CN102879903A - Device integrated with micro-electromechanical system (MEMS) micro-mirror with controllable inclined angle - Google Patents
Device integrated with micro-electromechanical system (MEMS) micro-mirror with controllable inclined angle Download PDFInfo
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Abstract
本发明公开了一种集成倾角可控MEMS微镜的器件,包括MEMS微镜、基底、电引线,所述电引线设置于所述基底上,所述MEMS微镜与所述基底之间连接有驱动臂,所述MEMS微镜底部无支撑地悬空设置,所述驱动臂上集成设置有反馈电路,以实时反馈MEMS微镜的偏转角度。该器件的MEMS微镜与入射光源成一定角度倾斜,无需额外基座,且其倾斜角度可以自由控制;单片MEMS微镜集成,MEMS微镜的电连接设置于基底上,方便操作。
The invention discloses a device integrating a tilt-controllable MEMS micromirror, comprising a MEMS micromirror, a substrate, and an electric lead, the electric lead is arranged on the substrate, and a connection is made between the MEMS micromirror and the substrate. The drive arm, the bottom of the MEMS micromirror is suspended without support, and a feedback circuit is integrated on the drive arm to feed back the deflection angle of the MEMS micromirror in real time. The MEMS micromirror of the device is inclined at a certain angle with the incident light source, no additional base is needed, and its inclination angle can be freely controlled; the single-chip MEMS micromirror is integrated, and the electrical connection of the MEMS micromirror is set on the substrate, which is convenient for operation.
Description
技术领域technical field
本发明涉及一种集成倾角可控MEMS微镜的器件,属于微机电系统领域。The invention relates to a device integrating an MEMS micromirror with controllable inclination angle, which belongs to the field of microelectromechanical systems.
背景技术Background technique
MEMS(Micro-electro-mechanical systems),即微机电系统,是利用微加工技术制造出来的各种微型器件或系统,主要包括微型机构、微型传感器、微型执行器和相应的处理电路等,它是在融合多种微细加工技术,并应用现代信息技术的最新成果的基础上发展起来的高科技前沿学科,而其中MEMS微镜系统就是此技术的一个典型应用。MEMS微镜主要用于控制光线的偏转方向,作为MEMS器件的典型产品应用器应用甚广。随着器件的微型化,MEMS微镜被广泛用于微型投影仪,光开关,光可变衰减器,微型光谱仪,微型光学探头等;其中许多情况下,都要求MEMS微镜与入射光成一定的角度,如图1中所示。MEMS (Micro-electro-mechanical systems), that is, micro-electro-mechanical systems, are various micro-devices or systems manufactured by micro-processing technology, mainly including micro-structures, micro-sensors, micro-actuators and corresponding processing circuits. It is a high-tech cutting-edge discipline developed on the basis of integrating various micro-processing technologies and applying the latest achievements of modern information technology, and the MEMS micro-mirror system is a typical application of this technology. MEMS micromirrors are mainly used to control the deflection direction of light, and are widely used as typical products of MEMS devices. With the miniaturization of devices, MEMS micromirrors are widely used in micro-projectors, optical switches, optical variable attenuators, micro-spectrometers, micro-optical probes, etc.; angle, as shown in Figure 1.
为使MEMS微镜能倾斜一定角度,现有的方法一般是把MEMS微镜贴敷于具有固定角度的基座上(Huikai Xie etc.,3D In Vivo optical coherencetomography based on a low-voltage,large-scan-range 2D MEMS mirror),或者把MEMS微镜插接在与基座成一定角度的沟槽中(Xiaojing Mu etc,MEMSmicromirror integrated endoscopic probe for optical coherence tomographybioimaging)。In order to tilt the MEMS micromirror at a certain angle, the existing method is generally to attach the MEMS micromirror to a base with a fixed angle (Huikai Xie etc., 3D In Vivo optical coherencetomography based on a low-voltage, large- scan-range 2D MEMS mirror), or insert the MEMS micromirror into the groove at a certain angle with the base (Xiaojing Mu etc, MEMSmicromirror integrated endoscopic probe for optical coherence tomographybioimaging).
由于现有方法中需要额外增加具有特定角度的基座或者沟槽等,使得器件的体积庞大,还需额外的电连接把MEMS微镜的焊盘与基座或额外的其他部件电路连接,因此,器件整体的性能不够稳定,且MEMS微镜的角度不能自由控制,导致器件的功能单一;另外,还需要大量的组装工作,成品率低。Due to the need to add additional pedestals or grooves with specific angles in the existing methods, the device is bulky, and additional electrical connections are required to connect the pads of the MEMS micromirror to the pedestal or additional other component circuits, so , the overall performance of the device is not stable enough, and the angle of the MEMS micromirror cannot be freely controlled, resulting in a single function of the device; in addition, a large amount of assembly work is required, and the yield is low.
发明内容Contents of the invention
本发明的目的在于提出一种集成倾角可控MEMS微镜的器件,该器件的MEMS微镜与入射光源成一定角度倾斜,无需额外基座,且其倾斜角度可以自由控制;单片MEMS微镜集成,MEMS微镜的电连接设置于基底上,方便操作。The object of the present invention is to propose a device with an integrated inclination controllable MEMS micromirror, the MEMS micromirror of the device is inclined at a certain angle with the incident light source, no additional base is needed, and its inclination angle can be freely controlled; the monolithic MEMS micromirror Integrated, the electrical connection of the MEMS micromirror is set on the substrate for easy operation.
为达此目的,本发明采用以下技术方案:For reaching this purpose, the present invention adopts following technical scheme:
一种集成倾角可控MEMS微镜的器件,包括MEMS微镜、基底、电引线,所述电引线设置于所述基底上,所述MEMS微镜与所述基底之间连接有驱动臂,所述MEMS微镜底部无支撑地悬空设置。A device that integrates a tilt-controllable MEMS micromirror, including a MEMS micromirror, a substrate, and an electrical lead, the electrical lead is arranged on the substrate, and a driving arm is connected between the MEMS micromirror and the substrate, so The bottom of the MEMS micromirror is suspended without support.
进一步地,所述MEMS微镜包括边框、镜面和镜体驱动臂,所述镜体驱动臂连接于边框与镜面之间。Further, the MEMS micromirror includes a frame, a mirror surface and a mirror body driving arm, and the mirror body driving arm is connected between the frame and the mirror surface.
进一步地,所述驱动臂的驱动方式为电热驱动、压电驱动或热膨胀聚合物。Further, the driving method of the driving arm is electrothermal driving, piezoelectric driving or thermal expansion polymer.
进一步地,所述驱动臂包括至少两段双层结构,所述双层结构的第一段与第二段包括第一材料层和第二材料层,所述第一段的第一材料层设置在第二材料层的上方,所述第二段的第一材料层设置在第二材料层的下方;所述第一段与第二段依次连接设置。Further, the driving arm includes at least two sections of double-layer structure, the first section and the second section of the double-layer structure include a first material layer and a second material layer, and the first material layer of the first section is set Above the second material layer, the first material layer of the second section is arranged below the second material layer; the first section and the second section are sequentially connected and arranged.
进一步地,所述驱动臂包括至少两段多层结构,所述多层结构的第一段与第二段包括第一材料层和第二材料层,所述第一段的第一材料层设置在第二材料层的上方,所述第二段的第一材料层设置在第二材料层的下方;所述第一段与所述第二段还包括除第一材料层与第二材料层之外的一层或多层材料结构,所述第一段与第二段依次连接设置。Further, the driving arm includes at least two sections of multilayer structure, the first section and the second section of the multilayer structure include a first material layer and a second material layer, and the first material layer of the first section is set Above the second material layer, the first material layer of the second section is arranged below the second material layer; the first section and the second section also include the first material layer and the second material layer One or more layers of material structure, the first segment and the second segment are sequentially connected.
进一步地,所述驱动臂至少包括上层材料层和下层材料层,所述上层材料层与下层材料层的材料热膨胀系数不同。Further, the driving arm at least includes an upper material layer and a lower material layer, and the upper material layer and the lower material layer have different material thermal expansion coefficients.
更进一步地,所述上层材料层的上表面、下层材料层的下表面或上层材料层和下层材料层之间设置有一层或多层材料层。Furthermore, one or more material layers are arranged on the upper surface of the upper material layer, the lower surface of the lower material layer, or between the upper material layer and the lower material layer.
进一步地,所述驱动臂中至少有一层是导体层。Further, at least one layer of the driving arm is a conductor layer.
进一步地,所述基底上设有焊盘,所述电引线与所述基底上的焊盘导电连接,所述电引线的另一端与驱动臂的导体电连接。Further, a pad is provided on the base, the electrical lead is electrically connected to the pad on the base, and the other end of the electrical lead is electrically connected to the conductor of the driving arm.
进一步地,所述MEMS微镜的镜体自身倾斜角度固定,或者镜体自身倾斜角通过其周围的镜体驱动臂可调。Further, the inclination angle of the mirror body itself of the MEMS micromirror is fixed, or the inclination angle of the mirror body itself is adjustable through the mirror body driving arm around it.
进一步地,所述镜体驱动臂包括至少两段双层结构,所述双层结构的第一段与第二段包括第一材料层和第二材料层,所述第一段的第一材料层设置在第二材料层的上方,所述第二段的第一材料层设置在第二材料层的下方;所述第一段与第二段依次连接设置。Further, the mirror body driving arm includes at least two sections of double-layer structure, the first section and the second section of the double-layer structure include a first material layer and a second material layer, and the first material of the first section The layer is arranged above the second material layer, and the first material layer of the second section is arranged below the second material layer; the first section and the second section are arranged sequentially.
进一步地,所述镜体驱动臂包括至少两段双层结构,所述双层结构的第一段与第二段包括第一材料层和第二材料层,所述第一段的第一材料层设置在第二材料层的上方,所述第二段的第一材料层设置在第二材料层的下方;所述第一段与所述第二段还包括除第一材料层与第二材料层之外的一层或多层结构,所述第一段与第二段依次连接设置。Further, the mirror body driving arm includes at least two sections of double-layer structure, the first section and the second section of the double-layer structure include a first material layer and a second material layer, and the first material of the first section layer is arranged above the second material layer, and the first material layer of the second section is arranged below the second material layer; the first section and the second section also include the first material layer and the second One or more layers of structure other than the material layer, the first segment and the second segment are connected in sequence.
进一步地,所述镜体驱动臂至少包括上层材料层和下层材料层,所述上层材料层与下层材料层的材料热膨胀系数不同。Further, the mirror body driving arm includes at least an upper material layer and a lower material layer, and the upper material layer and the lower material layer have different material thermal expansion coefficients.
进一步地,所述镜体至少一边连接有镜体驱动臂。Further, at least one side of the mirror body is connected with a mirror body driving arm.
进一步地,所述MEMS微镜的初始偏转角度由驱动臂的长度、材料厚度以及工艺参数控制。Further, the initial deflection angle of the MEMS micromirror is controlled by the length of the driving arm, material thickness and process parameters.
进一步地,所述驱动臂上集成设置有反馈电路,以实时反馈MEMS微镜的偏转角度。Further, a feedback circuit is integrated on the driving arm to feed back the deflection angle of the MEMS micromirror in real time.
本发明的有益效果为:本发明通过将MEMS微镜与基底之间的电连接改进为由膨胀系数不同的两种材料组成的双层或多层结构,采用电热驱动自由控制微镜倾斜角;驱动臂上集成反馈电路,及时反馈信号,精确控制倾斜角,安装过程无需预先对准倾斜角,更加方便;MEMS微镜直接通过驱动臂与基底连接,无需支架支撑,大大减小系统整体体积,MEMS微镜可缩小边框面积,来提高镜面填充率。The beneficial effects of the present invention are: the present invention improves the electrical connection between the MEMS micromirror and the substrate into a double-layer or multi-layer structure composed of two materials with different expansion coefficients, and uses electrothermal driving to freely control the inclination angle of the micromirror; The feedback circuit is integrated on the driving arm, the feedback signal is timely, and the tilt angle is precisely controlled. The installation process does not need to align the tilt angle in advance, which is more convenient; the MEMS micromirror is directly connected to the substrate through the driving arm without support, which greatly reduces the overall volume of the system. MEMS micromirrors can reduce the area of the frame to increase the fill rate of the mirror.
附图说明Description of drawings
图1是现有技术MEMS微镜与入射光成一定角度的示意图;Fig. 1 is the schematic diagram that prior art MEMS micromirror forms a certain angle with incident light;
图2是本发明提供的MEMS微镜与入射光成一定角度的示意图;Fig. 2 is the schematic diagram that the MEMS micromirror provided by the present invention forms a certain angle with incident light;
图3是本发明一种集成倾角可控MEMS微镜的器件结构示意图;Fig. 3 is a schematic diagram of the device structure of an integrated inclination controllable MEMS micromirror of the present invention;
图4是图3中MEMS微镜与基底的一种连接方式;Fig. 4 is a kind of connection mode of MEMS micromirror and substrate among Fig. 3;
图5是图3中MEMS微镜与基底的另一种连接方式;Fig. 5 is another connection mode of MEMS micromirror and substrate among Fig. 3;
图6是图3中MEMS微镜结构示意图;Fig. 6 is a schematic diagram of the MEMS micromirror structure in Fig. 3;
图7是图3中MEMS器件实施方案示意图。FIG. 7 is a schematic diagram of an embodiment of the MEMS device in FIG. 3 .
其中:in:
1、MEMS微镜;2、驱动臂;3、入射光;4、反馈电路;11、MEMS微镜平台;12、镜体驱动臂;13、镜体;21、上层材料层;22、下层材料层;23、中间层;24、第一材料层;25、第二材料层;26、第一段;27、第二段;31、电引线。1. MEMS micromirror; 2. Driving arm; 3. Incident light; 4. Feedback circuit; 11. MEMS micromirror platform; 12. Mirror body driving arm; 13. Mirror body; 21. Upper material layer; 22.
具体实施方式Detailed ways
下面结合附图并通过具体实施方式来进一步说明本发明的技术方案。The technical solutions of the present invention will be further described below in conjunction with the accompanying drawings and through specific implementation methods.
如图2至图6所示,一种集成倾角可控MEMS微镜的器件,包括MEMS微镜1、基底3、电引线31,所述电引线31设置于所述基底3上,所述MEMS微镜1与所述基底3之间连接有驱动臂2,所述MEMS微镜1底部无支撑地悬空设置。同时,基底3上设有焊盘,电引线31与基底3上的焊盘通过导电胶或者导线连接实现导电连接,电引线31的一端与驱动臂2的一端电连接,另一端与外部电路电连接。本发明与现有技术相比,省去了现有的用于放置MEMS微镜、且具有一定倾斜角度的固定底座,以及用于MEMS微镜与基底3的电引线实现电连接的连接线,使得整个装置体积减小,安装简单便利,另外,驱动臂2上还集成设置有反馈电路4,以实时反馈MEMS微镜的偏转角度。As shown in Fig. 2 to Fig. 6, a kind of device of integrated inclination controllable MEMS micromirror, comprises
其中,驱动臂2的驱动方式为电热驱动、压电驱动或热膨胀聚合物。Wherein, the driving method of the
作为本发明的一种优选方式,如图5所示,所述驱动臂2包括至少两段双层结构,所述双层结构的第一段26与第二段27包括第一材料层24和第二材料层25,所述第一段26的第一材料层24设置在第二材料层25的上方,所述第二段27的第一材料层24设置在第二材料层25的下方;所述第一段26与第二段27依次连接设置。其中,第一段26与第二段27的第一材料层24与第二材料层25的材料热膨胀系数不同,且在双层结构中至少有一层为导体层。优选的,在本方式中,驱动臂2采用柔性聚合物薄膜包裹一层Al作为第一材料层,在第二材料层填充热膨胀系数大的聚合物,如SiO2。将该双层结构的驱动臂2连接于MEMS微镜1与基底3之间,基底3与电引线31之间电连接,当外部电路将电信号传送给电引线31一直到驱动臂2时,由于驱动臂2的双层结构的材料膨胀系数不同,通电后,双层结构中的导体层受热,并对第一材料层与第二材料层的材料进行加热,使其向膨胀系数小的一侧偏转,从而实现倾斜角的偏转控制,并可以根据不同的电信号,实现不同的偏转结果,所以MEMS微镜的倾斜角度可以自由控制。As a preferred mode of the present invention, as shown in FIG. 5 , the
作为本发明的另一种优选方式,所述驱动臂2包括至少两段多层结构,所述多层结构的第一段26与第二段27包括第一材料层24和第二材料层25,所述第一段26的第一材料层24设置在第二材料层25的上方,所述第二段27的第一材料层24设置在第二材料层25的下方;所述第一段26与所述第二段27还包括除第一材料层25与第二材料层25之外的一层或多层材料结构,所述第一段26与第二段27依次连接设置。其中,第一段26与第二段27的第一材料层24与第二材料层25的材料热膨胀系数不同,且在多层结构中至少有一层为导体层。将该多层结构的驱动臂2连接于MEMS微镜1与基底3之间,基底3与电引线31之间电连接,当外部电路将电信号传送给电引线31一直到驱动臂2时,由于驱动臂2的多层结构的材料膨胀系数不同,通电后,多层结构中的导体层受热,并对第一材料层与第二材料层的材料进行加热,使其向膨胀系数小的一侧偏转,从而实现倾斜角的偏转控制,并可以根据不同的电信号,实现不同的偏转结果,所以MEMS微镜的倾斜角度可以自由控制。As another preferred mode of the present invention, the driving
作为本发明的再一种优选方式,如图4所示,所述驱动臂2至少包括上层材料层21和下层材料层22,所述上层材料层21与下层材料层22的材料热膨胀系数不同;所述上层材料层21的上表面、下层材料层22的下表面或上层材料层21和下层材料层22之间设置有一层或多层材料层。其中,驱动臂2的结构材料层中至少有一层是导体层。优选的,在本实施方式中,驱动臂2采用柔性聚合物薄膜包裹一层Al作为上层材料层,下层材料层填充热膨胀系数大的聚合物,如SiO2,在上层材料层与下层材料层之间设置中间材料层,该中间材料层作为导体层,其材料为Pt。将该结构的驱动臂2连接于MEMS微镜1与基底3之间,基底3与电引线31之间电连接,当外部电路将电信号传送给电引线31一直到驱动臂2时,由于驱动臂2的上层材料层与下层材料层的材料膨胀系数不同,通电后,中间材料层Pt通电受热,开始对上下材料层的材料进行加热,使其向膨胀系数小的一侧偏转,从而实现倾斜角的偏转控制,并可以根据不同的电信号,实现不同的偏转结果,所以MEMS微镜的倾斜角度可以自由控制。As another preferred mode of the present invention, as shown in FIG. 4, the driving
如图6所示,MEMS微镜1包括MEMS微镜平台11、镜体13以及连接在镜体13与MEMS微镜平台11之间的镜体驱动臂12。进一步地,所述镜体13至少一边连接有镜体驱动臂12。优选的,在本实施例中,镜体驱动臂12的数量为4个,分别设置于镜体13的四个角点方向,以灵活控制镜体13的倾斜角度。其中,MEMS微镜1的镜体13自身倾斜角度固定,或者镜体13自身倾斜角也可以通过其周围的镜体驱动臂12来调整变化。优选的,在本实施例中,镜体13的倾斜角度也是可调的。具体地,镜体驱动臂12的材料层结构与以上三种驱动臂2的结构中的任一种相同,优选的,镜体驱动臂12为双层膨胀系数不同的材料层结构,中间嵌入有加热结构层;当外部电信号通过电引线31、经过驱动臂2、最后达镜体驱动臂12处,镜体驱动臂12中间嵌入的加热结构通电受热,并对上下层进行加热,使得镜体驱动臂12发生偏转,镜体13的角度随着发生变化,实现镜体角度可调。As shown in FIG. 6 , the
进一步地,驱动臂2与镜体驱动臂12在制作完成时,由于受热冷却会形成一个初始倾斜角度,而该角度可以通过驱动臂2与镜体驱动臂12的长度与材料层厚度等的工艺参数确定。因此,在整个系统装配过程中,都无需预先对准MEMS微镜的倾斜角,待使用过程中再根据需要调整,使得安装过程更加简便。Further, when the driving
同时,又由于驱动臂2既能控制MEMS微镜1的倾斜角度,又能起到支撑作用,所以在整个MEMS器件系统中MEMS微镜1无需额外支撑结构,这不仅减小了系统整体的体积,又使得MEMS微镜1可以缩小微镜平台11的边框面积,提高镜面的填充率。At the same time, since the driving
在本发明中,MEMS微镜的驱动臂2的结构与镜体13的镜体驱动臂12的结构可以采用相同或不同的结构形式。但为了设计加工的方便,一般采用相同的结构形式,具体的加工过程如图7所示:In the present invention, the structure of the driving
(a)SOI准备;(a) SOI preparation;
(b)PECVD SiO2并图形化;(b) PECVD SiO2 and patterning;
(c)Pt图形化;(c) Pt graphics;
(d)PECVD SiO2并图形化;(d) PECVD SiO2 and patterning;
(e)Al图形化;(e) Al graphics;
(f)PECVD SiO2并图形化;(f) PECVD SiO2 and patterning;
(g)制作背面DRIE掩膜;(g) Make the backside DRIE mask;
(h)背面DRIE Si,RIE SiO2;(h) Backside DRIE Si, RIE SiO 2 ;
(i)正面DRIE Si,并侧向钻刻去除驱动结构下面的硅;(i) DRIE Si on the front side, and side drilling to remove the silicon under the driving structure;
(j)结构完全释放。(j) The structure is fully released.
通过以上这种方式不需要增加其他工艺步骤,节省成本。但是也可以采用不同的结构形式,只是会增加工艺的复杂度。In the above manner, no other process steps need to be added, which saves costs. However, different structural forms can also be used, which only increases the complexity of the process.
以上结合具体实施例描述了本发明的技术原理。这些描述只是为了解释本发明的原理,而不能以任何方式解释为对本发明保护范围的限制。基于此处的解释,本领域的技术人员不需要付出创造性的劳动即可联想到本发明的其它具体实施方式,这些方式都将落入本发明的保护范围之内。The above describes the technical principles of the present invention in conjunction with specific embodiments. These descriptions are only for explaining the principles of the present invention, and cannot be construed as limiting the protection scope of the present invention in any way. Based on the explanations herein, those skilled in the art can think of other specific implementation modes of the present invention without creative efforts, and these modes will all fall within the protection scope of the present invention.
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