CN103203955B - A hybrid production process for a step stencil - Google Patents
A hybrid production process for a step stencil Download PDFInfo
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- CN103203955B CN103203955B CN201210010729.8A CN201210010729A CN103203955B CN 103203955 B CN103203955 B CN 103203955B CN 201210010729 A CN201210010729 A CN 201210010729A CN 103203955 B CN103203955 B CN 103203955B
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- 238000004519 manufacturing process Methods 0.000 title abstract description 9
- 238000005323 electroforming Methods 0.000 claims abstract description 69
- 238000007639 printing Methods 0.000 claims abstract description 48
- 238000000034 method Methods 0.000 claims abstract description 34
- 238000005530 etching Methods 0.000 claims abstract description 25
- 238000011161 development Methods 0.000 claims abstract description 23
- 238000005554 pickling Methods 0.000 claims abstract description 21
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 238000002203 pretreatment Methods 0.000 claims abstract description 15
- 238000005488 sandblasting Methods 0.000 claims abstract description 10
- 238000005516 engineering process Methods 0.000 claims description 23
- 238000009415 formwork Methods 0.000 claims description 17
- 238000002156 mixing Methods 0.000 claims description 16
- 238000012545 processing Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 229910000831 Steel Inorganic materials 0.000 claims description 8
- 239000010959 steel Substances 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 7
- 239000002390 adhesive tape Substances 0.000 claims description 6
- 230000008021 deposition Effects 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 5
- 238000004140 cleaning Methods 0.000 claims description 4
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 238000003384 imaging method Methods 0.000 claims description 3
- 239000012528 membrane Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- 238000005266 casting Methods 0.000 claims 2
- 230000004913 activation Effects 0.000 claims 1
- 238000006243 chemical reaction Methods 0.000 claims 1
- 238000005238 degreasing Methods 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 27
- 230000018109 developmental process Effects 0.000 description 15
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 238000005422 blasting Methods 0.000 description 4
- 239000006071 cream Substances 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000027648 face development Effects 0.000 description 2
- 230000000116 mitigating effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000011814 protection agent Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
A hybrid production process for a step stencil. Specifically, The process flow is as follows: electroforming a first electroformed layer: core mold treatment->pre-treatment (degreasing, pickling and sandblasting)->film mounting 1->exposure 1->single sided development 1-> electroforming 1->stripping; electroforming up steps on a printing surface: pre-treatment (pickling and sandblasting)->double sided film mounting->double sided exposure->double sided development->electroforming 2->stripping; and etching down steps on a PCB surface: PCB surface etching->film stripping->follow-up treatment (degreasing and pickling). By employing the process, a metal stencil having the PCB surface with down steps and the printing surface with up steps can be produced. The pattern areas of the metal stencil have openings with good quality, smooth hole walls, and no undesirable phenomena of blurs, jags, etc.; the position precision of the opening pattern area is high; and the thickness uniformity of the stencil is good, uniformity COV being less than 10%.
Description
Technical field
The present invention relates to a kind of mixing processing technology of stepped formwork, belong to material manufacture and manufacture field and in particular to
In PCB manufacture field, a kind of printing surface has raised step, and PCB surface has the making work of the mask used for printing plate of recess step
Skill.
Background technology
Pursue miniaturization with electronic product, the piercing insert element using in the past cannot reduce；Electronic product function
More complete, the integrated circuit being adopted（IC）Cannot punctured element, particularly on a large scale, highly integrated IC is it has to adopt table
Face surface mount elements, therefore stencil print process have obtained rapid development in electronics manufacturing, and SMT printing is exactly typical case.Template
Buying be not only the first step of SMT assembly technology, be also a most important step.The major function of template is to aid in the heavy of tin cream
Amass it is therefore an objective to the material of accurate quantity is transferred to accurate position on tabula rasa.Tin cream is blocked in fewer in template, is deposited on electricity
More on the plate of road.It is more smooth better therefore the port quality of template to be required.But, for some special pcb boards, such as
Have some privileged sites to need the amount of tin cream more than other positions on pcb board or few it is therefore necessary to must be to corresponding templates
Position carries out up or down process, and in general, up region needs to make figure, and down region does not need to make figure.
Electrotyping forming, a kind of technique being incremented by rather than successively decreasing, produce a metal form, the sealing with uniqueness is special
Property, reduce the needs to Xi Qiao and template bottom surface cleaning.This technique provides the positioning of almost Perfect, does not have the limit of geometry
System, has inherent trapezoidal smooth hole wall and low surface tension, improves tin cream release.By the substrate in a perforate to be formed
（Or core）Upper lithographic glue, then one by one atom, around photoresist, electroforming goes out template layer by layer.
For the making of step step, what the cycle was the fastest surely belongs to etch process, the making of the Stainless Molding Board of chemical etching
It is by applying anticorrosion protection agent on metal foil, on metal forming two sides and then being made graph exposure with pin location sense optical tool
Corrode metal forming with double-side technology from two sides simultaneously.
For the technology that local thickeies, what it focused on up step graphics field is opened on substrate graphics field
Aperture position precision will height, big in combination with power, otherwise the life-span will substantially reduce.
Printing stencil is used to the mould of print solder paste, typically adopts steel mesh at present.And traditional handicraft passes through cut
The punching block opening size quality of fabrication techniques can not reach requirement, and board surface quality is also not good.
Therefore, how more preferably, quickly produce printing surface there is up step, PCB surface has the metal pattern of down step
Plate is significant.
Content of the invention
Present invention seek to address that above technical problem, invent a kind of mixing processing technology of stepped formwork.Using this making
The metal form that technique is made, printing surface has raised step（up step）, PCB surface has recess step（down
step）, and the figure opening in up step region has higher aligning accuracy with base openings.
A kind of mixing manufacture method of stepped formwork.Its technological process is as follows：
Electroforming first electroformed layer：Core process → pre-treatment（Oil removing, pickling, sandblasting）→ pad pasting 1 → exposure, 1 → one side shows
Shadow 1 → electroforming 1 → stripping；
Electroforming printing surface raised step（up step）：Pre-treatment（Pickling, sandblasting）→ two-sided pad pasting → double-sided exposure → bis-
Face development → electroforming 2 → stripping；
Etching PCB surface recess step（down step）：PCB surface etches → takes off film → subsequent treatment（Oil removing, pickling）.
Specifically, the concrete technology flow process of each step is：
Electroforming first electroformed layer：
（1）Core is processed：Select 0.3mm rustless steel as core, and substrate is cut into required size.
（2）Pre-treatment：The sheet metal cutting is carried out oil removing, after pickling, two sides blasting treatment, improve rough surface
Degree, thus improve the adhesion of dry film and sheet metal during pad pasting.
（3）Pad pasting 1：Select the high dry film of adhesive force, during preventing electroforming, fall film phenomenon.After choosing dry film,
Carry out pad pasting in mandrel surface.
（4）Exposure 1：Institute's patch dry film is exposed, exposure area is opening figure region, exposure dry film is as electroforming
Protective layer in journey, stops material deposition.
（5）Surface development 1：Unexposed dry film is removed by two-sided developing process, carries out development and check it is desirable to no after development
Fall film, rub not most etc. phenomenon of film, development.
（6）Electroforming 1：Electroforming material is deposited on no dry film region, clones the opening figure consistent with exposure figure.
（7）Peel off：After the completion of electroforming, electroformed layer is stripped down from core.
Electroforming printing surface raised step（up step）：
（1）Pre-treatment：Template is carried out pickling, two sides blasting treatment, improves surface roughness, thus improving dry during pad pasting
Film and the adhesion of sheet metal.
（1）Two-sided pad pasting：Two-sided pad pasting, because the up step region area of wanted electroforming is less, in printing pad pasting
Shi Chongfu press mold it is ensured that dry film is close to the first electroformed layer, that is, guarantees that up step region is not easily disconnected from.
（2）Double-sided exposure：By the lateral opening para-position of CCD, the opening figure of accurate contraposition up step regional location and up step
Shape region；Then the opening figure in the region beyond wanted for printing surface electroforming up step and up step region is exposed, by institute
Etch the regional exposure beyond PCB surface down step.
（3）Two-sided development：Development removes unexposed dry film it would be desirable to deposit the region of electroforming material（Up step region）
And need the region of etching（Down step region）Come out.
（4）Electroforming 2：The electroformed layer having developed adhesive tape is fixed on core substrate, and printing faces outwardly, and carries out secondary
Electroforming, in unexposed area（I.e. no dry film region）Deposition electroforming material, forms the up step of printing surface..
Because up step region area is less, during electroforming, electric current density line is concentrated, and can cause electroforming up step region
Edge effect is serious, so the ready shunting careful para-position of auxiliary template on the first electroformed layer, being careful not to scratch figure
Shape and electroformed layer, the first electroformed layer, one piece of flow distribution plate are fixed on winged bar, immerse electrotyping bath, control electroforming up step thick
Degree.
Described flow distribution plate, cuts out one by the method for cut on the corrosion resistant plate equivalently-sized with core
Identical with up step regional location, size identical through hole, plays share current, the effect of mitigation edge effect.
（5）Peel off：After the completion of secondary electroforming, electroformed layer is stripped down from core.
Etching PCB surface recess step（down step）：
（1）PCB surface etches：After the printing surface being ready for up step region being sealed with adhesive tape, cast layer is sent into horizontal
In etching machine, by way of spray, etching solution is sprayed PCB surface, produce chemistry in the substrate surface no exposing dry film anti-
Should, etch away one layer of steel disc, thus recess step region is defined on PCB surface, as shown in Fig. 34.
（2）Take off film：After the completion of etching, take off Membrane cleaning.
（3）Subsequent treatment：By template oil removing, pickling.
Specifically, the specific process parameter scope of each step is as follows：
Pre-treating technology parameter is as follows：
| The oil removing time | 1～2min |
| Pickling time | 1～2min |
| Blast time 1 | 2～3min |
| Blast time 2 | 5～10min |
| Pressure（pis） | 1～5 |
Exposure imaging technological parameter is as follows：
The technological parameter of electroforming is as follows：
Etch process parameters are as follows：
| Etching solution proportion | 1.30～1.50 |
| Fe3+Concentration（g/L） | 100～300 |
| pH | 1.4～1.8 |
| Temperature（℃） | 50～60 |
| Pressure（pis） | 10～20 |
| Etching speed | 8～20Hz |
The mixing processing technology of the stepped formwork of invention, compared with conventional laser cutting parameter, has following obvious
Improve：
（1）Printing surface can be made there is raised step（up step）And there is opening figure, PCB surface has depression platform
Rank（down step）Metal form；
（2）Template opening quality is good, and hole wall is smooth, impulse- free robustness；
（3）Raised step（up step）Figure open area is high with the positional precision of the opening of the first electroformed layer；
（4）Template thickness uniformity is good, uniformity COV within 10%,
（5）Raised step（up step）Region is big with the adhesion of the first electroformed layer, difficult for drop-off；
（6）Plate face one-level light.
Brief description
The above-mentioned and/or additional aspect of the present invention and advantage will become from reference to the description to embodiment for the accompanying drawings below
Substantially and easy to understand.
Fig. 1 .PCB face down region sectional view
1-PCB substrate
2- template
3- welds base station
4- plane opening
Elevated regions on 5-PCB plate
6-PCB face down region
7- printing surface
8-PCB face
Fig. 2. the opening sectional view in printing surface up region
1-PCB substrate
2- template
3a- welds base station
3b- welds base station
4- plane opening
5- printing surface up region
The opening in 6- printing surface up region
7- printing surface
8-PCB face
Fig. 3. template PCB surface down schematic diagram
1- template
2- stencil plane opening
3- template PCB surface down region
4- template PCB surface
Fig. 4. mould printing face up schematic diagram
1- template
2- stencil plane opening
3- mould printing face up region
4- mould printing face up region openings
5- mould printing face
Specific embodiment
Embodiments of the invention are described below in detail, the example of described embodiment is shown in the drawings, wherein from start to finish
The element that same or similar label represents same or similar element or has same or like function.Below with reference to attached
The embodiment of figure description is exemplary, is only used for explaining the present invention, and is not considered as limiting the invention.
During Noticed Problems in technological process in the specific technological process of this religious name and the present invention will be described below
More detailed.
A kind of mixing manufacture method of stepped formwork.Its technological process is as follows：
Electroforming first electroformed layer：Core process → pre-treatment（Oil removing, pickling, sandblasting）→ pad pasting 1 → exposure, 1 → one side shows
Shadow 1 → electroforming 1 → stripping；
Electroforming printing surface raised step（up step）：Pre-treatment（Pickling, sandblasting）→ two-sided pad pasting → double-sided exposure → bis-
Face development → electroforming 2 → stripping；
Etching PCB surface recess step（down step）：PCB surface etches → takes off film → subsequent treatment（Oil removing, pickling）.
Specifically, the concrete technology flow process of each step is：
Electroforming first electroformed layer：
（1）Core is processed：Select 0.3mm rustless steel as core, and substrate is cut into required size.
（2）Pre-treatment：The sheet metal cutting is carried out oil removing, after pickling, two sides blasting treatment, improve rough surface
Degree, thus improve the adhesion of dry film and sheet metal during pad pasting.
（3）Pad pasting 1：Select the high dry film of adhesive force, during preventing electroforming, fall film phenomenon.After choosing dry film,
Carry out pad pasting in mandrel surface.
（4）Exposure 1：Institute's patch dry film is exposed, exposure area is opening figure region, exposure dry film is as electroforming
Protective layer in journey, stops material deposition.
（5）Surface development 1：Unexposed dry film is removed by two-sided developing process, carries out development and check it is desirable to no after development
Fall film, rub not most etc. phenomenon of film, development.
（6）Electroforming 1：Electroforming material is deposited on no dry film region, clones the opening figure consistent with exposure figure.
（7）Peel off：After the completion of electroforming, electroformed layer is stripped down from core.
Electroforming printing surface raised step（up step）：
（1）Pre-treatment：Template is carried out pickling, two sides blasting treatment, improves surface roughness, thus improving dry during pad pasting
Film and the adhesion of sheet metal.
（1）Two-sided pad pasting：Two-sided pad pasting, because the up step region area of wanted electroforming is less, in printing pad pasting
Shi Chongfu press mold it is ensured that dry film is close to the first electroformed layer, that is, guarantees that up step region is not easily disconnected from.
（2）Double-sided exposure：By the lateral opening para-position of CCD, the opening figure of accurate contraposition up step regional location and up step
Shape region；Then the opening figure in the region beyond wanted for printing surface electroforming up step and up step region is exposed, by institute
Etch the regional exposure beyond PCB surface down step.
（3）Two-sided development：Development removes unexposed dry film it would be desirable to deposit the region of electroforming material（Up step region）
And need the region of etching（Down step region）Come out.
（4）Electroforming 2：The electroformed layer having developed adhesive tape is fixed on core substrate, and printing faces outwardly, and carries out secondary
Electroforming, in unexposed area（I.e. no dry film region）Deposition electroforming material, forms the up step of printing surface..
Because up step region area is less, during electroforming, electric current density line is concentrated, and can cause electroforming up step region
Edge effect is serious, so the ready shunting careful para-position of auxiliary template on the first electroformed layer, being careful not to scratch figure
Shape and electroformed layer, the first electroformed layer, one piece of flow distribution plate are fixed on winged bar, immerse electrotyping bath, control electroforming up step thick
Degree.
Described flow distribution plate, cuts out one by the method for cut on the corrosion resistant plate equivalently-sized with core
Identical with up step regional location, size identical through hole, plays share current, the effect of mitigation edge effect.
（5）Peel off：After the completion of secondary electroforming, electroformed layer is stripped down from core.
During electroforming, by pre-treatment increase blast time, increase before electroforming the modes such as soak time improve two coating it
Between adhesion, prevent coating from coming off, by test ready-made anode baffle come control electric current density line, be allowed in graphics field
In the range of the first electroformed layer deposit thickness uniformity COV within 10%；Coating matter is ensured by the amount adjusting electroforming additive
Amount, as bright in coating, pin-free, pit；By controlling development point, no hair good to reach coating opening hole wall quality during development
Thorn, plating.
Etching PCB surface recess step（down step）：
（1）PCB surface etches：After the printing surface being ready for up step region being sealed with adhesive tape, cast layer is sent into horizontal
In etching machine, by way of spray, etching solution is sprayed PCB surface, produce chemistry in the substrate surface no exposing dry film anti-
Should, etch away one layer of steel disc, thus recess step region is defined on PCB surface, as shown in Fig. 34.
（2）Take off film：After the completion of etching, take off Membrane cleaning.
（3）Subsequent treatment：By template oil removing, pickling.
Thus produce stepped formwork as shown in Figure 3,4, and the printing process of this kind of printing stencil such as Fig. 1,2 institutes
Show, the recess step of PCB surface, it primarily serves the purpose of avoids pcb board elevated regions, it is to avoid printing process template deformation, in such as 1
6 shown in, and the raised step of printing surface, it primarily serves the purpose of the lower stannum amount increasing printing on the welding copper platform on pcb board,
For the welding of big element, as shown in 26.
One group of preferred technological parameter is as follows：
Pre-treating technology parameter：
| The oil removing time | 2min |
| Pickling time | 2min |
| Blast time 1 | 3min |
| Blast time 2 | 6min |
| Pressure（pis） | 3 |
Exposure imaging technological parameter is as follows：
The technological parameter of electroforming is as follows：
Etch process parameters are as follows：
| Etching solution proportion | 1.4 |
| Fe3+Concentration（g/L） | 150 |
| pH | 1.6 |
| Temperature（℃） | 55 |
| Pressure（pis） | 15 |
| Etching speed | 14Hz |
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that：Not
Multiple changes, modification, replacement and modification can be carried out to these embodiments in the case of the principle of the disengaging present invention and objective, this
The scope of invention is limited by claim and its equivalent.
Claims (10)
1. the mixing processing technology of a kind of stepped formwork, its technological process is as follows：
Electroforming first electroformed layer：1 → exposure, 1 → surface development, 1 → electroforming, the 1 → stripping of core process → pre-treatment → pad pasting；
Electroforming printing surface raised step：Pre-treatment → two-sided pad pasting → double-sided exposure → two-sided development → electroforming 2 → stripping；
Etching PCB surface recess step：PCB surface etches → takes off film → subsequent treatment；
Wherein, electroforming first electroformed layer：It is to select rustless steel as core that core is processed, and substrate is cut into required size；
Pre-treatment is the steel disc cutting to be carried out oil removing, pickling and sandblasting 1 process；Pad pasting 1 is the dry film selecting adhesive force high, in core
Mould surface carries out pad pasting；Exposure 1 is that institute's patch dry film is exposed, and exposure area is opening figure region；Surface development 1 is not
Exposure dry film is removed by two-sided developing process, carry out after development development check it is desirable to no fall film, rub film, develop do not show completely as；
Electroforming 1 is that electroforming material is deposited on no dry film region, clones the opening figure consistent with exposure figure；Stripping is electric for the first time
After the completion of casting, electroformed layer is stripped down from core；
Electroforming printing surface raised step：Pre-treatment is that the first electroformed layer is carried out pickling, and two sides sandblasting 2 is processed；Two-sided pad pasting is
Because the raised step region area of wanted electroforming is less, repeat press mold when printing pad pasting it is ensured that dry film is close to first
Electroformed layer, that is, guarantee that raised step region is not easily disconnected from；Double-sided exposure is by the lateral opening para-position of CCD, accurate contraposition raised step
Regional location and raised step opening figure region, then by the region beyond wanted for printing surface electroforming raised step and convex
Play the opening figure exposure of stepped area, will will etch the regional exposure beyond PCB surface recess step；Two-sided development is development
Remove unexposed dry film it would be desirable to come out in the region of the region of deposition electroforming material and needs etching；Electroforming 2 is to develop
Good electroformed layer adhesive tape is fixed on core substrate, and printing faces outwardly, and carries out secondary electroforming, in unexposed area area deposition electricity
Casting material, forms the raised step of printing surface；After the completion of stripping is secondary electroforming, electroformed layer is stripped down from core；
Etching PCB surface recess step：PCB surface etching be with adhesive tape, the printing surface being ready for raised step region is sealed after,
Cast layer is sent in horizontal etching machine, by way of spray, etching solution is sprayed PCB surface, no exposing the substrate table of dry film
Face produces chemical reaction, etches away one layer of steel disc, thus defines recess step region in PCB surface；Taking off film is to have etched
Cheng Hou, takes off Membrane cleaning；Subsequent treatment is by template oil removing, pickling.
2. the mixing processing technology of stepped formwork according to claim 1 is it is characterised in that the metal form for preparing
Printing surface there is raised step region, PCB surface has recess step region.
3. the mixing processing technology of stepped formwork according to claim 1 is it is characterised in that the metal form for preparing
There is opening figure, and opening figure is distributed in raised step regional peace face region, recess step region imperforation figure.
4. stepped formwork according to claim 1 mixing processing technology it is characterised in that PCB surface be printing when, step
The one side that template is contacted with PCB substrate.
5. stepped formwork according to claim 1 mixing processing technology it is characterised in that printing surface be printing when, platform
Order mode plate and the one side of scraper into contact.
6. stepped formwork according to claim 1 mixing processing technology it is characterised in that pre-treating technology parameter such as
Under：
.
7. stepped formwork according to claim 1 mixing processing technology it is characterised in that exposure imaging technological parameter such as
Under：
.
8. the mixing processing technology of stepped formwork according to claim 1 is it is characterised in that have activation work before electroforming
Skill, the technological parameter of electroforming is as follows：
.
9. the mixing processing technology of stepped formwork according to claim 1 is it is characterised in that etch process parameters are as follows：
.
10. stepped formwork according to claim 1 mixing processing technology it is characterised in that it is characterized in that, second
Electroforming process adopts flow distribution plate to reduce electric current density, mitigates the edge effect in raised step region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010729.8A CN103203955B (en) | 2012-01-16 | 2012-01-16 | A hybrid production process for a step stencil |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210010729.8A CN103203955B (en) | 2012-01-16 | 2012-01-16 | A hybrid production process for a step stencil |
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| Publication Number | Publication Date |
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| CN103203955A CN103203955A (en) | 2013-07-17 |
| CN103203955B true CN103203955B (en) | 2017-02-08 |
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| CN201210010729.8A Expired - Fee Related CN103203955B (en) | 2012-01-16 | 2012-01-16 | A hybrid production process for a step stencil |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103572206B (en) * | 2013-11-08 | 2019-01-15 | 昆山允升吉光电科技有限公司 | A kind of production method of compound mask plate component |
| CN104191855B (en) * | 2014-08-22 | 2016-07-13 | 桐城运城制版有限公司 | A kind of SMT printing stencil |
| CN112606544B (en) * | 2020-11-19 | 2023-05-12 | 浙江硕克科技有限公司 | Metal plate and processing technology thereof |
| CN113276536B (en) * | 2021-05-14 | 2022-05-27 | 常州天禄显示科技有限公司 | Microstructure hole metal printing template and manufacturing method thereof |
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| CN102094221A (en) * | 2010-12-20 | 2011-06-15 | 昆山美微电子科技有限公司 | Method for preparing SMT (surface mount technology) nickel-phosphorus alloy plate by dry-film wet process |
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| JP2001105563A (en) * | 1999-10-07 | 2001-04-17 | Hitachi Ltd | Screen plate and method of manufacturing wiring board using the same |
| JP4720002B2 (en) * | 2001-04-12 | 2011-07-13 | 株式会社村田製作所 | Screen printing plate and manufacturing method thereof |
| JP4341250B2 (en) * | 2003-01-22 | 2009-10-07 | 株式会社村田製作所 | Screen printing plate and manufacturing method thereof |
| JP4808954B2 (en) * | 2004-12-06 | 2011-11-02 | 九州日立マクセル株式会社 | Manufacturing method of printing metal mask plate and printing metal mask plate |
| KR20120000717A (en) * | 2010-06-28 | 2012-01-04 | 삼성전기주식회사 | Screen printing mask and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102094221A (en) * | 2010-12-20 | 2011-06-15 | 昆山美微电子科技有限公司 | Method for preparing SMT (surface mount technology) nickel-phosphorus alloy plate by dry-film wet process |
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