CN102815665A - Interface method of micro-fluidic pipeline embedded in low-temperature co-fired ceramic substrate - Google Patents
Interface method of micro-fluidic pipeline embedded in low-temperature co-fired ceramic substrate Download PDFInfo
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- CN102815665A CN102815665A CN2011101510559A CN201110151055A CN102815665A CN 102815665 A CN102815665 A CN 102815665A CN 2011101510559 A CN2011101510559 A CN 2011101510559A CN 201110151055 A CN201110151055 A CN 201110151055A CN 102815665 A CN102815665 A CN 102815665A
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Abstract
本发明公开了一种低温共烧陶瓷基板内嵌微流管道的接口方法，在基板表面制作金属化环形焊盘环绕微流管道口，然后将内壁具有密封螺纹的金属套环焊接在环形焊盘上，同时选择合适外径的连接管，在其管头外壁加工出与金属套环内壁密封螺纹相匹配的密封外螺纹，将该连接管与金属套环通过密封螺纹旋拧连接，即可实现基板内嵌微流管道与外部的方便可靠连接。
The invention discloses an interface method for micro-fluid pipelines embedded in a low-temperature co-fired ceramic substrate. A metallized annular pad is made on the surface of the substrate to surround the mouth of the micro-fluid pipeline, and then a metal collar with a sealing thread on the inner wall is welded to the annular pad. At the same time, select a connecting pipe with a suitable outer diameter, process a sealing external thread on the outer wall of the pipe head that matches the sealing thread on the inner wall of the metal collar, and screw the connecting pipe and the metal collar through the sealing thread to realize The microfluidic pipeline embedded in the substrate is conveniently and reliably connected to the outside.
Description
Technical field
The invention belongs to MEMS (MEMS) encapsulation technology field, particularly the embedded microflow channels pipeline joint of LTCC (LTCC) substrate method.
Background technology
MEMS (Micro-electro-mechanical System) is commonly referred to MEMS, is microdevice or the system that integrates micro mechanism, microsensor, miniature actuator and signal processing circuit, control circuit, various interface, communication and power supply etc.Electronic mechanical system integrated can fundamentally solve the miniaturization issues of information system, realizes the functions that can't realize before many, with propulsion information obtain, the coordinated development of information processing, information operating etc.MEMS is encapsulated as integrated platform and the working environment that an interconnection is provided and supports of MEMS device, is one of key link of MEMS product function realization.
Having wide range of applications of MEMS product; Relate to every field; One type of MEMS product that relates to microfluid is wherein arranged; Like chemical MEMS, biological MEMS, medical science MEMS etc., various miniflow reagent are arranged in this type MEMS device as the object (like chemical solution or blood sample etc.) or the operation material (like fuel or printing ink etc.) that detect and analyze.Be exactly microelectronic chip and device in addition, like 3-D stacks chip, high-power electronic device etc., because integration density improves constantly with power and constantly increases, heat flow density also constantly increases.The centre of high-density packages body particularly, because far away from the border, thermal resistance is higher, forms high temperature hotspot easily, causes systemic-function to lose efficacy even damages.Utilize traditional radiating mode such as fin and air-cooled etc. unsatisfactory, need use the radiating mode of liquid cooling the radiating effect of the high-power micro-system packaging body of high density.Microchannel liquid cooling heat radiation is the heat radiation solution of the commonplace employing of the powerful high-end micro-system of present high density.
LTCC (LTCC) substrate piles up common burning by laminated ceramic chips and forms.Owing to burn temperature low (about 900 ℃) altogether, can burn altogether with low resistivity conductor wiring material (like Au, Ag, Cu etc.), wiring and layer stereo interconnection realize becoming more meticulous.Ltcc substrate has the high-frequency and high-Q characteristic, is applicable to high-frequency circuit and microwave circuit; Passive elements such as substrate can embedded resistance, electric capacity, inductance improve integration density; Ltcc substrate also has good temperature characterisitic, and heat conduction is good; And have favorable mechanical characteristic and chemical characteristic, but adverse circumstances such as high-temperature corrosion resistance.The very important point is in addition, ltcc substrate is first machining on ceramic chips, after laminate and sintering forms; Because the ceramic chips quality is soft; Make things convenient for machine cuts and punching, thus can in substrate, process microcavity body and microchannel, for the MEMS encapsulation offers convenience.Because the above-mentioned good characteristic of ltcc substrate, it is not only having great advantage aspect the circuit package of substrate level system, and is also having wide practical use aspect the microfluid encapsulation.
Use at present method and the technology maturation comparatively that the LTCC fabrication techniques is embedded in the miniflow pipeline of substrate; But improve not enough and ripe to the method for the microflow channels pipeline joint between substrate and the substrate, between substrate and the external system and technology, also have very big gap from standardization.To ltcc substrate miniflow pipeline and outside interface method, mainly contain following two kinds in the present existing document: a kind of adhesives such as epoxy resin, polyvinyl alcohol glue that are to use are bonding with metal microtubule or organic plastics microtubule and ltcc substrate.Though this method is simple, because substrate miniflow line size less (0.1mm magnitude) is difficult to location and fixing in bonding process; And microtubule road junction easy blocking; The operation easier that causes processing is big, even makes substrate discarded because of microchannel stops up, and is not suitable for large-scale processing production.Another kind method is a weld metal microtubule on ltcc substrate, at first makes metal pad at substrate surface, with scolder metal pad and metal microtubule is welded then.This method is that the location is difficult equally, inconvenient operation, and also because the contact-making surface of metal microtubule and substrate is little, and weld stress is big, Mechanical Reliability is poor.Above-mentioned two kinds of interface methods also have a common problem to be, the connection of interface is connection that fix, permanent, can not plug easily and dismantle, and are not suitable for the system's (disposable microtubule is used in detection like medical science) that needs the frequent change microtubule.
Summary of the invention
The objective of the invention is to defective, propose a kind of interface method that is applicable to the embedded miniflow pipeline of ltcc substrate, to realize ltcc substrate microfluid system and outside convenient and reliable the connection to the existing embedded microflow channels pipeline joint of ltcc substrate method.
The interface method of the embedded miniflow pipeline of ltcc substrate of the present invention; Make metallization annular welds disk ring on the ltcc substrate surface around the microflow channels road junction; The metallic sheath loops welded that then inwall is had a sealing thread is on the annular pad of metallization; Select the tube connector of suitable external diameter simultaneously; Process the sealing external screw thread that is complementary with metal collar inner wall sealing screw thread at its tube head outer wall, this tube connector is screwed through sealing thread with the metal collar be connected, can realize embedded miniflow pipeline of substrate and outside convenient and reliable the connection.
In the above-mentioned interface method; The preparation method of annular pad of metallizing has following two kinds: a kind of is co-firing technology; On ceramic chips, print the thick film metal slurry according to design drawing, burn altogether with ceramic chips then, in the substrate sintering, form the annular pad of metallization; Another kind is the back firing technique, prints the thick film metal slurry around the microflow channels road junction of the substrate behind sintering, and then sinters the annular pad of metallization into.Wherein, the slurry of making annular pad can be metal paste or their mixed slurries such as gold, silver, copper, zinc.The metal paste printing process of making annular pad can be methods such as serigraphy, mask printing or the printing of curtain coating type.
In the above-mentioned interface method, make the effect that sealing thread will reach liquid sealing or air seal as required at metal collar inwall, the metal material of making the metal collar can be copper, aluminium, aluminium alloy, kovar alloy etc.
In the above-mentioned interface method, the metallic sheath loops welded can be adopted welding methods such as scolder weldering, melting welding or soldering on the metallization annular pad of ltcc substrate.
In the above-mentioned interface method, said tube connector can be metal tube or organic plastics pipe etc.
The advantage of the ltcc substrate interface method of embedded miniflow pipeline is among the present invention:
A) because the relative tube connector of size of the metal collar more greatly, with the substrate convenient welding, and can improve the stress ability to bear at microflow channels pipeline joint place, improve the mechanical strength and the reliability of interface;
B), both can realize the sealing that connects can making installation, dismounting and the replacing of tube connector simple and convenient again owing to adopted sealing thread;
C) this method of attachment only needs the internal thread of the metal collar and the external screw thread mechanical snap of tube connector to get final product, and is little to the material properties requirement of tube connector, both can be metal material, also can be organic plastics or other material.
Description of drawings
Fig. 1 is ltcc substrate miniflow pipeline of the present invention and the outside microtubule syndeton sketch map that is connected.
Fig. 2 is an embodiment of the invention 1LTCC substrate liquid cooling heat radiation system generalized section.
Fig. 3 is an embodiment of the invention 2LTCC pressure sensor generalized section.
Wherein:
1---ltcc substrate 2---tapped metal collar 3---is with externally threaded connection microtubule
4---miniflow pipeline 5---scolder 6---heating electronic component
7---strain resistor 8---microcavity body
The specific embodiment
In interface method of the present invention; Ltcc substrate miniflow pipeline is as shown in Figure 1 with the outside structure that is connected after microtubule connects; Ltcc substrate 1 embedded miniflow pipeline 4; The tapped metal collar 2 is welded on the metallization annular pad at microflow channels road junction, and this metal collar 2 is again with being with externally threaded connection microtubule 3 to be screwed in.Below in conjunction with accompanying drawing,, but do not limit the present invention in any way through different miniflow pipeline application example further explain the present invention.
Adopt the interface method among the present invention to realize that the outside of ltcc substrate miniflow pipeline liquid cooling heat radiation system connects.Referring to Fig. 2, the miniflow pipeline 4 in the ltcc substrate 1 transports coolant to the refrigeration of dispelling the heat of ltcc substrate 1 surface-pasted heating electronic component 6, and the coolants that flow in the miniflow pipeline 4 are through tube connector 3 input and output.Accomplish the preparation of this structure according to following method:
1, the method that adopts lamination to burn altogether processes the base plate for packaging 1 of embedded miniflow pipeline 4, comprises the steps:
1) global design ltcc substrate 1 package system is drawn out the design drawing of each layer, comprise in the drawing each layer wiring, via hole, metallization annular pad, miniflow pipeline, in bury the location layout etc. of device;
2) according to each layer of figure paper conversion LTCC ceramic chips, wherein, the making of metal line, vertical vias, metallization annular pad etc. adopts printing slurry methods, the making of miniflow pipeline to adopt the method for secret lathe micromechanics cutting or cut;
3) method that laminates of static state such as employing is stacked the ceramic chips that each layer processes, and in sintering furnace, burns till incorporate substrate then altogether, and miniflow pipeline 4 is embedded in the substrate body.Laminate in the process with sintering at substrate and can fill sacrificial layer material such as graphite, paraffin, rosin, with prevent embedded miniflow pipeline substrate laminate with sintering process in distortion or avalanche.
2, make the metal collar 2 of band sealing internal thread.
3, the metal collar 2 is welded on the annular pad at substrate microflow channels road junction, the annular pad at microflow channels road junction can be made at the co-firing technology according to step 1, also can after step 1, republish the metal paste figure, adopts the back firing technique to make; Solder 5 welding are adopted in welding.
4, surface adhered with electronic component 6.
5, connecting the external seal external screw thread that processes on the microtubule 3 with the metal collar 2 couplings.
6, will connect microtubule 3 and screw with the metal collar 2 and be connected, and connect microtubule 3 and link to each other with the Micropump that transports coolant again.Through coolant flow circuit in substrate miniflow pipeline 4, surface-pasted heating electronic component 6 is played the effect of heat radiation refrigeration.
Adopt the interface method among the present invention to realize that the LTCC pressure sensor is connected with the detected fluid system.Referring to Fig. 3; Has microcavity body 8 in the ltcc substrate 1; Fluid in the microcavity body 8 is through miniflow pipeline 4 and the detected fluid system connectivity that is connected the microtubule 3 and the external world, and the LTCC film surface on microcavity body 8 has strain resistor 7, in order to the fluid pressure in the perception microcavity body 8.Prepare this structure according to following method:
1, the method that adopts lamination to burn altogether earlier processes the base plate for packaging 1 of embedded miniflow pipeline 4, comprises the steps:
1) global design ltcc substrate 1 package system is drawn out the design drawing of each layer, comprise in the drawing each layer wiring, via hole, metallization annular pad, miniflow pipeline, microcavity body, in bury the location layout etc. of device;
2) according to each layer of figure paper conversion LTCC ceramic chips, wherein, the printing slurry methods is adopted in the making of metal line, vertical vias, pad etc., and the method for secret lathe micromechanics cutting or cut is adopted in the making of miniflow pipeline and microcavity body;
3) method that laminates of static state such as employing is stacked the ceramic chips that each layer processes, and in sintering furnace, burns till incorporate substrate then altogether, and miniflow pipeline 4 is embedded in the substrate body with microcavity body 8.Laminate in the process with sintering at substrate and can fill sacrificial layer material such as graphite, paraffin, rosin, with prevent embedded miniflow pipeline and microcavity body substrate laminate with sintering process in distortion or avalanche.
2, on substrate 1, make strain resistor 7.Adopt the method printing strain metal paste of serigraphy, in step 1, be total to burning or step 1 and adopt the back firing technique to process afterwards.
3, make the metal collar 2 of band sealing internal thread.
4, the metal collar 2 is welded on the metallization annular pad at substrate microflow channels road junction.The metallization annular pad at microflow channels road junction can be made at the co-firing technology according to step 1, also can after step 1, republish the metal paste figure, adopts the back firing technique to make; Solder 5 welding are adopted in welding.
5, connecting the external seal external screw thread that processes on the microtubule 3 with the metal collar 2 couplings.
6, will connect microtubule 3 screws with the metal collar 2 and is connected; Connect microtubule 3 and detected fluid system connectivity; Fluid in the microcavity body 8 (liquid or gas) pressure makes cavity upper surface LTCC rete generation strain, and then changes the resistance of strain resistor 7, makes it to become a pressure sensor.
In addition, interface method of the present invention can also be used for the interconnection between ltcc substrate and the substrate, and polylith is communicated with based on the fluid encapsulation micro-system of ltcc substrate, forms microfluid system PoP (Package on Package) structure.This interface method will have very big using value based among the sensor of microfluid system and biology, medical science, the chemical MEMS.
Though description of the invention is with reference to limited embodiment; But those of ordinary skills should therefrom recognize various modifications and variation; And should be appreciated that accompanying claims has covered all such modifications and variation, they all are positioned within practicalness of the present invention and the scope.
Claims (8)
1. the interface method of the embedded miniflow pipeline of low-temperature co-fired ceramic substrate; Make metallization annular welds disk ring on the low-temperature co-fired ceramic substrate surface around the microflow channels road junction; The metallic sheath loops welded that then inwall is had sealing thread is on annular pad; While processes the external screw thread that is complementary with metal collar inner wall sealing screw thread at tube connector tube head outer wall, tube connector is screwed through sealing thread with the metal collar to be connected at last.
2. interface method as claimed in claim 1; It is characterized in that; Adopt co-firing technology to make the annular pad of metallization: according to design drawing type metal slurry on the LTCC ceramic chips, to burn altogether, in the substrate sintering, form the annular pad of metallization with ceramic chips.
3. interface method as claimed in claim 1 is characterized in that, adopts the back firing technique to make the annular pad of metallization: type metal slurry around the microflow channels road junction of the low-temperature co-fired ceramic substrate behind sintering, and then sinter the annular pad of metallization into.
4. like claim 2 or 3 described interface methods, it is characterized in that said metal paste is the slurry of gold, silver, copper or zinc or their mixed slurry.
5. interface method as claimed in claim 4 is characterized in that, adopts serigraphy, mask printing or curtain coating type printing process type metal slurry when making the annular pad of metallization.
6. interface method as claimed in claim 1 is characterized in that, the method that adopts scolder weldering, melting welding or soldering with the metallic sheath loops welded on annular pad.
7. interface method as claimed in claim 1 is characterized in that, adopts copper, aluminium, aluminium alloy or kovar alloy to make the metal collar.
8. interface method as claimed in claim 1 is characterized in that, said tube connector is metal tube or organic plastics pipe.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115159446A (en) * | 2022-06-17 | 2022-10-11 | 燕山大学 | Preparation method of silicon micro/nano column |
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| CN101733174A (en) * | 2008-11-07 | 2010-06-16 | 中国科学院大连化学物理研究所 | Connecting interface and application thereof in mircofluidic chip system |
| CN101875481A (en) * | 2010-06-29 | 2010-11-03 | 北京大学 | A MEMS packaging method based on low temperature co-fired ceramics |
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- 2011-06-07 CN CN2011101510559A patent/CN102815665A/en active Pending
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| US20020130408A1 (en) * | 2000-12-19 | 2002-09-19 | Harris Corporation | Method for making electronic devices including silicon and LTCC and devices produced thereby |
| CN101249482A (en) * | 2006-12-27 | 2008-08-27 | 精工爱普生株式会社 | Droplet ejection device, and device manufacturing method |
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Application publication date: 20121212 |