CN114900134A - Neutralizing capacitor amplifier and terminal of strip electrode isolation MOS (metal oxide semiconductor) tube - Google Patents
Neutralizing capacitor amplifier and terminal of strip electrode isolation MOS (metal oxide semiconductor) tube Download PDFInfo
- Publication number
- CN114900134A CN114900134A CN202210542947.XA CN202210542947A CN114900134A CN 114900134 A CN114900134 A CN 114900134A CN 202210542947 A CN202210542947 A CN 202210542947A CN 114900134 A CN114900134 A CN 114900134A
- Authority
- CN
- China
- Prior art keywords
- mos transistor
- electrode
- mos
- resistor
- mos tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/08—Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements
- H03F1/14—Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of neutralising means
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F1/00—Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
- H03F1/26—Modifications of amplifiers to reduce influence of noise generated by amplifying elements
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/189—High-frequency amplifiers, e.g. radio frequency amplifiers
- H03F3/19—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
- H03F3/193—High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only with field-effect devices
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F3/00—Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
- H03F3/45—Differential amplifiers
- H03F3/45071—Differential amplifiers with semiconductor devices only
- H03F3/45076—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
- H03F3/45179—Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using MOSFET transistors as the active amplifying circuit
- H03F3/45197—Pl types
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/372—Noise reduction and elimination in amplifier
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03F—AMPLIFIERS
- H03F2200/00—Indexing scheme relating to amplifiers
- H03F2200/451—Indexing scheme relating to amplifiers the amplifier being a radio frequency amplifier
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Amplifiers (AREA)
Abstract
Description
技术领域technical field
本发明属于无线通信技术领域,尤其涉及一种带体电极隔离MOS管中和电容放大器及终端。The invention belongs to the technical field of wireless communication, and in particular relates to a neutralization capacitor amplifier and a terminal of a MOS tube with body electrode isolation.
背景技术Background technique
目前,在射频放大器的设计过程中,由于MOS管栅漏电容Cgd的反馈作用,会将漏极的放大信号引入栅极输入端,容易引起放大器的振荡,影响放大器的工作状态。因此,常常使用中和电容技术,用电容将差分放大器一端MOS管的栅极与另一端MOS管的漏极相连接,由于两端MOS管的漏极相位相反,因此可以起到抵消Cgd的作用。在引入中和电容Cn后,放大器的稳定性因子为:At present, in the design process of the RF amplifier, due to the feedback effect of the gate-drain capacitance C gd of the MOS transistor, the amplified signal of the drain is introduced into the gate input terminal, which easily causes the amplifier to oscillate and affects the working state of the amplifier. Therefore, the neutralization capacitor technology is often used, and the gate of the MOS tube at one end of the differential amplifier is connected with the drain of the MOS tube at the other end with a capacitor. Since the drains of the MOS tubes at both ends are opposite in phase, it can cancel the C gd . effect. After introducing the neutralizing capacitor C n , the stability factor of the amplifier is:
其中,ω为角频率,Rg为栅电阻,Rd为负载电阻,gm为MOS管的跨导。当 k大于等于1时,放大器无条件稳定。因此,只有当中和电容Cn大小和Cgd相近时,k的分母接近于零,k变得很大,放大器才能稳定。Among them, ω is the angular frequency, R g is the gate resistance, R d is the load resistance, and g m is the transconductance of the MOS tube. When k is greater than or equal to 1, the amplifier is unconditionally stable. Therefore, only when the size of the neutralization capacitor C n is similar to that of C gd , the denominator of k is close to zero, and k becomes very large, and the amplifier can be stable.
目前最常采用的中和电容是用金属平板构成的MIM电容和金属插指构成的MOM电容,这两种电容的容值与金属的加工情况有关,并不会随着MOS管的工艺偏差产生变化,因此无法确保在不同的工艺角下都能够抵消Cgd的影响。如图6所示,将金属电容视为容值不变的电容,按照标准工艺角tt设计电容容值,仿真放大器在不同工艺角下Gmax随频率变化。Gmax 曲线通常分为两段,低频部分为MSG,即放大器在稳定状态下能达到的最大增益,高频部分为MAG,即放大器能获得的最大增益。MAG的部分表示该放大器在此频段内无条件稳定。图中,实线为tt工艺角,中和电容按照此工艺角设计,所以几乎没有MSG曲线,点虚线为ss工艺角,短划线为ff工艺角。可以看到在ff和ss工艺角下放大器的Gmax曲线都有很明显的MSG区间,MSG到MAG的转折点在10GHz左右。如果放大器加工出来MOS 管的性能在ff或ss工艺角,则放大器有可能振荡在10GHz以内的频率。At present, the most commonly used neutralizing capacitors are MIM capacitors composed of metal plates and MOM capacitors composed of metal fingers. The capacitance of these two capacitors is related to the processing of the metal, and will not occur with the process deviation of the MOS tube. changes, so there is no guarantee that the effect of C gd can be counteracted at different process angles. As shown in Figure 6, the metal capacitor is regarded as a capacitor with a constant capacitance value, and the capacitance value of the capacitor is designed according to the standard process angle tt, and the Gmax of the simulated amplifier varies with frequency under different process angles. The Gmax curve is usually divided into two sections, the low-frequency part is MSG, which is the maximum gain the amplifier can achieve in steady state, and the high-frequency part is MAG, which is the maximum gain the amplifier can achieve. The part of MAG indicates that the amplifier is unconditionally stable in this frequency band. In the figure, the solid line is the tt process angle, and the neutralization capacitor is designed according to this process angle, so there is almost no MSG curve, the dotted line is the ss process angle, and the dashed line is the ff process angle. It can be seen that the Gmax curve of the amplifier has a clear MSG interval at the ff and ss process angles, and the turning point from MSG to MAG is around 10GHz. If the performance of the MOS tube processed by the amplifier is in the ff or ss process angle, the amplifier may oscillate at a frequency within 10GHz.
现有的最接近技术是一种将MOS管的Cgd用作中和电容的技术,并且用作中和电容的MOS管的体电极和源极相连到大电阻上,其基本电路如图 2所示。图中,M1与M2为放大器的核心MOS管,用来放大信号,M3与M4 为中和电容MOS管,Load1和Load2为放大器的负载,R1为尾电阻。当R1 取值很大时,几乎不会有电流从M3和M4通过,M3与M4工作在几乎截至的状态。M3与M1的Cgd一端都连接在正相输入信号Vin+上,另一端分别连接Vout-与Vout+,相位相反,因此可以相互抵消,同理M4与M2的Cgd也可以相互抵消。由于放置在一起的同种MOS管,工艺偏差带来的离子注入浓度、栅氧化层厚度等的变化是同步的,因此Cgd的抵消效果基本不会因为工艺偏差而变化,放大器在各个工艺角下都可以非常稳定。上述提到的一种中和电容方案虽然使得放大器的稳定性抗工艺波动,但是仍然存在很多问题,相应的缺点如下:相比金属中和电容增益会降低,M3和M4的源极、体电极短接到大电阻的一端,M3和M4漏电极和体电极之间的寄生电容Cdb和一些寄生电阻会在M1和M2的漏极之间形成一条通路,这条通路会损耗输出功率,降低放大器的增益。放大器的噪声较差,射频链路中放大器的噪声性能,通常用噪声系数这一指标衡量,这一指标通常与放大器的跨导 gm呈反比,因此放大器的增益降低,等效降低了放大器的gm,进而增加了噪声系数。同时,在M3和M4的Cdb和一些寄生电阻形成的通路中,寄生电阻会将电阻热噪声引入输出端,进一步恶化输出噪声。The closest existing technology is a technology in which the C gd of the MOS tube is used as a neutralizing capacitor, and the body electrode and the source electrode of the MOS tube used as a neutralizing capacitor are connected to a large resistor. The basic circuit is shown in Figure 2. shown. In the figure, M1 and M2 are the core MOS tubes of the amplifier, used to amplify the signal, M3 and M4 are the neutralizing capacitor MOS tubes, Load1 and Load2 are the loads of the amplifier, and R1 is the tail resistor. When the value of R1 is very large, there is almost no current passing through M3 and M4, and M3 and M4 work in an almost cut-off state. One end of C gd of M3 and M1 is connected to the non-inverting input signal Vin+, and the other end is connected to Vout- and Vout+ respectively. The phases are opposite, so they can cancel each other. Similarly, the C gd of M4 and M2 can also cancel each other. Due to the same type of MOS transistors placed together, the changes in ion implantation concentration and gate oxide thickness caused by process deviation are synchronized, so the offset effect of C gd will basically not change due to process deviation. can be very stable. Although the above-mentioned neutralizing capacitor scheme makes the amplifier stability against process fluctuations, there are still many problems, and the corresponding disadvantages are as follows: Short to one end of the large resistor, the parasitic capacitance C db between the drain electrodes and the body electrodes of M3 and M4 and some parasitic resistances will form a path between the drains of M1 and M2, which will lose the output power and reduce the amplifier gain. The noise of the amplifier is poor. The noise performance of the amplifier in the RF link is usually measured by the noise figure, which is usually inversely proportional to the transconductance gm of the amplifier. Therefore, the gain of the amplifier is reduced, which is equivalent to reducing the amplifier's performance. g m , which in turn increases the noise figure. At the same time, in the path formed by C db of M3 and M4 and some parasitic resistances, the parasitic resistance will introduce resistance thermal noise into the output terminal, further deteriorating the output noise.
通过上述分析,现有技术存在的问题及缺陷为:Through the above analysis, the existing problems and defects in the prior art are:
(1)现有技术相比金属中和电容增益会降低,M3和M4的源极、体电极短接到大电阻的一端,M3和M4漏电极和体电极之间的寄生电容Cdb和一些寄生电阻会在M1和M2的漏极之间形成一条通路,这条通路会损耗输出功率,降低放大器的增益。(1) Compared with the prior art, the gain of metal neutralization capacitance will be reduced. The source and body electrodes of M3 and M4 are short-circuited to one end of the large resistance, and the parasitic capacitance C db between the drain electrode and the body electrode of M3 and M4 and some The parasitic resistance creates a path between the drains of M1 and M2 that loses output power and reduces the gain of the amplifier.
(2)现有技术中放大器的噪声较差,射频链路中放大器的噪声性能,通常用噪声系数这一指标衡量,这一指标通常与放大器的跨导gm呈反比,因此放大器的增益降低,等效降低了放大器的gm,进而增加了噪声系数。同时,在M3 和M4的Cdb和一些寄生电阻形成的通路中,寄生电阻会将电阻热噪声引入输出端,进一步恶化输出噪声。(2) The noise of the amplifier in the prior art is poor, and the noise performance of the amplifier in the radio frequency chain is usually measured by the noise figure, which is usually inversely proportional to the transconductance gm of the amplifier, so the gain of the amplifier is reduced , which effectively reduces the amplifier's g m , which in turn increases the noise figure. At the same time, in the path formed by C db of M3 and M4 and some parasitic resistances, the parasitic resistance will introduce resistance thermal noise into the output terminal, further deteriorating the output noise.
发明内容SUMMARY OF THE INVENTION
针对现有技术存在的问题,本发明提供了一种带体电极隔离MOS管中和电容放大器及终端。In view of the problems existing in the prior art, the present invention provides a neutralization capacitor amplifier and a terminal of a MOS transistor with body electrode isolation.
本发明是这样实现的,一种带体电极隔离MOS管中和电容放大器,所述带体电极隔离MOS管中和电容放大器设置有第一MOS管、第二MOS管、第三 MOS管、第四MOS管;The present invention is realized in this way, a neutralization capacitor amplifier with body electrode isolation MOS transistor, wherein the neutralization capacitor amplifier with body electrode isolation MOS transistor is provided with a first MOS transistor, a second MOS transistor, a third MOS transistor, a third MOS transistor, and a third MOS transistor. Four MOS tubes;
第一MOS管中的栅极接正相输入信号端Vin+,第一MOS管中的漏极接正相输出信号端Vout+;第二MOS管中的栅极接反相输入信号端Vin-,第二 MOS管中的漏极接负相输出信号端Vout-;The gate in the first MOS tube is connected to the non-inverting input signal terminal Vin+, the drain in the first MOS tube is connected to the non-inverting output signal terminal Vout+; the gate in the second MOS tube is connected to the inverting input signal terminal Vin-, The drain in the two MOS tubes is connected to the negative phase output signal terminal Vout-;
第三MOS管中的源极连接第一电阻,第三MOS管中的体电极连接第二电阻;第四MOS管中的源极连接第一电阻,第四MOS管中的体电极连接第三电阻。The source electrode of the third MOS transistor is connected to the first resistor, the body electrode of the third MOS transistor is connected to the second resistor; the source electrode of the fourth MOS transistor is connected to the first resistor, and the body electrode of the fourth MOS transistor is connected to the third resistor. resistance.
进一步,所述第一MOS管设置有源极、体电极,源极、体电极接地。Further, the first MOS transistor is provided with a source electrode and a body electrode, and the source electrode and the body electrode are grounded.
进一步,所述第二MOS管设置有源极、体电极,源极、体电极接地。Further, the second MOS transistor is provided with a source electrode and a body electrode, and the source electrode and the body electrode are grounded.
进一步,所述第三MOS管设置有栅极,栅极接正相输入信号端Vin+,第三MOS管中的漏极接负相输出信号端Vout-。Further, the third MOS transistor is provided with a gate, the gate is connected to the positive-phase input signal terminal Vin+, and the drain of the third MOS transistor is connected to the negative-phase output signal terminal Vout-.
进一步,所述第四MOS管设置有栅极,栅极接反相输入信号端Vin-,第四 MOS管中的漏极接正相输出信号端Vout+。Further, the fourth MOS transistor is provided with a gate, the gate is connected to the inverting input signal terminal Vin-, and the drain of the fourth MOS transistor is connected to the non-inverting output signal terminal Vout+.
进一步,所述正相输出信号端Vout+与第一负载连接,第一负载与电源Vdd 连接。Further, the non-inverting output signal terminal Vout+ is connected to the first load, and the first load is connected to the power supply Vdd.
进一步,所述负相输出信号端Vout-与第二负载连接,第二负载与电源Vdd 连接。Further, the negative phase output signal terminal Vout- is connected to the second load, and the second load is connected to the power supply Vdd.
进一步,所述第一电阻一端接地,第二电阻一端接地,第三电阻一端接地。Further, one end of the first resistor is grounded, one end of the second resistor is grounded, and one end of the third resistor is grounded.
进一步,所述第一MOS管和第二MOS管的尺寸大小相同,第三MOS管和第四MOS管的尺寸大小相同;Further, the first MOS transistor and the second MOS transistor have the same size, and the third MOS transistor and the fourth MOS transistor have the same size;
第二电阻和第三电阻的大小相同,第一电阻、第二电阻和第三电阻取值在千欧姆及以上量级。The size of the second resistor and the third resistor are the same, and the values of the first resistor, the second resistor and the third resistor are in the order of kiloohm and above.
本发明的另一目的在于提供一种无线通信终端,所述无线通信终端安装有所述带体电极隔离MOS管中和电容放大器。Another object of the present invention is to provide a wireless communication terminal, wherein the wireless communication terminal is installed with the strip electrode isolation MOS transistor neutralization capacitor amplifier.
本发明的另一目的在于提供一种射频芯片,所述射频芯片包含所述带体电极隔离MOS管中和电容放大器。Another object of the present invention is to provide a radio frequency chip, the radio frequency chip includes the strip body electrode isolation MOS transistor neutralization capacitor amplifier.
结合上述的技术方案和解决的技术问题,从以下几方面分析本发明所要保护的技术方案所具备的优点及积极效果为:In conjunction with the above-mentioned technical solutions and the technical problems solved, the advantages and positive effects of the technical solutions to be protected by the present invention are analyzed from the following aspects:
第一、针对上述现有技术存在的技术问题以及解决该问题的难度,紧密结合本发明的所要保护的技术方案以及研发过程中结果和数据等,详细、深刻地分析本发明技术方案如何解决的技术问题,解决问题之后带来的一些具备创造性的技术效果。具体描述如下:First, in view of the technical problems existing in the above-mentioned prior art and the difficulty of solving the problems, closely combine the technical solutions to be protected of the present invention and the results and data in the research and development process, etc., and analyze in detail and profoundly how to solve the technical solutions of the present invention. Technical problems, some creative technical effects brought about by solving problems. The specific description is as follows:
本发明将两个MOS管的体电极分别连接大电阻到地,再将源极互连后接大电阻到地,把这两个工作在截止区的MOS管交叉连接在放大器两个核心MOS 管的栅极和漏极之间,将两者的Cgd相互抵消,从而实现放大器的全频带稳定。用作中和电容的MOS管和放大器核心MOS管的漏极、体电极的直流电位相同, Cgd受工艺偏差的影响程度相似。因此,本发明的中和电容可以跟随放大器核心 MOS管的工艺波动,使得在不同的工艺角下,放大器都全频带稳定,防止放大器自激振荡,产生不需要的输出频率。本发明采用体电极隔离技术设计MOS管中和电容,切断了中和电容MOS管的Cdb和寄生电阻引入的通路,不会造成差分输出端的损耗,因此有着良好的增益性能。本发明的体电极隔离大电阻,可以切断体电极到地电位的交流通路,抑制体电极的寄生电阻作为噪声源将热噪声传递到放大器输出端,有助于改善放大器的噪声性能。In the present invention, the body electrodes of the two MOS tubes are respectively connected to the large resistance to the ground, the source electrodes are interconnected and then connected to the ground, and the two MOS tubes working in the cut-off region are cross-connected to the two core MOS tubes of the amplifier. Between the gate and the drain, the C gd of the two cancel each other out, so as to realize the full-band stability of the amplifier. The DC potentials of the drain and body electrodes of the MOS transistor used as the neutralizing capacitor and the core MOS transistor of the amplifier are the same, and C gd is similarly affected by process deviations. Therefore, the neutralizing capacitor of the present invention can follow the process fluctuation of the core MOS tube of the amplifier, so that the amplifier is stable in the whole frequency band under different process angles, preventing self-oscillation of the amplifier and generating unnecessary output frequency. The invention adopts the body electrode isolation technology to design the neutralizing capacitor of the MOS tube, cuts off the path introduced by the C db and parasitic resistance of the neutralizing capacitor MOS tube, does not cause the loss of the differential output end, and thus has good gain performance. The body electrode of the present invention isolates a large resistance, can cut off the AC path from the body electrode to the ground potential, and suppress the parasitic resistance of the body electrode as a noise source to transmit thermal noise to the output end of the amplifier, thereby helping to improve the noise performance of the amplifier.
第二,把技术方案看做一个整体或者从产品的角度,本发明所要保护的技术方案具备的技术效果和优点,具体描述如下:Second, considering the technical solution as a whole or from the product point of view, the technical effects and advantages of the technical solution to be protected by the present invention are specifically described as follows:
本发明将用作中和电容的MOS管的体电极分别接大电阻到地,隔绝了Cdb和寄生电阻在放大器差分输出两端形成的通路,因此可以提高放大器的增益,优化放大器的噪声系数,有助于射频芯片整体性能的提升。本发明通过将MOS 管电容的体电极单独接大电阻到地的方式,优化了放大器的增益和噪声性能。本发明通过对原本的MOS管中和电容技术进行改进,通过将中和电容MOS管的体电极单独接大电阻到地的方式,隔绝了Cdb和部分寄生电阻对输出端增益的损耗,抑制了传递到输出端的体电极寄生电阻的热噪声。因此本发明的放大器有着较好的增益和噪声性能。本发明采用的MOS管电容利用了同种MOS管加工时的一致性,因此可以跟随放大器核心MOS管的Cgd变化,使得在不同的工艺角下,放大器全频带稳定,防止放大器自激振荡影响工作状态和产生干扰频率。从增益、噪声、稳定性的角度考虑,本发明的放大器方案有助于射频芯片整体性能的提升。In the present invention, the body electrodes of the MOS transistors used as neutralizing capacitors are respectively connected to the ground with large resistances, which isolates the paths formed by C db and parasitic resistances at both ends of the differential output of the amplifier, so the gain of the amplifier can be improved, and the noise coefficient of the amplifier can be optimized. , which helps to improve the overall performance of the RF chip. The present invention optimizes the gain and noise performance of the amplifier by connecting the bulk electrode of the MOS tube capacitor to the ground independently. The invention improves the original MOS tube neutralization capacitor technology, and isolates the loss of C db and some parasitic resistances to the gain of the output end by connecting the body electrode of the neutralization capacitor MOS tube with a large resistance to the ground. thermal noise transmitted to the body electrode parasitic resistance of the output. Therefore, the amplifier of the present invention has better gain and noise performance. The MOS tube capacitor used in the present invention utilizes the consistency of the same MOS tube during processing, so it can follow the change of C gd of the core MOS tube of the amplifier, so that under different process angles, the full frequency band of the amplifier is stable, and the influence of self-oscillation of the amplifier is prevented. working state and frequency of interference. From the viewpoints of gain, noise and stability, the amplifier scheme of the present invention is helpful for improving the overall performance of the radio frequency chip.
第三,作为本发明的权利要求的创造性辅助证据,还体现在以下几个重要方面:Third, as an auxiliary evidence of inventive step for the claims of the present invention, it is also reflected in the following important aspects:
(1)本发明的技术方案转化后的预期收益和商业价值为:本发明通过改进中和电容技术,提高了放大器的稳定性相对工艺波动的抗性,提高了产品的良率。本发明相对传统的MOS管电容提升了放大器的噪声系数和增益性能,因此可应用于高性能的低噪声放大器、驱动放大器等放大器产品中。(1) The expected income and commercial value after the technical solution of the present invention is transformed are: the present invention improves the stability of the amplifier against the process fluctuation resistance by improving the neutralization capacitor technology, and improves the yield of the product. Compared with the traditional MOS tube capacitor, the invention improves the noise coefficient and gain performance of the amplifier, so it can be applied to amplifier products such as high-performance low-noise amplifiers and driving amplifiers.
(2)本发明的技术方案解决了人们一直渴望解决、但始终未能获得成功的技术难题:(2) the technical scheme of the present invention solves the technical problem that people have been eager to solve but have not been able to achieve success all the time:
传统射频放大器的设计中,如果采用金属电容作中和电容,就无法跟踪MOS 管的工艺波动,容易发生稳定性问题;如果采用传统的MOS管中和电容技术,虽然稳定性良好,但是增益和噪声系数会下降,影响了放大器的性能。本发明在保证放大器稳定性抗工艺波动的同时,兼顾了放大器的增益和噪声性能。In the design of traditional RF amplifiers, if metal capacitors are used as neutralizing capacitors, the process fluctuations of MOS tubes cannot be tracked, and stability problems are prone to occur; if traditional MOS tube neutralizing capacitor technology is used, although the stability is good, the gain and The noise figure will degrade, affecting the performance of the amplifier. The invention takes into account the gain and noise performance of the amplifier while ensuring the stability of the amplifier against process fluctuations.
附图说明Description of drawings
图1是本发明实施例提供的带体电极隔离MOS管中和电容放大器结构示意图;1 is a schematic structural diagram of a neutralizing capacitor amplifier with a body electrode isolation MOS tube provided by an embodiment of the present invention;
图2是本发明实施例提供的带体电极源极短接型MOS管中和电容的放大器电路图;FIG. 2 is a circuit diagram of an amplifier with a body electrode-source short-connected MOS tube neutralizing capacitor provided by an embodiment of the present invention;
图3是本发明实施例提供的在不同工艺角下Gmax随频率变化的仿真情况示意图;3 is a schematic diagram of a simulation situation of Gmax varying with frequency under different process angles provided by an embodiment of the present invention;
图4是本发明实施例提供的放大器Gmax随频率变化对比示意图;FIG. 4 is a schematic diagram of the comparison of the amplifier Gmax with frequency variation provided by an embodiment of the present invention;
图5是本发明实施例提供的放大器的NFmin随频率变化对比示意图;5 is a schematic diagram of a comparison of NFmin with frequency variation of an amplifier provided in an embodiment of the present invention;
图6是本发明实施例提供的带金属中和电容的放大器在不同工艺角下的稳定性示意图;6 is a schematic diagram of the stability of an amplifier with a metal neutralization capacitor provided by an embodiment of the present invention under different process angles;
图中:1、第一负载;2、正相输出信号端Vout+;3、第三MOS管;4、正相输入信号端Vin+;5、第一MOS管;6、第二电阻;7、第一电阻;8、第三电阻;9、第二MOS管;10、反相输入信号端Vin-;11、第四MOS管;12、负相输出信号端Vout-;13、第二负载。In the figure: 1. The first load; 2. The positive-phase output signal terminal Vout+; 3. The third MOS tube; 4. The positive-phase input signal terminal Vin+; 5. The first MOS tube; 6. The second resistor; 7. The first A resistor; 8, the third resistor; 9, the second MOS transistor; 10, the inverting input signal terminal Vin-; 11, the fourth MOS transistor; 12, the negative phase output signal terminal Vout-; 13, the second load.
具体实施方式Detailed ways
为了使本发明的目的、技术方案及优点更加清楚明白,以下结合实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
一、解释说明实施例。为了使本领域技术人员充分了解本发明如何具体实现,该部分是对权利要求技术方案进行展开说明的解释说明实施例。1. Explain the embodiment. In order for those skilled in the art to fully understand how the present invention is specifically implemented, this part is an explanatory embodiment to expand the description of the technical solutions of the claims.
如图1所示,本发明实施例提供的带体电极隔离MOS管中和电容放大器中第一MOS管5中的源极、体电极接地,第一MOS管5中的栅极接正相输入信号端Vin+4,第一MOS管5中的漏极接正相输出信号端Vout+2;第二MOS 管9中的源极、体电极接地,第二MOS管9中的栅极接反相输入信号端Vin-10,第二MOS管9中的漏极接负相输出信号端Vout-12;第三MOS管3中的源极连接第一电阻7,第三MOS管3中的体电极连接第二电阻6,第三MOS管3中的栅极接正相输入信号端Vin+4,第三MOS管3中的漏极接负相输出信号端 Vout-12;As shown in FIG. 1 , the source electrode and the body electrode of the
第四MOS管11中的源极连接第一电阻7,第四MOS管11中的体电极连接第三电阻8,第四MOS管11中的栅极接反相输入信号端Vin-10,第四MOS管 11中的漏极接正相输出信号端Vout+2;正相输出信号端Vout+2与第一负载1 连接,第一负载1与电源Vdd连接;负相输出信号端Vout-12与第二负载13 连接,第二负载13与电源Vdd连接;第一电阻7一端接地,第二电阻6一端接地,第三电阻8一端接地。第一MOS管5和第二MOS管9的尺寸大小相同,第三MOS管3和第四MOS管11的尺寸大小相同;第二电阻6和第三电阻8 的大小相同,第一电阻7、第二电阻6和第三电阻8需要取值在千欧姆及以上量级。The source of the
本发明的工作原理为:第一MOS管5与第二MOS管9为放大器的核心 MOS管,用来放大信号,第三MOS管3与第四MOS管11为中和电容MOS 管。当第一电阻7取值很大时,几乎不会有电流从第三MOS管3与第四MOS 管11通过,第三MOS管3与第四MOS管11工作在几乎截至的状态。第三 MOS管3与第一MOS管5的Cgd一端都连接在正相输入信号端Vin+4,另一端分别连接负相输出信号端Vout-12与正相输出信号端Vout+2,相位相反,因此可以相互抵消,同理第四MOS管11与第二MOS管9的Cgd也可以相互抵消。第三MOS管3和第四MOS管11的体电极分别通过大第二电阻6、第三电阻8 与地连接,因此体电极的直流电位为地电位。第一MOS管5、第二MOS管9、第三MOS管3和第四MOS管11的漏极和体电极的直流电位相同,漏极和体电极之间耗尽区的情况相似。The working principle of the present invention is as follows: the
二、应用实施例。为了证明本发明的技术方案的创造性和技术价值,该部分是对权利要求技术方案进行具体产品上或相关技术上的应用实施例。2. Application examples. In order to prove the creativity and technical value of the technical solution of the present invention, this part is an application example of the technical solution in the claims on specific products or related technologies.
本发明相对传统的MOS管电容提升了放大器的噪声系数和增益性能,因此可应用于高性能的低噪声放大器、驱动放大器等放大器产品中。可以应用在射频芯片中,无线通信芯片、雷达芯片等。Compared with the traditional MOS tube capacitor, the invention improves the noise coefficient and gain performance of the amplifier, so it can be applied to amplifier products such as high-performance low-noise amplifiers and driving amplifiers. It can be used in radio frequency chips, wireless communication chips, radar chips, etc.
三、实施例相关效果的证据。本发明实施例在研发或者使用过程中取得了一些积极效果,和现有技术相比的确具备很大的优势,下面内容结合试验过程的数据、图表等进行描述。3. Evidence of the relevant effects of the embodiment. The embodiments of the present invention have achieved some positive effects in the process of research and development or use, and indeed have great advantages compared with the prior art.
在现有技术中,如图2所示,M3与M4的体电极与源极短接到大电阻R1 的一端,体电极电位高于地电位,因此M3、M4和M1、M2的漏极和体电极之间的耗尽区情况不同。而这个耗尽区对电容Cgd的影响很大,所以,本发明相比之现有技术,核心MOS管的Cgd与中和电容MOS管的Cgd有着更相似的环境,两电容之间的一致性更好,也就更抗工艺波动。如图3所示,按照tt工艺角设计M3和M4的尺寸,仿真放大器在tt、ff和ss工艺角下的Gmax随频率变化的曲线。其中,实线为tt工艺角,点虚线为ff工艺角,短划线为ss工艺角。对比图6和图3可以看出,在不同的工艺角下,放大器在全频段内没有明显的从MSG 到MAG的转折点,几乎都处于MAG的状态下,因此可以做到在不同的工艺角下全频带稳定。M3、M4的体电极通过大电阻R2、R3到地,因此,M3、M4 的Cdb和寄生电阻引起通路被切断,不会加剧输出节点的损耗,所以相比体电极、源极短接的方案,本发明的放大器增益更高。In the prior art, as shown in FIG. 2 , the body electrodes and source electrodes of M3 and M4 are shorted to one end of the large resistor R1, and the potential of the body electrodes is higher than the ground potential, so the drain electrodes of M3, M4 and M1, M2 are The depletion region is different between the body electrodes. And this depletion region has a great influence on the capacitor C gd . Therefore, in the present invention, compared with the prior art, the C gd of the core MOS transistor and the C gd of the neutralizing capacitor MOS transistor have a more similar environment. The consistency is better, and it is more resistant to process fluctuations. As shown in Figure 3, the dimensions of M3 and M4 are designed according to the tt process angle, and the curve of the Gmax of the amplifier under the tt, ff and ss process angles as a function of frequency is simulated. Among them, the solid line is the tt process angle, the dotted line is the ff process angle, and the dashed line is the ss process angle. Comparing Figure 6 and Figure 3, it can be seen that under different process angles, the amplifier has no obvious turning point from MSG to MAG in the whole frequency band, and almost all are in the state of MAG, so it can be achieved under different process angles. Full-band stability. The body electrodes of M3 and M4 are connected to the ground through the large resistors R2 and R3. Therefore, the C db and parasitic resistances of M3 and M4 cause the path to be cut off, which will not increase the loss of the output node. solution, the amplifier gain of the present invention is higher.
如图4所示,为放大器的Gmax随频率变化的情况,其中,黑色实线为本发明放大器的Gmax,灰色虚线为体电极源极短接方案放大器的Gmax,两方案的M1-2尺寸、直流偏置电压相同。从图4可以看出,本发明放大器的Gmax在各个频点均大于体电极源极短接方案放大器的Gmax,在50GHz时,本发明比现有技术的Gmax高出0.8dB,在90GHz时,本发明的Gmax为5.01dB,现有技术Gmax为4.34dB,本发明比现有技术高出了0.67dB。大电阻R2和R3有很强的隔离作用,体电极寄生电阻产生的热噪声会遇到一个高阻的回路,因此不会叠加到放大器的输出端,所以可以相比体电极、源极短接的方案,有更低的噪声系数。如图5所示,黑色曲线为本发明放大器的NFmin,灰色虚线为现有技术放大器的NFmin。在全频段内,本发明放大器的NFmin均小于现有技术的 NFmin。50GHz时,本发明的NFmin为2.7662dB,现有技术的NFmin为2.9299dB,本发明比现有技术低0.1637dB;100GHz时,本发明的NFmin为4.9113dB,现有技术的NFmin为5.1738dB,本发明比现有技术低0.2625dB。频率越高,现有技术体电极处的寄生电阻通过Cdb等电容的通路进入输出端的噪声越多,因此,频率越高,本发明对NFmin改善越多。As shown in Figure 4, it is the case where the Gmax of the amplifier changes with frequency, in which the black solid line is the Gmax of the amplifier of the present invention, the gray dotted line is the Gmax of the amplifier with the body electrode-source short-circuiting scheme, the M1-2 size of the two schemes, The DC bias voltage is the same. It can be seen from FIG. 4 that the Gmax of the amplifier of the present invention is greater than the Gmax of the amplifier of the body electrode-source short circuit scheme at each frequency point. At 50 GHz, the Gmax of the present invention is 0.8dB higher than that of the prior art. At 90 GHz, The Gmax of the present invention is 5.01dB, and the Gmax of the prior art is 4.34dB, and the present invention is 0.67dB higher than the prior art. The large resistors R2 and R3 have a strong isolation effect. The thermal noise generated by the parasitic resistance of the body electrode will encounter a high-impedance loop, so it will not be superimposed on the output of the amplifier, so it can be compared to the body electrode and the source. scheme, has a lower noise figure. As shown in FIG. 5 , the black curve is the NFmin of the amplifier of the present invention, and the gray dotted line is the NFmin of the prior art amplifier. In the whole frequency band, the NFmin of the amplifier of the present invention is smaller than the NFmin of the prior art. At 50GHz, the NFmin of the present invention is 2.7662dB, the NFmin of the prior art is 2.9299dB, and the present invention is 0.1637dB lower than the prior art; at 100GHz, the NFmin of the present invention is 4.9113dB, and the NFmin of the prior art is 5.1738dB, The present invention is 0.2625dB lower than the prior art. The higher the frequency, the more noise the parasitic resistance at the body electrode in the prior art enters the output end through the path of capacitance such as C db . Therefore, the higher the frequency, the more the present invention improves NFmin.
以上所述,仅为本发明的具体实施方式,但本发明的保护范围并不局限于此,任何熟悉本技术领域的技术人员在本发明揭露的技术范围内,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,都应涵盖在本发明的保护范围之内。The above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited to this. Any person skilled in the art is within the technical scope disclosed by the present invention, and all within the spirit and principle of the present invention Any modifications, equivalent replacements and improvements made within the scope of the present invention should be included within the protection scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210542947.XA CN114900134B (en) | 2022-05-18 | 2022-05-18 | A MOS tube with body electrode isolation and capacitor amplifier and terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210542947.XA CN114900134B (en) | 2022-05-18 | 2022-05-18 | A MOS tube with body electrode isolation and capacitor amplifier and terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114900134A true CN114900134A (en) | 2022-08-12 |
| CN114900134B CN114900134B (en) | 2025-06-24 |
Family
ID=82723401
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202210542947.XA Active CN114900134B (en) | 2022-05-18 | 2022-05-18 | A MOS tube with body electrode isolation and capacitor amplifier and terminal |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114900134B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115549608A (en) * | 2022-10-09 | 2022-12-30 | 芯翼信息科技(上海)有限公司 | Integrated high linearity CMOS power amplifier |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1096914A (en) * | 1993-06-24 | 1994-12-28 | 三星电子株式会社 | Utilization drives at the DC feedback balance of the filter on the chip intermediate frequency to the second detector in monolithic integrated circuit |
| JP2003258564A (en) * | 2002-03-05 | 2003-09-12 | New Japan Radio Co Ltd | Impedance conversion amplifier circuit |
| CN101431316A (en) * | 2008-07-25 | 2009-05-13 | 华东师范大学 | Double-frequency band inductor multiplexing radio frequency CMOS low-noise amplifier |
| JP2012169950A (en) * | 2011-02-16 | 2012-09-06 | Fujitsu Ltd | Low noise amplifier |
| CN105281680A (en) * | 2015-10-19 | 2016-01-27 | 江苏卓胜微电子有限公司 | Low-noise amplifier with switch and radio-frequency signal amplification method |
| US20190123691A1 (en) * | 2017-08-25 | 2019-04-25 | University Of South Florida | Cascode common source transimpedance amplifiers for analyte monitoring systems |
| KR20200048583A (en) * | 2018-10-30 | 2020-05-08 | 한양대학교 산학협력단 | Low noise amplifier using differential superposition circuit |
| CN114513175A (en) * | 2021-12-30 | 2022-05-17 | 电子科技大学 | High-gain intermediate frequency amplifier adopting band body leakage cross coupling technology |
-
2022
- 2022-05-18 CN CN202210542947.XA patent/CN114900134B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1096914A (en) * | 1993-06-24 | 1994-12-28 | 三星电子株式会社 | Utilization drives at the DC feedback balance of the filter on the chip intermediate frequency to the second detector in monolithic integrated circuit |
| JP2003258564A (en) * | 2002-03-05 | 2003-09-12 | New Japan Radio Co Ltd | Impedance conversion amplifier circuit |
| CN101431316A (en) * | 2008-07-25 | 2009-05-13 | 华东师范大学 | Double-frequency band inductor multiplexing radio frequency CMOS low-noise amplifier |
| JP2012169950A (en) * | 2011-02-16 | 2012-09-06 | Fujitsu Ltd | Low noise amplifier |
| CN105281680A (en) * | 2015-10-19 | 2016-01-27 | 江苏卓胜微电子有限公司 | Low-noise amplifier with switch and radio-frequency signal amplification method |
| US20190123691A1 (en) * | 2017-08-25 | 2019-04-25 | University Of South Florida | Cascode common source transimpedance amplifiers for analyte monitoring systems |
| KR20200048583A (en) * | 2018-10-30 | 2020-05-08 | 한양대학교 산학협력단 | Low noise amplifier using differential superposition circuit |
| CN114513175A (en) * | 2021-12-30 | 2022-05-17 | 电子科技大学 | High-gain intermediate frequency amplifier adopting band body leakage cross coupling technology |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115549608A (en) * | 2022-10-09 | 2022-12-30 | 芯翼信息科技(上海)有限公司 | Integrated high linearity CMOS power amplifier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN114900134B (en) | 2025-06-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8890610B2 (en) | Compensation circuitry and method for amplifiers driving large capacitive loads | |
| CN111030614B (en) | A transconductance-enhanced millimeter-wave low-noise amplifier | |
| CN107070425B (en) | Broadband low-power-consumption low-noise amplifier applied to wireless sensor network | |
| CN103248324A (en) | High-linearity low-noise amplifier | |
| CN102946230A (en) | Ultra-wide band low-noise single-ended input and differential output amplifier | |
| CN105305981B (en) | One kind linearisation wideband low noise amplifier | |
| CN104393846A (en) | Operational amplifier | |
| CN105406826A (en) | Three-stage operational amplifier suitable for wide capacitive load range | |
| CN101917168A (en) | High Slew Rate Transconductance Amplifier Used in Active Power Factor Correctors | |
| CN105720927A (en) | Frequency-compensated transconductance amplifier | |
| CN114759881B (en) | An integrated bio-signal chopper amplifier with enhanced input impedance | |
| WO2023082932A1 (en) | Low-noise amplifier, related device and chip | |
| CN100474760C (en) | Miller compensation amplifier | |
| CN110034738A (en) | A kind of ultra-wideband low-noise amplifier based on modified impedance matching network | |
| CN115395906A (en) | Low-power consumption broadband common mode signal detection circuit suitable for ultralow voltage | |
| Kumngern et al. | Extremely low-voltage low-power differential difference current conveyor using multiple-input bulk-driven technique | |
| CN117498809A (en) | Broadband low-noise amplifier | |
| CN114900134A (en) | Neutralizing capacitor amplifier and terminal of strip electrode isolation MOS (metal oxide semiconductor) tube | |
| CN117713704A (en) | Transconductance-enhanced low-noise amplifier and radio frequency chip | |
| CN105071778A (en) | CMOS (Complementary Metal-Oxide-Semiconductor Transistor) process-based terahertz power amplifier | |
| CN109391236B (en) | Signal amplification circuit and millimeter wave signal amplification circuit | |
| CN106026954A (en) | Frequency compensation circuit for operational amplifier | |
| CN118826661B (en) | A power amplifier based on broadband predistortion | |
| CN106788279B (en) | Low-sensitivity substrate input amplifier | |
| CN110798162B (en) | Radio frequency ultra-wideband driving amplifier chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |