CN103237409A - Flexible printed circuit (FPC) single-layer board - Google Patents
Flexible printed circuit (FPC) single-layer board Download PDFInfo
- Publication number
- CN103237409A CN103237409A CN2013101603798A CN201310160379A CN103237409A CN 103237409 A CN103237409 A CN 103237409A CN 2013101603798 A CN2013101603798 A CN 2013101603798A CN 201310160379 A CN201310160379 A CN 201310160379A CN 103237409 A CN103237409 A CN 103237409A
- Authority
- CN
- China
- Prior art keywords
- adhesive tape
- transparent adhesive
- road transparent
- fpc
- conductive layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002356 single layer Substances 0.000 title abstract 5
- 239000002390 adhesive tape Substances 0.000 claims abstract description 36
- 239000000463 material Substances 0.000 claims abstract description 24
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 229920001721 polyimide Polymers 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000004698 Polyethylene Substances 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- -1 polyethylene Polymers 0.000 claims description 3
- 229920000573 polyethylene Polymers 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000010410 layer Substances 0.000 abstract 3
- 239000011247 coating layer Substances 0.000 abstract 2
- 239000003292 glue Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
Images
Landscapes
- Laminated Bodies (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a flexible printed circuit (FPC) single-layer board. The FPC single-layer board comprises a protection film, a primary transparent adhesive tape, a conductive layer, a secondary transparent adhesive tape, a base material and a bonding pad coating layer, and the FPC single-layer board is characterized in that the primary transparent adhesive tape is arranged on the protection film, the primary transparent adhesive tape is fixedly bonded with the conductive layer, the lower end of the conductive layer is also provided with the secondary transparent adhesive tape, the secondary transparent adhesive tape is fixedly bonded with the base material, and the bonding pad coating layer is arranged on the primary transparent adhesive tape. The FPC single-layer board not only has higher flexibility and higher planeness of a bonding pad, but also is low in manufacturing cost.
Description
Technical field
The present invention relates to the flexible PCB field, relate in particular to a kind of FPC flexible circuit lamina.
Background technology
Along with increasing mobile phone adopts flip structure, flexible PCB also more and more is used thereupon.Combination according to base material and conductive layer is divided, and flexible PCB can be divided into two kinds: glue flexible board and no glue flexible board are arranged.
The price of wherein not having the glue flexible board is more much higher than the flexible board that glue is arranged, because the price of no glue flexible board is too high, most flexible boards of using in market at present still have the flexible board of glue.
Summary of the invention
Technical problem to be solved by this invention provides a kind of higher pliability that not only has, and the flatness of pad is also higher, and also low FPC flexible circuit lamina of manufacturing cost.
For solving the problems of the technologies described above; the invention provides a kind of FPC flexible circuit lamina; comprise diaphragm, the first road transparent adhesive tape, conductive layer, the second road transparent adhesive tape, base material, pad coating; it is characterized in that: described diaphragm is provided with the first road transparent adhesive tape; the described first road transparent adhesive tape and conductive layer interfix bonding; described conductive layer lower end also is provided with the second road transparent adhesive tape, and the described second road transparent adhesive tape and base material interfix bonding, and described pad coating is arranged on the first road transparent adhesive tape.
Further, described diaphragm material is polyimides (PLOYMIDE).
Further, the described first road transparent adhesive tape, the second road transparent adhesive tape material are epoxy resin or polyethylene.
Further, described conductive is Copper Foil.
Further, described substrate material is polyimides (PLOYMIDE).
A nearlyer step, described pad coating material is gold, tin or scolding tin.
Compared with prior art, beneficial effect of the present invention is: the present invention not only has higher pliability, and the flatness of pad is also higher, and manufacturing cost is also low.
Description of drawings
Fig. 1 is structural representation of the present invention.
Number in the figure:
The 1-diaphragm 2-first road transparent adhesive tape 3-conductive layer 4-second road transparent adhesive tape 5-base material 6-pad coating.
Embodiment
Below in conjunction with the drawings and specific embodiments the present invention is described in further details referring to shown in Figure 1; a kind of FPC flexible circuit lamina; comprise diaphragm 1; the first road transparent adhesive tape 2; conductive layer 3; the second road transparent adhesive tape 4; base material 5; pad coating 6; described diaphragm 1 is provided with the first road transparent adhesive tape 2; the described first road transparent adhesive tape 1 interfixes bonding with conductive layer 3; described conductive layer 3 lower ends also are provided with the second road transparent adhesive tape 4; the described second road transparent adhesive tape 4 interfixes bonding with base material 5; described pad coating 6 is arranged on the first road transparent adhesive tape 2; described diaphragm 1 material is polyimides (PLOYMIDE); the described first road transparent adhesive tape 2; the second road transparent adhesive tape, 4 materials are epoxy resin or polyethylene; described conductive layer 3 materials are Copper Foil; described base material 5 materials are polyimides (PLOYMIDE), and described pad coating 6 materials are gold; tin or scolding tin.
To sum up, the present invention not only has higher pliability, and the flatness of pad is also higher, and manufacturing cost is also low.
The above only is preferred embodiments of the present invention; protection scope of the present invention is not limited with above-mentioned execution mode; as long as the equivalence that those of ordinary skills do according to disclosed content is modified or changed, all should include in the protection range of putting down in writing in claims.
Claims (6)
1. FPC flexible circuit lamina; comprise diaphragm, the first road transparent adhesive tape, conductive layer, the second road transparent adhesive tape, base material, pad coating; it is characterized in that: described diaphragm is provided with the first road transparent adhesive tape; the described first road transparent adhesive tape and conductive layer interfix bonding; described conductive layer lower end also is provided with the second road transparent adhesive tape; the described second road transparent adhesive tape and base material interfix bonding, and described pad coating is arranged on the first road transparent adhesive tape.
2. a kind of FPC flexible circuit lamina according to claim 1, it is characterized in that: described diaphragm material is polyimides (PLOYMIDE).
3. a kind of FPC flexible circuit lamina according to claim 1, it is characterized in that: the described first road transparent adhesive tape, the second road transparent adhesive tape material are epoxy resin or polyethylene.
4. a kind of FPC flexible circuit lamina according to claim 1, it is characterized in that: described conductive is Copper Foil.
5. a kind of FPC flexible circuit lamina according to claim 1, it is characterized in that: described substrate material is polyimides (PLOYMIDE).
6. a kind of FPC flexible circuit lamina according to claim 1 is characterized in that: described pad coating material is gold, tin or scolding tin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101603798A CN103237409A (en) | 2013-05-04 | 2013-05-04 | Flexible printed circuit (FPC) single-layer board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2013101603798A CN103237409A (en) | 2013-05-04 | 2013-05-04 | Flexible printed circuit (FPC) single-layer board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103237409A true CN103237409A (en) | 2013-08-07 |
Family
ID=48885411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2013101603798A Pending CN103237409A (en) | 2013-05-04 | 2013-05-04 | Flexible printed circuit (FPC) single-layer board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103237409A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201015912Y (en) * | 2007-01-15 | 2008-02-06 | 夏超华 | Rubber-resisted film for FPC soft board conventional pressing |
| US20100326704A1 (en) * | 2009-06-30 | 2010-12-30 | Wintek Corporation | Soldering pad layout for flexible printed circuit board |
| CN203233594U (en) * | 2013-05-04 | 2013-10-09 | 鑫茂电子（昆山）有限公司 | FPC flexible circuit single-layer board |
-
2013
- 2013-05-04 CN CN2013101603798A patent/CN103237409A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201015912Y (en) * | 2007-01-15 | 2008-02-06 | 夏超华 | Rubber-resisted film for FPC soft board conventional pressing |
| US20100326704A1 (en) * | 2009-06-30 | 2010-12-30 | Wintek Corporation | Soldering pad layout for flexible printed circuit board |
| CN203233594U (en) * | 2013-05-04 | 2013-10-09 | 鑫茂电子（昆山）有限公司 | FPC flexible circuit single-layer board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130807 |