CN103817434B - Dual laser beam system used with an FIB and/or electron microscope - Google Patents
Dual laser beam system used with an FIB and/or electron microscope Download PDFInfo
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- CN103817434B CN103817434B CN201310564270.0A CN201310564270A CN103817434B CN 103817434 B CN103817434 B CN 103817434B CN 201310564270 A CN201310564270 A CN 201310564270A CN 103817434 B CN103817434 B CN 103817434B
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical, image processing or photographic arrangements associated with the tube
- H01J37/226—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/1224—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/02—Details
- H01J37/22—Optical, image processing or photographic arrangements associated with the tube
- H01J37/226—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object
- H01J37/228—Optical arrangements for illuminating the object; optical arrangements for collecting light from the object whereby illumination or light collection take place in the same area of the discharge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/305—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching
- H01J37/3053—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching
- H01J37/3056—Electron-beam or ion-beam tubes for localised treatment of objects for casting, melting, evaporating, or etching for evaporating or etching for microworking, e. g. etching of gratings or trimming of electrical components
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/30—Electron-beam or ion-beam tubes for localised treatment of objects
- H01J37/31—Electron-beam or ion-beam tubes for localised treatment of objects for cutting or drilling
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/30—Electron or ion beam tubes for processing objects
- H01J2237/317—Processing objects on a microscale
- H01J2237/31749—Focused ion beam
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Welding Or Cutting Using Electron Beams (AREA)
Abstract
The present invention discloses an electron microscope and FIB system for processing and imaging of a variety of materials using two separate laser beams of different characteristics. The first laser beam is used for large bulk material removal and deep trench etching of a workpiece. The second laser beam is used for finer precision work, such as micromachining of the workpiece, small spot processing, or the production of small heat affected zones. The first laser beam and the second laser beam can come from the same laser source or come from separate laser sources. Having one laser source has the additional benefits of making the system cheaper and being able to create separate external and internal station such that the debris generated from bulk material removal from the first laser beam will not interfere with vacuum or components inside the particle beam chamber.
Description
Inventive technique field
The present invention relates to a kind of configuration of laser processing tool, wherein, with charged particle beam instrument and/or ultramicroscope
It is used together the Laser Processing luminous point separated.
Background of invention
Laser and ultramicroscope and focused ion beam（FIB）System is used together in such as integrated circuit, magnetic recording magnetic sound recording
The manufacture of head and the microdevice such as mask, repair and inspection field in provide various applications.These applications can be with
For energy exploration, material science and field of biology.Ultramicroscope（Typically scanning electron microscope（SEM））To mesh
Mark thing or workpiece provide high-resolution imaging in the case of causing minimum destruction, and FIB is used to change workpiece and for shape
Into image.Other kinds of ultramicroscope, such as transmission electron microscope can also be used（TEM）With scanning transmission electron microscopic
Mirror（STEM）.
FIB and SEM/STEM/TEM are used together the ability that can provide the internal imaging for making sample.FIB system is with one kind
Operate with scanning electron microscope similar mode, be not a beam electrons, as the term suggests and, FIB system is used can be low
Operate under beam electronic current for imaging or the fine micro- focusing for specific part imaging, deposition or milling is operated under high beam electronic current
Ion（Usually gallium）Beam.A kind of common purposes of FIB instruments is to carry out machining to surface.Preferably FIB machines can
So that tens or hundreds of microns can be entered to the inside machining of sample with high beam electronic current and acceleration potential.In low beam electronic current and acceleration potential
Under, its can with can machining fall to be close to the layer of atomic thickness, and do not destroy nanoscale or or even following layer.When with SEM/
When STEM/TEM is used for high-resolution imaging together, this micron and nano-machine working ability of FIB is usually highly effective.
During other, FIB can be used for machining away undesired electrical connection, and/or deposition conductive material, so as in the semiconductors
Make connection.FIB is additionally operable to maskless injection.During these FIB and/or SEM, it is often necessary to create one kind and be relatively free of
The environment of obstacle.Unfortunately, various different processes（Including massive material reset procedure）To produce in a large number can potential interference
The fragment of SEM/STEM/TEM and FIB.
The use of laser has been incorporated into this area to carry out rapid processing to workpiece recently.For example, on January 9th, 2009
2011/0163068 " the multiple beam systems of U.S. Patent Publication No. of the Utlaut of submission et al.（Multibeam System）" be directed to
A kind of use additional laser beam is used for the FIB system of rapid processing.When being used together with SEM/STEM/TEM and FIB system,
Material can be disposed from surface by the process of laser ablation by being irradiated to material.Very quickly picosecond laser is held
Go without thermal ablation process, and more slow nanosecond and continuous-wave laser（" CW laser "）Thermal ablation process is provided.
Generally, laser ablation is performed using pulse laser.Compared with charged particle beam is processed, laser ablation can be very
Relatively great amount of material is disposed rapidly.However, the wavelength of the charged particle in the wavelength ratio charged particle beam of laser is big obtaining
It is many.Because the sized fraction that beam can be focused into is limited to Shu Bochang, the minimum spot size of laser beam is typically larger than band
The minimum spot size of electrochondria beamlet.Therefore, although charged particle beam generally with the resolution finer than laser beam and
Micromachined can be carried out for minimum structure, but beam electronic current is restricted and micromachining operations slow can be obtained and can not be connect
Receive.On the other hand, the processing of laser microcomputer tool is generally faster, but resolution is inherently limited by longer Shu Bochang.Example
Such as, the United States Patent (USP) 8,168,961 in Straw et al. " is used for the charged particle beam mask of laser ablation micromachined
（Charged Particle Beam Masking for Laser Ablation Micromachining）" in describe to swash
Other purposes of opto-mechanical processing, the patent is transferred to assignee of the present invention and incorporated herein by reference.The U.S.
Patent 8,168,961 is included in this background parts by which and is not recognized as prior art.
The recent progressive careful preparation for allowing laser instrument to be used for workpiece, so which can be used for SEM/STEM/TEM
And FIB system.SEM/STEM/TEM and FIB instruments need prepare with thin heat affected area（“HAZ”）The sample in region, and
And system can aim at an extremely accurate position, such as submicron order defect in large sample.Generally do not know how using sharp
Light technology come cut bulk sample and while can produce suitable for the thin HAZ of SEM/STEM/TEM and FIB processing and/or micro-
Meter level end points determines.
When different types of laser instrument is preferred, with some examples.Some laser instrument are big to removing from workpiece
It is best for block of material.For example, these laser instrument can cut encapsulating material or machine away from workpiece it is big unnecessary
Material so that the size of workpiece be applied to analysis.Which can be also used for cutting deep trench within the workpiece, so that can
To expose the region for research.For cutting laser power scope generally from several watts to several hectowatt.Common
There is scope from nanosecond to the wide pulse width up to continuous wave.Commonly used longer wavelength（For example, it is common visible and connect
Near-ir wavelengths）, such as 532 nm, 1064 nm and it is up to 10.6 microns（For example, CO2Laser instrument）.These laser instrument are carried to workpiece
For high laser energy density（Pulse energy irradiated area separates）, having exceeded production includes the various different characteristics of hole and groove
Ablation threshold.In these quick working angles high power used be easy to produce perform fine SEM/STEM/TEM and
FIB processes（Such as imaging or circuit layout）The front heat affected area that must be disposed.High material clearance rate can also produce with FIB and
The incompatible fragment of the vacuum environment of SEM/STEM/TEM.
Different types of laser instrument is particularly suited for precise operation, such as micromachined, drilling, wiring, ditching, etching with
And heat affected area reset procedure.The laser instrument of this type of operation is commonly used in using than for removing the laser of massive material
The shorter wavelength of device, shorter pulse width and even closer focal spot.Although can be using up to micron-sized ripple
Long laser instrument, but because many materials easily absorb these wavelength and which can be focused into little spot definition, such as 355
The short wavelength laser of nm and 266 nm is preferred.Such as tens psecs and the short short pulse width laser instrument up to femtosecond situation
It is preferably as which provides material removing for little heat affected area.Will be with about several for these typical lasers applied
Watt or power below level.
There is the sample that many is made up of different materials, pass through before with SEM/STEM/TEM and/or FIB imagings or change
Laser instrument desirably processes these samples.Some examples of these samples include semiconductor device（Such as chip or chip）、
Encapsulation chip, electric wire and binding agent, mask, biological sample, ore deposit including the 3D stacked packages containing semi-conducting material
Thing sample（Such as rock）, or material sample（As synthetic, ceramics, glass, coating, glue, rubber, polymer,）, superconductor,
Magnetic material, alloy and metal.If this is the inventory of the multifarious dry-eye disease for representing the workpiece material that can be processed.May be used also
To process many other specimen materials do not listed.
Laser instrument Jing commonly selecteds are used for the favourable processing of the structure of different materials.For example, the CO of 10.6 micron wave lengths2Swash
Light device can be preferred for the encapsulating material for cutting through 3D stacked packages, and the laser instrument of 1.3 micron wave length of pulse can be preferred for
The metal structure on the semiconductor chip in encapsulation is cut, and shortwave long-pulse laser can be preferred for processing on chip
Silicon structure.Because just transparent and Metal absorption IR wavelength of the silicon to about 1100 nm or more, it is possible to silicon
It is processed in the case of causing less destruction.
One challenge is that the system with single laser instrument can not be performed and is hopeful when different laser beams are needed
Function.In other words, there is no the situation of the multiple systems buying respectively and using various lasers type is configured with
The lower known way for performing the multi-task being associated with different type laser instrument.In these cases, workpiece will be from a germline
System is transported to another kind of laser processing system to experience a kind of laser treatment and and then pass through another kind of laser treatment.
Another challenge is to be deposited on FIB and/or SEM/ from the unwelcome fragment of mechanical processing process
On key component in STEM/TEM rooms, such as each source and detector, and reduce its effect.Such fragment has obstruction
The probability of the function of FIB/SEM/STEM/TEM microscopys.Conventional electron microscope also generally need to make under vacuo sample into
Picture, because gaseous atmosphere makes electron beam diffusion and decay rapidly.As a result, the fragment evicted from the laser engine course of processing
Vacuum environment can be destroyed and imaging is hindered.In other cases, the unnecessary fragment after mechanical processing process can be so huge
It is big that so which prevents, workpiece is actual to be attached in the vacuum room of SEM/STEM/TEM.
A kind of system is needed, wherein, polytype laser beam spots can not produce a large amount of ablation materials in processing interior
SEM/STEM/TEM and FIB is combined in the case of material for being processed to workpiece.
Summary of the invention
In a preferred embodiment of the invention, disclose that a kind of use is produced from least one laser beam sources two
The system for focusing on laser beam spots, wherein, these focus on laser beam spots and simultaneously or sequentially play a role, so that
Exactly workpiece is processed, to carry out SEM/STEM/TEM and FIB imagings.These focus on laser beam spots and have difference
Characteristic so that being discriminatively processed to workpiece.
The system of preferred embodiment can have a kind of two laser beam sources separated or laser beam sources of being related to
Configuration, this laser beam sources are separated into two laser beams.This system is with the outside Laser Processing platform for room and interior
Portion laser machines platform, and the room is typically vacuum chamber.Outside Laser Processing platform can perform massive material with first laser Shu Guangdian
Removing and zanjon trench etch.Second laser Shu Guangdian is used together with interior chamber platform.Second laser Shu Guangdian is used for accurate work
Industry, such as micromachined, drilling, wiring, etching and heat affected area reset procedure.
It is an object of the present invention to improve the use of different types of laser beam spots, so that system can be from more smart
Carefully, removing or the zanjon trench etch of massive material, SEM/STEM/TEM/ are performed in more high-accuracy milling or machining respectively
This milling or machining are frequently necessary in FIB imaging process.
In order to detailed description of the invention below may be better understood, the present invention has quite widely been outlined above
Feature and technological merit.The supplementary features and advantage of the present invention are described below.Those skilled in the art will be appreciated that institute
The concept of disclosure and specific embodiment can be easily used as changing or be designed to carry out identical purpose other knots of the present invention
The basis of structure.Those skilled in the art will also be recognized that these equivalent constructions without departing from as illustrated in claims
The spirit and scope of the present invention.
Brief Description Of Drawings
In order to more thoroughly understand the present invention and advantages of the present invention, following explanation is referred to presently in connection with accompanying drawing, wherein：
Figure 1A shows the embodiment with a lasing light emitter, and the lasing light emitter is divided into two laser beams and is added with outside
Work platform and the interior chamber's platform with focused ion beam are used together；
Figure 1B shows another embodiment with a lasing light emitter, the lasing light emitter be divided into two laser beams and with
External process platform and the interior chamber's platform with focused ion beam and SEM/STEM/TEM are used together；
Fig. 1 C show another embodiment with a lasing light emitter, the lasing light emitter be divided into two laser beams and with
External process platform with motion platform and the interior chamber's platform with motion platform are used together；
Fig. 2 shows the embodiment with two lasing light emitters of the present invention, the two lasing light emitters and SEM/STEM/TEM and/
Or FIB independently produces two laser beams for work pieces process；
Fig. 3 shows embodiments of the invention, and the embodiment has swashing for the two discrete laser luminous points of generation separated
Light beam；
Fig. 4 shows embodiments of the invention, and it is sharp that there is the embodiment use beam actuator separated to produce two independences
The laser beam of light luminous point；
Fig. 5 shows embodiments of the invention, and the embodiment has a laser spot transmitted outside vacuum chamber and
The individual laser spot transmitted in vacuum room；And
Fig. 6 shows embodiments of the invention, and the embodiment has a laser spot transmitted outside vacuum chamber and
The individual laser spot transmitted in vacuum room, which discloses both SEM/STEM/TEM and FIB.
The detailed description of preferred embodiment
Various embodiments of the present invention are configured to be used together with SEM/STEM/TEM and/or FIB using different
Laser Processing.These configurations are that inner vacuum vessel uses and outer vacuum chamber is had using generation using one or more lasing light emitters
The laser spot of different processing characteristics.No matter one lasing light emitter of these configuration usings or multiple lasing light emitters, produce and using not
The focused laser spot of same type and respectively and/or discriminatively workpiece is processed.
There has been described many optical modules to select, can select to construct these systems by these optical modules.Retouch herein
The embodiment stated includes the possibility arrangement of module of optical system, using lasing light emitter, reflecting mirror, beam splitter, beam steering mechanism and
Shu Biangeng optics.Its that meet scope of the following claims can be easily designed using ordinary skill in the art
He arranges.
Figure 1A shows the preferred embodiment of multi-laser beam system 120, and the multi-laser beam system has used a lasing light emitter
With two machine tables separated.Lasing light emitter or laser generator 100 generate the laser beam with enough energy, and the laser beam will
For whole multi-laser beam system 120.Lasing light emitter 100 can be ultrafast pulsed laser device, such as special in the U.S. of Mourou et al.
Femto-second laser described in profit number 5,656,186.Although laser does not have particle beam accurate, this laser instrument can compare allusion quotation
The speed that the focused ion beam of type can reach much more quickly removes material from workpiece.Workpiece is intended to add for further
Work, thus system 120 can use it is more inexpensive to the effective lasing light emitter of large volume materials processing, such as continuous-wave laser or
CO2Laser instrument.The enough power of many offers in these cost laser sources, so that separating and being delivered to laser beam
Multiple focal spots on multiple workpiece.The following describe the wider inventory of the lasing light emitter suitable for massive material processing.
Lasing light emitter 100 produces the separated original laser beam 107 at beam splitter 108.Beam can be divided into by beam splitter 108
Two independent laser beams with different-energy.Different beam splitters can be used.Beam splitter can be large-scale optics
（Such as polarization beam apparatus）Or the reflecting mirror of part reflection.The optical module for switching over for halved tie or turning to can also be by permitting
Perhaps pulse is used as beam splitter to operation surface along different propagateds.Can be transmitted with explosion type or interactive along different beam paths
Transmission pulse.Can be configured and drive into includes AOM, EOM, Pockel cell, Yi Jike for the optical module for performing beam splitting
The LCD polarisers of switching.Alternately, fiber coupler can be used as beam splitter in optical fiber implementation.
Beam splitter 108 along first laser beam path 130 guide beam, by the first scanning reflection mirror 102, beam steering mechanism with
And first object lens 109 act on first laser beam path.Beam splitter 108 allows two laser beams separated, so that
The laser beam separated if desired is processed to workpiece, then do not need two lasing light emitters separated.The system allows same
Two workpiece separated of Shi Jiagong：The workpiece 104 processed on outside platform 105 and the second platform workpiece 116, internally room
112（Which is typically vacuum chamber）Middle processing second workpiece.First scanning reflection mirror 102 and the first object lens 109 can be produced
First laser beam 103.
First laser beam 103 produces first laser luminous point 150 at outside platform 105, and the outside platform is used for massive material
Remove and cut deep trench relevant range to be exposed on workpiece 104.Workpiece 104 can be comprising unnecessary to imaging process
Encapsulating material.First laser beam 103 can cut away unnecessary encapsulating material on outside platform 105.For example, for integrated circuit
3D IC packages Jing often comprising several millimeters thicks part.Can be used for can from the laser spot 150 of first laser beam 103
Encapsulation to be cut in half or along groove at outside platform 105 before being further processed 104 to workpiece in room 112 internally
Length cuts a groove.If internally performing these bulk operations in room 112（It can be related to remove up to tens or
Hundreds of cubic millimeter of material）, then its by degenerating vacuum environment or fragment can be made to be deposited on sensing assembly hindering SEM/
STEM/TEM/FIB processes.
Before the processing of fine inner laser, many applications are especially suitable for the Laser Processing of the bulk outside room 112.In mineral plus
Work and energy exploration field, internally before finer, the more accurate processing in room 112, it is possible to use first laser beam 103
Different minerals sample is processed to expose interior section.Outside laser station 105 can also dispose of workpiece 104
Point, unless the workpiece can not be attached in interior chamber 112.For example, outside laser station 105 can be used for cutting big semiconductor wafer
A part.
Beam steering mechanism generally falls into rotation maker species.Mechanical rotor includes to be caused with piezo-activator, electromagnetism
The steering reflection mirror of dynamic device, electric expansion actuator or other actuator activations.Galvanometer, inclination wedge and micromachined reflection
Lens array falls within the classification of mechanical beam-deflector.Other can make the optical element that light beam is turned to include AOM and EOM.
Once internally in room 112, become the workpiece after the transfer of the second platform workpiece 116 and will pass through additional more high-precision
Close processing.Workpiece 104 can manually or automatically be performed from outside platform 105 to the transfer of interior chamber 112.Can simultaneously or
Sequentially the workpiece at both outside platform 105 and internal platform 113 is processed.
Turbomolecular pump（It is not shown）It is equally used for emptying interior chamber 112 and keeping fine vacuum wherein.Vacuum system
Internally provide generally about 1 × 10 in room 112-7Support and 5 × 10-4Between vacuum.Electronics and ion source are by turbine
Pump is emptied and and then is maintained at such as 1 × 10 with ionic pump-10To 1 × 10-7Under the lower pressure of support.
High voltage power supply（It is not shown）It is connected on FIB 110 and can be formed the ion beam of about 1 keV of keV to 60.
The system can alternately include SEM/STEM/TEM.FIB and/or SEM/STEM/TEM will including corresponding deflector and thoroughly
Mirror, although electrostatic is also possible, which is typically magnetic.There is driving solenoid to produce magnetic for magnetic lens and deflector
The controller and amplifier of deflection field.Electrostatic lenses and deflector have the controller for driving charged plates to produce electric deflection field and put
Big device.
Once laser beam 107 is separated by beam splitter 108, the part of the beam is along can include the of beam regulating platform 101
Advance in dual-laser beam path 131.The regulation of laser beam is prepared for the finer precise operation wanted needed for interior chamber 112
Laser beam.Regulating platform 101 can change laser beam characteristic, such as power.Regulating platform 101 can also change the amplitude of laser beam, energy
Amount, polarization, time pulse shape, space profiles, wavelength or other characteristics.Regulating platform 101 is optional and in some applications
In can be unnecessary.In certain embodiments, " lasing light emitter " is considered as the group of laser generator 100 and actuator 101
Close, which produces the laser beam for being processed to sample jointly.
Various beams adjust optics and can be included in beam regulating platform 101.Similar and/or different element can be used
In the different beam paths of regulation.These optical elements can include polariser, polarization modifier, faraday isolator, spatial bundle
Profile modifier, when interfascicular fasciculus profile modifier, frequency shifter, frequency multiplication optics, attenuator, beam splitter, amplifier, modeling optics
Element, beam expander, lens and relay lenss.Laser beam 107 can be separated into into multiple beams by equal or different capacity ratio
Beam splitter 108 can also be considered as to adjust optics.Optical element can also include can be by extra optical path distance, folding
The delay line and fibre delay line of light path composition.
The U.S. Patent number 7,923,306 of the Bruland that on April 12nd, 2011 is issued et al. discusses the length of laser instrument
Description, arrange, configuration and beam modified elements and with regard to multiple luminous points are transferred to a list using one or two laser instrument
The discussion of individual workpiece, and which is incorporated herein by reference.
Second laser beam 115 can be advanced independently along the second beam path 131 and can be passed through the second scanning reflection mirror
111st, the second object lens 114 are acted on thereon and produce the focused laser spot 151 of their own.With associated Shu Guangdian 151
Second platform workpiece 116 of the second laser beam 115 in interior chamber 112 be processed in the operation together with FIB 110.
After massive material is removed in outside platform 105, second laser beam 115 and its associated Shu Guangdian 151 can be with
For finer machining operations.Finer, more precision machined laser instrument can be carried out can to swash including solid-state
Light device, such as diode pumping adjust q solid-state lasers, mix rare earth lasant including containing（Such as Nd:YVO.4、Nd:YLF and Nd:
YAG）With electronic vibration lasant（Such as alexandrite, Cr:LiSAF and Cr:LiCAF）Laser instrument.It is discussed below to carry out more
The wider inventory of the lasing light emitter of fine machining.Before SEM/STEM/TEM and FIB operations, second laser beam 115
Associated laser spot 151 can be also used for removing heat affected area or the miniature part for cutting workpiece 116 with which.This
Process sometimes referred to as ' cuts and observes（slice and view）', and can be to which repeatedly with measuring samples inside
3D measurement or internal feature is positioned and is imaged.
Second laser beam 115 and its associated laser spot 151 operation together with focused ion beam post 110, the focusing
Ion beam column can generate 1/10th microns of beamlet, so that the precision for performing the workpiece 116 to being placed on platform 113 adds
Work.Material clearance rate from the ion beam 117 of focused ion beam post 110 is relatively low.Technical staff will be appreciated that removing
Speed and beam spot definition are with beam electronic current change.Clearance rate is used together also as the material that is eliminated and with beam（Such as
Fruit has）Etching strengthens the species of gas and changes.
Massive material from workpiece 104 reduces the subsequent workpiece at platform 113 internally in the removing at outside platform 105
The material value generated in 116 course of processing, so as to reduce the pollution to vacuum and component in interior chamber 112.It is overall
On, the fragment generated at outside platform 105 will be discarded being transferred to before interior chamber 112, so that fragment will not have
The vacuum being related to during interference SEM/STEM/TEM and FIB and the probability of component.Due to the separation of each, by protecting
Hold piece of debris and will extend the system useful life of SEM/STEM/TEM and FIB away from optics.
Figure 1B shows an alternative embodiment of the invention of system 140.System 140 includes the system 120 in Figure 1B
All features and component and further include ultramicroscope 141.The embodiment of the present invention is not only restricted to a FIB source.Laser
Device system 140 can have FIB, a multiple FIB or one or more FIB with one or more ultramicroscope.
Although liquid metal ion source（LMIS）Be it is modal transmission gallium ion FIB sources, but can using other compared with
Few traditional FIB sources, such as neon source or helium source.In these systems ultramicroscope used will commonly SEM, but other classes
The ultramicroscope of type, such as TEM and STEM.In presents, the principle and advantage of the system of description is applied to polytype electronic display
It is any in micro mirror and/or FIB.
Fig. 1 C show an alternative embodiment of the invention of system 140.System 140 includes the system 120 in Figure 1B
All features and component and further include to reposition the machinery positioning platform of workpiece.Outside platform 105 and internal platform
113 can be made up of the platform for putting workpiece thereon.It can further comprising be designed to fix exactly sample with
Just the clip processed or support.These can be comprised additionally in for the location of workpiece is adjusted before processing or in the course of processing
Motor system.Motion platform 160 is a part for outside platform 105 and motion platform 161 is a part for internal platform 113.
In this context, position can refer to linear position or Angle Position, including but not limited to located lateral, it is vertically oriented, incline or turn
It is dynamic.This positioning can be with reference to beam steering mechanism（Such as scanning reflection mirror 102）Operation is with guided laser to the correct position on workpiece
Put and be processed.Indeed, it is possible to be repositioned, completely with beam steering mechanism or used mechanical workpieces with the machinery of workpiece completely
Positioning and beam turn to the coordination effort of work compound performing aiming or repositioning of the laser spot positions on workpiece.
In presents, the principle and advantage of the system of description is suitable for inclusion in the broad variety of both ultramicroscope and FIB
Any a member of charged particle beam instrument.Although liquid metal ion source（LMIS）It is the FIB sources of modal transmission gallium ion,
But other less traditional FIB sources, such as plasma focus ion beam can be used（PFIB）Or substituting ion, such as neon or
Helium.Ultramicroscope used will commonly scanning electron microscope in such systems（SEM）, however, it is also possible to realize
Other kinds of ultramicroscope, such as TEM（Transmission electron microscope）And STEM（Scanning transmission electron microscope）.
Fig. 2 shows another preferred embodiment, this example show a kind of matching somebody with somebody with twin-laser system 200
Put, the twin-laser system generates two independent laser beams and corresponding laser beam spots using two independent lasing light emitters.
The system includes focused ion beam post 208 and can alternately include SEM（It is not shown）.Different types of laser instrument is provided
The benefit of different machinings, and the use of two laser instrument separated of this configuration provides：First laser source 203 and second
Lasing light emitter 204.Each lasing light emitter and its 250 He of corresponding focal spot in first laser source 203 and second laser source 204
251 independent characteristics can with the ability for affecting to remove specimen material.Laser spot carries out ablation, machinery and adds to specimen material
Work, removing or the ability for changing are defined as its intensity, can distinguish the intensity by any optical signature, such as power, amplitude,
Energy, pulse width, burst length shape, spot definition, partial pulse distribution, fluence, polarization and wavelength.
The use of various lasers and different laser pulse characteristics in multiple laser processing can advantageously improve sample
The processing of material.Used in multiple laser system of processing or many different types of lasing light emitters can be combined.Depending on being related to
The specimen material for arriving and desired processing result, some lasing light emitters may be more suitable for the removing of massive material and others can
Sample fining-off can be more suitable for.
Lasing light emitter can include solid-state laser, and such as diode pumping is adjusted q solid-state lasers, mixes rare earth lasing including containing
Thing（Such as Nd:YVO4、Nd:YLF and Nd:YAG）With electronic vibration lasant（Such as alexandrite, Cr:LiSAF and Cr:LiCAF）Laser
Device.
Lasing light emitter may further include diode pumping mode locked solid state laser, if it is defeated to produce pulse picosecond laser
The SESAM locked mode Nd for going out:YVO4Laser instrument.Mode locked solid state laser can include agitator regenerative amplifier and oscillator power
Amplifier is configured.For the purpose for generating the output of pulsed femtosecond laser, lasing light emitter can also be included for generating femtosecond（fs）Swash
The chirped-pulse amplification laser system of light output can include other pulse stretchings well-known in the art and compression
Optics.
Lasing light emitter may further include pulse mix rare earth reality core fibre laser instrument and pulse mix rare earth photonic crystal fiber
Laser instrument.Rare earth fibre laser is mixed in pulse can be included adjusting q and agitator-amplifier configuration.It is many it is possible to further use
Plant various agitator, including wide area semiconductor laser instrument, single-frequency semiconductor laser, light emitting diode, tune q solid-state lasers
Device and optical fiber laser.
Additional laser source may further include semiconductor laser, gas laser（Including CO2And argon laser
Device）And excimer laser.
Can be produced and can be included in by lasing light emitter from many a variety of wavelength of about 150 nm of nm to 11,000
In multiple laser system of processing.Depending on the lasing light emitter for being used, can when this writes formation range from 10 fs to being more than
The pulse width and scope of 1 s is from continuous wave to the PRF more than 100 MHz.Depending on the lasing light emitter for being used, per pulse or defeated
Energy, pulse width, polarization and/or the wavelength for going out power can be adjustable or selectable.
The fundamental wavelength output of above-mentioned laser instrument can also be changed by well-known non-linear harmonic wave transformation process
Into harmonic wave.This can be in lasing light emitter itself（Such as the first and second lasing light emitters 203 and 204）It is internal or in such as 101 regulating platforms
Inside complete.
Twin-laser system is included in the vacuum chamber 201 comprising the inside machine table 202 for workpiece 213 in which.First
Lasing light emitter 203 is produced and is transmitted to scanning reflection mirror 205 laser beam 209 through object lens 210, and the laser beam is focused in the object lens
To produce first laser Shu Guangdian 250.Second laser source 204 produces and is transmitted to scanning reflection mirror 206 laser through object lens 212
Beam 211, the laser beam focus on to produce second laser Shu Guangdian 251 in the object lens.FIB posts 208 are also produced and are directed into work
Charged particle beam 207 on part 213.Both first laser beam 209 and second laser beam 211 are compared with ion beam 207 with certain
Angle is close to workpiece and can the simultaneously or sequentially operation on workpiece 213.All of optics and particle beam can simultaneously or
Operate sequentially on workpiece.All of beam can also be directed into it is completely overlapped on workpiece, partly overlap or do not overlap.
The system described in Fig. 2 is only a kind of figure of possible configuration, however, many different configurations are possible.
Can indoors, the combination of outdoor or indoor and outdoors transmit two laser beams.Any portion of two lasing light emitters and optical module
Point can indoors, the combination of outdoor or indoor and outdoors.Second laser 211 can also be the enlarged version of first laser 209.This
Invention is also not limited to two laser beams.It can be beneficial that realizing bigger gulping down using three or more than three laser beams
The amount of telling, the ability with the multiple positions of time processing or with the option that selection is carried out between various different laser characteristics,
Every kind of characteristic is with desirable working ability on a different material.
First laser beam 209 and second laser beam 211 are focused in different laser spots 250,251.Swash depending on each
The feature of light beam source, beam path optics and focusing optics, each laser spot can be of different sizes or not
Same shape.Because first laser beam 209 and laser beam 211 each have the beam-deflector of their own, each beam has makes which
The ability of the deflection profile synchronization of respective bundles luminous point and the pulse separated for creating its corresponding luminous point generate the ability of timing.Sweep
Retouch the example that reflecting mirror 205 and 206 is beam-deflector.Act on the beam-deflector on the first and second laser beams and there can be quilt
It is synchronous into producing a kind of its deflection command of desired spatial relationship in process between two laser beams.Desired sky
Between relation can be or overlap, partly overlap or be nonoverlapping, so as on the same area or zones of different of workpiece make
Industry.The timing that pulse between first and second laser beams is generated can with by synchronization into simultaneously, it is different when or in time with uncommon
The overlap of prestige produces pulse.Spatial relationship and/or the timing of any amount of laser beam, electron beam and FIB can be coordinated.This
These processes can be made outward synchronous with any motion subsystem, because these subsystems are of inside and outside machine table
Point.
Control system（It is not shown）Room and time for making laser spot and particle beam arranges synchronous.This control system
System will generally involve to lasing light emitter, SEM/STEM/TEM, FIB, optics, electronics and particle beam deflexion device, motion platform and
One or more computer systems and electronic installation that other actuating assemblies in system are disturbed, for example it is, some type of
Beam adjusts optics.Typically essence is performed using feedback control system in the use through sensor feedback and control algolithm
Degree adjustment.The software of coordination and control system component is stored with the form of electronically readable on such as hard disk or in flash memories and is consolidated
Part.
Fig. 3 shows embodiments of the invention, and the embodiment has swashing for the two discrete laser luminous points of generation separated
Light beam.Twin-laser system 320 generates two independent laser beams using two independent lasing light emitters 301,302.The system bag
Include focused ion beam post 310 and SEM/STEM/TEM can be included（It is not shown）.From the laser beam of laser instrument 301 and 302
In each laser beam can produce the focal spot 332 and 333 with independent characteristic, such as wavelength, time pulse profile, energy
Amount, power, spot definition, light spot form and polarization.
Twin-laser system 320 is included in which vacuum chamber 314 for carrying the inside machine table 315 for workpiece 316.The
One lasing light emitter 301 is produced and is transmitted to scanning reflection mirror 303 laser beam through beam combiner 308, so as to produce beam 331.It is common
Beam combiner be the polarisation beam cube that can efficiently combine the laser beam with different polarization.Beam 331 passes through object lens
312, its focusing is made in the object lens to produce the first beam luminous point 332.Second laser source 302 produces and is transmitted to scanning reflection mirror 306
And through beam combiner 308 laser beam producing the second beam 330.Second beam 330 passes through object lens 312 and which is focused on to produce
Raw second beam luminous point 333.The unshowned relay optics used in the system of these types are helping carry out beam biography
Pass.FIB 310 also produces the charged particle beam 311 being directed on workpiece 316.
Fig. 4 shows embodiments of the invention, and the embodiment has the laser beam separated, and these laser beams have generation
The beam combiner of two discrete laser luminous points.Twin-laser system 420 generates two using two independent lasing light emitters 401,402
Independent laser beam.Laser beam passes through corresponding beam regulating platform 403 and 404.Discuss that different types of beam is adjusted broadly above
Optics.The system includes focused ion beam post 412（Which has charged beam 414）And SEM/STEM/TEM can be included
（It is not shown）.Each laser beam in the lasing light emitter of laser instrument 401 and 402 can be when through beam regulating platform 403 and 404
Be further modified and produce the focal spot 415 and 417 with independent characteristic, such as wavelength, time pulse profile, energy,
Power, spot definition, light spot form and polarization.
Twin-laser system 420 is included in the vacuum chamber 413 comprising the inside machine table for workpiece 416 in which.First
Lasing light emitter 401 produces the laser beam through scanning reflection mirror 403, deflection scanning reflecting mirror 410 and beam splitter 409, so as to produce
Beam 422.Beam 422 passes through object lens 418, makes its focusing to produce the first beam luminous point 415 in the object lens.Produce in second laser source 402
The raw laser beam through beam actuator 404, deflection scanning reflecting mirror 411 and beam splitter 409 is producing the second beam 421.Second beam
421 pass through object lens 418 and which is focused on to produce the second beam luminous point 417.
Fig. 5 shows embodiments of the invention, and the embodiment has a laser beam transmitted outside vacuum chamber and one
Laser beam in vacuum room.Multi-laser beam system 520 uses laser beam sources 501 and laser beam sources 502 to generate two laser beams.Come
Deflection scanning reflecting mirror 503 is transmitted to and through object lens 505 from the laser beam of laser beam sources 501, so as to produce with first laser
The laser beam 506 of luminous point 530.First laser luminous point 530 is processed to workpiece on outside platform 508.First laser luminous point 530
Can be used for the removing of massive material and deep trench is cut to expose the relevant range on workpiece.Bulk reset mode, for example,
10,000 μm are removed at least3.Bulk reset procedure is with least 10,000 μm3The speed of/s removes material.Provide with reference to silicon clear
Removal rates, although the invention is not restricted to process silicon workpiece.In certain embodiments, bulk reset procedure is with more than 25,000 μ
m3/ s, more than 50,000 μm3/ s is more than 100,000 μm3The speed of/s removes material.
Fine or exact material laser is removed and is often referred to less than 10,000 μm3Removing.Fine or exact material laser is clear
Except process is generally needed with less than 10,000 μm3The speed of/s, with less than 5,000 μm3/ speed or be less than 1,000 μm3/s
Speed remove material.By contrast, focused ion beam system is generally with some μm3The speed of/s removes material.
System 520 includes robot 507 on moveable platform, and material is transferred to interior by the robot from outside platform 508
Portion's platform 504.Robot 507 shifts workpiece by room door 509.Robot 507 can either automatically or manually shift workpiece.Vacuum
Interlocking（It is not shown）Can be associated to allow to install sample additional in the case where not making room 510 ventilate with room door.Once internally
In room 510, the workpiece now referred to as after the transfer of the second platform workpiece 516 will pass through additional more high-accuracy processing.It is internal
Room 510 is typically vacuum chamber.Processing can be performed at both outside platform 508 and internal platform 504 simultaneously or sequentially.
Second laser source 502 generates laser beam, processes the laser beam and by object lens 513 by deflection scanning reflecting mirror
Focus on which, produce the laser beam 515 of the focal spot 517 with their own.Second laser Shu Guangdian 517 and FIB posts 511 1
Operation is played, the FIB posts produce charged particle beam 512 in being processed to workpiece.Will be useless before interior chamber 510 is transferred to
The fragment from the accumulation of outside platform 508 is abandoned, so that fragment is not had the probability of interference vacuum chamber 510 and FIB processes.By
In the separation of each, the system for extending SEM/STEM/TEM and FIB is used away from optics by keeping piece of debris
Time limit.
Fig. 6 shows system 650, an alternative embodiment of the invention, its have a lasing light emitter 601, beam splitter 602,
The beam regulating platform 603 and 605 separated and 611 liang of the FIB 612 and SEM/STEM/TEM that beam is transmitted in vacuum chamber 622
Person.Similar to the embodiment shown in Figure 1A, laser beam is generated from a source and is separated.First laser Shu Chuanxiang is inclined
Turn scanning reflection mirror, through object lens 608, and the first beam luminous point 618 is produced on the workpiece 617 of outside platform 619.Second laser
Shu Chuanxiang deflection scanning reflecting mirrors, through object lens 615, and produce second laser Shu Guangdian 620 to process on platform 621 internally
Workpiece 623 in vacuum chamber 622.FIB 612 and SEM/STEM/TEM 611 combines using for second laser Shu Guangdian and allows more
Fine precise operation.
Without the independent work(that prior art is used to separate using the laser beam of more than one type with reference to particle beam instrument
Can and it is well known.Also multiple laser beams are being used to be used for the vacuum chamber of the process intensification of debris management without prior art
Interior use Laser Processing ability and it is well known.
Laser beam systems are made to there are some benefits with multiple laser beam spots.System with multiple Shu Guangdian will pass through
With suitable for bulk operations laser beam perform bulk operations come improve working ability and and then be able to carry out accurate operation, such as
Removed with the HAZ suitable for precise operation and minute yardstick slicing.Allow to use with independent laser spot and be suitable for different materials
The particular laser of material and characteristic.Another of the system is had an advantage that in the situation that need not buy two systems separated
It is lower to allow a system to exercise the function of separating, the such as removing of massive material and finer precise operation.By only having
One workbench, can perform in the case where workpiece 213 need not be moved to another system from a system all of
Shu Xiugai, such as FIB processes, SEM/STEM/TEM processes and with the process and second laser Shu Guangdian of first laser Shu Guangdian
Process.This transfer may need careful data and material tracking operation.Independent laser instrument is made to manufacture the Shu Guang for separating
There is specific benefit in point.One laser beam can be used for that bulk is removed and the fine manipulation by the laser instrument separated can
For processing different types of material.For example, in the case of stacking 3D IC packages, one can be selected to be skillful in cutting through greatly
The laser instrument of block encapsulating material or binding agent and the second laser of a retrofit for being skillful in silicon can be selected.
Some embodiments of the invention, it is a kind of for what is be processed to workpiece with charged particle beam and laser beam to be
System includes：First workbench, including vacuum chamber be used for process the first workpiece supported in the vacuum room；Second workbench, uses
Second workpiece outside processing vacuum room；The lasing light emitter of generating source outgoing laser beam；Optical system, which is configured for this
Source outgoing laser beam is divided at least first laser beam and second laser beam and the first laser beam is delivered in the vacuum room
First workpiece and the second laser beam is delivered to into the second workpiece outside the vacuum room；And particle beam source, it is used for
The second workpiece processed in the vacuum room.
In certain embodiments, the optical system include for the first laser beam is positioned on first workpiece
A branch of steering mechanism and the second beam steering mechanism being positioned at for the second laser beam on the second workpiece.
In certain embodiments, the optical system includes changing the first laser beam, frequency of the second laser beam, strong
Degree, or pulse width or persistent period or both pulse width and persistent period at least one adjusting means, wherein, when plus
During its corresponding workpiece of work, the first laser beam and the second laser beam have different intensity.In certain embodiments, this
With higher power, the second laser beam is adapted for performing per second at least 10 the dual-laser beam ratio first laser beam,
The massive material of 000 cu μ m material is removed and the first laser beam is adapted for performing per second removing less than 5000
The accurate operation of cu μ m material.
According to some embodiments, a kind of system bag for being processed to workpiece with both charged particle beam and laser beam
Include：Vacuum chamber；Charged particle beam system, for processing the workpiece in the vacuum room；The multiple laser being placed on outside the vacuum room
Source；Optical system, which is configured for the laser beam from the plurality of lasing light emitter is guided to the vacuum from outside the vacuum room
Indoor workpiece.
In certain embodiments, one of the plurality of lasing light emitter is produced in the beam with the first intensity and the plurality of lasing light emitter
Another lasing light emitter produce the beam with the second intensity, second intensity is less than first intensity.In some embodiments
In, one of the plurality of lasing light emitter for another lasing light emitter in femto-second laser and the plurality of lasing light emitter be nanosecond laser or
Continuous-wave laser.
In certain embodiments, the multiple laser beams in the laser beam of the plurality of lasing light emitter are poly- by same object lens
Jiao is on the workpiece.In certain embodiments, the multiple laser beams in the laser beam of the plurality of lasing light emitter are by not jljl
Mirror is focused on the workpiece.
Some embodiments of the invention, it is a kind of for being carried out to workpiece using both charged particle beam and laser beam plus
The system of work includes：Vacuum chamber, for accommodating the first workpiece；Charged particle beam post, for process in the vacuum room this first
Workpiece；First laser electron gun, for processing first workpiece；Second laser electron gun, for processing first workpiece or the second work
Part, the first laser beam and the second laser beam have different beam characteristics, and the first laser source or the second laser source
At least one of be adapted for the first laser beam or the second laser beam are guided the workpiece to the vacuum room.
In certain embodiments, the first laser electron gun and the second laser electron gun include a single laser beam generator
And at least one of the first laser electron gun and the second laser electron gun include the frequency for changing the beam that the beam maker is generated
The beam actuator of rate, intensity or pulse width or persistent period.In certain embodiments, the beam actuator is configured for making
Obtain the first laser beam with the second laser beam power 1/10, the second laser beam be applied to bulk remove and this first
Laser beam is processed suitable for delicate mechanical.In certain embodiments, the second workpiece is placed on outside the vacuum room.
In certain embodiments, the first laser beam and the second laser beam are guided into first work to the vacuum room
Part.In certain embodiments, the first laser beam and the second laser beam are focused on the workpiece by same object lens.One
In a little embodiments, the first laser beam and the second laser beam are focused on the workpiece by different object lens.
In certain embodiments, the first laser beam is adjusted by one of procedure below：Wavelength convert, pulse width or frequency
Rate changes, amplifies and decays.
In certain embodiments, the system further includes steering reflection mirror, the steering reflection mirror act on this first swash
So that the first laser beam or the second laser beam are guided uncommon to first workpiece on light beam and/or the second laser beam
Hope position.
Some embodiments of the invention, a kind of method of use charged particle beam system include：Guide for processing
The first laser beam of the first workpiece；Second laser beam is guided from outside vacuum room, to process in first workpiece or vacuum room
Second workpiece；And guiding charged particle beam, to process described first or second workpiece, wherein, the first laser beam is in phase
Answer on workpiece with the intensity bigger than the intensity of the second laser beam, the first laser is with than the faster speed of the second laser
Remove material, the second laser is removing material than the faster speed of the charged particle beam.
In certain embodiments, the first laser beam is guided including by from laser beam generator beam guide to
First workpiece outside the vacuum room, and the second laser beam is guided including by from same laser beam generator
Beam is directed across beam actuator towards the second workpiece in the vacuum room.
In certain embodiments, the beam is directed across the beam actuator includes at least one of herein below：Space
Beam profile modifier, when interfascicular fasciculus profile modifier, frequency shifter, frequency multiplication optics, attenuator, amplifier, modeling optics
And beam expander.In certain embodiments, first laser beam is guided to include drawing the first laser beam to process the first workpiece
It is directed at the first workpiece being placed in the vacuum room.
In certain embodiments, first laser beam is guided and second laser beam is guided including guide this
One laser beam and the guiding second laser beam are through same object lens towards first workpiece in the vacuum room.In some enforcements
In example, first laser beam is guided and second laser beam is guided including guide the first laser beam and guiding this
Dual-laser beam is through different object lens towards first workpiece in the vacuum room.
In certain embodiments, first laser beam is guided and second laser beam is guided including：Guiding source
From the first laser beam of first laser maker, and second laser beam is guided including guiding from second laser generation
The second laser beam of device.In certain embodiments, first laser beam is guided and second laser beam is guided including：
First laser beam of the guiding from first laser maker, and second laser beam is guided sharp from first including guiding
The second laser beam that photoproduction is grown up to be a useful person, wherein, first laser beam or second laser beam or two laser beams through beam actuator with
Change intensity, wavelength or pulse width or frequency.
In certain embodiments, the first laser beam and the second laser beam process its corresponding workpiece simultaneously.
Those skilled in the art will recognize that concept disclosed herein and specific embodiment can be easily used as improve or
It is designed to carry out the basis of identical purpose other structures of the invention.Those skilled in the art will also be recognized that these equal structures
Make without departing from the spirit and scope of the present invention as illustrated in claims.
Claims (26)
1. a kind of system for being processed to workpiece with both charged particle beam and laser beam, the system include：
First workbench, which includes vacuum chamber and is processed for the first workpiece to being supported in the vacuum room；
Second workbench, for being processed to the second workpiece outside vacuum room；
The lasing light emitter of generating source outgoing laser beam；
Optical system, its be configured for by the source outgoing laser beam be divided at least first laser beam and second laser beam and
First workpiece that the first laser beam is delivered in the vacuum room and the second laser beam is delivered to outside the vacuum room
The second workpiece；And
Particle beam source, for being processed to the second workpiece in the vacuum room.
2. the system as claimed in claim 1, wherein, the optical system include for by the first laser beam be positioned at this first
The first beam steering mechanism on workpiece and the second beam steering mechanism for being positioned at the second laser beam on the second workpiece.
3. the system as described in claim 1 or claim 2, wherein, the optical system include changing the first laser beam, should
Second laser beam or at least one adjusting means of the frequency of both, intensity or pulse width or persistent period, its
In, when being processed to its corresponding workpiece, the first laser beam and the second laser beam have different intensity.
4. system as claimed in claim 3, wherein, the second laser beam ratio first laser beam has higher power, should
Second laser beam be adapted for performing the massive material of at least 10,000 cu μ m materials per second remove and this first
Laser beam is adapted for performing the accurate operation removed less than 5000 cu μ m materials per second.
5. a kind of system for being processed to workpiece with both charged particle beam and laser beam, the system include：
Vacuum chamber；
Charged particle beam system, for processing the workpiece in the vacuum room；
The multiple lasing light emitters being placed on outside the vacuum room, wherein, one of the plurality of lasing light emitter produces the first beam of the first intensity simultaneously
And another lasing light emitter in the plurality of lasing light emitter produces the second beam of the second intensity, second intensity is less than first intensity
½；And
Optical system, which is configured for the laser beam from the plurality of lasing light emitter is guided to the vacuum from outside the vacuum room
Indoor workpiece.
6. system as claimed in claim 5, wherein, one of the plurality of lasing light emitter is femto-second laser and the plurality of lasing light emitter
In another lasing light emitter be nanosecond laser or continuous-wave laser.
7. system as claimed in claim 5, wherein, the multiple laser beams in the laser beam of the plurality of lasing light emitter are by same
One object lens is focused on the workpiece.
8. system as claimed in claim 5, wherein, the multiple laser beams in the laser beam of the plurality of lasing light emitter are not by
Same object lens are focused on the workpiece.
9. a kind of system for being processed to workpiece using both charged particle beam and laser beam, the system are included：
Vacuum chamber, for accommodating the first workpiece；
Charged particle beam post, for being processed to first workpiece in the vacuum room；
The first laser electron gun being placed in outside the vacuum room, for being processed to first workpiece；
The second laser electron gun being placed in outside the vacuum room, for being processed to first workpiece or second workpiece, this first
Laser beam and the second laser beam have in different beam characteristics, and the first laser electron gun or the second laser electron gun extremely
Few one is adapted for the first laser beam or the second laser beam are guided the workpiece to the vacuum room.
10. system as claimed in claim 9, wherein, the first laser electron gun and the second laser electron gun include one it is single
At least one of laser beam generator and the first laser electron gun and the second laser electron gun include changing the beam maker
The beam actuator of the frequency, intensity or pulse width or persistent period of the beam of generation.
11. systems as claimed in claim 10, wherein, the beam actuator is configured for so that the first laser beam has
The 1/10 of the power of the second laser beam, the second laser beam is applied to bulk removing and the first laser beam is applied to finely
Machining.
12. systems as claimed in claim 10, wherein, the second workpiece is placed on outside the vacuum room.
13. systems as described in any one of claim 9 to 12, wherein, the first laser beam and the second laser beam are guided
First workpiece to the vacuum room.
14. systems as claimed in claim 13, wherein, the first laser beam and the second laser beam are poly- by same object lens
Jiao is on the workpiece.
15. systems as claimed in claim 13, wherein, the first laser beam and the second laser beam are poly- by different object lens
Jiao is on the workpiece.
16. systems as described in any one of claim 10 to 12, wherein, the first laser is adjusted by one of procedure below
Beam：Wavelength convert, pulse width or frequency shift, amplification and decay.
17. systems as described in any one of claim 9 to 12, further include steering reflection mirror, and the steering reflection mirror is acted on
On the first laser beam and/or the second laser beam so as to by the first laser beam or the second laser beam guide to this first
Desired location on workpiece.
A kind of 18. methods of use charged particle beam system, including：
The first laser beam for being processed to the first workpiece is guided,
Second laser beam is guided from outside vacuum room, to be processed to the second workpiece in first workpiece or the vacuum room,
And
Guiding charged particle beam, to be processed to described first or second workpiece,
Wherein, the first laser beam in associated workpiece with the intensity bigger than the intensity of the second laser beam, this first swash
, to remove material than the faster speed of the second laser, the second laser is removing material than the faster speed of the charged particle beam for light
Material.
19. methods as claimed in claim 18, wherein, the first laser beam is guided including will from laser beam generate
The beam of device guides first workpiece to outside the vacuum room, and the second laser beam is guided same sharp including being derived from
The beam of light beam generator is directed across beam actuator towards the second workpiece in the vacuum room.
20. methods as claimed in claim 19, wherein, beam is directed across the beam actuator is included in herein below at least
One：Spatial bundle profile modifier, when interfascicular fasciculus profile modifier, frequency shifter, frequency multiplication optics, attenuator, amplifier, modeling
Optics and beam expander.
21. methods as claimed in claim 18, wherein, guide the first laser beam so as to process the first workpiece include by this
One laser beam is guided to the first workpiece being placed in the vacuum room.
22. methods as claimed in claim 21, wherein, first laser beam is guided and second laser beam is guided
Same object lens are passed through towards first work in the vacuum room including guiding the first laser beam and guiding the second laser beam
Part.
23. methods as claimed in claim 21, wherein, first laser beam is guided and second laser beam is guided
Including guide the first laser beam and guide the second laser beam through different object lens towards in the vacuum room this first
Workpiece.
24. methods as described in claim 18 or claim 19, wherein, first laser beam is guided and is swashed to second
Light beam guide including：First laser beam of the guiding from first laser maker, and second laser beam is guided
The second laser beam of second laser maker is derived from including guiding.
25. methods as described in claim 18 or claim 19, wherein, first laser beam is guided and is swashed to second
Light beam guide including：First laser beam of the guiding from first laser maker, and second laser beam is guided
Including guiding from first laser maker second laser beam, wherein, the first laser beam or the second laser beam or two
Individual laser beam passes through beam actuator to change intensity, wavelength or pulse width or frequency.
26. methods as described in claim 18 or claim 19, wherein, the first laser beam and the second laser beam are simultaneously
Its corresponding workpiece is processed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/677854 | 2012-11-15 | ||
| US13/677,854 | 2012-11-15 | ||
| US13/677,854 US9991090B2 (en) | 2012-11-15 | 2012-11-15 | Dual laser beam system used with an electron microscope and FIB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103817434A CN103817434A (en) | 2014-05-28 |
| CN103817434B true CN103817434B (en) | 2017-04-12 |
Family
ID=49554163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310564270.0A Active CN103817434B (en) | 2012-11-15 | 2013-11-14 | Dual laser beam system used with an FIB and/or electron microscope |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9991090B2 (en) |
| EP (1) | EP2733722B1 (en) |
| JP (1) | JP6563166B2 (en) |
| CN (1) | CN103817434B (en) |
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| Publication number | Publication date |
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| US20140131195A1 (en) | 2014-05-15 |
| EP2733722A3 (en) | 2016-03-09 |
| EP2733722A2 (en) | 2014-05-21 |
| US9991090B2 (en) | 2018-06-05 |
| JP2014097531A (en) | 2014-05-29 |
| EP2733722B1 (en) | 2017-05-17 |
| CN103817434A (en) | 2014-05-28 |
| JP6563166B2 (en) | 2019-08-21 |
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