CN103607856A - Manufacturing method for composite flexible printed circuit board - Google Patents
Manufacturing method for composite flexible printed circuit board Download PDFInfo
- Publication number
- CN103607856A CN103607856A CN201310515779.6A CN201310515779A CN103607856A CN 103607856 A CN103607856 A CN 103607856A CN 201310515779 A CN201310515779 A CN 201310515779A CN 103607856 A CN103607856 A CN 103607856A
- Authority
- CN
- China
- Prior art keywords
- flexible substrate
- circuit board
- printed circuit
- flexible printed
- binder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 10
- 239000002131 composite material Substances 0.000 title abstract 2
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000007650 screen-printing Methods 0.000 claims abstract description 8
- 238000010438 heat treatment Methods 0.000 claims abstract description 7
- 239000000758 substrate Substances 0.000 claims description 59
- 239000011230 binding agent Substances 0.000 claims description 24
- 150000001875 compounds Chemical class 0.000 claims description 14
- 239000003795 chemical substances by application Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 239000002245 particle Substances 0.000 claims description 10
- 229920002799 BoPET Polymers 0.000 claims description 7
- 239000005041 Mylar™ Substances 0.000 claims description 7
- -1 isocyanate compound Chemical class 0.000 claims description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 239000012948 isocyanate Substances 0.000 claims description 4
- 230000002101 lytic effect Effects 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 229920002678 cellulose Polymers 0.000 claims description 2
- 239000001913 cellulose Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 239000010949 copper Substances 0.000 claims description 2
- 150000004693 imidazolium salts Chemical class 0.000 claims description 2
- 229910052759 nickel Inorganic materials 0.000 claims description 2
- 239000009719 polyimide resin Substances 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 claims description 2
- 239000000853 adhesive Substances 0.000 abstract 3
- 230000001070 adhesive effect Effects 0.000 abstract 3
- 238000007639 printing Methods 0.000 abstract 2
- 239000000463 material Substances 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 2
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 150000003949 imides Chemical class 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Images
Landscapes
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The invention discloses a manufacturing method for a composite flexible printed circuit board. The method includes the following steps in order: (1) printing a conductive adhesive on a first flexible printed circuit board through screen printing; (2) printing the conductive adhesive on a second flexible printed circuit board through the screen printing; (3) making the first flexible printed circuit board and the second flexible printed circuit board align through alignment of a first registration hole and a second registration hole; (4) bonding the first flexible printed circuit board with the second flexible printed circuit board; (5) heating the bonded first flexible printed circuit board and the second flexible printed circuit board so that the conductive adhesive is solidified.
Description
Technical field
The present invention relates to a kind of printed base plate field, particularly relate to a kind of manufacture method of compound flexible substrate.
Background technology
Flexible substrate (flexible printed circuit board, FPCB) is due to its special bent character, so a large amount of being applied in portable electric appts.Compound flexible substrate is that multi-disc is had to the circuit board structure that the flexible substrate of conductive pattern combines.By compound flexible substrate, can be by electronics miniaturization.
But in prior art, compound flexible substrate all connects by connector conventionally, and this connected mode not only complicate fabrication process, cost cannot reduce, and the more important thing is, owing to having had more connector, therefore the further miniaturization of compound flexible substrate is restricted.
Summary of the invention
The present invention is directed to the problem that prior art exists, a kind of manufacture method of compound flexible substrate is provided, the manufacture method of this flexible substrate can connect without connector, thereby can realize further miniaturization.
The manufacture method of described compound flexible substrate, in turn includes the following steps:
(1) electroconductive binder is printed on the first flexible substrate by silk screen printing;
(2) electroconductive binder is printed on the second flexible substrate by silk screen printing;
(3) by the contraposition of the first and second registration holes, by the first flexible substrate and the alignment of the second flexible substrate;
(4) the first flexible substrate and the second flexible substrate is bonding;
(5) by the first flexible substrate after bonding and the heating of the second flexible substrate, thereby electroconductive binder is solidified.
Wherein, the heating-up temperature of step (5) is 100-150 degree Celsius, and be 0.5-1 hour heating time.
Accompanying drawing explanation
Fig. 1 is the generalized section of compound flexible substrate.
Embodiment
Referring to Fig. 1, the compound flexible substrate that the present invention proposes, has following structure:
Compound flexible substrate comprises the first flexible substrate and the second flexible substrate, and described the first flexible substrate and the second flexible substrate combine by electroconductive binder; Wherein, the first flexible substrate is one side flexible substrate, and it comprises the first base material 100, covers the first conductive pattern 101 and first registration holes 105 on the first base material 100 surfaces;
The second flexible substrate is double-faced flexible substrate, it comprises the second base material 200, cover respectively the second conductive pattern 201 and the 3rd conductive pattern 202 on the first base material 200 two sides, wherein, the second conductive pattern 201 surfaces do not cover insulating barrier, the 3rd conductive pattern 202 surface coverage have insulating barrier 203, and the second registration holes 205;
Wherein, the second registration holes 205 alignment of the first registration holes 105 of the first flexible substrate and the second flexible substrate, the first conductive pattern 101 of described the first flexible substrate is bonded together by electroconductive binder 300 and the second conductive pattern 201 of described the second flexible substrate;
Wherein, described the first base material 100 and the second base material 200 are formed by mylar, for example polyimides, polyimides acid imide or polyethylene naphthalenedicarboxylate formaldehyde;
Wherein, described insulating barrier 203 is insulating resin.
The manufacture method of introducing the compound flexible substrate of the present invention's proposition below, described method in turn includes the following steps:
(1) electroconductive binder 300 is printed on the first flexible substrate by silk screen printing;
(2) electroconductive binder 300 is printed on the second flexible substrate by silk screen printing;
(3) by the contraposition of the first registration holes 105 and the second registration holes 205, by the first flexible substrate and the alignment of the second flexible substrate;
(4) the first flexible substrate and the second flexible substrate is bonding;
(5) by the first flexible substrate after bonding and the heating of the second flexible substrate, thereby electroconductive binder 300 is solidified.
Wherein, the heating-up temperature of step (5) is 100-150 degree Celsius, and be 0.5-1 hour heating time.
The compound flexible substrate that the present invention proposes, the first flexible substrate is directly connected by electroconductive binder 300 with the second flexible substrate, so without by connector, the first flexible substrate being connected to the second flexible substrate, thereby can simplify the structure that the first flexible substrate is connected to the second flexible substrate.
So far the present invention has been done to detailed explanation, but the embodiment of description above the preferred embodiments of the present invention just only, it is not intended to limit the present invention.Those skilled in the art can make any modification to the present invention, and protection scope of the present invention is limited to the appended claims.
Claims (3)
1. a manufacture method for compound flexible substrate, in turn includes the following steps:
(1) electroconductive binder is printed on the first flexible substrate by silk screen printing;
(2) electroconductive binder is printed on the second flexible substrate by silk screen printing;
(3) by the contraposition of the first and second registration holes, by the first flexible substrate and the alignment of the second flexible substrate;
(4) the first flexible substrate and the second flexible substrate is bonding;
(5) by the first flexible substrate after bonding and the heating of the second flexible substrate, thereby electroconductive binder is solidified.
2. the method for claim 1, is characterized in that:
Wherein, the heating-up temperature of step (5) is 100-150 degree Celsius, heating time 0.5-1 hour.
3. method as claimed in claim 2, is characterized in that:
Wherein, electroconductive binder is comprised of conductive particle, binder resin, curing agent and lytic agent; Described conductive particle is nano-level conducting particle, and conductive particle is for example silver, nickel or copper, and particle diameter is 100-200 nanometer; Described binder resin is for example mylar, epoxy resin or polyimide resin; When mylar is used as binder resin, isocyanate compound is as curing agent; When mylar is used as binder resin, curing agent is selected isocyanate compound; When epoxy resin is used as binder resin, curing agent is selected amines or imidazolium compounds; Lytic agent is for example cellulose solvent or butyl carbitol acetate;
Wherein, described insulating barrier is insulating resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310515779.6A CN103607856A (en) | 2013-10-26 | 2013-10-26 | Manufacturing method for composite flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310515779.6A CN103607856A (en) | 2013-10-26 | 2013-10-26 | Manufacturing method for composite flexible printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103607856A true CN103607856A (en) | 2014-02-26 |
Family
ID=50126040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310515779.6A Pending CN103607856A (en) | 2013-10-26 | 2013-10-26 | Manufacturing method for composite flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103607856A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1377393A (en) * | 1999-08-25 | 2002-10-30 | 日立化成工业株式会社 | Adhesive, connecting method of wiring terminal and wiring structure |
| CN1520448A (en) * | 2001-06-25 | 2004-08-11 | ̩�ո��Ϲɷ�����˾ | Anisotropic conductive adhesive with enhanced viscosity, and bonding method and integrated circuit package using the same |
| CN1675754A (en) * | 2003-01-08 | 2005-09-28 | Lg电线株式会社 | Method of microelectrode connection and connected structure of use thereof |
| CN101203095A (en) * | 2006-12-13 | 2008-06-18 | 富葵精密组件(深圳)有限公司 | Preparation method of multilayer flexible circuit board |
| CN102687603A (en) * | 2009-12-24 | 2012-09-19 | 住友电木株式会社 | Conductive connection material, electronic component producing method, and electronic member and electronic component with conductive connection material |
-
2013
- 2013-10-26 CN CN201310515779.6A patent/CN103607856A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1377393A (en) * | 1999-08-25 | 2002-10-30 | 日立化成工业株式会社 | Adhesive, connecting method of wiring terminal and wiring structure |
| CN1520448A (en) * | 2001-06-25 | 2004-08-11 | ̩�ո��Ϲɷ�����˾ | Anisotropic conductive adhesive with enhanced viscosity, and bonding method and integrated circuit package using the same |
| CN1675754A (en) * | 2003-01-08 | 2005-09-28 | Lg电线株式会社 | Method of microelectrode connection and connected structure of use thereof |
| CN101203095A (en) * | 2006-12-13 | 2008-06-18 | 富葵精密组件(深圳)有限公司 | Preparation method of multilayer flexible circuit board |
| CN102687603A (en) * | 2009-12-24 | 2012-09-19 | 住友电木株式会社 | Conductive connection material, electronic component producing method, and electronic member and electronic component with conductive connection material |
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| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140226 |