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CN114812244A - Temperature-uniforming plate with high material utilization rate and processing method thereof - Google Patents

Temperature-uniforming plate with high material utilization rate and processing method thereof Download PDF

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CN114812244A
CN114812244A CN202210269689.2A CN202210269689A CN114812244A CN 114812244 A CN114812244 A CN 114812244A CN 202210269689 A CN202210269689 A CN 202210269689A CN 114812244 A CN114812244 A CN 114812244A
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cavity
cover plate
degassing
convex rib
liquid injection
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CN114812244B (en
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张于光
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Liande Electronic Technology Changshu Co ltd
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23PMETAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0283Means for filling or sealing heat pipes

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Pressure Vessels And Lids Thereof (AREA)

Abstract

本申请提供了一种高材料利用率均温板及其加工方法,该均温板包括上盖板、下盖板、毛细结构和独立毛细支撑结构,上盖板上开设有除气注液孔;下盖板与上盖板焊接组成一凸台腔体和一凸筋型腔体,凸台腔体与凸筋型腔体连通,除气注液孔与凸筋型腔体连通,凸筋型腔体在压力结合区被挤压封口,压力结合区位于除气注液孔与凸台腔体之间;毛细结构附着于上盖板的下表面和下盖板的上表面;独立毛细支撑结构设置于凸台腔体内并与毛细结构连接;相变介质存在于凸台腔体内。本申请通过除气注液孔和凸筋型腔体形成完整的除气结构,无需传统均温板除气结构的除气管,进而无需抽气管根部的高频封焊或点胶,也无需裁切,提高了材料利用率,降低了加工成本。

Figure 202210269689

The present application provides a high material utilization temperature chamber and a processing method thereof. The temperature chamber includes an upper cover plate, a lower cover plate, a capillary structure and an independent capillary support structure, and the upper cover plate is provided with degassing and liquid injection holes ; The lower cover plate and the upper cover plate are welded to form a boss cavity and a convex rib cavity, the boss cavity is connected with the convex rib cavity, the degassing liquid injection hole is connected with the convex rib cavity, and the convex rib is connected with the convex rib cavity. The cavity body is squeezed and sealed in the pressure bonding area, and the pressure bonding area is located between the degassing liquid injection hole and the boss cavity; the capillary structure is attached to the lower surface of the upper cover plate and the upper surface of the lower cover plate; independent capillary support The structure is arranged in the cavity of the boss and connected with the capillary structure; the phase change medium exists in the cavity of the boss. The present application forms a complete degassing structure through the degassing and liquid injection holes and the rib-shaped cavity, and does not require the degassing pipe of the degassing structure of the traditional temperature equalizing plate, and thus does not require high-frequency sealing welding or glue dispensing at the root of the exhaust pipe, and does not require cutting Cut, improve the material utilization rate and reduce the processing cost.

Figure 202210269689

Description

一种高材料利用率均温板及其加工方法A kind of high material utilization rate uniform temperature plate and its processing method

技术领域technical field

本发明涉及散热技术,尤其涉及一种高材料利用率均温板及其加工方法。The invention relates to heat dissipation technology, in particular to a high material utilization rate temperature chamber and a processing method thereof.

背景技术Background technique

均温板作为当前散热行业最强大的传热元件,其导热能力可高达纯铜导热能力的数百倍,通过在全封闭真空腔内循环介质的汽、液相变来传递热量。在电子、通讯、汽车、照明等行业中广泛应用。As the most powerful heat transfer element in the current heat dissipation industry, the vapor chamber has a thermal conductivity hundreds of times that of pure copper, and transfers heat through the vapor and liquid phase changes of the circulating medium in the fully enclosed vacuum chamber. Widely used in electronics, communications, automotive, lighting and other industries.

均温板的主要结构由上盖板、下盖板、毛细结构、支撑结构、相变介质五部分构成。上盖板、下盖板及支持结构组合为能承受大气压力不型变的密闭腔体,腔体内为相对真空的气态相变介质及液态相变介质负压环境,热源处液态相变介质吸收热量汽化为气态相变介质,向远端负压冷凝区移动并逐步释放潜热变为液态相变介质,再通过毛细结构回到热源处,周而复始达到传热目的。由以上均温板工作原理可以看出,更好的真空度能够降低相变介质汽化的工作温度,从而降低阻抗,提升性能。均温板除气注液工艺是关键,关系到除气注液质量的均温板结构设计尤为重要。The main structure of the uniform temperature plate is composed of five parts: the upper cover plate, the lower cover plate, the capillary structure, the support structure and the phase change medium. The upper cover plate, the lower cover plate and the support structure are combined into a closed cavity that can withstand atmospheric pressure without deformation. The cavity is a relatively vacuum gaseous phase change medium and liquid phase change medium negative pressure environment, and the liquid phase change medium at the heat source absorbs The heat vaporizes into a gaseous phase change medium, moves to the remote negative pressure condensation zone and gradually releases the latent heat to become a liquid phase change medium, and then returns to the heat source through the capillary structure to achieve the purpose of heat transfer over and over again. It can be seen from the working principle of the above vapor chamber that a better vacuum degree can reduce the working temperature of the vaporization of the phase change medium, thereby reducing the impedance and improving the performance. The degassing and liquid injection process of the uniform temperature plate is the key, and the structural design of the uniform temperature plate related to the quality of the degassing and liquid injection is particularly important.

传统均温板除气、注液结构设计为下盖板边缘侧方向开放式开口,包裹除气管,下盖板侧方向开放式开口与除气管配合间隙处通过焊料或胶水密封,通过除气管先注液、后封管。此种注液、除气结构沿袭了线性热管的注液、除气方式。存在着浪费上、下盖板钣金材料,浪费除气管材料,需要额外二次焊料或胶水密封工序,及影响性能的均温板毛细结构内残留空气被表面张力夹持不易除净,必须进行二次加热除气等缺点。The traditional degassing and liquid injection structure of the uniform temperature plate is designed as an open opening on the edge side of the lower cover, wrapping the degassing pipe. Liquid injection and post-sealing. This liquid injection and degassing structure follows the liquid injection and degassing method of the linear heat pipe. There is a waste of upper and lower cover sheet metal materials, waste of degassing pipe material, additional secondary solder or glue sealing process, and residual air in the capillary structure of the uniform temperature plate that affects performance is not easy to be removed by surface tension, and must be carried out. Disadvantages of secondary heating and degassing.

随着均温板逐渐成为散热行业主流功能性部件,均温板注液除气急需一种新的结构设计以解决上述问题。As the vapor chamber has gradually become the mainstream functional component in the heat dissipation industry, a new structural design is urgently needed for liquid injection and degassing of the vapor chamber to solve the above problems.

发明内容SUMMARY OF THE INVENTION

本发明的目的在于提供一种高材料利用率均温板及其加工方法,通过改变除气注液结构和工序,提高了材料利用率,并改善了一次常温除气效果,基本无需进行二次加热除气。The purpose of the present invention is to provide a high material utilization rate uniform temperature plate and a processing method thereof. By changing the degassing and liquid injection structure and process, the material utilization rate is improved, and the primary degassing effect at room temperature is improved, and there is basically no need for secondary degassing. Heating and degassing.

以下给出一个或多个方面的简要概述以提供对这些方面的基本理解。此概述不是所有构想到的方面的详尽综览,并且既非旨在指认出所有方面的关键性或决定性要素亦非试图界定任何或所有方面的范围。其唯一的目的是要以简化形式给出一个或多个方面的一些概念以为稍后给出的更加详细的描述之序。A brief summary of one or more aspects is given below to provide a basic understanding of the aspects. This summary is not an exhaustive overview of all contemplated aspects and is neither intended to identify key or critical elements of all aspects nor attempt to delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

根据本发明的一方面,提供了一种高材料利用率均温板,包括:According to an aspect of the present invention, there is provided a vapor chamber with high material utilization rate, comprising:

上盖板,所述上盖板上开设有除气注液孔;an upper cover plate, the upper cover plate is provided with a degassing and liquid injection hole;

下盖板,所述下盖板与所述上盖板焊接组成一凸台腔体和一凸筋型腔体,所述凸台腔体与所述凸筋型腔体连通,所述除气注液孔与所述凸筋型腔体连通,所述凸筋型腔体在压力结合区被挤压封口,所述压力结合区位于所述除气注液孔与所述凸台腔体之间;a lower cover plate, the lower cover plate and the upper cover plate are welded to form a boss cavity and a rib-shaped cavity, the boss cavity is communicated with the rib-shaped cavity, and the degassing The liquid injection hole is communicated with the convex rib cavity, and the convex rib cavity is squeezed and sealed in the pressure bonding area, and the pressure bonding area is located between the degassing liquid injection hole and the boss cavity. between;

毛细结构,附着于所述上盖板的下表面和所述下盖板的上表面;a capillary structure attached to the lower surface of the upper cover plate and the upper surface of the lower cover plate;

独立毛细支撑结构,设置于所述凸台腔体内,并与所述毛细结构连接;以及an independent capillary support structure disposed in the boss cavity and connected with the capillary structure; and

相变介质,存在于所述凸台腔体内。A phase change medium exists in the boss cavity.

在一实施例中,所述压力结合区位于所述凸筋型腔体尾端靠近所述凸台腔体处。In one embodiment, the pressure bonding area is located at the rear end of the rib-shaped cavity close to the boss cavity.

在一实施例中,所述凸筋型腔体的截面宽度为1mm~3mm,所述凸筋型腔体的高度为0.2mm~1.2mm。In one embodiment, the cross-sectional width of the rib-shaped cavity is 1 mm˜3 mm, and the height of the rib-shaped cavity is 0.2 mm˜1.2 mm.

在一实施例中,所述除气注液孔孔径为1mm~3mm。In one embodiment, the diameter of the degassing and liquid injection holes is 1 mm˜3 mm.

在一实施例中,所述除气注液孔和凸筋型腔体设置于所述高材料利用率均温板的角部或侧边。In one embodiment, the degassing and liquid injection holes and the rib-shaped cavity are arranged at the corners or sides of the high material utilization rate temperature equalizing plate.

在一实施例中,所述上盖板和下盖板上还开设有定位孔,所述定位孔开设于所述凸筋型腔体两侧。In one embodiment, the upper cover plate and the lower cover plate are further provided with positioning holes, and the positioning holes are opened on both sides of the rib-shaped cavity.

根据本发明的另一方面,提供了一种均温板加工方法,包括以下步骤:According to another aspect of the present invention, a method for processing a vapor chamber is provided, comprising the following steps:

将上盖板与上毛细结构烧结为组件;Sintering the upper cover plate and the upper capillary structure into an assembly;

将下盖板与下毛细结构和独立毛细支撑结构烧结为组件;Sintering the lower cover, the lower capillary structure and the independent capillary support structure into an assembly;

将上盖板与下盖板组合并形成一凸台腔体和一凸筋腔体;Combining the upper cover plate and the lower cover plate to form a boss cavity and a convex rib cavity;

利用除气注液设备从除气注液孔将凸台腔体抽成负压,负压值≤1pa;Use degassing and liquid injection equipment to pump the boss cavity into negative pressure from the degassing and liquid injection hole, and the negative pressure value is ≤1pa;

利用腔体负压将除气注液设备内的相变介质吸入均温板腔体,通过流量计控制注入量;The phase change medium in the degassing and liquid injection equipment is sucked into the chamber of the uniform temperature plate by the negative pressure of the cavity, and the injection amount is controlled by the flow meter;

对凸筋腔体的压力结合区进行挤压封口。Press and seal the pressure bonding area of the rib cavity.

在一实施例中,在对凸筋腔体的压力结合区进行挤压封口时,所述压力结合区被挤压形变至上盖板和下盖板总厚度的90%~95%。In one embodiment, when the pressure bonding area of the rib cavity is pressed and sealed, the pressure bonding area is squeezed and deformed to 90%-95% of the total thickness of the upper cover plate and the lower cover plate.

在一实施例中,在对凸筋腔体的压力结合区进行挤压封口之后,还包括:通过压力电阻焊、超声波焊或激光焊进行二次封口。In one embodiment, after the pressure bonding area of the rib cavity is squeezed and sealed, the method further includes: performing secondary sealing by pressure resistance welding, ultrasonic welding or laser welding.

在一实施例中,在利用除气注液设备将凸台腔体抽成负压之前,通过上盖板上的定位孔实现上盖板与除气注液设备的配合。In one embodiment, before using the degassing and liquid injection equipment to pump the boss cavity into negative pressure, the upper cover plate and the degassing and liquid injection equipment are matched with each other through the positioning holes on the upper cover plate.

本发明实施例的有益效果是:通过除气注液孔和凸筋型腔体形成完整的除气结构,无需传统均温板除气结构的除气管,进而无需抽气管根部的高频封焊或点胶,也无需裁切,提高了材料利用率,简化了作业工序,降低了加工成本。The beneficial effect of the embodiment of the present invention is that: a complete degassing structure is formed through the degassing and liquid injection holes and the rib-shaped cavity, and the degassing pipe of the traditional uniform temperature plate degassing structure is not required, and thus the high-frequency sealing welding of the root of the gas extraction pipe is not required. Or dispensing, there is no need to cut, which improves the utilization rate of materials, simplifies the operation process, and reduces the processing cost.

附图说明Description of drawings

为了更清楚地说明本发明实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,应当理解,以下附图仅示出了本发明的某些实施例,因此不应被看作是对范围的限定,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他相关的附图。In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation of the scope, and for those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without any creative effort.

在结合以下附图阅读本公开的实施例的详细描述之后,能够更好地理解本发明的上述特征和优点。在附图中,各组件不一定是按比例绘制,并且具有类似的相关特性或特征的组件可能具有相同或相近的附图标记。The above-described features and advantages of the present invention can be better understood after reading the detailed description of the embodiments of the present disclosure in conjunction with the following drawings. In the drawings, components are not necessarily drawn to scale and components with similar related characteristics or features may have the same or similar reference numbers.

图1是本申请实施例一的仰视示意图;1 is a schematic bottom view of Embodiment 1 of the present application;

图2是图1中A-A截面示意图;Fig. 2 is A-A cross-sectional schematic diagram in Fig. 1;

图3是本申请实施例一的俯视示意图;3 is a schematic top view of Embodiment 1 of the present application;

图4是本申请实施例二的仰视示意图;Fig. 4 is the bottom view schematic diagram of the second embodiment of the present application;

图5是图4中B-B截面示意图;Fig. 5 is B-B sectional schematic diagram in Fig. 4;

图6是本申请实施例二的俯视示意图;6 is a schematic top view of Embodiment 2 of the present application;

其中:1-上盖板;11-除气注液孔;2-下盖板;3-毛细结构;4-独立毛细支撑结构;5-凸台腔体;6-凸筋型腔体;7-压力结合区;8-定位孔。Among them: 1- upper cover plate; 11- degassing liquid injection hole; 2- lower cover plate; 3- capillary structure; 4- independent capillary support structure; 5- boss cavity; 6- rib cavity; 7 - Pressure bonding area; 8 - Positioning holes.

具体实施方式Detailed ways

以下结合附图和具体实施例对本发明作详细描述。注意,以下结合附图和具体实施例描述的诸方面仅是示例性的,而不应被理解为对本发明的保护范围进行任何限制。The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Note that the aspects described below in conjunction with the accompanying drawings and specific embodiments are only exemplary, and should not be construed as any limitation to the protection scope of the present invention.

如图1~图3所示,本申请实施例一提供了一种高材料利用率均温板,包括:上盖板1、下盖板2、毛细结构3、独立毛细支撑结构4和相变介质。As shown in FIG. 1 to FIG. 3 , the first embodiment of the present application provides a high material utilization temperature uniform plate, including: an upper cover plate 1 , a lower cover plate 2 , a capillary structure 3 , an independent capillary support structure 4 and a phase change medium.

其中,上盖板1上开设有除气注液孔。下盖板2与上盖板1四周焊接,形成一凸台腔体5和一凸筋型腔体6,凸台腔体5与凸筋型腔体6连通。除气注液孔11与凸筋型腔体6连通。凸筋型腔体6在压力结合区7被挤压封口,压力结合区7位于除气注液孔11与凸台腔体5之间。在压力结合区7的凸筋型腔体6被挤压封口之前,凸台腔体5通过凸筋型腔体6与大气连通。压力结合区7被挤压封口后,凸台腔体5被密封。Wherein, the upper cover plate 1 is provided with a degassing and liquid injection hole. The lower cover 2 and the upper cover 1 are welded around to form a boss cavity 5 and a rib-shaped cavity 6 , and the boss cavity 5 communicates with the rib-shaped cavity 6 . The degassing and liquid injection holes 11 communicate with the rib-shaped cavity 6 . The rib-shaped cavity 6 is squeezed and sealed in the pressure bonding area 7 , and the pressure bonding area 7 is located between the degassing and liquid injection hole 11 and the boss cavity 5 . Before the rib-shaped cavity 6 of the pressure bonding area 7 is squeezed and sealed, the boss cavity 5 communicates with the atmosphere through the rib-shaped cavity 6 . After the pressure bonding area 7 is squeezed and sealed, the boss cavity 5 is sealed.

毛细结构3附着于上盖板1的下表面和下盖板2的上表面。独立毛细支撑结构4设置于凸台腔体5内,并与毛细结构3连接。相变介质(图中未示出)存在于凸台腔体5内。The capillary structure 3 is attached to the lower surface of the upper cover plate 1 and the upper surface of the lower cover plate 2 . The independent capillary support structure 4 is arranged in the boss cavity 5 and is connected with the capillary structure 3 . A phase change medium (not shown in the figure) exists in the boss cavity 5 .

相较于传统的均温板,本高材料利用率均温板无需除气注液管,而是由凸筋型腔体6和除气注液孔11组成完整的除气注液结构,从而无需抽气管根部的高频封焊或点胶,也无需裁切,提高了材料利用率,简化了作业工序,降低了加工成本。Compared with the traditional temperature equalizing plate, the high material utilization temperature equalizing plate does not need a degassing and liquid injection pipe, but consists of a convex rib-shaped cavity 6 and a degassing liquid injection hole 11 to form a complete degassing liquid injection structure. There is no need for high-frequency sealing and welding or dispensing of the root of the exhaust pipe, and no cutting is required, which improves the utilization rate of materials, simplifies the operation process, and reduces the processing cost.

如图1所示,压力结合区7位于除气注液孔11与凸台腔体5之间,优选地,压力结合区7位于凸筋型腔体6尾端靠近凸台腔体5处,以减少与凸台腔体5连通的凸筋型腔体6的部分,从而减少流入凸筋型腔体6内的相变介质。As shown in FIG. 1 , the pressure bonding area 7 is located between the degassing and liquid injection hole 11 and the boss cavity 5 . Preferably, the pressure bonding area 7 is located at the rear end of the convex rib cavity 6 close to the boss cavity 5 . In order to reduce the portion of the rib-shaped cavity 6 that communicates with the boss cavity 5 , the phase change medium flowing into the rib-shaped cavity 6 is reduced.

尺寸方面,凸筋型腔体6的截面宽度可以为1mm~3mm,凸筋型腔体6的高度为0.2mm~1.2mm。相应地,除气注液孔11的孔径为1mm~3mm。除气注液孔11的孔径不易大于凸筋型腔体6的截面宽度,除气注液孔11的投影应完全落在凸筋型腔体6内。In terms of size, the cross-sectional width of the rib-shaped cavity 6 may be 1 mm to 3 mm, and the height of the rib-shaped cavity 6 may be 0.2 mm to 1.2 mm. Correspondingly, the diameter of the degassing and liquid injection holes 11 is 1 mm˜3 mm. The diameter of the degassing and liquid injection holes 11 is not easy to be larger than the cross-sectional width of the rib-shaped cavity 6 , and the projection of the degassing and liquid injection holes 11 should completely fall within the rib-shaped cavity 6 .

材料方面,本均温板比传统均温板适用于更多金属材质,如铜、铜合金、铝合金、镁合金、铁、不锈钢、钛、钛合金、带有金属镀层的复合金属材料。In terms of materials, this vapor chamber is suitable for more metal materials than traditional vapor chambers, such as copper, copper alloy, aluminum alloy, magnesium alloy, iron, stainless steel, titanium, titanium alloy, and composite metal materials with metal coating.

图1~图3所示的实施例中,除气注液孔11和凸筋型腔体6设置于高材料利用率均温板的的角部,因此凸台腔体5在角部有一定内收。在实施例二中,如图4~6所示,除气注液孔11和凸筋型腔体6设置于高材料利用率均温板的侧边,相应地凸台腔体5在该侧边有一内收结构,以给凸筋型腔体6流出足够空间。In the embodiments shown in FIGS. 1 to 3 , the degassing and liquid injection holes 11 and the rib-shaped cavity 6 are arranged at the corners of the high material utilization temperature uniformity plate, so the boss cavity 5 has a certain amount at the corners. Adduction. In the second embodiment, as shown in FIGS. 4 to 6 , the degassing and liquid injection holes 11 and the rib-shaped cavity 6 are arranged on the side of the high material utilization temperature uniform plate, and the boss cavity 5 is correspondingly located on this side. There is a retraction structure on the side to allow enough space for the rib-shaped cavity 6 to flow out.

优选地,在上盖板1和下盖板2上还开设有定位孔8以方便除气注液设备定位,上盖板1和下盖板2组合后定位孔8形成一通孔,并且定位孔8位于除气注液孔11两侧。Preferably, a positioning hole 8 is also opened on the upper cover 1 and the lower cover 2 to facilitate the positioning of the degassing and liquid injection equipment. After the upper cover 1 and the lower cover 2 are combined, the positioning hole 8 forms a through hole, and the positioning hole 8 are located on both sides of the degassing and liquid injection holes 11.

基于上述均温板结构,本申请实施例还提供了一种均温板加工方法,包括以下步骤:Based on the above-mentioned vapor chamber structure, an embodiment of the present application also provides a method for processing a vapor chamber, comprising the following steps:

将上盖板与上毛细结构烧结为组件;Sintering the upper cover plate and the upper capillary structure into an assembly;

将下盖板与下毛细结构和独立毛细支撑结构烧结为组件;Sintering the lower cover, the lower capillary structure and the independent capillary support structure into an assembly;

将上盖板与下盖板通过钎焊、扩散焊、电阻焊、激光焊等方式组合并形成一凸台腔体和一凸筋腔体;Combining the upper cover plate and the lower cover plate by brazing, diffusion welding, resistance welding, laser welding, etc. to form a boss cavity and a convex rib cavity;

利用除气注液设备从除气注液孔将凸台腔体抽成负压,负压值≤1pa;Use degassing and liquid injection equipment to pump the boss cavity into negative pressure from the degassing and liquid injection hole, and the negative pressure value is ≤1pa;

利用腔体负压将除气注液设备内的相变介质吸入均温板腔体,通过流量计控制注入量;The phase change medium in the degassing and liquid injection equipment is sucked into the chamber of the uniform temperature plate by the negative pressure of the cavity, and the injection amount is controlled by the flow meter;

对凸筋腔体的压力结合区进行挤压封口。Press and seal the pressure bonding area of the rib cavity.

其中,在对凸筋腔体的压力结合区进行挤压封口时,应确保压力结合区被挤压形变至上盖板和下盖板总厚度的90%~95%,以达到较好的气密性。如有必要,在对凸筋腔体的压力结合区进行挤压封口之后,还可通过压力电阻焊、超声波焊或激光焊进行二次封口,。Among them, when extruding and sealing the pressure bonding area of the convex rib cavity, it should be ensured that the pressure bonding area is squeezed and deformed to 90% to 95% of the total thickness of the upper cover plate and the lower cover plate, so as to achieve better air tightness sex. If necessary, after pressing and sealing the pressure bonding area of the convex rib cavity, secondary sealing can also be performed by pressure resistance welding, ultrasonic welding or laser welding.

在可能的实施例中,在利用除气注液设备将凸台腔体抽成负压之前,还可通过上盖板上的定位孔实现上盖板与除气注液设备的配合。In a possible embodiment, before the degassing and liquid injection equipment is used to pump the boss cavity to a negative pressure, the upper cover plate can also be matched with the degassing and liquid injection equipment through the positioning holes on the upper cover plate.

不同于现有的均温板制造方法,本方法通过唯一的除气注液口,先除气后注液,不存在因为表面张力原因藏于毛细结构内气泡状废气。一次常温除气效果更佳,基本无需进行二次加热除气。均温性能被保证且极大简化了作业工序,降低了设备成本。Different from the existing method for manufacturing the temperature equalizing plate, the method uses the only degassing and liquid injection port, first degassing and then injecting liquid, and there is no bubble-like waste gas hidden in the capillary structure due to surface tension. The effect of primary degassing at normal temperature is better, and there is basically no need for secondary heating and degassing. The uniform temperature performance is guaranteed and the operation process is greatly simplified, reducing the equipment cost.

综上所述,本申请实施例所提供的高材料利用率均温板由于下盖板用于除气排出和注液流入的通道是内凸筋型腔体,在上盖板、下盖板长宽最大尺寸以内。钣金加工时无额外废料,在均温板主要以铜、铝为基材的情况下最大化的节约了原物料成本。除气注液孔与有内凸筋腔体组成完整的除气结构,无需传统均温板除气结构的除气管,进而无需抽气管根部的高频封焊或点胶,极大简化了原材料、作业工序和设备成本。新除气注液结构加工后在压力结合区进行挤压封口,如有必要则通过压力电阻焊、超声波焊、激光焊之其一方式进行二次封口确保气密性。保留了均温板整体性,无需裁切,并且结构完整美观。To sum up, the high material utilization rate temperature chamber provided by the embodiment of the present application is because the channel used by the lower cover for degassing and discharging and liquid injection is an inner rib-shaped cavity. Within the maximum size of length and width. There is no additional waste during sheet metal processing, and the cost of raw materials is maximized when the vapor chamber is mainly made of copper and aluminum. The degassing and liquid injection holes and the cavity with internal convex ribs form a complete degassing structure, which does not require the degassing pipe of the traditional vaporizing plate degassing structure, and thus does not require high-frequency sealing welding or dispensing at the root of the exhaust pipe, which greatly simplifies the raw materials. , operating procedures and equipment costs. After the new degassing and liquid injection structure is processed, it is squeezed and sealed in the pressure bonding area. If necessary, the secondary sealing is carried out by one of pressure resistance welding, ultrasonic welding and laser welding to ensure air tightness. The integrity of the vapor chamber is preserved, no cutting is required, and the structure is complete and beautiful.

本说明书中各个实施例采用递进的方式描述,每个实施例重点说明的都是与其他实施例的不同之处,各个实施例之间相同相似部分互相参见即可。The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same and similar parts between the various embodiments can be referred to each other.

提供对本公开的先前描述是为使得本领域任何技术人员皆能够制作或使用本公开。对本公开的各种修改对本领域技术人员来说都将是显而易见的,且本文中所定义的普适原理可被应用到其他变体而不会脱离本公开的精神或范围。由此,本公开并非旨在被限定于本文中所描述的示例和设计,而是应被授予与本文中所公开的原理和新颖性特征相一致的最广范围。The previous description of the present disclosure is provided to enable any person skilled in the art to make or use the present disclosure. Various modifications to the present disclosure will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other variations without departing from the spirit or scope of the present disclosure. Thus, the present disclosure is not intended to be limited to the examples and designs described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

以上所述仅为本申请的较佳实例而已,并不用以限制本申请,凡在本申请的精神和原则之内,所做的任何修改、等同替换、改进等,均应包含在本申请保护的范围之内。The above descriptions are only preferred examples of this application, and are not intended to limit this application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this application shall be included in the protection of this application. within the range.

Claims (10)

1. A high material utilization temperature-uniforming plate is characterized by comprising:
the upper cover plate is provided with a degassing and liquid injecting hole;
the lower cover plate and the upper cover plate are welded to form a boss cavity and a convex rib type cavity, the boss cavity is communicated with the convex rib type cavity, the degassing and liquid injection hole is communicated with the convex rib type cavity, the convex rib type cavity is extruded and sealed in a pressure combination area, and the pressure combination area is positioned between the degassing and liquid injection hole and the boss cavity;
the capillary structure is attached to the lower surface of the upper cover plate and the upper surface of the lower cover plate;
the independent capillary support structure is arranged in the boss cavity and is connected with the capillary structure; and
phase change medium existing in the boss cavity.
2. The high material utilization temperature equalization plate of claim 1, wherein: the pressure combination area is located at the position, close to the boss cavity, of the tail end of the rib type cavity.
3. The high material utilization temperature equalization plate of claim 1, wherein: the width of the section of the convex rib type cavity is 1 mm-3 mm, and the height of the convex rib type cavity is 0.2 mm-1.2 mm.
4. The high material utilization temperature equalization plate of claim 3, wherein: the aperture of the degassing and injecting hole is 1 mm-3 mm.
5. The material utilization rate vapor chamber of claim 1, wherein: the degassing liquid injection hole and the convex rib cavity body are arranged at the corner or the side of the uniform temperature plate with high material utilization rate.
6. The high material utilization temperature equalization plate of claim 1, wherein: the upper cover plate and the lower cover plate are also provided with positioning holes, and the positioning holes are formed in two sides of the convex rib cavity body.
7. The method for processing the uniform temperature plate is characterized by comprising the following steps of:
sintering the upper cover plate and the upper capillary structure into an assembly;
sintering the lower cover plate, the lower capillary structure and the independent capillary support structure into an assembly;
combining the upper cover plate and the lower cover plate to form a boss cavity and a convex rib cavity;
pumping the boss cavity into negative pressure from the degassing injection hole by using degassing injection equipment, wherein the negative pressure value is less than or equal to 1 pa;
absorbing the phase change medium in the degassing and liquid injection equipment into the cavity of the temperature-uniforming plate by utilizing the negative pressure of the cavity, and controlling the injection amount through a flowmeter;
and extruding and sealing the pressure combination area of the convex rib cavity.
8. The material utilization temperature-uniforming plate of claim 7, wherein: when the pressure combination area of the convex rib cavity is extruded and sealed, the pressure combination area is extruded and deformed to 90% -95% of the total thickness of the upper cover plate and the lower cover plate.
9. The material utilization rate vapor chamber of claim 7, further comprising, after extrusion sealing the pressure bonding area of the rib cavity: and carrying out secondary sealing by pressure resistance welding, ultrasonic welding or laser welding.
10. The temperature equalization plate with high material utilization rate as claimed in claim 7, wherein before the boss cavity is pumped to negative pressure by the degassing and liquid injection device, the upper cover plate is matched with the degassing and liquid injection device through a positioning hole in the upper cover plate.
CN202210269689.2A 2022-03-18 2022-03-18 High-material-utilization-rate temperature equalization plate and processing method thereof Active CN114812244B (en)

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