CN1032040A - The method for preparing composite tin-plating layer - Google Patents
The method for preparing composite tin-plating layer Download PDFInfo
- Publication number
- CN1032040A CN1032040A CN 88106559 CN88106559A CN1032040A CN 1032040 A CN1032040 A CN 1032040A CN 88106559 CN88106559 CN 88106559 CN 88106559 A CN88106559 A CN 88106559A CN 1032040 A CN1032040 A CN 1032040A
- Authority
- CN
- China
- Prior art keywords
- plating layer
- preparing composite
- grams per
- composite tin
- ceramic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000007747 plating Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 16
- 239000002131 composite material Substances 0.000 title claims abstract description 10
- 239000000919 ceramic Substances 0.000 claims abstract description 20
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000005282 brightening Methods 0.000 claims abstract description 10
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 10
- RCIVOBGSMSSVTR-UHFFFAOYSA-L stannous sulfate Chemical compound [SnH2+2].[O-]S([O-])(=O)=O RCIVOBGSMSSVTR-UHFFFAOYSA-L 0.000 claims abstract description 5
- 229910000375 tin(II) sulfate Inorganic materials 0.000 claims abstract description 5
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 238000005304 joining Methods 0.000 claims abstract 2
- 229910052582 BN Inorganic materials 0.000 claims description 11
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 11
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 11
- 239000007788 liquid Substances 0.000 claims description 6
- 239000002245 particle Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 5
- 239000012153 distilled water Substances 0.000 claims description 4
- 239000003595 mist Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000000654 additive Substances 0.000 claims description 2
- 230000000996 additive effect Effects 0.000 claims description 2
- 238000004140 cleaning Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 239000002002 slurry Substances 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 abstract description 12
- 238000000576 coating method Methods 0.000 abstract description 12
- 238000005219 brazing Methods 0.000 abstract description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 4
- 239000004615 ingredient Substances 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 239000002253 acid Substances 0.000 description 3
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
- C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
A kind of method for preparing composite tin-plating layer, the plating bath that it uses is made up of following ingredients: stannous sulfate 30-70 grams per liters, sulfuric acid 80-160 grams per liters, 15 milliliters/liter of SS-820 (joining the cylinder brightening agent), 1.5 milliliters/liter of SS-821 (interpolation brightening agent), metal ceramic powder 0.2-5.5 grams per liters.The tin coating that adopts this plating bath to plate out has good brazing property, is suitable for the production of electronic devices and components.
Description
The invention relates to electric plating method, more particularly, is the method about acid bright tinning.
In recent years, along with developing rapidly of electronic industry, in order to improve the weldability of electronic devices and components, and the metals such as gold and silver of conserve expensive, people attempt to plate the good tin of solderability on the lead-in wire of electronic devices and components." electroplating and environmental protection " " acid bright tinning novel process " literary composition on magazine the 2nd phase of nineteen eighty-two that China publishes discloses a kind of method of acid bright tinning, and the prescription of the electroplate liquid that this method adopts is:
Stannous sulfate 70 grams per liters
Sulfuric acid 160 grams per liters
SS-820(joins the cylinder brightening agent) 15 milliliters/liter
SS-821(adds brightening agent) 1.5 milliliters/liter
Use the plating bath of this prescription to electroplate, can obtain the coating of light on the lead-in wire of electronic devices and components, weak point is that the brazing property instability of coating is through coating blackening afterwards in, two month, solderability variation.
The objective of the invention is to overcome above-mentioned shortcoming, make coating have good brazing property, and good stability, can keep light and good solderability in a long time.
The method that the present invention prepares composite tin-plating layer is to use the electroplate liquid of following component:
Stannous sulfate 30-70 grams per liter
Sulfuric acid 80-160 grams per liter
SS-820(joins the cylinder brightening agent) 15 milliliters/liter
SS-821(adds brightening agent) 1.5 milliliters/liter
Add additive sintering metal micro mist 0.2-5.5 grams per liter in above-mentioned plating bath, the diameter of described ceramic micropowder particle is less than 5 microns.
Above-mentioned ceramic can be any among aluminum oxide, the boron nitride, also can be the mixture of aluminum oxide and boron nitride, certainly, also can be other ceramic, for example plumbous oxide, silicon carbide etc.Wherein the add-on of aluminum oxide and boron nitride was advisable with 2: 1.
Ceramic carries out the appropriate location reason before adding plating bath, effect is better.Its treatment step is: (a) with ceramic in 1: the ratio of 2-5 adds distilled water, is placed in the ball mill to grind 4-8 hour; (b) above-mentioned micro mist liquid slurry is put into the sulfuric acid that concentration is 1-5M, be heated to 80-100 ℃, be incubated 1-3 hour, and constantly stir; (c) the cooling said mixture filters then, and cleans with distilled water, until the pH value of aqueous cleaning solution till the 6-7; (d) above-mentioned ceramic is put into plating bath, and stir, make it even.
Characteristics of the present invention are to add ceramic in the electroplate liquid of existing technology, for example aluminum oxide and boron nitride.This way and tradition are electroplated theoretical running in the opposite direction, yet practice shows, not only light, solidity to corrosion are good to adopt the coating that electroplate liquid plated out that is mixed with ceramic, and brazing property is good, and this is unhoped-for.
Below by embodiment, can do further understanding to the present invention.Wherein example 1 is a prior art, and remaining example is a content of the present invention.
Example 1
Prescription is as follows with technology:
Stannous sulfate (analytical pure) 40 grams per liters
Sulfuric acid (analytical pure) 100 grams per liters
SS-820(joins the cylinder brightening agent) 15 milliliters/liter
SS-821(adds brightening agent) 1.5 milliliters/liter
The temperature room temperature
30 minutes time
4 amperes/decimeter of current densities
2
30 rev/mins of rotating speeds
Anode and cathode area were than 2: 1
Example 2
Add analytically pure ceramic (particle diameter is less than 5 microns) aluminum oxide 1 grams per liter and boron nitride 2 grams per liters in the plating bath of example 1, other processing condition are identical with example 1.
Example 3
Add analytically pure ceramic (particle diameter is less than 5 microns) aluminum oxide 5 grams per liters and boron nitride 0.5 grams per liter in the plating bath of example 1, other processing condition are identical with example 1.
Example 4
Add analytically pure ceramic (particle diameter is less than 5 microns) aluminum oxide 0.1 grams per liter and boron nitride 0.1 grams per liter in the plating bath of example 1, other processing condition are identical with example 1.
Example 5
Add analytically pure ceramic (particle diameter is less than 5 microns) aluminum oxide 1 grams per liter and boron nitride 0.5 grams per liter in the plating bath of example 1, other processing condition are identical with example 1.
The salient features of the tin coating that the various embodiments described above plate out (lead-in wire with 0.5 millimeter of diameter is an example) is shown in the table.As can be seen from the table, adopt the tin coating of method preparation of the present invention that following advantage is compared with prior art arranged: the brazing property of coating (wetting power) is good, zero friendship time is short, coating hardness is high, porosity is low.In addition, the coating luminance brightness is good, stability strong, and coating is deposited after half a year still very bright in air, and considerable change does not take place its good weldability.
Claims (6)
1, a kind of method for preparing composite tin-plating layer, use the plating bath of following component: stannous sulfate 30-70 grams per liter, sulfuric acid 80-160 grams per liter, 15 milliliters/liter of SS-820 (joining the cylinder brightening agent), 1.5 milliliters/liter of SS-821 (interpolation brightening agent), it is characterized in that, add additive sintering metal micro mist 0.2-5.5 grams per liter in above-mentioned plating bath, the diameter of described ceramic micropowder particle is less than 5 microns.
2, the method for preparing composite tin-plating layer according to claim 1 is characterized in that, described ceramic is an aluminum oxide.
3, the method for preparing composite tin-plating layer according to claim 1 is characterized in that, described ceramic is a boron nitride.
4, the method for preparing composite tin-plating layer according to claim 1 is characterized in that, described ceramic is the mixture of aluminum oxide and boron nitride.
5, the method for preparing composite tin-plating layer according to claim 4 is characterized in that, described aluminum oxide is 2: 1 with the ratio of boron nitride.
According to the described method for preparing composite tin-plating layer of claim 1 to 5, it is characterized in that 6, described ceramic is adding the following processing of plating bath previous crops: (a) with ceramic in 1: the ratio of 2-5 adds distilled water, is placed in the ball mill grinding 4-8 hour; (b) above-mentioned micro mist liquid slurry is put into the sulfuric acid that concentration is 1-5M, be heated to 80-100 ℃, be incubated 1-3 hour, and constantly stir; (c) the cooling said mixture filters then, and cleans with distilled water, until the pH value of aqueous cleaning solution till the 6-7; (d) above-mentioned ceramic is put into plating bath and stir, make it even.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 88106559 CN1008749B (en) | 1988-09-28 | 1988-09-28 | Process for preparation of composite tin-plating layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 88106559 CN1008749B (en) | 1988-09-28 | 1988-09-28 | Process for preparation of composite tin-plating layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1032040A true CN1032040A (en) | 1989-03-29 |
| CN1008749B CN1008749B (en) | 1990-07-11 |
Family
ID=4834284
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 88106559 Expired CN1008749B (en) | 1988-09-28 | 1988-09-28 | Process for preparation of composite tin-plating layer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1008749B (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101041903A (en) * | 2006-03-24 | 2007-09-26 | 富士通株式会社 | Plating film and forming method thereof |
| CN103215622A (en) * | 2012-06-13 | 2013-07-24 | 安徽恒晶电缆集团有限公司 | Method for electrotinning copper conductor of wire or cable |
| CN109735890A (en) * | 2018-12-27 | 2019-05-10 | 大连理工大学 | Nano TiO (titanium dioxide)2Preparation method of (E) -Sn micro bump |
| CN110438539A (en) * | 2019-09-24 | 2019-11-12 | 郎溪蓉承金属表面处理有限公司 | Electroplating technology with corrosion-resistant and conductivity kirsite substrate |
| CN110616451A (en) * | 2019-06-21 | 2019-12-27 | 西南交通大学 | Method for enhancing strength of welding interface of hard alloy and metal |
-
1988
- 1988-09-28 CN CN 88106559 patent/CN1008749B/en not_active Expired
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101041903A (en) * | 2006-03-24 | 2007-09-26 | 富士通株式会社 | Plating film and forming method thereof |
| US20100170804A1 (en) * | 2006-03-24 | 2010-07-08 | Fujitsu Limited | Plating film and forming method thereof |
| CN103215622A (en) * | 2012-06-13 | 2013-07-24 | 安徽恒晶电缆集团有限公司 | Method for electrotinning copper conductor of wire or cable |
| CN109735890A (en) * | 2018-12-27 | 2019-05-10 | 大连理工大学 | Nano TiO (titanium dioxide)2Preparation method of (E) -Sn micro bump |
| CN109735890B (en) * | 2018-12-27 | 2020-10-13 | 大连理工大学 | Nano TiO (titanium dioxide)2Preparation method of (E) -Sn micro bump |
| CN110616451A (en) * | 2019-06-21 | 2019-12-27 | 西南交通大学 | Method for enhancing strength of welding interface of hard alloy and metal |
| CN110438539A (en) * | 2019-09-24 | 2019-11-12 | 郎溪蓉承金属表面处理有限公司 | Electroplating technology with corrosion-resistant and conductivity kirsite substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1008749B (en) | 1990-07-11 |
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