CN103260386A - Layout structure of high-power power electronic equipment - Google Patents
Layout structure of high-power power electronic equipment Download PDFInfo
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- CN103260386A CN103260386A CN2013101803243A CN201310180324A CN103260386A CN 103260386 A CN103260386 A CN 103260386A CN 2013101803243 A CN2013101803243 A CN 2013101803243A CN 201310180324 A CN201310180324 A CN 201310180324A CN 103260386 A CN103260386 A CN 103260386A
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- 238000001816 cooling Methods 0.000 claims abstract description 51
- 230000017525 heat dissipation Effects 0.000 claims abstract description 9
- 238000005192 partition Methods 0.000 claims abstract description 6
- 206010022000 influenza Diseases 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 9
- 239000000428 dust Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007664 blowing Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 230000002633 protecting effect Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
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Abstract
The invention relates to a layout structure of high-power power electronic equipment. The layout structure of the high-power power electronic equipment is characterized in that a first partition plate divides the inner space of a case of the high-power power electronic equipment into a front cavity and a back cavity, the front cavity is close to a front door of the case of the high-power power electronic equipment, a second partition plate divides the back cavity into a first cavity and a second cavity, and a system component unit, an inductance unit and an IGBT module unit are respectively arranged inside the front cavity, the first cavity and the second cavity. The IGBT module unit is located in the middle of the upper portion of the case of high-power power electronic equipment, the inductance unit is located on the bottom inside the case of the high-power power electronic equipment, and a system unit cooling fan and an inductance unit cooling fan are respectively arranged in the front cavity and the back cavity. According to the layout structure of the high-power power electronic equipment, mutually independent cavities and air flues are formed through the partition plates, and heat dissipation efficiency is improved. An IGBT module fan is arranged in the opposite direction, mutual interference among the fans are avoided, supply air rate is guaranteed, and the layout space is saved.
Description
Technical field
The present invention relates to the layout structure of a kind of large power power electronic appliance inside, belong to power electronics, photovoltaic power generation technology field.
Background technology
Large power power electronic appliance, reason such as big owing to power, that caloric value is big, the space is little, environment for use is abominable is to guarantee reliability of products, and heat radiation and the dustproof aspect of equipment proposed very high request.
There is following problem in the layout structure of most of large power power electronic appliances inside on the market at present:
The first, caloric value is different device bulk storages are in rack, and not only the device that caloric value is bigger can not get effective heat radiation, can influence other device on the contrary, and radiating effect is very poor.
The second, for solving heat radiation, simply remove to strengthen radiator, blower fan and machine dimensions, cost of idleness.
Three, the blower fan position is unreasonable, not only makes equipment can not get effective heat radiation, and the life-span of blower fan is also very low.
Four, Primary Component can not get effective heat radiation, and reliability is low.
Bring bigger dust into when five, blower fan is worked, influence the performance of circuit board and part of devices.If the use screen pack is arranged, can increase screen pack and change frequency, increase maintenance cost.
Summary of the invention
The technical problem to be solved in the present invention is the radiating effect that increases former large power power electronic appliance under the condition that does not increase cost.
In order to solve the problems of the technologies described above, technical scheme of the present invention has provided a kind of layout structure of large power power electronic appliance, it is characterized in that: cavity and rear chamber before by first dividing plate inner space of large power power electronic appliance housing being divided into, preceding cavity is near the Qianmen of large power power electronic appliance housing, by second partition rear chamber is divided into first cavity and second cavity, the system unit unit, inductance unit and IGBT module group unit are arranged in preceding cavity, in first cavity and second cavity, wherein, the IGBT module group unit is positioned in the middle of the top of large power power electronic appliance housing, inductance unit is positioned at the bottom of large power power electronic appliance housing, system unit cooling fan and inductance unit cooling fan are arranged in preceding cavity and the rear chamber, system unit cooling fan and inductance unit cooling fan all are positioned at the top of large power power electronic appliance housing, middle part and bottom at the Qianmen have the Qianmen air inlet, position below the large power power electronic appliance housing is positioned at inductance unit has the bottom air inlet mouth, the cooling air heat that the air port enters the back or take away the system unit unit via the system unit heat dissipation wind channel that enters by the front door is discharged by the system unit cooling fan, discharge after perhaps taking away the heat of IGBT module group unit via IGBT module group unit heat dissipation wind channel, cooling air enters the heat of taking away inductance unit by the inductance unit heat dissipation wind channel by the bottom air inlet mouth and discharges by the inductance unit cooling fan.
Preferably, described IGBT module group unit comprises A phase IGBT module group unit, B phase IGBT module group unit and the C phase IGBT module group unit that is arranged side by side, be respectively equipped with A phase cooling fan, B phase cooling fan and C phase cooling fan under A phase IGBT module group unit, B phase IGBT module group unit and C phase IGBT module group unit, A phase cooling fan, C phase cooling fan are pressed opposite to layout with B phase cooling fan at fore-and-aft direction.
Advantage of the present invention is:
1, isolates separate cavity and air channel, improved radiating efficiency.
2, the raising of radiating efficiency selects for use the small-power fan to reduce system noise.
3, the heat radiation of IGBT module group unit can reduce bringing into of dust from middle and upper part, the Qianmen air intake of machine, has played good proofing dust and protecting effect.
4, IGBT module blower fan is taked the blowing mode, and what enter blower fan is cold wind, and the useful life of blower fan is longer.
5, IGBT module blower fan both guaranteed air intake by preventing phase mutual interference between the blower fan towards arranging on the contrary, had saved arrangement space again, made entire equipment overall dimension less, and interior layout is succinct, and is attractive in appearance, saved cost, and convenient the installation safeguarded.
Description of drawings
Fig. 1 is the structural representation of the layout structure of a kind of large power power electronic appliance provided by the invention;
Fig. 2 A is a kind of structural representation of IGBT module group unit;
Fig. 2 B is the another kind of structural representation of IGBT module group unit.
Embodiment
For the present invention is become apparent, now with preferred embodiment, and conjunction with figs. is described in detail below.
Consider the relatively poor environment such as the many suburbs of environment for use, desert of high-power photovoltaic DC-to-AC converter, and caloric value and the function of each assembly in the photovoltaic DC-to-AC converter.The present invention is divided into three relatively independent unit with the machine body of high-power photovoltaic DC-to-AC converter, that is: IGBT module group unit 1, inductance unit 2 and system unit unit 3, and carry out rational layout.At first, cavity and rear chamber before with first dividing plate inner space of high-power photovoltaic DC-to-AC converter housing being divided into, preceding cavity is in the front, and near the front, rear chamber is in the back.Secondly, use second partition 4 with the rear chamber one-to-two again, be divided into first cavity and second cavity.System unit unit 3, inductance unit 2 and IGBT module group unit 1 are arranged in preceding cavity, first cavity and second cavity.IGBT module group unit 1 is positioned in the middle of the top, and 2 of heavier inductance unit are positioned at the bottom.Relatively independent and the sealing of each cavity has independent ventiduct.Machine adopts air blast cooling, and system unit cooling fan 5 and inductance unit cooling fan 6 be the right and left at the top in high-power photovoltaic DC-to-AC converter housing respectively.Middle part and bottom at the Qianmen have the Qianmen air inlet, and the position below the large power power electronic appliance housing is positioned at inductance unit 2 has the bottom air inlet mouth
Shown in Fig. 2 A and Fig. 2 B, IGBT module group unit 1 comprises the A phase IGBT module group unit 9 that is arranged side by side, B phase IGBT module group unit 10 and C phase IGBT module group unit 11, at A phase IGBT module group unit 9, be respectively equipped with A phase cooling fan 12 under B phase IGBT module group unit 10 and the C phase IGBT module group unit 11, B phase cooling fan 13 and C phase cooling fan 14, A phase cooling fan 12, C phase cooling fan 14 is pressed opposite to layout with B phase cooling fan 13 at fore-and-aft direction, for example: A phase cooling fan 12, C phase cooling fan 14 forward, B phase cooling fan 13 backwards or A phase cooling fan 12, C phase cooling fan 14 backwards, B phase cooling fan 13 is forward.
The heat radiation of IGBT module group unit 1 is: A phase IGBT module group unit 9, B phase IGBT module group unit 10 and C phase IGBT module group unit 11 have independently air channel.The cooling air air port that enters by the front door enters by being brought separately independently into the air channel by the cooling fan of IGBT module group unit respectively and upwards discharging rack through this air channel.
The heat radiation of inductance unit 2 is: cooling air is entered by inductance unit heat dissipation wind channel 7 by the bottom air inlet mouth and takes away the heat of inductance unit 2 by 6 discharges of inductance unit cooling fan.
The heat radiation of system component unit 1 is: the cooling air air port that enters by the front door enters by the heat of being taken away system unit unit 3 by the system unit heat dissipation wind channel and discharges by system unit cooling fan 5 and IGBT module blower fan.
Claims (2)
1. the layout structure of a large power power electronic appliance, it is characterized in that: cavity and rear chamber before by first dividing plate inner space of large power power electronic appliance housing being divided into, preceding cavity is near the Qianmen of large power power electronic appliance housing, by second partition (4) rear chamber is divided into first cavity and second cavity, system unit unit (3), inductance unit (2) and IGBT module group unit (1) are arranged in preceding cavity, in first cavity and second cavity, wherein, IGBT module group unit (1) is positioned in the middle of the top of large power power electronic appliance housing, inductance unit (2) is positioned at the bottom of large power power electronic appliance housing, system unit cooling fan (5) and inductance unit cooling fan (6) are arranged in preceding cavity and the rear chamber, system unit cooling fan (5) and inductance unit cooling fan (6) all are positioned at the top of large power power electronic appliance housing, middle part and bottom at the Qianmen have the Qianmen air inlet, the position that is positioned at inductance unit (2) below at the large power power electronic appliance housing has the bottom air inlet mouth, the cooling air heat that the air port enters the back or take away system unit unit (3) via the system unit heat dissipation wind channel that enters by the front door is discharged by system unit cooling fan (5), discharge after perhaps taking away the heat of IGBT module group unit (1) via IGBT module group unit heat dissipation wind channel, cooling air enters the heat of taking away inductance unit (2) by inductance unit heat dissipation wind channel (7) by the bottom air inlet mouth and discharges by inductance unit cooling fan (6).
2. the layout structure of a kind of large power power electronic appliance as claimed in claim 1, it is characterized in that: described IGBT module group unit (1) comprises the A phase IGBT module group unit (9) that is arranged side by side, B phase IGBT module group unit (10) and C phase IGBT module group unit (11), at A phase IGBT module group unit (9), be respectively equipped with A phase cooling fan (12) under B phase IGBT module group unit (10) and the C phase IGBT module group unit (11), B phase cooling fan (13) and C phase cooling fan (14), A phase cooling fan (12), C phase cooling fan (14) is pressed opposite to layout with B phase cooling fan (13) at fore-and-aft direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101803243A CN103260386A (en) | 2013-05-15 | 2013-05-15 | Layout structure of high-power power electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101803243A CN103260386A (en) | 2013-05-15 | 2013-05-15 | Layout structure of high-power power electronic equipment |
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| CN103260386A true CN103260386A (en) | 2013-08-21 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4465779A1 (en) * | 2023-05-16 | 2024-11-20 | Delta Electronics, Inc. | Photovoltaic-inverter heat-dissipation assembly |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201821282U (en) * | 2010-09-08 | 2011-05-04 | 常州佳讯光电产业发展有限公司 | Photovoltaic inverter installation structure |
| CN202455722U (en) * | 2012-02-14 | 2012-09-26 | 上海正泰电源系统有限公司 | Layout structure of high-power electric power electronic equipment |
| CN102768551A (en) * | 2011-05-04 | 2012-11-07 | 通用汽车环球科技运作有限责任公司 | Thermal control of multiple devices |
| CN202663281U (en) * | 2012-05-11 | 2013-01-09 | 中国电力科学研究院 | Large-power current transformer power module structure |
| CN202696495U (en) * | 2012-07-10 | 2013-01-23 | 中冶赛迪电气技术有限公司 | IGBT (insulated gate bipolar transistor) low-voltage inverter |
| CN203301924U (en) * | 2013-05-15 | 2013-11-20 | 上海正泰电源系统有限公司 | Layout structure of high-power electric-power electronic equipment |
-
2013
- 2013-05-15 CN CN2013101803243A patent/CN103260386A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201821282U (en) * | 2010-09-08 | 2011-05-04 | 常州佳讯光电产业发展有限公司 | Photovoltaic inverter installation structure |
| CN102768551A (en) * | 2011-05-04 | 2012-11-07 | 通用汽车环球科技运作有限责任公司 | Thermal control of multiple devices |
| CN202455722U (en) * | 2012-02-14 | 2012-09-26 | 上海正泰电源系统有限公司 | Layout structure of high-power electric power electronic equipment |
| CN202663281U (en) * | 2012-05-11 | 2013-01-09 | 中国电力科学研究院 | Large-power current transformer power module structure |
| CN202696495U (en) * | 2012-07-10 | 2013-01-23 | 中冶赛迪电气技术有限公司 | IGBT (insulated gate bipolar transistor) low-voltage inverter |
| CN203301924U (en) * | 2013-05-15 | 2013-11-20 | 上海正泰电源系统有限公司 | Layout structure of high-power electric-power electronic equipment |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4465779A1 (en) * | 2023-05-16 | 2024-11-20 | Delta Electronics, Inc. | Photovoltaic-inverter heat-dissipation assembly |
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Application publication date: 20130821 |