CN1141538C - Freezing box of new semiconductor refrigeration and heat radiation structure - Google Patents
Freezing box of new semiconductor refrigeration and heat radiation structure Download PDFInfo
- Publication number
- CN1141538C CN1141538C CNB00103345XA CN00103345A CN1141538C CN 1141538 C CN1141538 C CN 1141538C CN B00103345X A CNB00103345X A CN B00103345XA CN 00103345 A CN00103345 A CN 00103345A CN 1141538 C CN1141538 C CN 1141538C
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- Prior art keywords
- refrigeration
- heat radiation
- conductive plate
- conduction device
- heat
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- 238000005057 refrigeration Methods 0.000 title claims abstract description 64
- 230000005855 radiation Effects 0.000 title claims abstract description 51
- 239000004065 semiconductor Substances 0.000 title claims abstract description 44
- 238000007710 freezing Methods 0.000 title description 4
- 230000008014 freezing Effects 0.000 title description 4
- 238000001704 evaporation Methods 0.000 claims abstract description 12
- 230000008020 evaporation Effects 0.000 claims abstract description 10
- 238000009834 vaporization Methods 0.000 claims description 18
- 230000008016 vaporization Effects 0.000 claims description 18
- 238000009833 condensation Methods 0.000 claims description 14
- 230000005494 condensation Effects 0.000 claims description 14
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 3
- 238000009825 accumulation Methods 0.000 abstract description 2
- 230000002708 enhancing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000001816 cooling Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000009466 transformation Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 239000002510 pyrogen Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The present invention relates to a novel refrigerator with the semiconductor refrigeration and radiation structure. A semiconductor refrigeration assembly is arranged on the wall of the refrigerator body. The cold end inside the refrigerator body is provided with a refrigeration conducting device, and the hot end outside the refrigerator body is provided with a radiation conducting device. The radiation conducting device comprises an evaporating block with an evaporation chamber, and the evaporating block is fixedly connected with radiation conducting plates formed by the flat arrangement of a plurality of conducting tubes. An annular circulating tube is arranged on the outer wall of the evaporation chamber, and each conducting plate and the actuating medium in the tube are communicated with the evaporation chamber. The refrigeration and radiation structure of the present invention can conduct in high efficiency, reducing the heat accumulation and heat change on the cold end and hot end, reducing the temperature differences of the both ends and enhancing the refrigeration efficiency.
Description
Technical field
The present invention relates to freezing equipment, concrete is a kind of household freezer that adopts new semiconductor refrigeration, radiator structure.
Background technology
Cooling technique of semiconductor is on the basis of peltier effect, utilizes two kinds of electronics and the potential variation that produces in power circuit of hole and heat absorption, exothermic phenomenon in the conductor, form cool and heat ends, and then realizes refrigeration (pyrogenicity) performance.Cooling technique of semiconductor all is widely used aspect a lot of at present, but in the practical application of refrigerator product, often because refrigeration, radiator structure can not well mate and the influence of the refrigeration degree of depth of semiconductor refrigerating assembly itself, refrigerator is being very restricted aspect the refrigeration performance effect, because the optimization of semi-conducting material is selected still to be at present to grope the experimental stage, this just needs to provide a kind of science that has more more, reasonably refrigeration, radiator structure, in realizing conductor refrigeration work, realize noiseless, in the time of multiple characteristics such as pollution-free, realize degree of depth refrigeration to a greater degree.
Summary of the invention
The household freezer that the purpose of this invention is to provide a kind of new semiconductor refrigeration, radiator structure, refrigeration conductive plate, heat radiation conductive plate with reasonable coupling carry out the high efficiency conduction, the high low temperature conduction of accelerated semiconductor refrigerating assembly, reduce the thermal accumlation and the heat exchange of cool and heat ends, reduce the two ends temperature difference, improve freezing capacity.
Order of the present invention is achieved in that
The household freezer of a kind of new semiconductor refrigeration, radiator structure, comprise that one has the heat insulation casing of door, on this box body wall, semiconductor refrigerating assembly is housed, its cold junction in casing is equipped with the refrigeration conduction device, the heat radiation conduction device is equipped with in its hot junction outside casing, described heat radiation conduction device comprises that one has the evaporation piece of vaporization chamber, this evaporation piece is connected with by the multi beam conducting tube and is the heat radiation conductive plate that planar alignment is formed, the outer wall of described vaporization chamber is provided with the circulation pipe of a ring-type, and the working medium in each conductive plate, the pipe communicates with vaporization chamber.
Described refrigeration conduction device comprises that one has the refrigerating block of condensation chamber, this refrigerating block is connected with the cold junction radiating subassembly, this cold junction radiating subassembly can be the refrigeration conductive plate of being made up of plane row's example in the multi beam conducting tube, and in the finned radiator, round needle shape radiator, large-area metal conductive plate any, the working medium in each conductive plate, the pipe communicates with condensation chamber.
The shape of the condensation chamber of the vaporization chamber of described heat radiation conduction device and refrigeration conduction device can be rectangular, circle and truncated cone, frustum of a pyramid shape, when it is the frustum of a cone, frustum of a pyramid shape, and this frustum small end adjacent semiconductor refrigerating assembly.
On the conducting tube of described composition heat radiation conductive plate, be connected with fin, wing bar.
Described be equipped with the heat radiation conductive plate the case shell on radiator fan also is housed, the air-flow of this fan towards the heat radiation conductive plate.
Described refrigeration, the heat radiation conduction device that is contained in semiconductor refrigerating assembly on the box body wall and cool and heat ends thereof can be provided with one group, and many groups also can be set.
The present invention has following active and effective effect:
The present invention is with refrigeration, the radiator structure of the semiconductor refrigerating assembly of reasonable coupling, the cold and hot amount that makes cool and heat ends is undertaken high efficiencyly distributing and conducting by refrigeration conductive plate, heat radiation conductive plate, the heat exchange that minimizing causes because of the two ends heat accumulation, reduce the temperature difference at two ends to greatest extent, it is operated under the minimum temperature difference state, obtain more refrigerating capacity, improve the condition of work of semiconductor refrigerating assembly, improve freezing capacity, enlarge the refrigeration volume, make it to be adapted at the extensive use of more field, its refrigeration temperature is below 0 ℃.
Description of drawings
Fig. 1 is the structural representation of heat abstractor one embodiment in the new semiconductor refrigeration radiator structure of the present invention;
Fig. 2 is the side view of Fig. 1;
Fig. 3 is the integral body assembling schematic diagram of household freezer one embodiment of new semiconductor refrigeration radiator structure of the present invention;
Fig. 4 is the A-A partial sectional view of Fig. 3
The same Fig. 3 of Fig. 5 is another embodiment;
Fig. 6 is the structural representation of chiller one embodiment in the new semiconductor refrigeration radiator structure of the present invention;
Fig. 7 is the side view of Fig. 6.
The specific embodiment
Accompanying drawing number;
1. semiconductor refrigerating assembly 2. refrigeration conductive plates 3. refrigerating blocks
4. condensation chamber 5. working medium 6. vaporization chambers
7. ring-type circulation pipe 8. heat radiation conductive plates 9. cabinet shells
Fan and motor 11. fins and wing bar 12. (household freezer) door
13. attachment screw
Please refer to Fig. 3 Fig. 5, the household freezer of employing new semiconductor refrigeration of the present invention, radiator structure, comprise that one has the heat insulation casing 9 of door 12, semiconductor refrigerating assembly 1 is housed on this box body wall, its cold junction in casing is equipped with the refrigeration conduction device, and the heat radiation conduction device is equipped with in its hot junction outside casing;
Please refer to Fig. 1 Fig. 2 and Fig. 4, described heat radiation conduction device comprises that one has the evaporation piece of vaporization chamber 6, this evaporation piece is connected with by the multi beam conducting tube and is the heat radiation conductive plate 8 that planar alignment is formed, the outer wall of described vaporization chamber 6 is provided with the circulation pipe 7 of a ring-type, and the working medium 5 in each conductive plate, the pipe communicates with vaporization chamber 6.
Described refrigeration conduction device comprises that one has the refrigerating block 3 of condensation chamber 4, this refrigerating block 3 is connected with the cold junction radiating subassembly, this cold junction radiating subassembly can be seen Fig. 6 Fig. 7 for be the routine refrigeration conductive plate of forming 2 of plane row by the multi beam conducting tube, and in the finned radiator, round needle shape radiator, large-area metal conductive plate any (back is several to be prior art, accompanying drawing does not show), the working medium in each conductive plate, the pipe communicates with condensation chamber.
During enforcement, the shape of the vaporization chamber 6 of described heat radiation conduction device and the condensation chamber 4 of refrigeration conduction device can be rectangular, circle and truncated cone, frustum of a pyramid shape, when it was the frustum of a cone, frustum of a pyramid shape (four ribs or many ribs), this frustum small end adjacent semiconductor refrigerating assembly was seen Fig. 2 Fig. 3.
During enforcement, on the conducting tube of described composition heat radiation conductive plate 8, be connected with fin, wing bar 11.
In the embodiment shown in fig. 5, described be equipped with the heat radiation conductive plate case shell 9 on radiator fan 10 also is housed, the air-flow of this fan towards the heat radiation conductive plate 8.
Described refrigeration, the heat radiation conduction device that is contained in semiconductor refrigerating assembly on the box body wall and cool and heat ends thereof can be provided with one group and see Fig. 5, and many groups also can be set, and Fig. 3 is symmetrical arranged 2 groups embodiment.
Design feature of the present invention and operation principle, implementation method:
The household freezer of new semiconductor refrigeration of the present invention, radiator structure mainly comprises;
(1) heat abstractor.By the multi beam band fin that is installed in semiconductor refrigerating assembly 1 hot junction or wing bar and come together in the heat radiation conductive plate 8 of vaporization chamber 6, the circulation pipe 7 of the ring-type on the outer wall of vaporization chamber 6, and the shell that is connected the casing 9 of heat radiation conductive plate 8 peripheries is formed as Fig. 1 Fig. 2;
(2) chiller.By semiconductor refrigerating assembly 1, be installed in the trapezoidal refrigerating block 3 of semiconductor refrigerating assembly 1 cold junction, be fixed on and be furnished with multi beam on the refrigerating block 3 and propel the price of the refrigeration conductive plate 2 that pipeline comes together in condensation chamber 4 and form as Fig. 6 Fig. 7;
Adopt the household freezer of new semiconductor refrigeration radiator structure, adopted heat radiation conductive plate, refrigeration conductive plate to realize heat radiation, refrigeration work.Its operation principle: the heat radiation conductive plate is after the heating of the hot junction of semiconductor refrigerating assembly, the former interior a large amount of working medium of heat radiation conductive plate that charges into is absorbing the heat that bring in the hot junction, a part is carried out nuclear boiling formula conduction heat to the bottom, and another part is vaporized to heat radiation conductive plate top conduction heat.Conduction time and external environment generation heat exchange, release heat.Flow to heat radiation conductive plate bottom liquid pool after the working medium condensation, utilize science to calculate, determine to fill the working medium amount, wherein sub-fraction has promptly realized high efficiency heat radiation in the motion of washing away of carrying out pipeline inside, and avoided dry, the generation of several limit such as carry, the wing bar that is provided with on the conductive plate that dispels the heat in addition can play the increasing area of dissipation, improve the good action of radiating condition, so go round and begin again, continuously the heat in hot junction is taken fast to the top (being cold junction) of heat radiation conductive plate, the heat radiation of this part is to lean on the phase transformation of working medium to realize, conduction realizes according to homophase in the bottom, can under very little temperature difference state, obtain higher heat conductivity, and the vaporization chamber that is provided with in the middle and lower part near the heat radiation conductive plate, not only expanded the internal volume that propels the price of pipeline, and in working medium transmission heat, expanded heat exchange area, can be more abundant, realizing the phase transformation and the conduction heat of working medium expeditiously, is more satisfactory, rational structure.
Described refrigeration conduction device be with the refrigeration space as thermal source, absorb heat at fire end, after the working medium of vaporization was imported cold junction into, by semiconductor refrigerating assembly cooling condensation, its operation principle was identical.
New semiconductor refrigeration of the present invention, the implementation method of the household freezer of radiator structure: chiller: at first determine the cold and hot end maximum temperature difference of semiconductor refrigerating assembly, then according to the temperature range of cold and hot end, select the suitable working medium that fills, the molten point of its working medium is lower than the operating temperature of refrigeration conductive plate, and critical point must be higher than the operating temperature of refrigeration conductive plate, be the gas-liquid two states, calculate by science then and determine filling weight, on structure and technology, the pure aluminum plate heat that adopts the refrigeration conductive plate moulding of rising, also can adopt the large-area metal plate, finned radiator, (these are prior arts to round needle shape radiator, accompanying drawing is on the books in the patent ZL 00201488.2 of my company, and this specification does not describe in detail.) after checking operating pressure, fill.This structure can be born bigger operating pressure, thermal conductivity height, and the circulating line of the intensive various arbitrary forms of can arranging, and the condensation chamber that is provided with can be expanded heat-dissipating space, making increases evaporation and area of dissipation to a greater degree in the Working fluid phase changing process, be more satisfactory structure.
The heat radiation conductive plate can adopt the structure of doubling plate compression molding, roll welding sealing, also can adopt pure aluminum plate hot pressing to propel the price of moulding, propelling the price of the structure that pipeline is provided with fin or wing bar on every side, improve area of dissipation with increase, the pipeline that is connected with vaporization chamber adopts radial, the same with described refrigeration conductive plate before filling, fill after qualified by pressure detecting.At the inner refrigeration conductive plate of installing of household freezer, between refrigeration conductive plate on the household freezer and heat radiation conductive plate semiconductor refrigerating assembly is installed afterwards, at the outside heat radiation conductive plate of installing of household freezer, this refrigeration conductive plate links together with screw with the heat radiation conductive plate.
Fig. 3 shows that the refrigeration conductive plate of semiconductor refrigerating assembly and cool and heat ends thereof and the conductive plate that dispels the heat are combined in the embodiment on the household freezer, are provided with two groups symmetrically on this box body wall.
In household freezer embodiment illustrated in fig. 5, the inner refrigeration conductive plate that adopts, the outside heat radiation conductive plate that adopts the incorporated fan heat radiation.
Claims (5)
1. new semiconductor refrigeration, the household freezer of radiator structure, comprise that one has the heat insulation casing of door, on this box body wall, semiconductor refrigerating assembly is housed, its cold junction in casing is equipped with the refrigeration conduction device, the heat radiation conduction device is equipped with in its hot junction outside casing, described heat radiation conduction device comprises that one has the evaporation piece of vaporization chamber, this evaporation piece is connected with by the multi beam conducting tube and is the heat radiation conductive plate that planar alignment is formed, each conductive plate, working medium in the pipe communicates with vaporization chamber, the outer wall of described vaporization chamber is provided with the circulation pipe of a ring-type, it is characterized in that: described refrigeration conduction device comprises that one has the refrigerating block of condensation chamber, this refrigerating block is connected with the cold junction radiating subassembly, this cold junction radiating subassembly can be for being the refrigeration conductive plate that plane row's example is formed by the multi beam conducting tube, and finned radiator, round needle shape radiator, in the large-area metal conductive plate any, each conductive plate, working medium in the pipe communicates with condensation chamber.
2. the household freezer of new semiconductor refrigeration as claimed in claim 1, radiator structure, it is characterized in that: the shape of the condensation chamber of the vaporization chamber of described heat radiation conduction device and refrigeration conduction device can be rectangular, circle and truncated cone, frustum of a pyramid shape, when it is the frustum of a cone, frustum of a pyramid shape, this frustum small end adjacent semiconductor refrigerating assembly.
3. the household freezer of new semiconductor refrigeration as claimed in claim 1, radiator structure is characterized in that: be connected with fin, wing bar on the conducting tube of described composition heat radiation conductive plate.
4. the household freezer of new semiconductor refrigeration as claimed in claim 1, radiator structure is characterized in that: described be equipped with the heat radiation conductive plate the case shell on radiator fan also is housed, the air-flow of this fan towards the heat radiation conductive plate.
5. the household freezer of new semiconductor refrigeration as claimed in claim 1, radiator structure is characterized in that: described refrigeration, the heat radiation conduction device that is contained in semiconductor refrigerating assembly on the box body wall and cool and heat ends thereof can be provided with one group, and many groups also can be set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB00103345XA CN1141538C (en) | 2000-03-02 | 2000-03-02 | Freezing box of new semiconductor refrigeration and heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB00103345XA CN1141538C (en) | 2000-03-02 | 2000-03-02 | Freezing box of new semiconductor refrigeration and heat radiation structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1311422A CN1311422A (en) | 2001-09-05 |
| CN1141538C true CN1141538C (en) | 2004-03-10 |
Family
ID=4576914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB00103345XA Expired - Fee Related CN1141538C (en) | 2000-03-02 | 2000-03-02 | Freezing box of new semiconductor refrigeration and heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1141538C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10261366A1 (en) * | 2002-12-30 | 2004-07-08 | BSH Bosch und Siemens Hausgeräte GmbH | Auxiliary cooling device |
-
2000
- 2000-03-02 CN CNB00103345XA patent/CN1141538C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1311422A (en) | 2001-09-05 |
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Owner name: LUQUAN JIWEI ELECTRICAL CO., LTD. Free format text: FORMER OWNER: HEBEI AOKELAI ELECTRONIC REFRIGERATOR CO., LTD. Effective date: 20080509 |
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Owner name: HEBEI AOKELAI ELECTRONIC REFRIGERATOR CO., LTD. Free format text: FORMER NAME OR ADDRESS: HEBEI ENERGY-SAVING INVESTMENT CO., LTD |
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Address after: No. 1, Xiangyang South Avenue, Hebei, Luquan Patentee after: Hebei Australia electronic refrigerator Co.,Ltd. Address before: Jinshi Industrial Park, No. 368 Hebei province Shijiazhuang City Xinshi North Road, No. 2 building of Hebei energy investment limited liability company Patentee before: Hebei Energy-saving Investment Co.,Ltd. |
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