[go: up one dir, main page]

CN114139409A - Fatigue life prediction method for transient thermal analysis electronic packaging welding joint - Google Patents

Fatigue life prediction method for transient thermal analysis electronic packaging welding joint Download PDF

Info

Publication number
CN114139409A
CN114139409A CN202111207337.6A CN202111207337A CN114139409A CN 114139409 A CN114139409 A CN 114139409A CN 202111207337 A CN202111207337 A CN 202111207337A CN 114139409 A CN114139409 A CN 114139409A
Authority
CN
China
Prior art keywords
thermal
stress
curve
structural stress
fatigue life
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202111207337.6A
Other languages
Chinese (zh)
Inventor
周韶泽
郭硕
陈秉智
兆文忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dalian Jiaotong University
Original Assignee
Dalian Jiaotong University
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dalian Jiaotong University filed Critical Dalian Jiaotong University
Priority to CN202111207337.6A priority Critical patent/CN114139409A/en
Publication of CN114139409A publication Critical patent/CN114139409A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G06F30/23—Design optimisation, verification or simulation using finite element methods [FEM] or finite difference methods [FDM]
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/04—Ageing analysis or optimisation against ageing
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2119/00—Details relating to the type or aim of the analysis or the optimisation
    • G06F2119/14—Force analysis or force optimisation, e.g. static or dynamic forces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)

Abstract

A fatigue life prediction method for a transient thermal analysis electronic packaging welding joint comprises the following steps: step 1: constructing a geometric model and a finite element model of the electronic packaging electronic element; step 2: calculating the node force time domain response of the electronic package welding joint by utilizing transient thermal analysis; and step 3: calculating the thermal equivalent structural stress time domain response of all nodes of the welding joint; and 4, step 4: acquiring a main S-N curve of an electronic packaging welding joint through a temperature change test; and 5: and (4) evaluating the fatigue life of the electronic packaging welding joint by using the main S-N curve obtained in the step (4). The method can acquire the thermal structure stress, accurately acquire the main SN curve of the fatigue of the welding joint, evaluate the fatigue life of the welding joint and effectively solve the problem of predicting the fatigue life of the electronic packaging welding joint under the condition of temperature load.

Description

Fatigue life prediction method for transient thermal analysis electronic packaging welding joint
Technical Field
The invention relates to the technical field of electronic packaging.
Background
Electronic packages, as an important component of a circuit, function as circuit support, sealing, internal and external point connection, heat dissipation and shielding, and have important effects on the performance and reliability of the circuit. The package assembly is generally divided into different levels, and the process of wiring or soldering the integrated circuit on the wafer is called as level 0 package, and the integrated circuit is usually soldered by soldering, etc., and then subjected to a temperature change test such as thermal shock to evaluate the fatigue life of the soldered joint. During welding, high and low temperature circulation and impact tests and the use process of electronic elements, the whole circuit board is burnt out and fails due to cracking, delamination, even fracture and the like of a welding joint of electronic packaging, and further the whole system fails, so that great loss is caused.
Fatigue life assessment for welded joints has long been progressively improving over and over again, relying primarily on engineering experience by designers and extensive fatigue testing. The traditional design mode has very high requirements on the experience of designers, and needs a great amount of long-period test verification, so that the test cost is very huge. Meanwhile, due to lack of theoretical explanation, reasonable and feasible guidance suggestions are difficult to provide for the requirements of improving the bearing capacity of the welding joint, prolonging the service life and the like.
With the improvement of computer-aided technology, finite element analysis of structural mechanics has become a common approach. However, due to the particularity of the welding joint, such as stress singularity of the welding joint position, the influence of the simulation calculation result strongly depending on the size of the finite element grid, the joint type can not be selected, and the like, the effective mechanical characteristics of the welding structure can be obtained by applying a common finite element analysis method, and further the welding fatigue life is very difficult to solve. Therefore, obtaining the exact stress distribution of the electronic packaging welding seam to further evaluate the fatigue life is a problem to be solved urgently.
The first related technical scheme is to calculate the service life by a thermal stress method. The stress magnitude was obtained by analysis of the thermal-structural coupling finite element calculation of ANSYS et al commercial software. However, the peak value of the finite element stress depends strongly on the size of the grid, especially at some corner positions of the electronic package soldering, and when the finite element grid is denser, the stress result is larger, and an accurate stress value cannot be obtained. This stress value is the most important factor in determining the life, so that the fatigue life prediction is difficult to be accurate. In addition, the SN curves are too scattered due to various electronic welded joint forms, which makes it difficult to perform statistics and calculations and further makes it impossible to predict the service life. Therefore, it is difficult to obtain the fatigue life under the thermal effect by the thermal stress method.
The second of the existing related technical solutions is a grid insensitive structural stress method (ASME 2007). The method is provided and proved to be capable of effectively overcoming the problem that a welding structure needs to be subjected to grid refinement, and well solving the problems of welding joint stress singularity and inaccurate stress result caused by a general finite element analysis method by extracting the node force of a welding seam instead of stress. The method also adopts a main SN curve to predict the fatigue life of various types of welding joints, and can obtain quantized welding joint fatigue life distribution in any trend. At present, structural stresses can already be applied in quantitative indicators of fatigue life analysis of welded joints.
However, the current structural stress method is only applied to the conventional welding fatigue life prediction occasion without temperature change, and no related method is used for predicting the welding fatigue life generating fatigue under the condition of temperature change, so that the problem of the welding fatigue life prediction of temperature change (such as temperature punching) electronic packaging and the like is solved. In addition, the types of electronic packaging welding seams are various under the condition of temperature change, because the welding joints are fine and tiny, the length of the welding seams reaches the millimeter level, such as 2.5 millimeters of certain capacitance, and the height of the fillet welding seams is 0.5 millimeters, so that the SN curve of the type of joint is difficult to obtain independently according to the traditional main SN curve. Moreover, the loading spectrum of the current structural stress method is added at the loaded part of the structure before calculation, and the original loading method cannot be applied under the working condition that the whole structure of the electronic packaging has temperature change load. In addition, the original structure stress method is only suitable for linear finite element analysis when load spectrum calculation is carried out, and fatigue life prediction cannot be carried out when nonlinear finite element analysis is carried out, such as thermal analysis, multilayer multiple materials and other nonlinear conditions.
Therefore, the conventional methods described above lead to difficulties in predicting the solder joint life of electronic packages, and new methods are needed to solve these problems.
Disclosure of Invention
The invention provides a method for predicting the fatigue life of electronic packaging welding by transient thermal analysis, which aims to effectively solve the problem of predicting the fatigue life of electronic packaging welding under the condition of temperature load.
The technical scheme adopted by the invention for realizing the purpose is as follows: a fatigue life prediction method for a transient thermal analysis electronic package welding joint comprises the following steps:
step 1: constructing a geometric model and a finite element model of an electronic package component including solder joints, comprising the steps of: 1-1, establishing a geometric model of an electronic packaging element containing a welding joint according to the size: the geometric model adopts a three-dimensional modeling method to create a main body, an electrode plate, a substrate and a welding line;
1-2, establishing a finite element model of an electronic packaging element containing a welding joint: setting units and nodes on the same side of a section of the welding line penetrating through the thickness as a designated combination, and setting a unit set along the welding line direction and a node set along the welding line direction;
1-3, fitting a thermal shock curve according to actually defined material parameters of each part of the electronic packaging welding joint;
step 2: calculating a nodal force time domain response of an electronic package solder joint using transient thermal analysis, comprising the steps of:
2-1, fitting a temperature change curve: according to a known thermal shock curve graph, selecting coordinates of nodes on the curve, performing linear fitting between every two nodes to obtain a piecewise function of the thermal shock curve, and setting the fitted piecewise function of temperature change as a time-temperature loading function in finite element software;
2-2, loading load boundary conditions according to simulation working conditions based on the finite element model established in the step 1;
2-3, setting transient thermal analysis in finite element software, wherein the transient thermal analysis comprises load step number, load step length and sub-step number of each load step as simulation calculation parameters;
2-4, solving unit node force by using a heat bole finite element basic theory;
2-5: setting the output of the finite element software to contain 'unit node force', and outputting the node force transient response time domain value F of all nodes on the section passing through the thicknessn(t) obtaining a moment transient response time domain M when the shell element is in usen(t), t is time;
and step 3: calculating the thermal equivalent structural stress time domain response of all nodes of the welding joint, comprising the following steps:
3-1: after the finite element analysis is finished, acquiring a finite element calculation result file;
3-2: reading result data of welding seam arrangement in 1-2 in a finite element calculation result file, wherein the result data comprises node numbers, unit numbers, node coordinates, unit types and transient response node forces Fn(t) and Joint bending moment Mn(t) forming a finite element result set by the time domain results;
3-3: and (3) calculating a welding seam collection weld neutral surface node force and node bending moment transient time domain result through the node force and bending moment time domain result obtained in the step (3-2).
And 4, step 4: acquiring a main S-N curve of an electronic packaging welding joint through a temperature change test;
and 5: acquiring a response counting spectrum of each node by using the main S-N curve obtained in the step (4) and adopting a transient response equivalent structure stress rain flow counting method, calculating the service life, and evaluating the fatigue life of the electronic packaging welding joint;
step 6: and if the design requirements are not met, returning to the step 1 to improve the design.
In the step 1-2, the solid units adopt eight-node hexahedron or tetrahedron 3D grids, the shell units adopt quadrilateral or trilateral 2D grids, and the units at the welding line and the base material are divided along a section penetrating through the thickness.
In the step 2-4, the algorithm is as follows:
assuming that there are N nodes in the domain, the node displacement is:
δ＝[N]{μ}
wherein [ N ] is a shape function;
{ mu } is a displacement vector of the node;
according to the principle of virtual displacement:
Figure RE-GDA0003457491830000031
in the formula (I), the compound is shown in the specification,
Figure BDA0003307328020000032
is a cell stiffness matrix;
Figure BDA0003307328020000033
is a cell thermal load;
Figure BDA0003307328020000034
is a cell mass matrix;
Figure BDA0003307328020000035
is a unit surface force load;
{Fnd}eis the unit node force.
3-3, a nodal force F perpendicular to the weldyn(t) bending moment M along the weldxn(t), shear node force and shear node bending moment transient time domain result Fxn(t)、Myn(t), acquiring a thermal structural stress time-domain curve on the middle surface of the welding seam, wherein the thermal structural stress and the shear thermal structural stress are as follows:
Figure BDA0003307328020000041
Figure BDA0003307328020000042
Fxn、Fynis the x and y axis node force time course of the neutral plane;
Myn、Mxnis neutralThe time history of the bending moment of the y-axis and x-axis joints;
Figure BDA0003307328020000043
thermal structural stress in the time domain perpendicular to the weld toe line direction;
Figure BDA0003307328020000044
thermal film stress in the time domain perpendicular to the weld toe line direction;
Figure BDA0003307328020000045
thermal bending stress in the time domain perpendicular to the weld toe line direction;
Figure BDA0003307328020000046
is the thermal shear structural stress in the time domain along the weld toe line direction;
Figure BDA0003307328020000047
is the thermal shear film stress in the time domain along the weld toe line direction;
Figure BDA0003307328020000048
is the thermal shear bending stress in the time domain along the weld toe line direction;
d is the plate thickness;
l is a welding seam section middle surface node distance matrix in the structural stress method, and the open welding seam is as follows:
Figure BDA0003307328020000049
the closed type weld is:
Figure BDA0003307328020000051
further, setting:
Figure BDA0003307328020000052
Figure BDA0003307328020000053
further, a default is set:
Figure BDA0003307328020000054
Figure BDA0003307328020000055
alternatively to this, the first and second parts may,
Figure BDA0003307328020000056
Figure BDA0003307328020000057
Figure BDA0003307328020000058
is a time domain load ratio parameter item; further, solving a thermal equivalent structure stress time domain response value:
Figure BDA0003307328020000059
Figure BDA00033073280200000510
when in use
Figure BDA00033073280200000511
Time of flight
Figure BDA0003307328020000061
Otherwise
Figure BDA0003307328020000062
In the above formula:
beta is a constant of the ratio of the fatigue strength between the normal stress based on fatigue testing and the shear stress based on testing.
Figure BDA0003307328020000063
The node in the direction of the vertical welding toe line responds to the equivalent thermal structural stress of the time domain;
Figure BDA0003307328020000064
the node in the direction of the vertical welding toe line responds to the equivalent thermal structural stress of time domain shearing;
Figure BDA0003307328020000065
time-domain thermally equivalent structural stresses that are nodal responses.
In the step 4, when the component is very small and is not suitable for the temperature change test of a single type of welding joint on the component, the method comprises the following steps: a single complete electronic element is adopted to carry out multiple temperature variation tests to fit a main SN curve, and the method comprises the following steps:
4-1-1: in the test, a temperature load is loaded on the complete electronic component;
4-1-2: using different welding temperatures or temperature change working conditions to enable the electronic element to fail, and recording the working condition and failure times N under which failure occurs;
4-1-3: establishing a finite element simulation model according to the structure and the working condition in the previous step, and using thermomechanical coupling transientPerforming thermal analysis simulation, and calculating the thermal equivalent structure stress variation range Delta S of the weak position of the welding seam of the electronic element according to the method in the step 3T；
4-1-4: repeating the steps 4-1-1 to 4-1-3 to obtain a stress change range and corresponding failure times of the thermal equivalent structure, and fitting the data into a main SN curve according to minimum two-multiplication;
4-1-5: based on N,. DELTA.S obtained in steps 4-1-2 and 4-1-4TAccording to the main SN curve N ═ Δ ST/Cd)1/hObtaining the thermal equivalent structural stress C of the electronic elementdAnd h constant.
In the step 4, one welding joint of one type is adopted for testing to obtain a main SN curve, and the method comprises the following steps:
4-1-1: in the test, a temperature load was applied to one type of weld joint;
4-1-2: using different welding temperatures or temperature change working conditions to enable the welded joint to fail, and recording the working condition and failure times N under which failure occurs;
4-1-3: establishing a finite element simulation model according to the structure and the working condition in the previous step, using thermomechanical coupling transient thermal analysis simulation, and calculating the thermal equivalent structure stress variation range delta S of the weak position of the welding seam of the welding joint according to the method in the step 3T；
4-1-4: repeating the steps 4-1-1 to 4-1-3 to obtain a stress change range and corresponding failure times of the thermal equivalent structure, and fitting the data into a main SN curve according to minimum two-multiplication;
4-1-5: based on N,. DELTA.S obtained in steps 4-1-2 and 4-1-4TAccording to the main SN curve N ═ Δ ST/Cd)1/hObtaining the thermal equivalent structural stress C of the welded jointdAnd h constant.
The step 5 comprises the following steps:
5-1: the thermal equivalent structure stress time history is compiled into a thermal equivalent structure stress counting spectrum of the time domain response of each node by a rain flow counting method, namely the ith order (i is 1,2 … k) equivalent thermal structure stress range
Figure BDA0003307328020000071
And the number of cycles ni；
5-2: substituting the counting spectrum into a calculation formula to obtain the failure fatigue life cycle number:
Figure BDA0003307328020000072
in the formula: cdAnd h is the test constant obtained in step 4;
Niis composed of
Figure BDA0003307328020000073
Fatigue life cycle number of the lower weld joint;
5-3: the fatigue life of the weld, i.e., the cumulative fatigue damage ratio, can be predicted
Figure BDA0003307328020000074
According to the method for predicting the fatigue life of the electronic packaging welding joint through transient thermal analysis, the thermal structural stress is obtained through the method, the main SN fatigue curve of the welding joint can be accurately obtained, the fatigue life of the welding joint is evaluated, and the problem of predicting the fatigue life of the electronic packaging welding joint under the condition of temperature load is effectively solved.
Drawings
FIG. 1 is a flow chart of a method for predicting fatigue life of a transient thermal analysis electronic package solder joint in accordance with the present invention.
Fig. 2 is a schematic cross-sectional view of a solder joint of an electronic package.
FIG. 3 is a weld joint set diagram of an electronic package weld joint.
Fig. 4 is a schematic view of a geometric model of an electronic package component including solder joints.
FIG. 5 is a schematic view of a finite element model of an electronic package component including solder joints.
Fig. 6 is a schematic view of an electronic package component including a weld joint weld toe node number set and a weld unit number set.
Fig. 7 is a graph of the thermal structural stress and the thermally equivalent structural stress of the weld 1 at a certain time.
FIG. 8 is a graph of weld distance and fatigue life.
FIG. 9 is a cloud of thermal shock cumulative damage lifetimes.
FIG. 10 is an enlarged view of the location of the weakest point of the weld.
In the figure: 1. weld, 2, neutral plane, 3, weld toe, 4, through thickness tangent, 5, fatigue weakness.
Detailed Description
The method for predicting the fatigue life of the transient thermal analysis electronic packaging welding joint is shown in figure 1 and comprises the following steps:
step 1: constructing a geometric model of the electronic packaging electronic element, and further establishing a finite element model of the electronic element with a welding joint;
step 2: calculating the node force time domain response of the electronic package welding joint by utilizing transient thermal analysis;
and step 3: calculating the thermal equivalent structural stress time domain response of all nodes of the welding joint;
and 4, step 4: acquiring a main S-N curve of an electronic packaging welding joint through a temperature change test;
and 5: obtaining a response counting spectrum of each node by using the main S-N curve obtained in the previous step and a stress rain flow counting method of a transient response equivalent structure, calculating the service life, and evaluating the fatigue life of the electronic packaging welding joint;
step 6: and if the design requirements are not met, returning to the step 1 to improve the design.
The step 1 is as follows:
1-1: a three-dimensional modeling method is adopted to construct a three-dimensional geometric model of an electronic element structure containing an electronic packaging welding joint, and the geometric model adopts the three-dimensional modeling method to create a main body, an electrode plate, a substrate and a welding line, as shown in figure 4;
1-2: and (3) dividing the geometric model structure in the previous step into grids by adopting a finite element method according to a conventional method, wherein the grids adopt 2D or 3D units, and the welding structure is established into groups according to materials: ceramics, nickel, tin and copper; the mesh adopts an eight-node hexahedron mesh, the units of the welding lines and the base material are divided along the plate thickness, and the node number 137342 and the unit number 130588 of the finite element model are shown in fig. 5. And setting units and nodes on the same side of a section of the welding line penetrating through the thickness as a designated combination, setting a unit set along the welding line direction and a node set along the welding line direction, and defining the set group name. All structural components meet the setting requirements of general finite element software according to the constraint relation of simulation working conditions, toe units and nodes on the same side of a section, penetrating the thickness, of a welding wire are set as a specified calculation welding line set, the section refers to fig. 2, and 20 welding lines are built in total, for example, the toe node number set of a welding line 1 is weld _1_ n, and the welding line unit number set is weld _1_ e, as shown in fig. 4-6; the constraint relation among all structural components meets the setting requirement of general finite element software; 1-3, fitting a thermal shock curve according to material parameters of each part of the electronic packaging welding joint, including density, elastic modulus, Poisson's ratio, thermal expansion coefficient and thermal conductivity, and setting the fitted thermal shock function as a time-temperature loading function. According to the specific working condition loading load boundary condition, the degree of freedom of the capacitor bottom plate in the longitudinal direction, the transverse direction and the vertical direction is restrained, and all nodes load temperature loads. Transient thermal analysis is set in finite element software, and comprises load step number, load step length and sub-step number of each load step. In the scheme, 24 load steps are calculated, each load step is provided with 3 sub-steps, and the load step length is 3 hours in total.
The step 2 is as follows:
2-1: fitting a temperature change curve: according to a known thermal shock curve graph, selecting coordinates of nodes on the curve, performing linear fitting between every two nodes to obtain a piecewise function of the thermal shock curve, and setting the fitted piecewise function of temperature change as a time-temperature loading function in finite element software (such as ANSYS);
2-2: loading load boundary conditions according to specific simulation working conditions based on the finite element model established in the step 1;
2-3: setting transient thermal analysis in finite element software, wherein the transient thermal analysis comprises load steps and load step length, and the sub-step number of each load step is used as a simulation calculation parameter;
2-4: the unit node force is solved by using the heat bolthole finite element basic theory, and the algorithm principle is as follows:
assuming that there are N nodes in the domain, the node displacement is:
δ＝[N]{μ}
wherein [ N ] is a shape function;
{ mu } is a displacement vector of the node;
according to the principle of virtual displacement:
Figure RE-GDA0003457491830000091
in the formula (I), the compound is shown in the specification,
Figure BDA0003307328020000092
is a cell stiffness matrix;
Figure BDA0003307328020000093
is a cell thermal load;
Figure BDA0003307328020000094
is a cell mass matrix;
Figure BDA0003307328020000095
is a unit surface force load;
{Fnd}eis the unit node force;
2-5: setting the output of the finite element software to contain 'unit node force', and outputting the node force transient response time domain value F of all nodes on the section passing through the thicknessn(t) obtaining a moment transient response time domain M when the shell element is in usen(t), t is time, the same as the following;
the step 3 is as follows:
3-1: after the finite element analysis is finished, acquiring a finite element calculation result file;
3-2: reading result data of welding seam arrangement in 1-2 in a finite element calculation result file, wherein the result data comprises node numbers, unit numbers, node coordinates, unit types and transient response node forces Fn(t) and Joint bending moment Mn(t) forming a finite element result set by the time domain results;
3-3: further, acquiring a welding seam collection concentrated welding seam neutral surface node force and node bending moment transient time domain result: nodal force F normal to weldyn(t) bending moment M along the weldxn(t), shear nodal force and shear nodal bending moment transient time domain result Fxn(t)、 Myn(t) as in FIG. 2. Obtaining a thermal structure stress time domain curve on the middle surface of the welding seam, wherein the thermal structure stress and the shearing thermal structure stress are as follows:
Figure BDA0003307328020000096
Figure BDA0003307328020000097
Fxn、Fynis the x and y axis node force time course of the neutral plane;
Myn、Mxnthe time history of the bending moment of the y-axis and x-axis joints of the neutral plane;
Figure BDA0003307328020000098
thermal structural stress in the time domain perpendicular to the weld toe line direction;
Figure BDA0003307328020000101
thermal film stress in the time domain perpendicular to the weld toe line direction;
Figure BDA0003307328020000102
thermal bending stress in the time domain perpendicular to the weld toe line direction;
Figure BDA0003307328020000103
is the thermal shear structural stress in the time domain along the weld toe line direction;
Figure BDA0003307328020000104
is the thermal shear film stress in the time domain along the weld toe line direction;
Figure BDA0003307328020000105
is the thermal shear bending stress in the time domain along the weld toe line direction;
d is the plate thickness;
l is a welding seam section middle surface node distance matrix in the structural stress method, and the open welding seam is as follows:
Figure BDA0003307328020000106
the closed type weld is:
Figure BDA0003307328020000107
further, setting:
Figure BDA0003307328020000108
Figure BDA0003307328020000109
further, a default is set:
Figure BDA00033073280200001010
Figure BDA0003307328020000111
alternatively to this, the first and second parts may,
Figure BDA0003307328020000112
Figure BDA0003307328020000113
Figure BDA0003307328020000114
is a time domain load ratio parameter item;
further, solving a thermal equivalent structure stress time domain response value:
Figure BDA0003307328020000115
Figure BDA0003307328020000116
when in use
Figure BDA0003307328020000117
Time of flight
Figure BDA0003307328020000118
Otherwise
Figure BDA0003307328020000119
In the above formula:
beta is a constant of the ratio of the fatigue strength between the normal stress based on fatigue testing and the shear stress based on testing.
Figure BDA00033073280200001110
The node in the direction of the vertical welding toe line responds to the equivalent thermal structural stress of the time domain;
Figure BDA00033073280200001111
the node in the direction of the vertical welding toe line responds to the equivalent thermal structural stress of time domain shearing;
Figure BDA00033073280200001112
time-domain thermally equivalent structural stresses that are nodal responses.
As shown in fig. 7, the thermal structural stress and the thermal equivalent structural stress curve of the weld 1 at a certain time are shown. And obtaining a thermal equivalent structure stress counting spectrum of each node by adopting a rain flow counting method according to the time response thermal equivalent structure stress history of all nodes of the welding joint.
The step 4 is as follows:
and (3) carrying out hot-punching tests on the 12 test pieces at different temperatures, and recording the failure times of the test pieces. After a finite element model is established, loading is carried out according to the working condition of a hot stamping test, the stress range of the hot stamping equivalent structure is obtained after calculation, and the stress range and the failure times of the hot stamping equivalent structure are fitted into a main SN curve. Step 4 has two methods, when the component is very tiny and is not suitable for testing the temperature change of the single type welding joint on the component, the method 1 is used, otherwise, the method 2 is used.
The method comprises the following steps: a single complete electronic element is adopted to perform multiple temperature variation tests to fit a main SN curve:
4-1-1: in the test, a temperature load is loaded on the complete electronic component;
4-1-2: using different welding temperatures or temperature change working conditions to enable the electronic element to fail, and recording the working condition and failure times N under which failure occurs;
4-1-3: establishing a finite element simulation model according to the structure and the working condition in the previous step, using thermomechanical coupling transient thermal analysis simulation, and calculating the weak position of the welding seam of the electronic element according to the method in the step 3Stress variation range Delta S of thermal equivalent structureT；
4-1-4: repeating the steps 4-1-1 to 4-1-3, obtaining a plurality of thermal equivalent structure stress change ranges and corresponding failure times through a plurality of tests, and fitting the data into a main SN curve according to a least square method;
4-1-5: n,. DELTA.S, obtained on the basis of 4-1-2 and 4-1-4TAccording to the main SN curve N ═ Δ ST/Cd)1/hObtaining a thermally equivalent structural stress C of the electronic componentdAnd h constant.
The method 2 comprises the following steps: one weld joint of one type was tested to obtain the main SN curve. The same procedure as above, but replacing the test piece with a single solder joint of one type from a single complete electronic component.
The step 5 is as follows:
and (4) calculating the fatigue life cycle number of the electronic packaging welding joint to be 143 times according to the thermal equivalent structure stress counting spectrum obtained in the step (4) and the main S-N curve obtained in the step (three), and conforming to the actual hot-punching test. For example, fig. 8 is a life curve of one of the key weak welds along the weld, and fig. 9 is a cloud of heat impact cumulative damage life, resulting in 20 locations of the weakest point of the weld. Fig. 10 is an enlarged view of the location of the weakest point.
5-1: the thermal equivalent structure stress time history is compiled into a thermal equivalent structure stress counting spectrum of the time domain response of each node by a rain flow counting method, namely the ith order (i is 1,2 … k) equivalent thermal structure stress range
Figure BDA0003307328020000124
And the number of cycles ni；
5-2: substituting the counting spectrum into a calculation formula to obtain the failure fatigue life cycle number:
Figure BDA0003307328020000121
in the formula: cdAnd h is the test constant obtained in step 4.
NiIs composed of
Figure BDA0003307328020000122
Fatigue life cycle number of the lower weld joint;
5-3: the fatigue life of the weld, i.e., the cumulative fatigue damage ratio, can be predicted
Figure BDA0003307328020000123
And 6, if the requirement of the anti-fatigue design is not met, returning to the step one to modify parameters such as the size of a welding leg, the size of an electronic element, the hot stamping temperature, the time and the like again to improve the anti-fatigue design of the electronic package until the requirement of the anti-fatigue design is met.
The method for predicting the fatigue life of the electronic packaging welding joint through transient thermal analysis solves the problem of fatigue resistance design of the electronic packaging welding joint under the condition of considering temperature change, and effectively solves the problem that the traditional nominal stress method is difficult to obtain weld stress due to grid sensitive stress singularity under the condition of temperature change by calculating the thermal equivalent structure stress; the temperature change problem which cannot be solved by the traditional structural stress method is solved by providing the thermal equivalent structural stress; the problem that the main SN curve of the single welding joint of the electronic element is difficult to obtain is solved by performing a temperature change test on the whole test piece; the problems that the load spectrum cannot be loaded under the temperature change condition, nonlinear calculation and the like are solved by a method for responding the thermal equivalent structure stress response counting spectrum. The method can effectively improve the accuracy of evaluating the fatigue cycle times of the electronic packaging welding joint. Weak positions and service lives can be further obtained by obtaining thermal structure stress curves and time domain curves along welding seams, and then model improvement design is continuously modified until a structure meeting the fatigue strength requirement is designed.
The method reduces the cost of the technical scheme of repeated tests, improves the prediction precision, and greatly saves the time and the cost of the anti-fatigue design of the electronic package. The invention has universality for the electronic packaging welding joint structure under the thermal shock working condition, can be used for various welding such as brazing, reflow welding, array spot welding and the like, and can be widely applied to the field of electronic packaging.
The present invention has been described with reference to embodiments, and it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, it is intended that the invention not be limited to the particular embodiment disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.

Claims (7)

1.一种瞬态热分析电子封装焊接接头的疲劳寿命预测方法，其特征在于：包括以下步骤：1. a fatigue life prediction method of transient thermal analysis electronic package welding joint, is characterized in that: comprise the following steps: 步骤1：构建含焊接接头的电子封装元件的几何模型和有限元模型，包括以下步骤：Step 1: Build the geometric model and finite element model of the electronic package component with solder joints, including the following steps: 1-1、根据尺寸建立含焊接接头的电子封装元件的几何模型：几何模型采用三维建模方法，创建主体、电极片、基板和焊缝；1-1. Establish the geometric model of electronic packaging components with solder joints according to the size: the geometric model adopts the three-dimensional modeling method to create the main body, electrode sheet, substrate and welding seam; 1-2、建立含焊接接头的电子封装元件的有限元模型：将焊线处穿过厚度的切面同侧单元和节点设置为指定组合，设定沿焊线方向的单元集合和沿焊缝方向的节点集合；1-2. Establish a finite element model of electronic packaging components with solder joints: set the ipsilateral elements and nodes of the tangent plane at the welding line through the thickness to the specified combination, set the element set along the welding line direction and the direction along the welding seam set of nodes; 1-3、依据实际定义电子封装焊接接头各零部件的材料参数，拟合热冲击曲线；1-3. According to the actual definition of the material parameters of each component of the electronic package solder joint, fit the thermal shock curve; 步骤2：利用瞬态热分析计算电子封装焊接接头的节点力时域响应，包括以下步骤：Step 2: Calculate the nodal force time-domain response of the solder joints of the electronic package using transient thermal analysis, including the following steps: 2-1、拟合温度变化曲线：根据已知热冲击曲线图，选取曲线上节点坐标，每两个节点之间进行线性拟合，获得热冲击曲线的分段函数，将拟合出的温度变化分段函数设置为有限元软件中的时间-温度加载函数；2-1. Fitting the temperature change curve: According to the known thermal shock curve, select the node coordinates on the curve, and perform linear fitting between every two nodes to obtain the piecewise function of the thermal shock curve. The variation piecewise function is set as the time-temperature loading function in the finite element software; 2-2、基于步骤1所建有限元模型，依据仿真工况加载载荷边界条件；2-2. Based on the finite element model built in step 1, load the load boundary conditions according to the simulation conditions; 2-3、在有限元软件中设置瞬态热分析，包括载荷步数、载荷步长、每个载荷步的子步数作为仿真计算参数；2-3. Set the transient thermal analysis in the finite element software, including the number of load steps, the length of the load step, and the number of sub-steps of each load step as simulation calculation parameters; 2-4、利用热弾性有限元基本理论，求解单元节点力；2-4. Use the basic theory of thermal elastic finite element to solve the element nodal force; 2-5：设置有限元软件的输出包含“单元节点力”，输出穿过厚度的切面上所有节点的节点力瞬态响应时域值Fn(t)，当壳单元时还获取弯矩瞬态响应时域值Mn(t)，t为时间；2-5: Set the output of the finite element software to include "element nodal force", output the time domain value F n (t) of the nodal force transient response of all nodes on the tangent plane passing through the thickness, and also obtain the bending moment transient when the shell element is used. state response time domain value M n (t), t is time; 步骤3：计算焊接接头所有节点的热等效结构应力时域响应，包括以下步骤：Step 3: Calculate the thermally equivalent structural stress time domain response of all nodes of the welded joint, including the following steps: 3-1：在有限元分析结束后，获取有限元计算结果文件；3-1: After the finite element analysis is completed, obtain the finite element calculation result file; 3-2：读取有限元计算结果文件中的1-2中的焊缝设置的结果数据，包括节点编号、单元编号、节点坐标、单元类型、瞬态响应节点力Fn(t)和节点弯矩Mn(t)时域结果组成有限元结果集合；3-2: Read the result data of the weld setup in 1-2 in the finite element calculation result file, including node number, element number, node coordinates, element type, transient response node force F n (t) and node The time domain results of the bending moment M n (t) form a finite element result set; 3-3：通过3-2取得的节点力和弯矩时域结果，计算出焊缝合集中焊缝中性面节点力和节点弯矩瞬态时域结果。3-3: Calculate the transient time-domain results of nodal force and nodal bending moment on the neutral plane of the welded seam concentrated by the time-domain results of the nodal force and bending moment obtained in 3-2. 步骤4：通过温度变化试验获取电子封装焊接接头的主S-N曲线；Step 4: Obtain the main S-N curve of the electronic package solder joint through the temperature change test; 步骤5：利用步骤4得到的主S-N曲线，采用瞬态响应等效结构应力雨流计数方法获得每个节点的响应计数谱，进行寿命计算，对电子封装焊接接头的疲劳寿命进行评估；Step 5: Using the main S-N curve obtained in step 4, the response count spectrum of each node is obtained by using the transient response equivalent structural stress rainflow counting method, and the life calculation is performed to evaluate the fatigue life of the electronic package solder joint; 步骤6：如果不满足设计要求，返回步骤1改进设计。Step 6: If the design requirements are not met, go back to Step 1 to improve the design. 2.根据权利要求1所述的一种瞬态热分析电子封装焊接接头的疲劳寿命预测方法，其特征在于：所述步骤1-2中，实体单元采用八节点六面体或四面体3D网格，壳单元采用四边形或三边形2D网格，焊线处与母材的单元应沿穿过厚度的切面划分。2 . The method for predicting fatigue life of electronic packaging welded joints by transient thermal analysis according to claim 1 , wherein in the steps 1-2, the solid element adopts an eight-node hexahedron or a tetrahedral 3D mesh, 2 . The shell element adopts a quadrilateral or triangular 2D mesh, and the element between the weld line and the base metal should be divided along the tangent plane through the thickness. 3.根据权利要求1所述的一种瞬态热分析电子封装焊接接头的疲劳寿命预测方法，其特征在于：所述步骤2-4中，算法如下：3. The fatigue life prediction method of a transient thermal analysis electronic package solder joint according to claim 1, wherein: in the steps 2-4, the algorithm is as follows: 假设域内共有N个节点，那么节点位移为：Assuming that there are N nodes in the domain, the node displacement is: δ＝[N]{μ}δ=[N]{μ} 式中，[N]为形函数；In the formula, [N] is the shape function; {μ}为节点的位移向量；{μ} is the displacement vector of the node; 根据虚位移原理有：According to the virtual displacement principle:
Figure RE-FDA0003457491820000021
Figure RE-FDA0003457491820000021
 式中，
Figure RE-FDA0003457491820000022
为单元刚度矩阵；In the formula,
Figure RE-FDA0003457491820000022
is the element stiffness matrix;
Figure RE-FDA0003457491820000023
为单元热载荷；
Figure RE-FDA0003457491820000023
is the unit heat load;
Figure RE-FDA0003457491820000024
为单元质量矩阵；
Figure RE-FDA0003457491820000024
is the element mass matrix;
Figure RE-FDA0003457491820000025
为单元面力载荷；
Figure RE-FDA0003457491820000025
is the element surface load; {Fnd}e为单元节点力。{F nd } e is the element nodal force. 4.根据权利要求1所述的一种瞬态热分析电子封装焊接接头的疲劳寿命预测方法，其特征在于：所述3-3中，垂直于焊缝的节点力Fyn(t)、沿着焊缝的弯矩Mxn(t)，剪切节点力和剪切节点弯矩瞬态时域结果Fxn(t)、Myn(t)，在焊缝中面上获得热结构应力时域曲线,为热结构应力和剪切热结构应力：4. A kind of fatigue life prediction method of transient thermal analysis electronic package welding joint according to claim 1, it is characterized in that: in said 3-3, the nodal force F yn (t) perpendicular to the welding seam, along the Bending moment M xn (t) at the weld, shear nodal force and shear nodal moment transient time domain results F xn (t), M yn (t), when thermal structural stress is obtained on the mid-surface of the weld Domain curves for thermal structural stress and shear thermal structural stress:
Figure FDA0003307328010000026
Figure FDA0003307328010000026
Figure FDA0003307328010000027
Figure FDA0003307328010000027
 Fxn、Fyn是的中性面x、y轴节点力时间历程；F xn , F yn are the time histories of the nodal force on the x and y axes of the neutral plane; Myn、Mxn是中性面y、x轴节点弯矩时间历程； My yn and M xn are the time histories of the y and x-axis nodal moments of the neutral plane;
Figure FDA0003307328010000028
是垂直焊趾线方向的时域的热结构应力；
Figure FDA0003307328010000028
is the thermal structural stress in the time domain in the direction perpendicular to the weld toe line;
Figure FDA0003307328010000029
是垂直焊趾线方向的时域的热膜应力；
Figure FDA0003307328010000029
is the time-domain thermal film stress in the direction perpendicular to the weld toe line;
Figure FDA0003307328010000031
是垂直焊趾线方向的时域的热弯曲应力；
Figure FDA0003307328010000031
is the thermal bending stress in the time domain in the direction perpendicular to the weld toe line;
Figure FDA0003307328010000032
是沿焊趾线方向的时域的热剪切结构应力；
Figure FDA0003307328010000032
is the thermal shear structural stress in the time domain along the weld toe line;
Figure FDA0003307328010000033
是沿焊趾线方向的时域的热剪切膜应力；
Figure FDA0003307328010000033
is the thermal shear film stress in the time domain along the weld toe line;
Figure FDA0003307328010000034
沿焊趾线方向的时域的热剪切弯曲应力；
Figure FDA0003307328010000034
Thermal shear bending stress in the time domain along the weld toe line; d是板厚；d is the plate thickness; L是结构应力法中焊缝截面中面节点距离矩阵，开放型焊缝是：L is the nodal distance matrix in the midplane of the weld section in the structural stress method, and the open weld is:
Figure FDA0003307328010000035
Figure FDA0003307328010000035
 封闭型的焊缝是：Closed welds are:
Figure FDA0003307328010000036
Figure FDA0003307328010000036
 进一步，设置：Further, set:
Figure FDA0003307328010000037
Figure FDA0003307328010000037
Figure FDA0003307328010000038
Figure FDA0003307328010000038
 进一步，设置缺省的：Further, set the default:
Figure FDA0003307328010000039
Figure FDA0003307328010000039
Figure FDA0003307328010000041
Figure FDA0003307328010000041
 可选的，optional,
Figure FDA00033073280100000412
Figure FDA00033073280100000412
Figure FDA0003307328010000042
Figure FDA0003307328010000042
Figure FDA0003307328010000043
为时域载荷比参数项；
Figure FDA0003307328010000043
is the time domain load ratio parameter item; 进一步，求热等效结构应力时域响应值：Further, find the time-domain response value of thermally equivalent structural stress:
Figure FDA0003307328010000044
Figure FDA0003307328010000044
Figure FDA0003307328010000045
Figure FDA0003307328010000045
 当
Figure FDA0003307328010000046
时when
Figure FDA0003307328010000046
Time
Figure FDA0003307328010000047
Figure FDA0003307328010000047
 否则otherwise
Figure FDA0003307328010000048
Figure FDA0003307328010000048
 上式中：In the above formula: β为基于疲劳测试的法向应力和基于测试的剪切应力之间疲劳强度的比值常数。β is the fatigue strength ratio constant between the fatigue test-based normal stress and the test-based shear stress.
Figure FDA0003307328010000049
是垂直焊趾线方向的节点响应时域等效热结构应力；
Figure FDA0003307328010000049
is the time-domain equivalent thermal structural stress of the nodal response in the direction perpendicular to the weld toe line;
Figure FDA00033073280100000410
是垂直焊趾线方向的节点响应时域剪切等效热结构应力；
Figure FDA00033073280100000410
is the time-domain shear equivalent thermal structural stress of the nodal response in the direction perpendicular to the weld toe line;
Figure FDA00033073280100000411
为节点响应的时域热等效结构应力。
Figure FDA00033073280100000411
is the time-domain thermally equivalent structural stress of the nodal response. 5.根据权利要求1所述的一种瞬态热分析电子封装焊接接头的疲劳寿命预测方法，其特征在于：所述步骤4中，当元器件非常微小而不适合将其上单一类型焊接接头做温度变化试验时，方法如下：采用单个完整电子元件做多次温变试验拟合主SN曲线，包括以下步骤：5. The method for predicting fatigue life of solder joints of electronic packaging by transient thermal analysis according to claim 1, wherein in the step 4, when the components are very small and not suitable for single type solder joints on them When doing the temperature change test, the method is as follows: use a single complete electronic component to do multiple temperature change tests to fit the main SN curve, including the following steps: 4-1-1：试验中，将温度载荷加载到完整电子元件上；4-1-1: In the test, load the temperature load on the complete electronic component; 4-1-2：使用不同焊接温度或温度变化工况使电子元件失效，并记录产生失效的工况条件和失效次数N；4-1-2: Use different welding temperature or temperature change working conditions to make electronic components fail, and record the working conditions and failure times N; 4-1-3：根据上步的结构和工况建立有限元仿真模型，使用热机械耦合瞬态热分析仿真，依据步骤3方法计算出该电子元件的焊缝薄弱位置的热等效结构应力变化范围△ST；4-1-3: Establish a finite element simulation model according to the structure and working conditions of the previous step, use the thermomechanical coupling transient thermal analysis simulation, and calculate the thermal equivalent structural stress of the weak position of the weld of the electronic component according to the method of step 3 Variation range △S T ; 4-1-4：重复步骤4-1-1至4-1-3，得到热等效结构应力变化范围和对应的失效次数，按最小二乘法拟合这些数据为主SN曲线；4-1-4: Repeat steps 4-1-1 to 4-1-3 to obtain the thermally equivalent structural stress variation range and the corresponding failure times, and fit these data to the main SN curve according to the least squares method; 4-1-5：基于步骤4-1-2和4-1-4获得的N、△ST，根据主SN曲线N＝(△ST/Cd)1/h获得该电子元件的热等效结构应力Cd和h常数。4-1-5: Based on N and ΔS T obtained in steps 4-1-2 and 4-1-4, obtain the thermal value of the electronic component according to the main SN curve N=(ΔS T /C d ) 1/h Equivalent structural stress C d and h constants. 6.根据权利要求1所述的一种瞬态热分析电子封装焊接接头的疲劳寿命预测方法，其特征在于：所述步骤4中，采用一种类型的一个焊接接头做试验获取主SN曲线，包括以下步骤：6. The fatigue life prediction method of a transient thermal analysis electronic package solder joint according to claim 1, wherein in the step 4, a solder joint of a type is used to perform a test to obtain the main SN curve, Include the following steps: 4-1-1：试验中，将温度载荷加载到一种类型的一个焊接接头上；4-1-1: In the test, a temperature load is applied to a welded joint of one type; 4-1-2：使用不同焊接温度或温度变化工况使焊接接头失效，并记录产生失效的工况条件和失效次数N；4-1-2: Use different welding temperature or temperature change working conditions to make the welded joint fail, and record the working conditions and failure times N; 4-1-3：根据上步的结构和工况建立有限元仿真模型，使用热机械耦合瞬态热分析仿真，依据步骤3方法计算出焊接接头的焊缝薄弱位置的热等效结构应力变化范围△ST；4-1-3: Establish a finite element simulation model according to the structure and working conditions of the previous step, use the thermomechanical coupling transient thermal analysis simulation, and calculate the thermal equivalent structural stress change at the weak position of the welded joint according to the method in step 3 range △ ST ; 4-1-4：重复步骤4-1-1至4-1-3，得到热等效结构应力变化范围和对应的失效次数，按最小二乘法拟合这些数据为主SN曲线；4-1-4: Repeat steps 4-1-1 to 4-1-3 to obtain the thermally equivalent structural stress variation range and the corresponding failure times, and fit these data to the main SN curve according to the least squares method; 4-1-5：基于步骤4-1-2和4-1-4获得的N、△ST，根据主SN曲线N＝(△ST/Cd)1/h获得该焊接接头的热等效结构应力Cd和h常数。4-1-5: Based on the N, ΔST obtained in steps 4-1-2 and 4-1-4 , obtain the heat of the welded joint according to the main SN curve N=( ΔST /C d ) 1/h Equivalent structural stress C d and h constants. 7.根据权利要求1所述的一种瞬态热分析电子封装焊接接头的疲劳寿命预测方法，其特征在于：所述步骤5包括以下步骤：7. The fatigue life prediction method of a transient thermal analysis electronic package solder joint according to claim 1, wherein the step 5 comprises the following steps: 5-1：将热等效结构应力时间历程通过雨流计数法编制成每个节点的时域响应的热等效结构应力计数谱，即第i阶(i＝1,2…k)等效热结构应力范围
Figure FDA0003307328010000054
和循环次数ni；5-1: The thermal equivalent structural stress time history is compiled into the thermal equivalent structural stress count spectrum of the time domain response of each node by the rainflow counting method, that is, the i-th order (i=1,2...k) equivalent Thermal Structural Stress Range
Figure FDA0003307328010000054
and the number of cycles n i ; 5-2：将计数谱代入计算公式获得失效疲劳寿命循环次数：5-2: Substitute the count spectrum into the calculation formula to obtain the number of cycles of failure fatigue life:
Figure FDA0003307328010000051
Figure FDA0003307328010000051
 式中：Cd和h为步骤4中获得的试验常数；where: C d and h are the experimental constants obtained in step 4; Ni为
Figure FDA0003307328010000052
下焊接接头的疲劳寿命循环次数； Ni is
Figure FDA0003307328010000052
The number of fatigue life cycles of the lower welded joint; 5-3：可预测该焊缝疲劳寿命，即累积疲劳损伤比
Figure FDA0003307328010000053
5-3: The fatigue life of the weld can be predicted, that is, the cumulative fatigue damage ratio
Figure FDA0003307328010000053
CN202111207337.6A 2021-10-18 2021-10-18 Fatigue life prediction method for transient thermal analysis electronic packaging welding joint Pending CN114139409A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202111207337.6A CN114139409A (en) 2021-10-18 2021-10-18 Fatigue life prediction method for transient thermal analysis electronic packaging welding joint

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202111207337.6A CN114139409A (en) 2021-10-18 2021-10-18 Fatigue life prediction method for transient thermal analysis electronic packaging welding joint

Publications (1)

Publication Number Publication Date
CN114139409A true CN114139409A (en) 2022-03-04

Family

ID=80395092

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202111207337.6A Pending CN114139409A (en) 2021-10-18 2021-10-18 Fatigue life prediction method for transient thermal analysis electronic packaging welding joint

Country Status (1)

Country Link
CN (1) CN114139409A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114912319A (en) * 2022-05-05 2022-08-16 一汽解放汽车有限公司 Method and device for detecting fatigue life of welding structure and computer equipment
CN115358109A (en) * 2022-07-25 2022-11-18 南京航空航天大学 Maximum torque calculation method of ultrasonic motor based on finite element simulation analysis
CN115563931A (en) * 2022-09-28 2023-01-03 丽清汽车科技(上海)有限公司 A method to improve the life of the circuit board
CN115828700A (en) * 2022-12-19 2023-03-21 中国石油大学(华东) Welding joint residual stress efficient calculation method based on steady-state heat transfer analysis
CN115906312A (en) * 2022-11-11 2023-04-04 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） A Method for Analyzing the Impact Strength of Mechanical Structures
CN116793825A (en) * 2023-06-21 2023-09-22 哈尔滨工业大学 Clamp device suitable for fatigue test of T-shaped test piece welding head and failure mode evaluation method
CN118862480A (en) * 2024-07-10 2024-10-29 广东大工数值仿真研究院有限公司 A fatigue analysis method and system for metal and welded structures
CN120578966A (en) * 2025-05-27 2025-09-02 山东芯赛思电子科技有限公司 A life prediction method based on thermal analysis

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160084802A1 (en) * 2014-09-19 2016-03-24 King Fahd University Of Petroleum And Minerals Process for determining weld quality using flexural characteristics
WO2017063540A1 (en) * 2015-10-12 2017-04-20 阿特拉斯科普柯(南京)建筑矿山设备有限公司 Method for calculating hotspot stress at weld toe
CN107451368A (en) * 2017-08-08 2017-12-08 大连交通大学 Weld fatigue lifetime estimation method based on ANSYS platforms
CN110990972A (en) * 2019-12-03 2020-04-10 上海电气电站设备有限公司 Simplified evaluation method for thermal shock resistance of heat exchange tube and tube plate joint of photo-thermal heat exchanger
CN111283307A (en) * 2018-12-06 2020-06-16 中国商用飞机有限责任公司 A method, device, terminal equipment and storage medium for simulating welding
CN112199875A (en) * 2020-10-14 2021-01-08 北京航空航天大学 Component welding point random vibration fatigue life distribution prediction method based on rain flow method
CN112364550A (en) * 2020-12-11 2021-02-12 潍柴动力股份有限公司 Fatigue life prediction method and device for thin-wall welding structure

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20160084802A1 (en) * 2014-09-19 2016-03-24 King Fahd University Of Petroleum And Minerals Process for determining weld quality using flexural characteristics
WO2017063540A1 (en) * 2015-10-12 2017-04-20 阿特拉斯科普柯(南京)建筑矿山设备有限公司 Method for calculating hotspot stress at weld toe
CN107451368A (en) * 2017-08-08 2017-12-08 大连交通大学 Weld fatigue lifetime estimation method based on ANSYS platforms
CN111283307A (en) * 2018-12-06 2020-06-16 中国商用飞机有限责任公司 A method, device, terminal equipment and storage medium for simulating welding
CN110990972A (en) * 2019-12-03 2020-04-10 上海电气电站设备有限公司 Simplified evaluation method for thermal shock resistance of heat exchange tube and tube plate joint of photo-thermal heat exchanger
CN112199875A (en) * 2020-10-14 2021-01-08 北京航空航天大学 Component welding point random vibration fatigue life distribution prediction method based on rain flow method
CN112364550A (en) * 2020-12-11 2021-02-12 潍柴动力股份有限公司 Fatigue life prediction method and device for thin-wall welding structure

Non-Patent Citations (5)

* Cited by examiner, † Cited by third party
Title
兆文忠等: "《焊接结构抗疲劳设计理论与方法》", 30 June 2017, pages: 67 - 68 *
兆文忠等: "基于主S-N曲线法的焊接结构虚拟疲劳试验理论与应用", 《焊接学报》, 31 May 2014 (2014-05-31), pages 3 *
刘刚;王悦东;方吉;王剑;: "基于ANSYS瞬态分析的焊接结构振动疲劳分析方法研究", 农业装备与车辆工程, no. 09, 30 September 2017 (2017-09-30) *
程贤福等: "《ANSYS Workbench 16.0基础教程及实例分析》", 31 July 2017, pages: 1 - 7 *
马思群;田小龙;牛小伟;金辉;冯良波;: "基于试验模态验证的铁路敞车侧墙疲劳寿命预测", 大连交通大学学报, no. 06, 15 December 2017 (2017-12-15) *

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114912319A (en) * 2022-05-05 2022-08-16 一汽解放汽车有限公司 Method and device for detecting fatigue life of welding structure and computer equipment
CN115358109A (en) * 2022-07-25 2022-11-18 南京航空航天大学 Maximum torque calculation method of ultrasonic motor based on finite element simulation analysis
CN115563931A (en) * 2022-09-28 2023-01-03 丽清汽车科技(上海)有限公司 A method to improve the life of the circuit board
CN115906312A (en) * 2022-11-11 2023-04-04 武汉船用电力推进装置研究所（中国船舶重工集团公司第七一二研究所） A Method for Analyzing the Impact Strength of Mechanical Structures
CN115828700A (en) * 2022-12-19 2023-03-21 中国石油大学(华东) Welding joint residual stress efficient calculation method based on steady-state heat transfer analysis
CN116793825A (en) * 2023-06-21 2023-09-22 哈尔滨工业大学 Clamp device suitable for fatigue test of T-shaped test piece welding head and failure mode evaluation method
CN118862480A (en) * 2024-07-10 2024-10-29 广东大工数值仿真研究院有限公司 A fatigue analysis method and system for metal and welded structures
CN118862480B (en) * 2024-07-10 2025-03-14 广东大工数值仿真研究院有限公司 Fatigue analysis method and system for metal and welding structure
CN120578966A (en) * 2025-05-27 2025-09-02 山东芯赛思电子科技有限公司 A life prediction method based on thermal analysis
CN120578966B (en) * 2025-05-27 2025-12-30 山东芯赛思电子科技有限公司 A Lifetime Prediction Method Based on Thermal Analysis

Similar Documents

Publication Publication Date Title
CN114139409A (en) Fatigue life prediction method for transient thermal analysis electronic packaging welding joint
CN103559418B (en) A kind of electronic product task reliability degree calculation method based on fault physics
Lall et al. Smeared-property models for shock-impact reliability of area-array packages
Zhou et al. Vibration durability assessment of Sn3. 0Ag0. 5Cu and Sn37Pb solders under harmonic excitation
CN111745276B (en) A Fast Simulation Method for Residual Stress and Deformation of Resistance Spot Welding of Complex Sheet Metal Components
CN112199875A (en) Component welding point random vibration fatigue life distribution prediction method based on rain flow method
CN104462700A (en) Electronic Product Reliability Simulation Test Method Based on Fault Physics
Syed et al. A methodology for drop performance modeling and application for design optimization of chip-scale packages
Lu et al. Reliability analysis of flip chip designs via computer simulation
Addagarla et al. Finite element analysis of flip–chip on board (FCOB) assembly during reflow soldering process
Gao et al. Reliability analysis of PoP stacked solder joints under thermal cycling load based on the optimal equivalent model
CN120850545A (en) A computer cross-scale integrated analysis method based on multi-physics field coupling mechanism
Ghenam et al. Optimal performance and cost-effective design of BGA solder joints using a deterministic design optimization (DDO) under real operating conditions
Shetty Board level reliability assessment of thick FR-4 QFN assemblies under thermal cycling
Tunga et al. Predictive model development for life prediction of PBGA packages with SnAgCu solder joints
Palmer et al. Thermomechanical fatigue testing and analysis of solder alloys
CN117350244A (en) BGA package electromigration reliability assessment method based on Latin hypercube sampling
Olatunji et al. Durability of Copper Traces in Ball Grid Array (BGA) Assemblies under Sequential Harmonic Vibration and Temperature Cycling
Radi et al. Probabilistic study and optimization of a solder interconnect
Li et al. Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests
Ahmad et al. Solder joint shape prediction using a modified Perzyna viscoplastic model
Van Driel et al. Virtual prototyping and qualification of board level assembly
Krishnamurthy Experimental and Computational Board Level Reliability Assessment of Thick Board QFN Assemblies Under Power Cycling
Tsuyuki et al. Evaluation of Lifetime of Through-Hole Solder Joints Considering Mounting Process and Variation
Cheng et al. Effective thermal-mechanical modeling of solder joints

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
RJ01 Rejection of invention patent application after publication
RJ01 Rejection of invention patent application after publication

Application publication date: 20220304