CN103551957B - Single side polishing machine - Google Patents

Abstract

The invention discloses a kind of single side polishing machine, comprise: casing, be arranged on dumping in described casing, grind platen, cylinder and electric rotating machine, above dumping described in described grinding platen is arranged on, described cylinder and electric rotating machine control described grinding platen knee-action and rotation respectively, and the inside of described grinding platen is provided with center cylinder.The mode that the present invention adopts center cylinder to pressurize makes the bottom of grinding platen produce a certain amount of deflection, thus improves the uniformity of wafer thickness.

Description

Single side polishing machine

technical field

The invention relates to a polishing machine, in particular to a single-side polishing machine.

Background technique

When polishing semiconductor wafers (such as silicon wafers, gallium arsenide, germanium wafers, sapphire, indium phosphide, etc.), the flatness control of the polishing disc of the single-chip polishing machine is a key technology that affects the wafer polishing accuracy. The current single-side polishing machine, because the polishing disc and the grinding upper disc have different radii and linear speeds during work, only a single plane is used to pressurize, resulting in inconsistent thickness inside and outside, which affects the quality of the wafer.

Contents of the invention

The invention provides a single-side polishing machine to overcome the problem of inconsistent thickness when the single-side polishing machine polishes wafers in the prior art.

In order to solve the above technical problems, the present invention provides a single-sided polishing machine, comprising: a casing, a throwing plate arranged in the casing, a grinding platen, a cylinder and a rotating motor, and the grinding platen is arranged on the throwing plate Above, the air cylinder and the rotating motor respectively control the up and down movement and rotation of the grinding platen, and a central air cylinder is arranged inside the grinding platen.

Preferably, a plurality of rotary cylinders are arranged around the throwing plate.

Preferably, the grinding platen also includes: a porcelain plate, a top plate, a top plate and an outer ring, wherein the top plate is arranged on the top of the outer ring and fixedly connected to the cylinder, and the central cylinder is arranged on the The center of the outer ring is in contact with the top plate, and the porcelain plate is fixed on the bottom of the outer ring.

Preferably, the top plate is provided with an air inlet corresponding to the central cylinder.

Preferably, the grinding platen is provided with two groups.

Preferably, a control panel is also arranged on the casing.

Compared with the prior art, the present invention has the following advantages: the present invention adopts the central air cylinder to pressurize the bottom of the grinding platen to produce a certain amount of deformation, thereby improving the consistency of wafer thickness.

Description of drawings

Fig. 1 is the front view of a single-side polishing machine in a specific embodiment of the present invention;

Fig. 2 is a schematic structural view of a grinding platen of a single-side polishing machine in a specific embodiment of the present invention;

Fig. 3 is a rear view of a single-side polishing machine in a specific embodiment of the present invention.

In the figure: 10-chassis, 20-throwing plate, 30-grinding pressure plate, 301-central cylinder, 302-top plate, 303-top plate, 304-porcelain plate, 305-outer ring, 306-air inlet, 40- Cylinder, 50-turn cylinder, 60-control panel.

detailed description

In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. It should be noted that all the drawings of the present invention are in simplified form and use inaccurate scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.

Please refer to Figs. 1-3, the single-side polishing machine of the present invention includes: a casing 10, a throwing plate 20 arranged in the casing 10, a grinding platen 30, a cylinder 40 and a rotating motor, the grinding platen 30 Arranged above the throwing plate 20 , the air cylinder 40 and the rotating motor respectively control the vertical movement and rotation of the grinding platen 30 , and a central air cylinder 301 is arranged inside the grinding platen 30 . Specifically, the rotating motor is used to control the rotation of the grinding platen 30, the cylinder 40 controls the lifting or lowering of the grinding platen 30, and the central cylinder 301 works when the grinding platen 30 presses the wafer, The bottom of the grinding platen 30 is deformed so that the grinding thickness of the center of the wafer is consistent with that of the surrounding area. Therefore, in the present invention, the central cylinder 301 is used to pressurize the bottom of the grinding platen 30 to produce a certain amount of deformation, thereby improving the consistency of the wafer thickness.

Please continue to refer to Figures 1 to 3. As a preference, multiple rotary cylinders 50 are arranged around the throwing plate 20 to control the rotation of the throwing plate 20. Further, the grinding platen 30 is provided with two groups, which can be used for multiple Wafers can be polished at the same time to improve production efficiency.

Please refer to Fig. 2 emphatically, the described grinding platen 30 also includes: a porcelain plate 304, a top plate 303, a top plate 302 and an outer ring 305, wherein the top plate 302 is arranged on the top of the outer ring 305 and is connected to the The cylinder 40 is fixedly connected, the central cylinder 301 is arranged at the center of the outer ring 305 and contacts the top plate 303 , and the porcelain plate 304 is fixed at the bottom of the outer ring 305 . Further, the top plate 302 is provided with an air inlet 306 corresponding to the central cylinder 301 . As shown by the dotted line in Figure 2, when the grinding platen 30 was working, the cylinder 40 drove the grinding platen 30 to move downward, and the central cylinder 301 moved to move the magnetic disk 304 through the top plate 303, so that the magnetic disk 304 produced a certain amount of deformation (such as Shown by the dotted line in FIG. 2 ), to ensure the polishing amount of the center and periphery of the wafer when the throwing plate 20 and the grinding platen 30 rotate, thereby improving the consistency of the wafer thickness.

Referring to FIG. 3 , a control panel 60 is provided on the casing 10 for adjusting various parameters in the single-side polishing machine, and the operation of the single-side polishing machine can be monitored through the control panel 60 .

In summary, the single-side polishing machine of the present invention includes: a casing 10, a throwing plate 20 arranged in the casing 10, a grinding platen 30, a cylinder 40 and a rotating motor, and the grinding platen 30 is arranged on Above the throwing plate 20 , the air cylinder 40 and the rotating motor respectively control the vertical movement and rotation of the grinding platen 30 , and a central air cylinder 301 is arranged inside the grinding platen 30 . In the present invention, the central cylinder 301 is used to pressurize the bottom of the grinding platen 30 to produce a certain amount of deformation, thereby improving the consistency of the wafer thickness.

Obviously, those skilled in the art can make various changes and modifications to the invention without departing from the spirit and scope of the invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and equivalent technologies thereof, the present invention also intends to include these modifications and variations.

Claims (5)

1. A single-side polishing machine, characterized in that, comprising: a casing, a throwing plate arranged in the casing, a grinding platen, a cylinder and a rotating motor, the grinding platen is arranged above the throwing plate, and the The cylinder and the rotating motor respectively control the up and down movement and rotation of the grinding platen, and a central cylinder is arranged inside the grinding platen; the grinding platen also includes: a porcelain plate, a top plate, a top plate and an outer ring, wherein , the top plate is arranged on the top of the outer ring and fixedly connected to the cylinder, the central cylinder is arranged in the center of the outer ring and contacts the top plate, and the porcelain plate is fixed on the bottom of the outer ring. 2. The single-side polishing machine according to claim 1, wherein a plurality of rotary cylinders are arranged around the throwing plate. 3. The single-side polishing machine according to claim 1, wherein an air inlet corresponding to the central cylinder is provided in the top plate. 4. The single-side polishing machine according to claim 1, characterized in that there are two sets of grinding platens. 5. The single-side polishing machine according to claim 1, wherein a control panel is further arranged on the casing.