CN102906300B - 溅射靶到背衬材料的非连续接合 - Google Patents
溅射靶到背衬材料的非连续接合 Download PDFInfo
- Publication number
- CN102906300B CN102906300B CN201180025119.9A CN201180025119A CN102906300B CN 102906300 B CN102906300 B CN 102906300B CN 201180025119 A CN201180025119 A CN 201180025119A CN 102906300 B CN102906300 B CN 102906300B
- Authority
- CN
- China
- Prior art keywords
- attachment
- target
- bearing surface
- surface treatment
- treatment region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Description
Claims (30)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP10005319 | 2010-05-21 | ||
| EP10005319.8 | 2010-05-21 | ||
| US34413110P | 2010-05-28 | 2010-05-28 | |
| US61/344,131 | 2010-05-28 | ||
| PCT/EP2011/058335 WO2011144759A1 (en) | 2010-05-21 | 2011-05-23 | Non-continuous bonding of sputtering target to backing material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102906300A CN102906300A (zh) | 2013-01-30 |
| CN102906300B true CN102906300B (zh) | 2016-04-13 |
Family
ID=42735572
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201180025119.9A Active CN102906300B (zh) | 2010-05-21 | 2011-05-23 | 溅射靶到背衬材料的非连续接合 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9932667B2 (zh) |
| EP (1) | EP2572013B1 (zh) |
| JP (1) | JP5840679B2 (zh) |
| KR (2) | KR20180006464A (zh) |
| CN (1) | CN102906300B (zh) |
| TW (1) | TWI544099B (zh) |
| WO (1) | WO2011144759A1 (zh) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105483625B (zh) * | 2014-10-07 | 2018-01-02 | Jx金属株式会社 | 溅射靶 |
| KR20220153675A (ko) | 2015-03-18 | 2022-11-18 | 유미코아 | 리튬 함유 전이금속 산화물 타겟 |
| JP5909006B1 (ja) * | 2015-03-23 | 2016-04-26 | Jx金属株式会社 | 円筒型スパッタリングターゲット及びその製造方法 |
| WO2016187011A2 (en) | 2015-05-15 | 2016-11-24 | Materion Corporation | Methods for surface preparation of sputtering target |
| JP6095824B2 (ja) * | 2016-03-24 | 2017-03-15 | Jx金属株式会社 | 円筒型スパッタリングターゲット及びその製造方法 |
| CN116240511A (zh) * | 2023-03-17 | 2023-06-09 | 广州市尤特新材料有限公司 | 一种增加靶材附着力的加工工艺 |
| CN118028729A (zh) * | 2024-01-24 | 2024-05-14 | 先导薄膜材料(广东)有限公司 | 一种靶材绑定结合促进方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090250337A1 (en) * | 2004-12-14 | 2009-10-08 | W.C. Heraeus Gmbh | Tubular target having a connecting layer arranged between the target tube and the carrier tube |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57188680A (en) * | 1981-05-16 | 1982-11-19 | Kemisuton:Kk | Target for sputtering and production thereof |
| JPS6447864A (en) | 1987-08-17 | 1989-02-22 | Seiko Epson Corp | Method for joining sputtering target |
| JPH028364A (ja) * | 1988-06-24 | 1990-01-11 | Matsushita Electric Ind Co Ltd | スパッタ用ターゲット及びその製造方法 |
| JP2634678B2 (ja) | 1989-06-15 | 1997-07-30 | 日立金属株式会社 | スパッタリング用ターゲット組立体およびその製造方法 |
| US5282943A (en) * | 1992-06-10 | 1994-02-01 | Tosoh Smd, Inc. | Method of bonding a titanium containing sputter target to a backing plate and bonded target/backing plate assemblies produced thereby |
| US5836506A (en) * | 1995-04-21 | 1998-11-17 | Sony Corporation | Sputter target/backing plate assembly and method of making same |
| US5857611A (en) * | 1995-08-16 | 1999-01-12 | Sony Corporation | Sputter target/backing plate assembly and method of making same |
| AU2003284294A1 (en) * | 2002-10-21 | 2004-05-13 | Cabot Corporation | Method of forming a sputtering target assembly and assembly made therefrom |
| US20050016833A1 (en) * | 2003-04-17 | 2005-01-27 | Shannon Lynn | Plasma sprayed indium tin oxide target for sputtering |
| US20050061857A1 (en) * | 2003-09-24 | 2005-03-24 | Hunt Thomas J. | Method for bonding a sputter target to a backing plate and the assembly thereof |
| DE102006009749A1 (de) | 2006-03-02 | 2007-09-06 | FNE Forschungsinstitut für Nichteisen-Metalle Freiberg GmbH | Targetanordnung |
| KR101171769B1 (ko) | 2007-01-05 | 2012-08-07 | 삼성코닝정밀소재 주식회사 | 스퍼터링용 타겟 장치 |
| JP5194460B2 (ja) * | 2007-01-26 | 2013-05-08 | 東ソー株式会社 | 円筒形スパッタリングターゲット及びその製造方法 |
| JP2009242915A (ja) * | 2008-03-31 | 2009-10-22 | Mitsubishi Materials Corp | スパッタリングターゲット及びその製造方法 |
| JP5387118B2 (ja) * | 2008-06-10 | 2014-01-15 | 東ソー株式会社 | 円筒形スパッタリングターゲット及びその製造方法 |
| JP5309978B2 (ja) | 2008-08-20 | 2013-10-09 | 東ソー株式会社 | 円筒形スパッタリングターゲットの製造方法 |
| CN101543924A (zh) | 2009-03-12 | 2009-09-30 | 宁波江丰电子材料有限公司 | 靶材与背板的焊接方法 |
| CN101648307A (zh) | 2009-05-08 | 2010-02-17 | 宁波江丰电子材料有限公司 | 靶材组件的制作方法 |
-
2011
- 2011-04-25 TW TW100114292A patent/TWI544099B/zh active
- 2011-05-23 JP JP2013510645A patent/JP5840679B2/ja active Active
- 2011-05-23 KR KR1020177037853A patent/KR20180006464A/ko not_active Ceased
- 2011-05-23 EP EP11721034.4A patent/EP2572013B1/en active Active
- 2011-05-23 US US13/699,311 patent/US9932667B2/en active Active
- 2011-05-23 WO PCT/EP2011/058335 patent/WO2011144759A1/en not_active Ceased
- 2011-05-23 KR KR1020127033242A patent/KR20130113955A/ko not_active Ceased
- 2011-05-23 CN CN201180025119.9A patent/CN102906300B/zh active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090250337A1 (en) * | 2004-12-14 | 2009-10-08 | W.C. Heraeus Gmbh | Tubular target having a connecting layer arranged between the target tube and the carrier tube |
Also Published As
| Publication number | Publication date |
|---|---|
| EP2572013B1 (en) | 2017-01-04 |
| JP2013529253A (ja) | 2013-07-18 |
| WO2011144759A1 (en) | 2011-11-24 |
| US9932667B2 (en) | 2018-04-03 |
| TW201204856A (en) | 2012-02-01 |
| JP5840679B2 (ja) | 2016-01-06 |
| CN102906300A (zh) | 2013-01-30 |
| KR20130113955A (ko) | 2013-10-16 |
| TWI544099B (zh) | 2016-08-01 |
| KR20180006464A (ko) | 2018-01-17 |
| US20130118898A1 (en) | 2013-05-16 |
| EP2572013A1 (en) | 2013-03-27 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180222 Address after: No. 27-9, Baijia Industrial Park, Gaoxin District, Qingyuan City, Guangdong Province, Qingyuan Pilot Materials Co., Ltd. D workshop Patentee after: Pilot film material (Guangdong) Co., Ltd. Address before: Brussels Patentee before: Umicore NV |
|
| TR01 | Transfer of patent right | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20130130 Assignee: Pilot film materials Co.,Ltd. Assignor: Leading film materials (Guangdong) Co.,Ltd. Contract record no.: X2021440000141 Denomination of invention: Discontinuous bonding of sputtering target to backing material Granted publication date: 20160413 License type: Common License Record date: 20210730 |
|
| EE01 | Entry into force of recordation of patent licensing contract |