CN114812239A - Ultra-thin type temperature-uniforming plate element with two-phase unidirectional flow - Google Patents
Ultra-thin type temperature-uniforming plate element with two-phase unidirectional flow Download PDFInfo
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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Abstract
An ultra-thin uniform temperature plate device with two-phase unidirectional flow has a heat absorption region and a far-end condensation region. The ultra-thin temperature equalizing plate element comprises two metal sheets and a capillary structure, wherein the first metal sheet is provided with a first concave surface and M strip-shaped supporting wall structures. M +1 grooves are separated by the M strip-shaped support wall structures. The second metal sheet is overlapped on the first metal sheet and forms M +1 accommodating spaces with the M +1 grooves, and the accommodating spaces are communicated with each other through the heat absorption region and the far-end condensation region. The capillary structure is formed inside the temperature-uniforming plate element. The first sections of the P containing spaces are filled with capillary structures, and the second sections of the Q containing spaces are free of capillary structures. Therefore, the invention can effectively improve the heat conduction efficiency of the ultrathin large-size temperature-equalizing plate element so as to reduce the temperature difference value between the heat absorption area and the far-end condensation area.
Description
Technical Field
The invention relates to a novel thin temperature-equalizing plate element, in particular to an ultrathin large-size ultrathin double-direction unidirectional-flow ultrathin temperature-equalizing plate element which is different from a common thin temperature-equalizing plate element with two-phase reverse flow of working fluid and has a two-phase unidirectional flow function of the working fluid.
Background
The conventional microprocessor is a core component of electronic and communication products, and is liable to generate heat under high-speed operation to become a main heating element of the electronic device. If the heat is not dissipated instantaneously, localized hot spots will occur. Without a good thermal management scheme and a heat dissipation system, the microprocessor is often overheated and cannot perform its intended function, which may even affect the lifetime and reliability of the whole electronic device system. At present, an effective way for electronic and communication products to handle hot spots is to contact the heat absorbing end of the vapor chamber with the microprocessor of the electronic device. The high heat generated by the microprocessor is conducted and distributed to the cabinet, radiating heat into the air.
The temperature equalizing plate element is a flat vacuum sealed cavity. The inner wall of the closed cavity is paved with a capillary structure and contains working fluid. The working principle of the temperature equalizing plate is that when the heat absorption area of the temperature equalizing plate is contacted with a heat source, the liquid phase working fluid in the capillary structure of the heat absorption area absorbs heat energy and is converted from a liquid phase to a gas phase. Due to the pressure difference in the element, the gas phase working fluid flows rapidly from the air passage in the cavity to the far-end condensation area. Latent heat is released when the vapor phase working fluid flows to a condensation zone remote from the heat source, transitioning from the vapor phase working fluid to the liquid phase working fluid into the capillary structure. Then, the liquid phase working fluid is transported and reflowed to the heat absorption area by the capillary force of the continuous capillary structure in the cavity, and the flow circulation of the liquid phase and the gas phase is formed. The temperature equalizing plate element achieves the purpose of quickly conducting heat energy through the phase change and circulation of the working fluid, and enables the microprocessor to cool and radiate. The two-phase reverse flow circulation mode of the working fluid can work well in a general temperature equalization plate element with the thickness of the element larger than 0.3mm and the inner accommodating space and the air passage of the element are sufficient.
With the popularization of 5G mobile communication devices, the trend of light and thin design of products has been developed, and the requirement for the thickness of the temperature equalization plate element is also becoming strict. Generally, the thickness of the element is less than 1mm, which is commonly called as an ultrathin uniform temperature plate, and the thickness of the ultrathin uniform temperature plate element which can be produced in mass production in the current market is more than 0.3 mm. Once the thickness of the element is below 0.3mm, the dimension length exceeds 60mm, and the element area is greater than 2000mm 2 Then, because the inner holding space of the element is narrow, the thickness of the capillary structure is greatly limited, and the airway space leading from the heat absorption area to the far-end condensation area is also compressed.
The ultra-thin temperature equalization plate is generally designed to be evenly paved on the inner surface of the cavity of the ultra-thin temperature equalization plate in structure and form a capillary structure, so that the liquid phase working fluid is conveyed by the capillary force of the capillary structure. And a certain gap space is reserved above the capillary structure to allow the gas-phase working fluid to flow between the capillary structure and the gas-phase working fluid. When the thickness of the temperature equalizing plate element is less than 1mm, the internal accommodating space is limited, and the thickness of the capillary structure is required to be relatively thin, so that the laying forming of the capillary structure is difficult to manufacture by a metal powder sintering process. The laying of copper mesh or foam copper sheet becomes the mainstream way of making capillary structure. However, once the thickness of the ultra-thin temperature equalization plate element is less than 0.3mm, the thickness of the capillary structure can only be designed to be dozens of microns, and the laying of a copper mesh or a foam copper sheet to manufacture the capillary structure also faces the bottleneck of the manufacturing process. Therefore, the printing slurry is sintered with the fine powder to form a porous capillary structure with ultra-thin capillary thickness, and a new process selection is formed.
The working fluid in the ultra-thin uniform temperature plate circulates in a two-phase countercurrent mode, namely the flowing direction of the liquid-phase working fluid in the capillary structure is opposite to the flowing direction of the gas-phase working fluid in the air channel space. The gas phase working fluid flows from the heat absorption area to the condensation area, and the liquid phase working fluid reversely flows from the condensation area to the heat absorption area to complete circulation, wherein the flowing directions of the two are just opposite. As the air passage space is narrowed, the air passage length is lengthened, and the reverse friction force generated by the liquid phase flow of the gas and the surface of the capillary structure is increased, the carrying limit value of the temperature equalizing plate is smaller, and the amount of the liquid phase working fluid flowing back to the heat absorption area is limited by the carrying limit value. In addition, the gas phase working fluid is condensed into liquid phase working fluid in advance due to the increase of the friction force, enters the capillary structure and reversely flows back to the heat absorption area, so that the heat of the heat absorption area is difficult to be conducted to a condensation area far away from the heat absorption area, and the temperature difference value between the heat absorption area of the temperature equalizing plate element and the far-end condensation area is overlarge.
Currently, the two-phase counter flow is a technology actually applied to the ultra-thin temperature-equalizing plate element, and the thickness of the ultra-thin temperature-equalizing plate element which can be formally produced in the industry is not less than 0.3 mm. However, under the trend of the 5G era, the power of the heat source of the mobile electronic product is increased, the temperature rising speed is faster, and the electronic component is thinner, and the structure and design concept of the existing ultra-thin temperature equalization plate element cannot meet various requirements in future application. The thinner the thickness of the ultrathin uniform temperature plate element is, the thinner the thickness of the capillary structure and the height of the air channel space are, and the larger the area of the element is required if the element faces the same heat source; the larger the area of the element, the longer the distance between the heat absorption zone and the condensation zone. In order to solve the problem of liquid phase and gas phase circulation in the ultrathin temperature equalization plate element with the thickness of less than 0.3mm and large area, the problem of carrying limit in a narrow space due to two-phase countercurrent flow is also needed to be solved besides the capillary limit of the ultrathin capillary structure.
Please refer to fig. 1, which shows a conventional temperature equalization plate element structure P in the prior art. When the conventional temperature equalizing plate member P is very thin and narrow at the left end of the heat source H, the gas-phase working fluid PG flowing in the narrow air passage P2 continuously rubs against the capillary structure P1, and is condensed into the liquid-phase working fluid PL, which is then retained. Therefore, latent heat is also brought to only the middle section of the vapor plate element, and is brought back to the heat absorption end by the liquid-phase working fluid PL. When the liquid phase working fluid on the surface of the capillary structure flows to the heat absorption end, the direction of the liquid phase working fluid is opposite to that of the gas phase working fluid, friction is generated, and the carrying limit of the liquid phase working fluid to a heat absorption area is reduced. By way of example, if the temperature T1 of the surface of the temperature equalization plate in the heat absorption zone is 55 degrees, the temperature T2 in the middle zone is 50 degrees, the temperature T3 at the right end is only 40 degrees, and the temperature difference Δ T13 is 15 degrees. While temperature equalization plate elements typically require a temperature differential Δ T13 of within 5 degrees. This means that heat energy is accumulated from the left end to the middle and is not transferred to the right end, and the temperature equalization plate does not achieve the function of temperature equalization. This problem is more pronounced as the thinner the ultrathin vapor-panel element thickness is, the larger the element area is, and the further the distance from T1 to T3 is. This may cause the mobile electronic device manufacturers to have some limitations on the size and shape of ultra-thin temperature equalization board elements with thickness less than 0.3mm when designing the thermal management of the whole system.
If the heat energy circulates only between the heat absorption end and the middle section of the conventional vapor chamber structure P and cannot reach the right end, the working fluid at the right end is lack of convection. The working fluid has not a long enough circulation distance, and thus the conventional vapor chamber structure P cannot exert the maximum heat-clearing and heat-conducting effects.
Therefore, how to make the working fluid in the ultrathin temperature-equalizing plate element is to be realized, especially to make the thickness of the ultrathin temperature-equalizing plate element less than 0.3mm, the dimension length of the ultrathin temperature-equalizing plate element more than 60mm and the area of the ultrathin temperature-equalizing plate element more than 2000mm 2 The ultra-thin temperature equalizing plate element can be quickly and completely circulated, and ideal heat conduction and heat release functions are achievedThe problem to be solved by the 5G era for manufacturing the ultrathin uniform temperature plate is urgent.
Disclosure of Invention
In view of the above, the present invention provides an ultra-thin temperature equalization plate element with two-phase unidirectional flow, which can effectively solve the problem of too large temperature difference between the heat absorption region and the far-end condensation region of the element caused by too low carrying limit of two-phase reverse flow of the working fluid in the large-sized ultra-thin temperature equalization plate, so as to implement the manufacturing and application of the high-power ultra-thin large-sized temperature equalization plate element. The invention utilizes the configuration forming mode of the capillary structure in the large-area ultrathin temperature-equalizing plate element and the flow channel design of the liquid-gas two-phase working fluid to change the two-phase reverse flow circulation mode of the working fluid in the current common temperature-equalizing plate element so as to form the circulation mode of the two-phase unidirectional flow of the working fluid. Furthermore, the working fluid is enabled to present good gas-liquid two-phase circulation between the heat absorption area and the far-end condensation area in the ultrathin temperature equalization plate, so that the problem of overlarge element temperature difference caused by carrying limit is solved, and the element temperature equalization problem of a plurality of far-end condensation areas in a single heat absorption area and a plurality of far-end condensation areas in a plurality of heat absorption areas is solved.
In order to achieve the above object, the present invention discloses an ultra-thin temperature equalization plate element with two-phase unidirectional flow, which is characterized by comprising:
the first metal sheet is provided with a first sunken surface, M first strip-shaped support walls and M +1 first groove structures, the first sunken surface is divided into a heat absorption area, at least one far-end condensation area and a middle section area, and the M first strip-shaped support walls are arranged in the middle section area and divide the M +1 first groove structures;
a second metal sheet having a second surface, stacked on the first concave surface of the first metal sheet, wherein M +1 accommodating spaces are formed between the M +1 first groove structures and the second surface, the M +1 accommodating spaces are communicated with each other by the heat absorption region and the far-end condensation region, and the M +1 accommodating spaces further include:
p first accommodation spaces with a first section; and
q second accommodating spaces with a second section;
wherein P, Q, M are natural numbers, P and Q are both ≧ 1, and M ≧ 2;
the capillary structure is continuously formed in the heat absorption area, the far-end condensation area and the first accommodating space, occupies the space of the first section, and is not formed in the second section; and
the working fluid is arranged in the ultra-thin temperature equalizing plate element and is subjected to phase change conversion between a gas-phase working fluid and a liquid-phase working fluid according to different environments;
when the heat absorption area is heated, the gas-phase working fluid flows from the heat absorption area to the far-end condensation area along the second accommodating spaces, and the liquid-phase working fluid flows from the far-end condensation area to the heat absorption area along the first accommodating spaces.
The first section is located in the first accommodating space and close to the heat absorption region, the second section is located in the second accommodating space and close to the heat absorption region, and P + Q ≦ M + 1.
Wherein, the distance between the farthest two points of the ultra-thin temperature-equalizing plate element is not less than 60mm, the total thickness of the ultra-thin temperature-equalizing plate element is not more than 0.3mm, and the area of the ultra-thin temperature-equalizing plate element is not less than 2000mm 2 。
Wherein, the length of the second section of the second accommodating space is not less than 1.0 mm.
The capillary structure is further divided into a first capillary structure and a second capillary structure, the first capillary structure is arranged in the heat absorption area, and the porosity of the first capillary structure is larger than that of the second capillary structure.
The second surface is further a second concave surface, which is provided with M second strip-shaped support walls and M +1 second groove structures, the second strip-shaped support walls correspond to the first strip-shaped support walls and divide the second groove structures, and the first groove structures and the second groove structures are superposed to form the M +1 accommodating spaces.
Wherein the second section is coated with a hydrophobic coating.
Wherein the occupied space ratio of the capillary structure increases in a gradient manner from the second section to the first section through the distal condensation zone.
The capillary structure is a powder sintered metal porous capillary structure, and comprises a plurality of chain copper members and a plurality of spheroidal copper members, wherein the chain copper members are connected with each other, the spheroidal copper members are dispersed among the chain copper members, and the average diameter of the spheroidal copper members is larger than that of the chain copper members.
The metal porous capillary structure is prepared by a slurry through a printing process, a drying process, a cracking process and a sintering process, wherein the slurry comprises a polymer colloid, a plurality of metal copper particles and a plurality of copper oxide particles.
Therefore, the invention can improve the heat conduction efficiency of the ultrathin temperature-equalizing plate element with larger size so as to reduce the temperature difference value between the heat absorption area and the far-end condensation area of the element. Especially suitable for the element with the thickness not more than 0.3mm, the dimension length not less than 60mm and the area not less than 2000mm 2 And the shape of the ultra-thin type temperature equalizing plate is irregular. The ultra-thin temperature equalizing plate element has the advantages that the accommodating space and the air passage in the element are too narrow, and the distance from the heat absorption area to the far-end condensation area is too long; and the insufficient conduction efficiency of the working fluid due to the limitation of the capillary limit and the carrying limit. The two limitations cause the temperature difference between the heat absorption area and the condensation area to be too large, and the heat energy cannot be effectively conducted.
The double-phase unidirectional flow thin temperature-equalizing plate element designed and provided by the invention is provided with M +1 strip-shaped accommodating spaces separated by M strip-shaped support walls in the middle section area. The capillary structure filling the first section of the first containing space blocks the gas-phase working fluid from flowing to the far-end condensing area through the first containing space, and the gas-phase working fluid is intensively led to the second containing space to flow to the far-end condensing area. The capillary structure of the heat absorption area and the capillary structure of the condensation area are disconnected in the second accommodating space by the second section which is not laid and forms the capillary structure, so that the condensed liquid-phase working fluid is prevented from reversely flowing back to the heat absorption area from the capillary structure in the second accommodating space, and only can flow to the heat absorption area from the continuous capillary structure of the far-end condensation area and the first accommodating space in the same forward direction as the gas-phase working fluid, and the whole liquid-gas phase circulation is completed.
Drawings
FIG. 1 illustrates a prior art vapor chamber device structure and a working fluid circulation pattern;
FIG. 2 is a schematic view of a first metal sheet and a second metal sheet in one embodiment of the invention;
FIG. 3A is a schematic view of an ultra-thin uniform temperature plate element according to an embodiment of the present invention;
FIG. 3B depicts a schematic flow diagram of a gas phase working fluid and a liquid phase working fluid in the embodiment of FIG. 3A;
FIG. 4A is a cross-sectional view of the first accommodating space along the line AA in the embodiment of FIG. 3B;
FIG. 4B is a cross-sectional view of the second accommodating space along the line BB in the embodiment of FIG. 3B;
FIG. 5 is a schematic view of an ultra-thin temperature equalization plate element according to another embodiment of the present invention;
FIG. 6A is a cross-sectional view of the first accommodating space according to another embodiment of the invention;
FIG. 6B is a cross-sectional view of the second accommodating space of the embodiment shown in FIG. 6A;
FIG. 7 is a schematic diagram of a capillary structure in accordance with one embodiment of the present invention;
FIG. 8 is a schematic diagram of a first capillary structure and a second capillary structure in accordance with one embodiment of the present invention;
FIG. 9A is a cross-sectional view of the first accommodating space according to another embodiment of the invention;
fig. 9B is a cross-sectional view of the second accommodating space of the embodiment of fig. 9A.
Detailed Description
In order that the advantages, spirit and features of the invention will be readily understood and appreciated, embodiments thereof will be described in detail hereinafter with reference to the accompanying drawings. It is to be understood that these embodiments are merely representative examples of the present invention, and that no limitation with respect to the scope of the invention or its corresponding embodiments is intended by the specific methods, devices, conditions, materials, etc. In the drawings, the vertical direction, the horizontal direction and each element are only used to express their relative positions, and are not drawn to actual scale, and will be described in advance.
Please refer to fig. 2 to 4. FIG. 2 is a schematic view of a first metal sheet and a second metal sheet in one embodiment of the invention; FIG. 3A is a schematic view of an ultra-thin temperature equalization plate element; FIG. 3B depicts a schematic flow diagram of a gas phase working fluid and a liquid phase working fluid in the embodiment of FIG. 3A; FIG. 4A shows a cross-sectional view along line AA in the embodiment of FIG. 3B; FIG. 4B shows a cross-sectional view along line BB of the embodiment of FIG. 3B. The dotted lines shown in fig. 4A and 4B represent the range of the accommodating space.
An ultra-thin uniform temperature plate device S with two-phase and one-way flow comprises a first metal sheet 1, a second metal sheet 2, a capillary structure 3 and a working fluid (not shown). The first metal sheet 1 has a first concave surface 10, M first elongated support walls 15, and M +1 first groove structures 11, where M ≧ 2. The first concave surface is divided into a heat absorption region 101, at least one far-end condensation region 102 and a middle section region 105, and M first strip-shaped support walls 15 are disposed in the middle section region 105 and divide into M +1 first trench structures 11. The second metal sheet 2 has a second surface 20 overlapping the first concave surface 10 of the first metal sheet 1. M +1 accommodating spaces 5 are formed between the M +1 first trench structures 11 and the second surface 20. The M +1 accommodating spaces 5 are communicated with each other by the heat absorbing region 101 and the far-end condensing region 102. The M +1 accommodating spaces 5 further include P first accommodating spaces 51 having a first section 510 and Q second accommodating spaces 52 having a second section 520. Wherein P, Q, M are natural numbers, and P and Q are ≧ 1.
The capillary structure 3 is continuously formed in the heat absorbing region 101, the distal condensation region 102 and the first receiving space 51. The capillary structure 3 occupies the space of the first section 510, and the capillary structure 3 is not formed at the second section 520. The working fluid is arranged in the ultra-thin temperature-uniforming plate element S and is subjected to phase change conversion between a gas-phase working fluid SG and a liquid-phase working fluid SL according to different environments; basically, when the temperature is high, the phase becomes the vapor phase working fluid SG, and when the temperature is low, the phase becomes the liquid phase working fluid SL. When the heat absorption region 101 is heated, the vapor working fluid SG flows from the heat absorption region 101 toward the distal condensation region 102 along the second accommodating space 52, and the liquid working fluid SL flows from the distal condensation region 102 toward the heat absorption region 101 along the first accommodating space 51.
The heat absorption area 101 is a section corresponding to the heat source H, and the heat absorption area 101 is usually slightly larger than the heat source H, that is, the overhead area of the heat absorption area 101 is larger than that of the heat source H. The occupied space of the capillary structure 3 means that the pores inside the capillary structure 3 are also regarded as a part of the capillary structure 3, and therefore the length, width and height of the outer surface of the capillary structure 3 are multiplied by the occupied space of the capillary structure 3. In this specification, the capillary structure 3 is shown as a dotted area in the drawings, in addition to fig. 7 and 8. The blank area without dots in the first trench structure 11 is the second section 520 of the second accommodating space 52, and the denser dot area is the first section 510 of the first accommodating space 51.
The first accommodating space 51 and the second accommodating space 52 are basically elongated spaces surrounded by the second surface 20, the first recessed surface 10 (or/and the capillary structure 3 thereon), and the first elongated support wall 15. The first and second accommodating spaces 51 and 520 are connected to the heat absorption region 101 and the far-end condensation region 102, and the first and second sections 510 and 520 are cross-sectional sections in the elongated space. In some embodiments, the first receiving space 51 and the second receiving space are respectively approximately equal to the space occupied by the first trench structure 11.
The first elongated support wall 15 may be formed by etching the first metal sheet 1, or may be a dense wall formed by sintering a metal-containing slurry at a high temperature. The first elongated support wall 15 can limit the working fluid from passing through between two adjacent accommodation spaces. A first section 510 occupied by the capillary structure 3, wherein the pores of the capillary structure 3 are substantially filled with the liquid-phase working fluid SL, thereby limiting the passage of the heat-absorbing region vapor-phase working fluid SG; the second section 520 of the capillary structure 3 is not laid, because no capillary structure 3 drives the liquid-phase working fluid SL to flow, the liquid-phase working fluid SL in the far-end condensation area 102 does not flow back to the heat absorption area 101 through the second section 520.
The first elongated support wall 15 is disposed at a position defining at least one boundary of the middle section 105. The first elongated support wall 15 also isolates the direct communication between the first accommodating space 51 and the second accommodating space 52, so that the first accommodating space 51 and the second accommodating space 52 must depend on the heat absorption region 101 and the far-end condensation region 102 for communication. In the cross-sectional views of fig. 4 and the following, it is seen that the first elongated support wall 15 is located behind the capillary structure 3, and the elongated support wall is shown as a white area in the figure.
The M first elongated support walls 15 separate the M +1 first trench structures 11, and the heat absorption region 101, the M +1 first trench structures 11, and the far-end condensation region 102 form a cavity with multiple surrounding routes. The capillary structure 3 almost filling the first section 510 blocks the vapor phase working fluid SG generated when the liquid phase working fluid SL in the capillary structure 3 of the heat absorption region 101 boils from passing through the first accommodation space 51 and intensively flowing to the second accommodation space 52 toward the distal condensation region 102. From the second section 520 with little capillary structure 3, the vapor phase working fluid SG of the heat absorption region 101 passes from the second accommodation space 52 to the distal condensation region 102 with less obstruction. The liquid-phase working fluid SL condensed in the far-end condensation area 102 is difficult to flow through the second accommodation space 52 to the heat absorption area 101 due to the second section 520 having almost no capillary structure 3, and is concentrated to flow back from the capillary structure 3 of the first accommodation space 51 to the heat absorption area 101. The liquid phase working fluid SL passes through the first accommodating space 51 from the far-end condensation area 102 to reach the heat absorption area 101; the vapor working fluid SG passes through the second receiving space 52 and the far-end condensing region 102 from the heat absorbing region 101 to reach the first receiving space 51, and is gradually condensed. Therefore, the flow starting points of the liquid-phase working fluid SL and the gas-phase working fluid SG are different, but the flow directions are the same. In addition, after the convection direction from the heat absorption region 101 to the distal condensation region 102 is formed, the convection velocity of the working fluid is driven, the turbulence is further reduced, and the heat conduction efficiency is improved again.
In the embodiment, since the P first receiving spaces 51 and the Q second receiving spaces 52 are communicated with each other in the plurality of distal condensation areas 102, the liquid-phase working fluid SL in the capillary structure 3 can selectively flow back to the first receiving space 51 of the heat absorption area 101 due to the capillary pressure difference.
In addition, the condensing position of the vapor phase working fluid SG is adjusted by changing the length D1 of the second section 520 of the second accommodating space 52 where the capillary structure 3 is not formed, so as to achieve the purpose of optimizing the temperature equalization of each region of the element.
In the present invention, the purpose of the first section 510 is to block the flow of the vapor working fluid SG, and a region capable of blocking the path to some extent is referred to as the first section 510, and is generally a region closest to the heat absorption region 101 in the first accommodating space 51. The second section 520 is designed to block the capillary structure, so that the liquid-phase working fluid SL cannot flow from the second accommodating space 52 to the heat absorption region 101, and the region between the second accommodating space 52 and the heat absorption region 101 is referred to as the second section 520, and is usually the region of the second accommodating space 52 closest to the heat absorption region 101. The first section 510 is located in the first accommodating space 51 near the heat absorption region 101, and the second section 520 is located in the second accommodating space 52 near the heat absorption region 101. The closer the edges of the first section 510 and the second section 520 are to the heat absorption region, the more unidirectional circulation can be maximized.
In one embodiment, the capillary structure 3 fills the space of the first section 510, or substantially fills the space of the first section 510. The higher the proportion of space occupied by the capillary structures 3 in the first section 510, the better the effect of creating a unidirectional flow of working fluid. The second section 520 does not have any capillary structures 3 therein or forms only a very thin layer of capillary structures. The lower the proportion of the space occupied by the capillary structure 3 in the second section 520, the better the effect of forming the unidirectional flow working fluid. In an optimal condition, the occupied space proportion of the capillary structure 3 in the first section 510 of the first accommodating space 51 is 100%; in the second section 520 of the second accommodating space 52, the occupied space ratio of the capillary structure 3 is 0%. At this time, the effect of forming the unidirectional flow working fluid is the best. In practice, the occupied space ratio of the capillary structure 3 is not easily 0% or 100%, and in a preferred embodiment, the occupied space ratio of the capillary structure 3 in the first section 510 of the first accommodating space 51 is greater than 90%, which is called to fill up the capillary structure 3; in the second section 520 of the second accommodating space 52, the occupied space proportion of the capillary structure 3 is less than 10%, which means that the capillary structure 3 is not formed.
In order to prevent the liquid-phase working fluid in the second accommodating space 52 from flowing back to the heat-absorbing region 101, the length D1 of the second section 520 of the second accommodating space 52 is greater than 1.0mm, so as to effectively cut off or reduce the capillary phenomenon. The length D1 of the second section 520 in different second accommodating spaces 52 can have different lengths, so as to adjust the positions of the liquid phase working fluid condensed into the liquid phase working fluid in the different accommodating spaces 52 and entering the capillary structure 3, and further adjust the temperatures of different point positions on the temperature equalization plate. When the second section 520 is covered with a hydrophobic coating, the vapor phase working fluid SG is less likely to condense on the surface of the metal sheet of the second section 520, so as to reduce the flow of the liquid phase working fluid SL, or reduce the liquid phase working fluid entering the capillary structure 3 for circulation.
In the embodiment of fig. 3A, M is 4, P is 2, and Q is 3. That is, the ultra-thin type vapor chamber element S has 4 first elongated knee walls 15, 5 first groove structures 11, two first accommodating spaces 51 and 3 second accommodating spaces 52. The number of P and Q can be different, and a multi-runner route is formed, so that the shape design of the ultrathin uniform temperature plate element S has more elasticity. In principle, P + Q ≦ M +1, i.e., the number of first elongated knee walls 15 determines the upper limit number of P + Q.
Please refer to fig. 5. FIG. 5 is a schematic view of an ultra-thin temperature equalization plate element according to another embodiment of the present invention. Elements not specifically shown or described have substantially the same function and structure as the embodiments described above, and may be modified reasonably in accordance with the embodiments. In the embodiment of fig. 5, M is 10, P is 5, and Q is 6. In fig. 5, there are two remote condensation zones 102 communicating with the same heat absorption zone 101. The densely distributed first strip-shaped support walls 15 enable the ultra-thin temperature equalization plate element S to have better support force and effectively limit the capillary direction. The 11 first trench structures 11 are arranged in sequence, wherein the leftmost four and rightmost two first trench structures 11 comprise the second section 520, and the middle five first trench structures 11 comprise the first section 510. In this way, the gaseous working fluid in the heat absorption region 101 is guided to the two distal condensation regions 102 from the second accommodating spaces 52 on both sides, and the liquid working fluid flows back to the heat absorption region 101 from the first accommodating space 51 in the middle. The structural design enables the ultra-thin type temperature-uniforming plate element to form two large-range working fluid circulation routes when in use.
In other embodiments, R general first groove structures 11 may be disposed between the heat absorbing region and the condensing region, and 20% to 80% of the thickness of the capillary structure 3 is disposed. At this time P + Q < M + 1. R general first groove structures 11 and the second metal sheet 2 form R accommodation spaces, and the liquid phase working fluid and the gas phase working fluid circulate in a two-phase counter-current mode. When the distance between the heat absorption area and the condensation area is short, the degree of the influence of the capillary limit and the carrying limit on circulation is not large, and the influence on the temperature difference is also not large.
In one embodiment, the capillary structure 3 and the flow channel design of the working fluid in the gas and liquid phases can have a very flexible design for ultra-thin temperature equalization plate elements with irregular super-large areas. The two-phase unidirectional flow working fluid circulation mode can be adopted, and the working fluid circulation mode with two-phase unidirectional flow and two-phase countercurrent flow can also be adopted.
Please refer to fig. 6. FIG. 6A is a cross-sectional view of the first accommodating space according to another embodiment of the invention; fig. 6B is a cross-sectional view of the second accommodating space of the embodiment of fig. 6A. Except for the first section 510 and the second section 520, the heat absorbing region 101, the distal condensation region 102, the rest of the first receiving space 51 and the rest of the second receiving space 52 of the first concave surface 10, the occupied space ratio of the capillary structure 3 is between 20% and 80%. And the proportion of the space occupied by the capillary structures 3 in these regions rises in a gradient, for example 0.01%, 20%, 50%, 80%, 99.99, from the second section 520 through the distal condensation zone 102 to the first section 510. The gas-phase working fluid meets the capillary structure 3 with ascending gradient in the forward direction, the capture degree of the capillary structure 3 to the gas-phase working fluid can be gradually improved, the condensation effect is increased, and the water storage capacity and the liquid transfer capacity are gradually improved.
Please refer to fig. 4B. The thickness D2 of the ultra-thin vapor chamber element S is in principle not more than 0.3mm, calculated from the outer surface of the first metal sheet 1 to the outer surface of the second metal sheet 2 as the thickness D2. The distance length D3 between the two farthest points of the ultra-thin temperature equalization plate element S is greater than 60mm, strictly speaking, the distance length D3 should be close to the straight distance between the two farthest ends of the heat absorption area 101 and the far-end condensation area 102 of the ultra-thin temperature equalization plate element S, and fig. 4B is only schematic. Under the limitation of the length-thickness ratio, the prior art and structure can not make a thin temperature-equalizing plate which can well operate, and only the ultra-thin temperature-equalizing plate element S provided by the invention can achieve the fluid circulation of the whole element. For example, the temperature T4 of the endothermic zone 101 is 52 degrees C, the temperature T5 of the middle zone is 50 degrees C, the temperature T6 of the right end is 48 degrees C, and the temperature difference Δ T46 is 4 degrees C. The temperature difference between the heat absorption area and the far-end condensation area is only 4 ℃ so as to meet the requirement that the temperature difference is less than 5 ℃ in general application. This means that the heat energy is effectively conducted to the other end, and naturally the heat can be effectively removed.
Please refer to fig. 7 and 8. FIG. 7 is a schematic diagram of a capillary structure in accordance with one embodiment of the present invention; FIG. 8 is a schematic diagram of a first capillary structure and a second capillary structure according to an embodiment of the invention. The capillary structure 3 is a powder-sintered porous metal capillary structure, which includes a plurality of chain copper members 37 and a plurality of spheroidal copper members 38, wherein the chain copper members 37 are connected with each other, the spheroidal copper members 38 are dispersed among the chain copper members 37, and the average diameter of the spheroidal copper members 38 is larger than that of the chain copper members 37. In one embodiment, the metal porous capillary structure is made by printing, drying, cracking and sintering a slurry containing a polymer colloid, a plurality of metal copper particles and a plurality of copper oxide particles.
In one embodiment, the average particle size of the metallic copper powder D50 is about 10um to 15um, and the average particle size of the copper oxide powder is about 0.5um to 5um, especially for the cuprous oxide powder with octagonal crystal. And drying the slurry, removing the solvent to form a solidified substance, and attaching the polymer between the metal copper powder and the copper oxide powder. The cured product is cracked and the polymer is gasified to leave holes between the metal copper powder and the copper oxide powder. After sintering in a mixed atmosphere of nitrogen and hydrogen, the metallic copper powder forms spherical copper members 38, and the copper oxide powder is stretched and reduced into chain-like copper members 37, and since the copper oxide powder is smaller, the reduced metallic copper powder is more easily sintered than the metallic copper powder, and flows through gaps between the spherical copper members 38, so that the chain-like copper members 37 and the spherical copper members 38 are sintered alternately with each other.
Please refer to fig. 5, 7 and 8. The capillary structure 3 is further divided into a first capillary structure 31 and a second capillary structure 32, both of which are continuous structures. The first capillary structure 31 is disposed in the heat absorption region 101, and the second capillary structure 32 is disposed in the far-end condensation region 102 and the middle region 105, or in a position outside the heat absorption region 101. The first capillary structure 31 has a porosity greater than that of the second capillary structure 32; the pore diameter of the first capillary structure 31 is larger than that of the second capillary structure 32; the average particle diameter of the spherical copper members 38 in the first capillary structure 31 is larger than the average particle diameter of the spherical copper members 38 in the second capillary structure 32.
The large average particle size of the first capillary structure 31 is beneficial to less thermal resistance when the liquid phase working fluid is boiled and faster evaporation speed to the gas phase working fluid; relatively speaking, the small average particle size of the second capillary structure 32 is beneficial to increase the capillary force, so that the flowing speed of the liquid phase working fluid is increased. Therefore, the first capillary structure 31 is disposed at the heat absorption region to facilitate the liquid phase to be converted into the gas phase working fluid, and the second capillary structure 32 is disposed at other portions to facilitate the liquid phase working fluid to flow, especially at the first section 510 to block the gas phase working fluid from passing through.
Please refer to fig. 9A and 9B. Fig. 9A and 9B are cross-sectional views illustrating a first accommodating space and a second accommodating space according to another embodiment of the invention. For the sake of clarity of illustration, the first metal sheet 1 and the second metal sheet 2 are not completely joined. The second surface 20 is further a second recessed surface, and has M second elongated support walls 25 and M +1 second trench structures 22, the second elongated support walls 25 correspond to the first elongated support walls 15 and separate the second trench structures 22, and the first trench structures 11 and the second trench structures 22 are stacked to form the M +1 accommodating spaces.
In an embodiment, the first metal sheet 1 shown in fig. 4A needs to be spread with slurry twice to form the protruding capillary structure 3, or a piece of the capillary structure 3 having a thickness approximately equal to the thickness D2 of the accommodating space can be directly attached to form the barrier of the gas phase working fluid. In the structure of fig. 9A or 9B, the first metal sheet 1 or the second metal sheet 1 is correspondingly subjected to slurry laying and sintering, so as to form the capillary structure 3 of the first section 510 with barrier property, and the process can be changed, so as to save the time for waiting for solidification after the slurry is laid for the first time.
In addition, in the present invention, in addition to the first elongated support wall 15 as a main structural wall, a secondary support wall (not shown) may be provided as an auxiliary structural wall, and the support columns 17 may be provided as a local reinforcement that does not affect the direction of the fluid. In one embodiment, the first elongated support wall 15 is a continuous elongated structure, or a structure with a narrow gap in the middle. The narrow gap is based on negligible permeation of the working fluid into the adjacent receiving space.
The invention mainly aims to improve the heat conduction efficiency of the ultrathin temperature-equalizing plate element with larger size so as to reduce the temperature difference value between the heat absorption area and the far-end condensation area of the element. Especially suitable for the element with the thickness not more than 0.3mm, the dimension length not less than 60mm and the area not less than 2000mm 2 And the shape of the ultra-thin type temperature equalizing plate is irregular. Because the internal accommodation space and the air passage of the element are too narrow, and the distance between the heat absorption area and the far-end condensation area is too long; and the insufficient conduction efficiency of the working fluid due to the limitation of the capillary limit and the carrying limit. The two limitations cause the temperature difference between the heat absorption area and the condensation area to be too large, and the heat energy cannot be effectively conducted.
The thin temperature-equalizing plate element with double-phase unidirectional flow provided by the design of the invention is provided with M +1 strip-shaped accommodating spaces separated by M strip-shaped support walls in the middle section area. The capillary structure filled in the first sections of the P first accommodating spaces stops the gas-phase working fluid from flowing to the far-end condensation area through the P first accommodating spaces, and the gas-phase working fluid is intensively led to the Q second accommodating spaces to flow to the far-end condensation area. The capillary structure of the heat absorption area and the capillary structure of the condensation area are disconnected in the Q second accommodating spaces by the second section which is not laid and forms the capillary structure, so that condensed liquid-phase working fluid is prevented from reversely flowing back to the heat absorption area from the capillary structures in the Q second accommodating spaces, and can only flow to the heat absorption area from the continuous capillary structures of the far-end condensation area and the P first accommodating spaces in the same forward direction as the gas-phase working fluid, and the whole liquid-gas phase circulation is completed.
Meanwhile, the position of the gas-phase working fluid condensed into the capillary structure can be adjusted by different designs of the lengths of the second sections in the Q second accommodating spaces, and the temperature distribution of the temperature-equalizing plate is further adjusted. In addition, as the far-end condensation area, the P first accommodating spaces and the Q second accommodating spaces are communicated with each other, the liquid-phase working fluid converged by the Q second accommodating spaces in the far-end condensation area can be conveyed back to the heat absorption area by the capillary structure according to capillary pressure difference by selecting any flow channel in the P first accommodating spaces, so as to form liquid-gas phase circulation.
Therefore, compared with the working fluid circulation mode using two-phase reverse flow in the conventional ultrathin uniform temperature plate technology, the design of the invention is applied to the working fluid circulation mode with the thickness of not more than 1.0mm, the length of more than 50mm and the area of more than 1000mm 2 When the temperature equalizing plate element is used, the heat conduction efficiency and the heat equalizing efficiency can be improved to a certain degree. When the prior art and the invention are applied to the thickness of not more than 0.3mm, the length of more than 60mm and the area of more than 2000mm 2 When the ultra-thin temperature equalizing plate element is adopted, the heat conduction efficiency and the heat equalizing efficiency can be remarkably increased, and the temperature difference between the two ends of the heat absorption area and the far-end condensation area is further greatly reduced. Therefore, the invention has excellent heat conduction and temperature equalization effects and innovative performance.
The above detailed description of the preferred embodiments is intended to more clearly illustrate the features and spirit of the present invention, and is not intended to limit the scope of the present invention by the preferred embodiments disclosed above. On the contrary, it is intended to cover various modifications and equivalent arrangements included within the scope of the claims. The scope of the claims is thus to be accorded the broadest interpretation so as to encompass all such modifications and equivalent arrangements as is within the scope of the appended claims.
Claims (10)
1. An ultra-thin temperature equalization plate element with two-phase unidirectional flow, characterized by comprising:
the first metal sheet is provided with a first sunken surface, M first strip-shaped support walls and M +1 first groove structures, the first sunken surface is divided into a heat absorption area, at least one far-end condensation area and a middle section area, and the M first strip-shaped support walls are arranged in the middle section area and divide the M +1 first groove structures;
a second metal sheet having a second surface, stacked on the first concave surface of the first metal sheet, wherein M +1 accommodating spaces are formed between the M +1 first groove structures and the second surface, the M +1 accommodating spaces are communicated with each other by the heat absorption region and the far-end condensation region, and the M +1 accommodating spaces further include:
p first accommodation spaces with a first section; and
q second accommodating spaces with a second section;
wherein P, Q, M are natural numbers, P and Q are both ≧ 1, and M ≧ 2;
the capillary structure is continuously formed in the heat absorption area, the far-end condensation area and the first accommodating space, occupies the space of the first section, and is not formed in the second section; and
the working fluid is arranged in the ultra-thin temperature equalizing plate element and is subjected to phase change conversion between a gas-phase working fluid and a liquid-phase working fluid according to different environments;
when the heat absorption region is heated, the gas-phase working fluid flows from the heat absorption region along the second accommodating spaces toward the far-end condensation region, and the liquid-phase working fluid flows from the far-end condensation region along the first accommodating spaces toward the heat absorption region.
2. The ultra-thin vapor chamber element with dual-phase unidirectional flow of claim 1, wherein the first section is located in the first receiving space adjacent to the heat absorption region, the second section is located in the second receiving space adjacent to the heat absorption region, and P + Q ≦ M + 1.
3. The ultra-thin type vapor-panel assembly with bi-phase unidirectional flow according to claim 1, wherein the distance between the two farthest points of the ultra-thin type vapor-panel assembly is not less than 60mm, the total thickness of the ultra-thin type vapor-panel assembly is not more than 0.3mm, and the area of the ultra-thin type vapor-panel assembly is not less than 2000mm 2 。
4. The ultra-thin body vapor-distribution plate member with two-phase unidirectional flow of claim 1, wherein the length of the second section of the second accommodating space is not less than 1.0 mm.
5. The ultra-thin plate member with bi-phase unidirectional flow according to claim 1, wherein the capillary structure is further divided into a first capillary structure and a second capillary structure, the first capillary structure is disposed in the heat sink region, and the first capillary structure has a porosity greater than that of the second capillary structure.
6. The ultra-thin vapor chamber element with bi-phase unidirectional flow of claim 1, wherein the second surface is further a second concave surface having M second elongated supporting walls and M +1 second groove structures, the second elongated supporting walls corresponding to the first elongated supporting walls and separating the second groove structures, the M +1 accommodating spaces being formed by stacking the first groove structures and the second groove structures.
7. The ultra-thin body vapor-distribution plate member with bi-phase unidirectional flow of claim 1, wherein said second section is coated with a hydrophobic coating.
8. The ultra-thin body vapor-distribution plate member with two-phase unidirectional flow according to claim 1, wherein the capillary structure has a space occupying ratio that increases in a gradient from the second section to the first section through the distal condensation zone.
9. The ultra-thin vapor chamber element with two-phase unidirectional flow as claimed in claim 1, wherein the capillary structure is a powder-sintered porous metal capillary structure, the porous metal capillary structure comprises a plurality of chain-like copper members and a plurality of spheroidal copper members, the chain-like copper members are connected with each other, the spheroidal copper members are dispersed among the chain-like copper members, and the average diameter of the spheroidal copper members is larger than that of the chain-like copper members.
10. The ultra-thin vapor deposition plate assembly with bi-phase unidirectional flow of claim 9, wherein the metal porous wick structure is made by a printing process, a baking process, a cracking process and a sintering process of a slurry containing a polymer colloid, a plurality of metal copper particles and a plurality of copper oxide particles.
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