CN103576810B - Electronic device - Google Patents

Abstract

The invention provides an electronic device, which comprises a body and a shape memory alloy element, wherein the body is provided with a surface and a heat dissipation opening arranged on the surface, and the shape memory alloy element is arranged on the heat dissipation opening. When the temperature of the shape memory alloy element is lower than a critical temperature, the shape memory alloy element presents a first shape and shields the heat dissipation opening; when the shape memory alloy element is heated to enable the temperature to rise and exceed the critical temperature, the shape memory alloy element deforms and protrudes out of the surface, at the moment, the shape memory alloy element is in a second shape, a channel is formed between the shape memory alloy element and the body, heat energy can leave the electronic device through the channel, the heat dissipation efficiency of the electronic device can be improved, and the service life of the internal element of the electronic device can be prolonged.

Description

electronic device

technical field

The invention relates to an electronic device, in particular to an electronic device with a shape memory alloy element.

Background technique

The problem of heat dissipation has long been a major problem in the mechanical design of portable electronic devices such as notebook computers and tablet computers. Common electronic devices usually use fans with cooling holes to dissipate heat. However, due to the current electronic device body Designs are becoming thinner and thinner, and the available heat dissipation space inside them is relatively reduced, so that the overall heat dissipation efficiency is not ideal, and it cannot meet the heat dissipation requirements of current high-speed electronic devices. In view of this, how to break through the existing heat dissipation limitation has become an important issue.

Contents of the invention

An embodiment of the present invention provides an electronic device, including a body and a shape memory alloy element, wherein the body is formed with a surface and a heat dissipation opening, wherein the heat dissipation opening is disposed on the surface, and the shape memory alloy element is disposed on the heat dissipation opening. When the temperature of the shape memory alloy element is lower than a critical temperature, the shape memory alloy element presents a first shape and covers the heat dissipation opening; when the shape memory alloy element is heated to increase the temperature and exceeds the critical temperature, the shape memory alloy element deforms and protrude from the surface. At this time, the shape memory alloy element presents a second shape and forms a channel with the main body.

In one embodiment, when the shape memory alloy element is cooled and the temperature drops below the critical temperature, the shape memory alloy element recovers from the second shape to the first shape and shields the heat dissipation opening.

In one embodiment, the aforementioned critical temperature is between 40°C and 65°C.

In one embodiment, the aforementioned shape memory alloy element has a two-way memory effect.

In one embodiment, the material of the shape memory alloy element includes iron-based alloy, nickel-titanium alloy or copper-based alloy.

In one embodiment, when the above-mentioned shape memory alloy element is heated to increase the temperature and exceed the critical temperature, at least a part of the shape memory alloy element is converted from the state of martensite (martensite) to wastite (austenite) state.

In one embodiment, the above-mentioned shape memory alloy element is formed with a plurality of slits, when the temperature of the shape memory alloy element is lower than the critical temperature, the slit is in a closed state; when the shape memory alloy element is heated, the temperature rises and exceeds the critical temperature. When the temperature is high, the shape memory alloy element deforms and expands the slit to an open state.

In one embodiment, the aforementioned slits are arranged at intervals.

In one embodiment, the aforementioned body includes a sliding slot, and the shape memory alloy element is accommodated in the sliding slot.

In one embodiment, when the shape memory alloy element is deformed, the shape memory alloy element moves in the slide groove.

Description of drawings

FIG. 1 shows a schematic diagram of a shape memory alloy element according to an embodiment of the present invention when it presents a first shape;

Fig. 2 shows the schematic diagram when the shape memory alloy element of an embodiment of the present invention presents a second shape;

Fig. 3 shows the schematic diagram when the shape memory alloy element of another embodiment of the present invention presents the first shape;

Fig. 4 represents the sectional view along A-A ' direction among Fig. 3;

Fig. 5 shows the schematic diagram when the shape memory alloy element of another embodiment of the present invention presents a second shape; and

Fig. 6 shows a sectional view along the direction B-B' in Fig. 5 .

Wherein, the reference signs are explained as follows:

Body 1; shape memory alloy element 2;

Cooling opening 11; Cooling hole 12;

chute 13; slot 21;

Electronics E; Channel P;

Surface S1.

detailed description

First, please refer to FIG. 1 and FIG. 2 together, which shows an electronic device E according to an embodiment of the present invention, such as a notebook computer or a tablet computer, mainly including a body 1 and a shape memory alloy element 2, wherein the body 1 A surface S1 and a heat dissipation opening 11 disposed on the surface S1 are formed. In this embodiment, the heat dissipation opening 11 is, for example, a rectangular opening. The aforementioned shape memory alloy element 2 is roughly a rectangular structure and is disposed on the heat dissipation opening 11 , wherein the shape memory alloy element 2 is formed with a plurality of slits 21 , and the slits 21 extend toward the same direction and are arranged at intervals. As shown in FIG. 2 , the shape memory alloy element 2 can deform when its temperature is higher than a critical temperature, and forms a channel P with the body 1 to improve the heat dissipation efficiency of the electronic device E.

It should be noted that the material of the aforementioned shape memory alloy element 2 is an alloy with a two-way shape memory effect, such as an iron-based alloy, a nickel-titanium alloy or a copper-based alloy.

In FIG. 1, when the electronic device E has not started to operate or the temperature is low, since the temperature of the shape memory alloy element 2 is lower than a critical temperature, it presents a substantially flat plate shape (first shape), wherein the critical temperature can be Between 40° C. and 65° C., and at this time, the shape memory alloy element 2 completely covers the heat dissipation opening 11 . Since the slit 21 is closed at this time, it is possible to prevent foreign matter such as dust from entering the electronic device E through the slit 21 or the heat dissipation opening 11 and causing damage.

Next, please refer to FIG. 2 , when the electronic device E starts to operate and the electronic components inside generate a large amount of heat energy, part of the heat energy will be transferred to the shape memory alloy element 2 and heat it up. When the temperature of the shape-memory alloy element 2 rises and exceeds the critical temperature, at least a part of the alloy material of the shape-memory alloy element 2 will be converted from a grain-like bulk state to a Worth-field state, so that the shape-memory alloy element 2 will start to deform. At the same time, the shape memory alloy element 2 will protrude from the surface S1 and form an arc shape (second shape), and at the same time, two channels P are formed between the body 1, so that heat energy can be dissipated through the channels P, thereby improving the heat dissipation efficiency of the electronic device E , and prolong the service life of its internal components.

In particular, when the shape memory alloy element 2 is heated so that its temperature rises and exceeds the critical temperature, the shape memory alloy element 2 will be deformed into an arc shape, and the slit 21 on it will expand to an open state (as shown in Figure 2 ). Therefore, heat energy can also leave the electronic device E quickly through the expanded slit 21 to further achieve the effect of heat dissipation.

Conversely, when the shape memory alloy element 2 is cooled and the temperature is lowered below the critical temperature, the shape memory alloy element 2 will return from an arc shape (second shape) to a flat plate shape (first shape), and cover the heat dissipation opening again 11. At this time, the slit 21 will return from the open state to the closed state.

Then please refer to Fig. 3 and Fig. 4 together, wherein Fig. 4 shows a cross-sectional view along the direction A-A' in Fig. 3 . The electronic device E in another embodiment of the present invention further includes a plurality of heat dissipation holes 12 ( FIG. 3 ) and a plurality of sliding grooves 13 ( FIG. 4 ), and the aforementioned shape memory alloy element 2 is adjacent to the heat dissipation holes 12 . When the temperature of the shape memory alloy element 2 is lower than the critical temperature, the shape memory alloy element 2 presents a flat plate shape (the first shape) and covers the heat dissipation opening 11 , and the electronic device E only dissipates heat through the heat dissipation hole 12 . As shown in FIG. 4 , the sliding slots 13 are disposed on both sides of the heat dissipation opening 11 , and the two side edges of the shape memory alloy element 2 are accommodated in the sliding slots 13 .

Please refer to Fig. 5 and Fig. 6 together again, wherein Fig. 6 shows a sectional view along the direction B-B' in Fig. 5 . When the temperature of the shape memory alloy element 2 rises and exceeds the critical temperature, the shape memory alloy element 2 will start to deform and form an arc (second shape), and at the same time form a channel P with the body 1, wherein the channel P is adjacent to the heat sink At this time, the heat energy can leave the electronic device E through the channel P and the heat dissipation hole 12 at the same time, so that the electronic device E can dissipate heat more efficiently.

As shown in Figure 6, when the shape memory alloy element 2 is deformed, the edge portion of the shape memory alloy element 2 can slide in the sliding groove 13, and at this time, the central portion of the shape memory alloy element 2 will protrude upwards, and A channel P is formed between the bodies 1 .

To sum up, the present invention provides an electronic device, which mainly includes a body and a shape memory alloy element, wherein the body forms a surface and a heat dissipation opening disposed on the surface, and the shape memory alloy element is disposed on the heat dissipation opening. When the temperature of the shape memory alloy element is lower than a critical temperature, the shape memory alloy element presents a first shape and covers the heat dissipation opening; when the shape memory alloy element is heated to increase the temperature and exceeds the critical temperature, the shape memory alloy element deforms And protrude from the surface, at this time, the shape memory alloy element presents a second shape, and forms a channel with the body, so that heat energy can leave the electronic device through the channel, thereby improving the heat dissipation efficiency of the electronic device and extending its internal components service life.

Although the present invention is disclosed by the aforementioned embodiments, they are not intended to limit the present invention. Those skilled in the art to which the present invention belongs may make many modifications and changes without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be determined by the scope defined by the appended claims.

Claims (9)

1. a kind of electronic installation, including：

One body, is formed with a surface and a radiating opening and a chute, and the wherein radiating opening is arranged on the surface；And

One shape memory alloy component, is arranged on the radiating opening and is placed in the chute；

Wherein, when the temperature of the shape memory alloy component is less than a critical-temperature, the shape memory alloy component is presented one First shape, and cover the radiating opening；Temperature is increased and surmount the critical-temperature when the shape memory alloy component is heated When, the shape memory alloy component produce deformation, now the shape memory alloy component present one second shape, and with the body Between form a passage.

2. electronic installation as claimed in claim 1, wherein when the shape memory alloy component is cooled down and makes temperature be reduced to this When below critical-temperature, the shape memory alloy component is recovered to the first shape by second shape, and is covered the radiating and opened Mouthful.

3. electronic installation as claimed in claim 1, wherein the critical-temperature is between 40 DEG C to 65 DEG C.

4. electronic installation as claimed in claim 1, wherein shape memory alloy component has double-pass memory effect.

5. electronic installation as claimed in claim 1, the wherein material of the shape memory alloy component include ferrous alloy, nickel- Titanium alloy or acid bronze alloy.

6. electronic installation as claimed in claim 1, wherein making temperature rise and surmount when the shape memory alloy component is heated During the critical-temperature, at least one of shape memory alloy component is by abampere State Transferring into austenite state.

7. electronic installation as claimed in claim 1, the wherein shape memory alloy component is formed with multiple slits, when the shape When the temperature of memory alloy element is less than the critical-temperature, the multiple slit is presented a closure state；When the shape memory is closed Gold dollar part is heated when temperature is increased and surmounting the critical-temperature, and the shape memory alloy component produces deformation, and makes described many Individual slit is expanded to an opening.

8. electronic installation as claimed in claim 7, wherein the multiple slit is to be spaced.

9. electronic installation as claimed in claim 1, wherein when the shape memory alloy component produces deformation, the shape memory Alloying element is moved in the chute.