CN103045117A

CN103045117A - Heat dissipation adhesive tape applied to electronic devices and its preparation process

Info

Publication number: CN103045117A
Application number: CN2012105517320A
Authority: CN
Inventors: 金闯; 梁豪
Original assignee: Sidike New Materials Jiangsu Co Ltd
Current assignee: Sidike New Materials Jiangsu Co Ltd
Priority date: 2012-12-18
Filing date: 2012-12-18
Publication date: 2013-04-17
Anticipated expiration: 2032-12-18
Also published as: CN103045117B

Abstract

The invention discloses a heat dissipation adhesive tape applied to an electronic device, which is characterized in that: the heat-conducting adhesive film comprises a PET film with the thickness of 0.004 mm-0.025 mm, wherein the lower surface of the PET film is coated with a heat-conducting adhesive layer, and the heat-conducting adhesive layer is obtained by mixing and baking the following components in parts by weight: 100 parts of acrylate adhesive, 50-150 parts of graphite powder, 200-300 parts of solvent, 0.1-1 part of curing agent and 0.01-0.1 part of coupling agent; the acrylate adhesive consists of the following components in parts by weight: 100 parts of butyl acrylate, 0.1-1 part of benzoyl peroxide, 50-150 parts of isooctyl acrylate, 2-5 parts of acrylic acid, 10-30 parts of methyl methacrylate, 0-10 parts of vinyl acetate and 0.1-1 part of 2-hydroxyethyl methacrylate. The invention ensures that the thermal conductivity is improved in the length direction and the thickness direction, realizes the uniformity of the thermal conductivity of the adhesive tape, is beneficial to heat diffusion, avoids local overheating of the adhesive tape, and improves the performance and the service life of the product.

Description

Be applied to heat radiation adhesive tape and the preparation technology thereof of electron device

Technical field

The present invention relates to a kind of heat radiation adhesive tape and preparation technology thereof who is applied to electron device, belong to the adhesive material technical field.

Background technology

Along with the fast development of electron trade, now from common desktop computer, to notebook computer, panel computer, smart mobile phone, scientific and technical innovation is advanced by leaps and bounds.Electronic product carries more and more lighting, and volume is more and more less, and function causes integrated level more and more higher from strength to strength like this.Cause like this volume dwindling, the function grow is large, directly causes the heat radiation of electronic devices and components to require more and more higher.And the fan type radiating that adopted in the past because volume is large, can produce the problems such as noise, is eliminated by market gradually.And then produced other heat sink material, such as Copper Foil, the heat radiation of aluminium foil class, but because resource-constrained, and expensive, radiating effect is good in the imagination not also, slowly, all seeking new efficient heat sink material.Secondly, because the diversity of electronic product, existing product often needs customization, thus the difficult popularization that is suitable for concrete use occasion and has limited its application; Therefore, if design a kind of for the electronic product characteristics have a high-performance heat radiation adhesive tape, become the direction that those of ordinary skills make great efforts.

Summary of the invention

The object of the invention provides a kind of heat radiation adhesive tape and preparation technology thereof who is applied to electron device, this heat radiation adhesive tape and preparation technology thereof have guaranteed that length and thickness direction have all improved thermal conductivity, and realized the homogeneity of adhesive tape heat conductivility, the adhesive tape local superheating is also avoided in the diffusion that both had been conducive to heat, has improved performance and the life-span of product; Secondly, product versatility and convenience can be applicable to the electronic product of different shape.

For achieving the above object, the first technical scheme that the present invention adopts is: a kind of heat radiation adhesive tape that is applied to electron device, comprise that a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with the heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and baking obtained after described heat-conducting glue adhesion coating was mixed by following parts by weight of component:

Acrylic ester adhesive 100,

Graphite Powder 99 50 ~ 150,

Solvent 200 ~ 300;

Solidifying agent 0.1 ~ 1,

Coupling agent 0.01 ~ 0.1;

Described acrylic ester adhesive is comprised of following parts by weight of component:

Butyl acrylate 100,

Benzoyl peroxide 0.1 ~ 1,

Isooctyl acrylate monomer 50 ~ 150,

Vinylformic acid 2 ~ 5,

Methyl methacrylate 10 ~ 30,

Vinyl acetate between to for plastic 0 ~ 10,

2-hydroxyethyl methacrylate 0.1 ~ 1;

The Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 100:100 ~ 300:10 ~ 100;

Described Graphite Powder 99 diameter is 3 ~ 6 microns.

Further improved plan is as follows in the technique scheme:

1, in the such scheme, the Thickness Ratio of described PET film, heat-conducting glue adhesion coating and aluminium foil layer is 100:200:100; Described Graphite Powder 99 diameter is 4 ~ 4.5 microns.

2, in the such scheme, described solvent mixes acquisition by the component of following weight percent:

Toluene 5 ~ 20%,

Ethyl acetate 30 ~ 70%,

Butanone 20 ~ 50%.

For achieving the above object, the second technical scheme that the present invention adopts is: a kind of preparation technology of above-mentioned heat radiation adhesive tape may further comprise the steps:

The first step: Graphite Powder 99, solvent are mixed according to the weight part ratio of 50 ~ 150:200 ~ 300, and stir the formation mixed solution 84 ~ 86 ℃ of conditions;

Second step: butyl acrylate, benzoyl peroxide, Isooctyl acrylate monomer, vinylformic acid, methyl methacrylate, vinyl acetate between to for plastic, 2-hydroxyethyl methacrylate are mixed with the mixed solution of the first step, and through high speed agitator dispersion 1 ~ 2 hour, thereby mix the formation mixing solutions;

The 3rd step: insulation after in reactor, the mixing solutions of second step being heated to 80 85 ℃, in insulating process, add a benzoyl peroxide minute for 1 ~ 3 time and obtain the gluing mixed solvent of heat conduction, described soaking time is 4 ~ 10 hours;

The 4th step: the gluing mixed solvent of heat conduction that the 3rd step obtained is coated the lower surface that upper surface has the PET film of aluminium foil layer;

The 5th step: the gluing mixed solvent of heat conduction in the 4th step is toasted formation heat-conducting glue adhesion coating;

The 6th step: with in the 5th step through another surperficial applying separated type material of heat-conducting glue adhesion coating of overbaking;

The 7th step: rolling.

Further improved plan is as follows in the technique scheme:

1, in the such scheme, the whipping temp of the described the first step is 85 ℃.

2, in the such scheme, described solvent is mixed by toluene 5 ~ 20%, ethyl acetate 30 ~ 70%, butanone 20 ~ 50%.

Because technique scheme is used, the present invention compared with prior art has following advantages and effect:

1, the present invention is applied to heat radiation adhesive tape and the preparation technology thereof of electron device, guaranteed that length and thickness direction have all improved thermal conductivity, and realized the homogeneity of adhesive tape heat conductivility, the adhesive tape local superheating is also avoided in the diffusion that both had been conducive to heat, has improved performance and the life-span of product;

2, the present invention adopt three kinds of certain content component as solvent, effectively avoided graphite granule agglomeration in the gluing system of subsequent technique acrylate, thereby be conducive to length and thickness direction heat conduction improves synchronously;

3, the present invention is specific according to its prescription, adopting diameter is that 36 microns graphite and Thickness Ratio are the heat conduction pad pasting of 10:10 30:1 10 the PET film, heat-conducting glue adhesion coating and the aluminium foil layer that superpose successively, taking into account existing pad pasting performance simultaneously, more be conducive to spread heat and the transmission of electron device, thereby that has further avoided the adhesive tape amount of localized heat concentrates the work-ing life of having improved product.

Description of drawings

Accompanying drawing 1 is applied to the thermal paste band structure synoptic diagram of electron device for the present invention;

Accompanying drawing 2 is that the content of toluene in the mixed solvent of the present invention is to the influence curve figure of thermal conductivity;

Accompanying drawing 3 is that the content of ethyl ester in the mixed solvent of the present invention is to the influence curve figure of thermal conductivity;

Accompanying drawing 4 is that the content of butanone in the mixed solvent of the present invention is to the graphic representation of thermal conductivity;

Accompanying drawing 5 is the influence curve figure of PET thickness of the present invention to heat conductivility;

Accompanying drawing 6 is the influence curve figure of churning time of the present invention to thermal conductivity;

Accompanying drawing 7 is impact (the stir 8H) graphic representation of rotating speed of the present invention on thermal conductivity.

In the above accompanying drawing: 1, PET film; 2, aluminium foil layer; 3, heat-conducting glue adhesion coating; 4, interleaving paper.

Embodiment

The invention will be further described below in conjunction with embodiment:

Embodiment: a kind of heat radiation adhesive tape that is applied to electron device, comprise that a thickness is 0.004mm ~ 0.025mmPET film, this PET film upper surface plating has an aluminium foil layer, PET film lower surface is coated with the heat-conducting glue adhesion coating, one interleaving paper is covered on another surface of heat-conducting glue adhesion coating, and baking obtained after described heat-conducting glue adhesion coating was mixed by following parts by weight of component:

Acrylic ester adhesive 100,

Graphite Powder 99 50 ~ 150,

Solvent 200 ~ 300;

Solidifying agent 0.1 ~ 1,

Coupling agent 0.01 ~ 0.1;

Butyl acrylate 100,

Benzoyl peroxide 0.1 ~ 1,

Isooctyl acrylate monomer 50 ~ 150,

Vinylformic acid 2 ~ 5,

Methyl methacrylate 10 ~ 30,

Vinyl acetate between to for plastic 0 ~ 10,

2-hydroxyethyl methacrylate 0.1 ~ 1;

Described Graphite Powder 99 diameter is 3 ~ 6 microns.

The Thickness Ratio of above-mentioned PET film, heat-conducting glue adhesion coating and aluminium foil layer is 100:200:100; Described Graphite Powder 99 diameter is 4 ~ 4.5 microns.

Above-mentioned solvent mixes acquisition by the component of following weight percent:

Toluene 4 ~ 20%,

Ethyl acetate 30 ~ 70%,

Butanone 20 ~ 50%.

Table 1

Figure 2012105517320100002DEST_PATH_IMAGE002A

Table 2

Figure 2012105517320100002DEST_PATH_IMAGE004

The preparation technology of the heat radiation adhesive tape of above-described embodiment may further comprise the steps:

The 7th step: rolling.

The whipping temp of the above-mentioned the first step is 85 ℃.

Above-mentioned solvent is mixed by toluene 5 ~ 20%, ethyl acetate 30 ~ 70%, butanone 20 ~ 50%.

Above-described embodiment only is explanation technical conceive of the present invention and characteristics, and its purpose is to allow the personage who is familiar with technique can understand content of the present invention and according to this enforcement, can not limit protection scope of the present invention with this.All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed within protection scope of the present invention.

Claims

1. A heat dissipation adhesive tape applied to electronic devices, characterized in that: it comprises a PET film with a thickness of 0.004mm ~ 0.025mm, the upper surface of the PET film is coated with an aluminum foil layer, and the lower surface of the PET film is coated with a thermally conductive adhesive layer. A release paper is pasted on the other surface of the thermally conductive adhesive layer, and the thermally conductive adhesive layer is obtained by mixing and baking the following components by weight:

Acrylate Adhesive 100,

Graphite powder 50~150,

Solvent 200~300;

Curing agent 0.1~1,

Coupling agent 0.01~0.1;

Described acrylate adhesive is made up of following components by weight:

Butyl Acrylate 100,

Benzoyl peroxide 0.1~1,

Isooctyl acrylate 50~150,

Acrylic acid 2~5,

Methyl methacrylate 10~30,

Vinyl acetate 0~10,

2-hydroxyethyl methacrylate 0.1~1;

The thickness ratio of the PET film, the thermally conductive adhesive layer and the aluminum foil layer is 100:100~300:10~100;

The diameter of the graphite powder is 3-6 microns.

2. The heat dissipation tape according to claim 1, characterized in that: the thickness ratio of the PET film, thermally conductive adhesive layer and aluminum foil layer is 100:200:100; the diameter of the graphite powder is 4-4.5 microns.

3. The thermal tape according to claim 1, characterized in that: The solvent is obtained by mixing components in the following percentages by weight:

Toluene 5~20%,

Ethyl acetate 30~70%,

Butanone 20~50%.

4. A preparation process for thermal tape according to claim 1, characterized in that: comprising the following steps:

Step 1: Mix graphite powder and solvent evenly according to the weight ratio of 50~150:200~300, and stir at 84~86°C to form a mixed solution;

The second step: mix butyl acrylate, benzoyl peroxide, isooctyl acrylate, acrylic acid, methyl methacrylate, vinyl acetate, 2-hydroxyethyl methacrylate with the mixture of the first step, and Disperse with a high-speed mixer for 1 to 2 hours, so as to mix evenly to form a mixed solution;

The third step: heat the mixed solution of the second step to 80~85°C in the reaction kettle and keep it warm, add benzoyl peroxide 1~3 times during the heat preservation process to obtain a thermally conductive adhesive mixed solvent, the heat preservation time 4~10 hours;

The fourth step: apply the thermally conductive adhesive mixed solvent obtained in the third step on the lower surface of the PET film with an aluminum foil layer on the upper surface;

Step 5: Bake the thermally conductive adhesive mixed solvent in the fourth step to form a thermally conductive adhesive layer;

Step 6: Attach the other surface of the thermally conductive adhesive layer baked in step 5 to the release material;

Step Seven: Winding up.

5. The preparation process according to claim 4, characterized in that: the stirring temperature of the first step is 85°C.

6. The preparation process according to claim 4, characterized in that: the solvent is formed by mixing 5-20% of toluene, 30-70% of ethyl acetate, and 20-50% of butanone.