CN115078531B - A high-frequency piezoelectric transducer, a high-frequency ultrasonic probe, and a method for their fabrication. - Google Patents
A high-frequency piezoelectric transducer, a high-frequency ultrasonic probe, and a method for their fabrication.Info
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- CN115078531B CN115078531B CN202110277343.2A CN202110277343A CN115078531B CN 115078531 B CN115078531 B CN 115078531B CN 202110277343 A CN202110277343 A CN 202110277343A CN 115078531 B CN115078531 B CN 115078531B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B61—RAILWAYS
- B61K—AUXILIARY EQUIPMENT SPECIALLY ADAPTED FOR RAILWAYS, NOT OTHERWISE PROVIDED FOR
- B61K9/00—Railway vehicle profile gauges; Detecting or indicating overheating of components; Apparatus on locomotives or cars to indicate bad track sections; General design of track recording vehicles
- B61K9/08—Measuring installations for surveying permanent way
- B61K9/10—Measuring installations for surveying permanent way for detecting cracks in rails or welds thereof
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/22—Details, e.g. general constructional or apparatus details
- G01N29/24—Probes
- G01N29/2437—Piezoelectric probes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/074—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing
- H10N30/076—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing by vapour phase deposition
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
- G01N2291/0234—Metals, e.g. steel
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Abstract
The invention relates to a high-frequency piezoelectric transduction vibrating element, a high-frequency ultrasonic probe and a preparation method thereof, which are used for monitoring rail defects and belong to the technical field of measurement. The high-frequency piezoelectric transduction vibrating element comprises a first electrode layer, a flexible piezoelectric transduction layer, a second electrode layer and a conductive epoxy solder mixture layer, wherein the first electrode layer is connected with the front surface of the flexible piezoelectric transduction layer and is connected with a positive electrode lead, the upper surface of the second electrode layer is connected with the back surface of the flexible piezoelectric transduction layer and is connected with a negative electrode lead, and the lower surface of the second electrode layer is connected with the conductive epoxy solder mixture layer. The high-frequency piezoelectric transduction vibrating element is used for a high-frequency ultrasonic probe, and the high-frequency ultrasonic probe can be used for automatically and accurately detecting rail head defects of a steel rail in real time on line.
Description
Technical Field
The invention belongs to the technical field of measurement, and particularly relates to a high-frequency piezoelectric transduction vibrating element, a high-frequency ultrasonic probe and a preparation method.
Background
In the prior art, the rail used for train/train running has the defect of damage such as cracks, cracks or breaks and the like in long-term running of the train/train, so the damage of the rail needs to be detected, the existing method is to couple a probe with ultrasonic function to the tread position of the rail head of the rail, reflect ultrasonic waves by utilizing the damage position of the rail, the rail head incident ultrasonic wave mode can not be arranged when a train/train runs on a track where the rail is located, so that the rail head nuclear damage defect can not be monitored on line in real time, and the shape of the rail damage defect and the change process of the shape of the damage defect are difficult to determine. Because the nuclear damage defect with extremely high rail head hazard cannot be found in time, the serious threat of serious threat to driving safety caused by rail breakage accidents possibly caused by defect expansion is unavoidable.
Disclosure of Invention
The invention aims to provide a high-frequency piezoelectric transduction vibrating element, a high-frequency ultrasonic probe and a preparation method, which are used for solving the problems in the prior art.
A high-frequency piezoelectric transduction vibrator for monitoring rail defects comprises a first electrode layer, a flexible piezoelectric transduction layer, a second electrode layer and a conductive epoxy solder mixture layer;
the first electrode layer is connected with the front surface of the flexible piezoelectric transduction layer and is connected with an anode lead;
The upper surface of the second electrode layer is connected with the back surface of the flexible piezoelectric transduction layer and is connected with a negative electrode lead;
The lower surface of the second electrode layer is connected with the conductive epoxy solder mixture layer.
Further, the flexible piezoelectric transduction layer is a copolymer PVDF layer with a certain thickness.
Further, the copolymer PVDF layer is a polyvinylidene fluoride-trifluoroethylene film or a vinylidene fluoride-tetrafluoroethylene film with the thickness of 20 mu m.
Further, the first electrode layer and the second electrode layer are two-layer evaporation structures.
Further, the two-layer vapor-deposited structure comprises, in order from inside to outside, a titanium (Ti) vapor-deposited electrode layer having a thickness of 10nm and a gold (Au) vapor-deposited electrode layer having a thickness of 200nm, which is covered thereon.
Further, the high-frequency piezoelectric transduction vibrating element is a square block with the side length of 3mm multiplied by 3mm.
The invention also provides a method for manufacturing the high-frequency piezoelectric transduction vibrating element, which comprises the following steps:
s1, preparing the flexible piezoelectric transduction layer;
S2, respectively connecting a first electrode layer and a second electrode layer on two sides of the flexible piezoelectric transduction layer;
s3, connecting the conductive epoxy solder mixture layer to the lower surface of the second electrode layer, wherein the first electrode layer, the flexible piezoelectric transduction layer, the second electrode layer and the conductive epoxy solder mixture form a multi-layer structure;
S4, placing the multilayer structure body into an oven with the temperature of 30-60 ℃ for curing for 3-6 hours, and polarizing the multilayer structure body in silicone oil at room temperature for 20-40 minutes by using a 2000V direct current electric field;
s5, cutting the polarized multilayer structure body to obtain the high-frequency piezoelectric transduction vibrating element.
Further, in the step S5, after the high-frequency piezoelectric transducer is obtained by cutting, the positive electrode lead and the negative electrode lead are welded on the first electrode layer and the second electrode layer, respectively.
The invention also provides a high-frequency ultrasonic probe which comprises a high-frequency piezoelectric transduction vibrating element, a flexible bonding connecting layer, an anode connecting wire, a cathode connecting wire, a multi-core high-frequency cable and a waterproof joint, wherein the high-frequency piezoelectric transduction vibrating element is bonded on the flexible bonding connecting layer.
Further, the flexible bonding connection layer is a polydimethylsiloxane PDMS layer, the number of the high-frequency piezoelectric transduction vibrating elements is multiple, and the distance between the high-frequency piezoelectric transduction vibrating elements is 1mm.
The beneficial effects of the invention are that
Compared with the prior art, the invention has the following beneficial effects:
(1) The flexible piezoelectric transduction layer is made of the copolymer PVDF, and the copolymer PVDF is a flexible piezoelectric material and has the characteristics of fluororesin and general resin, so that the high-frequency piezoelectric transduction vibrating element has good chemical corrosion resistance, high temperature resistance, oxidation resistance, good mechanical property, softness, no brittleness, light weight, impact resistance, good piezoelectric property and good acoustic sound transmission characteristic. The on-line monitoring positions are all outdoors, so that the performance of the copolymer PVDF is not changed at high and low temperatures, the service life is longer, the temperature resistance of the copolymer PVDF is between-40 ℃ and 140 ℃, and the aging resistance is strong.
(2) The high-frequency piezoelectric transduction vibrating element is manufactured by utilizing the flexible piezoelectric transduction layer, the flexible bonding connection layer is adopted for bonding and fixing, the high-frequency ultrasonic probe is manufactured, the flexible bonding connection layer adopts polydimethylsiloxane PDMS, and the polydimethylsiloxane PDMS has the performances of strong flexibility, good elasticity, low Young modulus, excellent gas permeability, chemical stability, thermal stability and the like, so that the high-frequency ultrasonic probe has good flexibility and bending characteristics, can be placed at any position of a steel rail, can be completely bonded with the lower jaw of the steel rail particularly when the nuclear damage defect of the rail head is monitored, forms a good ultrasonic incident surface, and can carry out real-time on-line automatic detection on the nuclear damage defect of the rail head of the steel rail.
Drawings
FIG. 1 is a schematic structural diagram of a high-frequency piezoelectric transducer;
FIG. 2 is a schematic diagram of the structure of a high frequency ultrasound probe;
fig. 3 is a schematic view of a high frequency ultrasonic probe mounted to a rail.
1, A high-frequency piezoelectric transduction vibrating element; 2, a first electrode layer; the flexible piezoelectric transducer comprises a flexible piezoelectric transducer layer, a second electrode layer, a conductive epoxy solder mixture layer, a positive electrode lead, a negative electrode lead, a high-frequency ultrasonic probe, a flexible adhesive connection layer, a positive electrode connecting wire, a negative electrode connecting wire, a multi-core high-frequency cable, an epoxy resin, a rivet hole, a waterproof connector and a multi-core shielding cable.
Detailed Description
For a better understanding of the present invention, the present disclosure includes, but is not limited to, the following detailed description, and similar techniques and methods should be considered as falling within the scope of the present protection. In order to make the technical problems, technical solutions and advantages to be solved more apparent, the following detailed description will be given with reference to the accompanying drawings and specific embodiments.
It should be understood that the described embodiments of the invention are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The terminology used in the embodiments of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in this application and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
In order to achieve the above object, the present invention provides a high-frequency piezoelectric transduction vibrator, as shown in fig. 1, the high-frequency piezoelectric transduction vibrator 1 includes a first electrode layer 2, a flexible piezoelectric transduction layer 3, a second electrode layer 4, and a conductive epoxy solder mixture layer 5;
wherein the first electrode layer 2 is connected with the front surface of the flexible piezoelectric transduction layer 3 and is connected with an anode lead 6;
the upper surface of the second electrode layer 4 is connected with the back surface of the flexible piezoelectric transduction layer 3, and is connected with a negative electrode lead 7;
the lower surface of the second electrode layer 4 is connected with the conductive epoxy solder mixture layer 5.
Preferably, the copolymer PVDF has the characteristics of both fluororesin and general resin, and the resin has good chemical corrosion resistance, high temperature resistance, oxidation resistance, good mechanical property, softness, no brittleness, light weight and impact resistance, so that the high-frequency ultrasonic probe manufactured by the material has good bending characteristic. The flexible piezoelectric transducer layer 3 of the present invention is implemented by using a copolymer PVDF, as shown in fig. 1, and in order to fabricate the high-frequency piezoelectric transducer element 1, in the embodiment of the present invention, the copolymer PVDF layer is selected to be a polyvinylidene fluoride-trifluoroethylene (P (VDF-TrFE)) film or a vinylidene fluoride-tetrafluoroethylene film having a thickness of 20 μm, and the polyvinylidene fluoride-trifluoroethylene (P (VDF-TrFE)) or the vinylidene fluoride-tetrafluoroethylene copolymer has a higher crystallinity, so that the piezoelectric performance determined by the crystallinity is also superior, and the higher the crystallinity is, the larger the piezoelectric response is, so that the piezoelectric constant is higher, and the acoustic performance is superior.
When the high-frequency piezoelectric transduction vibrating element is prepared, the preparation steps are as follows:
(1) Preparing a polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or vinylidene fluoride-tetrafluoroethylene film layer of 12mm x 12mm thickness of 20 μm;
(2) The first electrode layer and the second electrode layer are connected to two sides of the polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or the vinylidene fluoride-tetrafluoroethylene film layer, in the embodiment, the first electrode layer 2 is bonded to the front surface of the polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or the vinylidene fluoride-tetrafluoroethylene film layer, the upper surface of the second electrode layer 4 is bonded to the back surface of the polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or the vinylidene fluoride-tetrafluoroethylene film layer, the first electrode layer 2 and the second electrode layer 4 are all vapor deposition electrode structures, and the vapor deposition process deposits the conductive material on the corresponding electrode layers in a mode of heating the electrode material to form vapor and then adsorbing the vapor on a target object;
As a preferred embodiment, the first electrode layer 2 and the second electrode layer 4 are two vapor-deposited electrode structures, namely, a titanium (Ti) vapor-deposited electrode layer with a thickness of 10nm, which is a polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or vinylidene fluoride-tetrafluoroethylene thin film layer adhered in sequence from inside to outside, and a gold (Au) vapor-deposited electrode layer with a thickness of 200nm, which is a titanium (Ti) vapor-deposited electrode layer.
(3) Mixing conductive epoxy solder (E-Solder) 3022 with a hardener in a certain mass ratio, centrifuging at 10000rpm for 10min in a centrifuge to obtain a centrifuged conductive epoxy solder mixture, and connecting the centrifuged conductive epoxy solder mixture layer to the lower surface of the second electrode layer 4, wherein in this embodiment, casting is performed;
(4) The multilayer structure formed by the first electrode layer2, the polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or the vinylidene fluoride-tetrafluoroethylene film layer, the second electrode layer 4 and the conductive epoxy solder mixture layer 5 is put into an oven and cured for 3 to 6 hours, preferably 5 hours at a temperature of 30 to 60 ℃, preferably 45 ℃. The multilayer structure having high-frequency piezoelectric properties is formed by polarizing with a direct current electric field of 2000V in a silicone oil at room temperature for 20 to 40 minutes, preferably 30 minutes.
(5) Cutting the polarized multilayer structure into 16 square blocks with the side length of 3mm multiplied by 3mm by using a cutting tool such as a dicing saw, wherein each square block is the manufactured high-frequency piezoelectric transduction vibrating element, respectively welding the positive electrode lead 6 of the first electrode layer 2 and the negative electrode lead 7 of the second electrode layer 4, and externally connecting a power supply to the positive/negative leads for electrically pulse excitation of the high-frequency piezoelectric transduction vibrating element to generate ultrasonic waves with high-frequency narrow pulse characteristics.
In the invention, a flexible bonding connection layer is adopted to bond the high-frequency piezoelectric transduction vibrating element to manufacture the high-frequency ultrasonic probe. The flexible bonding connection layer is realized by adopting polydimethylsiloxane PDMS, and the polydimethylsiloxane PDMS material belongs to a high-molecular elastic polymer, is prepared by a special process, has good elasticity, low Young's modulus, excellent gas permeability, chemical stability, thermal stability and low-temperature flexibility, and can keep excellent performance especially at-60-200 ℃. Because the polydimethylsiloxane PDMS material has the special mechanical properties, the high-frequency ultrasonic probe manufactured by adopting the material as an adhesive connection layer has good bending property.
The high-frequency ultrasonic probe comprises a plurality of high-frequency piezoelectric transduction vibrating elements and a polydimethylsiloxane PDMS connecting layer, wherein each high-frequency piezoelectric transduction vibrating element is embedded and adhered to the Polydimethylsiloxane (PDMS) connecting layer, the distance between the vibrating elements of each high-frequency piezoelectric transduction vibrating element is set to be 1mm, all high-frequency piezoelectric transduction vibrating elements are distributed as shown in figure 2, in the embodiment, the high-frequency ultrasonic probe adopts the plurality of high-frequency piezoelectric transduction vibrating elements, 16 high-frequency piezoelectric transduction vibrating elements are adopted in the embodiment, and every four high-frequency piezoelectric transduction vibrating elements are arranged in a row to form a square of 4X4, so that the high-frequency ultrasonic probe can be conveniently and comprehensively attached to the arc surface of a lower jaw of a steel rail when in use and used for monitoring the damage part of the rail head of the steel rail, and the detected signal is more accurate and reliable.
The rear part of the high-frequency ultrasonic probe is designed into a combined planar structure, and the whole rear part of the high-frequency ultrasonic probe also comprises a positive connecting wire 10, a negative connecting wire 11, a multi-core high-frequency cable 12, epoxy resin 13, a rivet hole 14 and a waterproof joint 15. The positive lead 6 of each high-frequency piezoelectric transduction vibrating element 1 is coated, but needs to be led out from each high-frequency piezoelectric transduction vibrating element 1 independently, so that the positive poles of each high-frequency piezoelectric transduction vibrating element 1 are not conducted mutually, the positive leads 6 which are led out independently are connected in parallel to form a positive connecting wire 10 of a high-frequency ultrasonic probe 8, and a negative connecting wire 11 of the high-frequency ultrasonic probe 8 is formed by combining and connecting the negative lead 7 of each high-frequency piezoelectric transduction vibrating element 1 in a coating mode according to the figure 2, and leading out a common negative electrode as the negative connecting wire 11 of the high-frequency ultrasonic probe 8. All positive connecting wires 10 and negative connecting wires 11 are uniformly arranged, all positive connecting wires 10 and negative connecting wires 11 are led out in a film plating mode, rivet holes 14 are formed in each positive connecting wire 10 and negative connecting wires 11, all positive connecting wires 10 and negative connecting wires 11 are used for fixing, then a multi-core high-frequency cable 12 is connected to a waterproof joint 15, one end of the multi-core high-frequency cable 12 is used for fixedly welding all positive connecting wires 10 and negative connecting wires 11 to form a cable for signal transmission, the other end of the multi-core high-frequency cable is welded to the waterproof joint 15, the waterproof joint is of a multi-core structure, and finally the high-frequency cable 12 and the waterproof joint 15 are integrally sealed in a pouring mode through epoxy resin 13. The watertight fittings 15 are used for connecting the measuring instrument. The sealing epoxy resin 13 is used to realize waterproofing of the high-frequency ultrasonic probe. In order to ensure the waterproof and driving safety, the waterproof joint 15 should be placed at the bottom of the steel rail when being arranged on site, and is connected with the multicore shielding cable 16 of the ultrasonic instrument when being actually used.
The high-frequency ultrasonic probe is used for detecting rail damage of a steel rail, and transverse fatigue cracks of the rail head of the steel rail are commonly called rail head nuclear damage, which is referred to as nuclear damage for short, and refer to extremely complex stress distribution and stress states in the rail head under the repeated action of train load, so that small cracks transversely expand to form the nuclear damage until the steel around the nuclear damage is insufficient in strength to resist the stress under the action of wheel load, and the steel rail is suddenly brittle. The rail head nuclear injury defect is the steel injury which has the greatest threat to driving, is the most dangerous rail injury, and is easy to develop and expand due to the fact that the rail head nuclear injury is impacted by a vehicle continuously, and rail breakage is caused. Rail head nuclear damage generally occurs on the inner side surface of the rail head with the greatest compressive stress of the rail, and a certain included angle is formed between the rail head and the vertical section of the rail, which is about 14 degrees. When the conventional ultrasonic detection of rail head nuclear damage is carried out, the flaw detection is generally carried out by entering sound waves from the rail surface of the steel rail, but under the condition of on-line monitoring application, the probe cannot be arranged at the rail surface of the steel rail, and due to the existence of the wheel rim, the monitoring probe cannot be arranged at the inner side surface of the rail head of the steel rail. The high-frequency ultrasonic probe of the embodiment has good bending property and flexibility, so that the high-frequency ultrasonic probe 8 can be placed on the jaw part of the outer side face of the rail head of the steel rail, as shown in fig. 3, and the rail head of the steel rail can be automatically monitored on line in real time without being influenced by train/train running on the steel rail, the rail head nuclear injury of the inner side face of the rail head is detected through ultrasonic longitudinal waves generated by the high-frequency ultrasonic probe without manual intervention, the detected measurement signals are sent to a multi-channel ultrasonic instrument connected with the high-frequency ultrasonic probe, and the multi-channel ultrasonic instrument can be a 16-channel ultrasonic transmitting and receiving instrument, and analyzes the measurement signals acquired by the high-frequency ultrasonic probe to construct a defect contour image of the steel rail, and the edge and the shape of the nuclear injury defect of the rail head of the steel rail are determined according to the contour image. Meanwhile, if the core damage defect of the steel rail expands or deforms under the impact stress of the train/train, the change of the defect shape before and after the expansion of the core damage defect can be monitored through the signals measured by the high-frequency ultrasonic probe provided by the embodiment, so that a decision can be made in time.
While the foregoing description illustrates and describes the preferred embodiments of the present invention, it is to be understood that the invention is not limited to the forms disclosed herein, but is not to be construed as limited to other embodiments, and is capable of numerous other combinations, modifications and environments and is capable of changes or modifications within the scope of the inventive concept as expressed herein, either as a result of the foregoing teachings or as a result of the knowledge or technology of the relevant art. And that modifications and variations which do not depart from the spirit and scope of the invention are intended to be within the scope of the appended claims.
Claims (3)
1. The preparation method of the high-frequency piezoelectric transduction vibrating element is characterized by comprising the following steps of:
the high-frequency piezoelectric transduction vibrating element comprises a first electrode layer, a flexible piezoelectric transduction layer, a second electrode layer and a conductive epoxy solder mixture layer; the flexible piezoelectric transducer comprises a flexible piezoelectric transduction layer, a first electrode layer, a second electrode layer, a conductive epoxy solder mixture layer, a second electrode layer, a third electrode layer, a fourth electrode layer and a fourth electrode layer, wherein the first electrode layer is connected with the front surface of the flexible piezoelectric transduction layer and is connected with a positive electrode lead wire;
the preparation method comprises the following steps:
S1, preparing a polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or vinylidene fluoride-tetrafluoroethylene film layer with the thickness of 20 mu m and being 12mm multiplied by 12 mm;
S2, connecting a first electrode layer and a second electrode layer on two sides of a polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or vinylidene fluoride-tetrafluoroethylene film layer, bonding the first electrode layer on the front side of the polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or vinylidene fluoride-tetrafluoroethylene film layer, bonding the upper surface of the second electrode layer on the back side of the polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or vinylidene fluoride-tetrafluoroethylene film layer, wherein the first electrode layer and the second electrode layer are vapor deposition electrode structures, and depositing a conductive material on the corresponding electrode layers in a vapor deposition process by adopting a mode of heating electrode materials to form vapor and then adsorbing the vapor on a target object;
The first electrode layer and the second electrode layer are two layers of vapor-deposited electrode structures, namely a titanium (Ti) vapor-deposited electrode layer with the thickness of 10nm, which is a polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or vinylidene fluoride-tetrafluoroethylene film layer, and a gold (Au) vapor-deposited electrode layer with the thickness of 200nm, which is covered on the titanium (Ti) vapor-deposited electrode layer, are sequentially adhered from inside to outside;
S3, mixing conductive epoxy solder (E-Solder) 3022 with a hardener according to a preset mass ratio, putting into a centrifugal machine, centrifuging at 10000rpm for 10 minutes to obtain a centrifuged conductive epoxy solder mixture, connecting the centrifuged conductive epoxy solder mixture layer to the lower surface of the second electrode layer, and performing casting;
S4, placing a multilayer structure formed by the first electrode layer, the polyvinylidene fluoride-trifluoroethylene P (VDF-TrFE) or the vinylidene fluoride-tetrafluoroethylene film layer, the second electrode layer and the conductive epoxy solder mixture layer into an oven, curing for 3-6 hours at the temperature of 30-60 ℃, and polarizing for 20-40 minutes in silicone oil at room temperature by using a direct current electric field of 2000V to form the multilayer structure with high-frequency piezoelectric performance;
S5, cutting the polarized multilayer structure into 16 square blocks with the side length of 3mm multiplied by 3mm by using a cutting tool, wherein each square block is the manufactured high-frequency piezoelectric transduction vibrating element, respectively welding the positive electrode lead of the first electrode layer and the negative electrode lead of the second electrode layer, and externally connecting a power supply to the positive/negative leads for electrically pulse excitation of the high-frequency piezoelectric transduction vibrating element to generate ultrasonic waves with high-frequency narrow pulse characteristics.
2. A high-frequency ultrasonic probe, which is characterized by comprising the high-frequency piezoelectric transduction vibrating element, a flexible bonding connecting layer, an anode connecting wire, a cathode connecting wire, a multi-core high-frequency cable and a waterproof joint according to claim 1, wherein the high-frequency piezoelectric transduction vibrating element is bonded on the flexible bonding connecting layer.
3. The high-frequency ultrasonic probe according to claim 2, wherein the flexible bonding connection layer is a polydimethylsiloxane PDMS layer, the high-frequency piezoelectric transduction vibrating elements are provided in plurality, and the pitch of each high-frequency piezoelectric transduction vibrating element is 1mm.
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