CN103212816A - Ultraviolet-laser Punch drilling method - Google Patents
Ultraviolet-laser Punch drilling method Download PDFInfo
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- CN103212816A CN103212816A CN2012100157653A CN201210015765A CN103212816A CN 103212816 A CN103212816 A CN 103212816A CN 2012100157653 A CN2012100157653 A CN 2012100157653A CN 201210015765 A CN201210015765 A CN 201210015765A CN 103212816 A CN103212816 A CN 103212816A
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- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000005553 drilling Methods 0.000 title abstract description 9
- 239000000463 material Substances 0.000 claims description 8
- 239000012467 final product Substances 0.000 claims description 5
- 239000011148 porous material Substances 0.000 claims description 4
- 238000003913 materials processing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 7
- 230000008569 process Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N ferric oxide Chemical compound O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Abstract
The invention discloses an ultraviolet-laser Punch drilling method which comprises the following steps: S10, adjusting appropriate parameters; S11, producing a document according to machining requirements and making Punch points at a to-be-drilled circle center position; and S12, introducing the document to a laser machining software for processing. The ultraviolet-laser Punch drilling method disclosed by the invention can be used for drilling holes smaller than 50 microns; moreover, the punch drilling speed is extremely high and the production efficiency can be greatly improved.
Description
Technical field
The invention belongs to technical field of laser processing, relate in particular to a kind of Ultra-Violet Laser Punch boring method of processing the micro-aperture size.
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Background technology
It is HDI PCB(high density interconnect printed circuit board (PCB) that the lightly conducting hole forms: a kind of key technology in High Density Interconnect Printed Circuit Board) making, especially be accompanied by the demand of growing lightweight, portability and high-end e-machine such as highly integrated, many advanced persons' PCB often makes the multi-layer conductive that contains the plated through-hole that inter-level interconnects uses.Traditional machine drilling technology generally is confined to the above aperture size of 100 μ m; because the frequent damage and the machine stopping time of drill bit; this traditional machine drilling technology is low for the via drilling efficiency below 200 microns, the cost cost is big, is high so take this kind boring cost.Secondly, traditional mechanical drilling method also is difficult to produce blind via, thereby is difficult to provide multi-layer sheet needed perpendicular interconnection.
Because laser drill has many good characteristics, thereby laser drill is replacing mechanical bore process in recent years.Laser drill processing needs to consider the absorptivity of pcb board material (resin, Copper Foil and glass) to laser, CO
2Laser is respond well to resin boring, but Copper Foil and glass are just processed relatively difficulty, and CO
2Can only bore the above hole of system 75 μ m.And above-mentioned material all has good absorptivity to Ultra-Violet Laser, at present generally with helix cutting carrying out hole processing, this helix operation has not only limited production efficiency, and during helical cut aperture more little (50 μ m are following), the accumulation of heat of hole is high more, cause processing effect poor more, can only process the above hole of 50 μ m.
Therefore, industry is badly in need of exploring a kind of to solve the defective that exists in the above-mentioned prior art, the hole that can bore the system micro-aperture, and penetration rate is fast, the scheme that production efficiency is high.
Summary of the invention
For addressing the above problem, the object of the present invention is to provide a kind of Ultra-Violet Laser Punch boring method, this method can be bored the following hole of system 50 μ m, and penetration rate is exceedingly fast, and can enhance productivity greatly.
For achieving the above object, technical scheme of the present invention is:
A kind of Ultra-Violet Laser Punch boring method comprises the steps:
S10: regulate suitable parameters;
S11: make file according to processing request, make the punch point at the home position of needs boring;
S12: the importing file is processed to Laser Processing software and is got final product.
Further, described step S10 comprises:
S101: regulate laser power and single pulse energy density parameter, to guarantee the required laser energy of materials processing;
S102: regulate Punch time and laser frequency parameter, the pulse number during with the control Laser Processing;
S103: regulate the defocusing amount parameter, with the pore size of keyhole; In the embodiment of the invention, out of focus is ± 1mm in.
Further, described laser power will be looked the different of material with the setting of single pulse energy metric density and two groups of parameters of Punch time and laser frequency and be set.
Ultra-Violet Laser Punch boring method of the present invention can bore the following hole of system 50 μ m, and this punch penetration rate is exceedingly fast, and can enhance productivity greatly.
Description of drawings
Fig. 1 is the flow process diagram of Ultra-Violet Laser Punch boring method of the present invention.
The specific embodiment
In order to make purpose of the present invention, technical scheme and advantage clearer,, the present invention is further elaborated below in conjunction with drawings and Examples.Should be appreciated that specific embodiment described herein only in order to explanation the present invention, and be not used in qualification the present invention.
Please refer to shown in Figure 1ly, a kind of Ultra-Violet Laser Punch of the present invention boring method comprises the steps:
S10: regulate suitable parameters
Regulate suitable laser power, single pulse energy metric density, frequency and punch time parameter, the effect that allows laser under the punch pattern, on material, process to want (cut wear or half carve).Under the punch pattern, the pulse of computer control laser emitting is by the number of regulating frequency and punch time control impuls.Because the punch pattern is the pulse of single-point shoot laser, for pore size requirement is arranged if add man-hour, then need to regulate the cutting focal position, suitably out of focus processing is aided with and regulates other parameters, thereby can reach the effect of adjustment aperture size.In addition, in order to make laser bore the micropore better effects if, can be flat waveform by the waveform transformation that the beam shaping mirror will initial Gaussian distribution is installed, can reach better effect when making blind hole boring like this.Particularly, described step S10 comprises:
S101: regulate laser power and single pulse energy density parameter, to guarantee the required laser energy of materials processing;
S102: regulate Punch time and laser frequency parameter, the pulse number during with the control Laser Processing;
S103: regulate the defocusing amount parameter, with the pore size of keyhole; In the embodiment of the invention, out of focus is ± 1mm in.
Wherein, laser power will be looked the different of material with the setting of single pulse energy metric density and two groups of parameters of Punch time and laser frequency and be set, being worked into ideal effect gets final product, generally speaking, the thick more material for laser light absorptivity of material is low more, required laser energy is just big more, and umber of pulse is just many more.In addition, require the processing of smooth blind hole, look the demand decision whether the beam shaping mirror is installed, the laser wave deformation of Gaussian distribution is changed to flat waveform, when boring the system blind hole, can reach better effect like this for the bottom.
S11: make file according to processing request, make the punch point at the home position of needs boring; If the circular hole of different size is arranged in the cad figure that the client gives, different figure layers is put in the circular hole classification of different size, again each hole is replaced to a little at circle centre position.
S12: the importing file is processed to Laser Processing software and is got final product.The Laser Processing software that we use is powerlaser, can compatible dxf, and gbr, file formats such as NC to the classified and layered dxf figure of circular hole in the S11 example, only need to import amended dxf figure, difference figure layer is provided with corresponding cutting parameter, processes and get final product.
The above only is preferred embodiment of the present invention, not in order to restriction the present invention, all any modifications of being done within the spirit and principles in the present invention, is equal to and replaces and improvement etc., all should be included within protection scope of the present invention.
Claims (3)
1. a Ultra-Violet Laser Punch boring method is characterized in that, comprises the steps:
S10: regulate suitable parameters;
S11: make file according to processing request, make the punch point at the home position of needs boring;
S12: the importing file is processed to Laser Processing software and is got final product.
2. Ultra-Violet Laser Punch boring method as claimed in claim 1, it is characterized in that: described step S10 comprises:
S101: regulate laser power and single pulse energy density parameter, to guarantee the required laser energy of materials processing;
S102: regulate Punch time and laser frequency parameter, the pulse number during with the control Laser Processing;
S103: regulate the defocusing amount parameter, with the pore size of keyhole; In the embodiment of the invention, out of focus is ± 1mm in.
3. Ultra-Violet Laser Punch boring method as claimed in claim 2 is characterized in that: described laser power will be looked the different of material with the setting of single pulse energy metric density and two groups of parameters of Punch time and laser frequency and be set.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN2012100157653A CN103212816A (en) | 2012-01-19 | 2012-01-19 | Ultraviolet-laser Punch drilling method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012100157653A CN103212816A (en) | 2012-01-19 | 2012-01-19 | Ultraviolet-laser Punch drilling method |
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| CN103212816A true CN103212816A (en) | 2013-07-24 |
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| CN2012100157653A Pending CN103212816A (en) | 2012-01-19 | 2012-01-19 | Ultraviolet-laser Punch drilling method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104384726A (en) * | 2014-09-18 | 2015-03-04 | 北京东明兴业科技有限公司 | Processing method for punching plastic product |
| CN105911960A (en) * | 2016-04-01 | 2016-08-31 | 广州兴森快捷电路科技有限公司 | Laser boring method for packaging substrate |
| CN117047322A (en) * | 2023-09-06 | 2023-11-14 | 上海美维电子有限公司 | Direct cross-layer laser drilling process utilizing UV laser |
Citations (6)
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|---|---|---|---|---|
| US5182434A (en) * | 1989-09-19 | 1993-01-26 | Fanuc Ltd. | Laser beam machining method |
| CN101131470A (en) * | 2007-09-21 | 2008-02-27 | 北京工业大学 | Ultraviolet laser micromachining system and method of aperture for scanning electron microscope |
| CN101168217A (en) * | 2007-11-30 | 2008-04-30 | 上海市激光技术研究所 | Laser array microhole forming device and method |
| CN101480758A (en) * | 2009-01-22 | 2009-07-15 | 华中科技大学 | Technological process of ultraviolet laser cutting flexible printed circuit board |
| CN102015195A (en) * | 2008-03-27 | 2011-04-13 | 伊雷克托科学工业股份有限公司 | Method and apparatus for laser drilling holes with gaussian pulses |
| CN102233484A (en) * | 2009-12-25 | 2011-11-09 | 三星钻石工业股份有限公司 | Processing method for workpiece, method for dividing the same, and laser processing apparatus |
-
2012
- 2012-01-19 CN CN2012100157653A patent/CN103212816A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5182434A (en) * | 1989-09-19 | 1993-01-26 | Fanuc Ltd. | Laser beam machining method |
| EP0445297B1 (en) * | 1989-09-19 | 1995-02-22 | Fanuc Ltd. | Laser machining method |
| CN101131470A (en) * | 2007-09-21 | 2008-02-27 | 北京工业大学 | Ultraviolet laser micromachining system and method of aperture for scanning electron microscope |
| CN101168217A (en) * | 2007-11-30 | 2008-04-30 | 上海市激光技术研究所 | Laser array microhole forming device and method |
| CN102015195A (en) * | 2008-03-27 | 2011-04-13 | 伊雷克托科学工业股份有限公司 | Method and apparatus for laser drilling holes with gaussian pulses |
| CN101480758A (en) * | 2009-01-22 | 2009-07-15 | 华中科技大学 | Technological process of ultraviolet laser cutting flexible printed circuit board |
| CN102233484A (en) * | 2009-12-25 | 2011-11-09 | 三星钻石工业股份有限公司 | Processing method for workpiece, method for dividing the same, and laser processing apparatus |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104384726A (en) * | 2014-09-18 | 2015-03-04 | 北京东明兴业科技有限公司 | Processing method for punching plastic product |
| CN104384726B (en) * | 2014-09-18 | 2016-10-05 | 东明兴业科技股份有限公司 | The processing method of punching on a kind of plastic cement products |
| CN105911960A (en) * | 2016-04-01 | 2016-08-31 | 广州兴森快捷电路科技有限公司 | Laser boring method for packaging substrate |
| CN117047322A (en) * | 2023-09-06 | 2023-11-14 | 上海美维电子有限公司 | Direct cross-layer laser drilling process utilizing UV laser |
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Application publication date: 20130724 |