CN114486181B - Test piece of semiconductor detection equipment and debugging method of semiconductor detection equipment - Google Patents
Test piece of semiconductor detection equipment and debugging method of semiconductor detection equipment Download PDFInfo
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- CN114486181B CN114486181B CN202011273220.3A CN202011273220A CN114486181B CN 114486181 B CN114486181 B CN 114486181B CN 202011273220 A CN202011273220 A CN 202011273220A CN 114486181 B CN114486181 B CN 114486181B
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- 238000001514 detection method Methods 0.000 title claims abstract description 189
- 238000012360 testing method Methods 0.000 title claims abstract description 96
- 239000004065 semiconductor Substances 0.000 title claims abstract description 85
- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000003384 imaging method Methods 0.000 claims abstract description 108
- 238000007689 inspection Methods 0.000 claims description 38
- 230000000007 visual effect Effects 0.000 claims description 2
- 230000001360 synchronised effect Effects 0.000 claims 1
- 239000000463 material Substances 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 235000012431 wafers Nutrition 0.000 description 4
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- 230000007547 defect Effects 0.000 description 2
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- 238000005516 engineering process Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
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- 239000012788 optical film Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01M—TESTING STATIC OR DYNAMIC BALANCE OF MACHINES OR STRUCTURES; TESTING OF STRUCTURES OR APPARATUS, NOT OTHERWISE PROVIDED FOR
- G01M11/00—Testing of optical apparatus; Testing structures by optical methods not otherwise provided for
- G01M11/02—Testing optical properties
- G01M11/0242—Testing optical properties by measuring geometrical properties or aberrations
- G01M11/0257—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested
- G01M11/0264—Testing optical properties by measuring geometrical properties or aberrations by analyzing the image formed by the object to be tested by using targets or reference patterns
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Abstract
The application provides a debugging piece and a debugging method for debugging semiconductor detection equipment by using the same. The debugging piece comprises a detection surface and a detection pattern arranged on the detection surface. The detection pattern comprises concentric rings centered on the center of the detection surface, a diameter line passing through the center of the detection surface, and a calibration pattern. The concentric rings are used for detecting whether the test piece is positioned at the rotation center of the bearing device of the semiconductor detection equipment. The diameter line is used for detecting whether the center of the detection surface is on the center line of the field of view range of the debugging piece and the extension line of the center line. The diametric line intersects the concentric rings to form a spacing region. The calibration pattern is positioned in the interval area and is used for detecting whether the line frequency of the imaging device of the semiconductor detection equipment corresponds to the rotation speed of the bearing device. The test piece and the debugging method can utilize the detection pattern to debug the semiconductor detection equipment, so that the restored image obtained when the semiconductor detection equipment detects the piece to be detected is not distorted.
Description
Technical Field
The present disclosure relates to testing technologies, and in particular, to a debugging piece for a semiconductor testing device and a method for debugging the semiconductor testing device by using the debugging piece.
Background
Some semiconductor inspection devices can be used to capture a rotating part to be inspected to obtain a scan image generated in real time and a restored image obtained after processing. However, when the imaging device of the semiconductor inspection apparatus photographs that the center line of the field of view range of the piece to be inspected is not coincident with the rotation center of the piece to be inspected, the photographed restored image of the piece to be inspected may be distorted. And the time consumption for debugging the semiconductor detection equipment according to the distorted restored image is long, the efficiency is low, and the debugging is inconvenient.
Disclosure of Invention
The embodiment of the application provides a debugging piece of semiconductor detection equipment and a debugging method for debugging the semiconductor detection equipment by using the debugging piece.
The debugging piece of the embodiment of the application comprises a detection surface and a detection pattern arranged on the detection surface. The detection pattern includes concentric rings centered about a center of the detection face, a diameter line passing through the center of the detection face, and a calibration pattern. The diameter line is used for detecting whether the center of the detection surface is on the center line and the extension line of the field of view range of the test piece, which are shot by the imaging device of the semiconductor detection equipment. The diameter line intersects the concentric rings to form a spacing region. The calibration pattern is located in the interval area, and is used for detecting whether the line frequency of the imaging device of the semiconductor detection equipment corresponds to the rotation speed of the bearing device of the semiconductor detection equipment.
In certain embodiments, the concentric ring comprises a plurality of concentric rings. The distance between two adjacent concentric rings is 0.1 times the length of the field of view range.
In certain embodiments, the concentric ring comprises a plurality of concentric rings. The line width of the concentric rings is 2 times the length/width of the picture elements of the imaging device.
In certain embodiments, the diameter line comprises a plurality of diameter lines. The value range of the included angle between two adjacent diameter lines is [1 DEG, 180 DEG ].
In certain embodiments, the diameter line comprises a plurality of diameter lines. The line width of the diameter line is 2 times the length/width of the picture element of the imaging device.
In some embodiments, the concentric rings include a plurality of concentric rings, a plurality of spacing areas are formed in the radial direction and the circumferential direction after the concentric rings are intersected with a plurality of diameter lines, at least part of the spacing areas are provided with the calibration patterns, the centers of the calibration patterns between two adjacent diameter lines are collinear in the radial direction, and the collinear calibration patterns have the same size.
In some embodiments, the calibration patterns in the circumferentially adjacent spaced areas are located on the same virtual circumference centered on the center of the detection surface.
In some embodiments, each of the spaced areas is provided with a plurality of calibration patterns, each of the calibration patterns being located on a different one of the virtual circumferences.
In certain embodiments, the calibration patterns equidistant from the center of the detection surface within the circumferentially adjacent spaced regions have at least two dimensions.
In certain embodiments, the calibration pattern comprises any one of a circle, a polygon, an ellipse, and a racetrack.
In certain embodiments, the calibration pattern comprises a circle having a diameter in the range of [0.5,30] times the length/width of the picture elements.
The application also provides a debugging method for debugging the semiconductor detection equipment by using the debugging piece, the detection equipment comprises a bearing device and an imaging device, the bearing device can rotate to drive the debugging piece to synchronously rotate, the imaging device can shoot the debugging piece, and the debugging method comprises the following steps: placing a test piece on the bearing device, wherein the test piece comprises a detection surface and a detection pattern arranged on the detection surface, the detection pattern comprises concentric rings taking the center of the detection surface as the center, a diameter line passing through the center of the detection surface, and a calibration pattern, and the calibration pattern is positioned in a spacing area formed by intersecting the diameter line and the concentric rings; rotating the bearing device to drive the debugging piece to synchronously rotate; shooting the debugging piece to obtain a detection image; and debugging the detection equipment according to the detection image.
In some embodiments, said debugging said detection device from said detection image comprises: detecting whether the debugging piece is positioned at the rotation center of the bearing device according to the part, corresponding to the concentric ring, of the detection image; and when the test piece is not positioned at the rotation center of the bearing device, adjusting the position of the test piece until the part corresponding to the concentric ring in the detection image is a vertical straight line.
In some embodiments, said debugging said detection device from said detection image comprises: detecting whether the center of the detection surface is on the center line and the extension line of the field of view range of the test piece shot by the imaging device according to the part corresponding to the diameter line in the detection image; and when the center of the detection surface is not on the central line and the extension line of the visual field range of the test piece shot by the imaging device, adjusting the position of at least one of the bearing device and the imaging device until the part corresponding to the diameter line in the detection image is a horizontal straight line.
In some embodiments, said debugging said detection device from said detection image comprises: detecting whether the line frequency of the imaging device corresponds to the rotation speed of the bearing device according to the part, corresponding to the calibration graph, of the detection image; and when the line frequency of the imaging device does not correspond to the rotation speed of the bearing device, adjusting the rotation speed of the bearing device and/or the line frequency of the bearing device until the deformation of the part, corresponding to the calibration pattern, in the detection image is within a preset range compared with the deformation of the calibration pattern.
According to the test piece and the debugging method, the semiconductor detection equipment can be debugged by using the detection pattern rapidly, so that the restored image obtained when the semiconductor detection equipment shoots the piece to be detected is not distorted.
Additional aspects and advantages of embodiments of the application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the application.
Drawings
The foregoing and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings, in which:
FIG. 1 is a schematic plan view of a test piece according to certain embodiments of the present application;
FIG. 2 is a schematic perspective view of a semiconductor inspection apparatus according to certain embodiments of the present application;
FIG. 3 is a schematic plan view of a semiconductor inspection apparatus according to certain embodiments of the present application;
FIG. 4 is a flow chart of a method of debugging a semiconductor inspection device using a test piece in accordance with certain embodiments of the present application;
FIG. 5 is a flow chart of a method of debugging a semiconductor inspection device using a test piece in accordance with certain embodiments of the present application;
FIG. 6 is a flow chart of a method of debugging a semiconductor inspection device using a test piece in accordance with certain embodiments of the present application;
Fig. 7 is a flow chart of a method of debugging a semiconductor inspection device using a test piece in accordance with certain embodiments of the present application.
Detailed Description
Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it should be understood that the terms "thickness," "upper," "top," "bottom," "inner," "outer," and the like indicate an orientation or a positional relationship based on that shown in the drawings, and are merely for convenience of description and to simplify the description, rather than to indicate or imply that the devices or elements being referred to must have a particular orientation, be configured and operated in a particular orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements.
The following disclosure provides many different embodiments or examples for implementing different structures of the present application. In order to simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are merely examples and are not intended to limit the present application. Furthermore, the present application may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not in themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present application provides examples of various specific processes and materials, but one of ordinary skill in the art may recognize the application of other processes and/or the use of other materials.
Referring to fig. 1 to 3, the present application provides a debugging piece 100 of a semiconductor inspection apparatus 1000. The test piece 100 includes a test surface 10 and a test pattern 30 provided on the test surface 10. The detection pattern 30 comprises concentric rings 31 centered about the center 11 of the detection face 10, a diameter line 33 passing through the center 11 of the detection face 10, and a calibration pattern 35. The concentric ring 31 is used to detect whether the test piece 100 is located at the rotation center 210 of the carrier 200 of the semiconductor test apparatus 1000. The diameter line 33 is used to detect whether the center 11 of the inspection surface 10 is on the center line 340 of the field of view range 330 of the debugging member 100 and its extension line, which is photographed by the imaging device 300 of the semiconductor inspection apparatus 1000. The diametric line 33 intersects the concentric ring 31 to form a spacing region 50. The calibration pattern 35 is located in the interval region 50, and the calibration pattern 35 is used to detect whether the line frequency of the imaging device 300 of the semiconductor inspection apparatus 1000 corresponds to the rotation speed of the carrier device 200 of the semiconductor inspection apparatus 1000.
The semiconductor inspection apparatus 1000 may be used to inspect various types of semiconductor wafers, such as for detecting surface defects of the wafer, for detecting optical film thickness, and the like. The semiconductor inspection apparatus 1000 may be capable of capturing an object to be inspected, and in particular, the semiconductor inspection apparatus 1000 may include a carrying device 200 and an imaging device 300, the object to be inspected may be carried on the carrying device 200 and rotate together with the carrying device 200, and the imaging device 300 may be capable of capturing the rotating object to be inspected to obtain a scan image generated in real time and a restored image obtained after processing.
At least part of the field of view of the imaging device 300 is capable of capturing the object to be inspected while capturing the object to be inspected. The captured scanned image and the restored image of the object to be detected can represent the surface condition of the object to be detected, for example, whether the surface of the object to be detected has defects, pollutants and the like. If the center of the part to be detected is not on the center line 340 and the extension line of the field of view range 330 of the debugging part 100, which are shot by the imaging device 300, the obtained restored image may be distorted, for example, in the obtained restored image, obvious distortion occurs at the center of the part to be detected, thereby affecting the judgment of the surface condition of the part to be detected.
Referring to fig. 3, in one embodiment, the fields of view of the imaging device 300 can each capture the debugging member 100, and the field of view range 330 of the imaging device 300 captured the debugging member 100 is the field of view of the imaging device 300. In another embodiment, only a portion of the field of view of the imaging device 300 is able to capture the fitting 100, and then the portion of the field of view that is able to capture the fitting 100 is the field of view range 330 of the device capturing the fitting 100. In the semiconductor inspection apparatus 1000, the field of view range 330 of the debug 100 photographed by the imaging device 300 may be rectangular so as to perform line scanning of the debug 100 when photographing the rotating debug 100, thereby acquiring a scanned image.
In the embodiment of the present application, the semiconductor inspection apparatus 1000 may be debugged by using the debugging member 100 of one type of the semiconductor inspection apparatus 1000. The material and the size of the test piece 100 are the same as those of the to-be-detected piece. For example, when the part to be inspected is a 12-inch wafer, the debugging part 100 is also a 12-inch wafer. Specifically, the test piece 100 may be placed on the carrying device 200 of the semiconductor test apparatus 1000 instead of the to-be-tested piece, so that the carrying device 200 drives the test piece 100 to rotate synchronously, and the imaging device 300 of the semiconductor test apparatus 1000 is used to capture a real-time scan image obtained by the test surface 10 of the test piece 100, and then confirm whether the semiconductor test apparatus 1000 needs to be debugged according to the shape of the portion corresponding to the test pattern 30 in the real-time scan image, and how to debug the semiconductor test apparatus 1000, so that the semiconductor test apparatus 1000 is debugged before the to-be-tested piece is tested by using the semiconductor test apparatus 1000.
The detecting surface 10 may be provided with a diameter line 33 passing through the center 11 of the detecting surface 10, and according to the shape of the portion corresponding to the diameter line 33 in the real-time scanned image, it may be determined whether the center 11 of the detecting surface 10 is on the center line 340 and the extension line of the field of view range 330 of the debugging member 100 captured by the imaging device 300, and when the center 11 of the detecting surface 10 is not on the center line 340 and the extension line of the field of view range 330 of the debugging member 100 captured by the imaging device 300, the position of at least one of the carrying device 200 and the imaging device 300 is adjusted until it may be determined that the center 11 of the detecting surface 10 is on the center line 340 and the extension line of the field of view range 330 of the debugging member 100 captured by the imaging device 300 according to the shape of the portion corresponding to the diameter line 33 in the real-time scanned image, so as to ensure that the reduced image captured by the to be obtained by the detecting member is not distorted when the detecting the member is detected by the semiconductor detecting device 1000. In one embodiment, the real-time scanned image is a polar coordinate system image. When the center 11 of the detection surface 10 is on the center line 340 of the field of view range 330 of the debugging member 100 and the extension line thereof, which is photographed by the imaging device 300, the diameter line 33 is a straight line which is vertical in the polar coordinate system image. That is, when the diameter line 33 is not a straight line which is vertical in the polar coordinate system image, for example, is a diagonal line or a curved line, it is indicated that the center 11 of the inspection surface 10 is not on the center line 340 of the field of view range 330 of the debugging member 100 and the extension line thereof, which are photographed by the imaging device 300, and the semiconductor inspection apparatus 1000 needs to be debugged.
The detection surface 10 may further be provided with a concentric ring 31 centered on the center 11 of the detection surface 10, and it can be confirmed whether the test piece 100 is located at the rotation center 210 of the carrier 200 according to the shape of the portion corresponding to the concentric ring 31 in the real-time scanning image. When the debugging piece 100 is not located at the rotation center 210 of the carrying device 200, the position of the debugging piece 100 is adjusted until the position of the debugging piece 100 at the rotation center 210 of the carrying device 200 can be confirmed according to the shape of the part corresponding to the concentric ring 31 in the real-time scanning image, so as to ensure that the debugging of the semiconductor detection device 1000 by using the debugging piece 100 is accurate. For example, when the test piece 100 is located at the rotation center 210 of the carrier 200, the debugging of the semiconductor detecting device 1000 by using the test piece 100 is completed, and it is ensured that the restored image obtained by photographing the test piece 100 by the imaging device 300 is not distorted, so that when the subsequent semiconductor detecting device 1000 detects the to-be-detected piece located at the rotation center 210 of the carrier 200, the restored image obtained by photographing the to-be-detected piece by using the imaging device 300 is likewise not distorted. In one embodiment, the real-time scanned image is a polar coordinate system image. When the test piece 100 is located at the rotation center 210 of the carrier 200, the concentric ring 31 is a horizontal straight line in the polar coordinate system image. That is, when the concentric ring 31 is not a horizontal straight line in the polar coordinate system image, for example, is a diagonal line or a curved line, it is indicated that the debugging member 100 is not located at the rotation center 210 of the carrying device 200, and the semiconductor inspection apparatus 1000 needs to be debugged.
The detecting surface 10 may further be provided with a calibration pattern 35, and it may be determined whether the line frequency of the imaging device 300 corresponds to the rotation speed of the carrying device 200 according to the shape of the portion corresponding to the calibration pattern 35 in the real-time scan image, so as to adjust the rotation speed of the carrying device 200 or the line frequency of the imaging device 300 when the line frequency of the imaging device 300 does not correspond to the rotation speed of the carrying device 200, until it may be determined that the line frequency of the imaging device 300 corresponds to the rotation speed of the carrying device 200 according to the shape of the portion corresponding to the calibration pattern 35 in the real-time scan image, so as to ensure that the deformation of the surface image of the rotating workpiece to be detected, which is captured by the semiconductor detecting device 1000 when detecting the workpiece to be detected, is within the allowable deformation range relative to the original image. In one embodiment, when the line frequency of the imaging device 300 corresponds to the rotation speed of the carrier device 200, the shape of the portion corresponding to the calibration pattern 35 in the real-time scanned image is within the allowable deformation range compared to the deformation of the calibration pattern 35.
The debugging piece 100 of the semiconductor detection device 1000 provided by the application comprises a detection surface 10 and a detection pattern 30 arranged on the detection surface 10, wherein the detection pattern 30 comprises concentric rings 31 taking the center 11 of the detection surface 10 as the center, a diameter line 33 passing through the center 11 of the detection surface 10, and a calibration pattern 35. By photographing the test image obtained by the test piece 100, it is possible to determine whether the test piece 100 is located at the rotation center 210 of the carrier 200, whether the center 11 of the test surface 10 is located on the center line 340 and the extension line of the field of view range 330 of the test piece 100 photographed by the imaging device 300, and whether the line frequency of the imaging device 300 corresponds to the rotation speed of the carrier 200, so that the semiconductor test apparatus 1000 is quickly debugged according to the test image, and the reduced image obtained when the semiconductor test apparatus 1000 photographs the test piece to be tested is not distorted.
The detection image may be a scanned image or a restored image. When the detected image is a scanned image, since the scanned image is generated in real time, it is faster to debug the semiconductor detecting device 1000 according to the scanned image obtained by photographing the test piece 100, and the debug result can be fed back on the scanned image in real time, so that the debug efficiency can be improved. When the detected image is a restored image, the amount of information contained in the restored image is large, and the method can be applied to debugging with high fine-grained requirement.
Further description is provided below with reference to the accompanying drawings.
Referring to fig. 1 to 3, in some embodiments, the concentric rings 31 include a plurality of patterns corresponding to the concentric rings 31 in the detected image obtained by photographing the test piece 100, so as to eliminate errors caused by non-standard patterns of the concentric rings 31. For example, among the patterns corresponding to the concentric rings 31, one pattern indicates that the test piece 100 is located at the rotation center 210 of the carrier 200, and the other patterns indicate that the test piece 100 is not located at the rotation center 210 of the carrier 200, and then a large probability that one pattern of the test piece 100 is located at the rotation center 210 of the carrier 200 is an error result, it may be necessary to check whether the concentric ring 31 pattern corresponding to the error pattern is standard, such as whether the corresponding concentric ring 31 is eccentric, whether it stretches or compresses compared with the standard concentric ring 31, and so on.
In one embodiment, the distance between two adjacent concentric rings 31 is [3mm,8mm ], e.g., the distance between two adjacent concentric rings 31 is 3.0mm, 3.5mm, 3.7mm, 4.0mm, 4.2mm, 5.0mm, 5.8mm, 6.0mm, 6.6mm, 7.0mm, 7.4mm, 8.0mm, etc., which are not specifically recited herein. If the distance between the two adjacent concentric rings 31 is less than 3.0mm, the distance between the two adjacent concentric rings 31 may be too short to facilitate observation, resulting in increased time for the user to observe the image, because the distance between the two adjacent concentric rings 31 is too short to capture the detection image obtained by the concentric rings 31. If the distance between two adjacent concentric rings 31 is greater than 8mm, the number of concentric rings 31 that can be disposed on the same detection surface 10 is smaller, which is not beneficial to checking errors caused by the nonstandard patterns of the concentric rings 31. For example, in the patterns corresponding to two adjacent concentric rings 31 in the detection pattern, the pattern corresponding to one concentric ring 31 is a vertical straight line, and the pattern corresponding to the other concentric ring 31 is an oblique line inclined relative to the vertical straight line. If the distance between two adjacent concentric rings 31 is appropriate, the user can easily recognize the oblique line with reference to the straight line. However, when the distance between the adjacent two concentric rings 31 is long, it is difficult for the user to recognize the oblique line with reference to the straight line, making it difficult to check for accidental errors.
In another embodiment, the distance between two adjacent concentric rings 31 is 0.1 times the length of the field of view range 330, so that the number of concentric rings 31 that can be photographed in the field of view range 330 is suitable, and it is not difficult for the user to observe because of too many concentric rings 31 and too dense arrangement, or the number of concentric rings 31 is too small, and the arrangement is too sparse to solve the error caused by the nonstandard pattern of the concentric rings 31. The field of view range 330 refers to the field of view range 330 in which the imaging device 300 photographs the debugging 100. For example, referring to fig. 2 and 3, the semiconductor inspection apparatus 1000 may include two imaging devices 300 with the same specification parameters, and the two imaging devices 300 can capture the first and second field ranges 3301 and 3302 of the field of view range 330 of the inspection surface 10 of the debug 100. The first and second field of view ranges 3301, 3302 are the same size, and are rectangular, with the long sides of the rectangle being the lengths of the first and second field of view ranges 3301, 3302. If the length of the first field of view range 3301 and the second field of view range 3302 is 50mm, the distance between adjacent two concentric rings 31 may be set to 5mm.
In some embodiments, the linewidth of the concentric ring 31 is 2 times the length/width of the picture elements of the imaging device 300 to enable the imaging device 300 to capture the concentric ring 31 clearly. Typically, the picture elements of imaging device 300 are rectangular picture elements, and when the length and width of the picture elements are identical, the line width of concentric rings 31 may be 2 times the length of the picture elements or 2 times the width of the picture elements. When the lengths and widths of the picture elements are not identical, the line width of the concentric rings 31 may likewise be 2 times the length of the picture elements or 2 times the width of the picture elements. For example, the length of the pixel is 4 microns and the width is 6 microns, and the line width of the concentric ring 31 may be 8 microns or 12 microns, which is not limited herein.
Referring to fig. 1-3, in some embodiments, the diameter line 33 includes a plurality of diameter lines 33. The more the number of the diameter lines 33 provided on the debug piece 100, the shorter the interval time between the imaging device 300 photographing the diameter lines 33 twice, that is, the more the number of the diameter lines 33 provided on the debug piece 100 is when the semiconductor inspection apparatus 1000 is debugged according to the scan image of the diameter lines 33, the more the pattern corresponding to the diameter lines 33 in the scan image in the same time is, and the faster the user can feed back in the newly produced scan image when debugging the semiconductor inspection apparatus 1000, so as to improve the debugging efficiency.
In some embodiments, the included angle between two adjacent diametric lines 33 ranges from [1 °,180 ° ]. For example, the included angle between the two diameter lines 33 may be 1 °, 7 °, 12 °, 23 °, 35 °, 45 °, 57 °, 60 °, 73 °, 88 °, 90 °, 101 °, 114 °, 120 °, 135 °, 146 °, 150 °, 168 °, 179 °,180 °, etc., which are not illustrated herein. For example, when the angle between the two diameter lines 33 is 10 °, the fitting 100 is provided with 18 diameter lines 33 in total. For another example, when the angle between the two diameter lines 33 is 1 °, the fitting 100 is provided with 180 diameter lines 33 in total. For another example, when the angle between the two diameter lines 33 is 180 °, the debugging member 100 is provided with 2 diameter lines 33,2 in total, and the diameter lines 33 overlap. For the semiconductor inspection apparatus 1000 with higher accuracy, the angle between two adjacent diameter lines 33 may be smaller to set a larger number of diameter lines 33, improving the debugging efficiency. For the semiconductor inspection apparatus 1000 with lower precision, the angle between two adjacent diameter lines 33 may be larger to avoid too dense of the photographed diameter lines 33 to be observed.
In some embodiments, the line width of the diameter line 33 is 2 times the length/width of the picture element of the imaging device 300, so that the imaging device 300 can photograph the diameter line 33 clearly. Typically, the picture elements of imaging device 300 are rectangular picture elements, and when the length and width of the picture elements are identical, the line width of diametrical line 33 may be 2 times the length of the picture elements or 2 times the width of the picture elements. When the length and width of the picture elements are not uniform, the line width of the diameter line 33 may be 2 times the length of the picture elements or 2 times the width of the picture elements as well. For example, the length of the pixel is 4 micrometers and the width is 6 micrometers, and the line width of the diameter line 33 may be 8 micrometers or 12 micrometers, which is not limited herein.
In certain embodiments, the plurality of concentric rings 31 form a plurality of spaced apart regions 50 both radially and circumferentially after intersecting the plurality of diametrical lines 33. At least part of the spacing region 50 is provided with a calibration pattern 35. Wherein the centers of the calibration patterns 35 between two adjacent diameter lines 33 are radially collinear, and the collinear calibration patterns 35 have the same size. Providing at least part of the spacing area 50 with the calibration pattern 35 means that in some embodiments there are spacing areas 50 that are not provided with the calibration pattern 35.
Because the center 11 of the detection surface 10 is on the center line 340 and the extension line thereof of the field of view range 330 of the debugging member 100 photographed by the imaging device 300, the centers of the calibration patterns 35 between the two adjacent diameter lines 33 are collinear in the radial direction, so that when the calibration patterns 35 are photographed by the imaging device 300, the calibration patterns 35 can be aligned along the direction of the center line 340 of the field of view range 330 photographed by the device, so that a user can observe the pattern corresponding to the calibration patterns 35 on the detection image. The sizes of the collinear calibration patterns 35 are the same, so that whether the corresponding patterns of the collinear calibration patterns 35 are deformed on the detection image can be conveniently compared.
In some embodiments, the calibration patterns 35 within circumferentially adjacent spaced areas 50 are located on the same virtual circumference centered about the center 11 of the detection surface 10. In this way, the corresponding patterns of the circumferential calibration patterns 35 on the detection image can be aligned, so that the user can observe conveniently. For example, when the detection image is a scanning image, the corresponding pattern of the calibration pattern 35 in the circumferential direction on the scanning image is aligned in the vertical direction. For another example, when the detection image is a restored image, the corresponding patterns of the calibration patterns 35 in the circumferential direction on the restored image are aligned on the same virtual circumference.
In some embodiments, each spacer region 50 is provided with a plurality of calibration patterns 35, each calibration pattern 35 being located on a different virtual circumference. For example, each spacer region 50 is provided with two calibration patterns 35, in one spacer region 50, one calibration pattern 35 being located on the virtual circumference of the first diameter, and the other calibration pattern 35 being located on the virtual circumference of the second diameter, there may be present in the other spacer region 50 adjacent to this spacer region 50: one calibration pattern 35 located on the virtual circumference of the first diameter and the other calibration pattern 35 located on the virtual circumference of the second diameter; or one calibration pattern 35 located on a virtual circumference of a first diameter and another calibration pattern 35 located on a virtual circumference other than the first diameter or the second diameter; or one calibration pattern 35 located on a virtual circumference other than the first diameter or the second diameter and another calibration pattern 35 located on a virtual circumference of the second diameter; or two non-co-circumferential calibration patterns 35 located on a virtual circumference other than the first diameter or the second diameter.
In some embodiments, the calibration patterns 35 within circumferentially adjacent spaced areas 50 equidistant from the center 11 of the detection surface 10 have at least two dimensions for detecting the actual resolution of the imaging device 300. For example, a first calibration pattern 35 and a second calibration pattern 35 equidistant from the center 11 of the detection surface 10 are disposed in two adjacent interval regions 50 in the circumferential direction, the size of the first calibration pattern 35 is larger than that of the second calibration pattern 35, and if the first calibration pattern 35 shot by the imaging device 300 is clear and the second calibration pattern 35 is blurred, the pixel corresponding to the actual resolution of the imaging device 300 does not exceed the size of the second calibration pattern 35 at most. The more size types the calibration patterns 35 have on the same test piece 100, the finer the actual resolution of the imaging device 300 that can be detected.
In certain embodiments, the calibration pattern 35 includes any one of a circle, a polygon, an ellipse, and a racetrack, without limitation.
In one embodiment, the calibration pattern 35 is circular, so that deformation of the pattern corresponding to the calibration pattern 35 compared with the circular shape on the detection image can be observed intuitively, and the semiconductor detection apparatus 1000 can be correspondingly adjusted according to the direction of the deformation, so that the line frequency of the imaging device 300 of the semiconductor detection apparatus 1000 corresponds to the rotation speed of the carrying device 200 of the semiconductor detection apparatus 1000. The length/width of the pixels of the imaging device 300 having a diameter in the range of [0.5,30] times, for example, the diameter of the circle may be 0.5 times, 1.7 times, 3.9 times, 5.8 times, 8.2 times, 10 times, 12.2 times, 15 times, 17.5 times, 20 times, 23.5 times, 26.6 times, 28.2 times, 30 times, the length/width of the pixels of the imaging device 300, which are not specifically exemplified herein. If the diameter of the circle is smaller than 0.5 times the length/width of the pixels of the imaging device 300, the pattern corresponding to the calibration pattern 35 that may be photographed is not clear; if the diameter of the circle is greater than 30 times the length/width of the pixels of the imaging device 300, the number of calibration patterns 35 that can be set in the same radial direction or the same circumferential direction is smaller, which is disadvantageous for the user to compare the corresponding patterns of the calibration patterns 35 in the same radial direction or the same circumferential direction in the detected image.
Referring to fig. 4, and referring to fig. 1 to 3, the present application provides a debugging method for debugging a semiconductor testing device 1000 by using a test piece 100, the testing device includes a carrying device 200 and an imaging device 300, the carrying device 200 can rotate to drive the test piece 100 to synchronously rotate, the imaging device 300 can shoot the test piece 100, and the debugging method includes:
01: placing a test piece 100 on a carrying device 200, wherein the test piece 100 comprises a detection surface 10 and a detection pattern 30 arranged on the detection surface 10, the detection pattern 30 comprises a concentric ring 31 taking the center 11 of the detection surface 10 as the center, a diameter line 33 passing through the center 11 of the detection surface 10, and a calibration pattern 35, and the calibration pattern 35 is positioned in a spacing area 50 formed by intersecting the diameter line 33 and the concentric ring 31;
02: rotating the bearing device 200 to drive the test piece 100 to synchronously rotate;
03: shooting the test piece 100 to obtain a detection image; and
04: the detection device is commissioned according to the detected image.
In one embodiment, the user may directly observe at least one pattern of the pattern corresponding to the concentric ring 31, the pattern corresponding to the diameter line 33, and the pattern corresponding to the calibration pattern 35 on the inspection image to determine whether the semiconductor inspection apparatus 1000 needs to be debugged, and can debug the semiconductor inspection apparatus 1000 according to the inspection image when the semiconductor inspection apparatus 1000 needs to be debugged.
In another embodiment, the detected image may be input into a comparing apparatus, and at least one of the pattern corresponding to the concentric ring 31, the pattern corresponding to the diameter line 33, and the pattern corresponding to the calibration pattern 35 on the detected image is respectively compared with the sample pattern corresponding to the concentric ring 31, the sample pattern corresponding to the diameter line 33, and the sample pattern corresponding to the calibration pattern 35, so as to determine whether the semiconductor detecting apparatus 1000 needs to be debugged according to the comparison result, and to debug the semiconductor detecting apparatus 1000 according to the detected image when the semiconductor detecting apparatus 1000 needs to be debugged.
Referring to fig. 5 in conjunction with fig. 1-3, in some embodiments, 04: debugging the detection device according to the detected image, comprising:
041: detecting whether the test piece 100 is positioned at the rotation center 210 of the carrying device 200 according to the part corresponding to the concentric ring 31 in the detection image; and
042: when the debugging member 100 is not located at the rotation center 210 of the carrying device 200, the position of the debugging member 100 is adjusted until the portion corresponding to the concentric ring 31 in the detected image is a vertical straight line.
The detection image is a scan image of the detection surface 10 generated in real time and represented on a polar coordinate, so that the detection image can be quickly acquired, and feedback of the debug situation can be quickly acquired from the detection image generated in real time after the semiconductor detection device 1000 is debugged.
Whether the test piece 100 is located at the rotation center 210 of the carrier 200 can be detected by observing whether the portion of the detection image corresponding to the concentric ring 31 is a straight line that is vertical. When the test piece 100 is positioned at the rotation center 210 of the carrier 200, the portion of the test image corresponding to the concentric ring 31 is a straight line. When the test piece 100 is not located at the rotation center 210 of the carrier 200, the portion of the detected image corresponding to the concentric ring 31 is not a vertical straight line, such as a diagonal line or a curved line.
When the debugging member 100 is not located at the rotation center 210 of the carrier 200, the position of the debugging member 100 may be adjusted, and the real-time generated detection image is observed until the portion corresponding to the concentric ring 31 in the detection image is a vertical straight line, which means that the debugging member 100 is adjusted to be located at the rotation center 210 of the carrier 200. After the test piece 100 is accurately placed at the rotation center 210 of the bearing device 200, the relative position of the test piece 100 and the bearing device 200 can be fixed, so that the subsequent debugging result is based on the debugging result of the test piece 100 at the rotation center 210 of the bearing device 200, and the debugging result of the test piece 100 for debugging the semiconductor detection device 1000 can be ensured to be suitable for the detection of the subsequent test piece as long as the test piece to be detected is ensured to be located at the rotation center 210 of the bearing device 200.
Referring to fig. 6, in conjunction with fig. 1-3, in some embodiments, 04: debugging the detection device according to the detected image, comprising:
043: detecting whether the center 11 of the detection surface 10 is on the center line 340 and the extension line of the field of view range 330 of the debugging 100 photographed by the imaging device 300 according to the portion corresponding to the diameter line 33 in the detection image;
044: when the center 11 of the detection surface 10 is not on the center line 340 of the field of view range 330 of the debugging member 100 and the extension line thereof, the position of at least one of the carrying device 200 and the imaging device 300 is adjusted until the portion corresponding to the diameter line 33 in the detection image is a horizontal straight line.
The detection image is a scan image of the detection surface 10 generated in real time and represented on a polar coordinate, so that the detection image can be quickly acquired, and feedback of the debug situation can be quickly acquired from the detection image generated in real time after the semiconductor detection device 1000 is debugged.
By observing whether or not the portion of the detection image corresponding to the diameter line 33 is a horizontal straight line, it is possible to detect whether or not the center 11 of the detection surface 10 is on the center line 340 of the field of view range 330 of the debugging 100 and the extension line thereof captured by the imaging device 300. When the center 11 of the detection surface 10 is on the center line 340 of the field of view range 330 of the debugging 100 and the extension line thereof, which is photographed by the imaging device 300, a straight line of which the portion corresponding to the diameter line 33 in the detected image is horizontal. When the center 11 of the detection surface 10 is not on the center line 340 of the field of view range 330 of the debugging member 100 and the extension line thereof, the portion of the detection image corresponding to the diameter line 33 is not a horizontal straight line, such as a slant line or a curve.
When the center 11 of the detection surface 10 is not on the center line 340 and the extension line of the field of view range 330 of the debugging member 100 captured by the imaging device 300, the position of at least one of the carrier 200 and the imaging device 300 can be adjusted, and the detection image generated in real time can be observed until the portion corresponding to the diameter line 33 in the detection image is a horizontal straight line, that is, the center 11 of the detection surface 10 is adjusted to the center line 340 and the extension line of the field of view range 330 of the debugging member 100 captured by the imaging device 300.
In one embodiment, the position of the carrying device 200 may be adjusted by translational and/or rotational means, so that the carrying device 200 moves relative to the imaging device 300, so that the center 11 of the detection surface 10 moves onto the center line 340 and the extension line thereof of the field of view range 330 of the imaging device 300 where the imaging device 300 photographs the debugging 100.
In another embodiment, the position of the imaging device 300 may be adjusted by translational and/or rotational means, so that the imaging device 300 moves relative to the carrying device 200, so that the center line 340 of the field of view range 330 of the debugging member 100 and the extension line thereof are shot by the imaging device 300 to move to the center 11 of the detection surface 10.
In yet another embodiment, the position of the carrying device 200 and the position of the imaging device 300 may be adjusted by translational and/or rotational means, so that the carrying device 200 moves relative to the imaging device 300, such that the center 11 of the detection surface 10 moves to the center line 340 and the extension line thereof of the field of view range 330 of the debugging member 100 photographed by the imaging device 300.
When the center 11 of the detection surface 10 is on the center line 340 and the extension line of the field of view range 330 of the debugging member 100 photographed by the imaging device 300, the reduction image distortion obtained by photographing the detection surface 10 can be avoided, so that the reduction image distortion obtained by photographing the member to be detected is avoided when the member to be detected is replaced by the member to be detected for photographing, and the detection result of detecting the member to be detected is prevented from being influenced by the reduction image distortion obtained by photographing the member to be detected.
Referring to fig. 7 in conjunction with fig. 1-3, in some embodiments, 04: debugging the detection device according to the detected image, comprising:
045: detecting whether the line frequency of the imaging device 300 corresponds to the rotation speed of the carrying device 200 according to the part corresponding to the calibration pattern 35 in the detection image;
046: when the line frequency of the imaging device 300 does not correspond to the rotation speed of the carrying device 200, the rotation speed of the carrying device 200 and/or the line frequency of the carrying device 200 are/is adjusted until the deformation of the part corresponding to the calibration pattern 35 in the detected image compared with the deformation of the calibration pattern 35 is within a preset range.
The detection image is a scan image of the detection surface 10 generated in real time and represented on a polar coordinate, so that the detection image can be quickly acquired, and feedback of the debug situation can be quickly acquired from the detection image generated in real time after the semiconductor detection device 1000 is debugged.
The calibration pattern 35 may be circular so as to intuitively observe deformation of the pattern corresponding to the calibration pattern 35 on the inspection image compared with the circular shape, to correspondingly debug the semiconductor inspection apparatus 1000 according to the direction of the deformation, so that the line frequency of the imaging device 300 of the semiconductor inspection apparatus 1000 corresponds to the rotation speed of the carrier device 200 of the semiconductor inspection apparatus 1000.
By observing whether or not the portion of the detected image corresponding to the calibration pattern 35 is a portion that is smaller than the deformation of the calibration pattern 35, it is possible to detect whether or not the line frequency of the side imaging device 300 corresponds to the rotation speed of the carrying device 200 within a predetermined range. When the line frequency of the imaging device 300 corresponds to the rotation speed of the carrying device 200, the deformation of the portion of the detected image corresponding to the calibration pattern 35 compared to the calibration pattern 35 is within the preset range. When the line frequency of the imaging device 300 does not correspond to the rotation speed of the carrying device 200, the deformation of the portion of the detected image corresponding to the calibration pattern 35 compared with the calibration pattern 35 exceeds the preset deformation range.
When the line frequency of the imaging device 300 does not correspond to the rotation speed of the carrying device 200, the line frequency of the imaging device 300 and/or the rotation speed of the carrying device 200 may be adjusted, while the detection image generated in real time is observed until the deformation of the portion of the detection image corresponding to the calibration pattern 35 compared to the calibration pattern 35 is within the preset range, which means that the line frequency of the imaging device 300 and the rotation speed of the carrying device 200 have been adjusted to correspond.
For example, when the calibration pattern 35 is circular, a portion of the detection image corresponding to the calibration pattern 35 may be deformed into an elliptical shape. If the deformation of the ellipse compared to the circle is within the preset range, the line frequency of the imaging device 300 can be considered to correspond to the rotation speed of the carrying device 200. The oval shape is larger than the circular shape by a predetermined deformation range, and the line frequency of the imaging device 300 does not correspond to the rotation speed of the carrying device 200. The preset deformation range is set according to the precision requirement of the semiconductor detecting apparatus 1000, and the smaller deformation range may be set to strictly require that the line frequency of the imaging device 300 corresponds to the rotation speed of the carrier 200, or the larger deformation range may be set to loosely require that the line frequency of the imaging device 300 corresponds to the rotation speed of the carrier 200.
When the calibration pattern 35 is circular, if the portion of the detected image corresponding to the calibration pattern 35 is deformed into an oval shape stretched in the circumferential direction, the rotation speed of the carrying device 200 is low, and the rotation speed of the carrying device 200 can be increased by adjusting the rotation speed; or to turn down the line frequency of the imaging device 300, or to turn up the rotational speed of the carrier device 200 and to turn down the line frequency of the imaging device 300 so that the line frequency of the imaging device 300 corresponds to the rotational speed of the carrier device 200. If the part of the detected image corresponding to the calibration pattern 35 is deformed into an oval shape compressed in the circumferential direction, the rotation speed of the bearing device 200 is higher, and the rotation speed of the bearing device 200 can be reduced; either the line frequency of the imaging device 300 is increased or the rotational speed of the carrier 200 is decreased and the line frequency of the imaging device 300 is increased such that the line frequency of the imaging device 300 corresponds to the rotational speed of the carrier 200.
When the line frequency of the imaging device 300 corresponds to the rotation speed of the bearing device 200, the larger deformation of the pattern on the detection surface in the restored image acquired by the shooting detection surface 10 can be avoided, namely the restored image distortion acquired by the shooting detection surface 10 is avoided, so that the restored image distortion acquired by the shooting detection part is avoided when the adjustment part is replaced by the detection part to be shot, and the detection result of detecting the detection part to be detected is prevented from being influenced by the restored image distortion acquired by the shooting detection part.
In the description of the present specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "an exemplary embodiment," "an example," "a particular example," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present application, the meaning of "plurality" is at least two, for example two, three, unless explicitly defined otherwise.
Although embodiments of the present application have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the application, and that variations, modifications, alternatives and variations may be made to the above embodiments by one of ordinary skill in the art within the scope of the application, which is defined by the claims and their equivalents.
Claims (13)
1. A debug of semiconductor inspection equipment, characterized in that, the debug includes detection face and sets up the detection pattern on the detection face, the detection pattern includes:
a concentric ring centered on the center of the detection face;
a diameter line passing through the center of the detection surface, the diameter line being used for detecting whether the center of the detection surface is on a center line of a field of view range of the test piece and an extension line thereof shot by an imaging device of the semiconductor detection equipment, the diameter line intersecting with the concentric rings to form a spacing region; and
And the calibration pattern is positioned in the interval area and is used for detecting whether the line frequency of the imaging device of the semiconductor detection equipment corresponds to the rotation speed of the bearing device of the semiconductor detection equipment.
2. The test piece of claim 1, wherein the concentric rings comprise a plurality of,
the distance between two adjacent concentric rings is 0.1 times the length of the field of view range; and/or
The line width of the concentric rings is 2 times the length/width of the picture elements of the imaging device.
3. The test piece according to claim 1, wherein the diameter line comprises a plurality of diameter lines,
the value range of the included angle between two adjacent diameter lines is [1 DEG, 180 DEG ]; and/or
The line width of the diameter line is 2 times the length/width of the picture element of the imaging device.
4. A test piece according to claim 3, wherein said concentric rings comprise a plurality of said concentric rings, a plurality of said spacing areas are formed in the radial direction and the circumferential direction after intersecting with a plurality of said diameter lines, at least part of said spacing areas are provided with said calibration patterns, the centers of said calibration patterns between two adjacent said diameter lines are collinear in said radial direction, and the collinear calibration patterns have the same size.
5. The test piece according to claim 4, wherein the calibration patterns in the interval regions adjacent in the circumferential direction are located on the same virtual circumference centered on the center of the detection surface.
6. A test piece according to claim 5, wherein each of said spaced areas is provided with a plurality of calibration patterns, each of said calibration patterns being located on a different one of said virtual circumferences.
7. A test piece according to any one of claims 4-6, characterized in that the calibration patterns in the circumferentially adjacent spaced areas are equidistant from the center of the detection surface in at least two dimensions.
8. The test piece of claim 4, wherein the calibration pattern comprises any one of a circle, a polygon, an ellipse, and a racetrack.
9. The test piece of claim 4, wherein the calibration pattern comprises a circle having a diameter in the range of [0.5,30] times the length/width of the pel.
10. The utility model provides a utilize debugging method of debugging semiconductor check out test set of test set, its characterized in that, check out test set includes loading device and image device, loading device can rotate in order to drive the synchronous rotation of debugging piece, image device can shoot the debugging piece, the debugging method includes:
Placing a test piece on the bearing device, wherein the test piece comprises a detection surface and a detection pattern arranged on the detection surface, the detection pattern comprises concentric rings taking the center of the detection surface as the center, a diameter line passing through the center of the detection surface, and a calibration pattern, and the calibration pattern is positioned in a spacing area formed by intersecting the diameter line and the concentric rings;
rotating the bearing device to drive the debugging piece to synchronously rotate;
shooting the debugging piece to obtain a detection image; and
And debugging the detection equipment according to the detection image.
11. The debugging method of claim 10, wherein the debugging the detection apparatus from the detection image comprises:
detecting whether the debugging piece is positioned at the rotation center of the bearing device according to the part, corresponding to the concentric ring, of the detection image; and
And when the test piece is not positioned at the rotation center of the bearing device, adjusting the position of the test piece until the part corresponding to the concentric ring in the detection image is a vertical straight line.
12. The debugging method of claim 10, wherein the debugging the detection apparatus from the detection image comprises:
Detecting whether the center of the detection surface is on the center line and the extension line of the field of view range of the test piece shot by the imaging device according to the part corresponding to the diameter line in the detection image; and
And when the center of the detection surface is not on the central line and the extension line of the central line of the visual field range of the test piece, adjusting the position of at least one of the bearing device and the imaging device until the part corresponding to the diameter line in the detection image is a horizontal straight line.
13. The debugging method of claim 10, wherein the debugging the detection apparatus from the detection image comprises:
detecting whether the line frequency of the imaging device corresponds to the rotation speed of the bearing device according to the part, corresponding to the calibration graph, of the detection image; and
And when the line frequency of the imaging device does not correspond to the rotation speed of the bearing device, adjusting the rotation speed of the bearing device and/or the line frequency of the bearing device until the deformation of the part, corresponding to the calibration pattern, in the detection image is within a preset range compared with the deformation of the calibration pattern.
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