CN102956792B - Light emitting diode packaging structure - Google Patents

Abstract

A light-emitting diode package structure, including a substrate, electrodes, light-emitting diode chips and a package body. The electrodes are formed on the surface of the substrate, and the LED chips are located on the substrate and electrically connected with the electrodes. The packaging body covers the substrate and wraps the LED chip inside. The package includes a body and a light scattering area surrounding the body. The body includes a bonding surface attached to the substrate and a light-emitting surface opposite to the bonding surface. The light scattering area is formed by doping scattering particles in part of the body, and the light scattering area is arranged around the LED chip.

Description

Light-emitting diode packaging structure

technical field

The invention relates to a semiconductor structure, in particular to a light emitting diode packaging structure.

Background technique

Generally, when a light-emitting diode (Light Emitting Diode, LED) package structure is used as a light source for a direct-lit backlight module, it is usually required to have a wide light field to reduce the generation of light spots and bright and dark bands on the display. As shown in FIG. 1, a light-emitting diode packaging structure 100 that produces a wide light field is formed. A V-shaped lens 102 is formed on the light-emitting surface of the upper part of the light-emitting diode packaging structure 100. The lens 102 emits part of the light emitted by the light-emitting diode chip 103. The light is refracted to the surroundings of the LED packaging structure 100, thereby generating a wider light field. However, since the lens 102 is formed on the upper part of the light emitting diode packaging structure 100, its thickness and volume are relatively large, and its manufacturing cost is also relatively high.

Contents of the invention

In view of this, it is necessary to provide a low-cost and light-weight LED packaging structure with a wide light field.

A light-emitting diode package structure, including a substrate, electrodes, light-emitting diode chips and a package body. The electrodes are formed on the surface of the substrate, and the LED chips are located on the substrate and electrically connected with the electrodes. The packaging body covers the substrate and wraps the LED chip inside. The package includes a body and a light scattering area surrounding the body. The body includes a bonding surface attached to the substrate and a light-emitting surface opposite to the bonding surface. The light scattering area is formed by doping scattering particles in part of the body, and the light scattering area is arranged around the LED chip.

In the above light-emitting diode packaging structure, the package body includes a light scattering area around the package body, and the light scattering area is doped with a relatively high concentration of scattering particles, so as to increase the scattering of light, increase the side light emission, and improve the luminescence. The light field range of the diode packaging structure, and the light scattering area is formed by doping scattering particles in the packaging body, so the thickness and volume of the light emitting diode packaging structure will not be increased, and the manufacturing cost is also low, so that the light emitting The diode packaging structure can meet the requirements of low cost and thinness while increasing side light emission.

Description of drawings

FIG. 1 is a schematic diagram of a light emitting diode package structure in the prior art.

Fig. 2 is a schematic diagram of a package structure of a light emitting diode provided in the first embodiment of the present invention.

FIG. 3 is a top view of the LED packaging structure shown in FIG. 2 .

FIG. 4 is a light distribution curve diagram of the LED package structure shown in FIG. 2 .

Fig. 5 is a schematic diagram of a light emitting diode package structure provided by the second embodiment of the present invention.

Fig. 6 is a schematic diagram of a package structure of a light emitting diode provided in the third embodiment of the present invention.

Description of main component symbols

Light-emitting diode packaging structure 100, 10, 20, 30 lens 102 Substrate 11 upper surface 111 lower surface 112 electrode 12 LED chip 103, 13 metal wire 131 Package 14, 24, 34 ontology 141 Upper light surface 1411 Joint surface 1412 light scattering area 142 light diffusion surface 1421 side light surface 1422 scattering particles 143

The following specific embodiments will further illustrate the present invention in conjunction with the above-mentioned drawings.

Detailed ways

Referring to FIG. 2 and FIG. 3 , an embodiment of the present invention provides a LED package structure 10 , which includes a substrate 11 , electrodes 12 , LED chips 13 and a package body 14 .

The substrate 11 is a rectangular flat plate for carrying the electrodes 12 , LED chips 13 and packages 14 on its upper surface. The substrate 11 includes an upper surface 111 and a lower surface 112 opposite to the upper surface 111 and parallel to each other. The material of the substrate 11 is PPA (Polyphthalamide, polyvinyl acetate) or the like. It can be understood that the lengths of the sides of the substrate 11 may be the same or different. Further, the shape of the substrate 11 is not limited to a rectangle, and may also be a circle or the like.

There are at least two electrodes 12 formed on the surface of the substrate 11 , and each electrode 12 is electrically insulated from each other. The electrodes 12 respectively extend from the upper surface 111 to the lower surface 112 of the substrate 11 . The material used for the electrode 12 is a metal material with good electrical conductivity, such as one or more alloys of gold, silver, copper, platinum, aluminum, nickel, tin or magnesium.

The LED chip 13 is pasted on one of the electrodes 12 . The LED chips 13 are electrically connected to the electrodes 12 through metal wires 131 . It can be understood that the light emitting diode chip 13 can also be fixed on the electrode 12 on the surface of the substrate 11 in a flip-chip manner and electrically connected to the electrode 12 .

The package body 14 is formed on the upper surface 111 of the substrate 11 , covers the portion of the electrode 12 located on the upper surface 111 , and wraps the LED chip 13 and the metal wire 131 . The package body 14 may be a lens, or an encapsulant. The package body 14 includes a body 141 covering the LED chip 13 and a light scattering area 142 located on a peripheral portion of the body 141 away from the LED chip 13 . The main body 141 is approximately hemispherical and includes an arc-shaped upper light-emitting surface 1411 and a bonding surface 1412 attached to the upper surface of the substrate 11 . The light scattering area 142 includes an annular light diffusing surface 1421 located at the peripheral portion of the upper light emitting surface 1411 and a side light emitting surface 1422 vertically extending downward from the outer periphery of the light diffusing surface 1421 to vertically connecting with the substrate 11 . The light scattering area 142 covers the outer peripheral portion of the main body 141 . The light scattering area 142 is ring-shaped. The light scattering area 142 corresponds to a peripheral portion of the light emitting angle of the LED chip 13 . In this embodiment, the light scattering area 142 corresponds to a range between 45° and 90° of the light emitting angle of the LED chip 13 . The thickness of the light scattering region 142 gradually increases from the connection between the light diffusion surface 1421 and the upper light emitting surface 1411 to the connection between the light diffusing surface 1421 and the side light emitting surface 1422 . The light scattering region 142 is formed by doping scattering particles 143 into the package body 14, wherein the doping concentration of the scattering particles 143 in the light scattering region 142 is higher than the doping concentration of the scattering particles 143 in the body 141, so The scattering particles 143 are any one of titanium dioxide particles or silicon oxide particles. The package body 14 may also contain a fluorescent conversion material, and the fluorescent conversion material may be garnet-based phosphor, silicate-based phosphor, orthosilicate-based phosphor, sulfide-based phosphor, thiogallium Salt-based phosphors and nitride-based phosphors.

When the light emitting diode package structure 10 is in operation, the light emitting diode chip 13 emits light, as shown by the arrow in FIG. , the light in the surrounding part within the light emitting angle of the light emitting diode chip 13 penetrates the body 141 and then shoots to the light scattering region 142. Since the light scattering region 142 is doped with a high concentration of scattering particles 143, the light is scattered by the light scattering region 142 Most of the scattering particles 143 inside are refracted and emitted from the side light emitting surface 1422, thereby increasing the irradiation range of the light emitting diode packaging structure 10 and forming a wide light field. Please refer to FIG. 4 , which is a light distribution curve diagram of the light emitting diode package structure 10 provided by the above-mentioned embodiment of the present invention. Since the above-mentioned light scattering region 142 is formed on the light emitting diode package structure 10 , it can be seen from the figure that the light emitting diode package The structure 10 emits stronger light toward both sides, which increases the lateral light emission, thereby improving the light field range of the light emitting diode packaging structure 10 .

Please refer to FIG. 5 , the light emitting diode packaging structure 20 provided by the second embodiment of the present invention differs from the light emitting diode packaging structure 10 of the first embodiment in that: the packaging body 24 of the light emitting diode packaging structure 20 does not Scattering particles 143 are doped.

Please refer to FIG. 6 , the light emitting diode packaging structure 30 provided by the third embodiment of the present invention differs from the light emitting diode packaging structure 10 of the first embodiment in that: the light scattering region 142 of the light emitting diode packaging structure 30 is located The inside of the package body 34 is between the LED chip 13 and the light emitting surface of the package body 34 .

In the light-emitting diode packaging structures 10, 20 and 30 provided in the embodiments of the present invention, the packages 14, 24 and 34 include a light scattering region 142 covering the peripheral portion of the light-emitting surface of the package, which can increase the scattering of light and increase the side The light emitting diode packaging structure 10, 20 and 30 can be extended to light field, and the light emitting diode packaging structure 10, 20 and 30 can achieve the above-mentioned by doping only in the packaging body 14, 24 and 34. Therefore, the thickness and volume of the light-emitting diode packaging structures 10, 20 and 30 will not be increased, and the manufacturing cost is also low, so that the light-emitting diode packaging structures 10, 20 and 30 can meet the requirements while increasing the side light output. Low cost and thin and light requirements.

It can be understood that those skilled in the art can make various other corresponding changes and modifications according to the technical concept of the present invention, and all these changes and modifications should belong to the protection scope of the claims of the present invention.

Claims (9)

1. a package structure for LED, comprise substrate, electrode, light-emitting diode chip for backlight unit and packaging body, described electrode is formed at substrate surface, described light-emitting diode chip for backlight unit is positioned on substrate, and be electrically connected with described electrode, this packaging body covers described substrate and coated described light-emitting diode chip for backlight unit portion in the inner, it is characterized in that, this packaging body comprises a body and the light scattering sites around this body, this body comprises the faying face and the exiting surface relative with faying face that are sticked with substrate, this light scattering sites is formed by the scattering particles that adulterates in part body, this light scattering sites is arranged around described light-emitting diode chip for backlight unit, this light scattering sites comprises the light diffusingsurface of the upper exiting surface peripheral part being positioned at body and extends downward the side exiting surface of substrate from the outer peripheral edges of light diffusingsurface, this light diffusingsurface is connected with the upper exiting surface top of body, the thickness of this light scattering sites increases gradually from the junction of the junction of described smooth diffusingsurface and upper exiting surface respectively to described smooth diffusingsurface and described side exiting surface.

2. package structure for LED as claimed in claim 1, is characterized in that: doping scattering particles in described body, but the doping content of described light scattering sites inscattering particle is higher than the doping content of body inscattering particle.

3. package structure for LED as claimed in claim 1, is characterized in that: described light scattering sites is positioned near described upper exiting surface.

4. package structure for LED as claimed in claim 1, is characterized in that: described light scattering sites is the scope between 45 ° to 90 ° at the rising angle of described light-emitting diode chip for backlight unit.

5. package structure for LED as claimed in claim 4, is characterized in that: described light scattering sites in the form of a ring.

6. package structure for LED as claimed in claim 1, is characterized in that: described scattering particles is any one in titanium dioxide granule or silicon oxide particle.

7. package structure for LED as claimed in claim 3, is characterized in that: described body is roughly in hemisphere shape, and described light scattering sites is covered in the outer peripheral edge portion of this body.

8. the package structure for LED as described in any one of claim 1 to 7, is characterized in that: described packaging body is lens or packaging plastic.

9. the package structure for LED as described in any one of claim 1 to 7, is characterized in that: described light-emitting diode chip for backlight unit is fixed on substrate surface by pasting or covering brilliant mode.