CN102814603A - A kind of water-based flux of nano raw materials and its preparation process - Google Patents

Abstract

The invention relates to the technical field of welding flux materials, in particular to a water-based welding flux of a nano raw material and a preparation process thereof; the water-based soldering flux of the nano raw material takes water as a solvent, consists of a nano activating agent, a nano film-forming agent, a surfactant and a nano mildew-proof antibacterial agent according to a certain proportion, does not contain volatile organic compounds, is halogen-free, can effectively inhibit the growth of microorganisms (such as bacteria, fungi and mildew), does not basically corrode a circuit board and a conveyor belt during welding, does not need to be cleaned after welding, and is really safe and environment-friendly; the production process disclosed by the invention is suitable for coating the soldering flux on the welding surface of the PCB in a spraying, dipping and foaming mode to realize lead-free welding of electronic products, and can solve the problems of the water-based soldering flux without micro-wrapping, and does not need heating and complex reaction processes, so that the process is simple and reliable, and time and labor are saved; and the solid content is lower, so that the use amount of solid substances is reduced, and the cost is reduced.

Description

A kind of water-based flux of nano raw materials and its preparation process

technical field

The invention relates to the technical field of flux materials, in particular to a nano-material water-based flux and a preparation process thereof.

Background technique

In the field of electronic brazing, flux is a very important auxiliary material. Traditional fluxes are mainly organic solvent-based, using alcohols with low boiling points (such as methanol, ethanol, isopropanol, etc.) It may also cause adverse effects on the environment and human body. In recent years, people have begun to develop fluxes that use water as a solvent matrix, that is, "water-based fluxes", which have the advantages of environmental protection, no-cleaning and safety, but they severely corrode circuit boards and conveyor belts during lead-free soldering. In addition, the growth of microorganisms (such as bacteria, fungi and molds) not only affects solderability, but also the microbial residues after welding affect electrical conductivity.

Based on the above situation, the applicant applied for a patent for invention and obtained the authorization: ZL200810026633.4, which is halogen-free and can effectively inhibit the growth of microorganisms (such as bacteria, fungi and molds), and basically does not cause corrosion to circuit boards and conveyor belts during welding. After cleaning, it is a truly safe and environmentally friendly flux. However, in this patented technology, it is necessary to process the micro-encapsulation of the activator through processes such as dissolving, stirring, drying, and grinding. high.

Contents of the invention

The present invention aims at the deficiencies existing in the current water-based soldering flux, and provides a water-based soldering flux of nano-materials which solves the above problems.

To achieve the above object, the present invention adopts the following technical solutions:

A kind of water-based flux of nano raw material, described flux is to contain the aqueous solution that forms by mass percentage by following substance:

Preferably, the solvent water is deionized water; the deionized water has few impurities, low conductivity and good use effect.

Preferably, the nano-activator is one or more of nano-salicylic acid, nano-itaconic acid, nano-citric acid, nano-tartaric acid, nano-glycolic acid, nano-pimelic acid, and the main function of the nano-activator is Remove oxides from the lead pins and from the surface of the molten solder.

Preferably, the nano-film-forming agent is one or more of nano-organosilicon-modified water-based acrylic resin, nano-water-based acrylic resin, and nano-rosin-modified water-based acrylic resin. After welding, the printed circuit board is coated with a uniform protective film, and on the other hand, it plays a role in protecting the solder joints from re-oxidation during the welding process.

Preferably, the surfactant is a nonionic surfactant or a cationic surfactant, and the surfactant is dodecylphenol polyoxyethylene ether, octylphenol polyoxyethylene ether, nonylphenol polyoxyethylene ether, and nonylphenol polyoxyethylene ether. One or more of oxyethylene ether, lauryl dimethyl amine oxide, and tetradecyl dimethyl amine oxide, whose main function is to reduce surface tension, enhance wetting force, and improve solderability.

Preferably, the nano antifungal and antibacterial agent is one or more mixtures of nano ethylene glycol chitosan, nano hydroxypropyl chitosan, and nano turmeric root alcohol, and its main function is to inhibit microorganisms (such as Bacteria, fungi and mold) grow in water, improving solderability and post-weld service reliability.

A method for preparing nano-principle water-based flux: it is characterized in that it comprises the following steps:

a. Raw material preparation: Prepare nano-activator, nano-film-forming agent, surfactant, nano-mold anti-mold and anti-bacterial agent and solvent water according to the ratio of the above ingredients;

b. Preliminary mixing: Pour the solvent water, nano-activator, and nano-film-forming agent prepared in step a into the reaction kettle to mix and stir until completely dissolved;

c. Mixed finished product: on the basis of step b, add the surfactant and nano antifungal and antibacterial agent prepared in step a, and stir until completely dissolved to obtain the water-based flux of nano raw materials of the present invention.

The beneficial effect of the present invention is that: the water-based flux of the nano raw material of the present invention uses water as a solvent, and is composed of a certain proportion of nano-activator, nano-film-forming agent, surfactant, and nano-mold anti-mold and antibacterial agent, and does not contain volatile organic compounds , Halogen-free, can effectively inhibit the growth of microorganisms (such as bacteria, fungi and molds), basically does not cause corrosion to circuit boards and conveyor belts during welding, and does not need to be cleaned after welding. It is a truly safe and environmentally friendly flux; suitable for spraying, dipping, hair It is coated on the soldering surface of the PCB board by foaming method to realize lead-free soldering of electronic products. In addition, the production process of the present invention can solve the problem of water-based flux without micro-wrapping, without heating and complicated reaction process, and the process is simple The process is simple and reliable, saving time and effort; lower solid content, thereby reducing the use of solid substances and reducing costs.

Detailed ways:

Below in conjunction with embodiment, the present invention is further elaborated:

Example 1:

The preparation process of the present embodiment is as follows:

a. Preparation of raw materials: Prepare nano-activator, nano-film-forming agent, surfactant, nano-mold anti-mold and anti-bacterial agent and solvent water according to the above-mentioned ratio of each component;

b. Preliminary mixing: Pour the solvent water, nano-activator, and nano-film-forming agent prepared in step a into the reaction kettle to mix and stir until completely dissolved;

c. Mixed finished product: on the basis of step b, add the surfactant and nano antifungal and antibacterial agent prepared in step a, and stir until completely dissolved to obtain the water-based flux of nano raw materials of the present invention.

Example 2:

The production process is similar to Example 1, and will not be described in detail (the following examples will not be described either)

Example 3:

Example 4:

The above products have been tested by our company. Table 1 is a comparison of the experimental results of the above 4 embodiments of the present invention for soldering flux and copper mirror corrosion test results. It proves that the preparation process of the present invention and the water-based flux of nano raw materials have good flux. Weldability and corrosion resistance.

Table 1 Comparison data of the test results of soldering flux and copper mirror corrosion in Examples 1-4

Of course, the above descriptions are only preferred embodiments of the present invention, so all equivalent changes or modifications made according to the structures, features and principles described in the scope of the patent application of the present invention are included in the scope of the patent application of the present invention.

Claims (8)

1. the water-based scaling powder of a nano raw material, said scaling powder is to contain the aqueous solution that forms by mass percentage by following material:

2. the water-based scaling powder of nano raw material according to claim 1, it is characterized in that: said aqueous solvent is a deionized water.

3. the water-based scaling powder of nano raw material according to claim 1 is characterized in that: described nanometer activator is one or more in nanometer salicylic acid, nanometer itaconic acid, nanometer citric acid, nanometer tartaric acid, nano alcohol acid, the nanometer pimelic acid.

4. the water-based scaling powder of nano raw material according to claim 1, it is characterized in that: described nanometer film forming agent is one or more in nano-organosilicon modified aqueous acrylic acid resin, nanometer water acrylic resin, the Abietyl modified aqueous acrylic resin of nanometer.

5. the water-based scaling powder of nano raw material according to claim 1, it is characterized in that: described surfactant is non-ionic surface active agent or cationic surfactant.

6. the water-based scaling powder of nano raw material according to claim 5 is characterized in that: said surfactant is wherein one or more of dodecyl phenol polyethenoxy ether, OPEO, NPE, DDAO, CH3-(CH2)13N(CH3)2-O.

7. the water-based scaling powder of nano raw material according to claim 1, it is characterized in that: described nano mildew-proof antiseptic is one or more mixing in nanometer glycol-chitosan, nanometer hydroxypropyl chitosan, the nanometer yellow ginger root alcohol.

8. the preparation method of a nanometer principle water-based scaling powder: it is characterized in that, comprise the steps:

A, raw material are prepared: be ready to nanometer activator, nanometer film forming agent, surfactant, nano mildew-proof antiseptic and aqueous solvent by any described component ratio of claim 1-7;

B, the preliminary mixing:, pour into to mix in the agitated reactor and be stirred to fully and dissolve with aqueous solvent, nanometer activator, the nanometer film forming agent that step a prepares;

C, mixing finished product: on step b basis, add surfactant, the nano mildew-proof antiseptic that is equipped with among the step a, and be stirred to dissolving fully, promptly get the water-based scaling powder of nano raw material of the present invention.