CN114035704B - Circuit board structure, backlight module, display module and touch display module - Google Patents

Abstract

The application relates to the technical field of display, and this application embodiment provides a circuit board structure, backlight unit, display module assembly and touch-control display module assembly, and the circuit board structure includes flexible circuit board, first circuit hard board and second circuit hard board, and flexible circuit board includes laminating portion and kink. Because the orthographic projection of the first circuit hard board on the flexible circuit board covers the attaching part and covers at least part of the area of the bending part, the orthographic projection of the second circuit hard board on the flexible circuit board coincides with the attaching part, when the bending part of the flexible circuit board bends towards the second circuit hard board, the bending range of the bending part is increased, and the bending part is at least partially positioned under the first circuit hard board, the visual range of a visual area is ensured, and the space is saved.

Description

Circuit board structure, backlight module, display module and touch display module

technical field

The present application relates to the field of display technology, in particular to a circuit board structure, a backlight module, a display module and a touch display module.

Background technique

In the related art, the rigid-flex circuit board is laminated by arranging a flexible circuit board between two hard circuit boards. However, when it is applied to a display module, there is a bent portion of the flexible circuit board under the visible area of the display module, so that the visible range of the visible area is reduced.

Contents of the invention

Based on this, it is necessary to address the above technical problems and provide a circuit board structure, a backlight module, a display module and a touch display module to ensure the visible range of the visible area.

According to one aspect of the present application, the embodiment of the present application provides a circuit board structure, including:

A flexible circuit board, the flexible circuit board includes a bonding portion and a bending portion connected to the bonding portion, and the flexible circuit board has a first surface and a second surface oppositely disposed;

A first hard circuit board, the first hard circuit board is arranged on the first surface of the flexible circuit board, and the orthographic projection of the first hard circuit board on the flexible circuit board covers the bonding part , and cover at least a partial area of the bent portion; and

The second hard circuit board, the second hard circuit board is arranged on the second surface of the flexible circuit board, the orthographic projection of the second hard circuit board on the flexible circuit board and the bonding part coincide.

In one of the embodiments, the circuit board structure further includes a first adhesive layer disposed between the first rigid circuit board and the flexible circuit board;

The orthographic projection of the first adhesive layer on the flexible circuit board falls within the range of the bonding portion.

In one of the embodiments, the orthographic projection of the first adhesive layer on the flexible circuit board coincides with the bonding portion.

In one of the embodiments, the circuit board structure further includes a second adhesive layer disposed between the second hard circuit board and the flexible circuit board;

The orthographic projection of the second adhesive layer on the flexible circuit board falls within the range of the bonding portion.

In one of the embodiments, the orthographic projection of the second adhesive layer on the flexible circuit board coincides with the bonding portion.

In one of the embodiments, along the arrangement direction of the bonding portion and the bending portion, the orthographic outer contour of the first hard circuit board on the flexible circuit board has a The first side within the range of the portion; the orthographic outline of the second hard circuit board on the flexible circuit board has a second side close to the bending portion;

There is a preset distance between the first side and the second side.

In one of the embodiments, the preset distance is greater than 0.3 mm.

In one of the embodiments, the first hard circuit board is a Mini-LED backlight substrate.

According to another aspect of the present application, the embodiment of the present application provides a backlight module, including a chip and the above-mentioned circuit board structure;

The chip is connected to the first hard circuit board.

In one embodiment, the chip is a Mini-LED chip.

According to still another aspect of the present application, an embodiment of the present application provides a display module, including the above-mentioned backlight module.

According to another aspect of the present application, the embodiment of the present application provides a touch display module, including:

the above-mentioned display module; and

A touch module, the touch module is coupled to one side of the display module.

The above circuit board structure, backlight module, display module and touch display module, the circuit board structure includes a flexible circuit board, a first circuit rigid board and a second circuit rigid board, and the flexible circuit board includes a bonding part and a bending part . Since the orthographic projection of the first hard circuit board on the flexible circuit board covers the bonding portion and covers at least part of the bent portion, the orthographic projection of the second hard circuit board on the flexible circuit board coincides with the bonding portion, so that When the bending part of the flexible circuit board is bent towards the second hard circuit board, the bending range of the bending part is increased, and the bending part is at least partly located under the first hard circuit board, which not only ensures the visibility of the visible area range, and also saves space.

Description of drawings

Fig. 1 is a schematic structural diagram of a circuit board structure in an embodiment of the related art;

Fig. 2 is a schematic structural diagram of a circuit board structure in another embodiment of the related art;

Fig. 3 is a structural schematic diagram of a circuit board structure in another embodiment of the related art;

4 is a schematic structural diagram of a touch display module in an embodiment of the related art;

5 is a schematic structural diagram of a touch display module in another embodiment of the related art;

FIG. 6 is a schematic structural diagram of a circuit board structure in an embodiment of the present application;

FIG. 7 is a schematic structural diagram of a touch display module in an embodiment of the present application.

Brief description of component symbols:

10: circuit board structure 100: circuit hard board

101: The first circuit hard board 1011: Filling holes

102: Second circuit hard board 1021: Circuit wiring layer

200: flexible circuit board 210: bonding part

220: bending part 201: first surface

202: second surface 300: connector

20: chip 30: driver chip

40: Touch module 50: Cover

60: frame

a: the first adhesive layer b: the second adhesive layer

c: protective layer

x: layout direction s1: first side

s2: second side d: preset distance

N: non-visible area

Detailed ways

In order to make the above objects, features and advantages of the present application more obvious and understandable, the specific implementation manners of the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. Many specific details are set forth in the following description to facilitate a full understanding of the embodiments of the present application. It should be understood that the specific embodiments described here are only used to explain the present application, and are not intended to limit the present application. The embodiments of the present application can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without violating the connotation of the present invention. Therefore, the embodiments of the present application are not limited by the specific embodiments disclosed below. limits.

It can be understood that the terms "first", "second" and the like used in this application can be used to describe various technical terms herein, and should not be understood as indicating or implying relative importance or implicitly indicating the indicated technical features quantity. But unless otherwise specified, these technical terms are not limited by these terms. These terms are only used to distinguish one term from another. For example, the first fitting and the second fitting are different fittings without departing from the scope of the present application. In the description of the embodiments of the present application, "multiple" and "several" mean at least two, such as two, three, etc., unless otherwise specifically defined.

In the description of the embodiments of this application, unless otherwise specified and limited, the terms "installation", "connection", "connection", "fixation" and other terms should be understood in a broad sense, for example, it can be a fixed connection or It is a detachable connection, or integrated; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediary, it can be the internal communication of two components or the interaction relationship between two components, Unless expressly defined otherwise. Those of ordinary skill in the art can understand the specific meanings of the above terms in the embodiments of the present application according to specific situations.

In the description of the embodiments of the present application, unless otherwise specified and limited, the first feature may be in direct contact with the first feature or the second feature "on" or "under" the second feature. Indirect contact through intermediaries. Moreover, "above", "above" and "above" the first feature on the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the level of the first feature is higher than the level of the second feature . "Below", "under" and "under" the first feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature level is smaller than the second feature level.

It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present.

Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used in the description of the present application are only for the purpose of describing specific embodiments, and are not intended to limit the present application.

In order to facilitate the understanding of the technical solutions of the embodiments of the present application, some technical terms in the technical field to which the embodiments of the present application belong are briefly explained before explaining the specific implementation manners of the embodiments of the present application.

Mini-LED/Micro-LED, that is, LED miniaturization and matrix technology, refers to the integration of high-density, micro-sized LED arrays on the driving substrate, such as each pixel can be addressed and individually driven to light up to achieve display. Among them, Mini-LED is also called submillimeter light-emitting diode, which refers to LEDs with a grain size of about 100 microns or more. The size of Mini-LEDs is between traditional LEDs and Micro-LEDs, and the size is usually 100 microns-300 Micro-LED size is usually below 100 microns.

TDM, that is, full-fit touch display integrated module, belongs to the i/o device of the computer, that is, the input and output device. It is a kind of electronic file that is displayed on the screen through a specific transmission device and then reflected to the human eye. display tool.

OLED (Organic Light-Emitting Diode), also known as organic electroluminescence display, organic light-emitting semiconductor (Organic Electroluminescence Display, OLED). OLED is a current-type organic light-emitting device, which is a phenomenon of luminescence caused by injection and recombination of carriers, and the luminous intensity is proportional to the injected current. Under the action of an electric field in the OLED, the holes generated by the anode and the electrons generated by the cathode will move, inject into the hole transport layer and the electron transport layer respectively, and migrate to the light emitting layer. When the two meet in the light-emitting layer, energy excitons are generated, which excite light-emitting molecules and finally produce visible light.

According to the flexibility of the insulating layer, circuit boards can be divided into hard circuit boards and flexible circuit boards. When the electronic components are soldered to the hard circuit board, although the hard circuit board can provide better structural strength, its flexibility is not good. When the electronic components are soldered to the flexible circuit board, although the flexible circuit board has better flexibility, it cannot provide sufficient structural strength.

Therefore, a circuit board structure composed of a flexible circuit board and a rigid circuit board is proposed in the related art, which has both the flexibility of the flexible circuit board and the structural strength of the rigid circuit board. The circuit board structure in the related art will be described below with reference to the accompanying drawings.

Fig. 1 shows a schematic structural view of a circuit board structure 10 in an embodiment of the related art; Fig. 2 shows a schematic structural view of a circuit board structure 10 in another embodiment of the related art; Fig. 3 shows another embodiment of the related art A schematic structural diagram of the middle circuit board structure 10; for ease of description, only the parts related to the embodiment of the present application are shown.

Please refer to FIG. 1 , a circuit board structure 10 is provided in an embodiment of the related art, the circuit board structure 10 includes a circuit board 100 , a flexible circuit board 200 and a connector 300 , and the circuit board 100 is provided with a connector 300 , the flexible circuit board 200 is connected to the hard circuit board 100 by means of the connector 300 . Please refer to FIG. 2 , another embodiment of the related art provides a circuit board structure 10, the circuit board structure 10 includes a hard circuit board 100 and a flexible circuit board 200, and the hard circuit board 100 and the flexible circuit board 200 are respectively provided with The gold finger set, the hard circuit board 100 and the flexible circuit board 200 are bound together by means of the gold finger set structure. Please refer to FIG. 3 , another embodiment of the related art provides a circuit board structure 10, the circuit board structure 10 includes a flexible circuit board 200 and two circuit rigid boards 100, and the flexible circuit board 200 is arranged on the two circuit rigid boards 100 In between, press the three together again.

FIG. 4 is a schematic structural diagram of a touch display module in an embodiment of the related technology; for convenience of description, only the parts related to the embodiment of the present application are shown.

For ease of understanding, as shown in Figure 4, the upper part of the drawing is defined as the upper part, the lower part of the drawing is defined as the lower part, the left side of the drawing is defined as the left side, and the right direction outside of the drawing is defined as the right side. The upper side facing the user is the front side, and the lower side facing away from the user is the rear side. Subsequent diagrams follow the definition in FIG. 4 . It can be understood that the above definitions are for illustration only, and should not be construed as limiting the present application.

The aforementioned three circuit board structures 10 are all applied in the touch display module to realize signal transmission in the touch display module. Nowadays, the touch display module is developing toward integration, and the touch layer is integrated into the cover plate 50 or the display layer. Please refer to FIG. 4, the touch display module shown in FIG. The connected driver chip 30 , the chip 20 arranged above the hard circuit board 100 , the touch module 40 arranged above the chip 20 , the cover plate 50 and the frame body 60 arranged above the touch module 40 , and the hard circuit board 100 , the flexible circuit board 200 , the driver chip 30 , the chip 20 , the touch module 40 , and the cover 50 are all disposed in the frame body 60 . Wherein, the circuit board structure 10 in the touch display module adopts the structure in which the flexible circuit board 200 is bound to the hard circuit board 100 shown in FIG. 2 .

The inventors of the present application found that the flexible circuit board 200 cannot be bound to the hard circuit board 100 due to the limitation of the width and area of the touch display module during the design process. Moreover, the circuit board structure 10 shown in FIG. 1 cannot be used, that is, there is no place for placing the connector 300 on the circuit board 100 , and the connection between the flexible circuit board 200 and the circuit board 100 cannot be realized by means of the connector 300 . For the Mini TDM, its overall width and area will be smaller, and the flexible circuit board 200 cannot be bound to the hard circuit board 100 . If binding is forced, the pressing head performing the binding operation will touch the driving chip 30 and cause the driving chip 30 to be damaged.

FIG. 5 is a schematic structural diagram of a touch display module in another embodiment of the related art; for convenience of description, only the parts related to the embodiment of the present application are shown.

Please refer to FIG. 5 , another embodiment of related technology provides a touch display module, the touch display module includes a hard circuit board 100, a flexible circuit board 200, arranged under the hard circuit board 100 and connected to the hard circuit board 100 is electrically connected to the drive chip 30 , the chip 20 disposed above the hard circuit board 100 , the touch module 40 disposed above the chip 20 , the cover plate 50 and the frame body 60 disposed above the touch module 40 . The hard circuit board 100 , the flexible circuit board 200 , the driver chip 30 , the chip 20 , the touch module 40 and the cover plate 50 are all arranged in the frame body 60 . The hard circuit board 100 is provided with filling holes 1011 , and the chip 20 can be soldered to the positions corresponding to the filling holes 1011 . Meanwhile, the hard circuit board 100 is provided with a protective layer c to protect the chip 20 . Wherein, the circuit board structure 10 in the touch display module adopts the structure in which the flexible circuit board 200 is bound to the hard circuit board 100 shown in FIG. 3 . That is to say, the rigid circuit board 100 includes a first rigid circuit board 101 and a second rigid circuit board 102 , and the flexible circuit board 200 is disposed between the first circuit board and the second circuit board.

After further research by the inventors of the present application, it is found that although the circuit board structure 10 can save space, shorten the signal transmission distance, and simplify assembly requirements, the bending portion 220 of the flexible circuit board 200 will make the touch display module redundant. Viewing area N, causing the area of the viewing area to decrease.

FIG. 6 is a schematic structural diagram of a circuit board structure 10 in an embodiment of the present application; for convenience of description, only the parts related to the embodiment of the present application are shown.

Referring to FIG. 6 , an embodiment of the present application provides a circuit board structure 10 , the circuit board structure 10 includes a flexible circuit board 200 , a first hard circuit board 101 and a second hard circuit board 102 .

The flexible circuit board 200 includes a bonding portion 210 and a bending portion 220 connected to the bonding portion 210 , and the flexible circuit board 200 has a first surface 201 and a second surface 202 opposite to each other. The first hard circuit board 101 is disposed on the first surface 201 of the flexible circuit board 200 , and the orthographic projection of the first hard circuit board 101 on the flexible circuit board 200 covers the bonding portion 210 and at least a partial area of the bending portion 220 . The second hard circuit board 102 is disposed on the second surface 202 of the flexible circuit board 200 , and the orthographic projection of the second hard circuit board 102 on the flexible circuit board 200 coincides with the bonding portion 210 .

It should be noted that, taking FIG. 6 as an example, the “first surface 201 ” refers to the upper surface of the flexible circuit board 200 , and the “second surface 202 ” refers to the lower surface of the flexible circuit board 200 . It can be understood that the "first surface 201" includes the upper surface of the fitting part 210 and the upper surface of the bending part 220, and the "second surface 202" includes the lower surface of the fitting part 210 and the lower surface of the bending part 220. . The “orthographic projection of the first rigid circuit board 101 on the flexible circuit board 200 ” refers to the projection of the first rigid circuit board 101 on the flexible circuit board 200 in the vertical direction from top to bottom. “The orthographic projection of the first rigid circuit board 101 on the flexible circuit board 200 covers the bonding portion 210 and covers at least part of the bending portion 220” refers to the fact that the first rigid circuit board 101 extends to the bend of the flexible circuit board 200 Above the bent portion 220 , the length of the portion of the first hard circuit board 101 located above the bent portion 220 of the flexible circuit board 200 can be set according to usage requirements to meet different application scenarios. The "orthographic projection of the second rigid circuit board 102 on the flexible circuit board 200" refers to the projection of the first rigid circuit board 101 on the flexible circuit board 200 in the vertical direction from bottom to top.

The orthographic projection of the first hard circuit board 101 on the flexible circuit board 200 covers the bonding portion 210 and covers at least part of the bending portion 220, and the orthographic projection and bonding of the second hard circuit board 102 on the flexible circuit board 200 The portions 210 overlap, that is, the length of the first hard circuit board 101 in the left-right direction is longer than the length of the second hard circuit board 102 in the left-right direction. When the bending part 220 of the flexible circuit board 200 is bent toward the second hard circuit board 102, the part of the first hard circuit board 101 located above the bending part 220 of the flexible circuit board 200 increases the bending range of the bending part 220. , so that the bent portion 220 is at least partly located under the first hard circuit board 101 , which not only ensures the visible range of the visible area, but also saves space.

In some embodiments, please continue to refer to FIG. 6 , the circuit board structure 10 further includes a first adhesive layer a disposed between the first hard circuit board 101 and the flexible circuit board 200 , the first adhesive layer a is on the flexible circuit board 200 The orthographic projection on falls within the range of the bonding portion 210 . After further research by the inventors of the present application, it was found that since the flexible circuit board 200 is arranged on the plane of the circuit board structure 10 between the first circuit hard board 101 and the second circuit hard board 102, the flexible circuit board will be processed after the production is completed. The bending part 220 of the 200 is bent, so it is necessary to avoid the adhesive surface in advance. However, the orthographic projection of the first adhesive layer a on the flexible circuit board 200 falls within the range of the bonding portion 210, that is, the first adhesive layer a adheres to the upper surface of the bonding portion 210 of the flexible circuit board 200, and will not Adhesive to the upper surface of the bending portion 220 of the flexible circuit board 200 . Specifically, in some embodiments, the orthographic projection of the first adhesive layer a on the flexible circuit board 200 coincides with the bonding portion 210, so that the first hard circuit board 101 can be better bonded to the first part of the flexible circuit board 200. Surface 201.

It should be noted that, taking FIG. 6 as an example, "the orthographic projection of the first adhesive layer a on the flexible circuit board 200" means that the first adhesive layer a is on the flexible circuit board 200 in the vertical direction from top to bottom. projection. "The outer surface of the bent portion 220 of the flexible circuit board 200" refers to

In some embodiments, please continue to refer to FIG. 6 , the circuit board structure 10 further includes a second adhesive layer b disposed between the second hard circuit board 102 and the flexible circuit board 200 , and the second adhesive layer b is placed on the flexible circuit board 200 The orthographic projection on falls within the range of the bonding portion 210 . Similarly, after further research by the inventors of the present application, it was found that since the flexible circuit board 200 is arranged on the plane of the circuit board structure 10 formula between the first hard circuit board 101 and the second hard circuit board 102, after the production is completed, the The bending portion 220 of the flexible circuit board 200 is bent, so it is necessary to avoid the adhesive surface in advance. The orthographic projection of the second adhesive layer b on the flexible circuit board 200 falls within the range of the bonding portion 210, that is, the second adhesive layer b is adhered to the lower surface of the bonding portion 210 of the flexible circuit board 200, and will not Adhered to the lower surface of the bending portion 220 of the flexible circuit board 200 . Specifically, in some embodiments, the orthographic projection of the first adhesive layer a on the flexible circuit board 200 coincides with the bonding portion 210, so that the first hard circuit board 101 can be better bonded to the first part of the flexible circuit board 200. Surface 201.

It should be noted that, taking FIG. 6 as an example, "the orthographic projection of the first adhesive layer a on the flexible circuit board 200" means that the first adhesive layer a is on the flexible circuit board 200 in the vertical direction from top to bottom. projection.

In some embodiments, please continue to refer to FIG. 6 , along the arrangement direction x of the bonding portion 210 and the bending portion 220 , the outer contour of the orthographic projection of the first hard circuit board 101 on the flexible circuit board 200 has a The first side within the scope of the portion 220; the orthographic outline of the second hard circuit board 102 on the flexible circuit board 200, with a second side close to the bending portion 220; the first side and the second side There is a preset distance d between them. That is to say, the length of the first hard circuit board 101 along the arrangement direction x of the bonding portion 210 and the bending portion 220 is longer than that of the second circuit rigid board 102 along the arrangement direction x of the bonding portion 210 and the bending portion 220 The upper length is long. The first rigid circuit board 101 provides a bending range for the bending portion 220 of the flexible circuit board 200 , so that the bending portion 220 is at least partially located under the first rigid circuit board 101 . Specifically, in some embodiments, the preset distance d is greater than 0.3 mm, so that the display range in the Mini TDM can be maintained without increasing the width of the frame.

It should be noted that, taking FIG. 6 as an example, "arrangement direction x along the bonding part 210 and the bending part 220" refers to the horizontal direction from left to right, and "the first side" refers to the first circuit The orthographic projection of the first side end s1 (that is, the rightmost end shown in FIG. 6 ) of the rigid board 101 on the flexible circuit board 200, "the second side" refers to the second The orthographic projection of the side end s2 (that is, the rightmost end shown in FIG. 6 ) on the flexible circuit board 200 .

In some embodiments, the first hard circuit board 101 is a Mini-LED backlight substrate. Since the circuit board structure 10 can save space without reducing the scope of the visible area, it can meet the scenarios where Mini-LEDs are used.

Based on the same inventive concept, the embodiment of the present application also provides a backlight module, the backlight module includes a chip 20 and the circuit board structure 10 in the above embodiment, and the chip 20 is connected to the first hard circuit board 101 . In some embodiments, please continue to refer to FIG. 6. Taking FIG. 6 as an example, the chip 20 is disposed on the upper surface of the first hard circuit board 101, and the first hard circuit board 101 is provided with filling holes 1011. The chip 20 can be The filling hole 1011 is welded on the first hard circuit board 101 . In other embodiments, please continue to refer to FIG. 6, the upper surface of the first hard circuit board 101 is also provided with a protective layer c around the chip 20 to protect the chip 20, and the lower surface of the second hard circuit board 102 is provided with a driver chip. 30 , the driver chip 30 is signal-connected to the second hard circuit board 102 by means of the circuit wiring layer 1021 of the second hard circuit board 102 . Specifically, in some embodiments, the chip 20 is a Mini-LED chip 20.

Based on the same inventive concept, an embodiment of the present application further provides a display module, which includes the backlight module in the above embodiment. Therefore, due to the design of the circuit board structure 10, the area of the visible area can be reduced.

FIG. 7 is a schematic structural diagram of a touch display module in an embodiment of the present application; for convenience of description, only parts related to the embodiment of the present application are shown.

Based on the same inventive concept, the embodiment of the present application also provides a touch display module, the touch display module includes a touch module 40 and the display module in the above embodiment, the touch module 40 is coupled to the display module side. In some embodiments, please continue to refer to FIG. 7 in combination with FIG. 6. Taking FIG. The module also includes a frame body 60 , and the circuit board structure 10 , the chip 20 , the driver chip 30 , the touch module 40 and the cover plate 50 are all disposed in the frame body 60 . Therefore, the design of the circuit board structure 10 not only saves space, but also reduces the area that blocks the visible area, and can also be applied to miniaturized Mini TDMs.

In some embodiments, please continue to refer to FIG. 7 , the chip 20 may be configured as a photoelectric sensor, and correspondingly, the cover plate 50 may be configured as an OLED display panel. In this way, a light beam for identifying fingerprints can be emitted through the self-luminous property of the OLED display panel. In addition, in related technologies, a metal middle frame is usually used to fix fingerprints under the screen, and the hardware cost is high. In the aforementioned fingerprint identification method, the chip 20 is fixed in the filling hole 1011 of the first circuit board 101 , and the filling hole 1011 can provide support for the chip 20 and reduce hardware costs.

In some other embodiments, the circuit wiring layer 1021 of the second hard circuit board 102 can also be designed as a fingerprint sensing circuit, and correspondingly, the chip 20 can be a light source, and the light source can be a visible light source. An invisible light source (eg infrared light) is also possible.

It should be understood that the touch display module provided by the above embodiments can be applied to fields such as mobile phone terminals, bionic electronics, electronic skins, wearable devices, vehicle-mounted devices, Internet of Things devices, and artificial intelligence devices. For example, the above-mentioned touch display module can be applied to mobile terminals, tablets, palmtop computers, ipods, smart watches, laptop computers, televisions, monitors and the like.

The technical features of the above embodiments can be combined arbitrarily. To make the description concise, all possible combinations of the technical features in the above embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be It is considered to be within the range described in this specification.

The above-mentioned embodiments only represent several implementation modes of the present application, and the description thereof is relatively specific and detailed, but it should not be construed as limiting the scope of the patent for the invention. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the scope of protection of the patent application should be based on the appended claims.

Claims (10)

1. A circuit board structure, characterized in that, comprising: A flexible circuit board, the flexible circuit board includes a bonding portion and a bending portion connected to the bonding portion, and the flexible circuit board has a first surface and a second surface oppositely disposed; A first hard circuit board, the first hard circuit board is arranged on the first surface of the flexible circuit board, and the orthographic projection of the first hard circuit board on the flexible circuit board covers the bonding part , and cover at least a partial area of the bent portion; and The second hard circuit board, the second hard circuit board is arranged on the second surface of the flexible circuit board, the orthographic projection of the second hard circuit board on the flexible circuit board and the bonding part coincide; Wherein, along the arrangement direction of the bonding portion and the bending portion, the outer contour of the orthographic projection of the first hard circuit board on the flexible circuit board has a the first side; the orthographic outline of the second hard circuit board on the flexible circuit board has a second side close to the bending portion; There is a preset distance between the first side and the second side, and the preset distance is greater than 0.3 mm. 2. The circuit board structure according to claim 1, wherein the circuit board structure further comprises a first glue layer disposed between the first hard circuit board and the flexible circuit board; The orthographic projection of the first adhesive layer on the flexible circuit board falls within the range of the bonding portion. 3 . The circuit board structure according to claim 2 , wherein the orthographic projection of the first adhesive layer on the flexible circuit board coincides with the bonding portion. 4 . 4. The circuit board structure according to claim 1, characterized in that, the circuit board structure further comprises a second glue layer disposed between the second hard circuit board and the flexible circuit board; The orthographic projection of the second adhesive layer on the flexible circuit board falls within the range of the bonding portion. 5. The circuit board structure according to claim 4, wherein the orthographic projection of the second adhesive layer on the flexible circuit board coincides with the bonding portion. 6 . The circuit board structure according to claim 1 , wherein the first hard circuit board is a Mini-LED backlight substrate. 7. A backlight module, characterized in that it comprises a chip and the circuit board structure according to any one of claims 1-6; The chip is connected to the first hard circuit board. 8. The backlight module according to claim 7, wherein the chip is a Mini-LED chip. 9. A display module, comprising the backlight module according to claim 7 or 8. 10. A touch display module, characterized in that it comprises: The display module as claimed in claim 9; and A touch module, the touch module is coupled to one side of the display module.