CN103514816A - LED module display module spliced unit - Google Patents
LED module display module spliced unit Download PDFInfo
- Publication number
- CN103514816A CN103514816A CN201310459392.3A CN201310459392A CN103514816A CN 103514816 A CN103514816 A CN 103514816A CN 201310459392 A CN201310459392 A CN 201310459392A CN 103514816 A CN103514816 A CN 103514816A
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- led
- circuit board
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- display module
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- 239000000463 material Substances 0.000 claims abstract description 19
- 238000002834 transmittance Methods 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 claims description 46
- 238000012986 modification Methods 0.000 claims description 10
- 230000004048 modification Effects 0.000 claims description 10
- 238000005507 spraying Methods 0.000 claims description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 7
- 239000000741 silica gel Substances 0.000 claims description 7
- 229910002027 silica gel Inorganic materials 0.000 claims description 7
- 239000004593 Epoxy Substances 0.000 claims description 6
- 239000000499 gel Substances 0.000 claims description 6
- 238000013036 cure process Methods 0.000 claims description 4
- 229920000620 organic polymer Polymers 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 abstract description 5
- 230000001681 protective effect Effects 0.000 abstract 3
- 239000003973 paint Substances 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 7
- 239000002184 metal Substances 0.000 description 6
- 239000002390 adhesive tape Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 1
- 239000011222 crystalline ceramic Substances 0.000 description 1
- 229910002106 crystalline ceramic Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention relates to an LED module display module spliced unit. The LED module display module spliced unit comprises an LED display module and a light-transmitting decorative film adhering to the surface of the LED display module; the LED display module is composed of a driving IC, a driving circuit board, an LED wafer, a black paint layer and a transparent protective glue layer; the driving IC is welded to the back surface of the driving circuit board, and the LED wafer is fixed on the front surface of the driving circuit board; the front surface, away from the surface of the LED wafer, of the driving circuit board is coated with the black paint layer, and the transparent protective glue layer is attached to the front surface of the driving circuit board; the light-transmitting decorative film adheres to the front surface of the transparent protective glue layer, the light-transmitting decorative film is gray, the light transmittance ranges from 30% to 90%, and the thickness ranges from 0.1mm to 3mm. The light-transmitting decorative films used by all spliced units in an LED display module are formed by one whole film base material in a cutting mode, and the surface of the whole module is high in surface evenness and good in color consistency after splicing.
Description
Technical field
The invention belongs to LED technical field of flat panel display, relate to a kind of LED and show module concatenation unit, by the LED of this unit spliced, show that module surface smoothness is high, colour consistency good.
Background technology
At present, high density LED display device has (ZL200820072169.8) two kinds of modules of module that the three-in-one mode of Surface Mount (SMD) forms and " integrated three-in-one ".For SMD mode, on the one hand, each pixel needs high-end devices to encapsulate separately, and comparatively complexity is installed, and has increased production cost; On the other hand, the packing forms of this single tube individual packages, due to the too much ，PCB of single tube pin circuit layout few of space, adds the requirement to display performance and face shield technique etc., accomplishes that more small pixel spacing potentiality space is little, technical difficulty is large." integrated three-in-one " display module comprises the LED display module consisting of drive IC, drive circuit board and LED wafer, and drive IC is welded on drive circuit board, and LED wafer is fixed on the front surface of drive circuit board.Display module can be for having face shield and without two kinds of face shields.When using face shield substrate, black face shield substrate has light hole corresponding to the position of LED wafer, and each LED wafer embeds embedding to be had in the light hole of transparent colloid.When not using face shield substrate, the spraying of drive circuit board front surface is pitch-dark, and on drive circuit board and LED wafer, integral body is carried out encapsulating, and protection glue is transparent insulation glue.But no matter there is face shield or without the display module of face shield, be all difficult to guarantee that blackness and flatness consistance between modules reach very high level.Can cause a plurality of modules are combined into after module like this, module surface presents high or low out-of-flatness situation and the faint minute block distribution of module surface color, so that affects the aesthetic appearance of display screen.
Summary of the invention
The technical problem to be solved in the present invention is to provide a kind of LED and shows module concatenation unit, by the LED of this unit spliced, shows that module surface smoothness is high, colour consistency good.
In order to solve the problems of the technologies described above, LED of the present invention shows that module concatenation unit comprises LED display module and the printing opacity modification film that is pasted on this display module surface; Described LED display module can also consist of drive IC and drive circuit board, LED wafer, pitch-dark layer, transparency protected glue-line; Described drive IC is welded on the back side of drive circuit board, and LED wafer is fixed on the front of drive circuit board; The surface spraying that LED wafer is avoided in drive circuit board front has pitch-dark layer, and transparency protected glue-line is attached to drive circuit board front; Printing opacity is modified film and is pasted on the front surface of transparency protected glue-line; It is grey that printing opacity is modified film color, and transmittance is more than or equal to 30% and is less than or equal to 90%, and thickness is more than or equal to 0.1mm and is less than or equal to 3mm.
The transmittance that described printing opacity is modified film 2 is preferably greater than and equals 60% and be less than or equal to 90%.
The thickness that described printing opacity is modified film 2 is preferably greater than and equals 0.5mm and be less than or equal to 2mm.
It can be organic polymer light transmissive material that described printing opacity is modified film 2.
Described printing opacity is modified film 2 outside surfaces for the surface through sub-light and cure process.
It can also be the inorganic light transmissive material of hard that described printing opacity is modified film 2.
Described printing opacity is modified the surface of film 2 outside surfaces for processing through sub-light.
LED shows that in module, each concatenation unit printing opacity modification film used is sheared and formed by one whole film mother metal, and after splicing, the surface smoothness of module integral body is high, colour consistency good.Printing opacity is modified film outside surface and is processed through sub-light, can reduce mirror-reflection effect, and the space of improving LED display contrast and demonstration is bright, Colour consistance.When printing opacity is modified film employing organic polymer light transmissive material, anti-zoned degree, through cure process, can be improved in its surface.
Described transparency protected glue-line material is the transparent adhesive tapes such as transparent epoxy insulating gel or silica gel.
Accompanying drawing explanation
Below in conjunction with the drawings and specific embodiments, the present invention is described in further detail.
Fig. 1 is the front schematic view that LED of the present invention shows module concatenation unit embodiment 1～5.
Fig. 2 is the cross-sectional view that LED of the present invention shows module concatenation unit embodiment 1～5.
Embodiment
As shown in Figure 1, 2, LED of the present invention shows that module concatenation unit comprises: LED display module is modified film with the printing opacity that is pasted on this display module surface.Described LED display module consists of drive IC 6 and drive circuit board 5, LED wafer 1, pitch-dark layer 7, transparency protected glue-line 8.Dot spacing is d=1.5mm, and resolution is 64 * 64.Described drive IC 6 is welded on the back side of drive circuit board 5, and LED wafer 1 is fixed on the front of drive circuit board 5; The surface spraying that LED wafer 1 is avoided in drive circuit board 5 fronts has pitch-dark layer 7, and transparency protected glue-line 8 is attached to drive circuit board 5 fronts, and transparency protected glue-line 8 materials are other transparent adhesive tapes such as transparent epoxy insulating gel or silica gel.Printing opacity is modified film 2 and is pasted on the front surface of transparency protected glue-line 8.The color that described printing opacity is modified film 2 is grey, and transmittance is 70%, and thickness is 2mm, and material is PC material.Printing opacity is modified film 2 outside surfaces and is processed through sub-light, has reduced mirror-reflection effect, and the space of improving display comparison degree and demonstration is bright, look distribution consistance.In LED demonstration module, each concatenation unit printing opacity modification film used is sheared and is formed by one whole film mother metal, thereby guarantees surface smoothness and the colour consistency of the rear module integral body of splicing.
Embodiment 2
As shown in Figure 1, 2, LED of the present invention shows that module concatenation unit comprises: LED display module is modified film with the printing opacity that is pasted on this display module surface.Described LED display module consists of drive IC 6 and drive circuit board 5, LED wafer 1, pitch-dark layer 7, transparency protected glue-line 8.Dot spacing is d=1mm, and resolution is 64 * 64.Described drive IC 6 is welded on the back side of drive circuit board 5, and LED wafer 1 is fixed on the front of drive circuit board 5; The surface spraying that LED wafer 1 is avoided in drive circuit board 5 fronts has pitch-dark layer 7, and transparency protected glue-line 8 is attached to drive circuit board 5 fronts, and transparency protected glue-line 8 materials are other transparent adhesive tapes such as transparent epoxy insulating gel or silica gel.Printing opacity is modified film 2 and is pasted on the front surface of transparency protected glue-line 8.The color that described printing opacity is modified film 2 is grey, and transmittance is 30%, and thickness is 0.1mm, and material is crystalline ceramics, contributes to heat radiation.Printing opacity is modified film 2 outside surfaces and is processed through sub-light, has reduced mirror-reflection effect, and the space of improving display comparison degree and demonstration is bright, look distribution consistance.In LED demonstration module, each concatenation unit printing opacity modification film used is sheared and is formed by one whole film mother metal, thereby guarantees surface smoothness and the colour consistency of the rear module integral body of splicing.
As shown in Figure 1, 2, LED of the present invention shows that module concatenation unit comprises: LED display module is modified film with the printing opacity that is pasted on this display module surface.Described LED display module consists of drive IC 6 and drive circuit board 5, LED wafer 1, pitch-dark layer 7, transparency protected glue-line 8.Dot spacing is d=2.5mm, and resolution is 64 * 64.Described drive IC 6 is welded on the back side of drive circuit board 5, and LED wafer 1 is fixed on the front of drive circuit board 5; The surface spraying that LED wafer 1 is avoided in drive circuit board 5 fronts has pitch-dark layer 7, and transparency protected glue-line 8 is attached to drive circuit board 5 fronts, and transparency protected glue-line 8 materials are other transparent adhesive tapes such as transparent epoxy insulating gel or silica gel.Printing opacity is modified film 2 and is pasted on the front surface of transparency protected glue-line 8.The color that described printing opacity is modified film 2 is grey, and transmittance is 60%, and thickness is 1.5mm, and material is PMMA.Printing opacity is modified film 2 outside surfaces through sub-light and cure process, has reduced mirror-reflection effect, and the space of improving display comparison degree and demonstration is bright, look distribution consistance and anti-zoned degree.In LED demonstration module, each concatenation unit printing opacity modification film used is sheared and is formed by one whole film mother metal, thereby guarantees surface smoothness and the colour consistency of the rear module integral body of splicing.
As shown in Figure 1, 2, LED of the present invention shows that module concatenation unit comprises: LED display module is modified film with the printing opacity that is pasted on this display module surface.Described LED display module consists of drive IC 6 and drive circuit board 5, LED wafer 1, pitch-dark layer 7, transparency protected glue-line 8.Dot spacing is d=2.5mm, and resolution is 64 * 64.Described drive IC 6 is welded on the back side of drive circuit board 5, and LED wafer 1 is fixed on the front of drive circuit board 5; The surface spraying that LED wafer 1 is avoided in drive circuit board 5 fronts has pitch-dark layer 7, and transparency protected glue-line 8 is attached to drive circuit board 5 fronts, and transparency protected glue-line 8 materials are other transparent adhesive tapes such as transparent epoxy insulating gel or silica gel.Printing opacity is modified film 2 and is pasted on the front surface of transparency protected glue-line 8.The color that described printing opacity is modified film 2 is grey, and transmittance is 60%, and thickness is 3mm, and material is PVC, increases thicknesses of layers and contributes to reduce Moire fringe effect.Printing opacity is modified film 2 outside surfaces and is processed through sub-light, has reduced mirror-reflection effect, and the space of improving display comparison degree and demonstration is bright, look distribution consistance.In LED demonstration module, each concatenation unit printing opacity modification film used is sheared and is formed by one whole film mother metal, thereby guarantees surface smoothness and the colour consistency of the rear module integral body of splicing.
As shown in Figure 1, 2, LED of the present invention shows that module concatenation unit comprises: LED display module is modified film with the printing opacity that is pasted on this display module surface.Described LED display module consists of drive IC 6 and drive circuit board 5, LED wafer 1, pitch-dark layer 7, transparency protected glue-line 8.Dot spacing is d=1.25mm, and resolution is 64 * 64.Described drive IC 6 is welded on the back side of drive circuit board 5, and LED wafer 1 is fixed on the front of drive circuit board 5; The surface spraying that LED wafer 1 is avoided in drive circuit board 5 fronts has pitch-dark layer 7, and transparency protected glue-line 8 is attached to drive circuit board 5 fronts, and transparency protected glue-line 8 materials are silica gel.Printing opacity is modified film 2 and is pasted on the front surface of transparency protected glue-line 8.The color that described printing opacity is modified film 2 is grey, and transmittance is 90%, and thickness is 0.5mm, and material is glass.Printing opacity is modified film 2 outside surfaces and is processed through sub-light, has reduced mirror-reflection effect, and the space of improving display comparison degree and demonstration is bright, look distribution consistance.In LED demonstration module, each concatenation unit printing opacity modification film used is sheared and is formed by one whole film mother metal, thereby guarantees surface smoothness and the colour consistency of the rear module integral body of splicing.
The prompting of book and guidance according to the above description, those skilled in the art in the invention can also carry out suitable change and modification to above-mentioned embodiment.Therefore, the present invention is not limited to embodiment disclosed and described above, within also should belonging to the protection domain of claim of the present invention to modifications and changes more of the present invention.In addition,, although used some specific terms in this instructions, these terms just for convenience of description, do not form any restriction to the present invention.
Claims (8)
1. LED shows a module concatenation unit, it is characterized in that the printing opacity modification film (2) that comprises LED display module and be pasted on this display module surface; Described LED display module consists of drive IC (6) and drive circuit board (5), LED wafer (1), pitch-dark layer (7), transparency protected glue-line (8); Drive IC (6) is welded on the back side of drive circuit board (5), and LED wafer (1) is fixed on the front of drive circuit board (5); The surface spraying that LED wafer (1) is avoided in drive circuit board (5) front has pitch-dark layer (7), and transparency protected glue-line (8) is attached to drive circuit board (5) front; Printing opacity is modified film (2) and is pasted on the front surface of transparency protected glue-line (8); The color that printing opacity is modified film (2) is grey, and transmittance is more than or equal to 30% and is less than or equal to 90%, and thickness is more than or equal to 0.1mm and is less than or equal to 3mm.
2. LED according to claim 1 shows module concatenation unit, it is characterized in that described printing opacity modifies the transmittance of film (2) and be more than or equal to 60% and be less than or equal to 90%.
3. LED according to claim 1 shows module concatenation unit, it is characterized in that described printing opacity modifies the thickness of film (2) and be more than or equal to 0.5mm and be less than or equal to 2mm.
4. LED according to claim 1 shows module concatenation unit, it is characterized in that it is organic polymer light transmissive material that described printing opacity is modified film (2).
5. LED according to claim 4 shows module concatenation unit, it is characterized in that it is the surface through sub-light and cure process that described printing opacity is modified film (2) outside surface.
6. LED according to claim 1 shows module concatenation unit, it is characterized in that it is the inorganic light transmissive material of hard that described printing opacity is modified film (2).
7. LED according to claim 6 shows module concatenation unit, it is characterized in that it is the surface of processing through sub-light that described printing opacity is modified film (2) outside surface.
8. LED according to claim 1 shows module concatenation unit, it is characterized in that described transparency protected glue-line (8) material is transparent epoxy insulating gel or silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310459392.3A CN103514816A (en) | 2013-09-29 | 2013-09-29 | LED module display module spliced unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310459392.3A CN103514816A (en) | 2013-09-29 | 2013-09-29 | LED module display module spliced unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103514816A true CN103514816A (en) | 2014-01-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310459392.3A Pending CN103514816A (en) | 2013-09-29 | 2013-09-29 | LED module display module spliced unit |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103824528A (en) * | 2014-02-14 | 2014-05-28 | 利亚德光电股份有限公司 | Led display device |
| CN105427754A (en) * | 2015-09-02 | 2016-03-23 | 吴冬梅 | LED display screen |
| CN106683578A (en) * | 2016-12-01 | 2017-05-17 | 长春希达电子技术有限公司 | LED display screen capable of eliminating color difference among modules and manufacturing method of LED display screen |
| DE102015122737A1 (en) * | 2015-12-23 | 2017-06-29 | Osram Opto Semiconductors Gmbh | Video wall module and method of making a video wall module |
| CN107731122A (en) * | 2017-11-28 | 2018-02-23 | 深圳市秀狐科技有限公司 | A kind of gelatin LED display and its processing method |
| CN109817104A (en) * | 2019-01-08 | 2019-05-28 | 长春希达电子技术有限公司 | A kind of LED array of display mould group of thin-film package |
| CN111028701A (en) * | 2019-11-29 | 2020-04-17 | 深圳集简设计有限公司 | LED display screen |
| CN111477121A (en) * | 2020-05-26 | 2020-07-31 | 深圳市洲明科技股份有限公司 | Manufacturing method of L ED display screen |
| CN111599909A (en) * | 2020-05-21 | 2020-08-28 | 东莞市中麒光电技术有限公司 | LED display screen module and preparation method thereof |
| CN112992958A (en) * | 2020-07-21 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | LED display unit, LED display screen and manufacturing method thereof |
| WO2021120386A1 (en) * | 2019-12-20 | 2021-06-24 | 东莞阿尔泰显示技术有限公司 | Integrated-package display module |
| CN113528020A (en) * | 2021-07-14 | 2021-10-22 | 广州慧谷化学有限公司 | LED nanometer black coating and LED display module |
| CN115050857A (en) * | 2022-04-29 | 2022-09-13 | 深圳博元新材科技有限公司 | Manufacturing method of LED display panel, display panel and electronic equipment |
| CN116741062A (en) * | 2023-08-15 | 2023-09-12 | 长春希龙显示技术有限公司 | A packaging process method for an LED display module and an LED display module |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103824528A (en) * | 2014-02-14 | 2014-05-28 | 利亚德光电股份有限公司 | Led display device |
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| DE102015122737A1 (en) * | 2015-12-23 | 2017-06-29 | Osram Opto Semiconductors Gmbh | Video wall module and method of making a video wall module |
| CN106683578A (en) * | 2016-12-01 | 2017-05-17 | 长春希达电子技术有限公司 | LED display screen capable of eliminating color difference among modules and manufacturing method of LED display screen |
| CN107731122A (en) * | 2017-11-28 | 2018-02-23 | 深圳市秀狐科技有限公司 | A kind of gelatin LED display and its processing method |
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| CN109817104A (en) * | 2019-01-08 | 2019-05-28 | 长春希达电子技术有限公司 | A kind of LED array of display mould group of thin-film package |
| CN111028701A (en) * | 2019-11-29 | 2020-04-17 | 深圳集简设计有限公司 | LED display screen |
| WO2021120386A1 (en) * | 2019-12-20 | 2021-06-24 | 东莞阿尔泰显示技术有限公司 | Integrated-package display module |
| CN111599909A (en) * | 2020-05-21 | 2020-08-28 | 东莞市中麒光电技术有限公司 | LED display screen module and preparation method thereof |
| CN111477121A (en) * | 2020-05-26 | 2020-07-31 | 深圳市洲明科技股份有限公司 | Manufacturing method of L ED display screen |
| CN111477121B (en) * | 2020-05-26 | 2022-06-10 | 深圳市洲明科技股份有限公司 | Manufacturing method of LED display screen |
| CN112992958A (en) * | 2020-07-21 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | LED display unit, LED display screen and manufacturing method thereof |
| CN113528020A (en) * | 2021-07-14 | 2021-10-22 | 广州慧谷化学有限公司 | LED nanometer black coating and LED display module |
| CN113528020B (en) * | 2021-07-14 | 2022-08-30 | 广州慧谷化学有限公司 | LED nanometer black coating and LED display module |
| CN115050857A (en) * | 2022-04-29 | 2022-09-13 | 深圳博元新材科技有限公司 | Manufacturing method of LED display panel, display panel and electronic equipment |
| CN116741062A (en) * | 2023-08-15 | 2023-09-12 | 长春希龙显示技术有限公司 | A packaging process method for an LED display module and an LED display module |
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Application publication date: 20140115 |