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CN103376856A - 散热稳定结构及应用该散热稳定结构的服务器 - Google Patents

散热稳定结构及应用该散热稳定结构的服务器 Download PDF

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Publication number
CN103376856A
CN103376856A CN2012101256016A CN201210125601A CN103376856A CN 103376856 A CN103376856 A CN 103376856A CN 2012101256016 A CN2012101256016 A CN 2012101256016A CN 201210125601 A CN201210125601 A CN 201210125601A CN 103376856 A CN103376856 A CN 103376856A
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China
Prior art keywords
housing
server
fan
air
opening
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CN103376856B (zh
Inventor
马小峰
周家兴
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Guangdong Haina Agriculture Co ltd
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Hongfujin Precision Industry Shenzhen Co Ltd
Hon Hai Precision Industry Co Ltd
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Priority to CN201210125601.6A priority Critical patent/CN103376856B/zh
Priority to TW101115515A priority patent/TWI450682B/zh
Priority to US13/728,520 priority patent/US20130286580A1/en
Publication of CN103376856A publication Critical patent/CN103376856A/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F23/00—Features relating to the use of intermediate heat-exchange materials, e.g. selection of compositions
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20727—Forced ventilation of a gaseous coolant within server blades for removing heat from heat source

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mechanical Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

一种散热稳定结构，包括壳体及风扇，该壳体上设有容置槽，该风扇容置于该容置槽内，该风扇用以对该容置槽内的元件散热，该散热稳定结构还包括抽风机，该壳体还开设有与该容置槽导通的开口，该抽风机制造一风墙将该开口覆盖。本发明还提供一种应用上述散热稳定结构的服务器。

Description

散热稳定结构及应用该散热稳定结构的服务器
技术领域
本发明涉及一种散热稳定结构，尤其涉及一种应用于服务器上的散热稳定结构。
背景技术
服务器包括壳体、电子元件、散热元件及盖体，盖体盖合于壳体上并于壳体内形成一容置腔，电子元件及散热元件容置于该容置腔内。常用的散热元件为风扇，风扇制造的风在容置腔内沿预订风道流通并将电子元件工作时所产生的热量驱散至壳体外。
然而，在研发和测试阶段以及随后的使用过程中，不可避免地需要打开服务器的盖体，盖体一旦打开，容置腔内的预订风道随即遭到破坏，即风扇制造的风部分将从壳体原来设有盖体的开口吹出，从而降低了服务器的冷却效率，进而影响到服务器的工作稳定性及安全性。
发明内容
鉴于上述内容，有必要提供一种能提高服务器冷却效率的散热稳定结构。
此外，还有必要提供一种应用上述散热稳定结构的服务器。
一种散热稳定结构，包括壳体及风扇，该壳体上设有容置槽，该风扇容置于该容置槽内，该风扇用以对该容置槽内的元件散热，该散热稳定结构还包括抽风机，该壳体还开设有与该容置槽导通的开口，该抽风机制造一风墙将该开口覆盖。
一种服务器，包括壳体、风扇及发热元件，该壳体上设有容置槽，该风扇及该发热元件容置于该容置槽内，该风扇用以对该发热元件散热，该服务器还包括抽风机，该壳体还开设有与该容置槽导通的开口，该抽风机制造一风墙将该开口覆盖。
上述服务器的抽风机制造一风墙将壳体的开口覆盖，此时风扇制造的冷却风受风墙阻挡而无法从开口吹出，从而使得冷却风沿原预订轨迹继续对发热元件进行散热。因此，上述服务器中，风扇制造的冷却风得到了充分利用，如此，不仅提高了服务器的散热效率，而且还提高了服务器的工作稳定性及安全性。
附图说明
图1为本发明较佳实施方式应用散热稳定结构的服务器的零件图；
图2为本发明较佳实施方式应用散热稳定结构的服务器的立体图；
图3为图2所示服务器沿III-III线的剖视图；
图4为图3所示服务器移除盖体后的示意图。
主要元件符号说明
服务器 100
壳体 10
盖体 20
风扇 30
发热元件 40
抽风机 50
容置槽 12
开口 122
进风口 52
出风口 54
开关 56
风嘴 542
如下具体实施方式将结合上述附图进一步说明本发明。
具体实施方式
请参阅图1及图2，本实施例的服务器100包括一壳体10、一盖体20、若干并排设置的风扇30、若干发热元件40及一抽风机50。壳体10上设有一容置槽12及一与该容置槽12导通的开口122(图未标)，风扇30、发热元件40及抽风机50均由该开口122进入并设置于该容置槽12内。该盖体20盖合于该开口122上。风扇30用以对发热元件40散热。发热元件40可以为服务器100中任意会发出热量的电子元器件，如CPU、硬盘等。
抽风机50包括一进风口52及一与进风口52连通的出风口54。进风口52用以抽取壳体10周围的冷空气。出风口54设于开口122处，用以将由进风口52抽入的冷空气送出并制造一将开口122覆盖的风墙。出风口54由若干平行设置的长条形的风嘴542组成，且所述风嘴542大致与风扇30排列的方向平行。抽风机50邻近盖体20设有一用以控制抽风机50的开关56，当盖体20压合于壳体10上时同时按压开关56以关闭抽风机50。
请一并参阅图3及图4，使用上述服务器100时，启动风扇30，风扇30制造一冷却风并沿预订轨迹于容置槽12吹过，同时将发热元件40制造的热量从容置槽12吹出。当需要检查容置槽12内的元件时，将盖体20从壳体10上移除，开关56随即回位并开启抽风机50。抽风机50将壳体10周围的冷空气从进风口52抽入并由出风口54送出，以在开口122处形成一将其覆盖的风墙。此时风扇30制造的冷却风受风墙阻挡而无法从开口122吹出，从而使得冷却风沿原预订轨迹对发热元件40进行散热。
上述服务器100在盖体20打开的情况下，抽风机50制造一风墙将壳体10的开口122覆盖，此时风墙相对于原盖合于壳体10上的盖体20并驱使风扇30制造的冷却风沿预订轨迹对发热元件40继续进行散热。因此，上述服务器100中，风扇30制造的冷却风得到了充分利用，如此，不仅提高了服务器100的散热效率，而且还提高了服务器100的工作稳定性及安全性。
另外，本领域技术人员还可在本发明权利要求公开的范围和精神内做其他形式和细节上的各种修改、添加和替换。当然，这些依据本发明精神所做的各种修改、添加和替换等变化，都应包含在本发明所要求保护的范围之内。

Claims (8)

1.一种散热稳定结构，包括壳体及风扇，该壳体上设有容置槽，该风扇容置于该容置槽内，该风扇用以对该容置槽内的元件散热，其特征在于：该散热稳定结构还包括抽风机，该壳体还开设有与该容置槽导通的开口，该抽风机制造一风墙将该开口覆盖。
2.如权利要求1所述的散热稳定结构，其特征在于：该吹风机包括进风口及出风口，该进风口用以抽取该壳体周围的冷空气，该出风口设于开口处以将由该进风口抽入的冷空气送出并制造上述风墙。
3.如权利要求2所述的散热稳定结构，其特征在于：该出风口由若干相互平行的长条形的风嘴组成。
4.如权利要求1所述的散热稳定结构，其特征在于：该散热稳定结构还包括盖合于该开口上的盖体，该抽风机上设有开关，当该盖体盖合于该壳体上同时压合该开关以将开关关闭，当该盖体从该壳体上移除后该开关开启并启动该抽风机形成上述风墙。
5.一种服务器，包括壳体、风扇及发热元件，该壳体上设有容置槽，该风扇及该发热元件容置于该容置槽内，该风扇用以对该发热元件散热，其特征在于：该服务器还包括抽风机，该壳体还开设有与该容置槽导通的开口，该抽风机制造一风墙将该开口覆盖。
6.如权利要求5所述的服务器，其特征在于：该吹风机包括进风口及出风口，该进风口用以抽取该壳体周围的冷空气，该出风口设于开口处以将由该进风口抽入的冷空气送出并制造上述风墙。
7.如权利要求6所述的服务器，其特征在于：该出风口由若干相互平行的长条形的风嘴组成。
8.如权利要求5所述的服务器，其特征在于：该服务器还包括盖合于该开口上的盖体，该抽风机上设有开关，当该盖体盖合于该壳体上时，同时压合该开关以将开关关闭；当该盖体从该壳体上移除后，该开关开启并启动该抽风机形成上述风墙。
CN201210125601.6A 2012-04-26 2012-04-26 散热稳定结构及应用该散热稳定结构的服务器 Active CN103376856B (zh)

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CN201210125601.6A CN103376856B (zh) 2012-04-26 2012-04-26 散热稳定结构及应用该散热稳定结构的服务器
TW101115515A TWI450682B (zh) 2012-04-26 2012-05-02 散熱穩定結構及應用該散熱穩定結構之伺服器
US13/728,520 US20130286580A1 (en) 2012-04-26 2012-12-27 Heat dissipation assembly and server using the same

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US11184997B2 (en) * 2018-04-23 2021-11-23 Intel Corporation System to reduce coolant use in an array of circuit boards

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TWM258343U (en) * 2004-06-25 2005-03-01 Guo-Chuan Hung Side-sucked cooling structure of industrial computer
US20060120043A1 (en) * 2004-12-07 2006-06-08 International Business Machines Corp. Cooling apparatus for vertically stacked printed circuit boards
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TW200746987A (en) * 2007-06-12 2007-12-16 Acbel Polytech Inc Power supply and heat radiation method thereof
CN101185382A (zh) * 2005-05-24 2008-05-21 株式会社建伍 用于空气冷却电子设备的装置
TWI563845B (en) * 2014-11-19 2016-12-21 Method for taking photo with extension flash module of mobile device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW563845U (en) * 2002-11-13 2003-11-21 Seventeam Electronics Co Ltd Power supply housing structure improvement capable of improving internal heat dissipation of computer
TWM258343U (en) * 2004-06-25 2005-03-01 Guo-Chuan Hung Side-sucked cooling structure of industrial computer
US20060120043A1 (en) * 2004-12-07 2006-06-08 International Business Machines Corp. Cooling apparatus for vertically stacked printed circuit boards
CN101185382A (zh) * 2005-05-24 2008-05-21 株式会社建伍 用于空气冷却电子设备的装置
US20070091567A1 (en) * 2005-10-25 2007-04-26 Nobutake Hayashi Information processing device and manufacturing method of the information processing device
US20090034171A1 (en) * 2005-10-25 2009-02-05 Nobutake Hayashi Information processing device and manufacturing method of the information processing device
TW200746987A (en) * 2007-06-12 2007-12-16 Acbel Polytech Inc Power supply and heat radiation method thereof
TWI563845B (en) * 2014-11-19 2016-12-21 Method for taking photo with extension flash module of mobile device

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CN103376856B (zh) 2017-02-22
TWI450682B (zh) 2014-08-21
US20130286580A1 (en) 2013-10-31

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