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CN115041816B - A microstructure fabrication device and method based on pulse code control - Google Patents

A microstructure fabrication device and method based on pulse code control

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Publication number
CN115041816B
CN115041816B CN202210498275.7A CN202210498275A CN115041816B CN 115041816 B CN115041816 B CN 115041816B CN 202210498275 A CN202210498275 A CN 202210498275A CN 115041816 B CN115041816 B CN 115041816B
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China
Prior art keywords
pulse
microstructure
water
processing
laser
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CN202210498275.7A
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Chinese (zh)
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CN115041816A (en
Inventor
曹治赫
乔红超
赵吉宾
王顺山
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Shenyang Institute of Automation of CAS
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Shenyang Institute of Automation of CAS
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Priority to CN202210498275.7A priority Critical patent/CN115041816B/en
Publication of CN115041816A publication Critical patent/CN115041816A/en
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)

Abstract

The invention belongs to the field of microstructure water-guided laser processing, in particular to a microstructure processing device and method based on pulse code control, comprising a water-guided laser processing head module, a coupling head and a pulse control system; the water-guided laser processing head module comprises a pulse laser, a CCD camera and a reflecting mirror, wherein the CCD camera and the reflecting mirror are coaxially arranged in sequence from top to bottom, the pulse laser is arranged on one side of the reflecting mirror, emitted laser enters the coupling head after being reflected by the reflecting mirror, and acts on a microstructure to be processed after being transmitted by a water jet formed by the coupling head, the reflecting mirror is obliquely arranged, and the pulse control system is arranged at the bottom of the water-guided laser processing head module and is used for shielding or cutting the water jet so as to stop the processing of the microstructure by the water jet. The invention can realize the high-frequency reliable on-off of the energy-carrying water beam, and has wide applicable microstructure variety and high degree of freedom.

Description

Microstructure processing device and method based on pulse coding control
Technical Field
The invention belongs to the field of microstructure water-guided laser processing, and particularly relates to a microstructure processing device and method based on pulse code control.
Background
The water-guided laser processing technology is a novel laser processing technology, has the advantages of high processing quality and no heat affected zone, and is suitable for high-quality and high-efficiency processing of microstructures. However, the micro-structure processing needs to switch laser at high frequency, and high-power laser high-frequency on-off brings extremely high reliability and stability requirements to the water-guided laser processing equipment. In the prior art, the high-frequency on-off processing equipment is usually controlled by a system, so that the damage to a laser is large, and the laser is not easy to accurately control, and therefore, the high-frequency reliability on-off control for realizing the energy-carrying water beam processing capability is significant for reducing the micro-structure water-guide laser processing difficulty, improving the processing reliability and the processing efficiency and reducing the cost of the water-guide laser processing equipment.
In order to reduce the reliability requirement and equipment cost of the water guide laser light path component caused by repeated on-off during the processing of the microstructure and the repeated structure, a microstructure processing device and a microstructure processing method are required to be provided.
Disclosure of Invention
The invention aims to provide a microstructure processing device and method based on pulse coding control, which aims to solve the technical problem that the reliable on-off of an energy-carrying laser beam is difficult to realize at high frequency repeatedly when a microstructure is processed by a water-guided laser.
The invention adopts the technical scheme that the microstructure processing device based on pulse coding control is used for processing an array microstructure and comprises a water-guided laser processing head module, a coupling head and a pulse control system;
The water-guided laser processing head module comprises a pulse laser, a CCD camera and a reflecting mirror;
The CCD camera and the reflecting mirror are coaxially arranged in sequence from top to bottom, and the coupling head is arranged below the reflecting mirror of the water-guide laser processing head module;
The pulse laser is arranged on one side of the reflecting mirror, and the emitted laser enters the coupling head after being reflected by the reflecting mirror and acts on the microstructure to be processed after water jet formed by the coupling head is transmitted;
The pulse control system is arranged at the bottom of the water-guide laser processing head module and is used for shielding or cutting water jet so as to stop the water jet from processing the microstructure.
The coupling head comprises a shell, a focusing mirror, a light-transmitting window and a nozzle, wherein a laser entrance port is arranged at one end of the shell, the focusing mirror and the light-transmitting window are arranged in the laser entrance port, the nozzle is arranged at the other end of the shell, and laser is focused at the nozzle through the focusing mirror;
the device comprises a shell, a light-transmitting window, a nozzle, a pressure equalizing ring, a through hole cavity, a hydraulic equalizing cavity, limiting holes and a water inlet, wherein the pressure equalizing ring is arranged in the shell and between the light-transmitting window and the nozzle;
The focusing mirror, the light-transmitting window, the equalizing ring and the nozzle are coaxially arranged.
The pulse control system comprises a pulse control module, a pulse encoder, a driving motor and a pulse encoding disc;
The pulse control module is connected with the pulse encoder and the driving motor, and is used for receiving a pulse signal of the pulse encoder and adjusting the rotation speed of a rotating shaft of the driving motor according to the pulse signal so as to control the driving motor to move;
the driving motor is arranged on the bottom surface of the water-guide laser processing head module in a sliding manner, so that the driving motor can slide radially along the center direction of the coupling head, and the axis of a rotating shaft of the driving motor is vertical to the horizontal plane;
The pulse encoder is arranged in the driving motor and is arranged on a rotating shaft of the driving motor;
the central point of the pulse coding disc is fixedly connected with the rotating shaft of the driving motor, and when the driving motor rotates, the pulse coding disc is driven to rotate.
The pulse coding disc is a disc type, and a multi-circle through groove circular ring array is arranged along the circumferential direction by taking the joint of the pulse coding disc and the rotating shaft of the driving motor as the circle center;
The spacing between the circular ring arrays of the through grooves of any two adjacent circles is equal.
The circular ring array of the through groove is provided with 3-5 circles;
the space between any two adjacent through grooves in the through groove circular ring array is equal;
the distance L1 between two adjacent through grooves in the through groove circular ring array is as follows:
L1/(w1*R1)=L3/V1
the annular array length L2 is:
L2/(w1*R1)=L4/V1
wherein L3 is the processing length on the microstructure, L4 is the non-processing length on the microstructure, V1 is the moving speed of the water guide laser processing head, w1 is the rotating speed of the pulse coding disc, and R1 is the distance between the current through groove circular ring array and the rotating shaft.
The distance between the pulse coding disc and the workpiece to be processed is 1-10 mm.
The microstructure is a structure with a plurality of repetitions;
the repeated structure comprises a pit structure and a bulge, wherein the pit structure is at least one of a rectangular pit, a round pit and a special pit;
the arrangement of the repeating structures includes rectangular, circular, hexagonal arrays.
The pulse control system comprises a pulse air knife actuator and a pulse control module connected with the pulse air knife actuator;
the pulse air knife actuator is an air knife mechanism with a pulse signal receiving function and is used for forming a uniform air curtain at the air outlet, cutting off water jet and blocking the propagation and processing capacity of the water guide laser jet;
The pulse control module is an air circuit electromagnetic valve and is used for realizing the on-off of an air circuit according to a pulse control signal, so as to realize the control of the water guide laser jet processing capacity;
the air curtain forming air at the air outlet of the pulse air knife actuator comprises any one of air, nitrogen, argon and carbon dioxide, and the air pressure at the air outlet of the pulse air knife actuator is 1Mpa.
A microstructure processing method based on pulse coding control comprises the following steps:
1) And selecting a pulse coding disc mode or a pulse air knife actuator mode according to the microstructure (4) to be processed. When the pulse coding disc mode is selected, the required water-conduction laser on-off time ratio is calculated according to the rotation speed of the microstructure (4) to be processed and the pulse coding disc (5), the pulse coding disc (5) is manufactured, 2) processing is started, when the pulse coding disc (5) is selected, the laser water beam (3) reaches a workpiece removing area, the laser water beam (3) passes through a corresponding through groove area of the coding disc, material removal is achieved, the laser water beam (3) reaches a workpiece non-removing area, the laser water beam (3) is blocked by the pulse coding disc (5) or is cut off and damaged by a pulse air knife actuator (10), and the laser water beam (3) stops removing the material. When the pulse air knife actuator (10) is selected, the laser water jet (3) reaches a workpiece removing area, the pulse air knife actuator (10) does not exhaust air, the laser water beam (3) realizes material removal, the laser water beam (3) reaches a workpiece non-removing area, and the pulse air knife actuator (10) exhausts air to block the laser water beam (3). This step is repeated until the processing of the microstructure is completed.
The step 1) specifically comprises the following steps:
when the microstructure to be processed is a rectangular repeated structure and is arranged according to a rectangular layout, a pulse coding disc mode is selected for processing, and at the moment, the motion track of the water guide laser processing head is a reciprocating serpentine path until the scanning of the whole processing area is completed;
Manufacturing a pulse coding disc according to the length L1 which is not required to be processed on the microstructure to be processed in the scanning process, the length L2 which is required to be processed and the rotation speed W1 of the pulse coding disc;
When the microstructure to be processed is of other types, the pulse air knife executor is selected, the processing mode is to process the single repeated structures one by one, the air outlet of the pulse air knife executor stops water jet after the processing of the single microstructure is completed, the water-guiding laser processing head module moves to the next repeated structure, the pulse air knife executor stops air outlet, and the processing of the next repeated structure is started.
The invention has the following beneficial effects and advantages:
1. The invention can realize the high-frequency reliable on-off of the energy-carrying water beam, and has wide applicable microstructure variety and high degree of freedom.
2. The pulse coding disc and the pulse actuator can be replaced by the pulse air knife actuator so as to adapt to extremely narrow processing space, and high-frequency reliable on-off of energy-carrying water beam can be realized.
3. The invention can effectively improve the reliability and the processing efficiency of the water-guided laser technology in processing the microstructure, and is beneficial to realizing the large-scale application of the water-guided laser technology in processing the microstructure.
4. The equalizing ring is arranged in the shell, and the pressure and the flow of the high-pressure water are uniformly distributed by utilizing the equalizing ring, so that the problem that the water pressure and the flow near the nozzle are unbalanced to influence the stable length of the water jet is solved, and the processing precision and the processing efficiency of the water-guided laser processing are improved.
5. The ratio of the total sectional area of each flow limiting hole on the equalizing ring of the coupling head to the flow passage sectional area of the water supply pressure pipeline of the shell is smaller than 1, the pressure and the flow of the pressure water are uniformly distributed by utilizing a simple structure, and the processing is convenient and the realization is easy.
Drawings
FIG. 1 is a schematic diagram of an array microstructure processing apparatus based on coded pulse control according to an embodiment of the present invention;
The device comprises a water guide laser processing head module 1, a coupling head 2, a water jet 3, a microstructure 4, a pulse coding disc 5, a pulse control system 6, a pulse control module 7, a through groove spacing 8, a through groove 9 and a pulse air knife actuator 10, wherein the water guide laser processing head module is a water guide laser processing head module;
FIG. 2 is a schematic diagram of an exemplary pulse code disc according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of another apparatus for processing an array microstructure based on coded pulse control according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of an exemplary micro-pit structure array suitable for use in accordance with one embodiment of the present invention;
FIG. 5 is a typical array of micro-pit structures applicable to a second embodiment of the present invention;
FIG. 6 is a schematic diagram of a coupling head according to the present invention;
wherein 201 is a shell, 202 is laser, 203 is a focusing lens, 204 is a light-transmitting window, 205 is a equalizing ring, 206 is a hydraulic equalizing cavity, 207 is a restricting hole, 208 is a through hole cavity, 209 is laser water jet, 210 is a nozzle, 211 is a nozzle seat, and 212 is a water inlet.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples.
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention. In addition, the technical features of the embodiments of the present invention described below may be combined with each other as long as they do not collide with each other.
As shown in figures 1 and 3, the array microstructure processing device based on coding pulse control provided by the invention comprises a water-guided laser processing head module 1, a coupling head 2 and a pulse control system;
The water-guided laser processing head module 1 comprises a pulse laser, a CCD camera and a reflecting mirror, wherein the water-guided laser processing head module 1 is connected with a processing equipment moving mechanism and a coupling head 2, and the water-guided laser processing head module 1 and the coupling head 2 are matched to generate a water jet 3 carrying laser energy for processing a microstructure 4.
The CCD camera and the reflector are coaxially arranged in sequence from top to bottom, and the coupling head 2 is arranged below the reflector of the water-guide laser processing head module 1;
The pulse laser is arranged on one side of the reflecting mirror, the emitted laser enters the coupling head 2 after being reflected by the reflecting mirror, and acts on the microstructure 4 to be processed after the water jet 3 formed by the coupling head 2 propagates;
The pulse control system is arranged at the bottom of the water-guide laser processing head module 1 and is used for shielding or cutting the water jet 3 so as to stop the water jet 3 from processing the microstructure 4.
The coupling head 2 comprises a shell, a focusing mirror, a light-transmitting window and a nozzle, wherein a laser entrance port is arranged at one end of the shell, the focusing mirror and the light-transmitting window are arranged in the laser entrance port, the nozzle is arranged at the other end of the shell, and laser is focused at the nozzle through the focusing mirror;
As shown in fig. 6, the coupling head of the present invention is a schematic structural diagram, and includes a housing 201, an equalizing ring 205, a focusing mirror 203, a light-transmitting window 204 and a nozzle 210, wherein an entrance port is provided at one end of the housing 201, the focusing mirror 203 and the light-transmitting window 204 are sequentially provided in the entrance port along the transmission direction of the laser 202, the nozzle 210 is provided at the other end of the housing 201, the laser 202 is focused at the nozzle 210 through the focusing mirror 203, the equalizing ring 205 is disposed in the housing 201 and between the light-transmitting window 204 and the nozzle 210, a through hole 208 through which the laser 202 passes is provided in the equalizing ring 205, a groove is provided on the circumferential wall of the equalizing ring 205 along the circumferential direction, a hydraulic equalizing cavity 206 is formed between the groove and the housing 201, a plurality of restricting holes 207 are uniformly distributed in the circumferential direction in the circumferential wall of the equalizing ring 205, the hydraulic equalizing cavity 206 is communicated with the through each restricting hole 208, a water inlet 212 communicated with the hydraulic equalizing cavity 206 is provided on the housing 201, and the water inlet 212 is connected with a pressure water pipe.
The ratio of the total cross-sectional area of each flow limiting hole 207 to the cross-sectional area of the water flow channel (pressure water pipeline) on the shell 201 is smaller than 1, so as to play the roles of flow limiting and pressure uniform distribution, and in this embodiment, the diameter of each flow limiting hole 7 is in the range of 0.2-3 mm, and the number of the flow limiting holes is 6-20.
As shown in fig. 6, a nozzle holder 211 is disposed at an outgoing end of the laser water jet 209 of the housing 201, the nozzle 210 is mounted in the nozzle holder 211, and the nozzle holder 211 is provided with a flared laser water jet 209 outlet.
The focusing mirror 203, the light-transmitting window 204, the equalizing ring 205 and the nozzle 210 are coaxially arranged, wherein the light-transmitting window 204 can allow laser light to pass through and has a sealing effect on the pressurized water in the through hole cavity 208.
The working principle of the coupling head is as follows:
When the coupling head 2 works, laser 202 is injected into the shell 201 and then sequentially passes through the focusing mirror 203, the light-transmitting window 204 and the nozzle 210, high-pressure water flows into the hydraulic balancing cavity 206 at the outer side of the equalizing ring 205 through the inlet holes 212 and flows into the through hole cavity 208 in the equalizing ring 205 through the flow limiting holes 207, the high-pressure water in the through hole cavity 208 is sprayed out of the nozzle 210, the laser 202 is focused in the nozzle 210 through the focusing mirror 203 and continuously reflected along the high-pressure water jet to form laser water jet 209 for workpiece processing, the ratio of the total sectional area of the flow limiting holes 207 to the flow passage sectional area of the water supply pipeline of the shell 201 is smaller than 1, the functions of flow limiting and pressure uniform distribution can be achieved, the high-pressure water in the through hole cavity 208 is hydraulically stable and circumferentially uniform, the pressure water and the flow of the pressure water are uniformly distributed and then enter the nozzle 210, and finally stable laser water jet 209 is formed, and the processing precision and processing efficiency of water guide laser processing are improved.
The pulse control system comprises a pulse control module, a pulse encoder, a driving motor and a pulse encoding disk;
the pulse control module is connected with the pulse encoder and the driving motor, and is used for receiving a pulse signal of the pulse encoder and adjusting the rotation speed of a rotating shaft of the driving motor according to the pulse signal so as to control the driving motor to move;
the driving motor is arranged on the bottom surface of the water-guide laser processing head module 1 in a sliding manner, so that the driving motor can radially slide along the center direction of the coupling head, and the axis of a rotating shaft of the driving motor is vertical to a horizontal plane;
the pulse encoder is arranged in the driving motor and is arranged on a rotating shaft of the driving motor;
The central point of the pulse coding disc 5 is fixedly connected with the rotating shaft of the driving motor, and when the driving motor rotates, the pulse coding disc is driven to rotate.
The pulse coding disc 5 is circumferentially provided with a plurality of through grooves 9 with intervals and length being changed, and the high-frequency control on the on-off of the energy-carrying water jet is realized through the rotation of the pulse coding disc. The pulse actuator 6 can control the pulse coding disc 5 to rotate at a fixed rotation speed or a variable rotation speed so as to determine the on-off time length and the interval of the energy-carrying water beam, and the pulse actuator 6 is arranged on the water-guiding laser processing head module 1 and can adjust the distance between the water-guiding laser processing head module and the central axis of the coupling head 2. The control module 7 is connected with the pulse actuator 6 through a data line, and can realize pulse signal control of the pulse actuator 6.
The pulse coding disc 5 is a disc type, and a multi-circle through groove circular ring array is arranged along the circumferential direction by taking the joint of the pulse coding disc and the rotating shaft of the driving motor as the circle center;
The spacing between the circular ring arrays of the through grooves of any two adjacent circles is equal.
The circular ring array of the through groove is provided with 3-5 circles;
The space between any two adjacent through grooves 9 in each circle of the through groove circular ring array is equal;
The distance L1 between two adjacent through grooves 9 in the through groove circular ring array is as follows:
L1/(w1*R1)=L3/V1
the annular array length L2 is:
L2/(w1*R1)=L4/V1
Wherein L3 is the processing length on the microstructure 4, L4 is the non-processing length on the microstructure 4, V1 is the moving speed of the water guide laser processing head, w1 is the rotation angle speed of the pulse coding disc, and R1 is the distance between the current through groove circular ring array and the rotating shaft.
The distance between the pulse coding disc and the workpiece to be processed is 1-10 mm.
The pulse control system 6 can move along the radial direction of the coupling head 2, and the moving range can enable the water guide laser beam 3 to move from the innermost round of through grooves to the outermost round of through grooves of the pulse coding disc 5.
The rotating speed of the pulse control system 6 is controlled by the pulse control module 7, and the maximum rotating speed is 7r/s.
As shown in FIG. 4 or FIG. 5, the microstructure is a rectangular pit structure with multiple repeated structures;
the repeated structure comprises a pit structure and a bulge, wherein the pit structure is at least one of a rectangular pit, a round pit and a special pit;
the arrangement of the repeating structures includes rectangular, circular, hexagonal arrays.
The pulse control system comprises a pulse air knife actuator 10 and a pulse control module connected with the pulse air knife actuator;
the pulse air knife actuator 10 is an air knife mechanism with a pulse signal receiving function and is used for forming a uniform air curtain at an air outlet, cutting off the water jet 3 and blocking the propagation and processing capacity of the water guide laser jet;
The pulse control module is an air circuit electromagnetic valve and is used for realizing the on-off of an air circuit according to a pulse control signal, so as to realize the control of the water guide laser jet processing capacity;
The air curtain forming air at the air outlet of the pulse air knife actuator 10 comprises any one of air, nitrogen, argon and carbon dioxide, and the air pressure at the air outlet of the pulse air knife actuator 10 is 1Mpa.
A microstructure processing method based on pulse coding control comprises the following steps:
1) And selecting a pulse coding disc mode or a pulse air knife actuator mode according to the microstructure (4) to be processed. When a pulse coding disc mode is selected, calculating the required water guide laser on-off time ratio according to the rotation speed of the microstructure (4) to be processed and the pulse coding disc (5), manufacturing the pulse coding disc (5), and calculating the required water guide laser on-off time ratio according to the rotation speed of the microstructure to be processed and the pulse coding disc, manufacturing the pulse coding disc;
2) When the pulse coding disc (5) is selected, the laser water beam (3) reaches the workpiece removing area, the laser water beam (3) passes through the corresponding through groove area of the coding disc to remove materials, the laser water beam (3) reaches the workpiece non-removing area, the laser water beam (3) is blocked by the pulse coding disc (5) or is cut off and destroyed by the pulse air knife actuator (10), and the laser water beam (3) stops removing materials. When the pulse air knife actuator (10) is selected, the laser water jet (3) reaches a workpiece removing area, the pulse air knife actuator (10) does not exhaust air, the laser water beam (3) realizes material removal, the laser water beam (3) reaches a workpiece non-removing area, and the pulse air knife actuator (10) exhausts air to block the laser water beam (3). This step is repeated until the processing of the microstructure 4 is completed.
The step 1) is specifically as follows:
when the microstructure to be processed is a rectangular repeated structure and is arranged according to a rectangular layout, a pulse coding disc mode is selected for processing, and at the moment, the motion track of the water guide laser processing head is a reciprocating serpentine path until the scanning of the whole processing area is completed;
Manufacturing a pulse code disc 5 according to the length L1 which does not need to be processed on the microstructure 4 to be processed in the scanning process, the length L2 which needs to be processed and the rotation speed W1 of the pulse code disc 5;
When the microstructure to be processed is other types of microstructures, the pulse air knife executor 10 is selected, the processing mode is to process the single repeated structures one by one, after the single microstructure 4 is processed, the air outlet of the pulse air knife executor 10 stops the water jet 3, the water guide laser processing head module 1 moves to the next repeated structure, the pulse air knife executor 10 stops the air outlet, and the processing of the next repeated structure is started.
The invention can adopt different layout structures according to the size of the available space near the coupling head.
Embodiment one:
As shown in fig. 1 and 2, in this embodiment, the pulse coding disc 5 and the pulse control system are used to realize on-off control of the energy-carrying water-guiding laser beam, and when the microstructure shown in fig. 4 is aimed at, 3 circles of through grooves 9 are formed on the pulse coding disc 5, and the ratio of the circumferential width of each of the three circles of through grooves 9 to the space between the grooves is sequentially 1:3, 2:1, and 3:1, which sequentially correspond to the on-off time ratio when the microstructure is processed by the water-guiding laser beam. When the microstructure is processed, the motion mechanism drives the water guide laser processing head module to perform horizontal progressive scanning according to the shape of the microstructure 4 to be processed, and the pulse control module 7 adjusts the rotation speed of the pulse coding disc according to the on-off time ratio of the microstructure, so that the microstructure is processed.
The working principle of the embodiment is as follows:
In this embodiment, when the microstructure shown in fig. 5 is aimed at, the pulse coding disc 5 and the pulse actuator 6 cooperate to realize on-off control of the water-conducting laser beam. And manufacturing the pulse code disc 5 according to the length L1 which is not required to be processed on the microstructure 4 to be processed in the scanning process, the length L2 which is required to be processed and the rotation speed W1 of the pulse code disc 5, wherein the processing mode of the microstructure 4 by the water-guided laser processing equipment is horizontal progressive scanning, and the pattern on the pulse code disc is determined according to the on-off ratio during scanning before processing. In the processing process, the pulse executor drives the pulse coding disc 5 to rotate under the control of the control module 7, so that the high-frequency reliable on-off of the water guide laser beam flow is realized, and the processing of the microstructure is completed.
Embodiment two:
As shown in fig. 3, in this embodiment, the pulse air knife actuator 10 is used to realize on-off control of the energy-carrying water-guiding laser beam, and the pulse air knife actuator 10 is connected with the air compressor pipeline, so that high-speed air flow can be sprayed out under the control of the control module 7 to destroy the light guiding capability of the water jet and realize high-frequency reliability on-off control of the water-guiding laser beam. In the processing process, the movement mechanism drives the water guide laser processing head module to sequentially process each micro pit according to the shape of the microstructure 4 to be processed. When each micro pit is processed in a gap, the pulse air knife executor 10 sprays high-speed gas to turn off the water guide laser beam flow. The control module 7 is matched with a movement mechanism of the water guide laser processing equipment, and controls the on-off of the water guide laser jet according to whether the processing of the single microstructure is finished or not, so that the processing of the microstructure is finally realized.
The working principle of the embodiment is as follows:
In this embodiment, the pulse air knife actuator 10 is adopted to realize on-off control of the energy-carrying water guiding laser beam flow, when the microstructure to be processed is other types of microstructures, the pulse air knife actuator 10 is selected, the processing mode is to process the required single repeated structures one by one, after the single microstructure 4 is processed, the air outlet of the pulse air knife actuator 10 stops the water jet 3, the water guiding laser processing head module 1 moves to the next repeated structure, the pulse air knife actuator 10 stops the air outlet, and the processing of the next repeated structure is started.
The pulse air knife executor 10 is connected with an air compressor pipeline with the pressure of 7Bar, and command control is realized by the control module 7. Before machining, the output signal interval of the control module 7 is defined according to the machining time of each micro-pit on the microstructure 4 to be machined and the movement interval between the machining starting points of each micro-pit. In the processing process, the movement mechanism drives the water guide laser processing head module 1 to sequentially process each micro pit according to the shape of the microstructure 4 to be processed. After the single micro-pit is processed, the control module 7 commands the pulse air knife executor 10 to spray high-speed gas to turn off the water guide laser beam flow. After the motion mechanism moves to the next pit starting processing position, the pulse air knife executor 10 stops spraying high-speed gas. The control module 7 is matched with a movement mechanism of the water guide laser processing equipment, and controls the on-off of the water guide laser jet according to whether the processing of the single microstructure is finished or not, so that the processing of the microstructure is finally realized.
Finally, it should be noted that the above-mentioned embodiments are only for illustrating the technical solution of the present invention, and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications and equivalents may be made to the technical solution of the present invention without departing from the spirit and scope of the technical solution of the present invention, and all such modifications and equivalents are intended to be encompassed in the scope of the claims of the present invention.

Claims (7)

1.一种基于脉冲编码控制的微结构加工装置，用于加工阵列式微结构（4），其特征在于，包括：水导激光加工头模块（1）、耦合头（2）以及脉冲控制系统；1. A microstructure processing device based on pulse code control for processing array-type microstructures (4), characterized in that it comprises: a water-guided laser processing head module (1), a coupling head (2), and a pulse control system; 所述水导激光加工头模块（1），包括：脉冲激光器、CCD相机、反射镜；The water-guided laser processing head module (1) includes: a pulsed laser, a CCD camera, and a reflector; 所述CCD相机和反射镜从上至下依次同轴设置；所述耦合头（2）设于水导激光加工头模块（1）的反射镜下方；The CCD camera and the reflector are coaxially arranged from top to bottom; the coupling head (2) is located below the reflector of the water-guided laser processing head module (1); 所述脉冲激光器设于反射镜一侧，发射激光通过反射镜反射后，进入至耦合头（2）内，在耦合头（2）形成的水射流（3）传播后，作用在待加工微结构（4）上；The pulsed laser is located on one side of the reflector. After the emitted laser is reflected by the reflector, it enters the coupling head (2). After propagating in the water jet (3) formed by the coupling head (2), it acts on the microstructure (4) to be processed. 所述反射镜呈倾斜设置；所述脉冲控制系统设于水导激光加工头模块（1）底部，用于遮挡或切割水射流（3），以使水射流（3）停止对微结构（4）加工；The reflector is tilted; the pulse control system is located at the bottom of the water-guided laser processing head module (1) and is used to block or cut the water jet (3) so that the water jet (3) stops processing the microstructure (4); 所述脉冲控制系统，包括：脉冲控制模块、脉冲编码器、驱动电机以及脉冲编码盘（5）；The pulse control system includes: a pulse control module, a pulse encoder, a drive motor, and a pulse encoder disk (5). 所述脉冲控制模块与脉冲编码器、驱动电机连接，用于接收脉冲编码器的脉冲信号，并根据脉冲信号调整驱动电机旋转轴的旋转速度，以控制驱动电机运动；The pulse control module is connected to the pulse encoder and the drive motor. It is used to receive the pulse signal from the pulse encoder and adjust the rotation speed of the drive motor shaft according to the pulse signal to control the movement of the drive motor. 所述驱动电机滑动设于水导激光加工头模块（1）底面上，以使驱动电机可沿耦合头中心方向径向滑动，且所述驱动电机的旋转轴的轴线与水平面垂直；The drive motor is slidably mounted on the bottom surface of the water-guided laser processing head module (1) so that the drive motor can slide radially along the center direction of the coupling head, and the axis of the rotation shaft of the drive motor is perpendicular to the horizontal plane; 所述脉冲编码器设于驱动电机内，且安装在驱动电机的旋转轴上；The pulse encoder is located inside the drive motor and is mounted on the rotating shaft of the drive motor. 所述脉冲编码盘（5）的中心点与驱动电机的旋转轴固接，当驱动电机转动时，带动脉冲编码盘（5）旋转；The center point of the pulse encoder disk (5) is fixedly connected to the rotating shaft of the drive motor. When the drive motor rotates, it drives the pulse encoder disk (5) to rotate. 所述脉冲编码盘（5）为圆盘型，且以脉冲编码盘（5）上与驱动电机旋转轴连接处为圆心，沿周向设有多圈通槽圆环阵列；The pulse encoder disk (5) is a disc, and a multi-ring through-slot array is provided around the connection point between the pulse encoder disk (5) and the rotating shaft of the drive motor. 任意相邻两圈所述的通槽圆环阵列之间的间距相等；The spacing between any two adjacent rings of through slotted annulus is equal. 所述通槽圆环阵列设有3～5圈；The through-slot ring array has 3 to 5 rings; 每圈所述通槽圆环阵列中任意两个相邻的通槽（9）之间间距相等；The spacing between any two adjacent through slots (9) in each ring of the through slotted annular array is equal; 所述通槽圆环阵列中两个相邻的通槽（9）之间间距L1为：The distance L1 between two adjacent through slots (9) in the through-slot annular array is: L1/(w1*R1)=L3/V1L1/(w1*R1)=L3/V1 圆环阵列长度L2为：The length L2 of the circular array is: L2/(w1*R1)=L4/V1L2/(w1*R1)=L4/V1 其中，L3为微结构（4）上加工长度、L4为微结构（4）上不加工长度、V1为水导激光加工头运动速度、w1为脉冲编码盘（5）的旋转角速度、R1为当前通槽圆环阵列相对旋转轴的距离。Where L3 is the processing length on the microstructure (4), L4 is the unprocessed length on the microstructure (4), V1 is the movement speed of the water-guided laser processing head, w1 is the rotational angular velocity of the pulse encoder disk (5), and R1 is the distance of the current through-slot ring array relative to the rotation axis. 2.根据权利要求1所述的一种基于脉冲编码控制的微结构加工装置，其特征在于，所述耦合头（2），包括：壳体（201）、聚焦镜（203）、透光窗口（204）和喷嘴（210），所述壳体（201）一端设有激光入射口，且所述激光入射口内设有聚焦镜（203）和透光窗口（204），所述壳体（201）另一端设有喷嘴（210），且激光（202）经过所述聚焦镜（203）聚焦于所述喷嘴（210）处；2. A microstructure processing device based on pulse code control according to claim 1, characterized in that the coupling head (2) includes: a housing (201), a focusing lens (203), a light-transmitting window (204) and a nozzle (210), one end of the housing (201) is provided with a laser inlet, and the laser inlet is provided with a focusing lens (203) and a light-transmitting window (204), the other end of the housing (201) is provided with a nozzle (210), and the laser (202) is focused at the nozzle (210) by the focusing lens (203); 所述壳体（201）内设有均压环（205），且所述均压环（205）设于所述透光窗口（204）和喷嘴（210）之间，所述均压环（205）内部设有供激光（202）穿过的通孔腔（208），所述均压环（205）外侧与壳体（201）之间形成液压均衡腔（206），所述均压环（205）的环壁内均布有限流孔（207），且所述液压均衡腔（206）通过各限流孔（207）与所述通孔腔（208）连通，所述壳体（201）上设有与所述液压均衡腔（206）连通的入水孔（212）；The housing (201) is provided with a pressure equalization ring (205), and the pressure equalization ring (205) is located between the light-transmitting window (204) and the nozzle (210). The pressure equalization ring (205) is provided with a through-hole cavity (208) for the laser (202) to pass through. A hydraulic equalization cavity (206) is formed between the outer side of the pressure equalization ring (205) and the housing (201). Flow-limiting holes (207) are evenly distributed in the ring wall of the pressure equalization ring (205), and the hydraulic equalization cavity (206) is connected to the through-hole cavity (208) through each flow-limiting hole (207). The housing (201) is provided with a water inlet hole (212) that is connected to the hydraulic equalization cavity (206). 所述聚焦镜（203）、透光窗口（204）、均压环（205）和喷嘴（210）同轴设置。The focusing lens (203), the light-transmitting window (204), the equalizing ring (205), and the nozzle (210) are arranged coaxially. 3.根据权利要求1所述的一种基于脉冲编码控制的微结构加工装置，其特征在于，所述脉冲编码盘（5）与待加工工件之间的距离为1～10mm。3. The microstructure processing device based on pulse code control according to claim 1, wherein the distance between the pulse code disk (5) and the workpiece to be processed is 1 to 10 mm. 4.根据权利要求1所述的一种基于脉冲编码控制的微结构加工装置，其特征在于，微结构为：具有多个重复的结构；4. The microstructure fabrication device based on pulse code control according to claim 1, characterized in that the microstructure has multiple repeating structures; 重复的结构包括坑类结构与凸起，所述坑类结构为矩形坑、圆形坑、异形坑中的至少一种；The repeating structure includes pit-like structures and protrusions, wherein the pit-like structure is at least one of rectangular pits, circular pits, and irregularly shaped pits; 重复结构的排列方式包括矩形、圆形、六边形阵列。The arrangement of repeating structures includes rectangular, circular, and hexagonal arrays. 5.根据权利要求1所述的一种基于脉冲编码控制的微结构加工装置，其特征在于，所述脉冲控制系统，包括：脉冲风刀执行器（10）以及与其连接的脉冲控制模块；5. A microstructure processing device based on pulse code control according to claim 1, characterized in that the pulse control system comprises: a pulse air knife actuator (10) and a pulse control module connected thereto; 所述脉冲风刀执行器（10）为带有接收脉冲信号的风刀机构，用于在出风口形成均匀的风幕，切断水射流（3），阻断水导激光射流的传播与加工能力；The pulse air knife actuator (10) is an air knife mechanism with a pulse signal receiving function, used to form a uniform air curtain at the air outlet, cut off the water jet (3), and block the propagation and processing capability of the water-guided laser jet; 所述脉冲控制模块为气路电磁阀，用于根据脉冲控制信号实现气路的通断，进而实现对水导激光射流加工能力的控制；The pulse control module is a gas path solenoid valve, which is used to open and close the gas path according to the pulse control signal, thereby controlling the processing capability of water-guided laser jet. 所述脉冲风刀执行器（10）出风口形成风幕的气体，包括：空气、氮气、氩气、二氧化碳中任意一种；所述脉冲风刀执行器（10）出风口的气压为1Mpa。The gas forming the air curtain at the outlet of the pulse air knife actuator (10) includes any one of air, nitrogen, argon, and carbon dioxide; the air pressure at the outlet of the pulse air knife actuator (10) is 1 MPa. 6.根据权利要求5所述的一种基于脉冲编码控制的微结构加工装置的加工方法，其特征在于，包括以下步骤：6. The processing method of a microstructure processing device based on pulse code control according to claim 5, characterized in that it includes the following steps: 1）根据待加工微结构（4）选择脉冲编码盘（5）的方式或脉冲风刀执行器的方式；当选择脉冲编码盘（5）的方式时，根据待加工微结构（4）及脉冲编码盘（5）的旋转速度计算所需的水导激光通断时间比，制作脉冲编码盘（5）；1) Select the pulse encoder disk (5) or the pulse air knife actuator according to the microstructure to be processed (4); when the pulse encoder disk (5) is selected, calculate the required water guide laser on/off time ratio according to the microstructure to be processed (4) and the rotation speed of the pulse encoder disk (5), and make the pulse encoder disk (5). 2）开始加工，当选用脉冲编码盘（5）时，水射流（3）到达工件去除区时，水射流（3）穿过编码盘对应通槽区域，实现材料去除；水射流（3）到达工件非去除区时，水射流（3）被脉冲编码盘（5）挡住水射流（3）停止对材料的去除；当选用脉冲风刀执行器（10）时，水射流（3）到达工件去除区时，脉冲风刀执行器（10）不出风，水射流（3）实现材料去除；水射流（3）到达工件非去除区时，脉冲风刀执行器（10）出气阻断水射流（3）；重复该步骤，直至微结构（4）的加工完成。2) Start processing. When the pulse encoder disk (5) is selected, when the water jet (3) reaches the workpiece removal area, the water jet (3) passes through the corresponding through groove area of the encoder disk to remove the material. When the water jet (3) reaches the non-removal area of the workpiece, the water jet (3) is blocked by the pulse encoder disk (5) and the water jet (3) stops removing the material. When the pulse air knife actuator (10) is selected, when the water jet (3) reaches the workpiece removal area, the pulse air knife actuator (10) does not produce air and the water jet (3) removes the material. When the water jet (3) reaches the non-removal area of the workpiece, the pulse air knife actuator (10) produces air to block the water jet (3). Repeat this step until the microstructure (4) is processed. 7.根据权利要求6所述的一种基于脉冲编码控制的微结构加工装置的加工方法，其特征在于，所述步骤1）具体为：7. The processing method of a microstructure processing device based on pulse code control according to claim 6, characterized in that step 1) specifically comprises: 当所需加工微结构为矩形重复结构按矩形布局排列时，选用脉冲编码盘（5）的方式进行加工，此时水导激光加工头运动轨迹为往复蛇形路径，直至完成整个加工区域的扫描；When the microstructure to be processed is a rectangular repeating structure arranged in a rectangular layout, the pulse encoder disk (5) is selected for processing. At this time, the water-guided laser processing head moves in a reciprocating serpentine path until the scanning of the entire processing area is completed. 根据扫描过程中待加工的微结构（4）上不需要加工长度L1、需要加工的长度L2、脉冲编码盘（5）的旋转速度W1制作脉冲编码盘（5）；The pulse encoder disk (5) is made according to the length L1 that does not need to be processed, the length L2 that needs to be processed on the microstructure (4) to be processed during the scanning process, and the rotation speed W1 of the pulse encoder disk (5). 当所需加工微结构为其他类型微结构时，选用脉冲风刀执行器（10），加工方式为逐个加工所需单个重复结构，完成单个微结构（4）加工后脉冲风刀执行器（10）出风阻断水射流（3），水导激光加工头模块（1）运动至下一重复结构，脉冲风刀执行器（10）停止出风，开始下一重复结构的加工。When the microstructure to be processed is of other types, the pulse air knife actuator (10) is selected. The processing method is to process each of the required single repeating structures one by one. After the processing of a single microstructure (4) is completed, the pulse air knife actuator (10) blocks the water jet (3) by venting air. The water-guided laser processing head module (1) moves to the next repeating structure. The pulse air knife actuator (10) stops venting air and begins processing of the next repeating structure.
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