CN103152068A - Communication device with wireless module packaging structure and manufacturing method thereof - Google Patents

Abstract

A communication device with a wireless module package structure and a manufacturing method thereof are provided, which comprises: a circuit substrate; a wireless module package structure having a bottom surface and a top surface, wherein the bottom surface is disposed on the circuit substrate, and the top surface is provided with a signal feed-in point; and the top cover is connected with the circuit substrate and covers the wireless module packaging structure, an antenna pattern and a thimble are arranged on the surface of the top cover, one end of the thimble is connected with the antenna pattern, and the other end of the thimble is correspondingly abutted to a signal feed-in point of the wireless module packaging structure. The top surface of the wireless module packaging structure is directly fed into the antenna through the thimble, so that the assembly operation can be effectively simplified, the signal transmission path can be shortened, and the signal loss can be reduced.

Description

Communication device with wireless module packaging structure and manufacturing method thereof

technical field

The invention relates to a communication device, in particular to a communication device with a wireless module packaging structure and a manufacturing method thereof.

Background technique

At present, the general wireless module (Wireless module) or RF front-end module (RF front-end module) is electrically connected to the system motherboard (motherboard) through the bottom circuit of its packaging substrate (substrate), and then through the system motherboard. The RF connector (RF connector) and the coaxial cable (RF cable) are connected to the antenna provided on the product shell, or a line that connects the system board to the package substrate, and provides a signal feed point on the board surface, The antenna is electrically connected to the signal feeding point to form a wireless communication device, such as a mobile phone.

However, since the above-mentioned path from the bottom circuit of the packaging substrate to the system main board, and then from the system main board to the connecting antenna is too long, it is easy to increase signal loss, and the assembly process is quite complicated and increases the cost of components (such as radio frequency connectors, coaxial cable).

Therefore, it is necessary to provide a communication device with a wireless module packaging structure and a manufacturing method thereof to solve the problems existing in the prior art.

Contents of the invention

The main purpose of the present invention is to provide a communication device with a wireless module packaging structure, which can simplify the assembly work, shorten the signal transmission path, reduce the size of the wireless product and reduce the assembly cost.

In order to achieve the aforementioned object, an embodiment of the present invention provides a communication device with a wireless module packaging structure, the communication device with a wireless module packaging structure comprising: a circuit substrate; a wireless module packaging structure having a bottom surface and a top surface surface, the bottom surface of which is arranged on the circuit substrate, and a signal feed-in point is provided on the top surface; and a top cover, which is connected to the circuit substrate and covers the wireless module packaging structure, and an antenna pattern is provided on the surface of the top cover And a thimble, one end of the thimble is connected to the antenna pattern and the other end is correspondingly abutted against the signal feeding point of the wireless module packaging structure.

Furthermore, another embodiment of the present invention provides a method of manufacturing a communication device with a wireless module packaging structure, the manufacturing method includes the steps of: disposing a wireless module packaging structure on a circuit substrate, and the wireless module packaging structure A signal feed-in point is provided on the surface; and a top cover with an antenna pattern is correspondingly covered with the circuit substrate, so that a top pin connected with the antenna pattern is correspondingly abutted against the signal feed-in point.

Since the position of the signal output of the wireless module packaging structure of the present invention is changed from the bottom layer of the substrate to the top surface of the wireless module packaging structure and directly fed to the antenna through the thimble, it can effectively shorten the path of signal transmission, reduce signal loss, and also help to reduce the size of the antenna. size and cost of wireless products.

Description of drawings

FIG. 1 is a schematic structural diagram of a communication device with a wireless module packaging structure according to an embodiment of the present invention.

FIG. 2 is a schematic structural diagram of a communication device with a wireless module packaging structure according to another embodiment of the present invention.

FIG. 3 is a schematic structural diagram of a communication device with a wireless module packaging structure according to another embodiment of the present invention.

FIG. 4 is a schematic structural diagram of a communication device with a wireless module packaging structure according to another embodiment of the present invention.

FIG. 5 is a schematic structural diagram of a communication device with a wireless module packaging structure according to another embodiment of the present invention.

FIG. 6 is a schematic structural diagram of a communication device with a wireless module packaging structure according to another embodiment of the present invention.

FIG. 7 is a schematic diagram of a manufacturing method of the communication device with the wireless module packaging structure in FIG. 1 .

Detailed ways

In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments of the present invention are exemplified below and described in detail in conjunction with the accompanying drawings. Furthermore, the directional terms mentioned in the present invention, such as "up", "down", "front", "back", "left", "right", "inside", "outside", "side", etc., It is only for orientation with reference to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

Please refer to FIG. 1 , which is a schematic structural diagram of a communication device with a wireless module packaging structure according to an embodiment of the present invention. The communication device with wireless module packaging structure disclosed in the present invention includes a circuit substrate 1 , a wireless module packaging structure 2 and a top cover 3 .

The circuit substrate 1 is a printed circuit board with several welding pads on its surface.

The wireless module packaging structure 2 is disposed on the circuit substrate 1, and has a bottom surface 200 and a top surface 201, the bottom surface 200 is electrically connected to the circuit substrate 1, and a signal feed-in point is provided on the top surface 201. 202. More specifically, in this embodiment, the wireless module package structure 2 includes a package substrate 21 , a chip 22 , at least one passive component 23 , a package compound 24 and a conductive member.

The packaging substrate 21 is a small multi-layer printed circuit board, and its insulating layer can be first formed by glass fiber and epoxy resin, and then alternately stacked by insulating layers and circuit layers. The bottom surface of the package substrate 21 is provided with several electrical connection portions 210 (such as solder balls) for electrically connecting the circuit substrate 1 through the electrical connection portions 210 . The top surface of the packaging substrate 21 is also provided with a metal terminal 27 as a wireless signal output/input terminal.

The chip 22 is a wireless communication chip, which is arranged on the packaging substrate 21 and has an active surface, the active surface faces downward and is provided with several chip pads and bumps 220 connected to the chip pads, The chip 22 is electrically connected to the surface circuit on the top surface of the packaging substrate 21 through the bump 220 , and then electrically connected to the metal terminal 27 .

The passive component 23 is also arranged on the packaging substrate 21 and electrically connected to the chip 22, which can be, for example, a capacitor. The passive component 23 itself can provide an output/input terminal of a wireless signal. In an embodiment, the passive component 23 is connected to the metal terminal 27 .

The encapsulant 24 can be, for example, a mixture of epoxy resin and insulating particles (such as silicon oxide or aluminum oxide), which is disposed on the top surface of the packaging substrate 21 to cover the chip 22 and the passive components. Element 23.

At least a part of the conductive element is disposed in the encapsulant 24 and connected to the metal terminal 27 , and the conductive element partially exposes the top surface of the encapsulant 24 to provide the signal feed-in point. In this embodiment, as shown in FIG. 1 , the conductive member is a conductive column 26, the conductive column 26 is installed in the encapsulant 24, and its bottom end is connected to the metal terminal 27. One top is exposed on the top surface of the encapsulant 24 , and the exposed top is used as the signal feeding point 202 . The conductive pillars 26 can be made and shaped by a through-hole sealing process such as through-molding via (Through Molding Via, TMV).

The wireless module packaging structure 2 may further include a conductive shielding layer 25 . The conductive shielding layer 25 is disposed on the surface of the encapsulant 24 and exposes the conductive elements (conductive pillars 26 ). In this embodiment, the conductive shielding layer 25 has a window exposing the surface of the encapsulant 24 and the top of the conductive pillar 26, wherein the edge of the window of the conductive shielding layer 25 is larger than the top of the conductive pillar 26, so that the conductive shielding layer 25 and the top of the conductive pillar 26 are kept electrically separated. The conductive shielding layer 25 is also electrically connected to a grounding circuit on the packaging substrate 21, which may be formed by sputtering or electroplating to cover the surface of the packaging body 24, so as to achieve The purpose of shielding electromagnetic waves is to reduce the impact of external charges and electromagnetic waves on the chip 22 .

The top cover 3 is connected to the circuit substrate 1 to cover the wireless module packaging structure 2 , the surface of the top cover 3 is provided with an antenna pattern 30 and a thimble 31 , one end of the thimble 31 is connected to the antenna pattern 30 , and The other end corresponds to abutting against the signal feed-in point 202 on the top surface 201 of the wireless module package structure 2 , that is, abutting against the conductive element (conductive column 26 ). In this embodiment, as shown in FIG. 1 , the ejector pin 31 abuts against the top of the conductive post 26 exposed on the top surface of the encapsulant 24 .

As shown in FIG. 1 , the wireless module packaging structure 2 is in direct contact with the thimble 31 of the antenna pattern 30 of the top cover 3 through the conductive member (conductive column 26 ), without going through the circuit of the circuit substrate 1 . The purpose of wireless signal output/input is achieved, so the signal feed-in path is relatively shortened, which will effectively reduce signal loss; at the same time, the circuit substrate 1 does not need to be provided with additional radio frequency connectors and coaxial cables, so it also contributes to Simplify assembly operations, reduce the size of wireless products, and lower component and assembly costs.

In the communication device with the wireless module packaging structure of the present invention, the connection position of the conductive post 26 is not limited to the embodiment shown in FIG. 1 , and the connection position can be changed according to the specific position of the signal feeding point.

Please refer to FIG. 2, in another feasible embodiment of the present invention, a solder ball 28 may be pre-set on the metal terminal 27, and after the encapsulant 24 is formed, the corresponding solder ball 28 is formed. The conductive post 26 is such that the bottom end of the conductive post 26 is connected to the solder ball 28 , and is electrically connected to the metal terminal 27 through the solder ball 28 . In this way, the length of the conductive pillar 26 can be relatively shortened, which helps to reduce the use of high-precision drilling equipment with high cost, and speed up the production speed of the through-hole of the guide sealant.

Please refer to FIG. 3, in another embodiment of the present invention, since the passive component 23 itself can provide a wireless signal output/input terminal, the bottom end of the conductive column 26 can also be directly connected to the An electrical connection terminal of the passive component 23 mentioned above. Alternatively, the conductive pillars 26 can also be formed in the encapsulant 24 and pass through the silicon of the chip 22 through a through-gel via (TMV) and a through-silicon via (Through Silicon Via, TSV) manufacturing process. on the substrate, and then electrically connected to a wireless signal output/input terminal of the active circuit (lower surface) of the chip 22 . Alternatively, when the chip 22 is disposed on the packaging substrate 21 through a wire bonding process, since its active surface (upper surface) faces upward, the conductive pillar 26 can also be formed correspondingly on the packaging substrate 21. A pad on the active surface of the chip 22 provides output/input of wireless signals.

In addition to the above-mentioned conductive column form, the conductive member may also be in other forms.

Please refer to FIG. 4 , which schematically illustrates a structural diagram of a communication device with a wireless module packaging structure according to another embodiment of the present invention. Compared with the previous embodiment, the difference of the embodiment in Fig. 4 is that the conductive member is a metal cover 29, the cross section of the metal cover 29 is roughly Ω-shaped or inverted U-shaped, and can be pre-embedded in the The encapsulant 24 is in contact with the metal terminal 27 to form an electrical connection; or the encapsulant 24 can be pre-drilled so that it has a through hole of an appropriate size and correspondingly exposes the metal terminal 27 , and then insert the metal cover 29 into the through hole and then contact the metal terminal 27 to form an electrical connection. The top of the metal cover 29 is exposed to form a signal feeding point to abut against the ejector pin 31 .

As shown in FIG. 5, in another embodiment of the present invention, the conductive member can be a metal wire 40, which is arranged on the package substrate 21 through a wire bonding process, and connected to the metal terminal 27 electrical connection. After molding the encapsulant 24, the encapsulant 24 is further ground or etched, so that part of the metal wire 40 is exposed on the top surface of the encapsulant 24 to form a signal feed-in point to communicate with the encapsulant. The thimbles 31 abut against each other.

As shown in FIG. 6 , in yet another embodiment of the present invention, the conductive member can be a separate part 250 of the conductive shielding layer 25 , and the separate part 250 covers one side of the encapsulant 24 Insulated and separated from the grounded conductive shielding layer 25, a bottom of the separated part 250 extends into the bottom surface of the packaging compound 24, or is arranged on the packaging substrate 21 to connect to the metal terminal 27, the A top of the separation part 250 is used as a signal feeding point to abut against the ejector pin 31 of the top cover 3 .

Please refer to FIG. 7. FIG. 7 is a schematic diagram of the manufacturing method of the communication device with the wireless module packaging structure of the above-mentioned embodiment in FIG. The module packaging structure 2 is disposed on the circuit substrate 1; then, the top cover 3 with the antenna pattern 30 is correspondingly covered on the circuit substrate 1, so that the thimble 31 connected to the antenna pattern 30 is correspondingly abutted against the circuit substrate 1. The bare tops of the conductive pillars 26 form electrical connections. In this way, the fabrication of the communication device with the wireless module packaging structure as shown in FIG. 1 can be completed.

To sum up, compared with the lack of too long signal feed-in path of the existing communication device, the present invention mainly uses the conductive element arranged on the encapsulation compound of the wireless module encapsulation structure to directly contact the thimble connected to the antenna pattern, The purpose of wireless signal feed-in can be achieved without going through the circuits and components of the system motherboard, so the path of signal feed-in is relatively shortened, which will effectively reduce signal loss; at the same time, there is no need to set additional RF connectors and coaxial cables wires, so the invention also helps to simplify assembly work, reduce the size of wireless products, and reduce component and assembly costs.

The present invention has been described by the above-mentioned related embodiments, however, the above-mentioned embodiments are only examples for implementing the present invention. It must be pointed out that the disclosed embodiments do not limit the scope of the invention. On the contrary, modifications and equivalent arrangements included in the spirit and scope of the claims are included in the scope of the present invention.

Claims (10)

1. A communication device with a wireless module packaging structure, characterized in that: the communication device with a wireless module packaging structure includes: a circuit substrate; A wireless module packaging structure, disposed on the circuit substrate and having a bottom surface and a top surface, the bottom surface is electrically connected to the circuit substrate, and a signal feed-in point is provided on the top surface; and A top cover, connected to the circuit substrate to cover the wireless module packaging structure, the surface of the top cover is provided with an antenna pattern and a thimble, one end of the thimble is connected to the antenna pattern and the other end is correspondingly abutted against the wireless module The signal feed point of the encapsulation configuration. 2. The communication device with a wireless module packaging structure as claimed in claim 1, wherein the wireless module packaging structure comprises: A packaging substrate, a top surface of which is provided with a metal terminal as a wireless signal output/input terminal; a chip, disposed on the package substrate and electrically connected to the metal terminal; an encapsulant, disposed on the encapsulation substrate to cover the chip; and A conductive element, at least a part of which is disposed in the encapsulant and connected to the metal terminal, and the conductive element partially exposes the top surface of the encapsulant to provide the signal feed-in point. 3. The communication device with a wireless module package structure as claimed in claim 2, wherein the conductive member is a conductive column, and the conductive column is penetrated in the encapsulant, and a bottom end of the conductive column is connected to One top of the metal terminal is exposed on the top surface of the encapsulant; the ejector pin abuts against the top of the conductive column. 4. The communication device with a wireless module packaging structure as claimed in claim 2, characterized in that: a solder ball is provided on the metal terminal; In the encapsulation compound, one bottom end thereof is connected to the solder ball, and one top end thereof is exposed on the top surface of the encapsulation compound; the thimble abuts against the top end of the conductive column. 5. The communication device with wireless module packaging structure as claimed in claim 2, characterized in that: said wireless module packaging structure further comprises at least one passive element, said passive element is arranged on said packaging substrate and The chip is electrically connected; the conductive member is a conductive column, and the conductive column is installed in the encapsulant, and its bottom end is connected to an electrical connection end of the passive component, and its one The top is exposed on the top surface of the encapsulant; the ejector pin abuts against the top of the conductive pillar. 6. The communication device with a wireless module package structure as claimed in claim 2, wherein the conductive member is a metal cover, which is located in the encapsulant and contacts with the metal terminal, and the metal cover The top of the thimble is exposed and abuts against the thimble. 7. The communication device with a wireless module packaging structure as claimed in claim 2, wherein the conductive member is a metal wire, which is arranged on the packaging substrate and electrically connected to the metal terminal; The metal wires are exposed on the top surface of the encapsulant and abut against the ejector pins. 8. The communication device with a wireless module packaging structure according to any one of claims 2 to 7, characterized in that: the wireless module packaging structure further comprises a conductive shielding layer, the conductive shielding layer is arranged on the package The surface of the colloid exposes the conductive element, and the conductive shielding layer is electrically connected to a ground circuit on the packaging substrate. 9. The communication device with wireless module packaging structure as claimed in claim 2, characterized in that: said wireless module packaging structure further comprises a conductive shielding layer, said conductive shielding layer is arranged on the surface of said packaging colloid and electrically connected to a grounding circuit on the packaging substrate; the conductive member is a separate part of the conductive shielding layer, and the separate part covers one side of the encapsulant and is connected to the grounded conductive shielding Layer insulation separation, a bottom of the separation part extends into the bottom surface of the encapsulant to connect to the metal terminal, a top of the separation part abuts against the ejector pin. 10. A method for manufacturing a communication device with a wireless module packaging structure, characterized in that: the method includes the steps of: A wireless module packaging structure is arranged on a circuit substrate, and a signal feed-in point is provided on the top surface of the wireless module packaging structure; and A top cover with an antenna pattern is correspondingly covered on the circuit substrate, so that a top pin connected to the antenna pattern should abut against the signal feeding point.

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