CN103008711A

CN103008711A - Circuit board drilling alignment method

Info

Publication number: CN103008711A
Application number: CN2012105623391A
Authority: CN
Inventors: 唐海波; 黄广新; 吕红刚; 曾红
Original assignee: Dongguan Shengyi Electronics Co Ltd
Current assignee: Dongguan Shengyi Electronics Co Ltd
Priority date: 2012-12-21
Filing date: 2012-12-21
Publication date: 2013-04-03

Abstract

A circuit board drilling alignment method comprises at least one unit board and an auxiliary frame, wherein the unit board is provided with at least one inner layer graph provided with a target area, a target hole needs to be drilled in the target area, and the drilling alignment method of the target hole comprises the following steps: arranging a pin hole on the auxiliary frame for preliminary positioning, designing an X axis and a Y axis which are vertical to each other by taking the pin hole as a reference, arranging two targets on a target area on the unit plate, and distributing the targets outside the periphery of the target area; covering the whole target area by a rectangle which is a diagonal in the two targets; measuring the coordinate values of the actual X axis and the actual Y axis of each target by using an image sensor imaging technology, so as to calculate the expansion and contraction rate of the target area by combining the theoretical coordinate values of each coordinate, and then calculate the actual coordinate value of the target hole to be drilled by combining the theoretical coordinate values of the target hole; and drilling according to the calculated actual coordinate value of the target hole.

Description

The circuit boring alignment method

Technical field

The present invention relates to a kind of method of manufacturing circuit board, particularly relate to the boring alignment method in a kind of circuit board fabrication process.

Background technology

Along with making rapid progress of science and technology, electronic component trends towards microminiature and extra-thin future development more, and printed circuit board also trends towards high-accuracy figure more, and boring is also tended to strict with cooperating of figure.The method of pin (PIN) location is used in traditional circuit board processing equipment boring, and this PIN is positioned at periphery non-effective zone, whole plate.During boring, orientate benchmark as with this, default origin and the drilling program that comprises bore position.

Yet, when the method when only once holing, the precision of the theoretical bore position of its bore position and circuit board can be subject to the impact that this pin hole precision, the size contracting of whole plate rise and change; When to repeatedly when same position is holed,, PIN hole different because of the PIN hole repeatedly inserted pin and caused impaired or half-finished product plate changes in the size harmomegathus of holing between the flow process several times, cause follow-up hole site skew of boring larger, the position deviation that changes actual needs boring on the rear figure with harmomegathus is excessive, especially directly causes useless plate in the high zone of required precision.

Summary of the invention

In view of this, be necessary to provide high-precision boring alignment method in a kind of circuit board.

A kind of circuit boring alignment method, this circuit board comprises at least one cell board and is arranged on this cell board auxiliary frame on every side, this cell board has at least one inner figure, the inner figure of this cell board comprises that one has the target area of high-precision requirement, a target hole need to be bored in this target area, and the step of the boring alignment method of this target hole comprises:

S1: at described auxiliary frame one pin-and-hole is set and carries out Primary Location, and take this pin-and-hole as reference design orthogonal X-axis and Y-axis, at this cell board at least two targets are set in the target area, described target is distributed in the periphery outside of this target area, and writes down the X-axis of the relatively described pin-and-hole of each target and the theoretical coordinate value of Y-axis; Wherein has an X at least in the X-axis coordinate of each target _MAXGreater than the maximum in the X-axis coordinate of having a few in the described target area, has simultaneously an X at least _MINLess than the minimum of a value in the 40 interior X-axis coordinates of having a few of described target area; Has a Y in the Y-axis coordinate of each target at least _MAXGreater than the maximum in the Y-axis coordinate of having a few in the described target area, a Y is arranged simultaneously _MINLess than the minimum of a value in the Y-axis coordinate of having a few in the described target area;

S2: use the imageing sensor imaging technique to measure the actual coordinate value of described each target, thereby calculate the harmomegathus rate of this target area in conjunction with the theoretical coordinate value of each coordinate, the theoretical coordinate value in combining target hole calculates the actual coordinate value of the target hole that needs brill again;

S3: the actual coordinate value according to the target hole that calculates is holed.

Further, among the described step S2, with the X in the described target _MAXDeduct X _MINDraw a theoretical difference W, Y _MIN, calculate Y _MAX, Y _MINTheoretical difference be L, then measure X _MAX, X _MIN, Y _MAX, Y _MINCorresponding actual value also calculates actual difference, the actual difference of X-direction is drawn the harmomegathus rate of the X-axis of this target area divided by theoretical difference W, the actual difference of Y direction is drawn the harmomegathus rate of the Y-axis of this target area divided by theoretical difference L.

Further, among the described step S2, X-axis coordinate and X in the theoretical coordinate of described target hole _MINTheoretical difference be M, Y-axis coordinate and Y _MINTheoretical difference be N, this theory difference M be multiply by the harmomegathus rate of X-axis, described theoretical difference N be multiply by the harmomegathus rate of Y-axis, add respectively again the above X _MINAnd Y _MINThe actual coordinate value that correspondence is measured, thus draw the actual coordinate of this target hole.

Further, among the described step S1, the quantity of described target is two, contains whole target area take this two target as the rectangle at diagonal angle.

Further, described cell board also comprises an outer graphics, and this outer graphics and described inner figure are stacked, and described each target is arranged on this outer graphics.

Further, described cell board also comprises an outer graphics, and this outer graphics and described inner figure are stacked, and described each target is arranged on the inner figure, among the described step S1, uses X-RAY to bore target drone at each target placement drilling bore hole on each target.

A kind of circuit boring alignment method, this circuit board comprises at least one cell board and is arranged on this cell board auxiliary frame on every side, this cell board has at least one inner figure, the inner figure of this cell board comprises that one has the target area of high-precision requirement, there has been a target hole this target area, need to again hole on the physical location to this target hole, the step of the boring alignment method of this target hole comprises:

S4: when the same theory coordinate position carries out the n time (n 〉=2) boring, repeat S2 to S3.

S1: at described auxiliary frame one pin-and-hole is set and carries out Primary Location, and take this pin-and-hole as reference design orthogonal X-axis and Y-axis, at this cell board two targets are set in the target area, described target is distributed in the periphery outside of this target area, and writes down the X-axis of the relatively described pin-and-hole of each target and the theoretical coordinate value of Y-axis; Contain whole target area as the rectangle at diagonal angle in described two targets;

S2: use the imageing sensor imaging technique to measure the actual X-axis of described each target and the coordinate figure of Y-axis, thereby calculate the harmomegathus rate of this target area in conjunction with the theoretical coordinate value of each coordinate, the theoretical coordinate value in combining target hole calculates the actual coordinate value of the target hole that needs brill again;

Compared with prior art, this circuit boring alignment method has adopted the imageing sensor imaging technique, target placement to this former setting in zone before each boring detects, calculate this regional harmomegathus rate to compensate, thereby calculate the physical location of the hole harmomegathus of required brill, the impact of the harmomegathus of the circuit board that effectively having eliminated repeatedly holes causes.

Description of drawings

Fig. 1 is the floor map of circuit board of the present invention.

Fig. 2 is the cutaway view of circuit board of the present invention.

The specific embodiment

For technical scheme of the present invention can more clearly be showed, the invention will be further described below in conjunction with accompanying drawing.

As shown in Figures 1 and 2, method of manufacturing circuit board of the present invention is the boring alignment method to a circuit board 100.This circuit board 100 comprises a cell board 30 and the auxiliary frame 20 around cell board 30.Described cell board 30 comprises at least one inner figure 31 and two outer graphics 32.Described inner figure 31 is by described outer graphics sandwiched about in the of 32.This inner figure 31 has the high target area of a required precision 40.

In the first embodiment of the present invention, need in this target area 40, bore a target hole 60.The method of boring target hole 60 in this target area 40 may further comprise the steps:

S1: when the cell board 30 of this circuit board 100 is also done the boring processing, auxiliary frame 20 brills one pin-and-hole 21 at this circuit board 100 carries out Primary Location, designs two targets (MARK) 41,42 in the outside, edge of cell board 30 corresponding described target areas 40 simultaneously; In the present embodiment, this

target

41,42 is arranged on the outer graphics 32.In other embodiments, this

target

41,42 can be arranged on the described inner figure 31, needs use this moment X-RAY(X line) bores target drone and hole in the target 41 of outer graphics 32 corresponding described inner figures 31,42 position, as the

contraposition target

41,42 of formal boring;

In the present embodiment, the quantity of this target is two, this

target

41,42 selection principle be this

target

41,42 X-axis coordinate one of them be greater than maximum in the 40 interior X-axis coordinates of having a few of described target area, another one X-axis coordinate is less than the minimum of a value in the 40 interior X-axis coordinates of having a few of described target area; In like manner, one of them is greater than maximum in the 40 interior Y-axis coordinates of having a few of described target area this target 41,42 Y-axis coordinate, and another one is less than the minimum of a value in the 40 interior Y-axis coordinates of having a few of described target area; In the present embodiment, need contain whole high-precision requirement zone (such as dashed rectangle among Fig. 1) take described two

targets

41,42 as the rectangle at diagonal angle;

In other embodiments, the quantity of described target can be for more than three or three, at these targets all under the prerequisite in the outside, the edge of described target area 40, this moment, the selection principle of these targets was need to guarantee to have one at least greater than the maximum in the 40 interior X-axis coordinates of having a few of described target area in the X-axis coordinate of all targets, had simultaneously one at least less than the minimum of a value in the 40 interior X-axis coordinates of having a few of described target area; In like manner, have one at least greater than the maximum in the 40 interior Y-axis coordinates of having a few of described target area in the Y-axis coordinate of the target that the needs assurance is all, have simultaneously one less than the minimum of a value in the 40 interior Y-axis coordinates of having a few of described target area; When the X-axis coordinate that a plurality of targets are arranged during greater than the maximum in the 40 interior X-axis coordinates of described target area, choose the X-axis coordinate near the peaked target in the 40 interior X-axis coordinates of described target area; In like manner, when the X-axis that a plurality of targets are arranged or Y-axis coordinate meet the requirements, then choose X-axis coordinate or Y-axis coordinate near the fiducial value of correspondence; Four coordinate figures choosing out are defined as respectively X _MAX, X _MIN, Y _MAX, Y _MIN, these four coordinate figures can be on four four different points, also can be on three points or two points on;

In the present embodiment, described four values all on two points, X wherein _MIN, Y _MINBe X-axis and the Y-axis coordinate of target 41, X _MAX, Y _MAX, be X-axis and the Y-axis coordinate of target 42; Define simultaneously X _MAXWith X _MINTheoretical difference, be defined as width W; Definition Y _MAX, Y _MINTheoretical difference, be defined as length L;

S2: measure the actual coordinate of each target, and calculate the harmomegathus rate of X-direction of this target area 40 and the harmomegathus rate of Y direction according to the theoretical coordinate of each coordinate, thereby calculate the actual coordinate that calculates target hole 60;

Because the hot cold treatment meeting that may bore via hole or this circuit board intermediate process in other zones before boring target hole 60 has caused the contracting of circuit board 100 to rise.

X in the theoretical coordinate in target setting hole 60 in X-axis coordinate and the described target _MINThe difference of theoretical value that is the X-axis coordinate of the target 41 in the present embodiment is M and Y _MINBe the difference of theoretical value of the Y-axis coordinate of the target 41 in the present embodiment when being N, use first imageing sensor (Charged Coupled Device is called for short CCD) imaging technique, accurately catch described

target

41,42, actual coordinate X ₄₁, Y ₄₁, X ₄₂, Y ₄₂, with the actual coordinate X of target 42 ₄₂Deduct the actual X-axis coordinate X of target 41 ₄₁, be described width W with the actual difference calculated divided by the difference that the X-axis theoretical coordinate of target 42 deducts the theoretical X-axis coordinate of target 41, draw described regional 40 X-axis harmomegathus rate L _X, that is: L _x=(X ₄₂-X ₄₁)/W; In like manner, can draw the Y-axis harmomegathus rate L in this zone 40 _Y=(Y ₄₂-Y ₄₁)/L, wherein L is that the difference that the Y-axis theoretical coordinate of target 42 deducts the theoretical Y-axis coordinate of target 41 is described length L; Calculate the actual coordinate of target hole 60, method be with this mark hole 60 multiply by X-axis harmomegathus rate with the theoretical difference M of the X-axis of target 41, Y-axis theory difference N multiply by Y-axis harmomegathus rate, adds respectively the coordinate figure of target 41, i.e. X again ₆₀=X ₄₁+ L _X* M, Y ₆₀=Y ₄₁+ L _Y* N;

S3: according to the coordinate X of the target hole 60 that calculates ₆₀And Y ₆₀Hole.

After target hole 60 is finished boring, need to when other local borings in zone 40, repeat the step of S2, calculate before the boring should zone 40 the harmomegathus rate, thereby calculate the actual coordinate value in conjunction with the theoretical value in this hole, carry out actual boring.

The present invention has adopted the CCD imaging technique, target placement to this former setting in zone before each boring detects, calculate this regional harmomegathus rate to compensate, thereby calculate the physical location of the hole harmomegathus of required brill, the impact of the harmomegathus of the circuit board that effectively having eliminated repeatedly holes causes.

In second embodiment, when the same position in the hole of having bored in the described target area 40 of needs is again boring on the identical coordinate, as when boring shoulder hole or back drill hole etc., 40 to bore the method for target hole 60 similar in the target area for this method that repeats to hole at same position and above-mentioned the first embodiment, and may further comprise the steps:

S1: auxiliary frame brill one pin-and-hole at this circuit board carries out Primary Location, designs at least two targets in the outside, edge of the corresponding described target area of cell board simultaneously;

S2: use the imageing sensor imaging technique to measure the actual coordinate value of described each target, thereby calculate the harmomegathus rate of the target area of this circuit board in conjunction with the theoretical coordinate value of each coordinate, calculate again the actual coordinate value of the target hole that needs brill;

S3: the actual coordinate value according to the target hole that calculates is holed;

S4: when same coordinate position carries out the n time (n 〉=2) boring, repeat S2 to S3.

The above embodiment has only expressed one embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to claim of the present invention.Should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims

1. A circuit board drilling alignment method, the circuit board includes at least one unit board and an auxiliary frame arranged around the unit board, the unit board has at least one inner layer pattern, and the inner layer pattern of the unit board includes a There is a target area with high precision requirements, the target area needs to drill a target hole, and the steps of the drilling alignment method of the target hole include:

S1: Set a pin hole on the auxiliary frame for preliminary positioning, and use the pin hole as a reference to design mutually perpendicular X-axis and Y-axis, set at least two targets on the target area of the unit board, the target The targets are distributed outside the periphery of the target area, and the theoretical coordinate values of each target relative to the X-axis and Y-axis of the pin hole are recorded; wherein at least one X _MAX of each target's X-axis coordinates is greater than the target The maximum value in the X-axis coordinates of all points in the area, and at least one XMIN is smaller than the minimum value in the X-axis coordinates of all points in the target area 40; at least one Y _MAX in the Y-axis coordinates of each target is greater than The maximum value of the Y-axis coordinates of all points in the target area, and a Y _MIN smaller than the minimum value of the Y-axis coordinates of all points in the target area;

S2: Use the image sensor imaging technology to measure the actual coordinate values of the targets, so as to calculate the expansion and contraction rate of the target area in combination with the theoretical coordinate values of each coordinate, and then calculate the target to be drilled in combination with the theoretical coordinate values of the target hole The actual coordinate value of the hole;

S3: Drilling holes according to the calculated actual coordinate values of the target holes.

2. The circuit board drilling alignment method according to claim 1, characterized in that: in the step S2, subtract X _MIN from X _MAX in the target to obtain a theoretical difference W, Y _MIN , calculate the theoretical difference of Y _MAX and Y _MIN as L, then measure the actual values corresponding to X _MAX , X _MIN , Y _MAX , and Y _MIN and calculate the actual difference, and divide the actual difference in the X-axis direction by the theoretical The difference W is used to obtain the X-axis expansion and contraction rate of the target area, and the actual difference in the Y-axis direction is divided by the theoretical difference L to obtain the Y-axis expansion and contraction rate of the target area.

3. The circuit board drilling alignment method as claimed in claim 2, characterized in that: in the step S2, the theoretical difference between the X-axis coordinate and X _MIN in the theoretical coordinates of the target hole is M, Y-axis The theoretical difference between coordinates and Y _MIN is N, multiply the theoretical difference M by the expansion and contraction rate of the X-axis, multiply the theoretical difference N by the expansion and contraction rate of the Y-axis, and then add the X _MIN and Y _MIN correspond to the measured actual coordinates, so as to obtain the actual coordinates of the target hole.

4. The circuit board drilling alignment method according to claim 1, characterized in that: in the step S1, the number of the targets is two, and the rectangle with the two targets as diagonals covers the entire target area .

5. The circuit board drilling alignment method according to claim 1, characterized in that: the unit board also includes an outer pattern, the outer pattern is stacked with the inner pattern, and each target is set on that outer graphic.

6. The circuit board drilling alignment method according to claim 1, characterized in that: the unit board also includes an outer pattern, the outer pattern is stacked with the inner pattern, and each target is set On the inner layer graphics, in the step S1, each target is drilled with an X-RAY drilling machine at each target position.

7. A circuit board drilling alignment method, the circuit board includes at least one unit board and an auxiliary frame arranged around the unit board, the unit board has at least one inner layer pattern, the inner layer pattern of the unit board includes a For a target area with high precision requirements, the target area already has a target hole, and it needs to be drilled again at the actual position of the target hole. The steps of the drilling alignment method for the target hole include:

S1: Set a pin hole on the auxiliary frame for preliminary positioning, and use the pin hole as a reference to design mutually perpendicular X-axis and Y-axis, set at least two targets on the target area of the unit board, the target The targets are distributed outside the periphery of the target area, and the theoretical coordinate values of each target relative to the X-axis and Y-axis of the pin hole are recorded; wherein at least one X _MAX of each target's X-axis coordinates is greater than the target The maximum value of the X-axis coordinates of all points in the area, and at least one X _MIN is smaller than the minimum value of the X-axis coordinates of all points in the target area 40; there is at least one Y _MAX in the Y-axis coordinates of each target greater than the maximum value of the Y-axis coordinates of all points in the target area, and a Y _MIN smaller than the minimum value of the Y-axis coordinates of all points in the target area;

S4: When the nth (n≥2) drilling is performed at the same theoretical coordinate position, repeat S2 to S3.

8. The circuit board drilling alignment method according to claim 7, characterized in that: in the step S2, subtracting X _MIN from X _MAX in the target to obtain a theoretical difference W, Y _MIN , calculate the theoretical difference of Y _MAX and Y _MIN as L, then measure the actual values corresponding to X _MAX , X _MIN , Y _MAX , and Y _MIN and calculate the actual difference, and divide the actual difference in the X-axis direction by the theoretical The difference W is used to obtain the X-axis expansion and contraction rate of the target area, and the actual difference in the Y-axis direction is divided by the theoretical difference L to obtain the Y-axis expansion and contraction rate of the target area.

9. The circuit board drilling alignment method according to claim 8, characterized in that: in the step S2, the theoretical difference between the X-axis coordinate and X _MIN in the theoretical coordinates of the target hole is M, Y-axis The theoretical difference between coordinates and Y _MIN is N, multiply the theoretical difference M by the expansion and contraction rate of the X-axis, multiply the theoretical difference N by the expansion and contraction rate of the Y-axis, and then add the X _MIN and Y _MIN correspond to the measured actual coordinates, so as to obtain the actual coordinates of the target hole.

10. A circuit board drilling alignment method, the circuit board includes at least one unit board and an auxiliary frame arranged around the unit board, the unit board has at least one inner layer pattern, the inner layer pattern of the unit board includes a There is a target area with high precision requirements, the target area needs to drill a target hole, and the steps of the drilling alignment method of the target hole include:

S1: Set a pin hole on the auxiliary frame for preliminary positioning, and use the pin hole as a reference to design mutually perpendicular X-axis and Y-axis, set two targets on the target area of the unit board, the target Distributed outside the periphery of the target area, and write down the theoretical coordinate values of each target relative to the X-axis and Y-axis of the pin hole; the diagonal rectangle in the two targets covers the entire target area;

S2: Use image sensor imaging technology to measure the actual X-axis and Y-axis coordinate values of each target, so as to calculate the expansion and contraction rate of the target area by combining the theoretical coordinate values of each coordinate, and then combine the theoretical coordinate values of the target hole Calculate the actual coordinate value of the target hole to be drilled;