[go: up one dir, main page]

CN102812412A - Convective Cooling of Data Centers Using Chimneys - Google Patents

Convective Cooling of Data Centers Using Chimneys Download PDF

Info

Publication number
CN102812412A
CN102812412A CN201080056706XA CN201080056706A CN102812412A CN 102812412 A CN102812412 A CN 102812412A CN 201080056706X A CN201080056706X A CN 201080056706XA CN 201080056706 A CN201080056706 A CN 201080056706A CN 102812412 A CN102812412 A CN 102812412A
Authority
CN
China
Prior art keywords
chimney
plenum
air
computer
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201080056706XA
Other languages
Chinese (zh)
Inventor
A·B·卡尔森
J·克利达拉斯
C·G·马隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Google LLC
Original Assignee
Exaflop LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Exaflop LLC filed Critical Exaflop LLC
Publication of CN102812412A publication Critical patent/CN102812412A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
    • H05K7/20718—Forced ventilation of a gaseous coolant
    • H05K7/20745—Forced ventilation of a gaseous coolant within rooms for removing heat from cabinets, e.g. by air conditioning device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20127—Natural convection

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Chimneys And Flues (AREA)

Abstract

一种数据中心包括计算机组、与计算机组有流体连通的充气室和与充气室有流体连通的烟囱。烟囱被配置成使用来自计算机组的热以充分降低充气室中的气压以使得跨计算机组的气流足以冷却计算机组以用于正常操作。

Figure 201080056706

A data center includes a computer bank, a plenum in fluid communication with the computer bank, and a chimney in fluid communication with the plenum. The chimney is configured to use heat from the computer bank to sufficiently reduce air pressure in the plenum so that airflow across the computer bank is sufficient to cool the computer bank for normal operation.

Figure 201080056706

Description

Use the convection current cooling of the data center of chimney
Technical field
This instructions relates to the computing machine in the cooling data center.
Background technology
Computer data center is to hold the commercial building of great amount of calculation machine (such as thousands of or ten hundreds of rack-mounted computer servers and other computing equipment (for example, memory device, power supply and networked devices)).Usually, computer data center provides calculation services (such as webpage trustship, search, Email, video and other service) to a plurality of distributed remote users.
Because the user that the Internet connects is greatly increasing on the number and the COS of their demand greatly increases on complicacy, so data center must provide the amount of computational resources that increases sharply now.Thereby the scale of data center increases, and the number of data center increases, and because data center need use electronic equipment, so the electricity needs of data center increases.Because the signal portion of the electric power that data center uses becomes heat, so the cooling requirement of data center obviously increases.
Summary of the invention
In one aspect, a kind of data center comprises: computer set; Plenum chamber has fluid to be communicated with computer set; And chimney, there is fluid to be communicated with plenum chamber and is configured to use heat to be enough to the cooling computer group to be used for normal running so that stride the air-flow of computer set with the air pressure in the abundant reduction plenum chamber from computer set.
Implementation can comprise one or more characteristic in the following characteristic.The boosting fan can be configured to auxiliary air-flow process chimney from plenum chamber.The boosting fan can cause that the abundant pressure drop in the plenum chamber is enough to the air of cooling computer group when not having chimney to flow.Chimney can be reduced the heat of ambient dissipation from the air-flow of chimney inside by heat insulation one-tenth.Chimney can be configured to absorb heat from surrounding environment.Chimney can extend at least 50 feet above the bottom of plenum chamber.Plenum chamber can comprise the air that is configured to separate in the plenum chamber and the dividing plate of plenum chamber air outside.Removable ventilator can be attached to the upper end of chimney and be configured to guide the chimney opening to leave the direction of wind.Enclosure wall can surround computer set and can have opening that is used for chimney and the air intake that is formed at wherein.The fluid injector can be configured to apply fluid (for example, water) to the inlet air flow that flows through computer set and inflow plenum chamber.Heat exchanger (for example, devaporizer) can be configured to the inlet air flow that cool stream is crossed computer set and flowed into plenum chamber.Computer set can comprise the frame of computing machine (for example, at least two ten two computing machines).Thermal source can be configured to heat the inlet air flow that flows through computer set and flow into plenum chamber.Thermal source can be the hot-air from plenum chamber or chimney extraction.
In another aspect, a kind ofly, data center comprises: make air flow stream cross computer set and flow into plenum chamber for providing the method for cooling; Make air-flow flow into the bottom of chimney; Chimney is configured to use heat from computer set to reduce the air pressure in the plenum chamber; Chimney is configured to use heat from computer set with the air pressure in the abundant reduction plenum chamber, thereby makes the air-flow of striding computer set be enough to the cooling computer group to be used for normal running; And make air flow stream go out the top of chimney.
Implementation can comprise one or more characteristic in the following characteristic.Can be with being configured to make the air-flow of crossing the boosting fan boosting entering chimney of chimney from the airflow of plenum chamber.The boosting fan can cause that abundant pressure drop in the plenum chamber is with abundant cooling computer group when not having chimney.Chimney can be reduced the heat of ambient dissipation from the air-flow of chimney inside by heat insulation one-tenth.Chimney can be configured to absorb heat from surrounding environment.Chimney can extend at least 50 feet above the bottom of plenum chamber.Dividing plate can separate air and the plenum chamber air outside in the plenum chamber.Computer set can be surrounded by enclosure wall, and enclosure wall has opening that is used for chimney and the air intake that is formed at wherein.Can adjust the removable ventilator that is attached to the chimney upper end and leave the direction of wind to guide the chimney opening.Can cool stream cross computer set and flow into the inlet air flow of plenum chamber.Cooling can comprise that applying fluid (for example, water) to inlet air flow perhaps makes inlet air flow flow through heat exchanger (for example, devaporizer).Computer set can comprise the frame of computing machine (for example, at least two ten two computing machines).Can heat the inlet air flow that flows through computer set and flow into plenum chamber.Heating can comprise from plenum chamber or chimney extracts hot-air.
Implementation can comprise one or more advantage in the following advantage.Can use parts still less and therefore with lower facility constructions cost and also use energy still less and therefore with lower facility operations become original cooling number according in the heart computing machine.For example, through with routine data in core cooling system compare the use that reduces fan and heat pump, can increase data center's energy efficiency and can reduce data center's power consumption.In addition, reduce be used to cool off data center and essential number of components can improve data center reliability, can reduce and be used for the construction data center and essential cost and time, can reduce data center's maintenance cost and can reduce and be used to make data center to reach the standard grade and essential time quantum.
Description of drawings
Fig. 1 is that the cross-sectional side view of data center schematically illustrates.
Fig. 2 is that the cross-sectional plan views of the data center of Fig. 1 schematically illustrates.
Fig. 3 is that the cross-sectional plan views of an alternative implementation of data center schematically illustrates.
Fig. 4 is the process flow diagram of an implementation of cooling computer group.
Similar label in various accompanying drawings is indicated similar key element.
Embodiment
Can be with comprising that the convection current cooling (such as the natural convection cooling) of using chimney implements data center's cooling.Possibly hope to use a kind of device, system or method of using the least possible parts and consuming the least possible energy to cool off the computing machine in the data center.Convection current can be used for making the air-flow cooling computer stride the computer set in the data center.Can be with the convection current cooling that is configured to the plenum chamber (plenum) of guiding chimney from the hot-air of computer set into is implemented computing machine.Chimney can be opened and can be configured to use convection current to stride computer set and along chimney upwards and leave the air-flow of chimney to cause to the outside surrounding environment of data center.Utilize data center's cooling system of convection current can reduce power consumption, improve efficient and minimizing is used for the construction data center and the time and the spending of needs.
Fig. 1 is that the cross-sectional side view of data center 100 schematically illustrates.Fig. 2 is that the cross-sectional plan views of the data center of Fig. 1 schematically illustrates.See figures.1.and.2, data center 100 comprises the enclosure wall 110 (for example, room or building) that holds great amount of calculation machine or similar heat-generating electronic part.Computing machine can be arranged in a plurality of parallel rows and be assemblied in (computing machine certainly is positioned in other orientation (for example vertical pallet)) on the level tray in the upright frame 102 (such as frame 102a, 102b)." high frame that about 22 computing machines can be filled standard 78.Air can be striden the pallet circulation from work space 106.Work space 106 on a side of frame 102 can be called " cold passageway (aisle) " in some circumstances, and the plenum chamber space 144 on the opposite side of frame 102 can be regarded as " warm passageway ".Pooling together of the frame of computing machine can provide computer set 120.Enclosure wall 110 can surround or hold for example related with the operation and maintenance of data center 100 other hardware (not shown) and personnel's (not shown).Computer set 120 can comprise the server that is configured to provide to a plurality of distributed remote users calculation services (such as webpage trustship, search, Email, video and other service).
Common consumption of electric power of computing equipment in frame 102 and heating, and these computing equipments can comprise and are used for the heating radiator and the heat pipe that dissipate to the air that flows through pallet from the heat of these computing equipments.The frame group can be the part like lower module, and this module comprises and is configured to help the heat transfer structure or the mechanism's (not shown) that conduct heat to the liquid coolant that flows through computer set 120 (for example, flowing through near the water of the pipe frame 102) from air.
Computer set 120 can comprise air vent 130 (for example, the space between the adjacent trays in frame), and these air vent fluidity ground connect the plenum chamber space 144 of computer set 120 and plenum chamber.Air vent 130 can allow fluid (for example, air) around and flow through computing equipment or between neighborhood calculation equipment as the part of the frame 102 of computing machine.The frame 102 of computing machine can form the part (for example, the sidepiece of plenum chamber) of inflation locular wall 140.In some implementations, the frame of computing machine forms a plurality of (for example, opposite) sidepiece of plenum chamber 140.Plenum chamber space 144 can be the space that is centered on by inflation locular wall 140 and computer set 120.The inflation locular wall 140 can separate in the plenum chamber space 144 air with enclosure wall 110 in, but in the plenum chamber space 144 outsides enclosure wall space 114.In some implementations, inflation locular wall 140 can comprise be used to help to get into plenum chamber space 144 (such as be used to safeguard the equipment that is positioned at plenum chamber space 144 or computer set 120 can be from the plenum chamber space 144 approaching parts) a (not shown).
The plenum chamber space 144 of plenum chamber can be connected to chimney 150 fluidity.In some implementations, chimney 150 can be isolated with 114 fluidity ground, enclosure wall space except process plenum chamber space 144.Chimney 150 can pass through the chimney opening 116 that is formed in the enclosure wall 110 and stretch out from data center 100.In some implementations, surrounding environment 102 influences around data center 100 are avoided in the inside that chimney rain visor (flashing) 118 can the protected data center.Chimney 150 can above the computer set 120, extending chimney height H above the bottom of plenum chamber 140 or at some above other suitable RP.For example, chimney height H can be more than 50 feet (such as more than 100 feet).Such chimney can be compatible with in the framework shell of tier building basically.Under this situation, data center can be positioned on the floor, bottom of tier building and utilize chimney effect and the visual impact that almost do not have or do not come from the outside.Alternatively, the chimney stalk of retired industrial plants can convert this purposes to.Taller and bigger chimney (such as height to 350 foot) can extend above the roof or incorporate in the high macrostructure (such as the tower of wind turbine).Can make chimney height H fully big, thereby the sufficient air-flow of feasible process computer set 120, plenum chamber space 144 and the chimney 150 that can occur is mainly natural convection.That is to say, possibly hope to make chimney height H even as big as making natural convection through chimney 150 can make enough air-flows through computing machine cooling computer fully during some condition (such as normal operating condition).
Chimney 150 can have in enclosure wall 110 lower stack part 152 and on above the enclosure wall 110 chimney part 154.In some implementations, as hereinafter was further discussed, the outside surface of chimney 156 can be heat insulation by the insulator (not shown), and this can hope for the heat dissipation that prevents the air in the chimney 150.Chimney 150 can comprise chimney breast 158, and the air in the chimney can pass through this outlet and leave chimney 150 and get into surrounding environment 102.The air that leaves chimney 150 can be called waste gas.
Alternatively, ventilator (cowl) 160 can be attached to chimney 150 at chimney breast 158.Ventilator 160 can be formed and guide waste gas to flow out ventilator outlet 166.In some implementations, ventilator 160 can be movably (such as rotatable), thereby makes that the direction of ventilator outlet 166 can be adjustable.
Data center 100 can comprise the enclosure wall inlet 170 that is formed in the enclosure wall 110.In some implementations, possibly hope enclosure wall inlet 170 is fully located to alleviate or to prevent the air-flow of the inlet 170 from chimney breast 158 to enclosure wall away from chimney 150.Such air-flow possibly be undesirable, maybe be higher than surrounding environment 102 temperature because leave the waste gas of chimney breast 158.Waste gas flows into the cooling validity that therefore enclosure wall inlet 170 possibly reduce the air that flows through computer set.In addition, waste gas flows into enclosure wall inlet 170 like this possibly reduce convection current, and this possibly reduce the flow velocity through the air of computer set, and this possibly further reduce the cooling validity of the air that flows through computer set 120.If air in chimney 150 and the temperature difference that flows between the air in the computer set become too small and can't keep the convection current through chimney 150, then such exhaust gas recirculation possibly suspend convection current.Can't keep convection current and possibly interrupt cooling like this to computing machine.In some implementations, the height H that increases chimney 150 can reduce the possibility that waste gas flows into enclosure wall inlet 170 like this.Alternatively or additionally, enclosure wall inlet 170 can be in the horizontal direction (for example, direction) vertical with the length direction of chimney 150 goes up and removes further from chimney 150.
In some implementations, enclosure wall inlet 170 can comprise the heat exchanger 174 that is configured to cool off the air-flow that gets into data center 100.Heat exchanger 174 can for example comprise devaporizer.Enclosure wall inlet 170 also can comprise the injector 176 that is configured to apply to the air-flow (can be called inlet air flow) that gets into data center 100 fluid 178 (such as water).As hereinafter was further discussed, the evaporation of fluid 178 can be cooled off inlet air flow.Alternatively, injector 176 can inject a certain other cooling fluid (such as gas) in inlet air flow.As hereinafter was further discussed, cooling can be such as improving the cooling effect to computer set through the convection current that improves through chimney 150 through the air-flow of enclosure wall inlet 170.
Alternatively, as hereinafter was further discussed, plenum chamber 140 or chimney 150 can comprise optional boosting fan 180.Boosting fan 180 can for example be positioned in the lower stack part 152, go up in the chimney part 156, in the top (aerator 140 engages with chimney 150 at this top) of plenum chamber 140 perhaps in some other appropriate location.Air vent 130, plenum chamber 140, chimney 150, optional ventilator 160, enclosure wall inlet 170 and relevant parts can be referred to as the part of the cooling system of data center 100.
Fig. 3 is that the cross-sectional plan views of an alternative implementation of data center 100 schematically illustrates.Plenum chamber space 144 ' part is at least centered on by plenum chamber 140 ' and computer set 120.Plenum chamber space 144 ' is also centered on by dividing plate 320, thereby makes the part in plenum chamber space 144 be connected to enclosure wall space 114 with passing through dividing plate space 324 fluidities.Dividing plate 324 can be configured to limit air-flow through dividing plate 324, separate air and the air in the enclosure wall space 114 in the plenum chamber space 144 ' at least in part thus.In some implementations, dividing plate 324 can be enough greatly allowing the human plenum chamber space 144 ' that gets into, such as be used for safeguarding the equipment that is positioned at plenum chamber space 144 ' or computer set 120 can be from the plenum chamber space 144 ' approaching parts.In some other implementations, plenum chamber 140 can comprise the door (not shown) that is used to help to get into plenum chamber space 144 '.
Fig. 4 is the process flow diagram of a kind of implementation of cooling computer group 100.Airflow direction is indicated by the arrow among Fig. 1-Fig. 3.Air can pass through enclosure wall inlet 170 and get into data center 100.In some implementations, can cool stream cross the inlet air flow (step 410) of enclosure wall inlet 170.For example, the cooling fluid (not shown) can flow through heat exchanger 174 with the cooling inlet air flow.Cooling fluid can for example cool off by being positioned at data center's 100 outside freezer unit (not shown).In some other implementations, inlet air flow can flow through the passage (not shown), and can apply fluid (such as water) with cooling duct evaporatively to passage, and these passages can cool off inlet air flow thus.In some implementations, injector 176 can apply fluid 178 to the air that flows through enclosure wall inlet 170, and fluid 178 can for example be a water.Can for example carry out applying of injector 176 convection cells 178 through in inlet air flow, spraying fluid 178.For example, can apply or spray fluid 178 with droplet, vaporific or atomised form.Fluid 178 in the evaporation inlet air flow can cool off inlet air flow.In addition, in some implementations, can heat the inlet air flow (step 410) that flows through enclosure wall inlet 170.For example, can through the warm water of over-heat-exchanger 174 circulation or can recycle from some warm airs of plenum chamber 144 or chimney (stack) 154 so that heating to be provided.
Air can flow through computer set 120, flows through plenum chamber 140 and flow into chimney 150 (step 420).Can have than surrounding environment 102 relative higher temperature from the entering plenum chamber 140 of computer set 120 heat absorptions and the air of chimney 150.Therefore relatively hot air in the chimney 150 can have the buoyancy with respect to surrounding environment 102.This buoyancy can reduce the air pressure in the plenum chamber spaces 144 with respect to enclosure wall space 114, and this effect can be called chimney effect.Air pressure in the plenum chamber space 144 can be called air pressure with respect to the minimizing in enclosure wall space 114 and fall.
Chimney effect can help the natural convection through the air of data center 100.Thereby can design cooling system make chimney effect be enough to cause in the plenum chamber space 144 the sufficient gas pressure drop with realize through enclosure wall inlet 170, through computer set 120, through plenum chamber 140 and through and the sufficient air-flow that leaves chimney 150 to help the normal running of computer set 120.The height H that particularly, can design chimney 150 is to cause the sufficient gas pressure drop in the plenum chamber space 144.As an example, in some implementations, can realize the abundant cooling of data set 120, wherein the air pressure in the plenum chamber space 144 is than little 0.1 crust of the air pressure in the enclosure wall space 114.Generally speaking, pressure difference can be at least about 0.5 millibar (0.2in-wg), and the pressure drop of fin-tube heat exchanger coil pipe is perhaps striden in this representative through the server pallet.In some implementations, can use following relation to calculate the air pressure that causes by chimney effect and fall:
Δ P = C · a · h · ( 1 T o - 1 T i ) , Wherein:
Δ P=is the pressure difference of unit with Pascal (Pa);
C=0.0342 (constant);
A=is the atmospheric pressure of unit with Pa;
H=is the chimney height of unit with rice (m);
T o=be the outside absolute temperature of chimney of unit with deg K (K); And
T i=with K the inner absolute medial temperature of chimney of unit.
Temperature T oCan be the temperature of surrounding environment 102, this temperature can be less than, be greater than or equal to the temperature in the enclosure wall space 114.
In some implementations, can use following relation to calculate the air velocity that causes by chimney effect:
Q = C · A 2 · g · h · T i - T o T i , Wherein:
Q=is with cubic meters per second (m 3/ s) be the flue gas stream speed of unit;
A=is with m 2Cross-sectional area (supposing that it has constant cross-section) for the chimney of unit;
C=emission factor (being taken as from 0.65 to 0.70 usually);
G=the acceleration of gravity on sea level (be generally 9.807 meters every square second (m/s 2));
H=is the chimney height of unit with m;
T i=with K the inner absolute medial temperature of chimney of unit; And
T o=be the absolute external air temperature of unit with K.
Generally speaking, term ' chimney effect ' is meant because the buoyancy-induced flow effect due to the temperature difference between the inside and outside separation gas column of chimney.
For example, when the temperature of surrounding environment when to be 50 degree Fahrenheit temperature and plenum chamber 144 with temperature in the chimney 150 be 140 degree Fahrenheit temperature, chimney can have the height H of 55 feet (perhaps more) to cause 0.5 millibar of pressure difference.Use the induced draught equation, this chimney can be discharged 4.4m to per 1 square metre of cross-sectional area 3The air of/s.Induce mobile pressure difference and speed during hot summer, to descend, still strengthen in the operating period in cold winter.The selection of actual stack height depend on the leading weather condition in required place and such as the such factor of economy compromise (such as TCO (TCO)) with the cost of balance chimney structure and the saving of fan power and energy consumption.
The air pressure that the height H of increase chimney 150 can increase in the plenum chamber space 144 falls, and this can improve the cooling validity of cooling system.Yet, possibly hope to make chimney height H minimum so that constructions cost minimizes, makes around 150 pairs in the chimney visual impact of landscape to minimize or from other purpose.Therefore, possibly hope to design the cooling system with following chimney height H, this chimney height H is abundant cooling and the essential minimum value that is used to realize computer set 102.
That kind as discussed above, chimney effect can be the results of the buoyancy of the air in the chimney 150, and this buoyancy can be caused by the temperature as with surrounding environment 102, enclosure wall space 114 or the two raising of comparing in the chimney 150 again.Therefore, ambient 150 or the air heat in the 114 dissipation chimneys 150 of the enclosure wall space air pressure that can reduce in the plenum chamber space 144 falls.That is to say, in above-described mathematical relation, reduce T iCan reduce Δ P.The heat insulation ambient 102 that can reduce that increases chimney 150 is perhaps to the heat of enclosure wall space 114 losses from the air in the chimney 150.Yet, the heat insulation size that possibly increase chimney 150, and also possibly hope to make chimney size minimum so that constructions cost minimizes, makes around 150 pairs in the chimney visual impact of landscape to minimize or from other purpose.In some implementations, can be through smearing to chimney 150 or applying heat-absorbing paint or coating is improved chimney effect.For example, chimney 150 can absorb heat from the daylight (not shown), and coating or coating can help such absorption.Chimney 150 can increase the temperature the chimney 150 and improve chimney effect thus from the daylight heat absorption.
The design of chimney 150 and other part of cooling system also can be considered the contingent condition of other parts of computer set 120, surrounding environment 102 and cooling system and data center 100.For example, the heating of computer set 120 can change along with the usage degree of computer set 120.As an example, the heating that reduces computer set 120 can cause the temperature that reduces relatively in plenum chamber space 144 and the chimney 150, and this possibly reduce chimney effect.That is to say, along with the temperature in the chimney 150 becomes more near the temperature of surrounding environment 102, chimney effect possibly be reduced and therefore the air pressure in the plenum chamber space 144 fall and possibly be reduced.This minimizing of chimney effect possibly be acceptable in some implementations (the wherein minimizing that needs to cooling off when the heating of computer set 120 reduces).Yet, possibly need the design cooling system so that reduce the heating of computer set 120 do not cause chimney effect even as big as suspending through the air-flow of chimney 150 and interrupting minimizing thus to the cooling of computer set 120.Anti-speech, the heating that increases computer set 120 can increase chimney effect, but in some implementations, this increase of chimney effect possibly be not enough to sufficient cooling computer group 120 to be used for normal running.In order to help the abundance cooling of computer set 120, heating that can limit calculation unit 120, perhaps cooling system can be designed in the heating the predicted scope of computer set 120 cooling computer group 120 sufficiently.As another example, increase temperature that the temperature of surrounding environment 102 can make surrounding environment 102 more near the temperature in the chimney 150, this possibly reduce chimney effect and the air pressure that reduces thus in the plenum chamber space 144 falls.For the temperature in the heating of considering computer set 120, surrounding environment 102 or enclosure wall space 114 or the change of other system variable, chimney 150 and other part of cooling system can be designed in can predicting the required scope of operating conditions cooling computer group 120 fully.
In some implementations, the ability that can replenish or expand cooling system can be to the scope of the computer set 120 abundant operating conditionss of cooling off to extend cooling system.As an example, cooling can improve convection current through the air themperature that minimizing is flow through computer set 120 and flowed into plenum chamber space 144 through the air-flow of enclosure wall inlet 170.Cooling through the air-flow of enclosure wall inlet 170 therefore can for example support to given chimney height H around the relative higher temperature of environment 102 keep convection current and fully cooling.Alternatively or additionally, can reduce the essential chimney height H that is used for given environmental baseline collection.In addition, as hereinafter was further discussed, optional boosting fan 180 can fall such as the air pressure in the space, supplemental inflation chamber 144 during extreme operating condition.
Boosting fan 180 can increase or boosting from plenum chamber 140 air-flow through chimneys 150, (step 430) falls in this air pressure that can increase in the plenum chamber space 144.In some implementations, the air-flow that boosting fan 180 increases through chimney 150, this can increase through the air-flow of air vent 130 and can improve the cooling to computer set 120 thus.The air-flow that boosting gets into chimney 150 can comprise the air velocity that increases through chimney 150.For example, boosting fan 180 can cool off the abundance of computer set 120 when combining chimney 150 to implement boosting fan 180 even as big as helping by power.That is to say that in some implementations, boosting fan 180 possibly lack is enough to when not having chimney 150 power of cooling computer group 120 sufficiently.In some implementations, boosting fan 180 is configured to initiate the air-flow through chimney 150, and after such initiation, and boosting fan 180 can be turned off, walk around (bypass) or the two.Such initiation boosting can be useful for the convection current of initiating through chimney 150 in some implementations.In extreme operating condition (such as the heating relatively in a large number of the relatively-high temperature of surrounding environment 102 or computer set 120), boosting fan 180 can increase the cooling power that cooling system falls and can strengthen thus in air pressure in the plenum chamber space 144.
In some implementations, the generation of having a fixed day except the date of certain number that chimney height H can for example be selected to based on the average annual thermograph that is used for particular ambient environment 102 in average year is used for the sufficient air-flow of cooling computer group 120 and does not use boosting fan 180.For example, a certain threshold temperature that chimney height H can be selected in height to surrounding environment 102 provides the abundant natural convection cooling to computer set 120, and this threshold temperature is less than the prospective peak value temperature of surrounding environment 102.On date when the temperature of environment 102 surpasses threshold temperature around, boosting fan 180 can be activated and become to replenish air-flow through chimney 150 so that abundant cooling computer group 120.As an example, chimney height H can be selected to average year more than 50% date during (during 90% or more dates) in average year fully cool off surrounding environment and do not use boosting fan 180.Can use the tolerance except the date.For example, chimney height H can be selected to certain number in average year hour or minute during abundant cooling computer group 150 and do not use boosting fan 180.The temperature data that is used for average expected year can be based on data center place or near thermograph.In addition, on the date when boosting fan 180 must be used for realizing fully cooling off, boosting fan 180 can not provide the air-flow that is enough to cooling computer group 120 when no chimney 150.Alternatively, can configuration data center 100 so that the two use of chimney 150 and boosting fan 180 possibly be to realize that fully cooling is necessary.
Air can pass through chimney breast 158 and flow out chimney 150 (step 440).Alternatively, air can flow into the ventilator inlet 164 of optional ventilator 160 from chimney breast 158.In the implementation that comprises c /v cap 160, ventilator 160 can be adjusted to and on specific direction, guide the air that leaves ventilator outlet 166.For example, ventilator 160 can be adjusted to and on the direction that becomes 90 ° of angles with wind direction W, guide the air (referring to Fig. 1, wind flows according to the wind speed w opposite with wind direction W) (step 450) that leaves chimney 150 at least.That is to say, possibly hope according to guiding the air (see figure 1) of leaving chimney 150 on the direction of the wind direction W that leaves wind flow (for example, opposite) with it.In some implementations, on the direction opposite, guide air can increase air-flow through chimney 150 with wind direction W.Be not limited to any particular theory, the air-flow increase can be along with wind around and pass that ventilator 160 flows and the result of Bei Nuli (Bernoulli) effect that occurs.That is to say, around and the wind flow of passing ventilator 160 can reduce air pressure in ventilator outlet 166, this can increase through the air velocity of chimney 150 and the air pressure that increases in the plenum chamber space 144 and falls.In some implementations, ventilator 160 can be designed to make the pressure drop maximization in ventilator outlet 166 that is caused by the Bei Nuli effect through the wind speed w that passes ventilator outlet 166 is maximized.
Above-described implementation can provide zero in the following advantage, some or all advantages.Through as with routine data in core cooling system compare and reduce to use fan and heat pump, can increase data center's energy efficiency and can reduce data center's power consumption.In addition, reduce be used to cool off data center and essential parts amount can improve data center reliability, can reduce and be used for the construction data center and essential cost and time, can reduce data center's maintenance cost and can reduce and be used to make data center to reach the standard grade and essential time quantum.
A plurality of embodiment of the present invention has been described.Yet, will understand, various modifications be can make and spirit of the present invention and scope do not broken away from.For example, chimney can be directed except vertically (such as on a side on hillside or angled along this side).As another example, chimney can be contained in the enclosure wall basically, and enclosure wall can be Zhongting or some other structure with high relatively ceiling (this ceiling can ambient open).In some implementations, can omit enclosure wall and data center and can ambient open.As additional example, chimney can be equipped with fluid and be communicated with the heating except computer set.Can be to the chimney heating to strengthen chimney effect.Correspondingly, other embodiment within the scope of the appended claims.

Claims (35)

1.一种数据中心，包括：1. A data center comprising: 计算机组；computer group; 充气室，与所述计算机组有流体连通；以及a plenum in fluid communication with the computer pack; and 烟囱，与所述充气室有流体连通，并且配置成使用来自所述计算机组的热以充分降低所述充气室中的气压，以使得跨所述计算机组的气流足以冷却所述计算机组以用于正常操作。a chimney in fluid communication with the plenum and configured to use heat from the computer bank to reduce the air pressure in the plenum sufficiently such that airflow across the computer bank is sufficient to cool the computer bank for in normal operation. 2.根据权利要求1所述的系统，还包括：2. The system of claim 1, further comprising: 助推风扇，配置成辅助来自所述充气室的气流经过所述烟囱。A booster fan configured to assist airflow from the plenum through the chimney. 3.根据权利要求2所述的系统，其中所述助推风扇无法引起所述充气室中的充分压降以流动足以在不存在烟囱时冷却所述计算机组的空气。3. The system of claim 2, wherein the booster fan is unable to induce a sufficient pressure drop in the plenum to flow sufficient air to cool the computer cluster in the absence of a chimney. 4.根据权利要求1所述的系统，其中所述烟囱被隔热成减少向周围环境耗散来自所述烟囱内部的气流的热。4. The system of claim 1, wherein the chimney is insulated to reduce dissipation of heat from the airflow inside the chimney to the surrounding environment. 5.根据权利要求1所述的系统，其中所述烟囱被配置成从周围环境吸热。5. The system of claim 1, wherein the chimney is configured to absorb heat from the surrounding environment. 6.根据权利要求1所述的系统，其中所述烟囱在所述充气室的底部上方延伸至少50英尺。6. The system of claim 1, wherein the chimney extends at least 50 feet above the bottom of the plenum. 7.根据权利要求1所述的系统，其中所述充气室包括配置成分离所述充气室内的空气与所述充气室外部的空气的隔板。7. The system of claim 1, wherein the plenum includes a partition configured to separate air within the plenum from air outside the plenum. 8.根据权利要求1所述的系统，还包括：8. The system of claim 1, further comprising: 可移动通风帽，附接到所述烟囱的上端，并且配置成指引烟囱开口离开风的方向。A movable cowl is attached to the upper end of the chimney and is configured to direct the chimney opening away from the direction of the wind. 9.根据权利要求1所述的系统，还包括：9. The system of claim 1, further comprising: 围墙，包围所述计算机组，并且具有形成于其中的用于所述烟囱的开口和空气入口。An enclosure surrounds the computer cluster and has an opening for the chimney and an air inlet formed therein. 10.根据权利要求1所述的系统，还包括：10. The system of claim 1, further comprising: 流体注入器，配置成向流过所述计算机组、并且流入所述充气室的入口气流施加流体。A fluid injector configured to apply fluid to the inlet airflow flowing through the computer cluster and into the plenum. 11.根据权利要求10所述的系统，其中所述流体包括水。11. The system of claim 10, wherein the fluid comprises water. 12.根据权利要求1所述的系统，还包括：12. The system of claim 1, further comprising: 热交换器，配置成冷却流过所述计算机组、并且流入所述充气室的入口气流。A heat exchanger configured to cool the inlet airflow flowing through the computer cluster and into the plenum. 13.根据权利要求12所述的系统，其中所述热交换器包括蒸发冷却器。13. The system of claim 12, wherein the heat exchanger comprises an evaporative cooler. 14.根据权利要求1所述的系统，其中所述计算机组包括计算机的机架。14. The system of claim 1, wherein the group of computers comprises a rack of computers. 15.根据权利要求14所述的系统，其中所述计算机组包括至少二十二个计算机。15. The system of claim 14, wherein the group of computers includes at least twenty-two computers. 16.根据权利要求1所述的系统，还包括配置成加热流过所述计算机组、并且流入所述充气室的入口气流的热源。16. The system of claim 1, further comprising a heat source configured to heat an inlet airflow flowing through the computer cluster and into the plenum. 17.根据权利要求16所述的系统，其中所述热源是从所述充气室或者烟囱提取的热空气。17. The system of claim 16, wherein the heat source is hot air extracted from the plenum or chimney. 18.一种为数据中心提供冷却的方法，包括：18. A method of providing cooling for a data center comprising: 使气流流过计算机组并且流入充气室；direct airflow through the computer cluster and into the plenum; 使所述气流流入烟囱的下部，所述烟囱被配置成使用来自所述计算机组的热以降低所述充气室中的气压，所述烟囱被配置成使用来自所述计算机组的热以充分降低所述充气室中的气压，从而使得跨所述计算机组的所述气流足以冷却所述计算机组以用于正常操作；directing the airflow into a lower portion of a chimney configured to use heat from the computer group to reduce the air pressure in the plenum, the chimney configured to use heat from the computer group to substantially reduce an air pressure in the plenum such that the airflow across the computer bank is sufficient to cool the computer bank for normal operation; 使所述气流流出所述烟囱的上部。The airflow is directed out the upper portion of the chimney. 19.根据权利要求18所述的方法，还包括：19. The method of claim 18, further comprising: 利用配置成使来自所述充气室的空气流过所述烟囱的助推风扇，助推进入所述烟囱的气流。Airflow into the chimney is boosted with a booster fan configured to flow air from the plenum through the chimney. 20.根据权利要求19所述的方法，其中所述助推风扇无法引起所述充气室中的充分压降，以在不存在所述烟囱时充分冷却所述计算机组。20. The method of claim 19, wherein the booster fan is unable to induce a sufficient pressure drop in the plenum to sufficiently cool the computer cluster in the absence of the chimney. 21.根据权利要求18所述的方法，其中所述烟囱被隔热成减少向周围环境耗散来自所述烟囱内部的所述气流的热。21. The method of claim 18, wherein the chimney is insulated to reduce dissipation of heat from the airflow inside the chimney to the surrounding environment. 22.根据权利要求18所述的方法，其中所述烟囱被配置成从周围环境吸热。22. The method of claim 18, wherein the chimney is configured to absorb heat from the surrounding environment. 23.根据权利要求18所述的方法，其中所述烟囱在所述充气室的底部上方延伸至少50英尺。23. The method of claim 18, wherein the chimney extends at least 50 feet above the bottom of the plenum. 24.根据权利要求18所述的方法，其中所述充气室包括配置成分离所述充气室内的空气与所述充气室外部的空气的隔板。24. The method of claim 18, wherein the plenum includes a partition configured to separate air within the plenum from air outside the plenum. 25.根据权利要求18所述的方法，其中所述计算机组由围墙包围，所述围墙具有形成于其中的用于所述烟囱的开口和空气入口。25. The method of claim 18, wherein the computer bank is surrounded by an enclosure having an opening for the chimney and an air inlet formed therein. 26.根据权利要求18所述的方法，还包括：26. The method of claim 18, further comprising: 调整附接到所述烟囱上端的可移动通风帽以指引烟囱开口离开风的方向。A movable cowl attached to the upper end of the chimney is adjusted to direct the chimney opening away from the direction of the wind. 27.根据权利要求18所述的方法，还包括：27. The method of claim 18, further comprising: 冷却流过所述计算机组、并且流入所述充气室的入口气流。An inlet airflow flowing through the computer cluster and into the plenum is cooled. 28.根据权利要求27所述的方法，其中所述冷却包括向所述入口气流施加流体。28. The method of claim 27, wherein the cooling includes applying a fluid to the inlet airflow. 29.根据权利要求28所述的方法，其中所述流体包括水。29. The method of claim 28, wherein the fluid comprises water. 30.根据权利要求27所述的方法，其中所述冷却包括使所述入口气流流过热交换器。30. The method of claim 27, wherein the cooling comprises passing the inlet gas stream through a heat exchanger. 31.根据权利要求30所述的方法，其中所述热交换器包括蒸发冷却器。31. The method of claim 30, wherein the heat exchanger comprises an evaporative cooler. 32.根据权利要求18所述的方法，其中所述计算机组包括计算机的机架。32. The method of claim 18, wherein the group of computers comprises a rack of computers. 33.根据权利要求31所述的方法，其中所述计算机组包括至少二十二个计算机。33. The method of claim 31, wherein the group of computers includes at least twenty-two computers. 34.根据权利要求18所述的方法，还包括加热流过所述计算机组并且流入所述充气室的入口气流。34. The method of claim 18, further comprising heating an inlet airflow flowing through the computer cluster and into the plenum. 35.根据权利要求34所述的方法，其中加热包括从所述充气室或者烟囱提取热空气。35. The method of claim 34, wherein heating includes extracting hot air from the plenum or chimney.
CN201080056706XA 2009-10-30 2010-10-25 Convective Cooling of Data Centers Using Chimneys Pending CN102812412A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/610,075 2009-10-30
US12/610,075 US20110105015A1 (en) 2009-10-30 2009-10-30 Convection Cooling of Data Center Using Chimney
PCT/US2010/053927 WO2011053547A2 (en) 2009-10-30 2010-10-25 Convection cooling of data center using chimney

Publications (1)

Publication Number Publication Date
CN102812412A true CN102812412A (en) 2012-12-05

Family

ID=43922958

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080056706XA Pending CN102812412A (en) 2009-10-30 2010-10-25 Convective Cooling of Data Centers Using Chimneys

Country Status (5)

Country Link
US (1) US20110105015A1 (en)
EP (1) EP2494422A2 (en)
CN (1) CN102812412A (en)
CA (1) CA2779239A1 (en)
WO (1) WO2011053547A2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111457403A (en) * 2020-04-22 2020-07-28 陈辉辉 A purification unit for organic waste gas
CN112827686A (en) * 2021-01-13 2021-05-25 施红龙 Air current decompression humidification reactor has
CN114914003A (en) * 2022-04-28 2022-08-16 中国舰船研究设计中心 Passive residual heat removal system without time limit

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8839254B2 (en) * 2009-06-26 2014-09-16 Microsoft Corporation Precomputation for data center load balancing
US20170027086A1 (en) * 2009-07-09 2017-01-26 Yahoo! Inc. Integrated building based air handler for server farm cooling system
US9207993B2 (en) 2010-05-13 2015-12-08 Microsoft Technology Licensing, Llc Dynamic application placement based on cost and availability of energy in datacenters
US20110278928A1 (en) * 2010-05-17 2011-11-17 Microsoft Corporation Wind-powered data center
US8849469B2 (en) 2010-10-28 2014-09-30 Microsoft Corporation Data center system that accommodates episodic computation
US9063738B2 (en) 2010-11-22 2015-06-23 Microsoft Technology Licensing, Llc Dynamically placing computing jobs
US20120204565A1 (en) * 2011-02-15 2012-08-16 Google Inc. Natural Convection Intercooler
US9595054B2 (en) 2011-06-27 2017-03-14 Microsoft Technology Licensing, Llc Resource management for cloud computing platforms
US9450838B2 (en) 2011-06-27 2016-09-20 Microsoft Technology Licensing, Llc Resource management for cloud computing platforms
CN103930847A (en) * 2011-10-26 2014-07-16 惠普发展公司，有限责任合伙企业 Device for cooling an electronic component in a data center
GB2500238B (en) * 2012-03-15 2014-04-30 Crowcon Detection Instr Ltd Passively cooled gas detector
US9144181B2 (en) * 2012-11-09 2015-09-22 Facebook, Inc. Cooling computing assets in a data center using hot and cold stacks
US9141155B2 (en) * 2012-11-09 2015-09-22 Facebook, Inc. Cooling computing assets in a data center using a hot stack
US9376928B2 (en) * 2013-10-28 2016-06-28 Solar Turbines Incorporated Power system enclosure
JP2015140969A (en) * 2014-01-29 2015-08-03 大成建設株式会社 building structure
US9933804B2 (en) 2014-07-11 2018-04-03 Microsoft Technology Licensing, Llc Server installation as a grid condition sensor
US10234835B2 (en) 2014-07-11 2019-03-19 Microsoft Technology Licensing, Llc Management of computing devices using modulated electricity
JP6374255B2 (en) * 2014-07-24 2018-08-15 学校法人東京理科大学 Ventilation system for data center
US11659693B2 (en) 2014-12-30 2023-05-23 Dale LeFebvre Heat removal systems and methods
EP3241418B1 (en) 2014-12-30 2021-05-12 Dale Lefebvre Data center heat removal systems and methods
US10133325B2 (en) * 2016-01-28 2018-11-20 Dell Products L.P. Enhanced convective cooling system
US12397253B1 (en) 2022-12-27 2025-08-26 S-M Enterprises, Inc. Computer farm ventilation system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956852A (en) * 1974-03-10 1976-05-18 Intreprinderea Metalui Rosu Cluj Air and soil treatment apparatus for a greenhouse
US20010029163A1 (en) * 2000-02-18 2001-10-11 Rtkl Associates Inc. Computer rack heat extraction device
US20050225936A1 (en) * 2002-03-28 2005-10-13 Tony Day Cooling of a data centre
CN101027951A (en) * 2004-10-11 2007-08-29 克尼尔有限公司 Cooling system for appliance and network cabinets, and method for cooling appliance and network cabinets

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6819563B1 (en) * 2003-07-02 2004-11-16 International Business Machines Corporation Method and system for cooling electronics racks using pre-cooled air
US6896612B1 (en) * 2004-01-26 2005-05-24 Sun Microsystems, Inc. Self-cooled electronic equipment enclosure with failure tolerant cooling system and method of operation
US7381129B2 (en) * 2004-03-15 2008-06-03 Airius, Llc. Columnar air moving devices, systems and methods
JP4426943B2 (en) * 2004-10-27 2010-03-03 インターナショナル・ビジネス・マシーンズ・コーポレーション Electronic device provided with cooling device inside casing
US7862410B2 (en) * 2006-01-20 2011-01-04 American Power Conversion Corporation Air removal unit
US7604535B2 (en) * 2006-04-27 2009-10-20 Wright Line, Llc Assembly for extracting heat from a housing for electronic equipment
KR100962400B1 (en) * 2007-12-17 2010-06-10 한국전자통신연구원 Combined rack system with separate hot air discharge, data center cooling system and method
US20090275279A1 (en) * 2008-05-04 2009-11-05 Skidmore Owings & Merrill Llp Energy efficient building

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3956852A (en) * 1974-03-10 1976-05-18 Intreprinderea Metalui Rosu Cluj Air and soil treatment apparatus for a greenhouse
US20010029163A1 (en) * 2000-02-18 2001-10-11 Rtkl Associates Inc. Computer rack heat extraction device
US20050225936A1 (en) * 2002-03-28 2005-10-13 Tony Day Cooling of a data centre
CN101027951A (en) * 2004-10-11 2007-08-29 克尼尔有限公司 Cooling system for appliance and network cabinets, and method for cooling appliance and network cabinets

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111457403A (en) * 2020-04-22 2020-07-28 陈辉辉 A purification unit for organic waste gas
CN112827686A (en) * 2021-01-13 2021-05-25 施红龙 Air current decompression humidification reactor has
CN112827686B (en) * 2021-01-13 2023-12-19 深圳惠优达科技有限公司 Air flow pressure reducing and humidifying reactor
CN114914003A (en) * 2022-04-28 2022-08-16 中国舰船研究设计中心 Passive residual heat removal system without time limit

Also Published As

Publication number Publication date
CA2779239A1 (en) 2011-05-05
US20110105015A1 (en) 2011-05-05
EP2494422A2 (en) 2012-09-05
WO2011053547A2 (en) 2011-05-05
WO2011053547A3 (en) 2011-08-18

Similar Documents

Publication Publication Date Title
CN102812412A (en) Convective Cooling of Data Centers Using Chimneys
EP2496890B1 (en) Data center cooling
US20100071869A1 (en) Cooling system
US8635881B2 (en) Data center with low power usage effectiveness
ES2507545T3 (en) Procedure and device to reduce the energy consumption of a center consisting of equipment that consumes a lot of energy
He et al. Comparative study on the performance of natural draft dry, pre-cooled and wet cooling towers
CN111656537A (en) Improvements in solar panels and harvesting of energy from the sun
Silva-Llanca et al. Improving energy and water consumption of a data center via air free-cooling economization: The effect weather on its performance
CN101523119A (en) Warm cooling for electronics
US9708978B2 (en) Heat engine
CN101502192A (en) Controlled Hot Air Capture
CN102410036B (en) High-speed mine return-air heat exchanger and application method thereof
US9760098B1 (en) Cooling a data center
US10030913B1 (en) Heat pipe dry cooling system
Ma et al. Quantitative research of spray cooling effects on thermo-flow performance of the large-scale dry cooling tower with an integrated numerical model
US8776535B1 (en) Ambient air vaporizer fog dispersal system
CN103582385B (en) Outdoor electronic newspaper stand and fast cooling device thereof
CN102339111A (en) data center
CN206851236U (en) A top-mounted heat exchange integrated cabinet
CN204240826U (en) Aerial condenser system
CN104329955B (en) Aerial condenser system
CN105509502A (en) Water-saving central air-conditioning cooling tower capable of generating electricity
CN106931817B (en) Movable air heat trap
JP2016211775A (en) Air-air heat exchanger bypass for wet type cooling tower device and method
TWI633830B (en) Cooling system for data center

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
ASS Succession or assignment of patent right

Owner name: GOOGLE INC.

Free format text: FORMER OWNER: EXAFLOP LLC

Effective date: 20140506

C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20140506

Address after: American California

Applicant after: Google Inc.

Address before: American California

Applicant before: Exaflop LLC

C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20121205