CN102790020A - Liquid-cooled heat sink - Google Patents
Liquid-cooled heat sink Download PDFInfo
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- CN102790020A CN102790020A CN2011101480996A CN201110148099A CN102790020A CN 102790020 A CN102790020 A CN 102790020A CN 2011101480996 A CN2011101480996 A CN 2011101480996A CN 201110148099 A CN201110148099 A CN 201110148099A CN 102790020 A CN102790020 A CN 102790020A
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- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
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Abstract
Description
技术领域 technical field
本发明涉及一种散热装置,特别是涉及一种液冷式散热装置。The invention relates to a heat dissipation device, in particular to a liquid-cooled heat dissipation device.
背景技术 Background technique
由于现在电子装置运转效能的提高,电子装置内发热元件的运转效能也越来越高,为保持电子装置的正常运作,以电子装置内CPU的散热装置为例,目前普遍使用的是液体式冷却系统,而此类的散热装置在与CPU直接接触的吸热铜块上设有腔体供冷却液流动,让腔体内的冷却液与吸热铜块进行热交换,进而让与吸热铜块接触的CPU降温,但腔体占有一定体积,使得液体式冷却系统体积较大,并且与吸热铜块与冷却液的接触面积有限,无法充分发挥冷却液的效果。Due to the improvement of the operating efficiency of electronic devices, the operating efficiency of heating elements in electronic devices is also getting higher and higher. In order to maintain the normal operation of electronic devices, taking the cooling device of CPU in electronic devices as an example, liquid cooling is commonly used at present. System, and this kind of cooling device has a cavity on the heat-absorbing copper block that is in direct contact with the CPU for the flow of coolant, so that the coolant in the cavity can exchange heat with the heat-absorbing copper block, and then let the heat-absorbing copper block The contacted CPU cools down, but the cavity occupies a certain volume, which makes the liquid cooling system larger, and the contact area with the heat-absorbing copper block and the cooling liquid is limited, and the effect of the cooling liquid cannot be fully exerted.
背景技术中已经揭露的一种液冷式散热装置,在腔体内设计了多个凹陷部,用以增加冷却液与吸热块的接触面积,来提高热交换效率。但此背景技术仍保有相当体积的腔体,并没减少液冷式散热装置的体积。In a liquid-cooled heat sink disclosed in the background art, a plurality of recesses are designed in the cavity to increase the contact area between the cooling liquid and the heat-absorbing block to improve heat exchange efficiency. However, this background technology still retains a cavity with a considerable volume, and does not reduce the volume of the liquid-cooled heat sink.
因此有必要提供一种的液冷式散热装置,既能省去腔体所占用的体积,也能增加冷却液与CPU的热交换面积,达到减少体积又增加热交换效率的目的。Therefore, it is necessary to provide a liquid-cooled heat dissipation device, which can not only save the volume occupied by the cavity, but also increase the heat exchange area between the cooling liquid and the CPU, so as to reduce the volume and increase the heat exchange efficiency.
发明内容 Contents of the invention
本发明的一主要目的在于提供一种内部有多个流通道的吸热块。A main object of the present invention is to provide a heat absorbing block having a plurality of flow channels inside.
本发明另一的主要目的在于提供一种提高冷却液与外部发热元件间的热交换面积的液冷式散热装置。Another main objective of the present invention is to provide a liquid-cooled heat sink that increases the heat exchange area between the cooling liquid and the external heating element.
为达成上述的目的,本发明的液冷式散热装置,包括:吸热部、第一传输管、第二传输管与散热部,其中吸热部包括:吸热块、第一突扩管与第二突扩管。吸热块用以与外部发热元件接触,吸热块内部有多个流通道,用以让冷却液在多个流通道内流动,以吸收外部发热元件运转时发出的热量,第一突扩管与吸热块的一侧连接,用以让冷却液流入多个流通道内,第二突扩管与吸热块的另一侧连接,让冷却液流出多个流通道。第一传输管与第一突扩管连接,第二传输管与第二突扩管连接,散热部分别与第一传输管与第二传输管连接,使得吸热部、散热部与第一传输管与第二传输管之间形成一回路,让冷却液得以在回路内流动。In order to achieve the above-mentioned purpose, the liquid-cooled heat dissipation device of the present invention includes: a heat-absorbing part, a first transmission pipe, a second transmission pipe and a heat-dissipating part, wherein the heat-absorbing part includes: a heat-absorbing block, a first sudden expansion pipe and The second sudden expansion tube. The heat-absorbing block is used to contact the external heating element. There are multiple flow channels inside the heat-absorbing block to allow the coolant to flow in the multiple flow channels to absorb the heat emitted by the external heating element during operation. The first sudden expansion tube and One side of the heat-absorbing block is connected to allow the cooling liquid to flow into multiple flow channels, and the second sudden expansion tube is connected to the other side of the heat-absorbing block to allow the cooling liquid to flow out of the multiple flow channels. The first transmission pipe is connected with the first sudden expansion pipe, the second transmission pipe is connected with the second sudden expansion pipe, and the heat dissipation part is respectively connected with the first transmission pipe and the second transmission pipe, so that the heat absorption part, the heat dissipation part and the first transmission pipe A loop is formed between the tube and the second transfer tube, allowing the coolant to flow in the loop.
附图说明 Description of drawings
图1为本发明的一实施例的液冷式散热装置的分解示意图;FIG. 1 is an exploded schematic diagram of a liquid-cooled heat sink according to an embodiment of the present invention;
图2为本发明的一实施例的液冷式散热装置的吸热部的分解示意图;2 is an exploded schematic diagram of a heat absorbing part of a liquid-cooled heat sink according to an embodiment of the present invention;
图3为本发明的另一实施例的液冷式散热装置的吸热部的分解示意图;3 is an exploded schematic diagram of a heat absorbing part of a liquid-cooled heat sink according to another embodiment of the present invention;
图4为本发明的另一实施例的吸热块的示意图;Fig. 4 is a schematic diagram of a heat absorbing block according to another embodiment of the present invention;
图5为本发明的再一实施例的吸热块的示意图;Fig. 5 is a schematic diagram of a heat absorbing block according to another embodiment of the present invention;
图6为本发明的另一实施例的液冷式散热装置的分解示意图。FIG. 6 is an exploded schematic diagram of a liquid-cooled heat sink according to another embodiment of the present invention.
主要元件符号说明Description of main component symbols
液冷式散热装置1、1a 吸热部10、10aLiquid cooling heat sink 1, 1a Heat absorbing
吸热块11 第一突扩管12、12aHeat-absorbing
流通道111、111a、111b 第二突扩管13、13aFlow
进液接口121 吸热块接口122、132
第一传输管20 散热部40The
出液接口131 散热片42
第二传输管30 冷却液60
风扇41 外部发热元件90
泵50
具体实施方式 Detailed ways
为让本发明的上述和其他目的、特征和优点能更明显易懂,下文特举出本发明的具体实施例,并配合所附附图,作详细说明如下。In order to make the above and other objects, features and advantages of the present invention more comprehensible, specific embodiments of the present invention are listed below and described in detail in conjunction with the accompanying drawings.
请先参考图1关于依据本发明的一实施例的液冷式散热装置,其中图1为液冷式散热装置的分解示意图。Please refer to FIG. 1 for a liquid-cooled heat sink according to an embodiment of the present invention, wherein FIG. 1 is an exploded view of the liquid-cooled heat sink.
如图1所示,本发明的液冷式散热装置1与外部发热元件90接触,以供散除该外部发热元件90所产生的热。液冷式散热装置1包括吸热部10、第一传输管20、第二传输管30以及散热部40,并且吸热部10、散热部40与第一传输管20以及第二传输管30之间形成一回路,以使冷却液60得以如图1的箭号所示的方向在该回路内流动。As shown in FIG. 1 , the liquid-cooled heat sink 1 of the present invention is in contact with an
在本发明的一实施例中,吸热块10为一铜块,但本发明不以此为限,吸热块10可为任何具高热传导(Thermal Conductivity)性质的材料。在本发明的一实施例中,第一传输管20以及第二传输管30所使用的材质为塑胶或铜,并且冷却液60为冷媒或氟碳介电流体(FC72),但本发明不以此为限。在本实施例中,散热部40具有风扇41以及散热片42,且散热片42相邻于风扇41,且散热片42分别与第一传输管20以及第二传输管30连接。风扇41以及散热片42可让冷却液60降温而回复过冷状态,而回复过冷状态的冷却液60将再经由第一传输管20进入吸热部10,由此可持续不断地冷却外部发热元件90。在本发明的一实施例中,与液冷式散热装置1接触的外部发热元件90为中央处理单元(CPU),但本发明不以此为限,液冷式散热装置1可与任何发热的元件,例如绘图处理芯片、南桥芯片或北桥芯片等发热芯片接触,以供散除其所产生的热。In one embodiment of the present invention, the
接着请一并参考图2关于依据本发明的一实施例的液冷式散热装置的吸热部,其中图2为吸热部的分解示意图。Next, please refer to FIG. 2 for the heat absorbing part of the liquid-cooled heat sink according to an embodiment of the present invention, wherein FIG. 2 is an exploded view of the heat absorbing part.
如图1及图2所示,吸热部10包括吸热块11、第一突扩管12以及第二突扩管13。其中吸热块11用以与外部发热元件90接触,以吸收外部发热元件90所产生的热。吸热块11内部包括多个流通道111,用以让冷却液60如图1及图2的箭号方向所示,在多个流通道111内流动,由此吸收外部发热元件90运转时发出的热。As shown in FIGS. 1 and 2 , the
第一突扩管12具有进液接口121及吸热块接口122。第一突扩管12的一端通过进液接口121与第一传输管20连结,另一端通过吸热块接口122与吸热块11连结。进液接口121为单一管径,其与第一传输管20连接,可供冷却液60流入第一突扩管12,进而流入多个流通道111内。通过第一突扩管12的设计能让冷却液60由原本在单一管径(第一传输管20)内流动引导进入在吸热块11的多个管径(多个流通道111)内流动,以冷却外部发热元件90,并且为了配合吸热块11,吸热块接口122的管径大小实质上会与吸热块11连接的一端的尺寸相当。The first
第二突扩管13具有出液接口131及吸热块接口132,第二突扩管13的一端通过吸热块接口132与吸热块11连结,另一端通过出液接口131与第二传输管30连结,出液接口131为单一管径,其与第二传输管30连接,可供已吸收外部发热元件90所产生的热的冷却液60流出第二突扩管13。通过第二突扩管13的设计使得冷却液60由原本在吸热块11的多个管径(多个流通道111)内流动,回到单一管径(第二传输管30)内,而为了配合吸热块11,吸热块接口132的管径大小实质上会与吸热块11连接的一端的尺寸相当。此时流出第二突扩管13的冷却液60,将流入第二传输管30,再进入散热部40。The second
如图2所示,在本发明的一实施例中,多个流通道111为多个圆管,并且各个流通道的管径实质上小于3mm,但本发明不以此为限。本发明通过在与外部发热元件90直接接触的吸热块11内设置多个流通道111,可增加冷却液60与外部发热元件90的热交换面积,由此提高冷却效率。再者,在每个流通道111内流动的冷却液的质量流率(mass flow rate)比使用单一管径的质量流率小,因此可让在每个流通道111内流动的冷却液较快达到冷却液的沸点(较快产生由液相变气相的相变化),由此带走更多的热量,而提升吸热块11的热传效益,进而提高本发明的液冷式散热装置1冷却外部发热元件90的效率。此外,本发明的液冷式散热装置1可供冷却液60直接在吸热块11的流通道111内流动,可节省吸热部10的空间,使得液冷式散热装置1的吸热部10的体积较小。As shown in FIG. 2 , in an embodiment of the present invention, the plurality of
在此需注意的是,如图2所示,在本发明的一实施例中,第一突扩管12与第二突扩管13大致为三角形形状,而冷却液60在吸热部10内的流动方向是为直线流动,但本发明不以此为限。第一突扩管12与第二突扩管13也可为其他形状,并且冷却液60在吸热部10内也可以其他方向流动。It should be noted here that, as shown in FIG. 2 , in one embodiment of the present invention, the first
以下请参考图3关于依据本发明的另一实施例的液冷式散热装置的吸热部,其中图3为吸热部的分解示意图。如图3所示,在本发明的另一实施例中,吸热部10a的第一突扩管12a与第二突扩管13a的形状为一长条柱体。进液接口121设置于第一突扩管12a的一端,且出液接口131设置于第二突扩管13a的一端。冷却液60在吸热部10a内的流动方向如图3的箭号所示,冷却液60先由上往下经由进液接口121进入第一突扩管12a后,再由左往右流入吸热块11的多个流通道111。已吸收外部发热元件90所产生的热的冷却液60再由左往右流出多个流通道111进入第二突扩管13a,最后冷却液60再由下往上经由出液接口131流入第二传输管30。Please refer to FIG. 3 for the heat absorbing part of a liquid-cooled heat sink according to another embodiment of the present invention, wherein FIG. 3 is an exploded view of the heat absorbing part. As shown in FIG. 3 , in another embodiment of the present invention, the shape of the first sudden expansion tube 12 a and the second
此外,如图2及图3所示,在本发明的一实施例中,吸热块11的多个流通道111大致为圆形管径,但本发明不以此为限,多个流通道111也可为其他形状。外部发热元件90In addition, as shown in Figures 2 and 3, in an embodiment of the present invention, the plurality of
以下请参考图4及图5关于依据本发明的另一实施例的吸热块,其中图4及图5为吸热块的示意图。Please refer to FIG. 4 and FIG. 5 for the heat absorbing block according to another embodiment of the present invention, wherein FIG. 4 and FIG. 5 are schematic diagrams of the heat absorbing block.
如图4所示,在本发明的另一实施例中,吸热块11a的多个流通道111a可以是方形管径;或者,如图5所示,在本发明的再一实施例中,吸热块11b的多个流通道111b可以是星形管径,但本发明不以上述实施例为限。As shown in Figure 4, in another embodiment of the present invention, the plurality of
此外,本发明的多个流通道111、111a、111b也可任意与第一突扩管12、12a或第二突扩管13、13a搭配。再者,为了进一步提高吸热块11的吸热效率,本发明也可以在多个流通道111、111a、111b内设置散热片或内螺旋纹。In addition, the plurality of
以下请参考图6关于依据本发明的另一实施例的液冷式散热装置,其中图6为液冷式散热装置的分解示意图。Please refer to FIG. 6 for a liquid-cooled heat sink according to another embodiment of the present invention, wherein FIG. 6 is an exploded schematic view of the liquid-cooled heat sink.
如图6所示,在本发明的另一实施例中,液冷式散热装置1a包括吸热部10、第一传输管20、第二传输管30、散热部40以及泵50,泵50可用以加速推动冷却液60的散热循环,以供将散热部40散热后回到过冷状态的冷却液60泵入第一传输管20内,以使冷却液60再度进入吸热部10,而进行冷却外部发热元件90的散热循环。在本实施例中,泵50设于第一传输管20,惟本发明并不限于此。As shown in FIG. 6, in another embodiment of the present invention, a liquid-cooled heat sink 1a includes a
综上所述,本发明无论就目的、手段及功效,在均显示其迥异于现有技术的特征。但应注意的是,上述诸多实施例仅为了便于说明而举例而已,本发明所主张的权利范围自应以权利要求所述为准,而非仅限于上述实施例。To sum up, the present invention shows its characteristics that are very different from the prior art in terms of purpose, means and effect. However, it should be noted that the above-mentioned embodiments are examples only for the convenience of description, and the scope of rights claimed in the present invention should be determined by the claims, rather than limited to the above-mentioned embodiments.
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| TW100117831 | 2011-05-20 | ||
| TW100117831A TWI438388B (en) | 2011-05-20 | 2011-05-20 | Liquid cooled heat sink |
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| CN104866043A (en) * | 2014-02-21 | 2015-08-26 | 北京市鑫全盛商贸有限公司 | Water-cooled radiator |
| CN104866043B (en) * | 2014-02-21 | 2018-05-08 | 北京市鑫全盛商贸有限公司 | Water-filled radiator |
| CN107132891A (en) * | 2016-02-26 | 2017-09-05 | 株式会社日立信息通信工程 | Liquid-cooled-type cooling device |
| CN106604615A (en) * | 2017-01-03 | 2017-04-26 | 联想(北京)有限公司 | Electronic device |
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| CN112179163A (en) * | 2020-09-14 | 2021-01-05 | 东莞汉旭五金塑胶科技有限公司 | Water-cooling radiator capable of increasing radiating area |
| CN112286323A (en) * | 2020-11-10 | 2021-01-29 | 上海英众信息科技有限公司 | Notebook computer water-cooling heat dissipation device and use method thereof |
| CN112433587A (en) * | 2020-12-26 | 2021-03-02 | 枣庄科顺数码有限公司 | Enhanced heat dissipation device for computer |
| CN112433587B (en) * | 2020-12-26 | 2022-03-08 | 枣庄科顺数码有限公司 | Enhanced heat dissipation device for computer |
| CN116568008A (en) * | 2023-05-31 | 2023-08-08 | 小米汽车科技有限公司 | Liquid cooling radiator, motor controller and vehicle |
| CN116568008B (en) * | 2023-05-31 | 2024-02-23 | 小米汽车科技有限公司 | Liquid cooling radiator, motor controller and vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201248104A (en) | 2012-12-01 |
| US20120291997A1 (en) | 2012-11-22 |
| TWI438388B (en) | 2014-05-21 |
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Application publication date: 20121121 |