CN103203685A

CN103203685A - Polishing apparatus and method with direct load platen background

Info

Publication number: CN103203685A
Application number: CN201310076001XA
Authority: CN
Inventors: 陈宏清
Original assignee: Applied Materials Inc
Current assignee: Applied Materials Inc
Priority date: 2005-09-30
Filing date: 2006-09-21
Publication date: 2013-07-17
Also published as: WO2007041020A1; CN101277787A; US20070077861A1; US7198548B1; JP2009509782A; CN101277787B; JP5225089B2

Abstract

The present invention provides a method and equipment for chemical mechanical polishing, which includes a platen supporting a polishing object, a manipulator located near the platen, a carrier head with a retaining ring, and a carrier head supporting mechanism. The manipulator is configured to position the substrate on the polishing article, and the carrier head support mechanism is configured to move the carrier head into a position where the retaining ring surrounds the substrate.

Description

Polissoir and method with direct load platen

The application is that application number is 200680036363.4, the applying date is on September 21st, 2006, and denomination of invention is divided an application for the application for a patent for invention of " polissoir and method with direct load platen ".

Technical field

The present invention relates to chemical-mechanical polisher and method.

Background technology

Usually by sequentially deposited conductor layer, semiconductor layer or insulating barrier form integrated circuit at substrate on silicon wafer.A kind of manufacturing step is included in and deposits filler layer on the non-planar surfaces, and filler layer is carried out complanation up to exposing non-planar surfaces.For example, can be on insulation layer patterned the deposited conductor filler fill groove or hole in the insulating barrier.Then filler layer is polished, up to the insulating barrier that exposes projection.After complanation, the conductor layer that keeps between the raised design of insulating barrier has partly formed via hole, plug and lead, and they provide conductive path between the thin film circuit on the substrate.In addition, also need complanation to be used in the substrate surface planeization of photoetching.

The chemically mechanical polishing of being undertaken by polishing machine (CMP) is a kind of method of planarizing commonly used.Traditional polishing machine comprises pedestal, and pedestal has several polishing blocks and has load port.Load port is exclusively used in the position that provides accurate usually, is used for being blocked by carrier or rubbing head.After load port blocks substrate, polishing machine can move to substrate one or more polishing blocks to handle.In planarization, the exposed surface of substrate is placed by the polished surface against polishing pad, and described polishing pad for example rotates the band of polishing disk or straight ahead.Carrier head provides controlled load to substrate, promotes it against polishing pad.Polishing fluid can comprise abrasive grains, and is provided to the surface of polishing pad, and the relative motion between substrate and the polishing pad realizes complanation and polishing.

Traditional polishing pad comprises " standard " pad and fixed abrasive pad.Common standard pad has the polyurethane polishing layer with durable rough surface, can also comprise compressible backing layer.By contrast, fixed abrasive pad has and remains on the abrasive grains that holds in the medium, and can be supported on substantially on incompressible backing layer.

Generally speaking, form that the process of integrated circuit may be surprising expensive and more and more expensive.A principal element of expense is traditional required size of semiconductor manufacturing facility, and described equipment also comprises a large amount of handling machines except polishing machine.Each machine consumes certain floor area, is called " taking up an area of (footprint) area ".Particularly, the load port of polishing machine may consume nearly 1/4th of polishing machine floor space.Another principal element of expense is a large amount of required total times of step in handling.Processing time affects productivity ratio or output.In addition, many steps also need to transmit (handoff), and this transmission may make substrate go out of use because of destruction.

Summary of the invention

The description that the present invention is total be used for system, method, computer program and the device of chemical polishing appts.Generally speaking, chemical polishing appts can directly load (and unloading) substrate on polishing article or platen, can block substrate from described polishing article or platen by rubbing head.

In one aspect, the present invention is directed to a kind of chemical-mechanical polisher.This equipment comprises rotating disk, a N platen and the manipulator that has N rubbing head.N rubbing head located on equal angles ground substantially around the rotation of rotating disk.N platen respectively is configured to supporting polishing article, and N platen located on equal angles ground substantially around the rotation of rotating disk, each rubbing head can be become substrate orientation with the polishing article at relevant platen place contact.N platen comprises load platen, and manipulator is positioned near the load platen place and is configured to substrate orientation on the polishing article at load platen place, to be loaded into from the rubbing head in N the rubbing head.

Embodiments of the present invention can comprise following one or multinomial.N rubbing head can be rotatable.Manipulator only can be configured to also can be arranged in from one of a plurality of platens in N the platen and to locate position substrate in load platen place position substrate.Manipulator can be arranged to fetch substrate from load platen, also can be arranged to fetch substrate from the platen that is different from load platen.Another manipulator can be arranged on and second platen that is different from load platen approaches the place, and can be provided in the second platen place with substrate orientation on polishing article, to be loaded in another rubbing head from N rubbing head.First alignment sensor can be notified to manipulator: substrate has arrived along first desired locations of first dimension relevant with load platen.Second alignment sensor can be notified to manipulator: substrate has arrived along second desired locations of second dimension relevant with load platen.First alignment sensor can be coupled to manipulator, perhaps be coupled in rotating disk or the carrier head one or the two on.Controller can be communicated by letter with manipulator with first alignment sensor, and controller can be configured to from the first alignment sensor receiving feedback signals in response to the position, and send the position signalling that robot movement is instructed in response and to the manipulator street rowdy.This device can comprise the device of substrate location being regulated for before blocking after substrate is unclamped by manipulator but by one of N rubbing head.Retaining ring in the carrier head can be configured to from first diameter adjustment to second diameter less than first diameter.But adjustable ring can be configured to by unloading substrate from second diameter adjustment to first diameter.Load platen can comprise one group of alignment pin, with by substrate being reorientated more accurately position substrate.Alignment pin can be in the regracting platen.Spacing between the inner surface of alignment pin can be to provide bigger size at the top of alignment pin than the bottom.Load platen can be to can be rotated to " loaded " position to visit intrusively not to be subjected to carrier head, and can be to can be rotated to stuck position to be visited by carrier head.A rotating disk and N platen can be coupled to separately for the pedestal that supports.

In yet another aspect, the present invention is directed to a kind of chemical-mechanical polisher, this equipment comprises: rubbing head; Platen is arranged to support polishing article; Manipulator is positioned near the platen place and is arranged to substrate orientation on polishing article; And governor motion, be repositioned onto the second place in primary importance place bonded substrate and with substrate.The second place is blocked from load platen in the position range of substrate at rubbing head, and primary importance comprises extraneous position.

Embodiments of the present invention can comprise in the following characteristics one or multinomial.Governor motion can comprise retaining ring, and retaining ring is configured to from first diameter adjustment to second diameter less than first diameter.Governor motion comprises one group of alignment pin that is retractable in the platen.Platen can be to can be rotated to " loaded " position to conduct interviews not to be subjected to carrier head with hindering, and load platen can be to can be rotated to " loaded " position to be visited by carrier head.

In yet another aspect, the present invention is directed to a kind of chemical-mechanical polisher, this equipment comprises: platen, support polishing article; Manipulator is positioned near the platen place and is arranged to substrate orientation on polishing article; Carrier head has retaining ring; And the carrier head supporting mechanism, be arranged to carrier head moved to and make retaining ring center on the position of substrate.

In yet another aspect, the present invention is directed to and a kind of polishing system is carried out method of operating.This method comprises: with manipulator substrate is placed on the polished surface; Make at least a portion of carrier head be in " loaded " position, make the retaining ring of carrier head center on substrate; And cause relative motion between carrier head and the polished surface with polished substrate.

Embodiments of the present invention can comprise in the following characteristics one or multinomial.Substrate can be placed on the polished surface at the primary importance place, and substrate can be moved to " loaded " position from primary importance.Mobile substrate can comprise: the inner surface diameter to retaining ring is regulated, and edges of substrate is contacted with alignment pin, or platen is moved.Can block substrate with carrier head, carrier head can be with substrate to move to another polished surface, can be polished substrate by described another polished surface.

Embodiments of the present invention can comprise one or more in the following advantage.Under the situation that does not need the special-purpose loading port, equipment can take up an area of littler in maker.In addition, by eliminate transmitting, this equipment can have higher productivity ratio, and the loss that causes because of machine breakdown is littler.Thus, the expense that this equipment can make with semiconductor manufacturing facility produces relevantly reduces.

Set forth the details of one or more embodiment of the present invention in accompanying drawing and the following explanation.According to these explanations and accompanying drawing, and according to claim, can understand other features of the present invention, purpose and advantage.

Description of drawings

The schematic plan of Fig. 1 illustrates a kind of embodiment of the system that substrate is handled.

The schematic cross-sectional side view of Fig. 2 illustrates the polishing block in the system of Fig. 1.

The schematic side elevation of Fig. 3 A-3C illustrates substrate is loaded into processing in the polishing block.

The schematic illustration of Fig. 4 another embodiment of system that substrate is handled.

The schematic illustration of Fig. 5 another embodiment of system that substrate is handled.

The schematic side elevation of Fig. 6 A-6B and vertical view illustrate substrate directly are loaded into wet robot in the polishing machine of Fig. 1.

The schematic illustration of Fig. 7 first embodiment of the detent mechanism relevant with direct loading.

The schematic side elevation of Fig. 8 A-8B and vertical view illustrate second embodiment of the detent mechanism relevant with direct loading.

The schematic cross sectional views of Fig. 9 A-9B illustrates the 3rd embodiment of the detent mechanism relevant with direct loading.

Fig. 9 C is the schematic side elevation of alignment pin in the detent mechanism of Fig. 9 A-9B.

The schematic illustration of Figure 10 A-B the 4th embodiment of the detent mechanism relevant with direct loading.

Reference number identical in each accompanying drawing identifies similar element.

The specific embodiment

The schematic illustration of Fig. 1 in the semiconductor manufacturing facility substrate is handled the system 20 of (for example complanation).Lining treatment system 20 comprises chemical-mechanical polisher (" polishing machine ") 22, wet method (wet) manipulator (" manipulator ") 24, cleaner 26, factory interface module 28 and controller 32.System 20 can comprise optional element, for example metering device or particle monitoring system.Substrate 10 for example can be other objects of handling in silicon wafer (for example be used for forming integrated circuit) or the system 20.Usually, substrate 10 is sent to system 20 under the help of manipulator 24, in order to carry out complanation or polishing by polishing machine 22, and is cleaned by cleaner 26.Fig. 1 illustrates a kind of example system 20 of the specific embodiment, because polishing machine 22 can be implemented in other system and come the 20 exchange substrates 10 with system by additive method.

In one embodiment, factory interface module 28 can be rectangular shape.Several brilliant box gripper shoes 110 (for example four) are projected into the clean room to accept brilliant box 12 from factory interface module 28.Brilliant box 12 is used for protecting substrate around semiconductor manufacturing facility and in the transmission course in the system 10.A plurality of brilliant box port ones 12 allow substrate 10 is transmitted turnover factory interface module 28 from brilliant box 12.

Factory interface robot 130 can be located on the track 142, and track 142 extends in factory interface module 28 internal linear.Factory interface robot 130 can be advanced with mobile substrate between each processing (for example polishing or cleaning) along track 142.Specifically, factory interface robot 130 can move to the stand part 176 of accepting port 120 with substrate 10 from brilliant box port one 12.In addition, factory interface robot 130 can move back to brilliant box port one 12 from the cleaner 26 of accepting port 122 with substrate 10.

Manipulator 24 is located between stand part 176 and the polishing machine 22.In one embodiment, manipulator 24 is coupled to polishing machine 22, for example is supported on the pedestal of polishing machine 22.In another embodiment, manipulator 24 can be independent equipment.Manipulator 24 transmits substrate 10 between stand part and polishing machine 22.In stand part 176, but substrate 10 can be received by manipulator 24 (indexable) buffering area 182 from index.Manipulator 24 comprises substrate gripper (for example blade 141), and described substrate gripper can be moved in platen 54 upper horizontal.

Polishing machine 22 comprises polishing block (four platform 50a-50d for example, but the platform of other numbers also can be arranged) and the rotating disk (carousel) 60 that is supported on the polishing block top.Polishing block 50a-50d can arrange with the cardinal principle angle same around the rotation 57 of rotating disk 60, and leave the distance that described axis 57 equates substantially.

As shown in Figure 2, polishing block 50a-50d respectively comprises the platen 54 that is supported by common base 58.Each polishing block can also comprise for example rinsing table, pad conditioner (pad conditioner) etc. alternatively.

Each platen is supporting polishing article 56.Polishing article 56 can be for example standard pad, fixed abrasive pad or polishing pad.Perhaps, one or more polishing blocks can use thin plate rather than the circular polishing pad that continuous band or incremental are advanced.Platen 54 can be circular, can install and by Motor Drive in rotatable mode.At work, platen 54 rotation produces relative motion between substrate and polished surface, and makes the smooth surface of substrate 10 with slurries (slurry).

See figures.1.and.2, in one embodiment, rotating disk 60 is cross and has carrier head 62 (for example four) that carrier head 62 is separated (not shown carrier head is in order to clearly show that polishing article among Fig. 1) around the rotation 57 of rotating disk with cardinal principle angle same interval (for example 90 degree at interval).The distance that has kept the position of the supporting track 64 of carrier head 62 also can equate substantially from axis 57, each carrier head 62 can be moved independently along supporting track 64, thereby radially point-blank toward or away from axis 57 motions.In the embodiment shown, the number of the carrier head 62 on the rotating disk 60 (for example N carrier head 62) equals the number of polishing block 50 (for example N polishing block 50).Carrier head 62 is for example blocked by vacuum or is come fastening substrate 10 by retaining ring (retaining ring).Rotating disk 60 rotates around axis 57, thereby transmits the carrier head 62 that has substrate 10 between each polishing block 50.Each carrier head 62 can be vertical movable, perhaps comprises the bottom that can move both vertically, and handles thereby the substrate 10 that blocks can be reduced to polishing block 50.In addition, each carrier head can also be for example to drive independently rotary by motor 66.

In one embodiment, cleaner 26 is rectangular-shaped cabinet.But perforating branch support member 180 can be taken substrate 10 away from index buffering area 182.Generally speaking, cleaner 26 cleans substrate 10 after complanation, to remove unnecessary fragment.

For substrate is loaded in the polishing machine, manipulator 24 can be set and controller 32 is programmed, manipulator 24 directly is placed on the polished surface of polishing article on the platen of polishing block from stand part 176 transmission substrates 10 and with it.Similarly, for from polishing machine unloading substrate, manipulator 24 can be set and controller 32 is programmed, make manipulator 24 directly from the platen of polishing block the polished surface of polishing article pick up substrate 10 and put it to the stand part 176.

In one embodiment, blade 141 can be vertically positioned between the polished surface of the retracted position of carrier head 52 and polishing article 56.With reference to Fig. 3 A-3C, show a kind of embodiment for the processing that substrate is loaded into polishing block 50a.At first, as shown in Figure 3A, the installation surface of carrier head 62 is contracted, blade 141 with substrate laterally (as shown by arrow A) be transferred to position between carrier head and the polishing article.Then, shown in Fig. 3 B, blade is reduced to substrate on the polished surface, unclamps substrate, and withdrawal (as shown by arrow B).Then, shown in Fig. 3 C, the installation surface of carrier head 62 is lowered, and makes substrate be fitted in holding in the recess 68 of carrier head.At this moment, substrate can be polished at the polishing block place, also can snap into carrier head 62 and be sent to another polishing block by vacuum mode.Basically carry out these steps in reverse order from the processing of polishing system unloading substrate 10.

This structure provides very high flexibility ratio for processing and substrate flow.For example, in the order polishing operation, each substrate 10 can be loaded onto loading stage 50a, polished at loading stage 50a place, and be sequentially transferred to each polishing block 50b-50d of loading outside the polishing block 50a to add polishing, and be returned to loading stage 50a, unloaded then.For the order polishing operation, different polishing blocks place polishing condition can be different, different polishing blocks for example can be set be used for different materials is polished, and perhaps are used for carrying out in succession meticulousr polishing operation.Perhaps, in polishing operation in batch, can N substrate be loaded among the loading stage 50a by different successively carrier head, polish (and not polishing at other) at different polishing block 50a-50d, return successively and unload from polishing block 50a then.For polishing operation in batch, the substrate at polishing block place can similarly polished under the condition substantially.As mixing polishing, can polish the substrate that replaces with the paired polishing block that replaces.For example, substrate can load at loading stage 50a place, is transferred to polishing block 50b place and is subjected to polishing (and not polishing at loading stage 50a place), is transferred to polishing block 50d place and is polished, and is transferred to polishing block 50a place then and unloads.Next substrate can load at loading stage 50a place, is transferred to polishing block 50c place and is subjected to polishing (this can carry out in the polishing at platform 50d place simultaneously with first substrate), is transferred to polishing block 50a place and unloading then.

In embodiment shown in Figure 1, the position of manipulator 24 and polishing block 50 ' are contiguous, substrate 10 be loaded into special-purpose polishing platform 50 ' or fetch this substrate (that is, in this embodiment, system architecture is that manipulator 24 can only be visited in these polishing blocks) from this polishing block.

In another embodiment, as shown in Figure 4, manipulator 24 can be between two polishing blocks 50, and system architecture is that manipulator 24 can be visited two in the polishing block.In addition, manipulator also can be arranged between several polishing blocks 50 motion (for example passing through track) in case with the direct loading or unloading of substrate in adjacent polishing block.

Generally speaking, controller 32 is configured to select fetch substrate from which or from two polishing blocks which that substrate is sent to two polishing blocks.For example, manipulator 24 can send to substrate a special-purpose polishing platform 50a and fetch substrate (namely from another special-purpose polishing platform 50b, in this embodiment, the software of controller is configured to make in the manipulator 24 visit polishing blocks one to load and to visit another one in the polishing block to unload).As another kind of example, which polishing block controller 32 can dynamically determine to use carry out loading or unloading according to the situation in when operation.

Another example may be conducive to above-mentioned mixing polishing operation, in this example, manipulator 24 to/load substrates alternately from two adjacent polishing blocks.For example, a substrate is polished at loading stage 50a place, is transferred to polishing block 50c place and is polished, and is transferred to loading stage 50a then and from its unloading.The next substrate of this batch can load and be polished at loading stage 50d place, is transferred to polishing block 50b place and is polished, and is loaded onto loading stage 50d then and from its unloading.Particularly, first rotation by rotating disk,

platform

50a and 50d place are subjected to partially polished substrate and can be transferred to

platform

50c and 50b respectively simultaneously and be used for additional polishing, and originally the substrate at

platform

50c and 50b place was used for unloading by return to Chinese Taiwan by same rotation transmission 50a and 50d.Second rotation of rotating disk will be returned

platform

50a and 50d and be used for unloading through the substrate of polishing, and two new partially polished substrate transport are arrived platform 50c and 50d.An advantage of this operation is the twice rotating disk rotation that need of each polishing circulation.

In another embodiment, as shown in Figure 5, system 20 comprises two

charging manipulator

24a and 24b, and they are oriented to visit respectively two adjacent different polishing blocks, for example platform 50a and 50d.This system architecture can be that each manipulator can only be visited one different in the polishing block.In one embodiment, the manipulator contiguous with a polishing block 50a is the charging manipulator 24a of special use, and the manipulator contiguous with polishing block 50d is the unloading machinery hand 24b of special use.This also can be applied to said sequence polishing operation (just substrate is from platform 50d rather than platform 50a unloading), and in another embodiment,

charging manipulator

24a and 24b had both carried out loading and also carried out unloading.This also can be applied to top with reference to the described mixing polishing operation of Fig. 4 (just to not used different manipulators rather than shared manipulator on the same stage).

Controller 32 can comprise one or more programmable digital computers, and computer is carried out central authorities' control software or distributed control software.Controller 32 can coherent system 20 operation.In one embodiment, the direct loading of controller 32 management substrates 10.For example, control software can use mapped system, and this system distributes coordinate for the range of movement of manipulator 24.Reponse system can provide current coordinate, make control software can calculated example can be by the position of blocking from platen 54 as how arriving substrate 10.Controller 32 can produce electric control signal (for example analog signal or data signal) and instruct manipulator 24.

Fig. 6 A is a kind of embodiment schematic diagram of manipulator 24 direct load substrates 10.The joint arm 136 that manipulator 24 has robot base 132, vertical axis 134 and ends at substrate gripper 141.Vertical axis 134 can be regulated the height of substrate.For this reason, vertical axis 134 raises and reduction joint arm 136 along vertical axis as shown by arrow A.Joint arm 136 can horizontal mobile substrate 10.Specifically, joint arm 136 rotates around vertical axis shown in B.In addition, joint arm 136 is flexible in the horizontal direction shown in C.In one embodiment, joint arm comprises revolving actuator 138, and revolving actuator 138 can be around horizontal axis rotation substrate 10, shown in D.Manipulator 24 provides large-scale motion to come in stand part 176 thus and has loaded mobile substrate between the polishing block 50a.

Fig. 6 B is the upward view of joint arm 136.Substrate gripper 141 can be vacuum chuck, for example blade, electrostatic chuck, edge clamping (edge clamp) or similar wafer holding mechanism.Substrate gripper 141 is fastening substrate 10 when being transmitted by manipulator 24.Substrate gripper 141 can be fastened on substrate 10 prone position and fastening substrate 10 in the motion process of joint arm 136.

In one embodiment, loading (and unloading) is subjected to by auxiliary in conjunction with described one or more navigation system embodiments of Fig. 7-10 hereinafter.

Polishing machine 22 can have one or more elements assists in the location of loading on the polishing block 50a substrate 10, has described some examples among Fig. 7-10.Substantially, the element of navigation system can comprise hardware and/or software.Hardware aspect can be used on entity substrate 10 navigated to target stuck position (that is, can blocked safely in the position range of substrate 10 by rubbing head 62).The software aspect can be used for by instruction control hardware aspect, and described instruction for example is configured to calculate current location and is determined to the Dacca live the required motion in position.In some embodiments, joint arm 136 can be calibrated to substrate 10 is placed directly in stuck position.For example, feedback processing can as described belowly lead to joint arm 136.In certain embodiments, joint arm 136 can be placed on substrate 10 on the platen 54, and platen 54 can be repositioned onto stuck position (for example by making platen 54 rotations) then.In other embodiments, governor motion can be repositioned onto target stuck position (for example from extraneous position) with substrate 10 from initial orientation by joint arm 136.

Fig. 7 is the schematic diagram of polishing machine 22, and polishing machine 22 has first embodiment of navigation system, and this navigation system uses feedback to control the position of joint arm 136 in placing the substrate process.In a kind of embodiment of detent mechanism, in manipulator 24 and the polishing machine 22 one or the two can comprise alignment sensor, to determine that joint arm 136 is with respect to the position of polishing machine 22 elements.For example, alignment sensor 144 can be positioned on the joint arm 136, on the blade 141, on the rotating disk 60 or on the carrier head 62.In one embodiment, one of manipulator 24 or polishing machine 22 can comprise position sensor 144, and another element (for example, if sensor 144 is on blade, then on the carrier head 62) can comprise and improve the feature 162 that detects easiness, for example aligned pattern (for example reflection bar) or light source (for example LED).Position sensor 144 can be fluorescence detector (for example photoelectric detector), camera, edge detector etc.In one embodiment, fluorescence detector is to detecting from the light that is installed in the light source 162 on another element, to determine whether substrate has arrived stuck position.In another embodiment, camera uses image to handle, and is used for the visual identity to stuck position.Fig. 6 A-6B illustrates a kind of example of position sensor 144 on manipulator 24, is distributed in a kind of example between manipulator 24 (for example blade 141) and the polishing system 22 (for example carrier head 62) and Fig. 7 illustrates position sensor.Although sensor 144 is illustrated as being located on the end face of blade 141, sensor 144 also can be positioned on the bottom surface.

Position sensor 144 can provide feedback information.Position sensor 144 can for example provide output to control software or hardware (for example controller 32), and described control software or hardware calculating location also determine how to arrive stuck position.Joint arm 136 can receive the signal that further motion is instructed.For example, if use camera, then controller can be configured to blade is moved, so that from image of camera and predeterminated target images match, wherein blade 141 can be properly oriented at described predeterminated target image place.

In one embodiment, joint arm 136 can extend (that is, having one degree of freedom) along constrained axis and can navigate to stuck position by single position sensor 144.In other embodiments, joint arm 136 can be along extending more than axis, thereby by locating more than a position sensor 144.Till feedback processing can continue to when arriving stuck position.After on being located in polishing article 56, joint arm 136 unclamps substrate 10.

Fig. 8 A and Fig. 8 B are the schematic diagrames that has the polishing machine 22 of navigation system second embodiment, and this navigation system has first embodiment of governor motion.In Fig. 8 A, carrier head 62 comprises retaining ring 164.Fig. 8 B shows the upward view (that is the embodiment of ring-type retaining ring) of retaining ring 164.Retaining ring 164 has adjustable diameter 163.At work, can internal diameter be increased.The diameter 163 that increases has relaxed the tolerance relevant with the position of manipulator placement substrate 10.After carrier head is lowered, the internal diameter of retaining ring 164 is reduced, so that slightly that substrate 10 is inwardly short tight.For example, if substrate 10 with respect to internal diameter 163 off-centre, then the appropriate section of retaining ring 164 can be touched substrate 10 to contact or almost be contacted the opposite side of retaining ring 164.After polishing, the adjustable diameter of retaining ring 164 can increase to unclamp substrate 10 again.U.S. Patent No. 6,436 has been described the retaining ring that has adjustable diameter in 228, and this patent by reference and combination.

Fig. 9 A-9C is the schematic diagram that has the polishing machine 22 of navigation system the 3rd embodiment, and this navigation system has second embodiment of governor motion.Platen 54 comprises retractible alignment pin 166, and these alignment pins 166 are around the stuck position location.Retractible pin 166 can be installed to the actuator (not shown) in the platen 54, and can be arranged in the recess 168 of platen 54 when withdrawal.When upwards being activated, extend in the hole that pin 166 passes in the polishing article 56, makes them protrude from the polished surface top.In one embodiment, three retractible pins 166 are with the periphery setting of 120 increments of spending around stuck position.In another kind of embodiment, the retractable pin 166 of other numbers can be arranged.

Shown in Fig. 9 C, inside surface, the top of each retractable pin 166 place can taper (as shown in the figure, whole pin can be taper), make the top section of retractable pin than the bottom corresponding to bigger substrate diameter.Perhaps, retractable pin 166 can not be taper also, but is oriented to make their longitudinal axis to become the angle of on-right angle with respect to polished surface, thereby similar progress is arranged aspect diameter.

At work, retractable pin 166 is reduced, substrate 10 can be placed on the polishing article 56 interferingly.Can utilize various technology to place substrate 10 (for example using above in conjunction with the described alignment sensor 144 of Fig. 7).Retractable pin 166 can activated, thus in response to the substrate of institute's perception (for example when being notified by controller, perhaps be positioned at below the substrate 10 light sensors then) and stretch out from platen 54.The tapered edge 167 of retractable pin 166 is configured to contact edges of substrate, and slightly substrate 10 is repositioned onto stuck position from initial position.Subsequently, retractable pin 166 can be withdrawn in the platen 54, so as not to when be lowered to block substrate 10 and carrier head 62 interfere.

Figure 10 A and Figure 10 B are the schematic diagrames that has the polishing machine 22 of detent mechanism the 4th embodiment.In this embodiment, platen 54 rotates between the restraint location shown in the " loaded " position shown in Figure 10 A and Figure 10 B.In " loaded " position, substrate 10 can be placed between the retractable pin 166 by manipulator 24, and does not need to handle the blade 141 under the carrier head 62.After loading, platen 54 rotates towards stuck position, thereby substrate 10 is positioned in order to blocked by carrier head 62.

Various embodiments of the present invention above has been described.But, should be understood that under the situation that does not break away from the spirit and scope of the present invention and can carry out various changes.Therefore, other embodiment also within the scope of the appended claims.

Therefore, other embodiment also within the scope of the appended claims.

Claims

1. A method of operating a polishing system comprising:

Place the substrate onto the polished surface with a robotic arm;

placing at least a portion of a carrier head in a loading position such that a retaining ring of the carrier head surrounds the substrate; and

Relative motion is caused between the carrier head and the polishing surface to polish the substrate.

2. The method of claim 1 , wherein the substrate is placed onto the polishing surface at a first location, the method further comprising moving the substrate from the first location to the polishing surface. the loading position described above.

3. The method of claim 2, wherein moving the substrate comprises adjusting a diameter of an inner surface of the retaining ring.

4. The method of claim 2, wherein moving the substrate comprises bringing an edge of the substrate into contact with an alignment pin.

5. The method of claim 2, wherein moving the substrate comprises moving the platen.

6. The method of claim 1, wherein the substrate is placed on the polishing surface before the retaining ring of the carrier head surrounds the substrate.

7. The method of claim 1 , wherein placing the substrate onto the polishing surface comprises retracting the carrier head, transporting the substrate on the blade of the manipulator laterally to The substrate is lowered onto the polishing surface at a position between the carrier head and the polishing article, the substrate is released, and the blades of the manipulator are retracted.

8. The method of claim 1 , wherein placing at least a portion of the carrier head in the loading position comprises lowering a mounting surface of a polishing head such that the substrate fits on a surface of the polishing head. into the recess.

9. A chemical mechanical polisher comprising:

Tables for supporting polished objects;

a robot positioned proximate to the platen and configured to position a substrate on the polishing article;

a carrier head with a retaining ring; and

A carrier head support mechanism configured to move the carrier head to a position where the retaining ring surrounds the substrate.

10. The chemical mechanical polisher of claim 9, wherein, in operation, the mounting surface of the polishing head is retracted and the blades of the robot transport the substrate laterally to the carrier head and polishing article position between, the substrate is lowered onto the polishing surface of the polishing article, the substrate is released, and retracted, and then the mounting surface of the polishing head is lowered such that the retaining ring surrounds the and the substrate is fitted in the accommodating recess of the polishing head.