CN102800908A - Dual-mode substrate integrated waveguide source/load mixed coupling filter - Google Patents
Dual-mode substrate integrated waveguide source/load mixed coupling filter Download PDFInfo
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- CN102800908A CN102800908A CN2012102649402A CN201210264940A CN102800908A CN 102800908 A CN102800908 A CN 102800908A CN 2012102649402 A CN2012102649402 A CN 2012102649402A CN 201210264940 A CN201210264940 A CN 201210264940A CN 102800908 A CN102800908 A CN 102800908A
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Abstract
本发明涉及双模基片集成波导源/负载混合耦合滤波器，包括介质基片、第一金属层、第二金属层和金属化通孔阵列，第一金属层和第二金属层分别贴附于介质基片的上下表面，金属化通孔阵列贯穿介质基片、第一金属层和第二金属层并围成腔体，在所述腔体中心下部相对的两端具有两处开口，所述开口处分别向腔体外引出呈共面微带传输线状的两组电流探针，所述两组电流探针作为滤波器的第一输入输出端和第二输入输出端，所述第一输入输出端和第二输入输出端偏离腔体中心一定距离用以产生耦合的双模，在第一输入输出端和第二输入输出端之间的中间位置，设置有设有叉指结构，所述叉指结构采用S形结构。本发明的有益效果：有效的提高了滤波器的带外选择性。
The invention relates to a dual-mode substrate integrated waveguide source/load hybrid coupling filter, comprising a dielectric substrate, a first metal layer, a second metal layer and a metallized through-hole array, the first metal layer and the second metal layer are respectively attached On the upper and lower surfaces of the dielectric substrate, the array of metallized through holes runs through the dielectric substrate, the first metal layer and the second metal layer and encloses a cavity. There are two openings at opposite ends of the lower center of the cavity. Two sets of current probes in the form of coplanar microstrip transmission lines are respectively led out of the cavity from the openings, and the two sets of current probes are used as the first input and output ends and the second input and output ends of the filter, and the first input and output The output end and the second input and output end deviate from the center of the cavity by a certain distance to generate a coupled dual mode, and an interdigitated structure is provided at the middle position between the first input and output end and the second input and output end, and the The interdigitated structure adopts an S-shaped structure. The beneficial effect of the present invention is that the out-of-band selectivity of the filter is effectively improved.
Description
Technical field
The invention belongs to microwave and millimeter wave technical field, be specifically related to a kind of bimodulus substrate integration wave-guide hybrid coupled filter.
Background technology
Microwave filter is one of components and parts commonly used in communication system and the wireless system, and the quality of its performance directly has influence on the quality of whole system.Traditional metal waveguide filter has Q value height, low, the good selective of loss, but its volume is big, cost is high, difficulty of processing is big, and is difficult to integrated with active circuit.Substrate integrated waveguide technology is a kind of novel waveguide structure with characteristics such as low Insertion Loss, low radiation that can be integrated in the dielectric substrate that proposed in recent years; Substrate integral wave guide filter not only has the approximate performance of traditional metal waveguide filter, and have volume little, in light weight, be easy to advantages such as integrated.In recent years, along with the fast development of the communication technology, cause frequency spectrum resource more and more nervous, thereby especially be with outer selectivity characteristic and volume to have higher requirement each item performance of filter.The common method that realizes the filter high selectivity is the progression that increases filter, thereby produces more transmission zero to increase the steepness of stopband, improves the outer selectivity of band.But this method can cause the filter volume to increase, and loss simultaneously also uprises thereupon, has directly influenced the indexs such as selectivity, noise factor, gain and sensitivity of entire system.
Traditional single chamber dual mode filter; Can only produce a transmission zero; Improve the outer selectivity characteristic of filter band like need; Can only produce more transmission zero through the form of cascade resonator, the same like this loss that can increase filter, volume and weight have influenced the global indexs such as noise factor, gain and sensitivity of system.
Summary of the invention
Thereby the objective of the invention is to produce a transmission zero and cause band outer selectivity characteristic not high problem, proposed bimodulus substrate integration wave-guide source/load hybrid coupled filter in order to overcome traditional single chamber dual mode filter.
Technical scheme of the present invention: bimodulus substrate integration wave-guide source/load hybrid coupled filter; Comprise dielectric substrate, the first metal layer, second metal level and plated-through hole array; The said the first metal layer and second metal level are attached at the upper and lower surfaces of dielectric substrate respectively; The plated-through hole array runs through dielectric substrate, the first metal layer and second metal level and surrounds cavity; Have two place's openings at the relative two ends of said cavity central lower, said opening part is drawn two groups of current probes that are coplane microstrip transmission line shape respectively outside cavity, and said two groups of current probes are as first input/output terminal and second input/output terminal of filter; Said first input/output terminal and second input/output terminal depart from cavity center certain distance in order to produce the bimodulus of coupling; Centre position between first input/output terminal and second input/output terminal is provided with and is provided with interdigital structure, and said interdigital structure adopts S shape structure.
Advantage of the present invention and beneficial effect: with respect to traditional bimodulus substrate integral wave guide filter, technical scheme of the present invention has the following advantages:
1. the present invention has the high advantage of the outer selectivity of band; Under the cavity bimodulus pattern of the present invention; Introduce the interdigital structure of S shape, produce hybrid coupled between the excitaton source load, effectively increase by two bars transmission paths; Make the present invention can obtain three transmission zeros, effectively raise the outer selectivity of band of filter.
2. the present invention has the characteristics of the flexible adjustment in position at zero point.Through Controlling Source load hybrid coupled part, promptly the size of the position of I/O end and interdigital structure can be adjusted the position at three zero points flexibly according to demand, is more suitable for the requirement of actual microwave circuit applications.
3. the present invention has the advantage that volume is little, loss is low.The present invention only uses a resonant cavity; Utilize hybrid cross coupling and bimodulus coupled wave theory; With regard to the selectivity that can realize to produce, thereby aspect volume, loss, have more advantage than traditional substrate integral wave guide filter with the cascade of traditional substrate integral wave guide filter level.
4. but the present invention has cascade, can be compatible with traditional printed circuit board technology, and the three-dimensional character of LTCC technology also capable of using is realized the three-dimensional cascade of multistage cavity.
Description of drawings
Fig. 1 is a planar structure sketch map of the present invention.
Fig. 2 is a side structure sketch map of the present invention.
Fig. 3 is the geometric parameter sketch map of planar structure of the present invention.
Fig. 4 is the transmission characteristic figure of one embodiment of the present of invention.
Description of reference numerals: dielectric substrate 11,
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the present invention is done further explanation:
As depicted in figs. 1 and 2; Bimodulus substrate integration wave-guide source/load hybrid coupled filter; Comprise dielectric substrate 11, the first metal layer 41, second metal level 42 and plated-through hole array 51; The said the first metal layer 41 and second metal level 42 are attached at the upper and lower surfaces of dielectric substrate 11 respectively; Plated-through hole array 51 runs through dielectric substrate 11, the first metal layer 41 and second metal level 42 and surrounds cavity 5; Have two place's openings (among the present invention in the cavity the incoherent place of plated-through hole array be regarded as opening) at the relative two ends of said cavity 5 central lower, said opening part is drawn two groups of current probes 32 that are coplane microstrip transmission line shape respectively outside cavity 5, and said two groups of current probes 32 are as first input/output terminal 21 and second input/output terminal 22 of filter; Said first input/output terminal 21 and second input/output terminal 22 depart from cavity 5 center certain distances in order to produce the bimodulus of coupling; Centre position between first input/output terminal 21 and second input/output terminal 22 is provided with and is provided with interdigital structure 31, and said interdigital structure 31 adopts S shape structure; Electric coupling path between introducing source/load and magnetic coupling path (so-called source/load hybrid coupled) effectively increase the transmission of electromagnetic energy passage of filter.
Above-mentioned first input/output terminal 21 and second input/output terminal 22 are matching relationship, and when wherein an end was as input, the other end was as output, and vice versa.
Principle of the present invention is: resonant cavity of the present invention (cavity 5) works in TE
102And TE
201Two patterns, electromagnetic signal will form four transmission paths after first input/output terminal 21 gets into filter of the present invention, the one, by first input/output terminal 21 through first pattern TE
102To second input/output terminal 22, two, by second pattern TE of first input/output terminal, 21 warps
201To second input/output terminal 22, three are the source/load couplings between first input/output terminal 21 and second input/output terminal 22, the 4th, and the mixing electricity of being introduced through S shape interdigital structure 31 by first input/output terminal 21, magnetic coupling path are to second input/output terminal 22.Four bars transmission paths are in the CF interval, and the phase place of signal is opposite, the formation stopband of cancelling out each other, and, will produce transmission zero at the frequency place that amplitude equates, the present invention's four transmission paths can produce three transmission zeros at most.
For the exploitativeness of technique scheme further is described, provide a specific embodiment below: the present invention is that the bimodulus substrate integration wave-guide source load hybrid coupled filter of 10GHz is concrete case study on implementation with the centre frequency, and has tested overall performance.Embodiments of the invention physical dimension sketch map as shown in Figure 3, the relative dielectric constant ε of present embodiment used medium substrate
r=5.9, thickness is 0.4mm; The through-hole diameter VR of the plated-through hole array that adopts is 0.17mm; Through-hole spacing VS is 0.5mm, and concrete geometric parameter is the width W 10=0.6mm of co-planar waveguide I/O end, the length L 10=3.7mm of co-planar waveguide I/O end (first input/output terminal 21 and second input/output terminal 22); The width W 11=0.3mm of current probe; The length L 11=1.5mm of current probe, the width W 21=1.4mm of S shape interdigital structure, the length L 21=3.7mm of S shape interdigital structure; The width W idth=13.4mm of cavity body structure, the length L ength=13.6mm of cavity body structure.
According to above-mentioned concrete size, form one according to basic technical scheme of the present invention and have concrete size filtering device, the setting of above-mentioned concrete size should not be understood that the restriction to the present invention program's protection range.
Filter to above-mentioned specific embodiment structure is tested, and tester is the E8363B vector network analyzer of Agilent company, the transmission characteristic figure of present embodiment as shown in Figure 4, and solid line is a test result among the figure, dotted line is a simulation result.The centre frequency of this filter is 10GHz, and minimum insertion loss is 1.85dB in the band, and the position of three transmission zeros lays respectively at 8.45GHz, 9.60GHz and 11.08GHz.Can find that test result and simulation result are identical basically, mainly difference is outer three transmission zeros of band and band inpolar offset somewhat, and this should cause owing to the machining accuracy error.This bimodulus substrate integration wave-guide source load hybrid coupled filter has the outer selectivity of good band, be suitable for very much with to selectivity and the exigent microwave technical field of integrated level
Those of ordinary skill in the art will appreciate that embodiment described here is in order to help reader understanding's principle of the present invention, should to be understood that protection scope of the present invention is not limited to such special statement and embodiment.Those of ordinary skill in the art can make various other various concrete distortion and combinations that do not break away from essence of the present invention according to these teachings disclosed by the invention, and these distortion and combination are still in protection scope of the present invention.
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103326093A (en) * | 2013-04-19 | 2013-09-25 | 上海大学 | Novel cross coupling substrate integrated waveguide band-pass filter |
| CN103413998A (en) * | 2013-08-09 | 2013-11-27 | 电子科技大学 | Single-cavity double-die hexagonal substrate integrated waveguide filter |
| CN103427138A (en) * | 2013-08-15 | 2013-12-04 | 电子科技大学 | Multilayer hexagonal substrate integrated waveguide filter |
| CN104091986A (en) * | 2014-07-29 | 2014-10-08 | 西安电子科技大学 | A Hybrid Planar Lossy Filter |
| CN105048037A (en) * | 2015-07-21 | 2015-11-11 | 南京航空航天大学 | Micro-strip bandpass filter for loading interdigital trough line structures based on substrate integrated waveguide (SIW) |
| CN109037873A (en) * | 2018-06-24 | 2018-12-18 | 电子科技大学 | A kind of mode composite transmission line with transition structure |
| CN111740192A (en) * | 2020-08-21 | 2020-10-02 | 成都频岢微电子有限公司 | Substrate integrated waveguide filter loaded by interdigital structure |
| CN112563701A (en) * | 2020-11-17 | 2021-03-26 | 杭州电子科技大学 | Dual-mode substrate integrated waveguide filter based on perturbation rectangular cavity |
-
2012
- 2012-07-27 CN CN2012102649402A patent/CN102800908A/en active Pending
Non-Patent Citations (2)
| Title |
|---|
| WEI SHEN等: ""A Novel Single-Cavity Dual Mode Substrate Integrated Waveguide Filter With Non-Resonating Node"", 《IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS》 * |
| WEI SHEN等: "Novel Substrate Integrated Waveguide Filters With Mixed Cross Coupling (MCC)", 《IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS》 * |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103326093A (en) * | 2013-04-19 | 2013-09-25 | 上海大学 | Novel cross coupling substrate integrated waveguide band-pass filter |
| CN103413998A (en) * | 2013-08-09 | 2013-11-27 | 电子科技大学 | Single-cavity double-die hexagonal substrate integrated waveguide filter |
| CN103427138A (en) * | 2013-08-15 | 2013-12-04 | 电子科技大学 | Multilayer hexagonal substrate integrated waveguide filter |
| CN104091986A (en) * | 2014-07-29 | 2014-10-08 | 西安电子科技大学 | A Hybrid Planar Lossy Filter |
| CN105048037A (en) * | 2015-07-21 | 2015-11-11 | 南京航空航天大学 | Micro-strip bandpass filter for loading interdigital trough line structures based on substrate integrated waveguide (SIW) |
| CN109037873A (en) * | 2018-06-24 | 2018-12-18 | 电子科技大学 | A kind of mode composite transmission line with transition structure |
| CN109037873B (en) * | 2018-06-24 | 2023-07-25 | 电子科技大学 | Mode composite transmission line with transition structure |
| CN111740192A (en) * | 2020-08-21 | 2020-10-02 | 成都频岢微电子有限公司 | Substrate integrated waveguide filter loaded by interdigital structure |
| CN112563701A (en) * | 2020-11-17 | 2021-03-26 | 杭州电子科技大学 | Dual-mode substrate integrated waveguide filter based on perturbation rectangular cavity |
| CN112563701B (en) * | 2020-11-17 | 2021-10-08 | 杭州电子科技大学 | Dual-mode substrate integrated waveguide filter based on perturbation rectangular cavity |
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Application publication date: 20121128 |