CN102945817A - Integrated intelligent card packaging system and method - Google Patents
Integrated intelligent card packaging system and method Download PDFInfo
- Publication number
- CN102945817A CN102945817A CN2012104866377A CN201210486637A CN102945817A CN 102945817 A CN102945817 A CN 102945817A CN 2012104866377 A CN2012104866377 A CN 2012104866377A CN 201210486637 A CN201210486637 A CN 201210486637A CN 102945817 A CN102945817 A CN 102945817A
- Authority
- CN
- China
- Prior art keywords
- chip
- butt
- joint
- antenna
- intelligent card
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 10
- 238000000034 method Methods 0.000 title claims description 23
- 238000001514 detection method Methods 0.000 claims abstract description 42
- 239000000523 sample Substances 0.000 claims abstract description 14
- 238000003466 welding Methods 0.000 claims abstract description 10
- 238000009826 distribution Methods 0.000 claims abstract description 5
- 239000011159 matrix material Substances 0.000 claims abstract description 5
- 239000000758 substrate Substances 0.000 claims description 22
- 238000002372 labelling Methods 0.000 claims description 10
- 238000010191 image analysis Methods 0.000 claims description 6
- 238000009413 insulation Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 238000012856 packing Methods 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 238000012360 testing method Methods 0.000 claims description 4
- 239000007779 soft material Substances 0.000 claims description 3
- 238000012545 processing Methods 0.000 abstract description 2
- 239000003973 paint Substances 0.000 abstract 1
- 238000010422 painting Methods 0.000 abstract 1
- 230000006698 induction Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000001360 synchronised effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011897 real-time detection Methods 0.000 description 1
Images
Landscapes
- Credit Cards Or The Like (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
Abstract
The invention discloses an integrated intelligent card packaging system which is applicable to the technical field of intelligent card packaging and comprises a butt-welding device, a chip detection device and a main controller used for controlling the butt-welding device and the chip detection device to coordinate in work. The chip detection device comprises a chip detection controller arranged on a butt-welding table and an indication device corresponding to chip detection probes, and the chip detection controller is electrically connected with the chip detection probes which are in matrix distribution and collect connection conditions of chips on the butt-welding table and an antenna in real time. The chip detection probes collect chip signals and detect whether the chips are connected with the antenna in real time while butt-welding of the chips and the antenna is completed and outputs corresponding detection results through the indication device. The integrated intelligent card packaging system improves detection efficiency due to the fact that butt-welding of the chips and the antenna and connection detection of antenna coils and the chips are achieved simultaneously. Simultaneously, a mark painting device paints marks at corresponding positions before the antenna and the chips form an electrical loop in time, and good products can be separated out in follow-up processing.
Description
Technical field
The present invention relates to the technical field of intelligent card with the RFID chip, particularly with the Intelligent card package of RFID chip and integral and intelligent card package system and the method for packing of detection.
Background technology
Existing smart card is to be provided with intelligent chip in card, its intelligent chip mainly comprise contact and contactless two kinds, contactless mainly is to adopt induction technology, mainly is comprised of chip and induction antenna, can be hidden in the card fully.
Present contact type intelligent card is in manufacture process, and the induction antenna that normally needs to be located at substrate is electrically connected with chip, namely adopts butt-joint that antenna and chip are connected to form an electric loop.In the Intelligent card package process, normally to a large plate of RFID (by several smart card sizes, namely be not divided into the substrate before the smart card) on each antenna with the larger plate of whole RFID is taken out afterwards the whether conducting of detection antenna and chip after corresponding chip butt-joint is finished, because it is lower to detect its efficient after the large plate of RFID need to being taken out, and also can't in time carry out again with butt-joint being electrically connected bad antenna and chip simultaneously.
Summary of the invention
The technical problem that the present invention mainly solves provides a kind of integral and intelligent card package system, and this integral and intelligent card package system can detect in butt-joint, improves the efficient that detects, and can in time weld antenna and chip.
In order to address the above problem, the invention provides a kind of integral and intelligent card package system, this integral and intelligent card package system comprises the butt-joint device and is located at chip-detecting apparatus under this butt-joint device butt-weld joint and the master controller of control butt-joint device and chip-detecting apparatus co-ordination, wherein said chip-detecting apparatus comprises the chip detection controller of being located at the butt-joint platform, this chip detection controller be matrix distribution and Real-time Collection butt-joint platform on the chip detection probe of chip and antenna conducting situation is electrically connected, and with the chip detection corresponding indicating device of popping one's head in; In the whether conducting of the input chip of described chip and antenna described this chip of chip detection probe Real-time Collection when the butt-joint of butt-joint device is finished and antenna, and export corresponding testing result by indicating device.
Say further, described Intelligent card package system also comprises the labelling apparatus that is coated with that is electrically connected with master controller, this is coated with labelling apparatus and comprises the cylinder that is connected with butt-weld joint, the output of this cylinder is provided with the trace piece, when described antenna and chip do not form electric loop, make the cylinder output be moved downward to the trace piece to pneumatic control component and the smart card substrate contacts forms trace by described master controller output control signal.
Say that further described trace piece is soft material, comprises silica gel or sponge.
Say that further the described labelling apparatus that is coated with also comprises the face barrel that is communicated with the trace piece.
Say further, described Intelligent card package system also comprises the photographic image analysis module that camera that butt welding point gathers and photograph are analyzed, trigger controller control camera is not taken pictures to this butt-joint point when chip after the butt-joint is connected with antenna, and by photographic image analysis module Output rusults, again by controller according to this output control butt-joint device whether to the again butt-joint operation of this solder joint.
The present invention also proposes a kind of Intelligent card package method, and this Intelligent card package method comprises:
Around the antenna step, with the insulation wire coiled coil and be fixed on the smart card substrate;
Bury the chip step, chip is fixed on the substrate;
The butt-joint step is welded the coil of chip and antenna and to be formed electric loop by the mode of electrion;
Detecting step, whether real-time detection chip is connected conducting with aerial coil in butt-joint.
Say further, also comprise the step of marking behind the described detecting step, when described chip and aerial coil are not connected to form electric loop, coat mark at chip and the aerial coil correspondence position of current not conducting.
The present invention also proposes a kind of Intelligent card package method, and this Intelligent card package method comprises:
Bury the chip step, chip is fixed on the substrate;
Around the antenna step, with the insulation wire coiled coil and be fixed on the smart card substrate;
The butt-joint detecting step welds the coil of chip and antenna and to form electric loop by the mode of electrion, with chip with examine chip by the checkout gear Real-time Measuring when aerial coil welds by butt-joint and whether be connected conducting with aerial coil.
Say further, also comprise the step of marking behind the described detecting step, when described chip and aerial coil are not connected to form electric loop, coat mark at chip and the aerial coil correspondence position of current not conducting.
Integral and intelligent card package system of the present invention, comprise the butt-joint device and be located at chip-detecting apparatus under this butt-joint device butt-weld joint and the master controller of control butt-joint device and chip-detecting apparatus co-ordination, wherein said chip-detecting apparatus comprises the chip detection controller of being located at the butt-joint platform, this chip detection controller be matrix distribution and Real-time Collection butt-joint platform on the chip detection probe of chip and antenna conducting situation is electrically connected, and with the chip detection corresponding indicating device of popping one's head in; In the whether conducting of the input chip of described chip and antenna described this chip of chip detection probe Real-time Collection when the butt-joint of butt-joint device is finished and antenna, and export corresponding testing result by indicating device.Because described system is communicated with chip aerial coil in the synchronous realization that aerial coil is connected butt-joint with chip and detects, improve detection efficiency.Simultaneously when aerial coil and chip form electric loop, at once do not coat mark at correspondence position by being coated with labelling apparatus, can in the processing procedure of postorder, separate the connection non-defective unit.
Description of drawings
In order to be illustrated more clearly in the embodiment of the invention or technical scheme of the prior art, the below will do simple the introduction to the accompanying drawing of required use in embodiment or the description of the Prior Art, apparently, and the accompanying drawing in describing is some embodiments of the present invention, to those skilled in the art, under the prerequisite of not paying creative work, can also obtain other accompanying drawings according to these accompanying drawings.
Fig. 1 is integral and intelligent card package system embodiment electrical principle schematic diagram of the present invention.
Fig. 2 is another embodiment electrical principle schematic diagram of integral and intelligent card package system of the present invention.
Fig. 3 is integral and intelligent card packaging method embodiment schematic flow sheet of the present invention.
Below in conjunction with embodiment, and with reference to accompanying drawing, realization, functional characteristics and the advantage of the object of the invention is described further.
Embodiment
In order to make purpose, technical scheme and the advantage that to invent clearer, below in conjunction with the accompanying drawing in the embodiment of the invention, the technical scheme in the embodiment of the invention is clearly and completely described, obviously, described embodiment is a part of embodiment of invention, rather than whole embodiment.Based on the embodiment among the present invention, the every other embodiment that those of ordinary skills obtain under the prerequisite of not making creative work belongs to the scope of protection of the invention.
As depicted in figs. 1 and 2, the invention provides a kind of integral and intelligent card package system embodiment.
This integral and intelligent card package system comprises: butt-joint device 2 and be located at chip-detecting apparatus 3 under these butt-joint device 2 butt-weld joints and the master controller 1 of control butt-joint device 2 and chip-detecting apparatus 3 co-ordinations, wherein said chip-detecting apparatus 3 comprises the chip detection controller 31 of being located at the butt-joint platform, the chip detection probe 31 of this chip detection controller 31 and the chip that is matrix distribution and Real-time Collection butt-joint platform correspondence position and aerial coil conducting situation is electrically connected, and with the chip detection 31 corresponding indicating devices 33 of popping one's head in; The whether conducting of the input chip of 32 these chips of Real-time Collection and antenna of popping one's head in of described chip detection when the butt-joint of butt-joint device is finished when described chip and antenna, and by the corresponding testing result of indicating device 33 outputs.
Specifically, when butt-joint device 2 starts described chip-detecting apparatus 3 work when chip and aerial coil are welded, and by the chip detection on the chip-detecting apparatus 3 pop one's head in chip and the connection status of antenna of 32 Real-time Collections and its correspondence position, when chip with after aerial coil is connected conducting, chip forms electric loop with corresponding aerial coil, described chip detection this chip relevant information of 32 synchronization gains of popping one's head in, and identify and do corresponding control by master controller 1 and export, as showing by 33 pairs of different conditions of indicating device; When chip is not connected conducting with antenna, when namely not forming electric loop, chip detection probe 32 can't obtain the chip information of correspondence position, and according to default control program, master controller 1 is thought the chip status outofkilter of correspondence position.Described indicating device 33 comprises indicator light.
Because described system is communicated with chip aerial coil in the synchronous realization that aerial coil is connected butt-joint with chip and detects, two operations are united two into one, reduce process period, can improve detection efficiency, arrange and can aerial coil and the chip that detect not conducting be welded again by what adapt to.
Described Intelligent card package system also comprises the photographic image analysis module that camera that butt welding point gathers and photograph are analyzed, trigger controller control camera is not taken pictures to this butt-joint point when chip after the butt-joint is connected with antenna, and by photographic image analysis module Output rusults, again by controller according to this output control butt-joint device whether to the again butt-joint operation of this solder joint.
As shown in Figure 2, above-mentioned executing on the routine basis another embodiment is proposed also.
Described integral and intelligent card package system also comprises: what be electrically connected with master controller 1 is coated with labelling apparatus 4, this is coated with labelling apparatus 4 and comprises the cylinder 42 that is connected with butt-weld joint, the output of this cylinder is provided with the trace piece, when described antenna and chip do not form electric loop, make the cylinder output be moved downward to the trace piece to pneumatic control component and the smart card substrate contacts forms trace by described master controller 1 output control signal.
Owing to when detecting welded condition, can distinguish the antenna and the chip substrate that do not connect, can be conveniently the product of the loose contact that occurs in the Intelligent card package process be separated and manages.
Described trace piece is soft material, comprise silica gel or sponge, can dip in the face material at silica gel or sponge during use, when trace piece and substrate contacts, can firmly not stay impression at substrate because of the trace piece, and then make the smart card surface produce existing concave-convex sense, affect that it is attractive in appearance.
The described labelling apparatus 4 that is coated with also comprises the face barrel that is communicated with the trace piece, can provide painted face material for the trace piece incessantly.
As shown in Figure 3, the present invention also provides a kind of integral and intelligent card packaging method embodiment.
This integral and intelligent card packaging method comprises:
The S10 step, around the antenna step, with the insulation wire coiled coil and be fixed on the smart card substrate, specifically, by the ultrasonic wave mode with the insulation wire from inside to outside helical form be fixed on the smart card substrate, form coil antenna at substrate, wherein said insulated conductor comprises copper core enamelled wire, and the smart card substrate comprises the materials such as PVC.
The S11 step is buried the chip step, and the substrate that has been fixed with aerial coil in above-mentioned S10 step is buried chip underground, makes chip be fixed on the substrate appropriate location.
The S12 step, the butt-joint detecting step welds the coil of chip and antenna and to form electric loop by the mode of electrion; With chip with whether be connected conducting by checkout gear Real-time Measuring inspection chip with aerial coil when aerial coil welds by butt-joint; Specifically, because checkout gear described chip-detecting apparatus when carrying out the butt-joint welding just starts, chip and connection status of antenna by chip-detecting apparatus chip detection probe Real-time Collection and its correspondence position, when chip and this chip relevant information of chip detection probe synchronization gain after antenna is connected conducting, and identify and do corresponding control by master controller and export, as passing through indicating device, show the state of this chip such as indicator light; When chip is not connected conducting with antenna, when namely not forming electric loop, the chip detection probe can't obtain the chip information of correspondence position, and according to default control program, master controller is thought the chip status outofkilter of correspondence position.
Because described system is communicated with chip aerial coil in the synchronous realization that aerial coil is connected butt-joint with chip and detects, two operations are united two into one, can improve detection efficiency, arrange and can aerial coil and the chip that detect not conducting be welded again by what adapt to.
In the present embodiment, described S10 step and S11 step can namely can also can be buried first chip underground by first fixed antenna coil in no particular order, and other steps are constant, and encapsulation does not exert an influence to postorder.
Described butt-joint detecting step comprises that also triggering is not carried out video acquisition to this butt-joint point and analyzed and do not weld reason when chip after the butt-joint is connected with antenna, whether does not weld reason control butt-joint device to the again butt-joint operation of this solder joint according to this again.
Also comprise the step of marking behind the described butt-joint detecting step, when described chip and aerial coil are not connected to form electric loop, chip and aerial coil correspondence position in current not conducting are coated mark, can be conveniently the product of the loose contact that occurs in the Intelligent card package process be separated.
Above embodiment only in order to technical scheme of the present invention to be described, is not intended to limit; Although with reference to previous embodiment the present invention is had been described in detail, those of ordinary skill in the art is to be understood that: it still can be made amendment to the technical scheme that aforementioned each embodiment puts down in writing, perhaps part technical characterictic wherein is equal to replacement, and these modifications or replacement do not make the essence of appropriate technical solution break away from the spirit and scope of various embodiments of the present invention technical scheme.
Claims (10)
1. integral and intelligent card package system is characterized in that:
It comprises the butt-joint device and is located at chip-detecting apparatus under this butt-joint device butt-weld joint and the master controller of control butt-joint device and chip-detecting apparatus co-ordination, wherein said chip-detecting apparatus comprises the chip detection controller that is arranged at the butt-joint platform, this chip detection controller be matrix distribution and Real-time Collection butt-joint platform on the chip detection probe of chip and antenna conducting situation is electrically connected, and with the chip detection corresponding indicating device of popping one's head in; In the whether conducting of the input chip of described chip and antenna described this chip of chip detection probe Real-time Collection when the butt-joint of butt-joint device is finished and antenna, and export corresponding testing result by indicating device.
2. integral and intelligent card package system according to claim 1 is characterized in that:
Described integral and intelligent card package system also comprises the labelling apparatus that is coated with that is electrically connected with master controller, this is coated with labelling apparatus and comprises the cylinder that is connected with butt-weld joint, the output of this cylinder is provided with the trace piece, when described antenna and chip do not form electric loop, make the cylinder output be moved downward to the trace piece to pneumatic control component and the smart card substrate contacts forms trace by described master controller output control signal.
3. integral and intelligent card package system according to claim 2 is characterized in that:
Described trace piece is soft material, comprises silica gel or sponge.
4. integral and intelligent card package system according to claim 3 is characterized in that:
The described labelling apparatus that is coated with also comprises the face barrel that is communicated with the trace piece.
5. arbitrary described integral and intelligent card package system according to claim 1-3 is characterized in that:
Described Intelligent card package system also comprises the photographic image analysis module that camera that butt welding point gathers and photograph are analyzed, trigger controller control camera is not taken pictures to this butt-joint point when chip after the butt-joint is connected with antenna, and by photographic image analysis module Output rusults, again by controller according to this output control butt-joint device whether to the again butt-joint operation of this solder joint.
6. the method for packing of integral and intelligent card package system according to claim 1, this Intelligent card package method comprises:
Around the antenna step, with the insulation wire coiled coil and be fixed on the smart card substrate;
Bury the chip step, chip is fixed on the substrate;
The butt-joint detecting step welds the coil of chip and antenna and to form electric loop by the mode of electrion, with chip with examine chip by the checkout gear Real-time Measuring when aerial coil welds by butt-joint and whether be connected conducting with aerial coil.
7. integral and intelligent card packaging method according to claim 6 is characterized in that,
Described butt-joint detecting step comprises that also triggering is not carried out video acquisition to this butt-joint point and analyzed and do not weld reason when chip after the butt-joint is connected with antenna, whether does not weld reason control butt-joint device to the again butt-joint operation of this solder joint according to this again.
8. integral and intelligent card packaging method according to claim 7 is characterized in that,
Also comprise the step of marking behind the described detecting step, when described chip and aerial coil are not connected to form electric loop, coat mark at chip and the aerial coil correspondence position of current not conducting.
9. the method for packing of integral and intelligent card package system according to claim 1, this Intelligent card package method comprises:
Bury the chip step, chip is fixed on the substrate;
Around the antenna step, with the insulation wire coiled coil and be fixed on the smart card substrate;
The butt-joint detecting step welds the coil of chip and antenna and to form electric loop by the mode of electrion, with chip with examine chip by the checkout gear Real-time Measuring when aerial coil welds by butt-joint and whether be connected conducting with aerial coil.
10. integral and intelligent card packaging method according to claim 9 is characterized in that,
Also comprise the step of marking behind the described detecting step, when described chip and aerial coil are not connected to form electric loop, coat mark at chip and the aerial coil correspondence position of current not conducting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104866377A CN102945817A (en) | 2012-11-21 | 2012-11-21 | Integrated intelligent card packaging system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012104866377A CN102945817A (en) | 2012-11-21 | 2012-11-21 | Integrated intelligent card packaging system and method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102945817A true CN102945817A (en) | 2013-02-27 |
Family
ID=47728747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012104866377A Pending CN102945817A (en) | 2012-11-21 | 2012-11-21 | Integrated intelligent card packaging system and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102945817A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112990413A (en) * | 2021-03-09 | 2021-06-18 | 深圳源明杰科技股份有限公司 | Coil dispensing method, device, equipment and computer readable storage medium |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5705852A (en) * | 1995-04-13 | 1998-01-06 | Sony Chemicals Corp. | Non-contact IC card and process for its production |
| CN1316100A (en) * | 1998-09-01 | 2001-10-03 | 松下电器产业株式会社 | Judgment apparatus and method for pressure spot welding, and semiconductor component manufacturing apparatus and method |
| CN1352438A (en) * | 2000-11-08 | 2002-06-05 | 美国太平洋航空技术公司 | Integrate welding and detection method and device in producing intelligent card process |
| CN1388613A (en) * | 2001-05-30 | 2003-01-01 | 株式会社萌利克 | Method and apparatus for connecting conductor |
| US20060157573A1 (en) * | 2000-01-25 | 2006-07-20 | Renesas Technology Corp. | IC card |
| CN101706318A (en) * | 2009-11-27 | 2010-05-12 | 北京工业大学 | Large power laser on-line digital testing apparatus |
| CN102426659A (en) * | 2011-11-03 | 2012-04-25 | 北京德鑫泉物联网科技股份有限公司 | Intelligent card with two read-write matrixes and production method thereof |
| CN202306309U (en) * | 2011-11-07 | 2012-07-04 | 柳州高华机械有限公司 | On-line welding monitoring system |
-
2012
- 2012-11-21 CN CN2012104866377A patent/CN102945817A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5705852A (en) * | 1995-04-13 | 1998-01-06 | Sony Chemicals Corp. | Non-contact IC card and process for its production |
| CN1316100A (en) * | 1998-09-01 | 2001-10-03 | 松下电器产业株式会社 | Judgment apparatus and method for pressure spot welding, and semiconductor component manufacturing apparatus and method |
| US20060157573A1 (en) * | 2000-01-25 | 2006-07-20 | Renesas Technology Corp. | IC card |
| CN1352438A (en) * | 2000-11-08 | 2002-06-05 | 美国太平洋航空技术公司 | Integrate welding and detection method and device in producing intelligent card process |
| CN1388613A (en) * | 2001-05-30 | 2003-01-01 | 株式会社萌利克 | Method and apparatus for connecting conductor |
| CN101706318A (en) * | 2009-11-27 | 2010-05-12 | 北京工业大学 | Large power laser on-line digital testing apparatus |
| CN102426659A (en) * | 2011-11-03 | 2012-04-25 | 北京德鑫泉物联网科技股份有限公司 | Intelligent card with two read-write matrixes and production method thereof |
| CN202306309U (en) * | 2011-11-07 | 2012-07-04 | 柳州高华机械有限公司 | On-line welding monitoring system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112990413A (en) * | 2021-03-09 | 2021-06-18 | 深圳源明杰科技股份有限公司 | Coil dispensing method, device, equipment and computer readable storage medium |
| CN112990413B (en) * | 2021-03-09 | 2023-07-25 | 深圳源明杰科技股份有限公司 | Coil dispensing method, device, equipment and computer readable storage medium |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204769602U (en) | Coil capability test automatic checkout device | |
| CN105873377B (en) | A kind of charger automatic production process | |
| CN103236328B (en) | Cable joint marking method and automatic code printing system implementing the same | |
| CN204679596U (en) | Pcb board pick-up unit | |
| CN108061849A (en) | A kind of circuit board testing system and its test method | |
| CN202363914U (en) | Rectifier assembly machine | |
| CN204903691U (en) | Enameled wire on -line measuring ware | |
| CN102945817A (en) | Integrated intelligent card packaging system and method | |
| CN103679243A (en) | Intelligent dual interface card chip contact solder wetting and hot melt adhesive pasting automation device | |
| CN205554842U (en) | Automatic print bar code detection device of labeling system | |
| CN207057783U (en) | Flat motor Intelligentized automatic production line | |
| CN201917629U (en) | Short circuit test device for aluminum electrolytic capacitor jacketing machine | |
| CN205091416U (en) | Many car wiring harness detection device | |
| CN104101613A (en) | Cable online detection system | |
| CN201048181Y (en) | Multihead conductor jointing localizer | |
| CN106019066A (en) | Photovoltaic cell panel junction box terminal welding quality test system | |
| CN103962679B (en) | Missing solder detection device | |
| CN104339104A (en) | Automatic spot welding machine | |
| CN103729675B (en) | A kind of Non-contact intelligent identification card INLAY layer and preparation method thereof | |
| CN208156121U (en) | A kind of check device of engine wiring harness short circuit | |
| CN209131857U (en) | Arrangement of temperature sensor | |
| CN206710729U (en) | A kind of new probe circuitry switching device | |
| CN103390491A (en) | Phase position-distinguishing manufacturing method for inductor | |
| CN205124160U (en) | Rack assets management module | |
| CN202956777U (en) | Chip contact tin soldering and hot melt adhesive pasting automation device of intelligent double-interface card |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20130227 |
|
| RJ01 | Rejection of invention patent application after publication |