CN102956807A - Efficiently integrated LED (Light Emitting Diode) light source - Google Patents
Efficiently integrated LED (Light Emitting Diode) light source Download PDFInfo
- Publication number
- CN102956807A CN102956807A CN2012104858915A CN201210485891A CN102956807A CN 102956807 A CN102956807 A CN 102956807A CN 2012104858915 A CN2012104858915 A CN 2012104858915A CN 201210485891 A CN201210485891 A CN 201210485891A CN 102956807 A CN102956807 A CN 102956807A
- Authority
- CN
- China
- Prior art keywords
- light source
- led
- wiring board
- circuit board
- led light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000012431 wafers Nutrition 0.000 claims abstract description 22
- 230000010354 integration Effects 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 4
- 239000000084 colloidal system Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 12
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000011031 large-scale manufacturing process Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 4
- 241000218202 Coptis Species 0.000 description 2
- 235000002991 Coptis groenlandica Nutrition 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 206010034703 Perseveration Diseases 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
Images
Landscapes
- Led Device Packages (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The invention relates to an efficiently integrated LED (Light Emitting Diode) light source which comprises a radiator, LED wafers and a circuit board, wherein the radiator is fixedly provided with a plurality of the LED wafers which are arranged in an array way; the circuit board is provided with anode and cathode connecting wires which are used for conducting the LED wafers; the LED wafers are welded with the connecting wires of the circuit board in an abutting way, so that anodes and cathodes of the LED wafers are connected in series and in parallel; and the circuit board is in a shape of a square net. The efficiently integrated LED light source has the advantages of good heat conducting effect, high radiating performance, simplicity in packaging, high luminous efficiency of the light source, long service life of a lamp, simple manufacturing process, low production cost, easiness in large-scale production, strong applicability and versatility, good practicability and the like, and the efficiently integrated LED light source is favorable for popularization and application of the LED lamp.
Description
Technical field
The invention belongs to the luminescent device technical field, what be specifically related to is a kind of highly effective integration led light source.
Background technology
Along with popularizing and development of LED semiconductor lighting, the demand of LED integrated optical source is also increasing, improves the heat conduction and heat radiation of LED integrated optical source, reduces packaging cost and becomes the focus that the art professional and technical personnel pays close attention to.Existing led light source is that led chip is installed on the temperature-uniforming plate, temperature-uniforming plate is to run into cold meeting in a kind of internal volume that utilizes capillarity the molecule of heating power water to be sent to copper coin go into water droplet, the perseveration that so goes round and begins again reaches the function of heat conduction, some chips are gone up on samming version surface admittedly, put with wiring board made of copper again, form chip and in the middle of the copper wiring board, stamp loop of gold thread stroke, played fluorescent material glue etc. on this space cloth that still has living space behind the gold thread on the copper circuit board, but because general led support more complicated, relative cost is high, increased the weight of in process of production the cost of manufacturing enterprise, disadvantaged business enterprise long-run development and volume production fast, and this led light source in use, need led light source directly is fixed in directly heat radiation on the radiator by the samming version, but owing to having minused the medium of support and heat conductive silica gel between led chip and the radiator, affected the useful life of LED heat radiation and light source.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, a kind of simple in structure, the heat conduction and heat radiation performance is good, production cost reduces highly effective integration led light source is provided.
For achieving the above object, technical solution of the present invention is: a kind of highly effective integration led light source, include radiator, LED wafer and wiring board, be fixed with several LED wafers of arrayed on the described radiator, described wiring board is provided with the both positive and negative polarity line for conducting LED wafer, the line of LED wafer and wiring board is mounted welding, make the both positive and negative polarity connection in series-parallel of LED wafer.
Preferably, described wiring board is the square net shape.
Preferably, scribble the fluorescent material colloid mixture on the described wiring board.
Preferably, described wiring board is one of ceramic circuit-board, aluminum-based circuit board plate, copper base circuit board.
Preferably, the profile of described radiator is square.
By adopting above-mentioned technical scheme, the invention has the beneficial effects as follows: led light source of the present invention lead have good heat conduction effect, heat dispersion is high, encapsulation is simple, the luminance of light source is high, the advantages such as long service life of light fixture, its manufacture craft is simple, production cost reduces and be easy to the scale volume production, application, highly versatile, practicality is good, is conducive to applying of LED lighting.
Description of drawings
Fig. 1 is structural representation of the present invention.
Embodiment
Further specify the present invention below in conjunction with the drawings and specific embodiments.
As shown in Figure 1, a kind of highly effective integration led light source of the present invention, include radiator 1, LED wafer 2 and wiring board 3, the profile of described radiator 1 is square, be fixed with several LED wafers 2 of arrayed on the described radiator 2, described wiring board 3 is provided with the both positive and negative polarity line for conducting LED wafer 2, wiring board 3 is set circuit according to the number of LED wafer 2, the line of LED wafer 2 and wiring board 3 is mounted welding, make the both positive and negative polarity connection in series-parallel of LED wafer 2, described wiring board 3 is the square net shape, itself and LED wafer 2 form led array, be coated with the fluorescent material colloid mixture on the described wiring board 3, make led light source send white light, described wiring board 3 is the copper base circuit board of high heat conduction, its good heat conduction effect, heat dispersion is high, encapsulation is simple, the luminance of light source is high, the long service life of light fixture, manufacture craft is simple, production cost reduces, be easy to the scale volume production, be conducive to applying of LED lighting.
Above-described, only be a preferred embodiment of the present invention, can not limit scope of the invention process, every equalization of doing according to the present patent application claim changes and decorates, and all should still belong in the scope that the present invention contains.
Claims (5)
1. highly effective integration led light source, include radiator (1), LED wafer (2) and wiring board (3), it is characterized in that: several LED wafers (2) that are fixed with arrayed on the described radiator (2), described wiring board (3) is provided with the both positive and negative polarity line for conducting LED wafer (2), the line of LED wafer (2) and wiring board (3) is mounted welding, make the both positive and negative polarity connection in series-parallel of LED wafer (2).
2. highly effective integration led light source according to claim 1 is characterized in that: described wiring board (3) is the square net shape.
3. highly effective integration led light source according to claim 1 and 2, it is characterized in that: described wiring board scribbles the fluorescent material colloid mixture on (3).
4. highly effective integration led light source according to claim 1 and 2 is characterized in that: described wiring board (3) is one of ceramic circuit-board, aluminum-based circuit board plate, copper base circuit board.
5. highly effective integration led light source according to claim 1 is characterized in that: the profile of described radiator (1) is square.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104858915A CN102956807A (en) | 2012-11-26 | 2012-11-26 | Efficiently integrated LED (Light Emitting Diode) light source |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104858915A CN102956807A (en) | 2012-11-26 | 2012-11-26 | Efficiently integrated LED (Light Emitting Diode) light source |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102956807A true CN102956807A (en) | 2013-03-06 |
Family
ID=47765324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104858915A Pending CN102956807A (en) | 2012-11-26 | 2012-11-26 | Efficiently integrated LED (Light Emitting Diode) light source |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102956807A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109657849A (en) * | 2018-12-07 | 2019-04-19 | 桂林电子科技大学 | A kind of LED light array wiring method of Excavation Cluster Based on Network Analysis method |
| CN109802027A (en) * | 2019-02-22 | 2019-05-24 | 佛山市国星光电股份有限公司 | A kind of light source module group and its manufacturing method and its die cutting die |
| CN112885866A (en) * | 2021-03-19 | 2021-06-01 | 常州亚玛顿股份有限公司 | MicroLED photovoltaic composite display screen, preparation method thereof and terminal product thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101980388A (en) * | 2010-09-07 | 2011-02-23 | 浙江西子光电科技有限公司 | Radiator package-based LED device and manufacturing process for LED device |
| WO2012005771A2 (en) * | 2010-07-06 | 2012-01-12 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
| CN202996907U (en) * | 2012-11-26 | 2013-06-12 | 福建省能宝光电集团有限公司 | Efficient integrated LED light source |
-
2012
- 2012-11-26 CN CN2012104858915A patent/CN102956807A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012005771A2 (en) * | 2010-07-06 | 2012-01-12 | Cree, Inc. | Compact optically efficient solid state light source with integrated thermal management |
| CN101980388A (en) * | 2010-09-07 | 2011-02-23 | 浙江西子光电科技有限公司 | Radiator package-based LED device and manufacturing process for LED device |
| CN202996907U (en) * | 2012-11-26 | 2013-06-12 | 福建省能宝光电集团有限公司 | Efficient integrated LED light source |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109657849A (en) * | 2018-12-07 | 2019-04-19 | 桂林电子科技大学 | A kind of LED light array wiring method of Excavation Cluster Based on Network Analysis method |
| CN109657849B (en) * | 2018-12-07 | 2024-03-22 | 桂林电子科技大学 | LED lamp array wiring method based on network analysis method |
| CN109802027A (en) * | 2019-02-22 | 2019-05-24 | 佛山市国星光电股份有限公司 | A kind of light source module group and its manufacturing method and its die cutting die |
| CN109802027B (en) * | 2019-02-22 | 2024-04-09 | 佛山市国星光电股份有限公司 | Light source module, manufacturing method thereof and punching die thereof |
| CN112885866A (en) * | 2021-03-19 | 2021-06-01 | 常州亚玛顿股份有限公司 | MicroLED photovoltaic composite display screen, preparation method thereof and terminal product thereof |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130306 |