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CN103424817A - Optical fiber connecting assembly and photovoltaic conversion module used by same - Google Patents

Optical fiber connecting assembly and photovoltaic conversion module used by same Download PDF

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CN103424817A
CN103424817A CN2012101516009A CN201210151600A CN103424817A CN 103424817 A CN103424817 A CN 103424817A CN 2012101516009 A CN2012101516009 A CN 2012101516009A CN 201210151600 A CN201210151600 A CN 201210151600A CN 103424817 A CN103424817 A CN 103424817A
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circuit board
lens
lid
conversion module
glue
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曾国峰
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Abstract

一种光纤连接组件,其包括两个光电转换模组及连接两个光电转换模组的多根光纤,光电转换模组包括电路板、装设于电路板的受光元件及发光元件、通过胶水粘接于电路板的盖体及装设于盖体的多个第一透镜,盖体罩设于受光元件及发光元件上,多个第一透镜与多根光纤的端部对准,多个第一透镜与受光元件及发光元件光耦合,盖体与电路板的接合面上开设有溢胶孔,当盖体粘接接于电路板时,多余的胶水进入溢胶孔。本发明还提供一种光电转换模组。上述光纤连接组件中,由于光电转换模组的盖体靠近电路板的面上开设有溢胶孔,使得盖体通过胶水粘接于电路板时,多余的胶水进入溢胶孔,避免由于粘接过程导致的盖体偏移。

Figure 201210151600

An optical fiber connection assembly, which includes two photoelectric conversion modules and a plurality of optical fibers connecting the two photoelectric conversion modules, the photoelectric conversion module includes a circuit board, a light receiving element and a light emitting element installed on the circuit board The cover connected to the circuit board and a plurality of first lenses installed on the cover, the cover is set on the light receiving element and the light emitting element, the plurality of first lenses are aligned with the ends of the plurality of optical fibers, and the plurality of first lenses A lens is optically coupled with the light-receiving element and the light-emitting element. A glue overflow hole is opened on the joint surface of the cover body and the circuit board. When the cover body is bonded to the circuit board, excess glue enters the glue overflow hole. The invention also provides a photoelectric conversion module. In the above-mentioned optical fiber connection assembly, since the cover body of the photoelectric conversion module is provided with a glue overflow hole on the surface close to the circuit board, when the cover body is bonded to the circuit board with glue, the excess glue enters the glue overflow hole to avoid Cover deflection caused by the process.

Figure 201210151600

Description

光纤连接组件及其使用的光电转换模组Optical fiber connection assembly and photoelectric conversion module used therefor

技术领域 technical field

本发明涉及一种光纤连接组件,尤其涉及一种转换及传输光信号的光纤连接组件及其使用的光电转换模组。 The invention relates to an optical fiber connection assembly, in particular to an optical fiber connection assembly for converting and transmitting optical signals and a photoelectric conversion module used therein.

背景技术 Background technique

近年来,光通讯有高速化、大容量化的发展趋势。光纤连接器进行光信号传输时,需采用光电转换模组进行光电信号的转换。现有的光电转换模组中,盖体通过胶水固定于电路基板并位于光学元件上方,与连接光电转换模组的光纤装设于盖体上,装设在盖体中的透镜与光学元件光耦合。然而,胶水于高温固化烘烤时会因体积膨胀过大或是空气混入胶材中产生气泡而造成盖体偏移,从而导致光学组件与透镜之间的光耦合效果不佳,甚至使得光电转换模组失效,降低了生产良率。 In recent years, optical communication has a development trend of high speed and large capacity. When the optical fiber connector is used for optical signal transmission, it is necessary to use a photoelectric conversion module to convert the photoelectric signal. In the existing photoelectric conversion module, the cover body is fixed on the circuit substrate by glue and is located above the optical element, and the optical fiber connected to the photoelectric conversion module is installed on the cover body, and the lens installed in the cover body and the optical element light coupling. However, when the glue is cured and baked at high temperature, the cover body will be shifted due to excessive volume expansion or air mixed into the glue to generate air bubbles, which will lead to poor optical coupling between the optical component and the lens, and even make the photoelectric conversion The module fails, reducing the production yield.

发明内容 Contents of the invention

鉴于上述内容,有必要提供一种能提高产率且光耦合效率高的光纤连接组件及其使用的光电转换模组。 In view of the above, it is necessary to provide an optical fiber connection assembly capable of increasing productivity and high optical coupling efficiency and a photoelectric conversion module used therein.

一种光纤连接组件,其包括两个光电转换模组及连接该两个光电转换模组的多根光纤,该光电转换模组包括电路板、装设于该电路板的受光元件及发光元件、通过胶水粘接于该电路板的盖体及装设于该盖体的多个第一透镜,该盖体罩设于该受光元件及发光元件上,该多个第一透镜与该多根光纤的端部对准,该多个第一透镜与该受光元件及发光元件光耦合,该盖体与电路板的接合面上开设有溢胶孔,当该盖体粘接接于该电路板时,多余的胶水进入该溢胶孔。 An optical fiber connection assembly, which includes two photoelectric conversion modules and a plurality of optical fibers connecting the two photoelectric conversion modules, the photoelectric conversion module includes a circuit board, a light receiving element and a light emitting element installed on the circuit board, The cover body of the circuit board and the plurality of first lenses installed on the cover body are bonded by glue, the cover body is set on the light receiving element and the light emitting element, the plurality of first lenses and the plurality of optical fibers The ends are aligned, the plurality of first lenses are optically coupled with the light-receiving element and the light-emitting element, and a glue overflow hole is opened on the joint surface of the cover body and the circuit board. When the cover body is bonded to the circuit board , excess glue enters the overflow hole.

一种光电转换模组,包括电路板、装设于该电路板的受光元件及发光元件、通过胶水粘接于该电路板的盖体及装设于该盖体的多个第一透镜,该盖体罩设于该受光元件及发光元件上,该多个第一透镜与该受光元件及发光元件光耦合,该盖体与电路板的接合面上开设有溢胶孔,当该盖体粘接接于该电路板时,多余的胶水进入该溢胶孔。 A photoelectric conversion module, comprising a circuit board, a light-receiving element and a light-emitting element installed on the circuit board, a cover body bonded to the circuit board by glue, and a plurality of first lenses installed on the cover body, the The cover body is set on the light receiving element and the light emitting element, the plurality of first lenses are optically coupled with the light receiving element and the light emitting element, and a glue overflow hole is opened on the bonding surface of the cover body and the circuit board. When connecting to the circuit board, excess glue enters the glue overflow hole.

上述光电转换模组中,由于盖体靠近该电路板的面上开设有溢胶孔,使得盖体通过胶水粘接于该电路板时,多余的胶水进入该溢胶孔,避免由于粘接过程导致的盖体偏移,保证了透镜与受光元件及发光元件的良好光耦合,提高光纤传输效率。 In the above-mentioned photoelectric conversion module, since the surface of the cover body close to the circuit board is provided with a glue overflow hole, when the cover body is bonded to the circuit board by glue, the excess glue enters the glue overflow hole to avoid the glue overflow hole due to the bonding process. The resulting offset of the cover ensures good optical coupling between the lens, the light-receiving element and the light-emitting element, and improves the transmission efficiency of the optical fiber.

附图说明 Description of drawings

图1是本发明实施方式光纤连接组件的立体示意图。 Fig. 1 is a schematic perspective view of an optical fiber connection assembly according to an embodiment of the present invention.

图2是图1所示光纤连接组件的光电转换模组的剖视图。 FIG. 2 is a cross-sectional view of the photoelectric conversion module of the optical fiber connection assembly shown in FIG. 1 .

主要元件符号说明 Description of main component symbols

光纤连接组件Fiber Connector Components 100100 光电转换模组Photoelectric conversion module 101101 光纤optical fiber 105105 电路板circuit board 1010 受光元件Light receiving element 2020 发光元件Light emitting element 3030 盖体Cover 4040 第一透镜first lens 5050 壳体case 6060 第二透镜second lens 7070 胶水glue 9090 安装面Mounting surface 1111 基板Substrate 4141 侧壁side wall 4343 收容腔containment cavity 4545 定位部Positioning department 411411 通孔through hole 415415 接合面joint surface 431431 溢胶孔Glue overflow hole 433433 第一侧壁first side wall 6161 第二侧壁second side wall 6363 定位孔positioning hole 611611 第一收容孔Containment Hole 1 613613 第二收容孔Second Containment Hole 631631

如下具体实施方式将结合上述附图进一步说明本发明。 The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

具体实施方式 Detailed ways

请参阅图1及图2,本发明实施方式的光纤连接组件100包括两个光电转换模组101及连接两个光电转换模组101的多根光纤105。光电转换模组101用于实现光信号与电信号之间的转换。光纤105用于传输光信号。在本实施方式中,多根光纤105为一个光纤传输带中的多根光纤105。 Referring to FIG. 1 and FIG. 2 , an optical fiber connection assembly 100 according to an embodiment of the present invention includes two photoelectric conversion modules 101 and a plurality of optical fibers 105 connecting the two photoelectric conversion modules 101 . The photoelectric conversion module 101 is used to realize conversion between optical signals and electrical signals. Optical fiber 105 is used to transmit optical signals. In this embodiment, the plurality of optical fibers 105 are the plurality of optical fibers 105 in one optical fiber transmission ribbon.

光电转换模组101包括电路板10、受光元件20、发光元件30、盖体40、第一透镜50、壳体60及第二透镜70。受光元件20、发光元件30及盖体40均装设于电路板10上。盖体40罩设于受光元件20及发光元件30上。第一透镜50装设在盖体40中,并与受光元件20及发光元件30光耦合。壳体60与盖体40相卡合。第二透镜70装设于壳体60中,且与第一透镜50对准。光纤105的两端分别插设于壳体60远离盖体40的一侧,且光纤105与第二透镜70相耦合。 The photoelectric conversion module 101 includes a circuit board 10 , a light receiving element 20 , a light emitting element 30 , a cover 40 , a first lens 50 , a casing 60 and a second lens 70 . The light receiving element 20 , the light emitting element 30 and the cover 40 are all installed on the circuit board 10 . The cover 40 covers the light receiving element 20 and the light emitting element 30 . The first lens 50 is installed in the cover body 40 and optically coupled with the light receiving element 20 and the light emitting element 30 . The casing 60 is engaged with the cover 40 . The second lens 70 is installed in the casing 60 and aligned with the first lens 50 . Two ends of the optical fiber 105 are respectively inserted in a side of the casing 60 away from the cover 40 , and the optical fiber 105 is coupled with the second lens 70 .

电路板10包括有一个朝向盖体40的安装面11。安装面11上布设有电路,用于驱动及控制发光元件30及受光元件20工作。受光元件20与发光元件30间隔装设于电路板10的安装面11上,并与电路板10的电路电性连接。受光元件20用以接收光信号并将光信号转换为电信号。发光元件30用以接收电信号并将电信号转换为光信号。在本实施方式中,受光元件20与发光元件30均通过锡球焊接于电路板10上。受光元件20为光电二极管,发光元件30为激光二极管。可以理解,受光元件20及发光元件30也可通过银胶固化粘贴于电路板10的安装面11上。 The circuit board 10 includes a mounting surface 11 facing the cover 40 . Circuits are arranged on the mounting surface 11 for driving and controlling the light-emitting element 30 and the light-receiving element 20 to work. The light-receiving element 20 and the light-emitting element 30 are spaced apart from each other on the mounting surface 11 of the circuit board 10 , and are electrically connected to the circuit of the circuit board 10 . The light receiving element 20 is used for receiving light signals and converting the light signals into electrical signals. The light emitting element 30 is used for receiving electrical signals and converting the electrical signals into optical signals. In this embodiment, both the light receiving element 20 and the light emitting element 30 are soldered on the circuit board 10 through solder balls. The light receiving element 20 is a photodiode, and the light emitting element 30 is a laser diode. It can be understood that the light receiving element 20 and the light emitting element 30 can also be pasted on the mounting surface 11 of the circuit board 10 through silver glue curing.

盖体40通过胶水90固定在电路板10的安装面11上。本实施例中,胶水为UV胶。盖体40包括基板41及由基板41的四周朝向电路板10延伸至四侧壁43。基板41与侧壁43共同围成一个收容腔45,用以收容受光元件20及发光元件30。基板41朝向壳体60凸伸形成有一对定位部411。基板41于朝向壳体60的面上开设有多个通孔415。侧壁43朝向电路板10的接合面431上开设有溢胶孔433,优选地,溢胶孔433开设于接合面431的角部。在本实施方式中,定位部411分布于基板41的两端。通孔415的数量为四个,且通孔415分布于一对定位部411之间。通孔415与定位部411在一条直线上。溢胶孔433为通孔,且溢胶孔433的数量为六个,其分布于盖体40的四角及两个短边的居中位置。可以理解,定位部411的数量可为一个、三个、四个或更多。溢胶孔433的数量可为一个或多个,溢胶孔433可为盲孔。基板41的形状可为其它,例如三角形、梯形、五边形等等,相应地,侧壁43的数量对应为其它,例如侧壁43的数量为三个、四个、五个,接合面431相应为多边形,例如三边形、四边形、五边形。 The cover 40 is fixed on the mounting surface 11 of the circuit board 10 by glue 90 . In this embodiment, the glue is UV glue. The cover 40 includes a base plate 41 and four sidewalls 43 extending from a periphery of the base plate 41 toward the circuit board 10 . The substrate 41 and the side wall 43 jointly define a receiving cavity 45 for receiving the light receiving element 20 and the light emitting element 30 . A pair of positioning portions 411 protrude from the substrate 41 toward the housing 60 . The substrate 41 defines a plurality of through holes 415 on a surface facing the housing 60 . A glue overflow hole 433 is opened on the joint surface 431 of the side wall 43 facing the circuit board 10 . Preferably, the glue overflow hole 433 is opened at a corner of the joint surface 431 . In this embodiment, the positioning portions 411 are distributed at both ends of the substrate 41 . The number of through holes 415 is four, and the through holes 415 are distributed between a pair of positioning portions 411 . The through hole 415 is on a straight line with the positioning portion 411 . The glue overflow hole 433 is a through hole, and the number of the glue overflow hole 433 is six, which are distributed in the four corners of the cover body 40 and the middle positions of the two short sides. It can be understood that the number of positioning parts 411 may be one, three, four or more. The glue overflow hole 433 may be one or more, and the glue overflow hole 433 may be a blind hole. The shape of the substrate 41 can be other, such as triangle, trapezoid, pentagon, etc. Correspondingly, the number of side walls 43 is other, for example, the number of side walls 43 is three, four, five, and the joint surface 431 Corresponding to polygons, such as triangles, quadrilaterals, pentagons.

第一透镜50装设在通孔415中。在本实施方式中,第一透镜50为凸透镜,其数量为四个。可以理解,第一透镜50的数量可为二个、三个、五个或更多。对应地,通孔415的数量为二个、三个、五个或更多。 The first lens 50 is installed in the through hole 415 . In this embodiment, the first lens 50 is a convex lens, the number of which is four. It can be understood that the number of first lenses 50 may be two, three, five or more. Correspondingly, the number of through holes 415 is two, three, five or more.

壳体60大致为立方体状,其包括朝向盖体40的第一侧壁61及与第一侧壁61相对的第二侧壁63。壳体60于第一侧壁61上开设有一对定位孔611及第一收容孔613,以及于第二侧壁63上开设有第二收容孔631。在本实施方式中,定位孔611位于第一侧壁61的两端,且定位孔611与定位部411的位置相对应。第一收容孔613的数量为四个,且第一收容孔613分布于一对定位孔611之间。第一收容孔613与定位孔611在一条直线上。第二收容孔631的数量为四个,且第一收容孔613与对应的第二收容孔631相连通。可以理解,定位孔611的数量可为一个、三个、四个或更多。 The casing 60 is substantially cuboid, and includes a first sidewall 61 facing the cover 40 and a second sidewall 63 opposite to the first sidewall 61 . The casing 60 defines a pair of positioning holes 611 and a first receiving hole 613 on the first side wall 61 , and defines a second receiving hole 631 on the second side wall 63 . In this embodiment, the positioning holes 611 are located at both ends of the first side wall 61 , and the positioning holes 611 correspond to the positions of the positioning portions 411 . The number of the first receiving holes 613 is four, and the first receiving holes 613 are distributed between a pair of positioning holes 611 . The first receiving hole 613 is on a straight line with the positioning hole 611 . The number of the second receiving holes 631 is four, and the first receiving holes 613 communicate with the corresponding second receiving holes 631 . It can be understood that the number of positioning holes 611 may be one, three, four or more.

第二透镜70装设于第一收容孔613中。在本实施方式中,第二透镜70为凸透镜,其数量为四个。光纤105的两端分别通过胶水固定装设于两个光电转换模组101的第二收容孔631中,且光纤105容纳于第二收容孔631的端部与对应的第二透镜70对准。在本实施方式中,光纤105的数量为四个。可以理解,第二透镜70的数量可为二个、三个、五个或更多。对应地,第一收容孔613及第二收容孔631的数量分别为二个、三个、五个或更多。 The second lens 70 is installed in the first receiving hole 613 . In this embodiment, the second lens 70 is a convex lens, the number of which is four. Both ends of the optical fiber 105 are respectively fixed in the second receiving holes 631 of the two photoelectric conversion modules 101 by glue, and the ends of the optical fibers 105 received in the second receiving holes 631 are aligned with the corresponding second lenses 70 . In this embodiment, the number of optical fibers 105 is four. It can be understood that the number of the second lenses 70 may be two, three, five or more. Correspondingly, the numbers of the first receiving holes 613 and the second receiving holes 631 are respectively two, three, five or more.

组装时,将受光元件20及发光元件30装设于电路板10的安装面11上,将第一透镜50安装于盖体40的通孔415中,将盖体40的接合面431的角上涂覆胶水后,粘接于电路板10的安装面11上。将第二透镜70装设于壳体60的第一收容孔613中,将定位部411插设于定位孔611中,使得壳体60装设在盖体40上。将光纤105的两端分别通过胶水粘接于两个光电转换模组101的第二收容孔631中。 During assembly, the light receiving element 20 and the light emitting element 30 are installed on the mounting surface 11 of the circuit board 10, the first lens 50 is installed in the through hole 415 of the cover body 40, and the corner of the joint surface 431 of the cover body 40 After the glue is applied, it is bonded to the mounting surface 11 of the circuit board 10 . The second lens 70 is installed in the first receiving hole 613 of the housing 60 , and the positioning portion 411 is inserted into the positioning hole 611 , so that the housing 60 is installed on the cover 40 . The two ends of the optical fiber 105 are respectively glued into the second receiving holes 631 of the two photoelectric conversion modules 101 .

使用时,当光电转换模组101的发光元件30接收到由电路板10传输的电信号,发光元件30将该电信号转换为光信号,并发射到与其对准的第一透镜50。光信号通过第一透镜50、第二透镜70传输至光纤105。当第二透镜70接收到光纤105传送的光信号,该光信号通过第二透镜70及第一透镜50传送至受光元件20,受光元件20接收该光信号并将该光信号转换为电信号,继而将该电信号传送至电路板10。 In use, when the light-emitting element 30 of the photoelectric conversion module 101 receives an electrical signal transmitted by the circuit board 10 , the light-emitting element 30 converts the electrical signal into an optical signal and emits it to the first lens 50 aligned therewith. The optical signal is transmitted to the optical fiber 105 through the first lens 50 and the second lens 70 . When the second lens 70 receives the optical signal transmitted by the optical fiber 105, the optical signal is transmitted to the light receiving element 20 through the second lens 70 and the first lens 50, and the light receiving element 20 receives the optical signal and converts the optical signal into an electrical signal, The electrical signal is then transmitted to the circuit board 10 .

可以理解,该壳体60可省略,将第二透镜70直接装设于该盖体40上,并使得第二透镜70与该第一透镜50对准,该光纤105的端部直接插设于该盖体40上,并使得光纤105的端部与该第二透镜70对准。 It can be understood that the housing 60 can be omitted, the second lens 70 is directly installed on the cover 40, and the second lens 70 is aligned with the first lens 50, and the end of the optical fiber 105 is directly inserted into the on the cover body 40 and align the end of the optical fiber 105 with the second lens 70 .

本发明提供的光电转换模组101中安装有第一透镜50的盖体40通过胶水装设于电路板10的安装面11,由于盖体40的接合面431上开设有溢胶孔433,当胶水于高温固化烘烤时产生体积膨胀或是空气混入胶材中产生气泡时,多余的胶水可膨胀进入溢胶孔433,避免由于上述等原因导致盖体40偏移,从而避免了发光元件30及受光元件20与第一透镜50之间的光耦合效率不佳,提高光信号传输效率。 In the photoelectric conversion module 101 provided by the present invention, the cover body 40 with the first lens 50 installed on the mounting surface 11 of the circuit board 10 is installed on the mounting surface 11 of the circuit board 10 through glue. When the volume of the glue expands during curing and baking at high temperature or when air is mixed into the glue material to generate air bubbles, the excess glue can expand and enter the glue overflow hole 433, so as to avoid the deviation of the cover body 40 due to the above reasons, thereby avoiding the light-emitting element 30. And the optical coupling efficiency between the light receiving element 20 and the first lens 50 is not good, so as to improve the optical signal transmission efficiency.

另外,本领域技术人员还可在本发明精神内做其它变化,当然这些依据本发明精神所做的变化,都应包含在本发明所要保护的范围。 In addition, those skilled in the art can also make other changes within the spirit of the present invention. Of course, these changes made according to the spirit of the present invention should be included in the scope of protection of the present invention.

Claims (10)

1. a joint, the multifiber that it comprises two opto-electronic conversion modules and connects these two opto-electronic conversion modules, this opto-electronic conversion module comprises circuit board, be installed in photo detector and the light-emitting component of this circuit board, it is characterized in that: this opto-electronic conversion module also comprises by glue and is adhered to the lid of this circuit board and is installed in a plurality of first lens of this lid, this lid covers on this photo detector and this light-emitting component, the end alignment of the plurality of first lens and this multifiber, the plurality of first lens and this photo detector and light-emitting component optically-coupled, offer the glue hole of overflowing on the composition surface of this lid and circuit board, when this lid is bonding while being connected to this circuit board, unnecessary glue enters this excessive glue hole.
2. as claim 1 a described joint, it is characterized in that: this opto-electronic conversion module also comprises the housing engaged with this lid and is installed in a plurality of second lens of this housing, this first lens and this second lens alignment, the two ends of this optical fiber are inserted in respectively in the housing of these two opto-electronic conversion modules, the end alignment in a plurality of first lens of this opto-electronic conversion module and the insertion housing of this optical fiber.
3. as claim 1 a described joint, it is characterized in that: lid comprises substrate and a plurality of sidewalls that extended towards this circuit board by this substrate, and the composition surface of this lid is the face of the plurality of sidewall towards this circuit board.
4. as claim 3 a described joint, it is characterized in that: this composition surface is polygon, and this excessive glue hole is formed at the bight on this composition surface.
5. as claim 2 a described joint, it is characterized in that: this lid is formed with location division towards the sidewall of this housing, this housing comprises the first side wall towards this lid, and this first side wall offers pilot hole, and this location division is sticked in this pilot hole.
6. as claim 5 a described joint, it is characterized in that: the substrate of this lid offers a plurality of through holes on the side of this housing, and the plurality of first lens is contained in the plurality of through hole.
7. as claim 6 a described joint, it is characterized in that: this first side wall also offers a plurality of the first accepting holes, and the plurality of the second lens are contained in the plurality of the first accepting hole, and the plurality of the second lens are aimed at the plurality of first lens.
8. as claim 7 a described joint, it is characterized in that: this housing also comprises second sidewall relative with this first side wall, this second sidewall offers the second accepting hole, the plurality of the second accepting hole is communicated with the plurality of the first accepting hole, and the two ends of this optical fiber are inserted in respectively in second accepting hole of housing of this two opto-electronic conversion module.
9. an opto-electronic conversion module, comprise circuit board, be installed in photo detector and the light-emitting component of this circuit board, it is characterized in that: this opto-electronic conversion module also comprises by glue and is adhered to the lid of this circuit board and is installed in a plurality of first lens of this lid, this lid covers on this photo detector and this light-emitting component, the plurality of first lens and this photo detector and this light-emitting component optically-coupled, offer the glue hole of overflowing on the composition surface of this lid and circuit board, when this lid is bonding while being connected to this circuit board, unnecessary glue enters this excessive glue hole.
10. as claim 9 a described opto-electronic conversion module, it is characterized in that: this opto-electronic conversion module also comprises the housing engaged with this lid and is installed in a plurality of second lens of this housing, this first lens and this second lens alignment.
CN2012101516009A 2012-05-16 2012-05-16 Optical fiber connecting assembly and photovoltaic conversion module used by same Pending CN103424817A (en)

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CN2012101516009A CN103424817A (en) 2012-05-16 2012-05-16 Optical fiber connecting assembly and photovoltaic conversion module used by same

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Application Number Priority Date Filing Date Title
CN2012101516009A CN103424817A (en) 2012-05-16 2012-05-16 Optical fiber connecting assembly and photovoltaic conversion module used by same

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CN106233552A (en) * 2014-05-09 2016-12-14 株式会社自动网络技术研究所 circuit structure and electric connection box

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US20090310907A1 (en) * 2008-06-16 2009-12-17 Fujitsu Component Limited Mounting configuration and method of optical waveguide holding member
US20090317035A1 (en) * 2006-03-27 2009-12-24 Fujitsu Limited Optical module,optical transmission system, and fabrication method for optical module
US20110103747A1 (en) * 2009-10-30 2011-05-05 Hon Hai Precision Industry Co., Ltd. Optical fiber connector configured with separated seat member and lens member
US20120045176A1 (en) * 2010-08-18 2012-02-23 Hon Hai Precision Industry Co., Ltd. Optical fiber coupling connector

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EP0959617A2 (en) * 1998-05-22 1999-11-24 Eastman Kodak Company Method of connecting precision aligned components by ultraviolet curable adhesive
CN2632849Y (en) * 2003-06-09 2004-08-11 旭扬热导股份有限公司 Chip structure with reinforced colloidal wells
US20090317035A1 (en) * 2006-03-27 2009-12-24 Fujitsu Limited Optical module,optical transmission system, and fabrication method for optical module
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CN106233552A (en) * 2014-05-09 2016-12-14 株式会社自动网络技术研究所 circuit structure and electric connection box

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Application publication date: 20131204