CN102967817A - Testing system and testing method for chip audio module - Google Patents
Testing system and testing method for chip audio module Download PDFInfo
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Abstract
The invention relates to an audio testing technology and particularly discloses a testing system and testing method for a chip audio module. An analog to digital converter (ADC) module testing and a digital to analog converter (DAC) module testing are combined together by utilizing module performances of a chip, a DAC module is utilized to play standard audio signals, and the signals are collected through an ADC module to be analyzed, so that whether the chip audio module is qualified is judged. Due to the fact that limitation of a test instrument is got rid of, automatic testing of mass production chips is achieved well, and the testing system and the testing method are favorable for improving quality of the produced chips.
Description
Technical field
The present invention relates to the audio-frequency test technology, relate in particular to a kind of chip audio-frequency module testing system and method for testing.
Background technology
Chip checking is the necessary links that guarantees chip functions, for DAC module (Digital-to-Analog Conversion in AUDIO (audio frequency) module, digital to analog converter) with ADC module (Analog-to-Digital Conversion, analog to digital converter) in the checking, the instrument that need to use comprises the multiple instrument and equipments such as audio analyzer, signal generator, PC, complicated operation, can not carry out to the volume production chip every test, the AUDIO functions of modules performance of every chip block that can guarantee thus to flow to market is normal.
Particularly, existing DAC module and ADC module test method normally separate two parts with the DAC module with the ADC module to be tested: during to the DAC module testing, it is sinusoidal wave at first to play 1k with the DAC module, then remove to analyze the signal quality of output in the accessing to audio analyser, obtain the index of signal, whether more qualified with standard value; During to the ADC module testing, produce the sine wave of 1KHZ with signal generator, then with the ADC module of signal access chip, import data into computer after the ADC image data, the routine analyzer that utilization is relevant comes the data analysis to obtaining, calculate quality indication signal, whether more qualified with standard.Because this method need to be used multiple instrument and equipment, operation is comparatively complicated, can not test every chip of volume production, affects thus AUDIO module quality.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of chip audio-frequency module testing system and method for testing, realize the chip automatic test, guarantee preferably the chip product quality.
For solving above technical matters, technical scheme provided by the invention is, a kind of chip audio-frequency module testing system, chip comprises that CPU (central processing unit), ADC module reach and the DAC module, be connected by an external circuit between ADC module and the DAC module, wherein: the DAC module is used for the playing standard sound signal, obtains the DAC play signal; The ADC module is used for gathering the DAC play signal, obtains the ADC image data; CPU (central processing unit) is used for calculating according to preset strategy the performance index of ADC image data, and compares with the respective standard value, and whether the analysis chip audio-frequency module is qualified.
More preferably, comprise storer, be used for writing the ADC image data, process for CPU (central processing unit).
More preferably, memory stores has the standard audio signal of making in advance.
More preferably, the standard audio signal is sine wave signal.
More preferably, the frequency of sine wave signal is 1～3KHZ.
More preferably, external circuit is coupled circuit.
More preferably, coupled circuit comprises a coupling capacitance.
On this basis, the present invention is corresponding to provide a kind of chip audio-frequency module method of testing, comprising:
DAC module playing standard sound signal obtains the DAC play signal;
The ADC module gathers the DAC play signal, obtains the ADC image data;
CPU (central processing unit) is calculated the performance index of ADC image data according to preset strategy, and compares with the respective standard value, and whether the analysis chip audio-frequency module is qualified.
More preferably, pre-stored sine wave signal is as the standard audio signal.
More preferably, proportion is that 1～3KHZ sine wave signal is as the standard audio signal.
Compared with prior art, the present invention combines ADC module and two kinds of tests of DAC module, namely utilizes DAC module playing standard sound signal, then by the ADC module signals collecting is returned to analyze, judge that thus whether the chip audio-frequency module is qualified, can realize the test of every chip.The present invention utilizes the module of chip self, breaks away from the restriction of testing tool, has realized preferably the automatic test to chip.When the chip volume production, add this test, but the quality of Effective Raise shipment chip.
Description of drawings
Fig. 1 is the external wiring diagram of chip audio-frequency module testing system of the present invention;
Fig. 2 is the theory diagram of chip audio-frequency module testing system of the present invention;
Fig. 3 is the process flow diagram of chip audio-frequency module method of testing of the present invention.
Embodiment
Core concept of the present invention is, utilizes the DAC module to go the playing standard sound signal, and the ADC module returns to analyze with signals collecting, judges thus whether the chip audio-frequency module is qualified, realizes preferably the automatic test of every chip.
Based on above-mentioned basic conception, technical solution of the present invention comprises hardware and software two parts, and the detailed problem that wherein need consider comprises: it is clean how to protect the signal of levying normal chip DAC module generation; The signal that how the DAC module is produced gathers again; How the signal of returning of sampling is analyzed; And, how to shorten sampling is returned signal analysis the time time of consuming.
Particularly, for addressing these problems, the overall technical architecture of preferred embodiment of the present invention is divided into following step and finishes:
1, at first makes sinusoidal wave data, will protect the quality of levying signal and complete in manufacturing process, offer the DAC module and play.
2, write the driver of chip DAC module and ADC module, guarantee to make the chip normal play to go out sine wave and normal collection signal.
3, connect hardware, signal is taken back the ADC module of chip, make the sine wave signal of broadcast gather by the ADC module, as shown in Figure 1 external wiring diagram.
4, write DAP, in order to realize FFT (Fast Fourier Transformation, be fast Fourier transform), SNR (signal to noise ratio (S/N ratio), be called again signal to noise ratio, be the voltage and the ratio of noise voltage of output simultaneously of the output signal of amplifier, decibels commonly used represents), THD (Total HarmonicDistortion, total harmonic distortion, the level of the harmonic wave that the expression sound device produces) calculates.
5, the data that collect are kept among the RAM (Random Access Memory, random memory unit) of system, and chip self-operating routine analyzer can advance to analyze to these data, calculates the indexs such as SNR and THD.
6, compare with standard value, draw whether conclusion of qualified product.
In order to make those skilled in the art understand better technical scheme of the present invention, the present invention is described in further detail below in conjunction with the drawings and specific embodiments.
Referring to Fig. 2, represent the theory diagram of chip audio-frequency module testing system of the present invention.This test macro comprises chip 100, storer 200 and external circuit 300, and wherein: chip 100 comprises that CPU (central processing unit) 101, ADC module 102 reach and DAC module 103; Be connected by external circuit 300 between ADC module 102 and the DAC module 103; More preferably, external circuit 300 is the coupled circuit that comprises coupling capacitance C.Below respectively each ingredient of this test macro is described:
DAC module 103 disposes corresponding audio frequency and plays driver, is used for the playing standard sound signal, obtains DAC and broadcasts and revolve signal, gathers voice datas in order to be connected to ADC module 102;
ADC module 102 disposes corresponding audio collection driver, is used for gathering the DAC play signal, obtains the ADC image data, calculates, analyzes for CPU (central processing unit) 101;
CPU (central processing unit) 101 is used for according to preset strategy (algorithm), and the ADC image data is calculated, and obtains ADC image data performance index, and compares with the respective standard value, and whether the analysis chip audio-frequency module is qualified.
Comprise storer 200 in the present embodiment, it can write the ADC image data, carries out subsequent analysis for CPU (central processing unit) 101 and processes.Especially, the sinusoidal wave standard audio signal that its storage is made in advance, optimized frequency is 1KHZ, tests, compares by this signal, namely obtains whether qualified conclusion of chip quality.
In the present embodiment, directly be connected by coupling capacitance C between DAC module 103 and the ADC module 102, realize thus: utilize DAC module 103 to go the playing standard sound signal, ADC module 102 returns to analyze with signals collecting, confirms finally whether the chip audio-frequency module is qualified.Because storage unit 200 stores the standard audio signal, thereby need not by external test facility, just can analyze quickly, whether compare the chip audio-frequency module qualified.
This shows, in the described test macro of above-described embodiment, utilize the modular character of chip self, can realize the automatic test to chip.Owing to broken away from the restriction of testing tool, thereby all added this test in the time of making the chip volume production, be conducive to improve the quality of shipment chip.
Referring to Fig. 3, represent the process flow diagram of chip audio-frequency module method of testing of the present invention, be specially:
By DAC module playing standard sound signal, obtain the DAC play signal, this standard audio signal is the sine wave signal of making in advance that is stored in memory inside, its calibration is 1～3KHZ (step S301);
This DAC play signal taken back to the ADC module gather, obtain ADC image data (step S302);
, obtained the performance index of ADC image data, and compare with the respective standard value according to according to pre-defined algorithm the ADC image data being calculated by CPU (central processing unit), whether the analysis chip audio-frequency module qualified (step 303～S305).
This method of testing can realize the test of chip DAC modules A DC module quickly, has broken away from preferably the restriction of testing tool.The method has been applied to guarantee preferably the quality of chip shipment originally in the BBT test of chip at present.
Below only be preferred implementation of the present invention, its key is to realize the logic of hardware, software algorithm and the whole flow process of DAC module and DC module automatic test.Be pointed out that in passing for chip product: one of them is not up to standard to need only DAC module or ADC module, judges that all the chip audio-frequency module does not meet performance index, and judges that further whole chip quality is defective.Therefore, the present invention does as a whole the test with DAC module and ADC module, and judges that no longer the defective generation reason of chip quality is DAC module or ADC module.
Should be pointed out that above-mentioned preferred implementation should not be considered as limitation of the present invention, protection scope of the present invention should be as the criterion with the claim limited range.For those skilled in the art, without departing from the spirit and scope of the present invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (10)
1. chip audio-frequency module testing system, chip comprise CPU (central processing unit), ADC module and with the DAC module, it is characterized in that, be connected by an external circuit between ADC module and the DAC module, wherein: the DAC module is used for the playing standard sound signal, obtains the DAC play signal; The ADC module is used for gathering the DAC play signal, obtains the ADC image data; CPU (central processing unit) is used for calculating according to preset strategy the performance index of ADC image data, and compares with the respective standard value, and whether the analysis chip audio-frequency module is qualified.
2. chip audio-frequency module testing system as claimed in claim 1 is characterized in that, comprises storer, is used for writing the ADC image data, processes for CPU (central processing unit).
3. chip audio-frequency module testing system as claimed in claim 2 is characterized in that, memory stores has the standard audio signal of making in advance.
4. chip audio-frequency module testing system as claimed in claim 3 is characterized in that, the standard audio signal is sine wave signal.
5. chip audio-frequency module testing system as claimed in claim 4 is characterized in that, the frequency of sine wave signal is 1～3KHZ.
6. such as the described chip audio-frequency module testing system of claim 1～5, it is characterized in that external circuit is coupled circuit.
7. chip audio-frequency module testing system as claimed in claim 6 is characterized in that, coupled circuit comprises a coupling capacitance.
8. a chip audio-frequency module method of testing is characterized in that, comprising:
DAC module playing standard sound signal obtains the DAC play signal;
The ADC module gathers the DAC play signal, obtains the ADC image data;
CPU (central processing unit) is calculated the performance index of ADC image data according to preset strategy, and compares with the respective standard value, and whether the analysis chip audio-frequency module is qualified.
9. chip audio-frequency module method of testing as claimed in claim 8 is characterized in that pre-stored sine wave signal is as the standard audio signal.
10. chip audio-frequency module method of testing as claimed in claim 9 is characterized in that, proportion is that 1～3KHZ sine wave signal is as the standard audio signal.
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104422865A (en) * | 2013-08-22 | 2015-03-18 | 上海海尔集成电路有限公司 | Wafer-level one time programmable (OTP) chip test method and device |
| CN106054058A (en) * | 2016-04-28 | 2016-10-26 | 芯海科技（深圳）股份有限公司 | System and method capable of performing testing and temperature control on multiple Sigma-Delta ADC chips |
| CN103747407B (en) * | 2013-12-27 | 2017-04-12 | 深圳英飞拓科技股份有限公司 | Audio module automatic test method based on FFT frequency sweep |
| CN107111538A (en) * | 2014-12-19 | 2017-08-29 | 杜比实验室特许公司 | Audio benchmark with simulated audio real-time processing |
| CN107340054A (en) * | 2017-06-23 | 2017-11-10 | 歌尔科技有限公司 | A kind of method and apparatus for testing acoustic product noise |
| CN108064347A (en) * | 2017-11-28 | 2018-05-22 | 福建联迪商用设备有限公司 | The audio pin test method and test device of communication module |
| CN110825567A (en) * | 2019-07-17 | 2020-02-21 | 深圳芯智汇科技有限公司 | Test system and test method of audio chip |
| CN111065039A (en) * | 2020-03-18 | 2020-04-24 | 延锋伟世通电子科技（南京）有限公司 | Universal audio analysis system based on Dirana3 |
| CN112566005A (en) * | 2021-02-25 | 2021-03-26 | 易兆微电子(杭州)股份有限公司 | Audio chip testing method and device, electronic equipment and storage medium |
| CN112995880A (en) * | 2021-01-18 | 2021-06-18 | 讯喆微电子(合肥)有限公司 | Automatic testing system and method for audio module |
| CN113759194A (en) * | 2021-08-16 | 2021-12-07 | 国微集团(深圳)有限公司 | Human body signal collecting and generating device |
| CN113946476A (en) * | 2020-07-16 | 2022-01-18 | 北京君正集成电路股份有限公司 | Method for testing functions of system-on-chip audio codec |
| CN117198373A (en) * | 2023-09-26 | 2023-12-08 | 深圳市爱普泰科电子有限公司 | A method for automatic performance evaluation and calculation of production and testing audio IC playback and recording channels |
| CN118245384A (en) * | 2024-05-21 | 2024-06-25 | 深圳市爱普泰科电子有限公司 | Audio signal data management system and method of audio chip |
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| CN104422865A (en) * | 2013-08-22 | 2015-03-18 | 上海海尔集成电路有限公司 | Wafer-level one time programmable (OTP) chip test method and device |
| CN103747407B (en) * | 2013-12-27 | 2017-04-12 | 深圳英飞拓科技股份有限公司 | Audio module automatic test method based on FFT frequency sweep |
| CN107111538B (en) * | 2014-12-19 | 2020-05-19 | 杜比实验室特许公司 | Audio benchmarking with simulated audio real-time processing |
| CN107111538A (en) * | 2014-12-19 | 2017-08-29 | 杜比实验室特许公司 | Audio benchmark with simulated audio real-time processing |
| CN106054058A (en) * | 2016-04-28 | 2016-10-26 | 芯海科技（深圳）股份有限公司 | System and method capable of performing testing and temperature control on multiple Sigma-Delta ADC chips |
| CN106054058B (en) * | 2016-04-28 | 2019-01-25 | 芯海科技（深圳）股份有限公司 | One kind can be to multiple sigma-delta ADC chip testings and temperature controlled system and method |
| CN107340054A (en) * | 2017-06-23 | 2017-11-10 | 歌尔科技有限公司 | A kind of method and apparatus for testing acoustic product noise |
| CN107340054B (en) * | 2017-06-23 | 2020-02-07 | 歌尔科技有限公司 | Method and device for testing noise of acoustic product |
| CN108064347A (en) * | 2017-11-28 | 2018-05-22 | 福建联迪商用设备有限公司 | The audio pin test method and test device of communication module |
| CN110825567A (en) * | 2019-07-17 | 2020-02-21 | 深圳芯智汇科技有限公司 | Test system and test method of audio chip |
| CN111065039A (en) * | 2020-03-18 | 2020-04-24 | 延锋伟世通电子科技（南京）有限公司 | Universal audio analysis system based on Dirana3 |
| CN111065039B (en) * | 2020-03-18 | 2020-09-25 | 延锋伟世通电子科技（南京）有限公司 | Universal audio analysis system based on Dirana3 |
| CN113946476A (en) * | 2020-07-16 | 2022-01-18 | 北京君正集成电路股份有限公司 | Method for testing functions of system-on-chip audio codec |
| CN112995880A (en) * | 2021-01-18 | 2021-06-18 | 讯喆微电子(合肥)有限公司 | Automatic testing system and method for audio module |
| CN112566005A (en) * | 2021-02-25 | 2021-03-26 | 易兆微电子(杭州)股份有限公司 | Audio chip testing method and device, electronic equipment and storage medium |
| CN112566005B (en) * | 2021-02-25 | 2021-07-16 | 易兆微电子(杭州)股份有限公司 | Audio chip testing method and device, electronic equipment and storage medium |
| CN113759194A (en) * | 2021-08-16 | 2021-12-07 | 国微集团(深圳)有限公司 | Human body signal collecting and generating device |
| CN113759194B (en) * | 2021-08-16 | 2024-06-04 | 国微集团(深圳)有限公司 | Human body signal collecting and generating device |
| CN117198373A (en) * | 2023-09-26 | 2023-12-08 | 深圳市爱普泰科电子有限公司 | A method for automatic performance evaluation and calculation of production and testing audio IC playback and recording channels |
| CN118245384A (en) * | 2024-05-21 | 2024-06-25 | 深圳市爱普泰科电子有限公司 | Audio signal data management system and method of audio chip |
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| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: 510555 No. 107 Bowen Road, Huangpu District, Guangzhou, Guangdong Patentee after: Guangzhou Ankai Microelectronics Co.,Ltd. Address before: 510663 3rd floor, area C1, innovation building, 182 science Avenue, Guangzhou Science City, Luogang District, Guangzhou City, Guangdong Province Patentee before: Guangzhou Ankai Microelectronics Co.,Ltd. |