[go: up one dir, main page]

CN103425307A - Sensing circuit structure of touch panel - Google Patents

Sensing circuit structure of touch panel Download PDF

Info

Publication number
CN103425307A
CN103425307A CN2012101576796A CN201210157679A CN103425307A CN 103425307 A CN103425307 A CN 103425307A CN 2012101576796 A CN2012101576796 A CN 2012101576796A CN 201210157679 A CN201210157679 A CN 201210157679A CN 103425307 A CN103425307 A CN 103425307A
Authority
CN
China
Prior art keywords
axis
carbon
circuit structure
axis carbon
touch panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012101576796A
Other languages
Chinese (zh)
Inventor
张祐严
黄长煌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Psd Technology Co ltd
Original Assignee
Psd Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Psd Technology Co ltd filed Critical Psd Technology Co ltd
Priority to CN2012101576796A priority Critical patent/CN103425307A/en
Publication of CN103425307A publication Critical patent/CN103425307A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Position Input By Displaying (AREA)

Abstract

The invention discloses an induction circuit structure of a touch panel, which is formed by arranging X-axis carbon beams and Y-axis carbon beams which are mutually staggered on a transparent substrate with a cementing layer, wherein each X-axis carbon beam and each Y-axis carbon beam are respectively provided with a conductive wire and one is coated by an insulating layer. In the manufacturing process of the sensing circuit, the purposes of simplifying the manufacturing steps and reducing the manufacturing cost are achieved without carrying out insulation isolation treatment.

Description

触控面板的感应电路结构Sensing circuit structure of touch panel

技术领域 technical field

本发明与触控面板有关,特别是指一种触控面板的感应电路结构。The present invention relates to a touch panel, in particular to a sensing circuit structure of a touch panel.

背景技术 Background technique

触控面板(Touch Panel)根据感应原理主要可分为电容式及电阻式等类别,其中电容式触控面板是目前主流的控制方式。According to the sensing principle, the touch panel can be mainly divided into capacitive type and resistive type, among which the capacitive touch panel is the mainstream control method at present.

参阅图1、图2,电容式触控面板主要以一块透明玻璃为基板11,而在基板11上设有具有平行设置的多个X轴感应电极121的第一线路层12、及具有平行设置的多个Y轴感应电极131的第二线路层13,且各X轴感应电极121与各Y轴感应电极131彼此交错,形成呈棋盘结构状的感应数组。而为了确保各X轴感应电极121与各Y轴感应电极131交迭处正常运作,因此在各交迭处以一绝缘层14使其电气绝缘,藉以利用该感应数组中的静电场变化来计算接触点位置。当然,电容式触控面板更包含有其他的绝缘层15及接地层16。Referring to Fig. 1 and Fig. 2, the capacitive touch panel mainly uses a piece of transparent glass as the substrate 11, and the first circuit layer 12 with a plurality of X-axis sensing electrodes 121 arranged in parallel is arranged on the substrate 11, and a first circuit layer 12 with parallel arranged The second circuit layer 13 of a plurality of Y-axis sensing electrodes 131 , and each X-axis sensing electrode 121 and each Y-axis sensing electrode 131 are interlaced to form a checkerboard-like sensing array. In order to ensure the normal operation of the overlapping parts of each X-axis sensing electrode 121 and each Y-axis sensing electrode 131, an insulating layer 14 is used to electrically insulate each overlapping part, so as to use the electrostatic field change in the sensing array to calculate the contact. point location. Of course, the capacitive touch panel further includes other insulating layers 15 and grounding layers 16 .

然而,就触控面板的感应电路的制程而言,在单一透明基板11的一面上分别形成多个X轴感应电极121的第一线路层12及多个Y轴感应电极131的第二线路层13,由于X、Y轴感应电极121、131作矩阵排列,使得各X轴感应电极121与各Y轴感应电极131会有交叉重迭处,因此必须进行绝缘隔离处理,但绝缘隔离处理将增加制程步骤,凸显出触控面板的感应电路制程繁杂的缺陷。However, in terms of the manufacturing process of the sensing circuit of the touch panel, the first circuit layer 12 of the plurality of X-axis sensing electrodes 121 and the second circuit layer of the plurality of Y-axis sensing electrodes 131 are respectively formed on one side of the single transparent substrate 11. 13. Since the X-axis and Y-axis sensing electrodes 121 and 131 are arranged in a matrix, each X-axis sensing electrode 121 and each Y-axis sensing electrode 131 will overlap and overlap, so insulation and isolation treatment must be performed, but the insulation isolation treatment will increase The process steps highlight the defects of the complicated process of the sensing circuit of the touch panel.

除此之外,已知触控面板的感应电路的另一种制程是在基板上溅镀有呈线性的多个X轴感应电极,及在各X轴感应电极之间溅镀有与X轴感应电极不接触的Y轴感应电极线段,随后在X轴感应电极上涂布有绝缘层,且该绝缘层位于各Y轴感应电极线段连接的路径上,最后,再通过溅镀使各线段Y轴感应电极电性连接,此种制程更凸显出制程繁复冗长且成本高的缺陷。In addition, another known manufacturing process of the sensing circuit of the touch panel is to sputter a plurality of linear X-axis sensing electrodes on the substrate, and between each X-axis sensing electrodes to sputter with X-axis sensing electrodes. The Y-axis sensing electrode line segment that the sensing electrode does not touch is then coated with an insulating layer on the X-axis sensing electrode, and the insulating layer is located on the path where each Y-axis sensing electrode line segment is connected. Finally, each line segment is made Y by sputtering. The shaft sensing electrodes are electrically connected, and this kind of manufacturing process highlights the defects of complicated and lengthy manufacturing process and high cost.

发明内容 Contents of the invention

本发明要解决的技术问题是提供一种触控面板的感应电路结构,可以简化制程步骤,降低制程成本,并可以提升触控感应的灵敏度。The technical problem to be solved by the present invention is to provide a sensing circuit structure of a touch panel, which can simplify the process steps, reduce the process cost, and improve the sensitivity of touch sensing.

为解决上述技术问题,本发明提供一种触控面板的感应电路结构,包含:一透明基板,具有一使用端面及一反向于所述使用端面的结合端面;一胶合层,设于所述透明基板的结合端面;多个X轴碳束,平行设置于所述结合端面且被所述胶合层黏固,各X轴碳束具有一第一导电线及一包覆所述第一导电线的第一绝缘膜;多个Y轴碳束,平行设置于所述结合端面且与各X轴碳束交错并被所述胶合层黏固,各Y轴碳束具有一第二导电线及一包覆所述第二导电线的第二绝缘膜。In order to solve the above technical problems, the present invention provides a sensing circuit structure of a touch panel, comprising: a transparent substrate having a use end surface and a bonding end surface opposite to the use end surface; The joint end surface of the transparent substrate; a plurality of X-axis carbon bundles are arranged in parallel on the joint end surface and are fixed by the adhesive layer, and each X-axis carbon bundle has a first conductive wire and a covering of the first conductive wire The first insulating film; a plurality of Y-axis carbon bundles, arranged in parallel on the joint end surface and interlaced with each X-axis carbon bundle and bonded by the adhesive layer, each Y-axis carbon bundle has a second conductive wire and a A second insulating film covering the second conductive wire.

较佳地,所述胶合层为一紫外线可固化黏着剂。Preferably, the adhesive layer is an ultraviolet curable adhesive.

较佳地,所述第一导电线为碳纤维。Preferably, the first conductive wire is carbon fiber.

较佳地,所述第二导电线为碳纤维。Preferably, the second conductive wire is carbon fiber.

本发明主要由相互交错的X轴碳束与Y轴碳束设于具有胶合层的透明基板上组成,且各X轴碳束与Y轴碳束各具有一导电线(碳纤维)及一被绝缘层包覆,因此,感应电路在制程上可将X轴碳束与Y轴碳束交错后,直接设于具有胶合层的透明基板上,最后经照射紫外线(UV)使胶合层固化而将X轴碳束、Y轴碳束与透明基板三者结合为一体,感应电路在制作的过程中,不需进行绝缘隔离处理,简化了制程步骤及,降低了制程成本。The present invention is mainly composed of interlaced X-axis carbon bundles and Y-axis carbon bundles arranged on a transparent substrate with a glued layer, and each X-axis carbon bundle and Y-axis carbon bundle has a conductive wire (carbon fiber) and an insulated Therefore, the induction circuit can interleave the X-axis carbon beam and the Y-axis carbon beam in the manufacturing process, and then directly set it on the transparent substrate with the glued layer. Finally, the glued layer is cured by irradiating ultraviolet rays (UV) and the X The axis carbon beam, the Y axis carbon beam and the transparent substrate are combined into one body, and the induction circuit does not need to be insulated and isolated during the production process, which simplifies the process steps and reduces the process cost.

附图说明 Description of drawings

图1是已知触控面板立体分解图;FIG. 1 is a three-dimensional exploded view of a known touch panel;

图2是已知触控面板的感应电路的局部剖面图;2 is a partial sectional view of a sensing circuit of a known touch panel;

图3是本发明的立体分解图;Fig. 3 is a three-dimensional exploded view of the present invention;

图4是本发明的立体组合图;Fig. 4 is a three-dimensional combined view of the present invention;

图5是图4的侧视图;Fig. 5 is a side view of Fig. 4;

图6是图4另一视角的侧视图;Fig. 6 is a side view of another angle of view of Fig. 4;

图7是本发明另一种实施状态的局部放大图,显示X轴碳束与Y轴碳束编织成网状的状态。Fig. 7 is a partially enlarged view of another implementation state of the present invention, showing a state in which X-axis carbon bundles and Y-axis carbon bundles are woven into a mesh.

其中附图标记说明如下:Wherein the reference signs are explained as follows:

基板11                    第一线路层12Substrate 11 The first circuit layer 12

X轴感应电极121            第二线路层13X-axis sensing electrode 121 Second circuit layer 13

Y轴感应电极131            绝缘层14、15Y-axis induction electrode 131 insulation layer 14, 15

接地层16Ground plane 16

透明基板20                使用端面21Transparent substrate 20 Use end face 21

结合端面22Combined end face 22

胶合层30glued layer 30

X轴碳束40                第一导电线41X-axis carbon beam 40 The first conductive wire 41

第一绝缘膜42first insulating film 42

Y轴碳束50                第二导电线51Y-axis carbon beam 50 Second conductive wire 51

第二绝缘膜52second insulating film 52

具体实施方式 Detailed ways

下面结合附图与具体实施方式对本发明作进一步详细的说明。The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

参阅图3、图4,本发明实施例所提供的一种触控面板的感应电路结构,其主要由一透明基板20、一胶合层30、多个X轴碳束40及多个Y轴碳束50组成。Referring to Fig. 3 and Fig. 4, a sensing circuit structure of a touch panel provided by an embodiment of the present invention is mainly composed of a transparent substrate 20, a glue layer 30, a plurality of X-axis carbon bundles 40 and a plurality of Y-axis carbon bundles. Bundle of 50 compositions.

透明基板20具有一使用端面21及一反向于使用端面21的结合端面22;所述透明基板20可为玻璃或透明高分子板材。The transparent substrate 20 has a use end surface 21 and a joint end surface 22 opposite to the use end surface 21 ; the transparent substrate 20 can be glass or a transparent polymer plate.

胶合层30涂布在透明基板20的结合端面22;本实施例中的胶合层30为一紫外线可固化黏着剂。The adhesive layer 30 is coated on the bonding end surface 22 of the transparent substrate 20; the adhesive layer 30 in this embodiment is an ultraviolet curable adhesive.

参阅图5,各X轴碳束40平行设置于结合端面22且被胶合层30黏固,各X轴碳束40具有一第一导电线41及一包覆第一导电线41的第一绝缘膜42;本实施例中,该第一导电线41为碳纤维。Referring to FIG. 5 , each X-axis carbon bundle 40 is arranged parallel to the joint end surface 22 and is fixed by the glue layer 30 . Each X-axis carbon bundle 40 has a first conductive wire 41 and a first insulating layer covering the first conductive wire 41. Membrane 42; in this embodiment, the first conductive wire 41 is carbon fiber.

参阅图6,各Y轴碳束50平行设置于结合端面22且与各X轴碳束40交错并被胶合层30黏固,各Y轴碳束50具有一第二导电线51及一包覆第二导电线51的第二绝缘膜52;本实施例中,该第二导电线51为碳纤维。Referring to FIG. 6, each Y-axis carbon bundle 50 is arranged parallel to the joint end surface 22 and intersects with each X-axis carbon bundle 40 and is bonded by the glue layer 30. Each Y-axis carbon bundle 50 has a second conductive wire 51 and a coating The second insulating film 52 of the second conductive wire 51; in this embodiment, the second conductive wire 51 is carbon fiber.

以上所述即为本发明实施例各主要构件的结构及其组态说明,至于本发明的功效作以下说明。The above is the description of the structure and configuration of each main component of the embodiment of the present invention, and the functions of the present invention are described below.

本发明的感应电路结构主要由相互交错的X轴碳束40与Y轴碳束50设于具有胶合层30的透明基板20上组成,由于X轴碳束40与Y轴碳束50的导电线(碳纤维)被一绝缘层包覆,因此,该感应电路在制程上可将X轴碳束40与Y轴碳束50交错后,直接设于具有胶合层30的透明基板20上,最后经照射紫外线(UV)使胶合层30固化而将X轴碳束40、Y轴碳束50与透明基板20三者结合为一体,即完成触控面板的感应电路结构。因此,本发明感应电路在制作的过程中,不需进行绝缘隔离处理,更不需要通过溅镀制程来将X轴碳束40、Y轴碳束50与透明基板20三者结合为一体,因此,确实能达到简化制程步骤及降低制程成本的目的。The induction circuit structure of the present invention is mainly composed of interlaced X-axis carbon bundles 40 and Y-axis carbon bundles 50 arranged on a transparent substrate 20 with an adhesive layer 30. Due to the conductive wires of the X-axis carbon bundles 40 and Y-axis carbon bundles 50 (Carbon fiber) is covered by an insulating layer. Therefore, the induction circuit can be directly arranged on the transparent substrate 20 with the adhesive layer 30 after the X-axis carbon beam 40 and the Y-axis carbon beam 50 are interlaced in the manufacturing process, and finally irradiated Ultraviolet (UV) cures the adhesive layer 30 to combine the X-axis carbon bundles 40 , Y-axis carbon bundles 50 and the transparent substrate 20 into one, thus completing the sensing circuit structure of the touch panel. Therefore, in the process of manufacturing the induction circuit of the present invention, it is not necessary to perform insulation and isolation treatment, and it is not necessary to combine the X-axis carbon beam 40, the Y-axis carbon beam 50 and the transparent substrate 20 through a sputtering process. Therefore, , can indeed achieve the purpose of simplifying the process steps and reducing the process cost.

值得一提的是,本发明的感应电路结构在讯号的发射及接收上,除了以X轴碳束40作为发射端、以Y轴碳束50作为接收端、或者相反之外,请参阅图7所示,由于X轴碳束40与Y轴碳束50的导电线(碳纤维)被一绝缘层包覆,因此,可将X轴碳束40与Y轴碳束50直接编织成网状,不会相互电性接触,而在讯号的发射及接收上,就可用奇数的碳束作为发射端、以偶数的碳束作为接收端、或者相反,据此,可在呈网状的感应电路上形成快速变化的电容,提升触控感应的灵敏度。It is worth mentioning that, in terms of signal transmission and reception, the induction circuit structure of the present invention, in addition to using the X-axis carbon beam 40 as the transmitting end, and the Y-axis carbon beam 50 as the receiving end, or vice versa, please refer to FIG. 7 As shown, since the conductive wires (carbon fibers) of the X-axis carbon bundles 40 and Y-axis carbon bundles 50 are covered by an insulating layer, the X-axis carbon bundles 40 and the Y-axis carbon bundles 50 can be directly woven into a mesh without They will be in electrical contact with each other, and in the transmission and reception of signals, odd-numbered carbon beams can be used as the transmitting end, and even-numbered carbon beams can be used as the receiving end, or vice versa. Rapidly changing capacitance improves the sensitivity of touch sensing.

综上所述,上述实施例及附图只是本发明的较佳实施例而已,并非用以限定本发明,任何熟知以上技术者,在不脱离本发明的精神与范围内,凡是依照本发明申请专利范围所作的均等变化与修饰,都属于本发明专利涵盖的范围。In summary, the above-mentioned embodiments and accompanying drawings are only preferred embodiments of the present invention, and are not intended to limit the present invention. The equivalent changes and modifications made in the scope of the patent all belong to the scope covered by the patent of the present invention.

Claims (4)

1. the sensor circuit structure of a contact panel, is characterized in that, comprises:
One transparency carrier, have a use end face and be in reverse to described use end face in conjunction with end face;
One cementing layer, be located at described transparency carrier in conjunction with end face;
A plurality of X-axis carbon bundles, be set in parallel in describedly in conjunction with end face and cemented by described cementing layer, and each X-axis carbon bundle has the first dielectric film that one first conductor wire and coats described the first conductor wire;
A plurality of Y-axis carbon bundles, be set in parallel in describedly in conjunction with end face and staggered and cemented by described cementing layer with each X-axis carbon bundle, and each Y-axis carbon bundle has the second dielectric film that one second conductor wire and coats described the second conductor wire.
2. the sensor circuit structure of contact panel as claimed in claim 1, it is characterized in that: described cementing layer is a ultraviolet-curing adhesive agent.
3. the sensor circuit structure of contact panel as claimed in claim 1, it is characterized in that: described the first conductor wire is carbon fiber.
4. the sensor circuit structure of contact panel as claimed in claim 1, it is characterized in that: described the second conductor wire is carbon fiber.
CN2012101576796A 2012-05-18 2012-05-18 Sensing circuit structure of touch panel Pending CN103425307A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012101576796A CN103425307A (en) 2012-05-18 2012-05-18 Sensing circuit structure of touch panel

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012101576796A CN103425307A (en) 2012-05-18 2012-05-18 Sensing circuit structure of touch panel

Publications (1)

Publication Number Publication Date
CN103425307A true CN103425307A (en) 2013-12-04

Family

ID=49650161

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012101576796A Pending CN103425307A (en) 2012-05-18 2012-05-18 Sensing circuit structure of touch panel

Country Status (1)

Country Link
CN (1) CN103425307A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116320108A (en) * 2023-03-08 2023-06-23 维沃移动通信有限公司 Cover plate, display panel, electronic device and method for manufacturing cover plate

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002044649A1 (en) * 2000-11-30 2002-06-06 Nitta Corporation Capacitive sensor
CN101520704A (en) * 2008-02-26 2009-09-02 胜华科技股份有限公司 Touch panel
CN101561737A (en) * 2008-04-16 2009-10-21 株式会社日立显示器 Electrostatic capacitance type touch panel and screen input display device including the same
CN202142025U (en) * 2010-11-09 2012-02-08 宸鸿光电科技股份有限公司 Touch panel device
CN102419655A (en) * 2011-12-09 2012-04-18 天津富纳源创科技有限公司 Touch screen panel
CN202632246U (en) * 2012-05-18 2012-12-26 榕增光电科技有限公司 Induction circuit structure of touch panel
CN104576672A (en) * 2013-10-16 2015-04-29 精工爱普生株式会社 Semiconductor device and method for manufacturing the same

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002044649A1 (en) * 2000-11-30 2002-06-06 Nitta Corporation Capacitive sensor
CN101520704A (en) * 2008-02-26 2009-09-02 胜华科技股份有限公司 Touch panel
CN101561737A (en) * 2008-04-16 2009-10-21 株式会社日立显示器 Electrostatic capacitance type touch panel and screen input display device including the same
CN202142025U (en) * 2010-11-09 2012-02-08 宸鸿光电科技股份有限公司 Touch panel device
CN102419655A (en) * 2011-12-09 2012-04-18 天津富纳源创科技有限公司 Touch screen panel
CN202632246U (en) * 2012-05-18 2012-12-26 榕增光电科技有限公司 Induction circuit structure of touch panel
CN104576672A (en) * 2013-10-16 2015-04-29 精工爱普生株式会社 Semiconductor device and method for manufacturing the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116320108A (en) * 2023-03-08 2023-06-23 维沃移动通信有限公司 Cover plate, display panel, electronic device and method for manufacturing cover plate

Similar Documents

Publication Publication Date Title
US9836144B2 (en) Touch panel
CN100517001C (en) Optical organic film structure of display device and display device
CN107611160B (en) Flexible touch sensor and flexible touch display device
TWI557606B (en) Touch panel and method for manufacturing the same
US20140104511A1 (en) Touch panel and a manufacturing method thereof
US20140084992A1 (en) Touch panel
TWM495567U (en) Touch display
JP2013526755A (en) Touch panel using metal thin film and manufacturing method thereof
TW201421333A (en) Capacitance type touch panel
KR101418159B1 (en) Touch panel
CN101458410B (en) Touch control type lcd device touch control liquid crystal display
US10564784B2 (en) Capacitive sensor having bending portion and flat portion
CN103246420B (en) Monolayer multipoint capacitive touch screen
CN102645992B (en) Light-transmitting touch control panel structure and manufacturing method thereof
CN103631416A (en) Touch screen and touch-controlled display device
CN202632246U (en) Induction circuit structure of touch panel
CN201689397U (en) Touch module
CN103425307A (en) Sensing circuit structure of touch panel
JP2012524324A (en) Touch panel manufacturing pad, touch panel manufacturing method using the same, and touch panel manufactured thereby
CN202632262U (en) Sensing circuit structure of touch panel
TW201437860A (en) Touch panel and method of manufacturing the same
CN103425309A (en) Sensing circuit structure of touch panel
KR101114024B1 (en) Touch panel
US10558308B2 (en) Capacitive sensor for panel having flat-surface portion and curved-surface portion
JP2011095903A (en) Touch pad structure

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20131204