CN103303011A - Manufacturing method for circuit board - Google Patents
Manufacturing method for circuit board Download PDFInfo
- Publication number
- CN103303011A CN103303011A CN2012100595357A CN201210059535A CN103303011A CN 103303011 A CN103303011 A CN 103303011A CN 2012100595357 A CN2012100595357 A CN 2012100595357A CN 201210059535 A CN201210059535 A CN 201210059535A CN 103303011 A CN103303011 A CN 103303011A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- bearing substrate
- wind inlet
- preparation
- printing machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 5
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 238000007639 printing Methods 0.000 claims abstract description 38
- 238000007650 screen-printing Methods 0.000 claims abstract description 24
- 238000002360 preparation method Methods 0.000 claims description 20
- 238000000034 method Methods 0.000 claims description 11
- 238000003854 Surface Print Methods 0.000 claims description 2
- 230000000149 penetrating effect Effects 0.000 abstract 2
- 239000000463 material Substances 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 5
- 238000003466 welding Methods 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000012467 final product Substances 0.000 description 3
- 229920000297 Rayon Polymers 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Images
Landscapes
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a manufacturing method for a circuit board. The manufacturing method for the circuit board comprises the following steps: providing a bearing substrate, wherein the bearing substrate comprises a first surface and a second surface which are opposite; the bearing substrate is also provided with a plurality of deflector holes penetrating the first surface and the second surface and at least one first air draft hole penetrating the first surface and the second surface; putting the second surface of the bearing substrate to a printing machine board, wherein the printing machine board is provided with at least one second air draft hole which corresponds to the first air draft hole; providing the circuit board with a plurality of via holes, putting the circuit board to the first surface of the bearing substrate, and communicating the via holes and the deflector holes in the manner of one-to-one correspondence; vacuumizing by the first air draft holes to enable the circuit board to be smoothly pasted to the bearing substrate; printing the surface of the circuit board with a screen printing material, wherein the surface of the circuit board is far away from the bearing substrate; and removing the circuit board from the first surface of the bearing substrate to obtain the circuit board after screen printing.
Description
Technical field
The present invention relates to serigraphy, relate in particular to a kind of screenprinting that prevents and in printing process, pollute the preparation method of circuit board.
Background technology
Serigraphy is a kind of multiduty printing technology, and it is playing the part of important role in field of circuit boards always, and it is the key that realizes the coatings such as circuit board printing ink, viscose glue and scolding tin.In the circuit board making process, during serigraphy, circuit board directly is positioned over below the silk screen of printing screen plate, allow the screenprintings such as printing ink, viscose glue and scolding tin under the squeezing action of scraper, pass silk screen and be applied to presumptive area on the circuit board.
Take circuit board serigraphy welding resistance printing ink (green lacquer) as example, circuit board can have the surface of many conducting wires by preparation method coating welding resistance printing ink, to form the permanent protective layer of circuit board at circuit board usually after completing.But circuit board has a plurality of vias that run through the circuit board upper and lower surface usually, and when adopting serigraphy welding resistance printing ink, and welding resistance printing ink can pass via from the upper surface of circuit board and pollute the lower surface of circuit board.
Therefore, be necessary to provide a kind of screenprinting that prevents in printing process, to pollute the preparation method of circuit board.
Summary of the invention
Below a kind of preparation method of circuit board will be described with embodiment.
The present invention relates to a kind of preparation method of circuit board, it comprises step: bearing substrate is provided, this bearing substrate comprises relative first surface and second surface, and this bearing substrate also has a plurality of pod apertures that run through this first surface and second surface and runs through at least one first wind inlet of this first surface and second surface; The second surface of this bearing substrate is placed printing machine platform, and this printing machine platform has at least one second wind inlet corresponding with this first wind inlet; Circuit board with a plurality of vias is provided, and this circuit board is placed the first surface of this bearing substrate, make these a plurality of vias and the one by one corresponding connection of these a plurality of pod apertures; Thereby by vacuumizing from the first wind inlet so that circuit board entirely is affixed on bearing substrate; The surface printing screenprinting away from this bearing substrate at this circuit board; And the first surface of this circuit board from this bearing substrate removed, thereby obtain circuit board behind the wire mark.
In the preparation method of the circuit board of the technical program, the screenprinting that enters via flows directly in the pod apertures of bearing substrate, thereby can prevent effectively that screenprinting from polluting the surface of not printing screenprinting of circuit board in printing process, improved the manufacturing efficient of circuit board.
Description of drawings
The schematic diagram of the bearing substrate that Fig. 1 provides for the technical program embodiment.
The schematic diagram of the printing machine platform that Fig. 2 provides for the technical program embodiment.
Fig. 3 for the technical program embodiment provide with among Fig. 1 loading plate place schematic diagram behind the board of Fig. 2.
The schematic diagram of the circuit board that Fig. 4 provides for the technical program embodiment.
Behind the bearing substrate that circuit board among Fig. 4 is placed Fig. 3 that Fig. 5 provides for the technical program embodiment.
Fig. 6 is that bearing substrate, circuit board and printing machine platform among Fig. 5 is along the generalized section of VI-VI line.
Fig. 7 carries out generalized section behind the screen printing for what the technical program embodiment provided to the circuit board among Fig. 6.
Fig. 8 for the technical program embodiment provide the circuit board behind the wire mark among Fig. 7 is removed from bearing substrate after schematic diagram.
The main element symbol description
| |
10 |
| |
20 |
| |
30 |
| |
40 |
| |
60 |
| |
101 |
| |
103 |
| |
1011 |
| |
1013 |
| |
1015 |
| The first locating |
1017 |
| The |
1019 |
| |
201 |
| The |
202 |
| The |
203 |
| The |
205 |
| |
207 |
| The 5th surface | 301 |
| The 6th surface | 303 |
| |
305 |
| The second locating hole | 307 |
The following specific embodiment further specifies the present invention in connection with above-mentioned accompanying drawing.
The specific embodiment
Below in conjunction with a plurality of drawings and the embodiments, the preparation method of the circuit board that the technical program is provided is described in further detail.
The preparation method of the circuit board that the technical program embodiment provides comprises step:
The first step sees also Fig. 1, and a bearing substrate 10 is provided.Bearing substrate 10 comprises a plate body 101 and is attached to diaphragm 103 on the plate body 101.Diaphragm 103 pollutes the printing machine platform 20(that is used for carrying bearing substrate 10 for the screenprinting that prevents printing process and consults Fig. 2).
Diaphragm 103 covers four pod apertures 1015.
Second step sees also Fig. 2, and a printing machine platform 20 is provided.Printing machine platform 20 comprises a top board 201 and a vacuum extractor (not shown).
Vacuum extractor is connected with two the second wind inlets 205, is used for vacuumizing from two the second wind inlets 205.
The 3rd step; see also Fig. 3; bearing substrate 10 is placed the 3rd surface 202 of printing machine platform 20; and the second surface 1013 of diaphragm 103 and plate body 101 and the 3rd surface 202 are affixed; two the second wind inlets 205 and the one by one corresponding connection of two the first wind inlets 1019; and two alignment pins 207 are corresponding one by one with two the first locating holes 1017, so that each alignment pin 207 in two alignment pins 207 passes respectively corresponding the first locating hole 1017.
The 4th step saw also Fig. 4, and a circuit board 30 is provided.Circuit board 30 has the 5th surface 301 and reaches and the 5th surperficial 301 the 6th relative surface 303.Circuit board 30 also has a plurality of vias 305, and two the second locating holes 307 that run through the 301 and the 6th surface 303, the 5th surface.
The 5th step, see also Fig. 5 and Fig. 6, the 5th surface 301 of circuit board 30 is placed the first surface 1011 of bearing substrate 10, make a plurality of vias 305 and the one by one corresponding connection of a plurality of pod apertures 1015, and two alignment pins 207 are corresponding one by one with two the second locating holes 307, so that each alignment pin 207 in two alignment pins 207 enters respectively corresponding the second locating hole 307.
Need to prove, in order clearly to express diaphragm 103, the diaphragm 103 among Fig. 6 is the diaphragm of exaggerative thickness specially, directly so that the larger slit of existence between the bearing substrate 10 among Fig. 6 and the printing machine platform 20.In fact, for the thickness effect that prevents diaphragm 103 to the effect that vacuumizes, the thickness range of diaphragm 103 is 0.01 micron ~ 0.03 micron, and bearing substrate 10 and the slit between the printing machine platform 20 of this moment are very little, can ignore.Preferably, in the present embodiment, the thickness of diaphragm 103 is 0.022 micron.
The 6th step, open vacuum extractor, thereby by vacuumizing so that circuit board 30 entirely is affixed on bearing substrate 10 from the first wind inlet 1019.
The 7th step, consult Fig. 7, at the 6th surperficial 303(of circuit board 30 namely away from the surface of bearing substrate 10) printing screenprinting 40.In the present embodiment, screenprinting 40 is anti-solder ink.Certainly, screenprinting 40 also can for literal printing ink, conductive paste (such as copper cream, silver paste, tin cream etc.), be not limited to the anti-solder ink in the present embodiment.
The 8th step, consult Fig. 8, the first surface 1011 of circuit board 30 from bearing substrate 10 removed, thus the circuit board 30 behind the acquisition wire mark.
Certainly, also can adopt said method at the 5th surface of circuit board 30 301 printing screenprintings 40.Certainly, when having the screenprinting 40 that leaks down in the more printing process in the pod apertures 1015, also can remove diaphragm 103, and pod apertures 1015 is cleaned, with follow-up for subsequent use.
In order to guarantee that circuit board 30 can entirely be adsorbed on the bearing substrate 10, the diameter of each the first wind inlet 1019 is greater than the diameter (as shown in Figure 6) of each the second corresponding wind inlet 205.In order to guarantee better aligning accuracy, the diameter of the second wind inlet 205 that the diameter of each the first wind inlet 1019 is corresponding with each differs 0.5 millimeter ~ 1.5 millimeters.In the present embodiment, the diameter of the second wind inlet 205 that the diameter of each the first wind inlet 1019 is corresponding with each differs 1 millimeter.
In order easily to distinguish the different bearing substrate 10 that is complementary from various boards 30, also be provided with the mark 60 for sign bearing substrate 10 on the bearing substrate 10, as shown in Figure 3.In the present embodiment, mark 60 adopts the text printout method to form.Certainly, mark 60 also can adopt the methods such as drill point boring, laser drill to form, and is not limited to the text printout method in the present embodiment.
In the preparation method of the circuit board of the technical program, the screenprinting 40 that enters via 305 can enter corresponding pod apertures 1015, and adhere to the hole wall of pod apertures 1015, thereby effectively prevented the 5th surface 301 that screenprinting 40 pollutes circuit board 30, remove the step of removing pollutant from, improved the production efficiency of circuit board 30.Diaphragm 103 can stop further that screenprinting 40 flows to printing machine platform 20, prevents that screenprinting 40 from polluting circuit board 30.
Certainly, pollute the printing machine platform 20 that is used for carrying bearing substrate 10 if the hole depth of pod apertures 1015 enough prevents screenprinting, diaphragm 103 also can omit not.
Be understandable that, the number of the via 305 on the circuit board 30 can also for one, two, three or more, be not limited to four in the present embodiment; The number of pod apertures 1015 can also for one, two, three or more, be not limited to four in the present embodiment, as long as via 305 is corresponding one by one with pod apertures 1015, thereby so that screenprinting can flow into pod apertures 1015 gets final product.
Be understandable that, the number of the second locating hole 307 on the circuit board 30 can also be three, four or more, is not limited to two in the present embodiment; The number of the first locating hole 1017 can also be three, four or more, is not limited to two in the present embodiment; The number of alignment pin 207 can also be three, four or more, be not limited to two in the present embodiment, as long as the second locating hole 307, the first locating hole 1017 and alignment pin 207 are corresponding one by one, thereby with circuit board 30, bearing substrate 10 and printing machine platform 20 location and fixing getting final product.
Be understandable that, the number of the first wind inlet 1019 can also be one, three, four or more, is not limited to two in the present embodiment; The number of the second wind inlet 205 can also be one, three, four or more, be not limited to two in the present embodiment, as long as the first wind inlet 1019 is corresponding one by one with the second wind inlet 205, get final product thereby under the effect of air intake device, circuit board 30 is adsorbed in bearing substrate 10.
Be understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these change the protection domain that all should belong to claim of the present invention with distortion.
Claims (10)
1. the preparation method of a circuit board comprises step:
Bearing substrate is provided, and this bearing substrate comprises relative first surface and second surface, and this bearing substrate also has a plurality of pod apertures that run through this first surface and second surface and runs through at least one first wind inlet of this first surface and second surface;
The second surface of this bearing substrate is placed printing machine platform, and this printing machine platform has at least one second wind inlet corresponding with this first wind inlet;
Circuit board with a plurality of vias is provided, and this circuit board is placed the first surface of this bearing substrate, make these a plurality of vias and the one by one corresponding connection of these a plurality of pod apertures;
Thereby by vacuumizing from the first wind inlet so that circuit board entirely is affixed on bearing substrate;
The surface printing screenprinting away from this bearing substrate at this circuit board; And
The first surface of this circuit board from this bearing substrate removed, thus the circuit board behind the acquisition wire mark.
2. the preparation method of circuit board as claimed in claim 1 is characterized in that, the diameter of each the first wind inlet in this at least one first wind inlet is greater than the diameter of each the second corresponding wind inlet.
3. the preparation method of circuit board as claimed in claim 2 is characterized in that, the diameter of the second wind inlet that the diameter of each the first wind inlet in this at least one first wind inlet is corresponding with each differs 0.5 millimeter ~ 1.5 millimeters.
4. the preparation method of circuit board as claimed in claim 3 is characterized in that, the diameter range of this at least one the first wind inlet is 2 millimeters ~ 4 millimeters.
5. the preparation method of circuit board as claimed in claim 1, it is characterized in that, this printing machine platform comprises at least two alignment pins, this bearing substrate comprises at least two the first locating holes that run through this first surface and second surface, place the printing machine platform step at the second surface with this bearing substrate, also comprise at least two the first locating holes of these at least two alignment pins and this corresponding and step of each alignment pin in these at least two alignment pins being passed respectively the first corresponding locating hole one by one.
6. the preparation method of circuit board as claimed in claim 5, it is characterized in that, this circuit board also comprises at least two the second locating holes, at the circuit board that provides to have a plurality of vias, and this circuit board is placed the first surface of this bearing substrate, make these a plurality of vias and these a plurality of pod apertures one by one in the corresponding connection step, also comprise at least two the second locating holes of these at least two alignment pins and this corresponding one by one so that each alignment pin in these at least two alignment pins enters respectively the step of the second corresponding locating hole.
7. the preparation method of circuit board as claimed in claim 1 is characterized in that, this bearing substrate also comprises the diaphragm being located at this second surface and covering this at least one pod apertures.
8. the preparation method of circuit board as claimed in claim 7 is characterized in that, the thickness range of this diaphragm is 0.01 micron ~ 0.03 micron.
9. the preparation method of circuit board as claimed in claim 1 is characterized in that, this bearing substrate also comprises the mark that is used for this bearing substrate of sign of being located at this bearing substrate.
10. the preparation method of circuit board as claimed in claim 9 is characterized in that, this mark adopts drill point boring or text printout method to form.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100595357A CN103303011A (en) | 2012-03-08 | 2012-03-08 | Manufacturing method for circuit board |
| TW101108539A TWI455668B (en) | 2012-03-08 | 2012-03-13 | Method for manufacturing circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100595357A CN103303011A (en) | 2012-03-08 | 2012-03-08 | Manufacturing method for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103303011A true CN103303011A (en) | 2013-09-18 |
Family
ID=49128915
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012100595357A Pending CN103303011A (en) | 2012-03-08 | 2012-03-08 | Manufacturing method for circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN103303011A (en) |
| TW (1) | TWI455668B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106626729A (en) * | 2016-09-23 | 2017-05-10 | 盐城工学院 | Mold used for electrode coating and electrode coating device provided with mold |
| CN109496071A (en) * | 2018-11-01 | 2019-03-19 | 广州金鹏源康精密电路股份有限公司 | A kind of welding resistance consent component |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3889363A (en) * | 1971-02-16 | 1975-06-17 | Richard P Davis | Method of making printed circuit boards |
| JPH02137392A (en) * | 1988-11-18 | 1990-05-25 | Furukawa Electric Co Ltd:The | Printed wiring board |
| CN1277797A (en) * | 1998-10-07 | 2000-12-20 | 松下电器产业株式会社 | Circuit board manufacturing method, manufacturing apparatus, and porous sheet used |
| JP2001301120A (en) * | 2000-04-24 | 2001-10-30 | Fuji Mach Mfg Co Ltd | Method and apparatus for screen printing |
| CN1340289A (en) * | 1999-12-15 | 2002-03-13 | 松下电器产业株式会社 | Circuit-formed substrate and method for manufacturing circuit-formed substrate |
| CN1565056A (en) * | 2002-03-29 | 2005-01-12 | 松下电器产业株式会社 | Method of manufacturing heat conductive substrate |
| CN1575627A (en) * | 2001-10-26 | 2005-02-02 | 松下电工株式会社 | Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method |
| CN101318400A (en) * | 2007-06-08 | 2008-12-10 | 富葵精密组件(深圳)有限公司 | Text printing screen and method for producing circuit board using the text printing screen |
| CN101340778A (en) * | 2007-07-06 | 2009-01-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollow printed circuit board |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5560779B2 (en) * | 2010-03-08 | 2014-07-30 | 株式会社デンソー | Method for manufacturing multilayer circuit board with through via filled with conductive material |
| TWM407585U (en) * | 2011-01-03 | 2011-07-11 | Career Technology Mfg Co Ltd | Circuit board fixture of printing |
-
2012
- 2012-03-08 CN CN2012100595357A patent/CN103303011A/en active Pending
- 2012-03-13 TW TW101108539A patent/TWI455668B/en not_active IP Right Cessation
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3889363A (en) * | 1971-02-16 | 1975-06-17 | Richard P Davis | Method of making printed circuit boards |
| JPH02137392A (en) * | 1988-11-18 | 1990-05-25 | Furukawa Electric Co Ltd:The | Printed wiring board |
| CN1277797A (en) * | 1998-10-07 | 2000-12-20 | 松下电器产业株式会社 | Circuit board manufacturing method, manufacturing apparatus, and porous sheet used |
| CN1340289A (en) * | 1999-12-15 | 2002-03-13 | 松下电器产业株式会社 | Circuit-formed substrate and method for manufacturing circuit-formed substrate |
| JP2001301120A (en) * | 2000-04-24 | 2001-10-30 | Fuji Mach Mfg Co Ltd | Method and apparatus for screen printing |
| CN1575627A (en) * | 2001-10-26 | 2005-02-02 | 松下电工株式会社 | Wiring board sheet and its manufacturing method, multilayer board, and its manufacturng method |
| CN1565056A (en) * | 2002-03-29 | 2005-01-12 | 松下电器产业株式会社 | Method of manufacturing heat conductive substrate |
| CN101318400A (en) * | 2007-06-08 | 2008-12-10 | 富葵精密组件(深圳)有限公司 | Text printing screen and method for producing circuit board using the text printing screen |
| CN101340778A (en) * | 2007-07-06 | 2009-01-07 | 富葵精密组件(深圳)有限公司 | Manufacturing method of hollow printed circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106626729A (en) * | 2016-09-23 | 2017-05-10 | 盐城工学院 | Mold used for electrode coating and electrode coating device provided with mold |
| CN106626729B (en) * | 2016-09-23 | 2019-04-05 | 盐城工学院 | For electrode coating mold and the electrode coating unit of the mold is set |
| CN109496071A (en) * | 2018-11-01 | 2019-03-19 | 广州金鹏源康精密电路股份有限公司 | A kind of welding resistance consent component |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201338657A (en) | 2013-09-16 |
| TWI455668B (en) | 2014-10-01 |
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| PB01 | Publication | ||
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| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
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Application publication date: 20130918 |