CN103811400A - Wafer support base - Google Patents

Abstract

The invention provides a wafer support base. The wafer support base comprises a support plate, a support rod and an inserting plate, wherein the support plate is taken as a holding platform of a wafer; the support rod is used for supporting the support plate; the first surface of the support plate is used for holding the wafer; the second surface of the support plate is provided with an opening; the first end of the support rod is inserted into the opening; the side wall of the support plate is provided with a slot; the slot is communicated with the opening; the inserting plate is arranged in the slot, and is fixedly connected with the support rod through a locking structure. By adopting the technical scheme, the first end of the support rod can be firmly fixed in the opening, the support rod is prevented from being separated from the support plate, and the firmness of the support rod fixed to the support plate is improved.

Description

Wafer Support Base

technical field

The invention relates to the field of semiconductors, in particular to a wafer support base.

Background technique

In the process of manufacturing integrated circuits, thin film coating technology is mostly used to grow different thin film layers on the surface of the wafer. The thin film coating technology includes physical vapor deposition (Physical Vapor Deposition, PVD), chemical vapor deposition (Chemical Vapor Deposition, CVD) and the like.

Referring to FIG. 1 , it shows a schematic diagram of a thin film coating equipment in the prior art. The thin film coating process is done in a coating chamber (not shown). Wherein, a lifting mechanism 10 is included in the coating chamber, and a wafer support base 20 for placing a wafer 30 to be coated is included. The wafer support base 20 includes a wafer placement platform 21, and is fixed on the wafer. A supporting rod (pin) 22 is placed below the platform 21 in a circle.

For example, in the CVD film coating process, after the wafer 30 is placed on the wafer placement platform 21, the wafer 30 is sent to a specific position by the lifting mechanism 10, and is transported into the coating chamber by the pipeline of the reaction gas in the coating chamber. gas to form a thin film layer on the surface of the wafer 30 .

In the existing wafer support base 20, the wafer placement platform 21 is fixedly connected with the support rod 22 by bonding, and its specific structure includes: opening a through hole on the wafer placement platform 21, and the support rod 22 inserted into the through hole, and the two are fixedly connected by an adhesive.

However, after a long time of use, the adhesive will age, and the adhesive will be easily melted at a higher temperature in the thin film coating process. The above defects have seriously affected the connection between the support rod 22 and the wafer placement platform 21 strength. During use, after the wafer 30 is placed on the wafer placement platform 21, the looseness of the support rods 22 and the wafer placement platform 21 will affect the unbalanced force of each support rod 22, thereby causing the wafer placement platform 21 Tilting occurs, causing the wafer 30 to slide down, what's more, the support rod 22 will fall off from the wafer placement platform 21, or the support rod 22 will break.

Therefore, how to improve the connection strength and stability of the wafer placement platform 21 and the poles 22 of the wafer support base 20 is an urgent problem to be solved by those skilled in the art.

Contents of the invention

The problem to be solved by the present invention is to provide a wafer support base, which can effectively improve the connection strength and stability of the wafer placement platform and the pole.

In order to solve the above problems, the present invention provides a wafer support base, comprising:

A support plate, the support plate includes a first surface, a second surface, and a side wall surrounding the first surface and the second surface, the first surface is used to place a wafer; the second surface of the support plate A hole is provided; a slot is provided on the side wall of the support plate, and the slot communicates with the hole;

a strut including a first end, the first end being located in the opening;

The inserting plate is arranged in the slot and is fixedly connected with the first end of the pole through a locking structure.

Optionally, the locking structure includes: a slot opened at the first end of the pole, and the insertion plate is inserted into the slot towards the top of the pole.

Optionally, the locking groove is an annular groove centered on the central axis of the pole.

Optionally, the strut is cylindrical.

Optionally, the support rod has a first diameter inside the slot, and has a second diameter outside the slot, and the locking structure further includes: opening at the end of the plug-in plate and facing toward the support rod notches;

The opening diameter of the notch is greater than or equal to the first diameter and smaller than the second diameter.

Optionally, the ratio of the first diameter to the second diameter is 4/5˜9/10.

Optionally, the depth of the notch is greater than or equal to 1/2 of the first diameter.

Optionally, the wafer support base further includes: a board fixing device, configured to fix the board in the support plate.

Optionally, the board fixing device includes: a lock hole opened on the first surface of the support plate, the lock hole communicates with the slot;

A locking nail located in the first locking hole, the top end of the locking nail is against the insertion plate.

Optionally, the board fixing device includes: a lock hole opened on the first surface of the support plate, the lock hole communicates with the slot;

A locking nail located in the first locking hole, the locking nail passing through the board.

Compared with the prior art, the technical solution of the present invention has the following advantages:

The wafer support base includes a support plate, a pole mounted on the support plate and a plug-in plate; the support plate is used as a placement platform for the wafer, and the first surface of the support plate is used to place the wafer, and the pole used to support the supporting board. Wherein, the second surface of the support plate is provided with an opening, and the first end of the pole is located in the opening; a slot is provided on the side wall of the support plate, and the slot communicates with the opening. The inserting board is located in the slot, and the inserting board is fixedly connected with the first end of the pole through a locking structure. The inserting plate is fixedly connected by locking the first end of the strut in the structural domain, which can firmly fix the strut in the opening, prevent the strut from detaching from the support plate, and improve the fixation of the strut on the support plate firmness and stability.

Further, the locking mechanism includes a slot provided on the first end of the pole, and the slot is an annular structure centered on the central axis of the pole, and the insertion plate is inserted toward the pole. In the card slot, the convenience of fixing the top of the pole in the support plate can be improved.

Further, a notch is provided at the end of the inserting plate facing the pole, and the notch can be inserted into the slot, thereby improving the strength of the pole fixed in the support plate and preventing the pole from detaching from the support plate .

Further, the wafer support base also includes a board fixing device for fixing the board on the support board, and the board fixing device can effectively improve the stability of the board in the support board. Fix the strength to avoid displacement of the board, so as to improve the connection strength between the board and the pole.

Description of drawings

Fig. 1 is the schematic diagram of a kind of thin film coating equipment of prior art;

Fig. 2 is an exploded view of an embodiment of the wafer support base of the present invention;

FIG. 3 is a schematic diagram of the structure of the assembled wafer support base in FIG. 2;

FIG. 4 is a schematic structural view of the support rod and the insert plate of the wafer support base in FIG. 2;

5 is a schematic structural view of a support plate of another embodiment of the wafer support base of the present invention;

6 is an exploded view of another embodiment of the wafer support base provided by the present invention;

FIG. 7 is a schematic diagram of the structure of the assembled wafer support base in FIG. 6;

FIG. 8 is a schematic structural view of the support plate of the wafer support base in FIG. 6;

FIG. 9 is a schematic structural diagram of the board in FIG. 6 .

Detailed ways

As mentioned in the background technology, in the existing wafer support base, the poles are fixed in the wafer placement platform by means of adhesive, but the aging phenomenon of the adhesive will occur after a long period of use, or during use , based on the higher temperature conditions of the thin film coating process, the adhesive will melt, which will affect the connection strength between the support rod and the wafer placement platform, resulting in loosening between the support rod and the wafer placement platform. During use, the looseness between the support rods and the wafer placement platform will cause the difference in force between the support rods, which will cause the wafer placement platform to tilt, causing the wafer to slip; what's more, the support rods will be pulled by the wafer. The placement platform falls off, or the pole breaks due to the difference in force between the poles.

In order to solve the above-mentioned technical problems, the present invention provides a wafer support base to improve the connection strength and stability of the wafer placement platform and the support rods, so as to prevent the support rods from falling off from the wafer placement platform and reduce the Probability of strut breakage due to connection strength problems of the circular placement platform.

In order to make the above objects, features and advantages of the present invention more comprehensible, specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

2 to 4 are structural schematic diagrams of an embodiment of the wafer support base provided by the present invention.

Wherein, FIG. 2 is an exploded view of the structure of the wafer support base provided in this embodiment, and FIG. 3 is a schematic diagram of the assembled structure of the wafer support base in FIG. 2 .

Referring to FIG. 2 , the wafer support base provided by this embodiment includes a support plate 100 and a support rod 200 installed on the support plate 100 for supporting. There are a plurality of poles 200 installed on the support board 100 , and only one pole is shown in the figure to show the connection structure between the poles 200 and the support board 100 more clearly.

In this embodiment, the support plate 100 functions as a wafer placement platform for placing wafers. The support plate 100 includes a lower surface 110 (ie, a first surface) and an upper surface 120 (ie, a second surface), the upper surface 120 of the support plate 100 is used to place a wafer, and the support rod 200 is fixed on the lower surface of the support plate 100 . The specific connection structure between the support plate 100 and the pole 200 includes:

The lower surface 110 of the support plate 100 is provided with an opening 101, the opening 101 is matched with the structure of the pole 200 of the wafer support base, the pole 200 includes a first end 202, and the pole 200 The first end 202 of 200 is inserted into the opening 101 .

A slot 102 is opened on a side wall of the support plate 100 , and the opening 101 communicates with the slot 102 .

The board 300 is disposed in the slot 102 and matches the structure of the slot 102 . The insert plate 300 can be inserted into the support plate 100 through the slot 102, and the insert plate 300 is fixedly connected to the pole 200 through a locking structure, so that the pole 200 is firmly fixed on the support plate 100.

A plurality of openings 101 are opened on the lower surface 110 of the support plate 100 for installing a plurality of poles 200 . A plurality of slots 102 corresponding to the openings 101 are provided on the side wall of the support plate 100 , and inserting boards are installed in each slot 102 to fix each pole 200 .

With reference to Figure 4, the locking structure includes:

The card slot 201 provided on the first end 202 of the support rod 200 corresponds to the position of the slot 102 , and after the plug-in board 300 is inserted into the slot 102 , the plug-in board 300 faces the slot 102 The top end of the support rod 200 is inserted into the slot 201, so that the first end 202 of the support rod 200 is locked in the opening 101, so that the support rod 200 cannot be pulled out in the axial direction.

In this embodiment, the clamping groove 201 is an annular structure centered on the central axis of the support rod 200 , specifically, the clamping groove 201 of the annular structure surrounds the central axis of the support rod 200 , with a front-to-tail contiguous structure. The card slot 201 in the ring structure facilitates the alignment of the insertion board 300 with the card slot 201 .

But in other embodiments except this embodiment, the card slot can also be a structure similar to an opening, the top of the board is inserted into the slot, and the board and the slot are equivalent to a pin structure . When compared with the present embodiment, when the pin structure is used, the positioning of the slot and the inserting plate is troublesome.

In the field of semiconductor manufacturing, the material of the strut 200 is mostly made of ceramics and other materials with poor thermal conductivity and electrical conductivity. Like ceramics, it is brittle and has a smooth surface. In addition, the cross-sectional diameter of the strut 200 is also small. For this reason, if the depth of the slot 201 on the pole is too small, the fixing strength of the insert plate 300 to the pole 200 will be reduced; if the depth of the slot 201 is too large, the pole in the slot 201 will be too thin and easy to break.

In this embodiment, the support rod 200 is a cylindrical structure, the diameter of the support rod 200 inside the slot 201 is the first diameter d4, and the diameter of the support rod 200 outside the slot 201 is is the second diameter d2, the depth d3 of the locking groove 201 perpendicular to the axial direction of the support rod 200, the ratio of d4:d2 is 4/5-9/10, that is, the ratio of d3 to d2 is 1/10-1 /20. For example, in this embodiment, the second diameter d2 of the support rod 200 is about 2 mm, and the depth d3 of the locking groove 201 perpendicular to the axial direction of the support rod 200 is 0.1-0.2 mm. The diameter d4 of the rod 200 inside the slot 201 is 1.6mm˜1.8mm.

In an optional solution, the locking structure further includes: a notch 301 provided on the top end of the clamping plate 300 facing the pole 200 , the notch 301 matching the structure of the locking groove 201 .

In this embodiment, the notch 301 is in the shape of a circular arc that matches the structure of the pole 200 , the inner side of the notch 301 is inserted into the slot 201 , and is aligned with the side wall of the pole 200 . fit together. Optionally, the opening diameter d1 of the notch 301 is greater than or equal to the inner diameter d4 of the pole 200 in the slot 201 , and smaller than the diameter d2 of the pole 200 outside the slot 201 .

In an optional solution, the depth h2 of the notch 301 (the distance from the innermost side of the notch 301 to the top end surface of the insert plate 300 facing the pole 200 ) is greater than or equal to that of the pole in the slot 201 1/2 of the first inner diameter d4, ie h2≥0.5×d4. In this way, the notch 301 at least partially surrounds the slot 201 , thereby effectively improving the fixing strength of the inserting plate 300 to the pole 200 .

In addition, as shown in FIG. 2 , the thickness h3 of the inserting plate 300 along the axial direction of the pole 200 is equal to the depth h4 of the slot 201 along the axial direction of the pole 200 . After the top end is inserted into the card slot 201 , the insertion plate 300 can be in close contact with the pole 200 , thereby reducing the movement of the pole 200 in the axial direction and improving the stability of the pole 200 .

2 and 3, in use, the first end 202 of the pole 200 is inserted into the opening 101 of the support plate 100, and the slot 201 of the pole 200 is connected to the support plate. The position of the slot 102 of 100 is opposite; insert the board 300 from the slot 102 into the support board 100, and the notch 301 at the top of the board 300 is inserted into the slot 201 of the pole 200, so that Lock the first end 202 of the pole 200 in the opening 101 .

In addition to this embodiment, the opening 101 of the support plate 100 can also pass through the upper and lower surfaces of the support plate 100. This structure allows the support rod 200 to be inserted from the upper surface or the lower surface of the support plate 100. The support plate 100 .

In addition, in this embodiment, the support rod 200 is cylindrical. In other embodiments except this embodiment, the support rod 200 can also be a regular prism or other columnar structures. These simple changes are all within the protection scope of the present invention.

In another embodiment of the present invention, the wafer support base further includes a board fixing device, which is used to fix the board 300 on the support board 100, so as to improve the speed of the board 300 on the board The fixing strength in the groove 102 further improves the stability of the strut 200 in the support plate 100 .

As shown in conjunction with reference to Figures 6 to 9, the board fixing device includes:

6 and 8, the first lock hole 104 opened on the lower surface 110 of the support plate 100, the first lock hole 104 communicates with the slot 102, and is in the first lock hole 104. A locking nail 400 is installed in the locking hole 104 , and the top end of the locking nail 400 extends into the slot 102 .

In use, when the plugboard 300 is inserted into the slot 102, the locking pin 400 is inserted into the first locking hole 102, and the top end of the locking pin 400 extends into the slot 102, and The top end of the locking pin 400 is against the plug board 300 , thereby improving the stability of the plug board 300 fixed in the slot 102 .

In this embodiment, the first locking hole 104 may be a threaded hole, and internal threads are provided on the inner wall of the first locking hole 104; The internal thread structure of the first lock hole 104 is matched with the external thread, thereby improving the connection strength between the locking nail 400 and the support plate 100 .

6 and FIG. 9, optionally, a second lock hole 302 is provided on the board 300. When the board 300 is inserted into the slot 102, the second lock hole 302 Corresponding to the position of the first locking hole 104 , the top end of the locking nail 400 can be fixed in the second locking hole 302 .

Optionally, the second locking hole 302 runs through the plugboard 300 , and the top end of the locking nail 400 can go through the plugboard 300 .

Further optionally, the second lock hole 302 can be a threaded hole structure, and the inner wall of the second lock hole 302 is provided with an internal thread that matches the external thread structure of the locking nail 400, thereby improving the lock. The strength and stability of the connection between the nail 400 and the board 300.

As shown in FIG. 6 and FIG. 7 , in use, after the insertion plate 300 is inserted into the support plate 100 , the locking nail 400 is placed in the first locking hole 104 , and the locking nail The top end of 400 protrudes into the second locking hole 302 of the board 300 to securely lock the board 300 in the slot 102 .

It should be noted that in this embodiment, the first lock hole 104 is opened on the lower surface 110 of the support plate 100, and in other embodiments except this embodiment, the first lock hole 104 can also be opened On the upper surface 120 of the support plate 100, it does not affect the protection scope of the present invention. However, compared with the technical solution of setting the first lock hole 104 on the upper surface 120 of the support plate 100, during use, the upper surface 120 of the support plate 100 is directly used to place the wafer, therefore, the first lock hole The technical solution in which the holes 104 are opened on the lower surface 110 of the support plate 100 can effectively improve the flatness of the upper surface 120 of the support plate 100 , thereby avoiding wafer damage.

Although the present invention is disclosed above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, so the protection scope of the present invention should be based on the scope defined in the claims.

Claims (10)

1. a wafer support pedestal, is characterized in that, comprising:

Supporting bracket, described supporting bracket comprises first surface, second surface, and around the sidewall of described first surface and second surface, described first surface is used for placing wafer; The second surface of described supporting bracket offers perforate; The sidewall of described supporting bracket offers slot, and described slot and described perforate communicate;

Pole, comprises first end, and described first end is positioned at described perforate;

Plate, is arranged in described slot, is fixedly connected with the first end that is positioned at described pole by locking mechanism.

2. wafer support pedestal as claimed in claim 1, is characterized in that, described locking mechanism comprises: be opened in the draw-in groove of described pole first end, described plate is in the top of described pole is inserted into described draw-in groove.

3. wafer support pedestal as claimed in claim 2, is characterized in that, described draw-in groove is the loop configuration centered by described pole central shaft.

4. wafer support pedestal as claimed in claim 3, is characterized in that, described pole is cylindrical.

5. wafer support pedestal as claimed in claim 4, is characterized in that, described pole has the first diameter in draw-in groove, has Second bobbin diameter outward at described draw-in groove; Described locking mechanism also comprises: be opened in the end of plate, and towards the recess of described support bar;

The opening bore of described recess is more than or equal to described the first diameter, and is less than described Second bobbin diameter.

6. wafer support pedestal as claimed in claim 5, is characterized in that, described the first diameter is 4/5～9/10 with the ratio of described Second bobbin diameter.

7. wafer support pedestal as claimed in claim 5, is characterized in that, the degree of depth of described recess is more than or equal to 1/2 of described the first diameter.

8. wafer support pedestal as claimed in claim 1, is characterized in that, described wafer support pedestal also comprises: plate fixture, and for described plate is fixed on to described supporting bracket.

9. wafer support pedestal as claimed in claim 8, is characterized in that, described plate fixture comprises: be opened in the lockhole of described supporting bracket first surface, described lockhole communicates with described slot;

Be positioned at the pinning of described lockhole, described pinning top props up described plate.

10. wafer support pedestal as claimed in claim 8, is characterized in that, described plate fixture comprises: be opened in the lockhole of described supporting bracket first surface, described lockhole communicates with described slot;

Be positioned at the pinning of described the first lockhole, described pinning runs through described plate.

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