CN114568007B - Electromagnetic shielding device and related method - Google Patents

Abstract

The embodiment of the application discloses an electromagnetic shielding device and a related method, wherein the electromagnetic shielding device comprises a wire arc structure, a wire column structure and a metal shielding layer, wherein the wire arc structure and the wire column structure are both metal conductors, one end of the wire column structure is connected with an end point of the wire arc structure, and the other end of the wire column structure is connected with the metal shielding layer.

Description

Electromagnetic shielding device and related method

Technical Field

The embodiment of the application relates to the field of electromagnetic shielding, in particular to an electromagnetic shielding device and a related method.

Background

With the development of electronic devices, electronic components tend to be miniaturized and integrated. A large number of internal elements of consumer electronics such as mobile phones, watches and headphones are packaged and integrated by adopting (SYSTEM IN PACKAGE and SIP), so that the high-density layout of products is improved. The component units (such as radio frequency elements) in the SIP need to be subjected to a cavity-splitting electromagnetic shielding technology to solve the problem of mutual interference in the SIP module.

The electromagnetic shielding device adopting the metal wire process can play a certain high-frequency shielding role, has the advantages of low cost, high efficiency and the like, and is a conventional electromagnetic shielding device adopting the metal wire process, and the faraday building is formed around the part unit to realize the effect of cavity-dividing shielding, as shown in fig. 1.

However, the wire arc increases the device height, which is detrimental to high density integrated layout.

Disclosure of Invention

A first aspect of an embodiment of the present application provides an electromagnetic shielding device, including:

The wire pole structure is connected with an end point of the wire pole structure, and the other end of the wire pole structure is connected with the metal shielding layer.

The embodiment of the application provides an electromagnetic shielding device which can be applied to split-cavity electromagnetic shielding, does not need to increase the height of a device, and reduces the volume of electronic components.

According to a first implementation manner of the first aspect of the embodiment of the present application, the wire loop structure includes two or more groups of sub-wire loop structures, and end points of the sub-wire loop structures of each group are connected.

In the embodiment of the application, an implementation mode of a multi-sub-wire-arc structure forming a wire-arc structure is provided, and the electromagnetic shielding effect is improved.

According to a first aspect of the present application or a first implementation manner of the first aspect, in a second implementation manner of the first aspect, there is provided a packaging system, which includes an electromagnetic shielding structure, a substrate, and two or more component units, wherein end points of the wire-arc structure are connected to the substrate, and the component units are separated by the electromagnetic shielding structure.

In the embodiment of the application, a packaging system is provided, and the packaging system can package a component unit to realize the effect of cavity-dividing shielding.

According to a third implementation manner of the first aspect of the present application, the component unit is a chip.

The embodiment of the application can be used for chip packaging.

According to a second implementation manner of the first aspect of the embodiment of the present application or a third implementation manner of the first aspect of the embodiment of the present application, in a fourth implementation manner of the first aspect of the embodiment of the present application, the pillar structure is perpendicular to the substrate and perpendicular to a top layer of the metal shielding layer.

The embodiment of the application provides a deployment state of a wire column structure, and the feasibility of a scheme is improved.

According to any one of the second implementation manner to the fourth implementation manner of the first aspect of the present application, in a fifth implementation manner of the first aspect of the present application, the substrate may include a metal trace and a pad, and the pad includes a ground pad.

According to any one of the second implementation manner to the fifth implementation manner of the first aspect of the embodiment of the present application, in a sixth implementation manner of the first aspect of the embodiment of the present application, the wire arc structure and the wire post structure are connected to the shielding layer by a slot structure and/or a film-adding structure.

In the embodiment of the application, a plurality of connection modes are provided, and the flexibility of the scheme is improved.

According to any of the second to sixth embodiments of the first aspect of the present application, in a seventh embodiment of the first aspect of the present application, the electromagnetic shielding device comprises stainless steel, copper, nickel and/or aluminum.

A second aspect of an embodiment of the present application provides a packaging method, including:

And mounting part units on the substrate, wherein the number of the part units is two or more, and packaging an electromagnetic shielding device, wherein the electromagnetic shielding device is used for reducing electromagnetic interference among the part units, and is an electromagnetic shielding device shown in any embodiment of the first aspect of the application.

Drawings

FIG. 1 shows an electromagnetic shielding device according to an embodiment of the present application;

FIG. 2 is a schematic diagram illustrating an exemplary embodiment of an electromagnetic shielding device packaging system;

FIG. 3 is a schematic illustration of another electromagnetic shielding device according to an embodiment of the present application;

FIG. 4 is a schematic diagram of another embodiment of an electromagnetic shielding device packaging system;

FIG. 5 is a schematic illustration of another electromagnetic shielding device according to an embodiment of the present application;

FIG. 6 is a graph showing the relationship between the density of conductors and shielding effectiveness in an embodiment of the present application;

FIG. 7 illustrates another electromagnetic shielding device according to an embodiment of the present application;

FIG. 8 is a schematic illustration of another electromagnetic shielding device according to an embodiment of the present application;

FIG. 9 is a schematic illustration of another electromagnetic shielding device according to an embodiment of the present application;

FIG. 10 illustrates another electromagnetic shielding device according to an embodiment of the present application;

Fig. 11 shows another electromagnetic shielding device according to an embodiment of the application.

Detailed Description

The embodiment of the application provides an electromagnetic shielding device which can be applied to split-cavity electromagnetic shielding.

Referring to fig. 1, an embodiment of the present application provides an electromagnetic shielding device, including:

a wire arc structure, a wire column structure and a metal shielding layer.

Referring to fig. 2, a packaging system based on the electromagnetic shielding device shown in fig. 1 includes an electromagnetic shielding structure, a substrate, and two or more component units.

The encapsulation method is described below:

A substrate is prepared, wherein the substrate comprises at least one metal circuit layer, bonding pads, and at least one grounding bonding pad.

And attaching an electronic component to the surface of the substrate. Electronic components include various active passive devices, chips, stand-alone components or component packages.

A design signal isolation region between two or more components is implanted with a wire bonding process to a printed circuit board (printed circuit board, PCB) pad multipoint coupled to a first continuous wire loop. Wire bonding (wire bonding) is a process that uses thin metal wires to bond metal wires to substrate pads using heat, pressure, and ultrasonic energy. In this embodiment, copper wires are recommended, the diameter of the copper wires can be 30 micrometers um, the diameter of the bonding pads at the bottom of the copper wire column is 70um, the height of the wire arc is not higher than the height of the plastic package material of the whole system-in-package, the possible height range is not less than 0.1 millimeter mm, it can be understood that other metal wires such as aluminum, silver and the like can be adopted, the diameter of the metal wires is determined according to specific practical situations, and the embodiment of the application is not limited.

The wire bonding process is used for vertically stacking and implanting metal wire columns at the coupling points of the wire arc structures and the bonding pads, the copper wires are recommended to be coupled with the copper wire in the embodiment, the copper columns are coupled on the multipoint continuous wire arcs to form a stacked structure, the high-density layout and the wire density are increased, and the height of the copper columns is slightly lower than that of the plastic package, such as lower than 50-300um.

The structure is encapsulated with an insulating material. The insulating material encapsulates the electronic components and the copper pillar structure. The insulating layer material may be made of epoxy, acrylic, dielectric, thermoset, thermoplastic, rubber or other insulating material. An injection process is typically used to form the insulating layer within the molding tool.

Laser is used to etch trench or hole structures in the copper wire arc, post regions. In this embodiment, laser dicing may be used. Laser cutting is to irradiate a workpiece with a focused high power density laser beam to rapidly melt, vaporize, ablate or reach a fire point, while blowing away molten material with a high velocity gas stream coaxial with the beam to effect cutting of the workpiece. Based on the absorption sensitivity of different materials to laser energy with different wavelengths, selective slotting can be realized. In this embodiment, only the insulating material may be selectively removed, leaving the copper structure unremoved. The slot width may be 50um to 300um and the hole diameter may be 50um to 300um, with the slot or opening being sized to allow the upper surface portion of the copper wire stud to be exposed as a reference.

And a shielding layer is attached on the upper surface and the side wall of the whole system-in-package. And the electric conduction between the copper wire column and the shielding layer is realized. The process used in this embodiment may be physical sputter deposition. The main structure is a stainless steel layer and a copper layer with a single-layer or multi-layer structure. Other metal materials that may be deposited are selected from copper, nickel and aluminum. A metallic shielding layer will be realized. The shielding layer structure is also realized by adopting methods such as chemical vapor deposition metal, electroplating and the like.

The electromagnetic shielding device can be implanted with a wire-bonding wire-arc structure which is coupled with the PCB bonding pad in a multipoint manner in the cavity-dividing area, and the wire-bonding vertical stacking process is used for implanting the metal wire column at the coupling point of the wire-arc structure and the PCB bonding pad.

Referring to fig. 3, it will be appreciated that other processes may be used to implant the wire studs, such as, but not limited to, adding a film to the mold cavity to embed the wire loops in the film when encapsulating with an insulating material, and forming an outer drain at the ends of the wire studs after plastic encapsulation. Referring to fig. 4, a corresponding packaging system is shown.

It will be appreciated that the pillar structure may be perpendicular to the substrate (as shown in fig. 1 and 3), or at other angles, as shown in fig. 5. The embodiments of the present application will be described with reference to the vertical.

In the embodiment of the application, a multipoint coupling continuous wire arc structure is adopted, the number of wire arc grounding points is increased, the ground conductivity is improved, the distance between different wire arcs in a multi-wire arc process of a wire bonding process is eliminated through continuous coupling, the conductor density is improved, and the wire column is increased to also improve the wire arc density. FIG. 6 is a graph showing the relationship between conductor density and shielding effectiveness, where WB1-WB3 are increased in conductor density and shielding effectiveness is increased NoWB without conductor.

Referring to fig. 7, the wire loop structure may include a plurality of groups of sub-wire loop structures, in which a second continuous wire loop is vertically stacked and implanted at a coupling point of a first continuous wire loop and a ground pad by a wire bonding process, the second wire loop is higher than the first wire loop, in which a metal wire post is vertically stacked and implanted at a coupling point of a second continuous wire loop and a first continuous wire loop by a wire bonding process, and the plurality of groups of sub-wire loop structures are used to increase a conductor density, thereby increasing shielding effectiveness.

Referring to fig. 8 and 9, an embodiment of the present application provides an implementation manner in which adjacent wire loops are not connected, and in an embodiment of the present application, the multiple groups of sub-wire loops may not be completely symmetrical, and referring to fig. 10, a possible electromagnetic shielding structure is provided.

It will be appreciated that in some cases the post structure may be eliminated, with multiple sets of sub-wire arc structures, see fig. 11.

It will be clear to those skilled in the art that, for convenience and brevity of description, specific working procedures of the above-described systems, apparatuses and units may refer to corresponding procedures in the foregoing method embodiments, which are not repeated herein.

In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices, and methods may be implemented in other manners. For example, the apparatus embodiments described above are merely illustrative, e.g., the division of the units is merely a logical function division, and there may be additional divisions when actually implemented, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed with each other may be an indirect coupling or communication connection via some interfaces, devices or units, which may be in electrical, mechanical or other form.

The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.

The integrated units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application may be embodied essentially or in part or all of the technical solution or in part in the form of a software product stored in a storage medium, including instructions for causing a computer device (which may be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method according to the embodiments of the present application. The storage medium includes a usb disk, a removable hard disk, a read-only memory (ROM), a random-access memory (RAM, random access memory), a magnetic disk, an optical disk, or other various media capable of storing program codes.

Claims (10)

1. An electromagnetic shielding device, characterized in that the electromagnetic shielding device is used for a packaging system, the packaging system includes a plurality of pads, and the electromagnetic shielding device includes: Wire arc structure, wire column structure and metal shielding layer; The wire arc structure, the wire column structure and the metal shielding layer are all metal conductors; One end of the wire column structure is connected to an end point of the wire arc structure, the wire arc structure is a continuous wire arc structure, the continuous wire arc structure is multi-point coupled with the plurality of pads, and the other end of the wire column structure is connected to the metal shielding layer. 2. The electromagnetic shielding device according to claim 1 is characterized in that the line arc structure includes two or more groups of sub-line arc structures, and the endpoints of each group of sub-line arc structures are connected. 3. The electromagnetic shielding device according to claim 1 or 2, characterized in that the packaging system comprises: A base plate and two or more component units; The end points of the arc structure are connected to the substrate; The component units are separated by the electromagnetic shielding device. The electromagnetic shielding device according to claim 3 , characterized in that the component unit is a chip. 5 . The electromagnetic shielding device according to claim 3 , wherein the wire column structure is perpendicular to the substrate and perpendicular to the top layer of the metal shielding layer. 6 . The electromagnetic shielding device according to claim 3 , wherein the substrate comprises a metal trace and a pad, and the pad comprises a ground pad. 7. The electromagnetic shielding device according to claim 3, characterized in that the wire arc structure, the wire column structure and the shielding layer are connected through a slot structure and/or a film structure. 8. The electromagnetic shielding device according to claim 3, characterized in that the electromagnetic shielding device comprises stainless steel, copper, nickel and/or aluminum. 9. A packaging method, comprising: Mounting component units on a substrate, wherein the number of the component units is two or more, and the substrate includes a plurality of pads; Encapsulating an electromagnetic shielding device, the electromagnetic shielding device is used to reduce electromagnetic interference between the component units; The electromagnetic shielding device comprises a wire arc structure, a wire column structure and a metal shielding layer; The wire arc structure, the wire column structure and the metal shielding layer are all metal conductors; One end of the wire column structure is connected to an end point of the wire arc structure, the wire arc structure is a continuous wire arc structure, the continuous wire arc structure is multi-point coupled with the plurality of pads, and the other end of the wire column structure is connected to the metal shielding layer. 10. The method according to claim 9, characterized in that the component unit is a chip.