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CN102814429B - Manufacture method of light-emitting diode (LED) assembling screen and bottom casing - Google Patents

Manufacture method of light-emitting diode (LED) assembling screen and bottom casing Download PDF

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Publication number
CN102814429B
CN102814429B CN201210153956.6A CN201210153956A CN102814429B CN 102814429 B CN102814429 B CN 102814429B CN 201210153956 A CN201210153956 A CN 201210153956A CN 102814429 B CN102814429 B CN 102814429B
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stamping
installation
led
hole
base material
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CN102814429A (en
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李漫铁
王虹丽
彭德华
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Ledman Optoelectronic Co Ltd
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Ledman Optoelectronic Co Ltd
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Abstract

本发明公开了一种LED拼装屏底壳制造方法,所述方法包括:准备LED拼装屏底壳冲压模具;在模具内放入底壳冲压基材;对基材进行第一次冲压,得到底面具有四个以上成非直线分布的安装通孔的板材;对具有安装通孔的板材进行第二次冲压,得到顶面开口、四侧面及底面封闭的具有安装通孔的U型槽状体状的LED拼装屏底壳;对具有安装通孔的板材进行第二次冲压的步骤之前或之后,对基材或对底面具有安装通孔的底壳进行第三次冲压,得到底面具有电源接口的板材,或其中一侧壁具有电源接口的底壳。本发明采用冲压成型工艺制作LED拼装屏底壳,底壳的制造材料采用强度高且质量轻的冲压基材,仅需两次冲压即可成型,得到轻薄精致、强度高、防水效果好的LED拼装屏底壳。

The invention discloses a method for manufacturing the bottom case of an LED assembled screen. The method comprises: preparing a stamping mold for the bottom case of an LED assembled screen; placing the bottom case in the mold to stamp a base material; and stamping the base material for the first time to obtain a bottom surface A plate with more than four installation through holes distributed in a non-linear manner; a second stamping is performed on the plate with installation through holes to obtain a U-shaped groove with an opening on the top surface, four sides and a closed bottom surface with installation through holes The bottom shell of the LED assembled screen; before or after the second stamping step on the plate with the installation through hole, the third stamping is performed on the base material or the bottom shell with the installation through hole on the bottom surface to obtain a power interface on the bottom surface Plate, or a bottom case with a power connection on one side wall. The present invention adopts a stamping forming process to manufacture the bottom shell of the LED assembled screen, and the manufacturing material of the bottom shell is a high-strength and light-weight stamping base material, which can be formed by only two stampings to obtain light, thin, delicate, high-strength, and good waterproof LEDs. Assemble the bottom case of the screen.

Description

LED拼装屏底壳制造方法Manufacturing method of LED assembled screen bottom shell

技术领域 technical field

本发明涉及LED显示领域,尤其涉及一种LED拼装屏底壳制造方法。  The invention relates to the field of LED displays, in particular to a method for manufacturing a bottom case of an LED assembled screen. the

背景技术Background technique

现有LED显示屏包括常规显示屏和条幕屏,其中:  Existing LED display screens include conventional display screens and strip screens, of which:

1)常规显示屏,包括厚重的箱体,屏体体积大,重量重,对安装载体要求高,且需要占用较大的维护空间。常规显示屏的箱体是通过钣金加焊接工艺制作,其加工精度不足,尺寸公差难以保证,有焊接变型及焊缝漏水风险。  1) Conventional display screens, including heavy cabinets, are large in size and heavy in weight, have high requirements for installation carriers, and require a large maintenance space. The box body of conventional display screens is made by sheet metal and welding process. The processing accuracy is insufficient, the dimensional tolerance is difficult to guarantee, and there are risks of welding deformation and weld leakage. the

2)条幕屏,使用条形LED灯条与控制箱体直接连接,中间具有通孔连接,连接处使用硅胶密封圈和螺丝压紧的模式进行防水,控制箱体的电力和信号线材通过此通孔连接到条形LED灯条上,体积小重量轻,且具有通透性,维护安装成本都相对较低。但此种屏体受结构限制,其安装的结构强度不足,容易导致外力碰撞型损伤。为了克服条形屏结构强度的不足,也有使用注塑工艺来制作条形屏底壳,但是由于注塑工艺在制作大尺寸、小批量产品时,其模具费用高昂,成本较高。  2) Strip screen, use the strip-shaped LED light strip to connect directly with the control box, with a through-hole connection in the middle, and use a silicone sealing ring and screw compression mode for waterproofing at the connection, through which the power and signal wires of the control box pass The through hole is connected to the strip LED light strip, which is small in size, light in weight, transparent, and relatively low in maintenance and installation costs. However, this kind of screen is limited by its structure, and the structural strength of its installation is insufficient, which is easy to cause damage due to external force collision. In order to overcome the lack of structural strength of the strip screen, an injection molding process is also used to make the bottom shell of the strip screen. However, when the injection molding process is used to produce large-scale and small-batch products, the cost of the mold is high and the cost is relatively high. the

发明内容 Contents of the invention

本发明主要解决的技术问题是提供一种采用冲压的加工工艺制作而成的体积小、重量轻且结构强度高的LED拼装屏及其底壳、以及底壳制造方法。  The technical problem mainly solved by the present invention is to provide a small-volume, light-weight and high-strength LED assembled screen, its bottom shell, and a manufacturing method for the bottom shell, which are produced by stamping processing technology. the

为解决上述技术问题,本发明采用的一个技术方案是:提供一种LED拼装屏底壳制造方法,包括以下步骤:  In order to solve the above technical problems, a technical solution adopted by the present invention is to provide a method for manufacturing the bottom shell of an LED assembled screen, comprising the following steps:

准备LED拼装屏底壳冲压模具;  Prepare the stamping mold for the bottom shell of the LED assembled screen;

在所述底壳冲压模具内放入底壳冲压基材;  Putting the stamping base material of the bottom shell in the stamping die of the bottom shell;

对所述底壳冲压基材进行第一次冲压,得到底面具有安装通孔的板材;  Stamping the stamping base material of the bottom shell for the first time to obtain a plate with a through hole for installation on the bottom surface;

对所述具有安装通孔的板材进行第二次冲压,得到顶面开口、四侧面及底面封闭的具有安装通孔的U型槽状体状的LED拼装屏底壳。  The plate with the installation through hole is punched a second time to obtain a U-shaped groove-shaped LED assembly screen bottom case with an installation through hole that is open on the top surface and closed on the four sides and the bottom surface. the

其中,在对所述具有安装通孔的板材进行第二次冲压,得到顶面开口、四侧面及底面封闭的具有安装通孔的U型槽状体的步骤之前,还包括:对冲压基材进行第三次冲压,得到底面具有电源接口的板材。  Wherein, before performing the second stamping on the plate with the installation through hole to obtain the U-shaped groove-shaped body with the installation through hole with the top open, the four sides and the bottom surface closed, it also includes: punching the base material Perform the third stamping to obtain a plate with a power interface on the bottom surface. the

其中,对所述具有安装通孔的板材进行第二次冲压,得到顶面开口、四侧面及底面封闭的具有安装通孔的U型槽状体的步骤之后,还包括:对所述底面具有安装通孔的LED拼装屏底壳进行第三次冲压,得到其中一侧壁具有电源接口的LED拼装屏底壳。  Wherein, after the step of carrying out the second stamping on the plate with the installation through hole to obtain the U-shaped groove-shaped body with the installation through hole with the top open, the four sides and the bottom closed, it also includes: The bottom case of the assembled LED screen with the through holes is punched for the third time to obtain the bottom case of the assembled LED screen with a power interface on one side wall. the

其中,对所述底壳冲压基材进行第一次冲压,得到底面具有安装通孔的板材的步骤中,包括:对所述底壳冲压基材进行第一次冲压,得到底面具有两个安装通孔的板材。  Wherein, the step of stamping the stamping base material of the bottom shell for the first time to obtain a plate with mounting through holes on the bottom surface includes: stamping the stamping base material of the bottom shell for the first time to obtain two mounting holes on the bottom surface. through-hole sheet. the

其中,对所述底壳冲压基材进行第一次冲压,得到底面具有安装通孔的板材的步骤中,包括:对所述底壳冲压基材进行第一次冲压,得到底面具有三个安装通孔的板材。  Wherein, the step of stamping the stamping base material of the bottom shell for the first time to obtain a plate with mounting through holes on the bottom surface includes: stamping the stamping base material of the bottom shell for the first time to obtain three mounting holes on the bottom surface. through-hole sheet. the

其中,对所述底壳冲压基材进行第一次冲压,得到底面具有安装通孔的板材的步骤中,包括:对所述底壳冲压基材进行第一次冲压,得到底面具有四个以上安装通孔的板材。  Wherein, the step of stamping the stamping base material of the bottom shell for the first time to obtain a plate with installation through holes on the bottom surface includes: stamping the stamping base material of the bottom shell for the first time to obtain a plate with more than four holes on the bottom surface. Install through-hole panels. the

为解决上述技术问题,本发明采用的另一个技术方案是:提供一种LED拼装屏底壳,包括:  In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide a bottom shell of LED assembled screen, including:

开口的顶面、封闭的四侧面和具有安装通孔的底面,且所述顶面、四侧面和底面围合成U型槽状;所述四侧面和底面的材质为冲压基材。  The top surface of the opening, the four closed sides and the bottom surface with installation through holes, and the top surface, the four sides and the bottom surface form a U-shaped groove; the material of the four sides and the bottom surface is a stamping base material. the

其中,所述底面还具有电源接口。  Wherein, the bottom surface also has a power interface. the

其中,所述四侧面中的其中一面还具有电源接口。  Wherein, one of the four sides also has a power interface. the

其中,所述底面的安装通孔具有两个,且分别靠近底面的两相对端部设置。  Wherein, there are two installation through-holes on the bottom surface, which are respectively arranged near two opposite ends of the bottom surface. the

其中,所述底面的安装通孔具有三个,且呈三角形分布在所述底面上。  Wherein, there are three installation through holes on the bottom surface, and they are distributed on the bottom surface in a triangular shape. the

其中,所述底面的安装通孔具有四个以上,且成非直线分布在所述底面上。  Wherein, there are more than four installation through holes on the bottom surface, and they are distributed on the bottom surface in a non-linear manner. the

为解决上述技术问题,本发明采用的另一个技术方案是:提供一种LED拼装屏,包括上述的LED拼装屏底壳。  In order to solve the above-mentioned technical problems, another technical solution adopted by the present invention is to provide an LED assembled screen, including the above-mentioned LED assembled screen bottom case. the

本发明的有益效果是:区别于现有技术采用注塑工艺来制作LED条形屏底壳,其在制作大尺寸、小批量产品时具有成本较高的缺陷,本发明采用冲压成型工艺制作LED拼装屏底壳,底壳的制造材料采用强度高且质量轻的冲压基材,仅需两次冲压即可成型,得到轻薄精致、强度高、防水效果好的LED拼装屏底壳。进一步地,采用轻薄精致、强度高、防水效果好的LED拼装屏底壳制作成LED拼装屏,可以省略传统LED显示屏的箱体,仅仅通过LED拼装屏的底壳上设置的安装通孔固定在框架上,即可实现高强度的固定,LED拼装屏底壳体积小,重量轻,对安装载体的需求也不高,可实现LED拼装屏的快速拆卸与安装。  The beneficial effects of the present invention are: different from the prior art that adopts injection molding process to manufacture the LED bar-shaped screen bottom shell, which has the defect of high cost when producing large-scale and small-batch products, the present invention adopts stamping forming process to manufacture LED assembly The bottom shell of the screen is made of high-strength and light-weight stamping base material, which can be formed by stamping twice, and the bottom shell of the LED assembled screen with lightness, exquisiteness, high strength and good waterproof effect is obtained. Furthermore, the assembled LED screen is made of light and delicate, high-strength, and waterproof LED assembled screen bottom shell, which can omit the box of the traditional LED display screen, and only fix it through the installation through hole set on the bottom shell of the LED assembled screen. On the frame, high-strength fixing can be realized. The bottom shell of the LED assembled screen is small in size and light in weight, and the demand for the installation carrier is not high, which can realize the quick disassembly and installation of the LED assembled screen. the

附图说明 Description of drawings

图1是本发明LED拼装屏底壳制造方法的第一实施例步骤流程图;  Fig. 1 is the step flow chart of the first embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention;

图2是本发明LED拼装屏底壳制造方法的第二实施例步骤流程图;  Fig. 2 is the step flow chart of the second embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention;

图3是本发明LED拼装屏底壳制造方法的第三实施例步骤流程图;  Fig. 3 is the step flow chart of the third embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention;

图4是本发明LED拼装屏底壳制造方法的第四实施例步骤流程图;  Fig. 4 is the step flow chart of the fourth embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention;

图5是本发明LED拼装屏底壳制造方法的第五实施例步骤流程图;  Fig. 5 is a step flow chart of the fifth embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention;

图6是本发明LED拼装屏底壳制造方法的第六实施例步骤流程图;  Fig. 6 is a flowchart of the steps of the sixth embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention;

图7是本发明LED拼装屏底壳的第一实施例结构示意图;  Fig. 7 is a schematic structural view of the first embodiment of the LED assembled screen bottom case of the present invention;

图8是本发明LED拼装屏底壳的第二实施例结构示意图;  Fig. 8 is a schematic structural diagram of the second embodiment of the LED assembled screen bottom case of the present invention;

图9是本发明LED拼装屏底壳的第三实施例结构示意图;  Fig. 9 is a schematic structural view of the third embodiment of the LED assembled screen bottom case of the present invention;

图10是本发明LED拼装屏底壳的第四实施例结构示意图;  Fig. 10 is a schematic structural view of the fourth embodiment of the LED assembled screen bottom case of the present invention;

图11是本发明LED拼装屏底壳的第五实施例结构示意图。  Fig. 11 is a schematic structural view of the fifth embodiment of the bottom case of the assembled LED screen of the present invention. the

具体实施方式 Detailed ways

下面,结合具体实施例及附图,对本发明作出详细说明。  Hereinafter, the present invention will be described in detail in combination with specific embodiments and accompanying drawings. the

请参阅图1,在本发明LED拼装屏底壳制造方法的第一实施例中,LED拼装屏底壳制造方法包括以下步骤:  Please refer to Fig. 1, in the first embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention, the manufacturing method of the LED assembled screen bottom case includes the following steps:

步骤101:准备LED拼装屏底壳冲压模具;  Step 101: Prepare the stamping mold for the bottom shell of the LED assembled screen;

步骤102:在底壳冲压模具内放入底壳冲压基材;  Step 102: Put the stamping base material of the bottom shell in the stamping die of the bottom shell;

步骤103:对所述底壳冲压基材进行第一次冲压,得到底面具有安装通孔的板材;  Step 103: Perform the first stamping on the bottom shell stamping base material to obtain a plate with installation through holes on the bottom surface;

步骤104:对所述具有安装通孔的板材进行第二次冲压,得到顶面开口、四侧面及底面封闭的具有安装通孔的U型槽状体状的LED拼装屏底壳。  Step 104: Perform a second stamping on the plate with the installation through hole to obtain a U-shaped trough-shaped LED assembly screen bottom case with the installation through hole that is open on the top surface and closed on the four sides and the bottom. the

以上可以了解,区别于现有技术采用注塑工艺来制作LED条形屏底壳,其在制作大尺寸、小批量产品时具有成本较高的缺陷,本发明采用冲压成型工艺制作LED拼装屏底壳,底壳的制造材料采用强度高且质量轻的冲压基材,仅需两次冲压即可成型,得到轻薄精致、强度高、防水效果好的LED拼装屏底壳。进一步地,采用轻薄精致、强度高、防水效果好的LED拼装屏底壳制作成LED拼装屏,可以省略传统LED显示屏的箱体,仅仅通过LED拼装屏的底壳上设置的安装通孔固定在框架上,即可实现高强度的固定,LED拼装屏底壳体积小,重量轻,对安装载体的需求也不高,可实现LED拼装屏的快速拆卸与安装。  It can be understood from the above that, unlike the prior art that uses injection molding technology to make the bottom shell of the LED strip screen, which has the defect of high cost when making large-scale and small-batch products, the present invention uses the stamping process to make the bottom shell of the LED assembled screen. , The manufacturing material of the bottom shell adopts high-strength and light-weight stamping base material, which can be formed by only two stampings, and the bottom shell of LED assembled screen with light and delicate, high strength and good waterproof effect is obtained. Furthermore, the assembled LED screen is made of light and delicate, high-strength, and waterproof LED assembled screen bottom shell, which can omit the box of the traditional LED display screen, and only fix it through the installation through hole set on the bottom shell of the LED assembled screen. On the frame, high-strength fixing can be realized. The bottom shell of the LED assembled screen is small in size and light in weight, and the demand for the installation carrier is not high, which can realize the quick disassembly and installation of the LED assembled screen. the

图1及后续实施例中仅仅举例说明了冲压矩形槽的U形槽状体,但是根据实际需要,可以对冲压模具进行调整,通过改变冲压模具的形状,也可以冲压出其他形状的U形槽状体,本发明的附图仅仅是一种举例说明,并不用于限制本发明权利要求的保护范围。  In Fig. 1 and subsequent embodiments, only the U-shaped trough-shaped body of stamping a rectangular trough is illustrated, but according to actual needs, the stamping die can be adjusted, and U-shaped troughs of other shapes can also be punched out by changing the shape of the stamping die. Shape, the accompanying drawings of the present invention are only an illustration, and are not intended to limit the protection scope of the claims of the present invention. the

请参阅图2,在本发明LED拼装屏底壳制造方法的第二实施例中,LED拼装屏底壳制造方法包括:  Please refer to Figure 2, in the second embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention, the manufacturing method of the LED assembled screen bottom case includes:

步骤201:准备LED拼装屏底壳冲压模具;  Step 201: Prepare the stamping mold for the bottom shell of the LED assembled screen;

步骤202:在底壳冲压模具内放入底壳冲压基材;  Step 202: Put the stamping base material of the bottom shell in the stamping die of the bottom shell;

步骤203:对所述底壳冲压基材进行第一次冲压,得到底面具有安 装通孔的板材;  Step 203: Perform the first stamping on the bottom shell stamping base material to obtain a plate with a through hole for installation on the bottom surface;

步骤204:对冲压基材进行第三次冲压,得到底面具有电源接口的板材;  Step 204: Perform a third stamping on the stamping substrate to obtain a plate with a power interface on the bottom surface;

步骤205:对所述具有安装通孔的板材进行第二次冲压,得到顶面开口、四侧面及底面封闭的具有安装通孔的U型槽状体状的LED拼装屏底壳。  Step 205: Perform a second stamping on the plate with installation through holes to obtain a U-shaped trough-shaped LED assembly bottom case with installation through holes that is open on the top and closed on four sides and bottom. the

在该实施例中,对底面具有安装通孔的LED拼装屏底壳进行第三次冲压,在底壳的底面得到了电源接口,通过电源接口可以连接外接电源。  In this embodiment, the third stamping is carried out on the bottom shell of the LED assembled screen with the installation through hole on the bottom surface, and a power interface is obtained on the bottom surface of the bottom shell, through which an external power supply can be connected. the

请参阅图3,在本发明LED拼装屏底壳制造方法的第三实施例中,LED拼装屏底壳制造方法包括:  Please refer to Figure 3, in the third embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention, the manufacturing method of the LED assembled screen bottom case includes:

步骤301:准备LED拼装屏底壳冲压模具;  Step 301: Prepare the stamping mold for the bottom shell of the LED assembled screen;

步骤302:在底壳冲压模具内放入底壳冲压基材;  Step 302: Put the stamping base material of the bottom shell in the stamping die of the bottom shell;

步骤303:对所述底壳冲压基材进行第一次冲压,得到底面具有安装通孔的板材;  Step 303: Perform the first stamping on the bottom shell stamping base material to obtain a plate with a through hole for installation on the bottom surface;

步骤304:对所述具有安装通孔的板材进行第二次冲压,得到顶面开口、四侧面及底面封闭的具有安装通孔的U型槽状体状的LED拼装屏底壳;  Step 304: Perform a second stamping on the plate with the installation through hole to obtain a U-shaped groove-shaped LED assembly screen bottom shell with the installation through hole that is open on the top surface and closed on the four sides and the bottom surface;

步骤305:对所述底面具有安装通孔的LED拼装屏底壳进行第三次冲压,得到其中一侧壁具有电源接口的LED拼装屏底壳。  Step 305: Perform a third stamping on the bottom case of the assembled LED screen with the installation through hole on the bottom surface to obtain the bottom case of the assembled LED screen with a power interface on one side wall. the

在该实施例中,对底面具有安装通孔的LED拼装屏底壳进行第三次冲压,在底壳的其中一个侧壁得到了电源接口,通过电源接口可以连接外接电源。  In this embodiment, the third stamping is carried out on the bottom shell of the LED assembled screen with the installation through hole on the bottom surface, and a power interface is obtained on one of the side walls of the bottom shell, through which an external power supply can be connected. the

请参阅图4,在本发明LED拼装屏底壳制造方法的第四实施例中,LED拼装屏底壳制造方法包括:  Please refer to Figure 4, in the fourth embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention, the manufacturing method of the LED assembled screen bottom case includes:

步骤401:准备LED拼装屏底壳冲压模具;  Step 401: Prepare the stamping mold for the bottom shell of the LED assembled screen;

步骤402:在底壳冲压模具内放入底壳冲压基材;  Step 402: Put the stamping base material of the bottom shell in the stamping die of the bottom shell;

步骤403:对所述底壳冲压基材进行第一次冲压,得到底面具有两个安装通孔的板材;  Step 403: Perform the first stamping on the bottom shell stamping base material to obtain a plate with two installation through holes on the bottom surface;

步骤404:对所述具有安装通孔的板材进行第二次冲压,得到顶面 开口、四侧面及底面封闭的具有安装通孔的U型槽状体状的LED拼装屏底壳。  Step 404: Perform a second stamping on the plate with the installation through hole to obtain a U-shaped groove-shaped LED assembly screen bottom shell with the installation through hole that is open on the top surface and closed on the four sides and the bottom surface. the

请参阅图5,在本发明LED拼装屏底壳制造方法的第五实施例中,LED拼装屏底壳制造方法包括:  Please refer to Figure 5, in the fifth embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention, the manufacturing method of the LED assembled screen bottom case includes:

步骤501:准备LED拼装屏底壳冲压模具;  Step 501: Prepare the stamping mold for the bottom shell of the LED assembled screen;

步骤502:在底壳冲压模具内放入底壳冲压基材;  Step 502: Put the stamping base material of the bottom shell in the stamping die of the bottom shell;

步骤503:对所述底壳冲压基材进行第一次冲压,得到底面具有三个安装通孔的板材;  Step 503: Perform the first stamping on the bottom shell stamping base material to obtain a plate with three installation through holes on the bottom surface;

步骤504:对所述具有安装通孔的板材进行第二次冲压,得到顶面开口、四侧面及底面封闭的具有安装通孔的U型槽状体状的LED拼装屏底壳。  Step 504: Perform a second stamping on the plate with the installation through hole to obtain a U-shaped trough-shaped LED assembly screen bottom case with the installation through hole that is open on the top surface and closed on the four sides and the bottom. the

请参阅图6,在本发明LED拼装屏底壳制造方法的第六实施例中,LED拼装屏底壳制造方法包括:  Please refer to Figure 6, in the sixth embodiment of the manufacturing method of the LED assembled screen bottom case of the present invention, the manufacturing method of the LED assembled screen bottom case includes:

步骤601:准备LED拼装屏底壳冲压模具;  Step 601: Prepare the stamping mold for the bottom shell of the LED assembled screen;

步骤602:在底壳冲压模具内放入底壳冲压基材;  Step 602: Put the stamping base material of the bottom shell in the stamping die of the bottom shell;

步骤603:对所述底壳冲压基材进行第一次冲压,得到底面具有四个以上安装通孔的板材;  Step 603: Perform the first stamping on the bottom shell stamping base material to obtain a plate with more than four installation through holes on the bottom surface;

步骤604:对所述具有安装通孔的板材进行第二次冲压,得到顶面开口、四侧面及底面封闭的具有安装通孔的U型槽状体状的LED拼装屏底壳。  Step 604: Perform a second stamping on the plate with the installation through hole to obtain a U-shaped trough-shaped LED assembly bottom case with the installation through hole that is open on the top surface and closed on the four sides and the bottom. the

请参阅图7,在本发明LED拼装屏底壳的第一实施例中,LED拼装屏底壳包括:开口的顶面10、侧面11、侧面12、侧面13、侧面14和具有安装通孔16的底面15,且顶面10、四侧面(11、12、13、14)和底面15围合成U型槽状;四侧面(11、12、13、14)和底面15的材质为冲压基材。  Please refer to Fig. 7, in the first embodiment of the LED assembled screen bottom case of the present invention, the LED assembled screen bottom case includes: an open top surface 10, a side surface 11, a side surface 12, a side surface 13, a side surface 14 and a through hole 16 for installation. The bottom surface 15, and the top surface 10, the four sides (11, 12, 13, 14) and the bottom surface 15 form a U-shaped groove; the material of the four sides (11, 12, 13, 14) and the bottom surface 15 is stamping substrate . the

请参阅图8,本发明LED拼装屏底壳的第二实施例中,LED拼装屏底壳除了包括第一实施例的所有技术特征外,还包括底面15设置有电源接口17。在底壳的底面设置电源接口17,通过电源接口17可以连接外接电源。  Please refer to FIG. 8 , in the second embodiment of the LED assembled screen bottom case of the present invention, the LED assembled screen bottom case not only includes all the technical features of the first embodiment, but also includes a power interface 17 on the bottom surface 15 . A power interface 17 is arranged on the bottom surface of the bottom case, through which an external power supply can be connected. the

请参阅图9,在本发明LED拼装屏底壳的第三实施例中,LED拼装屏底壳包括:开口的顶面10、四侧面(11、12、13、14)和具有安装通孔16的底面15,且顶面10、四侧面(11、12、13、14)和底面15围合成U型槽状;四侧面(11、12、13、14)和底面15的材质为冲压基材,四侧面(11、12、13、14)中的其中一面14设置有电源接口17。在底壳的其中一个侧面14设置电源接口17,通过电源接口17可以连接外接电源。当然,不局限于在侧面14冲压出电源接口,在其他的三个面也可以冲压出电源接口,本实施例的视图仅仅是帮助理解的示意图,并不用于限制本发明的保护范围。  Please refer to Fig. 9, in the third embodiment of the LED assembled screen bottom case of the present invention, the LED assembled screen bottom case includes: an open top surface 10, four sides (11, 12, 13, 14) and installation through holes 16 The bottom surface 15, and the top surface 10, the four sides (11, 12, 13, 14) and the bottom surface 15 form a U-shaped groove; the material of the four sides (11, 12, 13, 14) and the bottom surface 15 is stamping substrate , one of the four sides ( 11 , 12 , 13 , 14 ) is provided with a power interface 17 on one side 14 . A power interface 17 is provided on one side 14 of the bottom case, through which an external power supply can be connected. Of course, it is not limited to punching out the power interface on the side 14, and the power interface can also be punched out on the other three sides. The view of this embodiment is only a schematic diagram to help understanding, and is not used to limit the scope of protection of the present invention. the

继续参阅图7,在本发明的另一实施例中,底面15的安装通孔具有两个(161、162),且分别靠近底面15的两相对端部设置。安装通孔如果设置两个,则在靠近端部的情况下,可以提高安装稳定度。  Continuing to refer to FIG. 7 , in another embodiment of the present invention, there are two installation through holes ( 161 , 162 ) on the bottom surface 15 , and they are respectively arranged near two opposite ends of the bottom surface 15 . If two installation through holes are provided, the installation stability can be improved in the case of being close to the end. the

请参阅图10,在本发明的第四实施例中,底面15的安装通孔具有三个(161、162、163),且呈三角形分布在底面15上。三角形布局的安装通孔具有稳定安装的特性,三个安装通孔确定了一个平面,有利于安装更加稳固。  Referring to FIG. 10 , in the fourth embodiment of the present invention, there are three installation through holes ( 161 , 162 , 163 ) on the bottom surface 15 , and they are distributed on the bottom surface 15 in a triangular shape. The installation through holes in the triangular layout have the characteristics of stable installation, and the three installation through holes determine a plane, which is conducive to more stable installation. the

请参阅图11,在本发明的第五实施例中,底面的安装通孔具有四个(161、162、163、164),且成非直线分布在底面15上。底面15的安装通孔可以设置四个或者四个以上,成非直线分布在底面上是为了使安装的效果更加好,更加稳固。  Please refer to FIG. 11 , in the fifth embodiment of the present invention, there are four installation through holes ( 161 , 162 , 163 , 164 ) on the bottom surface, and they are distributed on the bottom surface 15 in a non-linear manner. The installation through-holes on the bottom surface 15 can be provided with four or more, and the non-linear distribution on the bottom surface is to make the installation effect better and more stable. the

本发明的LED拼装屏实施例,可以包括上述的任意LED拼装屏底壳来制造成型。任意采用二次或者三次冲压成型得到的上述的LED拼装屏底壳,且使用这些LED拼装屏底壳组装得到LED拼装屏,则应该认为落入到本发明的保护范围。  The embodiment of the LED assembled screen of the present invention can include any of the above-mentioned bottom shells of the LED assembled screen to be manufactured and formed. Any use of the above-mentioned LED assembled screen bottom shells obtained by secondary or tertiary stamping molding, and using these LED assembled screen bottom shells to assemble an LED assembled screen should be considered to fall within the scope of protection of the present invention. the

以上所述仅为本发明的实施例,并非因此限制本发明的专利范围,凡是利用本发明说明书及附图内容所作的等效结构或等效流程变换,或直接或间接运用在其他相关的技术领域,均同理包括在本发明的专利保护范围内。  The above is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the description of the present invention and the contents of the accompanying drawings, or directly or indirectly used in other related technologies fields, all of which are equally included in the scope of patent protection of the present invention. the

Claims (1)

1. a LED assembled screen drain pan manufacture method, is characterized in that, comprise the following steps:
Prepare the diel of LED assembled screen drain pan;
Drain pan punching press base material is put in described drain pan diel;
First time punching press is carried out to described drain pan punching press base material, bottom surface must be arrived there is the sheet material installing through hole;
Second time punching press is carried out to the described sheet material with installation through hole, obtains the assembled screen drain pan of LED with the U-type groove shape body shape installing through hole that end face opening, four sides and bottom surface are closed;
First time punching press is carried out to described drain pan punching press base material, must have in the step of the sheet material installing through hole to bottom surface, comprise:
First time punching press is carried out to described drain pan punching press base material, bottom surface must be arrived there is the sheet material that more than four are installed through hole, and described more than four installation through holes become non-rectilinear to be distributed on described bottom surface;
To described have the sheet material of through hole be installed carrying out second time punching press, obtain that end face opening, four sides and bottom surface close there is the step of the U-type groove shape body of installation through hole before, also comprise:
Third time punching press is carried out to punching press base material, the sheet material that bottom surface has power interface must be arrived;
Or,
To described have the sheet material of through hole be installed carry out second time punching press, obtain that end face opening, four sides and bottom surface close there is the step of the U-type groove shape body of installation through hole after, also comprise:
To described bottom surface, there is the assembled screen drain pan of LED installing through hole and carry out third time punching press, obtain the assembled screen drain pan of LED that a wherein sidewall has power interface.
CN201210153956.6A 2012-05-17 2012-05-17 Manufacture method of light-emitting diode (LED) assembling screen and bottom casing Active CN102814429B (en)

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Application publication date: 20121212

Assignee: LEDMAN OPTOELECTRONIC HZ Co.,Ltd.

Assignor: LEDMAN OPTOELECTROIC Co.,Ltd.

Contract record no.: X2025980039068

Denomination of invention: The manufacturing method of the LED assembly screen base shell

Granted publication date: 20150429

License type: Common License

Record date: 20251127