CN114005811B - Double-sided plastic-packaged shielding packaging structure and processing method thereof - Google Patents
Double-sided plastic-packaged shielding packaging structure and processing method thereofInfo
- Publication number
- CN114005811B CN114005811B CN202110820323.5A CN202110820323A CN114005811B CN 114005811 B CN114005811 B CN 114005811B CN 202110820323 A CN202110820323 A CN 202110820323A CN 114005811 B CN114005811 B CN 114005811B
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- shielding film
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
本发明提供一种双面塑封的屏蔽封装结构及其加工方法，其中的双面塑封的屏蔽封装结构包括单体基板、设置在所述单体基板的上表面的上层芯片以及设置在所述单体基板的下表面的下层芯片；在所述单体基板的上表面设置有第一塑封层，在所述单体基板的下表面设置有第二塑封层，其中，所述第一塑封层覆盖所述上层芯片；并且，在所述第一塑封层的上表面以及所述单体基板的侧面上设置有第一树脂屏蔽薄膜。利用上述发明能够解决传统的双面塑封的屏蔽封装结构的加工效率低且制作成本高的问题。
This invention provides a double-sided plastic-encapsulated shielding packaging structure and its processing method. The double-sided plastic-encapsulated shielding packaging structure includes a single substrate, an upper chip disposed on the upper surface of the single substrate, and a lower chip disposed on the lower surface of the single substrate. A first plastic encapsulation layer is disposed on the upper surface of the single substrate, and a second plastic encapsulation layer is disposed on the lower surface of the single substrate. The first plastic encapsulation layer covers the upper chip. Furthermore, a first resin shielding film is disposed on the upper surface of the first plastic encapsulation layer and on the side surface of the single substrate. This invention solves the problems of low processing efficiency and high manufacturing cost of traditional double-sided plastic-encapsulated shielding packaging structures.
Description
Technical Field
The invention relates to the technical field of device packaging, in particular to a shielding packaging structure of double-sided plastic packaging and a processing method thereof.
Background
With the progress of technology, there is an increasing demand for electronic products with multiple functions and high integration of components. For electronic products such as mobile phones, the integration level of the electronic products needs to be improved as much as possible in a limited space, and the electronic products are packaged by adopting a classification device in the past and are gradually replaced by a high-density SiP integrated assembly technology. In packaging electronic products, a double-sided SMT (surface mount technology) and a plastic packaging technology (especially, double-sided packaging) are widely adopted in the industry.
At present, a double-sided packaging tool process with an EMI (electromagnetic interference) shielding function in the industry (such as Samsung, samsung) generally comprises the steps of firstly carrying out double-sided SMT on a whole substrate, then implanting balls, carrying out upper and lower Molding on the substrate, then adopting STRIP GRINDING (substrate grinding technology) to expose Solder Ball (solder balls on the substrate), then carrying out Laser sawing and Reflow so as to cut the substrate to form a single packaging structure, then adopting a UV (ultraviolet curing) protective adhesive tape with the adhesive thickness of 100-200um to protect the solder balls on the lower surface so as to prevent the solder balls on the lower surface from being overflowed, carrying out Sputtering on the single packaging structure to realize the shielding function, and finally removing the UV protective adhesive tape to finish the process flow.
Then, the existing shielding packaging technology of the double-sided plastic package has the following technical defects:
1. Because the vacuum sputtering is needed for shielding packaging, UPH (yield) is usually low, the surface thickness of the sputtering layer is usually about 6um, the side thickness is usually 2-3um, and the shielding effect of the sputtering layer with the structure on low-frequency signals is not ideal.
2. In order to prevent the solder balls or pads on the lower surface from being overflowed, a certain distance needs to be reserved from the solder balls or pads on the lower surface to the edge of the package to prevent sputtering short circuit, and the design can influence the further reduction of the package size.
3. Because the lower surface solder balls need to be coated with a UV protective tape or polyimide film tape to prevent the lower surface from being overflowed, the solder balls are cut into single packaging structures, placed in a Carrier of spraying, and sputtered. Therefore, the equipment investment of the whole production line is relatively large, the working efficiency of picking, placing and sputtering products is relatively low, and the cost is high.
4. UV protective tape is typically thicker, requiring a greater height than the solder balls, and thus more costly, requiring approximately $ 7-8 per substrate, greatly increasing the auxiliary cost of spatting.
5. The UV protection adhesive tape needs UV light irradiation, the reaction rate of the material is difficult to control, and therefore, the solder balls have the quality risk of residual adhesive.
6. In the Sputtering process, since a certain depth ratio is required for Sputtering, the Sputtering process can be used only for Conformal shielding (integral profile shielding) of products, and cannot be used for Compartmental shielding (interval shielding) of fine isolation.
7. In the routing process, if the coating is thicker, metal particles are easily attached to the product, and in order to avoid the risk of failure of the customer product, metal burrs (Spur) need to be removed. Obviously, such operations may further reduce the efficiency of the operation.
Based on the above technical problems, there is a need for a shielding packaging method of double-sided plastic packaging, which can significantly improve the working efficiency and reduce the manufacturing cost.
Disclosure of Invention
In view of the above problems, the present invention is to provide a double-sided plastic-encapsulated shielding packaging structure and a processing method thereof, so as to solve the problems of low processing efficiency and high manufacturing cost of the conventional double-sided plastic-encapsulated shielding packaging structure.
The shielding packaging structure of the double-sided plastic package comprises a single substrate, an upper chip arranged on the upper surface of the single substrate and a lower chip arranged on the lower surface of the single substrate, wherein a first plastic package layer is arranged on the upper surface of the single substrate, a second plastic package layer is arranged on the lower surface of the single substrate, the first plastic package layer covers the upper chip, and a first resin shielding film is arranged on the upper surface of the first plastic package layer and the side surface of the single substrate.
In addition, the preferred proposal is that a slot corresponding to the position of the grounding end on the single substrate is arranged in the first plastic sealing layer, a second resin shielding film is arranged in the slot,
One end of the second resin shielding film is connected with the first resin shielding film, and the other end of the second resin shielding film is connected with the grounding end.
In addition, it is preferable that the first resin shielding film and the second resin shielding film are both provided by vacuum lamination and infusion, and
The first resin shielding film is linked with the side surface of the single substrate to form conformal shielding, and the second resin shielding film is used for forming interval shielding.
Further, it is preferable that the first resin shielding film and the second resin shielding film each use a resin containing metal particles inside.
In addition, preferably, the surface of the lower chip is exposed out of the second plastic package layer or is flush with the surface of the second plastic package layer.
In addition, preferably, solder balls are arranged on the lower surface of the single substrate, and the tops of the solder balls are exposed out of the second plastic package layer.
On the other hand, the invention also provides a processing method of the shielding packaging structure of the double-sided plastic package, which comprises the following steps:
The upper chip and the lower chip are respectively attached to the corresponding positions of the upper surface and the lower surface of the integral substrate, and the upper surface and the lower surface of the integral substrate are subjected to plastic packaging to form a first plastic packaging layer covering the upper chip and a second plastic packaging layer covering the lower chip;
The method comprises the steps of carrying out laser cutting on a plastic-packaged integral substrate to form an upper surface half-cutting groove, wherein the upper surface half-cutting groove is used for dividing the integral substrate into at least two structural monomers, and two adjacent structural monomers are connected through a half-cutting reserved plastic-packaging part;
Performing resin shielding film lamination on the upper surface of the first plastic sealing layer, the side surface of the integral substrate and the inner wall of the upper surface half-cutting groove to form a first resin shielding film;
And grinding the lower surface of the integral substrate to remove the half-cut reserved plastic package part, so that each structural monomer is separated.
In addition, the laser cutting process of the integrated substrate after plastic packaging preferably comprises upper surface half-cutting and laser grooving, wherein the upper surface half-cutting is used for forming the upper surface half-grooving, the laser grooving is used for forming a grooving corresponding to the position of the grounding end on the substrate, and the processing method further comprises the following steps:
and pressing the resin shielding films in the grooves to form a second resin shielding film, wherein one end of the second resin shielding film is connected with the first resin shielding film, and the other end of the second resin shielding film is connected with the grounding end.
In addition, preferably, solder balls are further arranged on the lower surface of the integral substrate, and in the process of grinding the lower surface of the integral substrate,
And exposing the top of the solder ball outside the second plastic sealing layer, and exposing the surface of the lower chip outside the second plastic sealing layer or flush with the surface of the second plastic sealing layer.
In addition, preferably, after polishing the lower surface of the monolithic substrate, the polishing method further includes:
and removing the plastic package material at the edge of the solder ball through laser.
According to the technical scheme, the double-sided plastic-packaged shielding packaging structure and the manufacturing method thereof adopt a novel packaging structure, novel packaging materials and novel processing technology, and mainly comprise the steps of performing whole-board cutting in a mode of semi-cutting on the upper surface after whole double-sided packaging, performing press fit and solidification by adopting a resin material with shielding thermosetting property (mainly added with conductive metal particles) to form a shielding layer, and then forming a single packaging structure monomer in a mode of grinding the lower surface to expose solder balls. Firstly, because the shielding layer is arranged in a simple pressing mode, compression Molding (compression molding) equipment can be used for operation, the working efficiency can be obviously improved, sputtering technology and feeding and discharging equipment are not needed, in addition, the thickness of the shielding layer on the surface of the packaging can be increased to 30-40um, meanwhile, the thickness of the shielding layer on the side wall can be increased to 4-5um, so that the shielding effect is obviously improved, in addition, the upper surface half-cutting and Laser grooving are carried out by adopting Laser Cut, interval shielding and conformal shielding can be simultaneously formed, the manufacturing technology of interval shielding can be greatly simplified, and the cost is reduced. In addition, since the lower surface polishing method is adopted, quality risks such as sputtering metal particles are not easy to occur.
To the accomplishment of the foregoing and related ends, one or more aspects of the invention comprise the features hereinafter fully described and particularly pointed out in the claims. The following description and the annexed drawings set forth in detail certain illustrative aspects of the invention. These aspects are indicative, however, of but a few of the various ways in which the principles of the invention may be employed. Furthermore, the invention is intended to include all such aspects and their equivalents
Drawings
Other objects and attainments together with a more complete understanding of the invention will become apparent and appreciated by referring to the following description taken in conjunction with the accompanying drawings. In the drawings:
Fig. 1 is a front view cross-section of a shielding packaging structure of a double-sided plastic package according to an embodiment of the present invention;
Fig. 2 is a schematic diagram of upper chip mounting of a processing method of a double-sided plastic-encapsulated shielding package structure according to an embodiment of the invention;
fig. 3 is a schematic diagram of upper surface plastic packaging of a processing method of a double-sided plastic-packaged shielding packaging structure according to an embodiment of the invention;
fig. 4 is a schematic diagram of a lower chip mounting method of a processing method of a double-sided plastic-encapsulated shielding package structure according to an embodiment of the present invention;
fig. 5 is a schematic view of a lower surface plastic package of a processing method of a double-sided plastic-packaged shielding package structure according to an embodiment of the invention;
Fig. 6 is a schematic view of laser cutting of a processing method of a shielding packaging structure of a double-sided plastic package according to an embodiment of the invention;
Fig. 7 is a schematic resin shielding film lamination diagram of a processing method of a shielding packaging structure of a double-sided plastic package according to an embodiment of the invention;
Fig. 8 is a schematic view of grinding a lower surface of a processing method of a shielding packaging structure of a double-sided plastic package according to an embodiment of the invention;
Fig. 9 is a schematic view of removing solder ball edge molding compound in a processing method of a double-sided plastic-packaged shielding packaging structure according to an embodiment of the invention;
Fig. 10 is a final single product molding diagram of a processing method of a double-sided plastic-encapsulated shielding packaging structure according to an embodiment of the present invention;
The reference numerals comprise a single substrate 1, an upper chip 2, a first plastic sealing layer 3, a first resin shielding film 4, a second resin shielding film 5, a lower chip 6, a second plastic sealing layer 7, solder balls 8, an intermediate layer 9, a slot 10, an upper surface half slot 11, a positioning adhesive tape 12 and an integral substrate 13.
The same reference numerals will be used throughout the drawings to refer to similar or corresponding features or functions.
Detailed Description
In order to describe the structure of the double-sided plastic package shielding packaging structure of the present invention in detail, specific embodiments of the present invention will be described in detail with reference to the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is only for descriptive purposes, and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. Furthermore, if there are directions or positional relationships in the embodiments of the present invention as referred to by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., which are based on the directions or positional relationships shown in the drawings, this is merely for convenience of description and to simplify the description, and does not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In addition, the meaning of "and/or" as it appears throughout is meant to include three side-by-side schemes, for example, "A and/or B", including the A scheme, or the B scheme, or the scheme where A and B meet at the same time.
Fig. 1 shows a front view cross-section structure of a double-sided plastic-encapsulated shielding package structure according to an embodiment of the present invention, and according to fig. 1, the double-sided plastic-encapsulated shielding package structure provided in the embodiment of the present invention includes a single substrate 1, an upper chip 2 disposed on an upper surface of the single substrate 1, and a lower chip 6 disposed on a lower surface of the single substrate 1, where the single substrate 1 may be a circuit board, such as a PCB (english full name Printed Circuit Board, chinese name printed circuit board, which is a support for electronic components), for loading the upper chip 2 and the lower chip 6.
In addition, be provided with first plastic envelope 3 at the upper surface of monomer base plate 1, be provided with second plastic envelope 7 at the lower surface of monomer base plate 1, adopt the structure of two-sided plastic envelope, effectively protect the device, provide the reliability. The first plastic layer 3 covers the upper chip 2 and is used for protecting the upper chip 2.A first resin shielding film 4 is provided on the upper surface of the first molding layer 3 and the side surface of the single substrate 1, and the first resin shielding films 4 at two positions are connected. It should be noted that, the first resin shielding film 4 (and the second resin shielding film 5 described below) provided by the present invention are made of thermosetting resin materials with shielding function, and the thermosetting resin materials can be directly pressed onto the plastic layer or the single substrate 1 by compression molding equipment.
In addition, a slot 10 corresponding to the position of the grounding end arranged on the single substrate 1 is formed in the first plastic sealing layer 3, and a second resin shielding film 5 is pressed in the slot 10, wherein one end of the second resin shielding film 5 is connected with the first resin shielding film 4, and the other end of the second resin shielding film 5 is connected with the grounding end. The first resin shielding film 4 and the second resin shielding film 5 may be disposed at corresponding positions by direct vacuum pressing and pouring through a compression molding device, and the first resin shielding film 4 disposed on the first plastic layer 3 and the first resin shielding film 4 disposed on the side of the single substrate 1 are connected to form a conformal shielding. Because one end of the second resin shielding film 5 is connected with the first resin shielding film 4, and the other end is connected with the grounding end, the second resin shielding film 5 can form interval shielding, so that the manufacturing process of interval shielding can be greatly simplified, and the cost is reduced. In addition, it should be emphasized that the slot 10 may take any shape as long as the corresponding conductive properties and section shielding properties are satisfied.
In addition, it should be noted that, since the conventional thermosetting resin material does not have conductive performance, it generally does not have a corresponding shielding function, and in order to make the thermosetting resin material have a corresponding shielding function, metal particles (such as Ag, cu, etc.) need to be added into the thermosetting resin material, and after the metal particles are added, the thermosetting resin material has a corresponding shielding function, and still has a corresponding resin characteristic, so that the thermosetting resin material can be set by a direct vacuum pressing and pouring manner through a compression molding device.
In addition, in the actual use process, since the lower chip 6 on the single substrate 1 is usually disposed on the side close to the inner side of the device housing, it is not easy to directly contact with an external object to cause damage, so in the actual manufacturing process, the surface of the lower chip 6 can be exposed out of the second plastic sealing layer 7 or flush with the surface of the second plastic sealing layer 7, thereby enhancing the heat dissipation effect of the whole structure.
In a specific embodiment of the invention, solder balls 8 can be arranged on the lower surface of the single substrate 1, the tops of the solder balls 8 are exposed out of the second plastic sealing layer 7, and terminals (such as I/O port terminals) preset on the single substrate can be directly led out by arranging the solder balls 8, so that external equipment can be conveniently connected. Of course, for some terminals to be direct, a direct connection is required by itself, in which case their corresponding solder balls 8 may be directly connected through pads of solder balls 8 or interposer 9.
Corresponding to the double-sided plastic-packaged shielding packaging structure, the invention also provides a processing method of the double-sided plastic-packaged shielding packaging structure, and the processing and manufacturing of the double-sided plastic-packaged shielding packaging structure are realized through the processing method.
Specifically, fig. 2 to 10 are schematic diagrams showing steps of the flow of the processing method, and collectively shown in fig. 2 to 10, the processing method includes:
The upper chip 2 and the lower chip 6 are respectively mounted on the corresponding positions of the upper surface and the lower surface of the whole substrate 13 (which is an entire substrate, after being cut according to the requirement, the single substrate 1 is shaped) by adopting a Surface Mounting Technology (SMT), and the upper surface and the lower surface of the whole substrate 13 are subjected to plastic packaging and curing to form a first plastic packaging layer 3 covering the upper chip 2 and a second plastic packaging layer 7 covering the lower chip 6 (corresponding to fig. 1 to 4).
And then, carrying out laser cutting on the integrated substrate 13 after plastic packaging to form an upper surface half-cutting groove 11 from the upper surface of the first plastic packaging layer 3 to the middle position of the second plastic packaging layer 7, wherein the upper surface half-cutting groove 11 is used for dividing the integrated substrate 13 into at least two structural monomers (when overlooking from the upper side of the integrated substrate 13), and the two adjacent structural monomers are connected through a half-cutting reserved plastic packaging part (namely, a reserved non-second plastic packaging layer 7 below the upper surface half-cutting groove 11).
Then, resin shielding films are laminated and cured on the upper surface of the first plastic layer 3, the side surface of the integrated substrate 13, and the inner wall of the upper surface half slit 11 by a compression molding apparatus so that the thermosetting resin material is fixedly covered at the corresponding positions to form the first resin shielding film 4.
Finally, the upper surface of the integral substrate 13 is fixed on the positioning adhesive tape 12, then the lower surface of the integral substrate 13 is ground and thinned, along with the thinning of the second plastic sealing layer 7, the half-cut reserved plastic sealing part is continuously removed, and after the half-cut reserved plastic sealing part is completely removed, all the structural monomers are separated (corresponding to the separation of the substrate monomers).
Further, the process of performing laser cutting on the plastic-packaged integral substrate 13 mainly comprises two processes, namely an upper surface half-cut and a laser grooving, wherein the upper surface half-cut is used for forming an upper surface half-cut groove 11, the laser grooving is used for forming a grooving 10 corresponding to the position of a grounding end on the substrate, and the processing method further comprises the following steps:
the resin shielding film lamination is performed in the slit 10 to form the second resin shielding film 5 while the resin shielding film lamination is performed and cured on the upper surface of the first molding layer 3, the side surface of the integrated substrate 13, and the inner wall of the upper surface half slit 11 by the compression molding apparatus, wherein one end of the second resin shielding film 5 is connected to the first resin shielding film 4 and the other end of the second resin shielding film 5 is connected to the ground terminal.
Specifically, solder balls 8 are further provided on the lower surface of the entire substrate 13, and, in the course of polishing the lower surface of the entire substrate 13,
It is also possible to expose the top of the solder balls 8 outside the second plastic layer 7 and expose the surface of the underlying chip 6 outside the second plastic layer 7 or flush with the surface of the second plastic layer 7. By the design, the lower chip 6 can be exposed, and the heat dissipation effect is enhanced. In addition, after the lower surface of the whole substrate 13 is polished, the method further comprises the step of removing the plastic package material at the edge of the solder ball 8 by laser so as to reduce the influence of the plastic package material at the edge of the solder ball 8 on the solder ball 8.
After all the steps are completed, a plurality of single shielding packaging monomers can be formed, and at the moment, each monomer can be picked up and packaged.
It should be noted that the shielding packaging structure for double-sided plastic packaging and the processing method thereof provided by the invention can be used for double-sided plastic packaging structures, and can be used for single-sided plastic packaging structures by only performing half-cutting after single-sided plastic packaging, then performing vacuum film pressing and finally separating.
The shielding packaging structure and the processing method thereof for providing the double-sided plastic package according to the present invention are described above by way of example with reference to the accompanying drawings. It will be appreciated by those skilled in the art that various modifications may be made to the double sided plastic encapsulated shielding package and method of making the same as set forth above without departing from the spirit of the invention. Accordingly, the scope of the invention should be determined from the following claims.
Claims (8)
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| CN116960115A (en) * | 2023-07-26 | 2023-10-27 | 江苏柒捌玖电子科技有限公司 | A split-cavity electromagnetic shielding packaging structure and its manufacturing method |
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| CN110970296A (en) * | 2018-09-28 | 2020-04-07 | 株式会社迪思科 | Method for manufacturing semiconductor package |
| CN111684590A (en) * | 2018-02-01 | 2020-09-18 | 汉高知识产权控股有限责任公司 | Method for shielding system-in-package components from electromagnetic interference |
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| WO2005078796A1 (en) * | 2004-02-13 | 2005-08-25 | Murata Manufacturing Co., Ltd. | Electronic component and method for manufacturing the same |
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| CN111684590A (en) * | 2018-02-01 | 2020-09-18 | 汉高知识产权控股有限责任公司 | Method for shielding system-in-package components from electromagnetic interference |
| CN110970296A (en) * | 2018-09-28 | 2020-04-07 | 株式会社迪思科 | Method for manufacturing semiconductor package |
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