CN102770810A - Lithographic apparatus and device manufacturing method - Google Patents

Abstract

A photolithography apparatus includes: two or more optical arrays configured to project a beam onto a target portion of a substrate, each of the two or more optical arrays including one or more radiation sources (906) for providing the beam and a projection system (920, 924, 930) for projecting the beam onto the target portion; a scan motion actuator configured to move the substrate at a scan speed along a scan direction relative to the two or more optical arrays; and two or more position measuring devices (944) configured to determine the position of the respective two or more optical arrays relative to a reference object (940).

Description

Lithographic apparatus and device manufacturing method

Cross References to Related Applications

This application claims the benefit of US Provisional Application 61/307,394, filed February 23, 2010, which is hereby incorporated by reference in its entirety. Additionally, this application also claims the benefit of US Provisional Application 61/322,505, filed April 9, 2010, which is hereby incorporated by reference in its entirety.

technical field

The present invention relates to a lithographic apparatus, a programmable patterning device, a method of device fabrication and a method for aligning two or more optical columns of a lithographic apparatus.

Background technique

A lithographic apparatus is a machine that applies a desired pattern to a substrate or a portion of a substrate. Lithographic apparatus can be used, for example, in the fabrication of integrated circuits (ICs), flat panel displays, and other devices or structures with fine features. In conventional lithographic apparatus, a patterning device called a mask or reticle may be used to create a circuit pattern corresponding to a single layer of an IC, flat panel display, or other device. This pattern can be transferred to (a part of) a substrate, such as a silicon wafer or a glass plate, for example via imaging onto a layer of radiation-sensitive material (resist) provided on said substrate .

In addition to circuit patterns, the patterning device can also be used to generate other patterns, such as a color filter pattern or a matrix of dots. Instead of a conventional mask, the patterning device may include a patterning array comprising an array of individually controllable elements that create a circuit or other applicable pattern. An advantage of such a "maskless" system is that patterns can be set and/or changed more quickly and at less cost than conventional mask-based systems.

Thus, maskless systems include programmable patterning devices (eg, spatial light modulators, contrast devices, etc.). The programmable patterning device is programmed (eg electronically or optically) using an array of individually controllable elements for forming the desired patterned beam. Types of programmable patterning devices include micromirror arrays, liquid crystal display (LCD) arrays, grating light valve arrays, and the like.

Contents of the invention

In an embodiment, a maskless lithographic apparatus may for example be provided with an array of optics configured to generate a pattern on a target portion of a substrate. The optical train may be provided with: a self-emissive contrast device configured to emit a plurality of beams; and a projection system configured to project at least a portion of the plurality of beams onto the target portion. The apparatus may be provided with an actuator configured to move the column of optics or a part of the column of optics relative to the substrate.

In a maskless lithographic apparatus of the type described above, in one embodiment a plurality of columns of optics are provided to project the projection beam onto different target portions of the substrate substantially simultaneously. In practice, the substrate may be divided into strips along a direction substantially perpendicular to the scan direction, each strip being associated with a column of optical devices. Each swath may be further divided in a direction parallel to the scan direction into a plurality of target portions on which the pattern is then projected while moving the substrate along the optical column.

When projecting the pattern onto the substrate, it is desirable that the patterned beam projected onto the substrate is properly aligned and in focus with the substrate surface where the pattern will be generated.

For a lithographic apparatus of the type described above, the pattern can be generated across the entire width of the substrate by using multiple optical columns, each configured to generate on a target portion of an associated stripe on the substrate, simultaneously or substantially simultaneously pattern. In order to generate a continuous and correct pattern across the substrate, it is desirable to align the columns of optics with respect to the substrate and with respect to each other during the photolithographic process.

It is desirable to provide a lithographic apparatus configured to align each of a plurality of optical columns of the lithographic apparatus with a substrate.

According to an embodiment of the present invention, there is provided a lithographic apparatus comprising: two or more columns of optical devices configured to project a beam onto a target portion of a substrate, the two or more optical devices Each of the columns includes one or more radiation sources for providing the beam and a projection system for projecting the beam onto a target portion; a scanning movement actuator configured relative to the two or more optical trains moving the substrate along a scan direction at a scan velocity; and two or more position measuring devices configured to determine the position of the respective two or more optical trains relative to a reference object .

According to an embodiment of the present invention, there is provided a method for aligning optics columns of a lithographic apparatus, the method comprising the steps of: measuring the position of target portions of a plurality of optics columns relative to a reference object; relative to each other comparing the positions of the target locations of adjacent optical columns; and adjusting the pattern projected onto the target portion for aligning the optical columns.

For example, it is desirable to provide a flexible, low-cost lithographic apparatus including a programmable patterning device.

In one embodiment, a lithographic apparatus is disclosed comprising: a modulator configured to expose an exposure region of a substrate with a plurality of beams modulated according to a desired pattern; and a projection system configured to expose the modulated The beam is projected onto the substrate. The modulator may be movable relative to the exposure area, and/or the projection system may have a lens array for receiving the plurality of beams, the lens array being movable relative to the exposure area.

Description of drawings

The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the invention and to enable a person skilled in the relevant art to make and use the invention. In the drawings, like reference numbers may indicate identical or functionally similar elements.

Figure 1 shows a schematic side view of a lithographic apparatus according to an embodiment of the invention.

Figure 2 shows a schematic top view of a lithographic apparatus according to an embodiment of the invention.

Figure 3 shows a schematic top view of a lithographic apparatus according to an embodiment of the invention.

Figure 4 shows a schematic top view of a lithographic apparatus according to an embodiment of the invention.

Figure 5 shows a schematic top view of a lithographic apparatus according to an embodiment of the invention.

6(A)-(D) show schematic top and side views of a portion of a lithographic apparatus according to an embodiment of the invention.

7(A)-(O) show schematic top and side views of a portion of a lithographic apparatus according to an embodiment of the invention.

Figure 7(P) shows a power/forward current diagram for individually addressable elements according to an embodiment of the present invention.

Figure 8 shows a schematic side view of a lithographic apparatus according to an embodiment of the invention.

Figure 9 shows a schematic side view of a lithographic apparatus according to an embodiment of the invention.

Figure 10 shows a schematic side view of a lithographic apparatus according to an embodiment of the invention.

Figure 11 shows a schematic top view of an array of individually controllable elements for a lithographic apparatus according to an embodiment of the invention.

Figure 12 shows a mode of transferring a pattern to a substrate using an embodiment of the present invention.

Figure 13 shows a schematic arrangement of the optical engine.

14(A) and (B) show schematic side views of a part of a lithographic apparatus according to an embodiment of the present invention.

Figure 15 shows a schematic top view of a lithographic apparatus according to an embodiment of the invention.

Figure 16(A) shows a schematic side view of a portion of a lithographic apparatus according to an embodiment of the invention.

Figure 16(B) shows the schematic location of the detection area of the sensor relative to the substrate.

Figure 17 shows a schematic top view of a lithographic apparatus according to an embodiment of the invention.

Figure 18 shows a schematic cross-sectional side view of a lithographic apparatus according to an embodiment of the invention.

Figure 19 shows a layout of a schematic top view of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto, according to an embodiment of the invention.

FIG. 20 shows a schematic three-dimensional view of a part of the lithographic apparatus in FIG. 19 .

Figure 21 shows the layout of a schematic side view of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto according to an embodiment of the invention, and shows the layout relative to Three different rotational positions of the optical element 242 are set by independently controllable elements.

Figure 22 shows the layout of a schematic side view of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto according to an embodiment of the invention, and shows the layout relative to Three different rotational positions of the optical element 242 are set by independently controllable elements.

Figure 23 shows the layout of a schematic side view of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto according to an embodiment of the invention, and shows the layout relative to Five different rotational positions of the optical element 242 are set by independently controllable elements.

Figure 24 shows a schematic layout of a portion of an individually controllable element 102 using a standard laser diode with a diameter of 5.6 mm for obtaining full coverage across the width of the substrate.

FIG. 25 shows a schematic layout of the details of FIG. 24 .

Figure 26 shows a layout of a schematic side view of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto, according to an embodiment of the invention.

Figure 27 shows a layout of a schematic side view of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto, according to an embodiment of the invention.

Figure 28 shows the layout of a schematic side view of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto according to an embodiment of the invention, and shows the layout relative to Five different rotational positions of the optical element 242 are set by independently controllable elements.

FIG. 29 shows a schematic three-dimensional view of a portion of the lithographic apparatus of FIG. 28 .

FIG. 30 schematically shows an arrangement of 8 lines written simultaneously by a single movable optical element 242 set up in FIGS. 28 and 29 .

Figure 31 shows a schematic arrangement for controlling focus with a moving rooftop in the arrangement of Figures 28 and 29 .

Figure 32 shows a schematic cross-sectional side view of a lithographic apparatus according to an embodiment of the invention having independently controllable elements substantially stationary in the X-Y plane and an optical element movable relative thereto, according to an embodiment of the invention .

Figure 33 shows a portion of a lithographic apparatus according to an embodiment of the invention.

Figure 34 shows a top view of the lithographic apparatus of Figure 33 according to an embodiment of the invention.

Fig. 35 schematically shows a side view of a position measuring device according to an embodiment of the invention.

Detailed ways

One or more embodiments of maskless lithography apparatus, maskless lithography methods, programmable patterning devices and other apparatus, articles of manufacture, and methods are described herein. In an embodiment, a low cost and/or flexible maskless lithography apparatus is provided. Since it is maskless, no conventional masks are required for exposing eg ICs or flat panel displays. Similarly, one or more rings are not required for packaging applications; the programmable patterning device can provide digital edge processing "rings" for packaging applications for avoiding edge projection. Maskless (digital patterning) may enable the use of flexible substrates.

In one embodiment, the lithographic apparatus can be used for super-non-critical applications. In an embodiment, the lithographic apparatus can have a resolution > 0.1 μm, eg a resolution > 0.5 μm or a resolution > 1 μm. In an embodiment, the lithographic apparatus can have a resolution < 20 μm, eg a resolution < 10 μm or a resolution < 5 μm. In an embodiment, the lithographic apparatus is capable of a resolution of ~0.1-10 μm. In an embodiment, the lithographic apparatus is capable of having an overlap >50 nm, such as >100 nm overlap, >200 nm overlap or >300 nm overlap. In an embodiment, the lithographic apparatus can have an overlap < 500 nm, eg an overlap < 400 nm, an overlap < 300 nm or an overlap < 200 nm. These overlap and resolution values can be independent of substrate size and material.

In one embodiment, the lithographic apparatus has high flexibility. In an embodiment, the lithographic apparatus is scalable to substrates of different sizes, types and characteristics. In an embodiment, the lithographic apparatus has a virtually infinite field size. Thus, a lithographic apparatus can be used for multiple applications (eg, IC, flat panel display, packaging, etc.) with a single lithographic apparatus or with multiple lithographic apparatuses using a large common lithographic apparatus platform. In one embodiment, the lithographic apparatus allows for automated operations for providing flexible manufacturing. In one embodiment, the lithographic apparatus provides 3D integration.

In an embodiment, the lithographic apparatus is low cost. In an embodiment, only common off-the-shelf components are used (eg radiation emitting diodes, simple movable substrate holder and lens array). In one embodiment, pixel-grid imaging is used to allow simple projection optics to operate. In an embodiment, a substrate holder with a single scan direction is used to reduce cost and/or complexity.

Fig. 1 schematically shows a lithographic projection apparatus 100 according to an embodiment of the present invention. Apparatus 100 includes a patterning device 104 , an object holder 106 (eg, an object table, such as a substrate table), and a projection system 108 .

In an embodiment, the patterning device 104 includes a plurality of individually controllable elements 102 for modulating radiation for applying a pattern to the beam 110 . In an embodiment, the positions of the plurality of individually controllable elements 102 may be fixed relative to the projection system 108 . However, in an alternative arrangement, the plurality of individually controllable elements 102 may be connected to positioning means (not shown) for precisely positioning one or more of them according to specific parameters (eg relative to the projection system 108). indivual.

In one embodiment, the patterning device 104 is a self-emissive contrast device. Such a patterning device 104 eliminates the requirement for a radiation system, which may, for example, reduce the cost and size of a lithographic apparatus. For example, each individually controllable element 102 is a radiation emitting diode, such as a light emitting diode (LED), an organic LED (OLED), a polymer LED (PLED), or a laser diode (eg, a solid state laser diode). In one embodiment, each individually controllable element 102 is a laser diode. In one embodiment, each individually controllable element 102 is a blue-violet laser diode (eg, Sanyo model no. DL-3146-151). Such diodes are supplied by companies such as Sanyo, Nichia, Osram and Nitride. In an embodiment, the diode emits radiation having a wavelength of about 365 nm or about 405 nm. In one embodiment, the diode can provide an output power selected from the range of 0.5-100 mW. In one embodiment, the size of the laser diode (bare die) is selected from the range of 250-600 microns. In one embodiment, the laser diode has an emission area selected from the range of 1-5 microns. In one embodiment, the laser diode has a divergence angle selected from the range of 7-44 degrees. In one embodiment, the patterning device 104 has about 1×10 ⁵ diodes, with configurations ⁽ e.g., emissive regions, ^emissive regions, divergence angle, output power, etc.).

In one embodiment, the self-emissive contrast device includes more independently addressable elements than would be required for a "redundant" independently controllable element 102 that allows use in the event that another independently controllable element 102 fails or fails to operate properly. More individually addressable elements 102 of elements. In an embodiment, redundant independently controllable elements may be advantageously used in embodiments using movable independently controllable elements 102 such as discussed below with respect to FIG. 5 .

In an embodiment, the individually controllable elements 102 in a self-emissive contrast device are operated in the steep portion of the power/forward current curve of the individually controllable elements 102 (eg, laser diodes). This may be more efficient and results in less power loss/heat. In an embodiment, in use, the light output of each individually controllable element is at least 1 mW, such as at least 10 mW, at least 25 mW, at least 50 mW, at least 100 mW or at least 200 mW. In an embodiment, in use, the light output of each individually controllable element is less than 300mW, less than 250mW, less than 200mW, less than 150mW, less than 100mW, less than 50mW, less than 25mW, or less than 10mW. In an embodiment, the power consumption of each programmable patterning device to operate the individually controllable elements is less than 10 kW, such as less than 5 kW, less than 1 kW, or less than 0.5 kW, in use. In an embodiment, the power consumption of each programmable patterning device operating the individually controllable elements in use is at least 100W, such as at least 300W, at least 500W, or at least 1 kW.

The lithographic apparatus 100 includes an object holder 106 . In this embodiment, the object holder includes an object stage 106 for holding a substrate 114, such as a resist-coated silicon wafer or a glass substrate. The object stage 106 may be movable and connected to a positioning device 116 for precisely positioning the substrate 114 according to certain parameters. For example, positioning device 116 may precisely position substrate 114 relative to projection system 108 and/or patterning device 104 . In one embodiment, the movement of the object stage 106 can be realized by the positioning device 116, which includes a long-stroke module (coarse positioning) and an optional short-stroke module (fine positioning) not specifically shown in FIG. 1 . ). In an embodiment, the apparatus is at least without a short-stroke module for moving the object stage 106 . A similar system can be used to position individually controllable elements 102 . It should be understood that beam 110 may alternatively/additionally be movable, while object stage 106 and/or individually controllable elements 102 may have fixed positions for providing the required relative movement. Such an arrangement can help limit the size of the device. In embodiments that may be used, for example, in the manufacture of flat panel displays, the object table 106 may be stationary and the positioning device 116 configured to move the substrate 114 relative to (eg, on) the object table 106 . For example, object table 106 may be provided with a system for scanning substrate 114 across object table 106 at a substantially constant speed. Where this is done, the object table 106 may be provided on a flat uppermost surface with a number of openings through which gas is fed for providing a gas cushion capable of supporting the substrate 114 . This is commonly referred to as a gas bearing arrangement. Substrate 114 is moved on object stage 106 using one or more actuators (not shown) capable of precisely positioning substrate 114 relative to the path of beam 110 . Alternatively, the substrate 114 may be moved relative to the object table 106 by selectively opening and closing the passage of gas through the openings. In one embodiment, the object holder 106 may be a tumbling system on which the substrate rolls, and the positioning device 116 may be a motor for rotating the tumbling system to provide the substrate onto the object table 106 .

A projection system 108 (such as a quartz and/or _CaF lens system or a refractive reflective system comprising lens elements made of such materials, or a mirror system) may be used to project the patterned beam modulated by the individually controllable elements 102 onto a target portion 120 (eg, one or more dies) of the substrate 114 . The projection system 108 may project and image the pattern provided by the plurality of individually controllable elements 102 such that the pattern is uniformly formed on the substrate 114 . Alternatively, the projection system 108 may project an image of the secondary source, elements of the plurality of individually controllable elements 102 acting as light shields for the secondary source.

In this regard, the projection system may comprise a focusing element, or a plurality of focusing elements (hereinafter collectively referred to as a lens array), such as a microlens array (known as MLA) or a Fresnel lens array, for example for forming a secondary source and The light spot is imaged onto the substrate 114 . In one embodiment, the lens array (eg MLA) comprises at least 10 focusing elements, such as at least 100 focusing elements, at least 1000 focusing elements, at least 10000 focusing elements, at least 100000 focusing elements or at least 1000000 focusing elements. In an embodiment, the number of individually controllable elements in the patterning device is equal to or greater than the number of focusing elements in the lens array. In an embodiment, the lens array comprises focusing elements optically associated with one or more of the individually controllable elements of the array of individually controllable elements, for example only one of the individually controllable elements of the array of individually controllable elements Optically correlated to, or optically correlated to, two or more individually controllable elements in an array of individually controllable elements, such as 3 or more, 5 or more, 10 or more, 20 or More, 25 or more, 35 or more, or 50 or more individually controllable elements are optically associated; in one embodiment, the focusing element is optically associated with less than 5000 individually controllable elements , for example optically associated with less than 2500, less than 1000, less than 500, or less than 100 individually controllable elements. In an embodiment, the lens array includes more than one focusing elements (eg more than 1000, most or about all) that are optically related to one or more of the individually controllable elements in the array of individually controllable elements.

In an embodiment, the lens array is movable at least in a direction to and away from the substrate, for example by using one or more actuators. Being able to move the lens array to and away from the substrate allows, for example, focus adjustments without having to move the substrate. In one embodiment, individual lens elements in the lens array (e.g., each individual lens element in the lens array) are movable at least in a direction to and away from the substrate (e.g., on a non-flat substrate) Local focus adjustment or so that each optical column achieves the same focal length).

In one embodiment, the lens array comprises plastic focusing elements (which may be easy to manufacture (eg, by injection molding) and/or be inexpensive when, for example, the wavelength of the radiation is greater than or equal to about 400 nm (eg, 405 nm). In one embodiment, the wavelength of the radiation is selected from the range of about 400nm-500nm. In one embodiment, the lens array includes quartz focusing elements. In an embodiment, each focusing element or elements may be an asymmetric lens. The asymmetry may be the same for each of the plurality of focusing elements, or the asymmetry may be different for one or more of the plurality of focusing elements different focusing elements. An asymmetric lens may facilitate converting an elliptical radiant output into a circular projected spot and vice versa.

In an embodiment the focusing element has a high numerical aperture (NA) arranged to project radiation onto the substrate out of focus to obtain a low NA for the system. Higher NA lenses may be more economical, popular and/or of better quality than available low NA lenses. In one embodiment, the low NA is less than or equal to 0.3, and in one embodiment, the low NA is 0.18, 0.15 or less. Correspondingly, a higher NA lens has a larger NA than the design NA of the system, for example greater than 0.3, greater than 0.18 or greater than 0.15.

Although in one embodiment projection system 108 is separate from patterning device 104, this is not required. Projection system 108 may be integral with patterning device 108 . For example, a lens array block or plate may be attached (integrally attached) to the patterning device 104 . In an embodiment, the lens array may be in the form of individual spatially separated lenslets, each connected (integrally connected) to an individually addressable element in the patterning device 104, as described in more detail below.

Optionally, the lithographic apparatus may include a radiation system that supplies radiation, such as ultraviolet (UV) radiation, to the plurality of individually controllable elements 102 . If the patterning device itself is a radiation source (such as a laser diode array or LED array), then a lithographic apparatus can be designed without a radiation system, ie without a radiation source other than the patterning device itself, or at least a simplified radiation system.

The radiation system includes an illumination system (illuminator) configured to receive radiation from a radiation source. The illumination system comprises one or more of the following elements: a radiation delivery system (e.g. a suitable directional mirror), radiation conditioning means (e.g. a beam expander), means for setting the angular intensity distribution of said radiation (typically , adjustment means, integrators and/or condensers that can adjust at least said outer and/or inner radial extent (commonly referred to as σ-outer and σ-inner, respectively) of the intensity distribution in the pupil plane of the illuminator device. The illumination system can be used to tailor the radiation that can be provided to the individually controllable elements 102 to have a desired uniformity and intensity distribution in their cross-section. The illumination system may be arranged to split the radiation into a plurality of sub-beams which may eg each be associated with one or more of the plurality of independently controllable elements. Two-dimensional diffraction gratings may for example be used to split radiation into sub-beams. In the description, the terms "beam of radiation" and "radiation beam" include, but are not limited to, the case where the beam is composed of a plurality of such radiation sub-beams.

The radiation system may also include a radiation source, such as an excimer laser, for generating radiation supplied to or by the plurality of individually controllable elements 102 . The radiation source and the lithographic apparatus 100 may be separate entities, eg when the radiation source is an excimer laser. In such cases, the radiation source is not considered to form part of the lithographic apparatus 100, and the radiation passes from the source to the illuminator. In other cases, the radiation source may be an integral part of the lithographic apparatus 100, for example when the source is a mercury lamp. It should be understood that both scenarios are contemplated to be within the scope of the present invention.

In one embodiment, the radiation source can be a plurality of independently controllable elements 102. In one embodiment, the radiation source can provide a wavelength of at least 5nm, such as at least 10nm, at least 50nm, at least 100nm, at least 150nm, at least 175nm, at least 200nm , radiation of at least 250 nm, at least 275 nm, at least 300 nm, at least 325 nm, at least 350 nm or at least 360 nm. In one embodiment, the radiation has a wavelength of at most 450 nm, such as at most 425 nm, at most 375 nm, at most 360 nm, at most 325 nm, at most 275 nm, at most 250 nm, at most 225 nm, at most 200 nm, or at most 175 nm. In one embodiment, the wavelength of the radiation includes 436nm, 405nm, 365nm, 355nm, 248nm, 193nm, 157nm, 126nm, and/or 13.5nm. In one embodiment, the radiation includes a wavelength of about 365 nm or about 355 nm. In one embodiment, the radiation includes broadband wavelengths, including, for example, 365nm, 405nm, and 436nm. A 355nm laser source can be used. In one embodiment, the radiation has a wavelength of about 405 nm.

In an embodiment, the illumination system is illuminated at an angle between 0 and 90°, such as between 5 and 85°, between 15 and 75°, between 25 and 65°, or between 35 and 55°. Radiation is directed to patterning device 104 . Radiation from the illumination system may be provided directly to the patterning device 104 . In an alternative embodiment, radiation may be directed from the illumination system to the patterning device 104 through a beam splitter (not shown) configured such that the radiation is initially reflected by the beam splitter and directed to the patterning device 104. The patterning device 104 modulates the beam and reflects it back to the beam splitter which transmits the modulated beam towards the substrate 114 . However, it should be understood that alternative arrangements may be used to direct radiation to patterning device 104 and thereafter to substrate 114 . In particular, if a transmissive patterning device 104 is used (eg, an LCD array) or the patterning device 104 is self-emissive (eg, multiple diodes), then no illumination system arrangement may be required.

In operation of the lithographic apparatus 100, when the patterning device 104 is not radiation-emitting (e.g., comprising LEDs), radiation is incident on the patterning device 104 (e.g., a plurality of independent controllable element) and modulated by the patterning device 104. After having been produced by the plurality of individually controllable elements 102 , the patterned beam 110 passes through a projection system 108 which focuses the beam 110 onto a target portion 120 of the substrate 114 .

With the aid of the positioning device 116 (and optionally a position sensor 134 on the pedestal 136, such as an interferometric device, a linear encoder, or a capacitive sensor receiving the interferometric beam 138), the substrate 114 can be moved precisely, e.g. In order to position different target portions 120 in the path of the beam 110 . In use, the positioning means for the plurality of individually controllable elements 102 may be used to precisely correct the position of the plurality of individually controllable elements 102 relative to the path of the beam 110, for example during scanning.

Although a lithographic apparatus 100 according to an embodiment of the invention is described herein as being used to expose resist on a substrate, it should be understood that the apparatus 100 can be used to project a patterned beam 110 for use in resist-free etchant in photolithography.

As shown here, the lithographic apparatus 100 is of the reflective type (eg employing reflective individually controllable elements). Alternatively, the device may be of the transmissive type (eg employing transmissive individually controllable elements).

The dedicated device 100 may be used in one or more of the following modes, for example:

1. In step mode, the entire patterned radiation beam 110 is projected onto the target portion 120 at once (ie, a single static exposure) while the individually controllable elements 102 and substrate 114 are held substantially stationary. The substrate 114 is then moved in the X and/or Y direction so that different target portions 120 can be exposed to the patterned radiation beam 110 . In step mode, the maximum size of the exposure field limits the size of the target portion 120 imaged in a single static exposure.

2. In scanning mode, the patterned radiation beam 110 is projected onto the target portion 120 while the individually controllable elements 102 and the substrate 114 are being scanned synchronously (ie, a single dynamic exposure). The velocity and direction of the substrate relative to the individually controllable elements can be determined by the (de-)magnification and image inversion characteristics of said projection system PS. In scanning mode, the maximum size of the exposure field limits the width of the target portion (along the non-scanning direction) in a single dynamic exposure, while the length of the scanning motion determines the height of the target portion (along the scanning direction). ).

3. In pulsed mode, the individually controllable elements 102 are kept substantially stationary and the entire pattern is projected onto the target portion 120 of the substrate 114 using pulses (e.g. provided by a pulsed radiation source or by pulsing the individually controllable elements) superior. The substrate 114 is moved at a substantially constant speed such that the patterned beam 110 makes a line scan across the substrate 114 . The pattern provided by the individually controllable elements is updated as needed between pulses timed to expose successive target portions 120 at desired locations on the substrate 114 . Thus, patterned beam 110 may be scanned across substrate 114 to expose a complete pattern for strips of substrate 114 . The process is repeated until the entire substrate 114 has been exposed row by row.

4. In continuous scan mode, except that the substrate 114 is scanned at a substantially constant velocity relative to the modulated radiation beam B and the pattern on the array of individually controllable elements is scanned across the substrate 114 by the patterned beam 110 And make it update when exposed, essentially the same as the pulse mode. A substantially constant radiation source or a pulsed radiation source may be used which is synchronized with the updating of the pattern on the array of individually controllable elements.

Combinations and/or variations of the above described modes of use, or entirely different modes of use may also be employed.

Figure 2 shows a schematic top view of a lithographic apparatus according to an embodiment of the invention for use with a wafer, eg a 300mm wafer. As shown in FIG. 2 , the lithographic apparatus 100 includes a substrate table 106 for holding a wafer 114 . A positioning device 116 is associated with the substrate table 106 for moving the substrate table 106 in at least the X direction. Optionally, the positioning device 116 may move the substrate table 106 in the Y-direction and/or the Z-direction. The positioning device 116 may also rotate the substrate table 106 about the X, Y and/or Z directions. Accordingly, positioning device 116 can provide up to 6 degrees of freedom of motion. In one embodiment, the substrate table 106 provides movement in the X direction only, which has the advantage of being less costly and less complex. In an embodiment, the substrate table 106 includes relay optics.

The lithographic apparatus 100 also includes a plurality of individually addressable elements 102 arranged on a frame 160 . The frame 160 may be mechanically isolated from the substrate table 106 and its positioning device 116 . Mechanical isolation may be provided, for example, by connecting the frame 160 to the ground or a strong pedestal separate from the frame for the substrate table 106 and/or its positioning device 116 . Additionally or alternatively, a damper may be provided between the frame 160 and the structure attached to the frame, whether the structure is the ground, a solid pedestal or used to support the substrate table 106 and/or It positions the frame of the device 116 .

In this embodiment, each individually addressable element 102 is a radiation emitting diode, such as a blue-violet laser diode. As shown in FIG. 2 , the individually addressable elements 102 may be arranged in at least 3 discrete arrays of individually addressable elements 102 extending along the Y direction. In one embodiment, arrays of individually addressable elements 102 are interleaved with adjacent arrays of individually addressable elements 102 in the X direction. The lithographic apparatus 100, in particular the individually addressable elements 102, may be arranged to provide pixel-grid imaging as described in more detail herein.

Each of the array of individually addressable elements 102 may be part of a separate optical engine component, which may be fabricated as a unit for ease of replication. Additionally, frame 160 may be configured to be expandable and configurable to readily employ any number of such optical engine components. The optical engine components may include a combination of an array of individually addressable elements 102 and a lens array 170 (see, eg, FIG. 8 ). For example, three optical engine components are shown in FIG. 2 (with associated lens arrays 170 underlying each respective array of individually addressable elements 102). Thus, in an embodiment, a multi-column optical arrangement may be provided, with each optical engine forming a column.

In addition, the lithographic apparatus 100 includes an alignment sensor 150 . Alignment sensors are used to determine alignment between individually addressable elements 102 and substrate 114 before and/or during exposure of substrate 114 . The results of the alignment sensor 150 may be used by a controller in the lithographic apparatus 100 to, for example, control the positioning device 116 to position the substrate table 106 to improve alignment. Additionally or alternatively, the controller may, for example, control positioning means associated with individually addressable elements 102 for positioning one or more individually addressable elements 102 to improve alignment. In an embodiment, alignment sensor 150 may include pattern recognition functionality/software for performing alignment.

Additionally or alternatively, the lithographic apparatus 100 includes a level sensor 150 . Level sensor 150 is used to determine whether substrate 106 is level relative to the projection of the pattern from individually addressable elements 102 . Level sensor 150 may determine a level before and/or during exposing substrate 114 . The results of the level sensor 150 may be used by a controller in the lithographic apparatus 100, eg, to control the positioner 116 to position the substrate table 106 to improve leveling. Additionally or alternatively, the controller may control positioning devices associated with projection system 108 (eg, lens array), eg, for positioning elements in projection system 108 (eg, lens array), to improve leveling. In an embodiment, the level sensor may be operated by projecting an ultrasound beam onto the substrate 106 and/or may be operated by projecting a beam of electromagnetic radiation onto the substrate 106 .

In an embodiment, the results from the alignment sensors and/or level sensors may be used to change the pattern provided by the individually addressable elements 102 . The pattern may be altered to correct for example distortions that may be caused by, for example, optics (if any) between the individually addressable elements 102 and the substrate 114, irregularities in the positioning of the substrate 114, substrate 114, etc. The unevenness of the bottom 114 and the like are caused. Thus, results from the alignment sensor and/or level sensor can be used to alter the projected pattern to achieve non-linear distortion correction. Non-linear deformation correction may be beneficial, for example, for flexible displays, which may not have consistent linear or non-linear deformation.

In operation of the lithographic apparatus 100, a substrate 114 is loaded onto the substrate table 106 using, for example, a robotic transporter (not shown). Thereafter, the substrate 114 is displaced in the X direction under the frame 160 and the individually addressable elements 102 . The substrate 114 is measured by a level sensor and/or an alignment sensor 150 and the substrate is then pattern-exposed using the individually addressable elements 102 . For example, the substrate 114 is scanned through the focal plane (image plane) of the projection system 108 while the beamlets and thus the image spot S (see e.g. FIG. 12 ) are switched at least partially ON or ON by the patterning device 104. All on (ON) or off (OFF). Features corresponding to the patterns in patterning device 104 are formed on substrate 114 . The individually addressable elements 102 may be operated, for example, to provide pixel-to-grid imaging as described herein.

In an embodiment, the substrate 114 may be fully scanned in the positive X direction, and then fully scanned in the negative X direction. In such embodiments, additional level sensors and/or alignment sensors 150 on opposite sides of the individually addressable elements 102 may be required for negative X-direction scanning.

Figure 3 shows a schematic top view of a lithographic apparatus according to an embodiment of the invention for exposing substrates in the manufacture of eg flat panel displays (eg LCD, OLED displays, etc.). Like the lithographic apparatus 100 shown in FIG. 2, the lithographic apparatus 100 includes a substrate table 106 for holding a flat panel display substrate 114, a positioning device 116 for moving the substrate table 106 in up to 6 degrees of freedom, a An alignment sensor 150 and a level sensor 150 for determining the alignment between the individually addressable elements 102 and the substrate 114 for determining the projection of the substrate 114 relative to the pattern from the individually addressable elements 102 Is it horizontal.

The lithographic apparatus 100 also includes a plurality of individually addressable elements 102 arranged on a frame 160 . In this embodiment, each individually addressable element 102 is a radiation emitting diode, such as a blue-violet laser diode. As shown in FIG. 3 , the individually addressable elements 102 are arranged in an array of a large number (eg, at least 8) of stationary separate individually addressable elements 102 extending in the Y direction. In an embodiment, the arrays are substantially stationary, ie they do not move significantly during projection. Additionally, in one embodiment, a large number of arrays of individually addressable elements 102 are alternately interleaved with adjacent arrays of individually addressable elements 102 in the X direction. The lithographic apparatus 100, in particular the individually addressable elements 102, may be arranged to provide pixel-to-grid imaging.

In operation of the lithographic apparatus 100, a flat panel display substrate 114 is loaded onto the substrate table 106 using, for example, a robotic transporter (not shown). Thereafter, the substrate 114 is displaced in the X direction under the frame 160 and the individually addressable elements 102 . The substrate 114 is measured by a level sensor and/or an alignment sensor 150 and then pattern-exposed using the individually addressable elements 102 . The individually addressable elements 102 may be operated, for example, to provide pixel-to-grid imaging as described herein.

Figure 4 shows a schematic top view of a lithographic apparatus according to an embodiment of the present invention for roll-to-roll flexible displays/electronics. Like the lithographic apparatus 100 shown in FIG. 3 , the lithographic apparatus 100 includes a plurality of individually addressable elements 102 arranged on a frame 160 . In this embodiment, each individually addressable element 102 is a radiation emitting diode, such as a blue-violet laser diode. In addition, the lithographic apparatus includes an alignment sensor 150 for determining the alignment between the individually addressable elements 102 and the substrate 114 and for determining whether the projection of the substrate 114 relative to the pattern from the individually addressable elements 102 Horizontal level sensor 150 .

The lithographic apparatus may also include an object holder having an object table 106 on which the substrate 114 moves. The substrate 114 is flexible and is rolled onto a roller connected to a positioning device 116, which may be a motor that turns the roller. In an embodiment, the substrate 114 may additionally or alternatively be rolled from a roller connected to a positioning device 116, which may be a motor that turns the roller. In one embodiment, there are at least two rollers, one roller the substrate rolls off of and the other roller onto which the substrate rolls. In an embodiment, the object stage 106 need not be provided if, for example, the substrate 114 is sufficiently rigid between the rollers. In such a case there will still be object holders such as one or more rollers. In an embodiment, the lithographic apparatus may provide carrier-less substrates (eg, carrier-less foil (CLF)) and/or roll-to-roll manufacturing. In an embodiment, the lithographic apparatus may provide sheet-to-sheet fabrication.

In operation of the lithographic apparatus 100 , the flexible substrate 114 is rolled onto and/or off the rollers in the X direction beneath the frame 160 and the individually addressable elements 102 . The substrate 114 is measured by a level sensor and/or an alignment sensor 150 and the substrate 114 is then pattern-exposed using the individually addressable elements 102 . Individually addressable elements 102 may be operated, for example, to provide pixel-to-grid imaging as discussed herein.

FIG. 5 shows a schematic top view of a lithographic apparatus according to an embodiment of the invention with movable individually addressable elements 102 . Like the lithographic apparatus 100 shown in FIG. 2, the lithographic apparatus 100 includes a substrate table 106 for holding a substrate 114, a positioning device 116 for moving the substrate table 106 in up to 6 degrees of freedom, An alignment sensor 150 that addresses the alignment between the elements 102 and the substrate 114 , and a level sensor 150 that determines whether the substrate 114 is level relative to the projection of the pattern from the individually addressable elements 102 .

The lithographic apparatus 100 also includes a plurality of individually addressable elements 102 arranged on a frame 160 . In this embodiment, each individually addressable element 102 is a radiation emitting diode, eg a laser diode such as a blue violet laser diode. As shown in FIG. 5 , the individually addressable elements 102 are arranged in an array 200 of a large number of separate individually addressable elements 102 extending along the Y direction. Additionally, in one embodiment, a plurality of arrays 200 of individually addressable elements 102 are interleaved with adjacent arrays 200 of individually addressable elements 102 along the X direction in an alternating fashion. The lithographic apparatus 100, in particular the individually addressable elements 102, may be arranged to provide pixel-grid imaging. However, in an embodiment, the lithographic apparatus 100 need not provide pixel-to-grid imaging. Rather, the lithographic apparatus 100 may project the radiation of the diodes onto the substrate in such a way that not a single pixel is formed for projection onto the substrate, but rather a substantially continuous image is formed for projection onto the substrate.

In one embodiment, one or more of the plurality of individually addressable elements 102 is movable between the exposure area and a position outside the exposure area, and one or more of the individually addressable elements 102 in the exposure area Elements are used to project all or part of the beam 110, one or more individually addressable elements in locations outside the exposure area do not project any beam 110. In one embodiment, one or more of the individually addressable elements 102 are radiation-emitting devices that are turned on (ON) or at least partially turned on (ON) in the exposure region 204, i.e. they (the lightly shaded areas) emit radiation, and are turned off (OFF) when located outside the exposed area 204, ie they do not emit radiation.

In an embodiment, one or more of the individually addressable elements 102 are radiation emitting devices that can be turned ON in and outside of the exposed region 204 . In such a situation, one or more individually addressable elements 102 may be outside the exposure area 204 if, for example, radiation is not properly projected into the exposure area 204 through the one or more individually addressable elements 102 Is turned on to provide compensating exposure. For example, referring to FIG. 5, one or more of the individually addressable elements 102 in the array opposite the exposure area 204 can be turned on (ON) for correcting failed or inappropriate radiation in the exposure area 204. projection.

In one embodiment, exposed regions 204 are elongated lines. In one embodiment, the exposure region 204 is a one-dimensional array of one or more individually addressable elements 102 . In one embodiment, exposure region 204 is a two-dimensional array of one or more individually addressable elements 102 . In one embodiment, exposure region 204 is elongated.

In one embodiment, each movable individually addressable element 102 can move independently, not necessarily together as a unit.

In an embodiment, one or more of the individually addressable elements are movable and, in use, move in a direction transverse to the direction of propagation of the beam 110 at least during projection of the beam 110 . For example, in one embodiment, one or more of the individually addressable elements 102 are radiation emitting devices that move in a direction substantially perpendicular to the direction of propagation of the beam 110 during projection of the beam 110 .

In one embodiment, each array 200 is a laterally displaceable board having a plurality of spatially separated individually addressable elements 102 arranged along the board as shown in FIG. 6 . In use, each plate translates along direction 208 . In use, the movement of the individually addressable elements 102 is appropriately timed to be located in the exposure area 204 (shown as the dark shaded area in FIG. 6 ) so as to project all or a portion of the beam 110 . For example, in one embodiment, one or more of the individually addressable elements 102 are radiation emitting devices, and the turning on or off of the individually addressable elements 102 is timed such that one or more of the individually addressable elements 102 Elements 102 are switched on (ON) when they are in exposure region 204 and turned off (OFF) when they are outside region 204 . For example in FIG. 6(A), a two-dimensional array of a plurality of radiation emitting diodes 200 is translated along direction 208, two arrays along positive direction 208 and an array in the middle between the two arrays along negative direction 208. . The turning on (ON) or turning off (OFF) of the radiation-emitting diodes 102 is timed such that particular radiation-emitting diodes 102 in each array 200 are turned on (ON) when they are in the exposure region 204 and turned on (ON) when they are in the exposure region 204 They are turned off (OFF) when outside the region 204 . Of course, the arrays 200 may travel in opposite directions, ie two arrays in the negative direction 208 and an intermediate array in between the two arrays in the positive direction 208 , eg when the arrays 200 reach the end of their travel. In a further example, in FIG. 6(B), multiple interleaved one-dimensional arrays of radiation emitting diodes 200 are translated along direction 208, alternating in positive direction 208 and in negative direction 208. The turning on (ON) or turning off (OFF) of the radiation-emitting diodes 102 is timed so that particular radiation-emitting diodes 102 in each array 200 are turned on (ON) when they are in the exposure region 204, and when they are It is turned off (OFF) when outside the region 204 . Of course, array 200 can travel in the opposite direction. In another example, in FIG. 6(C), a single array of radiation-emitting diodes 200 (shown as a one-dimensional array, but this is not required) is translated in direction 208 . The turning on (ON) or turning off (OFF) of the radiation emitting diodes 102 is timed so that the particular radiation emitting diodes 102 of each array 200 are turned on (ON) when they are in the exposure area 204 and when they are in the area 204 is turned off (OFF).

In one embodiment, each array 200 is a rotatable plate having a plurality of spatially separated individually addressable elements 102 arranged around the plate. In use, each plate rotates about its own axis 206 , for example in the direction shown by the arrows in FIG. 5 . That is, array 200 may alternatively rotate in clockwise and counterclockwise directions as shown in FIG. 5 . Alternatively, each array 200 may rotate in a clockwise direction or in a counterclockwise direction. In one embodiment, array 200 rotates a full revolution. In one embodiment, the array 200 rotates through less than a full revolution. In an embodiment, if, for example, the substrate is scanned along the Z direction, the array 200 may be rotated about an axis extending along the X or Y direction. In an embodiment, referring to FIG. 6(D), the individually addressable elements 102 in the array 200 may be arranged at the edge and projected in a radial direction outward toward the substrate 114 . Substrate 114 may extend around at least a portion of the sides of array 200 . In this case, the array 200 is rotated about an axis extending along the X direction, and the substrate 114 is moved in the X direction.

In use, the movement of the individually addressable elements 102 is appropriately timed for positioning in the exposure area 204 so as to project all or a portion of the beam 110 . For example, in one embodiment, one or more of the individually addressable elements 102 are radiation emitting devices, and the turning on (ON) or turning off (OFF) of the individually addressable elements 102 is timed such that one or more Multiple individually addressable elements 102 are turned on (ON) when they are in the exposed area 204 and turned off (OFF) when they are outside the area 204 . Thus, in an embodiment, the radiation-emitting devices 102 may all remain on during motion, after which some radiation-emitting devices 102 are modulated OFF in the exposure region 204 . Suitable shielding between the radiation-emitting device 102 and the substrate and outside the exposure area 204 may be required for shielding the exposure area 204 from being turned ON outside the exposure area 204 . Having the radiation-emitting device 102 consistently turned ON may facilitate having the radiation-emitting device 102 at a substantially uniform temperature during use. In an embodiment, the radiation-emitting devices 102 may remain off (OFF) most of the time, while one or more radiation-emitting devices 102 are turned on (ON) while in the exposure region 204 .

In an embodiment, the rotatable plate may have a configuration as shown in FIG. 7 . For example, in Fig. 7(A) a schematic top view of a rotatable plate is shown. The rotatable plate may have an array 200 with multiple sub-arrays 210 of individually addressable elements 102 arranged around the plate (compared to the rotatable plate in FIG. A single array 200 of addressing elements 102). In FIG. 7(A), the sub-arrays 210 are shown interleaved with each other such that an individually addressable element 102 of one sub-array 210 is between two individually addressable elements 102 of the other sub-array 210 . However, individually addressable elements 102 of sub-array 210 may be aligned with each other. The individually addressable elements 102 may be rotated independently or together by the motor 216 about an axis, in this example the axis extends through the motor 216 along the Z direction in FIG. 7(A). Motor 216 may be connected to the rotatable plate and to the frame (eg, frame 160 ), or to a frame (eg, frame 160 ) and to the rotatable plate. In an embodiment, the motors 216 (or, for example, some motor located elsewhere) may cause additional movement of the individually addressable elements 102, either individually or together. For example, motor 216 may cause translation of one or more individually addressable elements 102 in X, Y, and/or Z directions. Additionally or alternatively, motor 216 may cause rotation of one or more individually addressable elements 102 about the X and/or Y directions (ie, _Rx and/or _Ry motion).

In the embodiment of the rotatable plate shown schematically in FIG. 7(B) as a top view, the rotatable plate may have an opening 212 in its central region, and the array 200 of individually addressable elements 102 are arranged outside the opening 212. on the board. Thus, for example, the rotatable plate may form an annular disk as shown in Fig. 7(B), with the array 200 of individually addressable elements 102 arranged around the disk. The openings may reduce the weight of the rotatable plate and/or facilitate cooling of the individually addressable elements 102 .

In an embodiment, supports 204 may be used to support the rotatable plate at the outer perimeter. The support 214 may be a bearing, such as a roller bearing or a gas bearing. Rotation (and/or other motion, such as translation along X, Y, and/or Z directions and/or R _x motion and/or R _y motion) may be provided by motor 216 as shown in FIG. 7(A). Additionally or alternatively, the support 214 may include components that allow the individually addressable elements 102 to rotate about the axis A (and/or provide other movement, such as translation along the X, Y, and/or Z directions and/or R _x motion and/or R _y motion) motors.

In one embodiment, referring to FIGS. 7(D) and 7(E), a rotatable plate with an array 200 of individually addressable elements 102 may be connected to a rotatable structure 218 . Rotatable structure 218 is rotatable about axis B by motor 220 . Additionally, the rotatable plate may be rotated relative to the rotatable structure 218 by a motor 216 which causes the rotatable plate to rotate about axis A. As shown in FIG. In an embodiment, the axes of rotation A and B do not coincide, so the axes are spatially separated as shown in Figures 7(D) and 7(E). In an embodiment, the axes of rotation A and B are substantially parallel to each other. In use during exposure, the rotatable structure 218 and the rotatable plate rotate. The rotation can be coordinated such that the individually addressable elements 102 can be aligned along a substantially straight line in the exposure region 204 . This can be compared with, for example, the embodiment of FIG. 5 , where the individually addressable elements 102 in the exposure area 204 may not be aligned along a substantially straight line.

With movable individually addressable elements as described above, the number of individually addressable elements can be reduced by moving the individually addressable elements into the exposure region 204 if desired. Therefore, heat load can be reduced.

In an embodiment, more movable individually addressable elements may be provided than theoretically required (eg on a rotatable plate). A possible advantage of this arrangement is that if one or more movable individually addressable elements break or fail to operate, one or more other movable individually addressable elements can be used instead. Additionally or alternatively, additional movable individually addressable elements may have the advantage of controlling the thermal load on the individually addressable elements, because the more movable individually addressable elements, the The cooling opportunities for movable individually addressable elements are greater.

In one embodiment, the movable individually addressable elements 102 are embedded in a material with low thermal conductivity. For example, the material may be ceramic, such as cordierite or a cordierite-based ceramic and/or a Zerodur ceramic. In one embodiment, the movable individually addressable elements 102 are embedded in a material with high thermal conductivity, such as a metal, for example a relatively lightweight metal such as aluminum or titanium.

In an embodiment, array 200 may include a temperature control arrangement. For example, referring to FIG. 7(F), the array 200 may have fluid (eg, liquid) guide channels 222 for delivering cooling fluid onto the array 200, delivering cooling fluid near the array 200, or passing cooling fluid through the array 200 to cool the array. Channel 222 may be connected to a suitable heat exchanger and pump 228 to circulate fluid through the channel. Supply means 224 and return means 226 connected between channel 222 and heat exchanger and pump 228 may facilitate fluid circulation and temperature control. Sensors 234 may be placed in, on, or near the array to measure parameters of the array 200 that may be used to control the temperature of the fluid flow provided by the heat exchangers and pumps. In one embodiment, sensors 234 may measure expansion and/or contraction of the body of array 200 and the resulting measurements may be used to control the temperature of the fluid flow provided by the heat exchanger and pump. Such expansion and/or contraction may be indicative of temperature. In an embodiment, the sensors 234 may be integrated with the array 200 (as shown by the sensors 234 in the form of points) and/or may be discrete from the array 200 (as shown by the sensors 234 in the form of boxes) . Sensor 234, which is separate from array 200, may be an optical sensor.

In one embodiment, referring to FIG. 7(G), the array 200 may have one or more heat sinks 230 for increasing the surface area for heat dissipation. Heat sink 230 may be located, for example, on the top surface of array 200 and/or on side surfaces of array 200 . Optionally, one or more additional heat sinks 232 may be provided for cooperation with the heat sink 230 to facilitate heat dissipation. For example, fins 232 are capable of absorbing heat from fins 230, and may include fluid (eg, liquid) guide channels and associated heat exchangers/pumps similar to those shown in and described with respect to FIG. 7(F).

In one embodiment, referring to FIG. 7(H), the array 200 may be located at or near a fluid confinement structure 236 configured to maintain a fluid 238 in contact with the body of the array 200 to facilitate heat dissipation through the fluid. In one embodiment, fluid 238 may be a liquid, such as water. In one embodiment, fluid confinement structure 236 provides a seal between it and the body of array 200 . In an embodiment, the seal may be a non-contact seal provided, for example, by air flow or capillary forces. In an embodiment, fluid 238 is circulated to facilitate heat dissipation, similar to that discussed with respect to fluid guide channel 222 . Fluid 238 may be provided by fluid supply 240 .

In one embodiment, referring to FIG. 7(H), the array 200 may be located at or near a fluid supply 240 configured to project a fluid 238 toward the body of the array 200 to facilitate heat dissipation through the fluid. In one embodiment, the fluid 238 is a gas, such as a clean dry gas, N2, an inert gas, or the like. Although the fluid confinement structure 236 and the fluid supply 240 are shown together in FIG. 7(H), they need not be provided together.

In an embodiment, the body of the array 200 is a substantially solid structure with lumens, eg, for the fluid guiding channels 222 . In one embodiment, the body of the array 200 is a mostly open generally frame-like structure to which various components (eg, individually addressable elements 102, fluid guiding channels 222, etc.) are connected. This open structure facilitates gas flow and/or increases surface area. In one embodiment, the body of the array 200 is a substantially solid structure with a plurality of cavities into or through the body to facilitate gas flow and/or increase surface area.

Although embodiments are described above that provide cooling, embodiments may alternatively or additionally provide heating.

In one embodiment, array 200 is desirably maintained at a substantially constant steady state temperature during exposure use. Thus, for example, all or many of the individually addressable elements 102 in the array 200 may be energized prior to exposure to a desired steady state temperature or thereabout, and any one or more temperature control arrangements may be used during exposure. The array 200 is cooled and/or heated to maintain a steady state temperature. In an embodiment, any one or more temperature control arrangements may be used to heat the array 200 prior to exposure to a desired steady state temperature at or thereabout. Thereafter, during exposure, any one or more temperature control arrangements may be used to cool and/or heat the array 200 to maintain a steady state temperature. Measurements from sensor 234 may be used in a feedforward and/or feedback manner to maintain a steady state temperature. In one embodiment, each of the plurality of arrays 200 may have the same steady-state temperature, or one or more of the plurality of arrays 200 may have a different temperature than one or more of the plurality of arrays 200. The steady-state temperature of the other array 200 . In one embodiment, the array 200 is heated to a temperature higher than the desired steady state temperature, and thereafter due to cooling applied by any one or more temperature control arrangements and/or due to insufficient use of the individually addressable elements 102 The temperature is lowered during exposure in order to maintain a temperature higher than the desired steady state temperature.

In one embodiment, the number of bodies of array 200 is increased along and/or across the exposure area for improved thermal control and overall cooling. Thus, for example, instead of the four arrays 200 shown in Figure 5, 5, 6, 7, 8, 9, 10 or more arrays 200 may be provided. Fewer arrays may be provided, eg one array 200, such as a single large array covering the full width of the substrate.

In one embodiment, a lens array as described herein is associated or integral with movable individually addressable elements. For example, a lens array plate may be attached to each movable array 200 and thus be movable (eg, rotatable) together with the individually addressable elements 102 . As mentioned above, the lens array plate may be displaceable relative to the individually addressable elements 102 (eg, along the Z direction). In an embodiment, multiple lens array plates may be provided for array 200 , each lens array plate being associated with a different subset of multiple individually addressable elements 102 .

In one embodiment, referring to FIG. 7(I), a single discrete lens 242 may be connected in front of each individually addressable element 102, and 102 is movable with the individually addressable element (for example around axis A is rotatable). Additionally, the lens 242 may be displaceable relative to the individually addressable elements 102 (eg, along the Z direction) using the actuator 244 . In one embodiment, referring to FIG. 7(J), individually addressable elements 102 and lens 242 may be displaced together by actuator 244 relative to body 246 of array 200 . In an embodiment, the actuator 244 is configured to displace only the lens 242 along the Z direction (ie, relative to or with the individually addressable element 102 ).

In an embodiment, the actuator 244 is configured to displace the lens 242 in up to 3 degrees of freedom (Z-direction, rotation about the X-direction, and/or rotation about the Y-direction). In one embodiment, the actuator 244 is configured to displace the lens 242 in up to 6 degrees of freedom. While the lens 242 is movable relative to its individually addressable element 102, the lens 242 can be moved by the actuator 244 to change the focal position of the lens 242 relative to the substrate. As the lens 242 moves with its individually addressable elements 102, the focus position of the lens 242 is substantially constant, but is displaced relative to the substrate. In one embodiment, movement of lenses 242 is independently controlled for each lens 242 associated with each individually addressable element 102 in array 200 . In an embodiment, subgroups of the plurality of lenses 242 move with respect to, or with, their associated subgroups of the plurality of individually addressable elements 102 . In the latter case, fine focus control may be sacrificed for lower data management overhead and/or faster response. In one embodiment, the size of the radiation spot provided by the individually addressable elements 102 can be adjusted by defocusing, that is, the larger the defocusing, the larger the size of the radiation spot.

In one embodiment, referring to FIG. 7(K), an aperture structure 248 having an aperture therein may be located below the lens 242 . In one embodiment, the aperture structure 248 may be located above the lens 242 and between the lens 242 and the associated individually addressable element 102 . The aperture structure 248 may limit the diffraction effects of the lens 242 , the associated individually addressable element 102 and/or the adjacent lens 242 /individually addressable element 102 .

In an embodiment, the individually addressable elements 102 may be radiation emitting devices, such as laser diodes. Such radiation emitting devices may have high spatial coherence and thus may exhibit speckle problems. In order to avoid such speckle problems, the radiation emitted by the radiation-emitting device should be perturbed by shifting the phase of one beam portion relative to the other. In one embodiment, referring to FIGS. 7(L) and 7(M), the board 250 may be located, for example, on the frame 160 and the individually addressable elements 102 move relative to the board 250 . As the individually addressable elements 102 move relative to and over the plate 250, the plate 250 causes a disruption of the spatial coherence of the radiation emitted by the individually addressable elements 102 towards the substrate. In one embodiment, the plate 250 is positioned between the lens 242 and its associated individually addressable element 102 as the individually addressable elements 102 move relative to and over the plate 250 . In an embodiment, plate 250 may be positioned between lens 242 and the substrate.

In an embodiment, referring to FIG. 7(N), a spatial coherence breaking device 252 may be located between the substrate and at least individually addressable elements 102 that project radiation onto the exposure area. In one embodiment, the spatial coherence breaking device 252 is located between the individually addressable elements 102 and the lens 242 and may be connected to the body 246 . In one embodiment, the spatial coherence breaking device 252 is a phase modulator, a vibrating plate or a rotating plate. The spatial coherence breaking means 252 cause the spatial coherence of the radiation emitted by the individually addressable elements 102 to be broken when the individually addressable elements 102 project the radiation towards the substrate.

In one embodiment, an array of lenses (whether together as a unit or as individual lenses) is connected (desirably via a high thermal conductivity material) to the array 200 so as to dissipate the heat where it can provide more favorable cooling Conducted from the lens array to the array 200 .

In an embodiment, array 200 may include one or more focus or level sensors 254 like level sensor 150 . For example, sensor 254 may be configured to measure the focus of each individually addressable element 102 in array 200 or a plurality of individually addressable elements 102 of array 200 . Thus, if an out-of-focus condition is detected, focus may be corrected for each individually addressable element 102 in the array 200 or for multiple individually addressable elements 102 in the array 200 . Focusing can be corrected by, for example, moving lens 242 along the Z direction (and/or about the X axis and/or about the Y axis).

In one embodiment, the sensor 254 is integral to an individually addressable element 102 (or may be integral to a plurality of individually addressable elements 102 in the array 200). Referring to FIG. 7(O), an exemplary sensor 254 is schematically shown. Focused detection beam 256 is redirected (eg, reflected) away from the substrate surface, passes through lens 242 , and is directed by half-silvered mirror 258 toward detector 262 . In an embodiment, the focused detection beam 256 may be the radiation used for exposure, which is redirected just from the substrate. In an embodiment, the focused detection beam 256 may be a dedicated beam directed at the substrate, which becomes the beam 256 when redirected by the substrate. A knife edge 260 , which may be an aperture, is located in the path of the beam 256 before the beam 256 impinges on a detector 262 . In this example, detector 262 includes at least two radiation-sensitive portions (eg, regions or detectors) shown in FIG. 7(O) by separating detector 262 . When the substrate is in focus, a sharp image is formed at edge 260, so the radiation sensitive portion of detector 262 receives an equal amount of radiation. While the substrate is out of focus, the beam 256 is displaced and the image will be formed in front of or behind the edge 260 . Thus, edge 260 will intercept a particular portion of beam 256 and one radiation sensitive portion of detector 262 will receive a smaller amount of radiation than another radiation sensitive portion of detector 262 . A comparison of the output signals from the radiation-sensitive portion of detector 262 enables the amount by which the redirected beam 256 differs from the expected position, the direction in which the redirected beam 256 differs from the expected position, and The plane of the substrate from which the redirected beam 256 exits from the desired position. The signal may be electronically processed to provide a control signal by which adjustments to lens 242 may be made, for example. Mirror 258 , edge 260 and detector 262 may be mounted to array 200 . In one embodiment, the detector 262 may be a four-quadrant optoelectronic unit.

In one embodiment, 400 individually addressable elements 102 may be provided, with (at any one time) 133 active. In one embodiment, 600-1200 operative individually addressable elements 102 may be provided, optionally with additional individually addressable elements 102, for example for reserve and/or for correcting exposure (e.g. such as described above). The number of working individually addressable elements 102 may eg depend on the resist, which requires a certain dose of radiation for patterning. In case the individually addressable elements 102 are rotatable (eg individually addressable elements 102 ), the individually addressable elements 102 may be rotated at a frequency of 6 Hz with 1200 individually addressable elements 102 operating. If you have fewer individually addressable elements 102, you can rotate the individually addressable elements 102 at a higher frequency; if you have more individually addressable elements 102, you can rotate the individually addressable elements 102 at a lower frequency. address element 102.

In an embodiment, movable individually addressable elements 102 may be used to reduce the number of individually addressable elements 102 as compared to an array of individually addressable elements 102 . For example, 600-1200 active individually addressable elements 102 may be provided (at any one time). Additionally, the reduced number can yield substantially similar results to an array of individually addressable elements 102, but with one or more advantages. For example, for sufficient exposure capability using an array of violet diodes, an array of 100,000 violet diodes, eg arranged in 200 diodes x 500 diodes, may be required. When operating at a frequency of 10 kHz, the optical power per laser diode will be 0.33 mW. The electrical power of each laser diode will be 150mW = 35mA x 4.1V. Therefore, for the array, the electrical power would be 15kW. In an embodiment using movable individually addressable elements, 400 violet diodes can be provided, 133 of which are active. When operating at a frequency of 9Mhz, the optical power per laser diode will be 250mW. The electrical power of each laser diode will be 1000mW = 240mA x 4.2V. Therefore, for the array, the electrical power would be 133W. Thus, the diodes in the movable individually addressable element arrangement can be operated in the steep part of the light output power vs. forward current curve (240mA v.35mA) as shown for example in Fig. 7(P), This results in a high output power per diode (250mW v.0.33mW), but with low electrical power for multiple individually addressable elements (133W v.15kW). Thus, the diodes can be used more efficiently and result in reduced power loss and/or heat.

Thus, in one embodiment, the diode operates in the steep portion of the power/forward current curve. Operating in the non-steep portion of the power/forward current curve may result in incoherence in radiation. In an embodiment, the diode operates at an optical power greater than 5 mW but less than or equal to 20 mW, or less than or equal to 30 mW, or less than or equal to 40 mW. In an embodiment, the diode is not operated at an optical power greater than 300 mW. In one embodiment, the diodes are operated in a single mode rather than in multiple modes.

The number of individually addressable elements 102 on the array 200 may depend, in particular (and to the extent as otherwise indicated above) on the length of the exposure area that the array 200 is to cover, the speed at which the array moves during exposure, The size of the spot (i.e. the cross-sectional dimension of the spot projected onto the substrate from the individually addressable elements 102, e.g. width/diameter), the desired intensity each individually addressable element should provide (e.g. is it desired for more than desired dose to avoid damage to the substrate or resist on the substrate), desired scan speed of the substrate, cost considerations, independently addressable elements address elements can be turned on (ON) or turned off (OFF), and the desire for redundant independently addressable elements 102 (as previously discussed; for example for correct exposure or as a reserve, for example if a or more individually addressable element failures). In one embodiment, the array 200 includes at least 100 individually addressable elements 102, such as at least 200 individually addressable elements, at least 400 individually addressable elements, at least 600 individually addressable elements, at least 1000 Individually addressable elements, at least 1500 individually addressable elements, at least 2500 individually addressable elements, or at least 5000 individually addressable elements. In one embodiment, array 200 includes less than 50,000 individually addressable elements 102, such as less than 25,000 individually addressable elements, less than 15,000 individually addressable elements, less than 10,000 individually addressable elements, less than 7,500 Individually addressable elements, less than 5000 individually addressable elements, less than 2500 individually addressable elements, less than 1200 individually addressable elements, less than 600 individually addressable elements, or less than 300 individually addressable elements element.

In one embodiment, the array 200 includes for each 10 cm exposure field length (i.e., such that the number of individually addressable elements in the array is normalized for a 10 cm exposure field length): at least 100 individually addressable elements 102, e.g. At least 200 individually addressable elements, at least 400 individually addressable elements, at least 600 individually addressable elements, at least 1000 individually addressable elements, at least 1500 individually addressable elements, at least 2500 individually addressable elements addressable elements, or at least 5000 individually addressable elements. In one embodiment, the array 200 includes less than 50,000 individually addressable elements 102 per 10 cm exposure field length (i.e. such that the number of individually addressable elements in the array is normalized for a 10 cm exposure field length), for example less than 25,000 IDs, less than 15,000 IDs, less than 10,000 IDs, less than 7,500 IDs, less than 5,000 IDs, less than 2,500 IDs addressable elements, less than 1200 individually addressable elements, less than 600 individually addressable elements, or less than 300 individually addressable elements.

In one embodiment, the array 200 includes less than 75% redundant individually addressable elements 102, such as 67% or less, 50% or less, about 33% or less, 25% or less, 20 % or less, 10% or less, or 5% or less. In one embodiment, array 200 includes at least 5% redundant individually addressable elements 102, such as at least 10%, at least 25%, at least 33%, at least 50%, or at least 65%. In one embodiment, the array includes approximately 67% redundant individually addressable elements.

In one embodiment, the spot size of the individually addressable elements on the substrate is 10 microns or less, 5 microns or less, such as 3 microns or less, 2 microns or less, 1 micron or less , 0.5 microns or less, 0.3 microns or less, or about 0.1 microns. In one embodiment, the spot size of the individually addressable elements on the substrate is 0.1 micron or larger, 0.2 micron or larger, 0.3 micron or larger, 0.5 micron or larger, 0.7 micron or larger, 1 micron or greater, 1.5 microns or greater, 2 microns or greater, or 5 microns or greater. In one embodiment, the spot size is about 0.1 microns. In one embodiment, the spot size is about 0.5 microns. In one embodiment, the spot size is about 1 micron.

In operating the lithographic apparatus 100, a substrate 114 is loaded onto the substrate table 106 using, for example, a robotic transporter (not shown). Substrate 114 is then displaced along the X direction beneath frame 160 and individually addressable elements 102 . The substrate 114 is measured by a level sensor and/or an alignment sensor 150, and the substrate is then pattern-exposed using the individually addressable elements 102, as described above. Individually addressable elements 102 may be operated, for example, to provide pixel-to-grid imaging as discussed herein.

Figure 8 shows a schematic side view of a lithographic apparatus according to one embodiment of the invention. As shown in FIG. 8 , lithographic apparatus 100 includes patterning device 104 and projection system 108 . Projection system 108 includes two lenses 176 , 172 . The first lens 176 is arranged to receive the modulated radiation beam 110 from the patterning device 104 and focus it through a contrast aperture in the aperture stop 174 . Additional lenses (not shown) may be located in the aperture. The radiation beam 110 then diverges and is focused by a second lens 172 (eg, a field lens).

The projection system 108 also includes a lens array 170 arranged to receive the modulated radiation beam 110 . Different portions of modulated radiation beam 110 corresponding to one or more individually controllable elements in patterning device 104 pass through respective different lenses in lens array 170 . Each lens focuses a respective portion of the modulated radiation beam 110 onto a point on the substrate 114 . In this way, an array of radiation spots S (see FIG. 12 ) is exposed onto the substrate 114 . It should be understood that while only 5 lenses are shown in the lens array 170 shown, the lens array may include hundreds or thousands of lenses (the same applies to individually controllable elements used as patterning device 104) .

As shown in FIG. 8 , a free working distance FWD is provided between the substrate 114 and the lens array 170 . This distance allows substrate 114 and/or lens array 170 to move, allowing for example focus correction. In an embodiment, the free working distance is in the range of 1-3mm, for example about 1.4mm. The individually addressable elements of the patterning device 104 are arranged at a pitch P, which results in a relative pitch P of imaging spots at the substrate 114 . In one embodiment, lens array 170 may provide an NA of 0.15 or 0.18. In one embodiment, the imaged spot size is about 1.6 μm.

In this embodiment, projection system 108 may be a 1:1 projection system, where the array pitch of the image spots on substrate 114 is the same as the array pitch of the pixels of patterning device 104 . To provide improved resolution, the image spots may be much smaller than the pixels of the patterning device 104 .

Fig. 9 shows a schematic side view of a lithographic apparatus according to an embodiment of the invention. In this embodiment, there is no optical device between the patterning device 104 and the substrate 114 other than the lens array 170 .

The lithographic apparatus 100 in FIG. 9 includes a patterning device 104 and a projection system 108 . In this case, projection system 108 comprises only lens array 170 arranged to receive modulated radiation beam 110 . Different portions of modulated radiation beam 110 corresponding to one or more individually controllable elements in patterning device 104 are passed through respective different lenses in lens array 170 . Each lens focuses a respective portion of the modulated radiation beam 110 onto a point on the substrate 114 . In this way, an array of radiation spots S (see FIG. 12 ) is exposed onto the substrate 114 . It should be understood that while only 5 lenses are shown in the lens array 170 shown, the lens array may include hundreds or thousands of lenses (the same applies to individually controllable elements used as patterning device 104).

As shown in FIG. 8 , a free working distance FWD is provided between the substrate 114 and the lens array 170 . This distance allows substrate 114 and/or lens array 170 to move to allow focus correction, for example. The individually addressable elements of the patterning device 104 are arranged at a pitch P, which results in a relative pitch P of imaging spots at the substrate 114 . In one embodiment, lens array 170 may provide an NA of 0.15. In one embodiment, the imaged spot size is about 1.6 μm.

FIG. 10 shows a schematic side view of a lithographic apparatus according to an embodiment of the invention using the movable individually addressable elements 102 described above with respect to FIG. 5 . In this embodiment, apart from the lens array 170 , there are no other optical devices between the patterning device 104 and the substrate 114 .

The lithographic apparatus 100 in FIG. 10 includes a patterning device 104 and a projection system 108 . In this case, projection system 108 comprises only lens array 170 arranged to receive modulated radiation beam 110 . Different portions of modulated radiation beam 110 corresponding to one or more individually controllable elements in patterning device 104 are passed through respective different lenses in lens array 170 . Each lens focuses a respective portion of the modulated radiation beam 110 onto a point on the substrate 114 . In this way, an array of radiation spots S (see FIG. 12 ) is exposed onto the substrate 114 . It should be understood that while only 5 lenses in lens array 170 are shown, the lens array may include hundreds or thousands of lenses (the same applies to individually controllable elements used as patterning device 104).

As shown in FIG. 8 , a free working distance FWD is provided between the substrate 114 and the lens array 170 . This distance allows substrate 114 and/or lens array 170 to move to allow focus correction, for example. The individually addressable elements of the patterning device 104 are arranged at a pitch P, which results in a relative pitch P of imaging spots at the substrate 114 . In one embodiment, lens array 170 may provide an NA of 0.15. In one embodiment, the imaged spot size is about 1.6 μm.

FIG. 11 shows a plurality of individually addressable elements 102 , specifically six individually addressable elements 102 . In this embodiment, each individually addressable element 102 is a radiation emitting diode, such as a blue-violet laser diode. Each radiation emitting diode bridges two wires to supply current to the radiation emitting diodes to control the diodes. Thus, the diodes form an addressable grid. The width between the two wires is about 250 μm and the radiation emitting diodes have a pitch of about 500 μm.

Figure 12 shows schematically how a pattern on a substrate 114 may be produced. The solid circles represent the array of spots S projected onto the substrate 114 by the lens array MLA in the projection system 108 . The substrate 114 is moved in the X direction relative to the projection system 108 as a series of exposures are performed on the substrate. Open circles represent spot exposure SEs that have been previously exposed on the substrate. As shown, each spot projected onto substrate 114 through lens array 170 in projection system 108 exposes a row of R spots on substrate 114 . The complete pattern of the substrate 114 is produced by the sum of the spot exposures SE of all rows R exposed by each spot S. Such an arrangement is commonly referred to as "pixel-grid imaging". It should be understood that Fig. 12 is a schematic drawing and that spots S may overlap in practice.

It can be seen that the array of radiation spots S is arranged at an angle α relative to the substrate 114 (the edges of the substrate 114 lie parallel to the X and Y directions). This is done so that each radiation spot will pass through a different area of the substrate as the substrate 114 is moved along the scan direction (X direction), allowing the entire substrate to be covered by the array of radiation spots S. In an embodiment, the angle α is at most 20°, 10°, such as at most 5°, at most 3°, at most 1°, at most 0.5°, at most 0.25°, at most 0.10°, at most 0.05°, or at most 0.01°. In an embodiment, the angle α is at least 0.0001°, such as at least 0.001°. The width of the array in the scan direction and the tilt angle α are determined according to the array pitch and the image spot size in the direction perpendicular to the scan direction for ensuring that the entire surface area of the substrate 114 is addressed.

Figure 13 schematically shows how an entire substrate 114 can be exposed in a single scan by using multiple optical engines, each comprising one or more independently addressable elements. 8 arrays SA of radiation spots S (not shown) are generated by 8 optical engines, and the 8 optical engines are arranged in two rows R1, R2 on a "checkerboard", or in a staggered configuration, so that the radiation spots S The edge of one array slightly overlaps the edge of the adjacent array of radiation spots S. In an embodiment, the optical engines are arranged in at least 3 rows, such as 4 rows or 5 rows. In this way, the strip of radiation extends across the width of the substrate W, allowing exposure of the entire substrate to be performed in a single scan. Such "full-width" single-pass exposure helps avoid possible stitching problems connecting two or more pass was moved on. It should be understood that any suitable number of optical engines may be used. In an embodiment, the number of optical engines is at least 1, such as at least 2, at least 4, at least 8, at least 10, at least 12, at least 14, or at least 17. In one embodiment, the number of optical engines is less than 40, such as less than 30 or less than 20. Each optical engine may include a separate patterning device 104 and optionally a separate projection system 108 and/or radiation system as described above. It should be understood, however, that two or more optical engines may share at least a portion of one or more radiation systems, patterning device 104 , and/or projection system 108 .

In embodiments described herein, a controller for controlling individually addressable elements is provided. For example, in the case where the individually addressable elements are radiation emitting devices, the controller can control when the individually addressable elements are turned on (ON) or turned off (OFF), and obtain high frequency modulation. A controller may control the power of radiation emitted by one or more individually addressable elements. A controller may modulate the intensity of radiation emitted by one or more individually addressable elements. The controller can control/adjust intensity uniformity over all or a portion of the array of individually addressable elements. The controller can adjust the radiation output of the individually addressable elements to correct for imaging errors such as etendue and optical aberrations (eg coma, astigmatism, etc.).

In photolithography, desired features can be produced on a substrate by selectively exposing a resist layer on the substrate to radiation, for example by exposing the resist layer to patterned radiation. Areas of the resist that receive a certain minimum radiation dose ("dose threshold") undergo a chemical reaction, while other areas remain unchanged. The resulting chemical differences in the resist layer allow development of the resist, ie selective removal of areas that have received at least a minimum dose or removal of areas that have not received a minimum dose. As a result, a portion of the substrate remains protected by the resist, while regions of the substrate from which the resist has been removed are exposed, allowing for example additional processing steps such as selective etching of the substrate, selective metal deposition, etc., whereby produce the desired characteristics. Patterning of the radiation can be achieved by setting independently controllable elements in the patterning device such that the radiation delivered to regions of the resist layer on the substrate within the desired features is at a sufficiently high intensity that the Regions receive a radiation dose greater than the dose threshold during exposure, while other regions on the substrate receive a radiation dose below the dose threshold by setting corresponding individually controllable elements to provide zero or significantly lower radiation intensity.

In practice, the radiation dose at the edge of a desired feature may not vary from a given The maximum dose changes dramatically to zero dose. Alternatively, the level of radiation dose may decrease across the transition region due to diffraction effects. The location of the resulting boundary of the desired feature after developing the resist is then determined by the location at which the received dose drops below a radiation dose threshold. The distribution of the radiation dose drop across the transition region and thus the precise location of the feature boundary can be more precisely controlled by setting independently controllable elements providing not only maximum or minimum intensity levels but also is radiation at an intensity level between the maximum and minimum intensity levels to a point on the substrate that is on or near a feature boundary. This is often referred to as "grayscale" or "grayscale levels".

Gray scale can provide greater control over the location of feature boundaries than is possible in lithographic systems where the intensity of radiation delivered to the substrate by a given independently controllable element can be set to only two values (that is, only the maximum and minimum values). In an embodiment, at least three different irradiance values may be projected onto the substrate, for example at least 4 irradiance values, at least 8 irradiance values, at least 16 irradiance values, at least 32 irradiance values , at least 64 radiation intensity values, at least 100 radiation intensity values, at least 128 radiation intensity values, or at least 256 radiation intensity values. If the patterning device is itself a radiation source (such as an array of light emitting diodes or laser diodes), gray scales can be achieved, for example by controlling the intensity level of the transmitted radiation. If the contrast device is a micromirror device, gray scales can be achieved, for example by controlling the tilt angle of the micromirrors. Additionally, grayscale can be achieved by grouping multiple programmable elements in the contrast device and controlling the number of elements within the group that are switched on or off at a given time.

In one example, the patterning device can have a range of states including: (a) a black state where the contribution of the supplied radiation to the intensity distribution of its corresponding pixel is minimal or even zero; (b) the whitest A state in which the provided radiation makes the greatest contribution; and (c) states in between the preceding two states in which the provided radiation makes an intermediate contribution. The states are divided into a normal group for normal beam patterning/printing and a compensation group for compensating the effects of defective elements. The normal group includes the black state and the first group of intermediate states. This first group will be described as grayscale states, which are selectable to provide an increasing contribution to the corresponding pixel intensity from a minimum black value up to a certain normal maximum value. The compensation set includes the remaining second set of intermediate states and the whitest state. This second set of intermediate states will be described as white states, which are optional to provide a larger than normal maximum contribution, increasing up to the true maximum corresponding to the whitest state. Although the second set of intermediate states are described as white states, it should be understood that this is merely a convenience for distinguishing between normal and compensated exposure steps. All multiple states would alternatively be described as a sequence of grayscale states between black and white, optionally enabling grayscale printing.

It should be understood that gray scale may be used for additional or alternative purposes to those described above. For example, the processing of the substrate after exposure can be tuned so that there are more than two potential responses of regions of the substrate depending on the received radiation dose level. For example, a portion of the substrate receiving a radiation dose below a first threshold responds in a first manner; a portion of the substrate receiving a radiation dose above the first threshold but below a second threshold responds in a second manner; and receiving A portion of the substrate at a radiation dose above the second threshold responds in a third manner. Thus, grayscale can be used to provide a radiation dose distribution across the substrate with more than two desired dose levels. In an embodiment, the radiation dose profile has at least 2 desired dose levels, such as at least 3 desired radiation dose levels, at least 4 desired radiation dose levels, at least 6 desired radiation dose levels or at least 8 desired radiation dose levels.

It should also be understood that the radiation dose distribution may be controlled by methods other than merely controlling the intensity of radiation received at each point on the substrate, as described above. For example, the radiation dose received by each point on the substrate may alternatively or additionally be controlled by controlling the duration of exposure of that point. As another example, each point on the substrate may potentially receive radiation in multiple consecutive exposures. Thus, the radiation dose received by each point may alternatively or additionally be controlled by exposing the point using a selected subset of the plurality of consecutive exposures.

To form a pattern on a substrate, each individually controllable element in the patterning device needs to be set to a desired state at each stage during the exposure process. Therefore, a control signal representing the desired state must be transmitted to each individually controllable element. Desirably, the lithographic apparatus includes a controller 400 that generates control signals. The pattern to be formed on the substrate can be provided to a lithographic apparatus in a vector-defined format such as GDSII. In order to convert the design information into control signals for each individually controllable element, the controller includes one or more data manipulation devices, each configured to perform a processing step on the data stream representing the pattern. Data manipulation devices may be collectively referred to as a "datapath".

The data manipulation device in the data path may be configured to perform one or more of the following functions: converting vector-based design information into bitmap pattern data; converting bitmap pattern data into required radiation dose maps (i.e. in required radiation dose distribution over the entire substrate); converting the required radiation dose map into required radiation intensity values for each individually controllable element; and converting the required radiation intensity values for each individually controllable element into corresponding control signal.

In one embodiment, the control signals may be supplied to the individually controllable elements 102 and/or one or more other devices (eg, sensors) via wired or wireless communications. Additionally, signals from individually controllable elements 102 and/or from one or more other devices (eg, sensors) may be communicated to controller 400 .

Referring to FIG. 14(A), in a wireless embodiment, the transceiver (or just the transmitter) 406 transmits signals containing the control signals received by the transceiver (or just the receiver) 402 . Control signals are sent to respective individually controllable elements 102 via one or more wires 404 . In one embodiment, the signal from transceiver 406 may include multiple control signals, which transceiver 402 may demultiplex into respective individually controllable elements 102 and/or one or more other devices (e.g. sensor) multiple control signals. In one embodiment, wireless transmission may be via radio frequency (RF).

Referring to FIG. 14(B), in a wired embodiment, one or more wires 404 may connect the controller 400 to the individually controllable elements 102 and/or to one or more other devices (eg, sensors). In an embodiment, a single line 404 may be provided to carry each control signal to and/or from the body of the array 200 . At the body of the array 200, the control signals may then be provided individually to the individually controllable elements 102 and/or to one or more other devices (eg, sensors). For example, similar to the wireless example, control signals can be multiplexed for transmission on a single wire, and then can be multiplexed for delivery to individually controllable elements 102 and/or to one or more other devices (such as sensors). Perform demultiplexing. In an embodiment, a plurality of wires 404 may be provided to carry respective control signals of the individually controllable elements 102 and/or one or more other devices (eg, sensors). In embodiments where array 200 is rotatable, wire 404 may be provided along axis A of rotation. In an embodiment, signals may be provided to or from the body of array 200 by sliding contacts at or around motor 216 . This may be advantageous for rotatable embodiments. The sliding contact can be, for example, by a brush in contact with the plate.

In an embodiment, wire 404 may be an optical wire. In this case, the signal may be an optical signal, wherein for example different control signals may be transmitted at different wavelengths.

In a manner similar to the control signals, power may be supplied to the individually controllable elements 102 or to one or more other devices (eg, sensors) by wire or wirelessly. For example, in wired embodiments, power may be supplied over one or more wires 404, whether the same or different than the wires carrying the signal. As mentioned above, a sliding contact arrangement may be provided to transfer power. In wireless embodiments, power may be delivered via RF coupling.

While the previous discussion has focused on the control signals supplied to the individually controllable elements 102 and/or to one or more other devices (such as sensors), it should be understood that they also include, additionally or alternatively by suitable configuration Signals are transmitted from the individually controllable elements 102 and/or one or more other devices (eg, sensors) to the controller 400 . Accordingly, communication may be one-way (e.g., to or from only the individually controllable element 102 and/or one or more other devices (e.g., sensors)) or two-way (i.e., to and from the individually controllable element 102 and and/or one or more other devices (eg sensors)). For example, transceiver 402 may multiplex multiple signals from individually controllable elements 102 and/or one or more other devices (eg, sensors) for transmission to transceiver 406, at which point it may be multiplexed into separate signals.

In an embodiment, the control signal providing the pattern may be changed to take into account factors that may affect the correct provision and/or realization of the pattern on the substrate. For example, corrections may be applied to the control signals to account for heating of one or more of the arrays 200 . Such heating may cause altered pointing directions of the individually controllable elements 102, changes in the uniformity of radiation from the individually controllable elements 102, and the like. In one embodiment, measured temperature and/or expansion/contraction associated with array 200 (e.g., of one or more individually controllable elements 102) from, for example, sensor 234 may be used to alter the control signal that would otherwise have been provided. The control signal to form a pattern. Thus, for example during exposure, the temperature of the individually controllable elements 102 may vary, which variation causes a variation of the projected pattern to be provided at a single constant temperature. Therefore, the control signal can be changed to account for such changes. Similarly, in an embodiment, results from the alignment sensor and/or level sensor 150 may be used to alter the pattern provided by the individually controllable elements 102 . This pattern can be changed to correct for example deformations that may be caused by, for example, optics between the individually controllable elements 102 and the substrate 114 (if any), irregularities in the positioning of the substrate 114, irregularities in the substrate 114, etc. Caused by flatness, etc.

In an embodiment, the change in the control signal may be determined based on a theory of physical/optical consequences on the desired pattern caused by measured parameters (eg, measured temperature, distance measured by a level sensor, etc.). In an embodiment, the change in the control signal may be determined based on an experimental or empirical model of the physical/optical consequences on the desired pattern caused by the measured parameters. In an embodiment, changes in the control signal may be applied in a feed-forward and/or feedback manner.

In an embodiment, a lithographic apparatus may include a sensor 500 that measures a characteristic of radiation that is or will be transmitted through one or more individually controllable elements 102 towards a substrate. Such sensors may be spot sensors or transmissive image sensors. The sensors may be used, for example, to determine the intensity of radiation from individually controllable elements 102, the uniformity of radiation from individually controllable elements 102, the cross-sectional size or area of radiation spots from individually controllable elements 102, and/or the The position of the radiation spot (in the X-Y plane) of the controllable element 102 .

Fig. 15 shows a schematic top view of a lithographic apparatus showing some exemplary positions of sensors 500 according to an embodiment of the invention. In an embodiment, one or more sensors 500 are disposed in or on the substrate table 106 holding the substrate 114 . For example, sensor 500 may be disposed at a leading edge of substrate table 106 and/or a trailing edge of substrate table 106 . In this example, four sensors 500 are shown, one for each array 200 . It is desirable that they be located where they will not be covered by the substrate 116 . In an alternative or additional example, sensors may be positioned at side edges of the substrate table 106 , desirably at locations that will not be covered by the substrate 116 . A sensor 500 at the front edge of the substrate table 106 may be used for detection of pre-exposure of the individually controllable elements 102 . A sensor 500 at the trailing edge of the substrate table 106 may be used for post-exposure detection of the individually controllable elements 102 . Sensors 500 at the side edges of the substrate table 106 may be used for detection of the individually controllable elements 102 during exposure ("on-the-fly" detection).

Referring to FIG. 16(A), a schematic side view of a portion of a lithographic apparatus according to an embodiment of the present invention is shown. In this example, only a single array 200 is shown, and other parts of the lithographic apparatus omitted for clarity; the sensors described here may be applied to each array 200 or some arrays 200 . Some additional or alternative examples of the location of the sensor 500 (in addition to the sensor 500 of the substrate table 106) are shown in FIG. 16(A). A first example is a sensor 500 on frame 160 that receives radiation from individually controllable elements 102 through a beam redirecting structure 502 (eg, a reflective mirror arrangement). In this first example, the individually controllable elements 102 move in the X-Y plane, and thus different ones of the individually controllable elements 102 may be arranged to provide radiation to the beam redirecting structure 502 . An additional or alternative second example is a sensor 500 on the frame 160 that receives radiation from the individually controllable elements 102 from the backside (i.e., the side opposite to where the exposure radiation is provided) of the individually controllable elements 102. radiation. In this second example, the individually controllable elements 102 move in the X-Y plane, and thus different ones of the individually controllable elements 102 may be arranged to provide radiation to the sensor 500 . Although the sensor 500 in the second example is shown in the path of the individually controllable elements 102 at the exposure area 204 , the sensor 500 may be located where the sensor 510 is shown. In an embodiment, the sensor 500 on the frame 160 is located at a fixed position or may otherwise be movable by, for example, an associated actuator. In addition to or instead of pre-exposure sensing and/or post-exposure sensing, the first and second examples above may be used to provide "on the fly" sensing. A third example is sensor 500 on structures 504,506. Structures 504 , 506 may be movable by actuator 508 . In one embodiment, the structure 504 is located below or to the side of the path in which the substrate table will travel (as shown in FIG. 16(A)). In one embodiment, the structure 504 may be moved by the actuator 508 to the position where the sensor 500 of the substrate table 106 is shown in FIG. 16(A) (if the substrate table 106 is not there), if the structure 504 is on the side of the path, then such movement may be along the Z direction (as shown in FIG. 16(A)) or along the X and/or Y directions. In one embodiment, the structure 506 is located above or to the side of the path along which the substrate table will move (as shown in FIG. 16(A)). In one embodiment, the structure 506 can be moved by the actuator 508 to the position where the sensor 500 of the substrate table 106 is shown in FIG. 16(A) (if the substrate table 106 is not there). Structure 506 may be connected to frame 160 and be displaceable relative to frame 160 .

In an operation to measure a characteristic of radiation transmitted or to be transmitted towards the substrate by one or more individually controllable elements 102, the sensor 500 is positioned by moving the sensor 500 and/or moving the radiation beam of the individually controllable elements 102 such that the sensor 500 is positioned from In the path of the radiation of the independently controllable element 102 . Thus, as an example, the substrate table 106 may be moved to position the sensor 500 in the path of radiation from the individually controllable elements 102 shown in FIG. 16(A). In this case, the sensor 500 is positioned in the path of the individually controllable elements 102 at the exposure area 204 . In an embodiment, the sensor 500 may be positioned in the path of an individually controllable element 102 outside the exposure area 204 (eg, the individually controllable element 102 shown on the left hand side if the beam redirecting structure 502 is not there). If located in the path of the radiation, the sensor 500 can detect the radiation and measure characteristics of the radiation. To facilitate sensing, sensor 500 may move relative to individually controllable elements 102 , and/or individually controllable elements 102 may move relative to sensor 500 .

As another example, individually controllable elements 102 may be moved to a position such that radiation from individually controllable elements 102 impinges on beam redirecting structure 502 . The beam redirecting structure 502 directs the beam to the sensor 500 on the frame 160 . To facilitate sensing, sensor 500 may move relative to individually controllable elements 102 , and/or individually controllable elements 102 may move relative to sensor 500 . In this example, the individually controllable elements 102 are measured outside the exposure area 204 .

In an embodiment, the sensor 500 may be fixed or mobile. If fixed, the individually controllable elements 102 are desirably movable relative to the fixed sensor 500 to facilitate sensing. For example, array 200 may be moved (eg, rotated or translated) relative to sensor 500 (eg, sensor 500 on frame 160 ) to facilitate sensing by sensor 500 . If the sensor 500 is movable (eg, the sensor 500 on the substrate table 106), the individually controllable elements 102 may remain stationary for sensing, or otherwise be moved, eg, to accelerate sensing.

Sensor 500 may be used to calibrate one or more individually controllable elements 102 . For example, the position of the spots of the individually controllable elements 102 can be detected by the sensor 500 prior to exposure and the system calibrated accordingly. Exposure can then be adjusted based on this expected location of the spot (eg, controlling the position of the substrate 114, controlling the position of the individually controllable elements 102, controlling the individually controllable elements 102 to be OFF or ON, etc.). Alternatively, calibration can be performed subsequently. For example, calibration may be performed using, for example, the sensor 500 on the trailing edge of the substrate table 106 immediately after an exposure and before another exposure. Calibration can be done before each exposure, after a certain number of exposures, etc. Additionally, the position of the spots of the individually controllable elements 102 can be detected "on the fly" by use of the sensor 500 and the exposure adjusted accordingly. Individually controllable elements 102 may be able to be recalibrated based on "on the fly" sensing.

In one embodiment, one or more of the individually controllable elements 102 may be coded to enable detection of which individually controllable element 102 is in a particular location or being used. In an embodiment, the independently controllable element 102 may have an identification, and the sensor 510 may be used to detect the identification, and the identification may be RFID, a bar code, or the like. For example, each of the plurality of individually controllable elements 102 can be moved close to the sensor 510 to read the identification. Knowing which individually controllable element 102 is close to the sensor 510 , it can be known which individually controllable element 102 is close to the sensor 500 , which individually controllable element 102 is in the exposure area 204 , and so on. In an embodiment, each individually controllable element 102 may be used to provide radiation having a different frequency and the sensors 500 , 510 may be used to detect which individually controllable element 102 is close to the sensor 500 , 510 . For example, each of the plurality of individually controllable elements 102 may be moved close to the sensor 500, 510 to receive radiation from the individually controllable element 102, and the sensors 500, 510 may then demultiplex the received radiation, to determine which individually controllable element 102 is close to the sensor 500, 510 at a particular time. Knowing the above, it is possible to know which individually controllable element 102 is close to the sensor 500 , which individually controllable element 102 is located in the exposure area 204 , and so on.

In one embodiment, position sensors may be provided to determine the position of one or more individually controllable elements 102 in up to 6 degrees of freedom, as described above. For example, sensor 510 may be used for position detection. In an embodiment, sensor 510 may include an interferometer. In one embodiment, sensor 510 may include an encoder that may be configured to detect one or more one-dimensional encoder gratings and/or one or more two-dimensional encoder gratings.

In an embodiment, a sensor 520 may be provided for determining the characteristics of the radiation that has been transmitted to the substrate. In this embodiment, sensor 520 captures radiation redirected by the substrate. In an example use, the redirected radiation captured by sensor 520 may be used to facilitate determining the position of a spot of radiation from individually controllable elements 102 (eg, the misalignment of the spot of radiation from individually controllable elements 102 ). In particular, sensor 520 may capture redirected radiation, ie, a latent image, from the portion of the substrate that was just exposed. Measurement of the intensity of this tail-redirected radiation can give an indication of whether the spot is properly aligned. For example, repeated measurements of this tail may give repeated signals from which deviations will indicate misalignment of the spots (eg, out-of-phase signals may indicate misalignment). FIG. 16(B) shows a schematic position of the detection area of the sensor 520 relative to the exposure area 522 of the substrate 114 . In this example, 3 detection areas are shown, the results of which can be compared and/or combined to facilitate identification of misalignments. Only one detection zone needs to be used, for example the one on the left hand side. In an embodiment, the detectors 262 of the individually controllable elements 102 may be used in a similar manner to the sensors 520 . For example, one or more individually controllable elements 102 outside the exposure area 204 of the array 200 on the right-hand side may be used to detect radiation redirected from the latent image on the substrate.

Figure 17 shows one embodiment of a lithographic apparatus. In this embodiment, a plurality of individually controllable elements 102 direct radiation towards a rotatable polygon 600 . The surface 604 of the polygon 600 on which the radiation impinges redirects the radiation towards the lens array 170 . Lens array 170 directs radiation towards substrate 114 . During exposure, polygon 600 rotates about axis 602 such that a respective beam from each of plurality of individually controllable elements 102 moves across lens array 170 in the Y direction. Specifically, as each new facet of polygon 600 impinges with radiation, the beam will repeatedly scan across lens array 170 in the positive Y direction. The individually controllable elements 102 are modulated during exposure to provide the desired pattern as discussed herein. A polygonal piece may have any number of suitable sides. Additionally, the individually controllable elements 102 are modulated in time sequence with the rotating polygon 600 such that the respective beams impinge on lenses in the lens array 170 . In an embodiment, a further plurality of individually controllable elements 102 may be arranged on the opposite side of the polygon, ie on the right-hand side, so that radiation impinges on the surface 606 of the polygon 600 .

In one embodiment, a vibrating optical element may be used in place of polygon 600 . The vibrating optical element has a specific fixed angle relative to the lens array 170 and can be translated back and forth along the Y direction so that the beam is scanned back and forth across the lens array 170 in the Y direction. In one embodiment, polygon 600 may be replaced with an optical element that rotates back and forth about axis 602 through an arc. By rotating the optics back and forth through an arc, the beam is scanned back and forth across lens array 170 in the Y direction. In one embodiment, the polygon 600, the vibrating optical element, and/or the rotating optical element have one or more mirror surfaces. In one embodiment, polygon 600, vibrating optical elements, and/or rotating optical elements comprise prisms. In one embodiment, an AOM may be used in place of the polygon 600 . An acousto-optic modulator may be used to scan the beam across lens array 170 . In an embodiment, lens array 170 may be placed in the radiation path between plurality of individually controllable elements 102 and polygon 600, vibrating optical element, rotating optical element, and/or acousto-optic modulator.

Thus, in general, the width of the exposure area (eg the substrate) can be covered with less radiation output than the width of these radiation outputs divided into the width of the exposure area. In an embodiment, this may include moving the source of the radiation beam relative to the exposure area or moving the radiation beam relative to the exposure area.

Figure 18 shows a schematic cross-sectional side view of a lithographic apparatus according to an embodiment of the invention, with movable individually controllable elements 102. Like the lithographic apparatus 100 shown in FIG. 5 , the lithographic apparatus 100 includes a substrate table 106 for holding a substrate, and a positioning device 116 for moving the substrate table 106 in up to 6 degrees of freedom.

The lithographic apparatus 100 also includes a plurality of individually controllable elements 102 arranged on a frame 160 . In this embodiment, each individually controllable element 102 is a radiation emitting diode, for example a laser diode, such as a blue-violet laser diode. The individually controllable elements 102 are arranged in an array 200 of individually controllable elements 102 extending along the Y direction. Although one array 200 is shown, a lithographic apparatus may have multiple arrays 200 such as shown in FIG. 5 .

In this embodiment, the array 200 is a rotatable plate with a plurality of spatially discrete individually controllable elements 102 arranged around the plate. In use, the plate rotates about its own axis 206 , for example in the direction shown by the arrow in FIG. 5 . The plates of array 200 are rotated about axis 206 using motor 216 . Additionally, the plates of array 200 may be moved in the Z direction by motor 216 such that individually controllable elements 102 may be displaced relative to substrate table 106 .

In this embodiment, array 200 may have one or more heat sinks 230 to increase the surface area for heat dissipation. Heat sink 230 may, for example, be on the top surface of array 200 . Optionally, one or more additional heat sinks 232 may be provided to cooperate with the heat sink 230 to facilitate heat dissipation. For example, fins 232 are capable of absorbing heat from fins 230, and may include fluid (eg, liquid) guide channels and associated heat exchangers/pumps similar to those shown in and described with respect to FIG. 7(F).

In this embodiment, a lens 242 may be located in front of each individually controllable element 102 and may move (eg, be rotatable about axis A) with the individually controllable element 102 . In FIG. 18 , two lenses 242 are shown and connected to the array 200 . Additionally, the lens 242 may be displaceable relative to the individually controllable elements 102 (eg, along the Z direction).

In this embodiment, the aperture structure 248 having the aperture therein may be located above the lens 242 , between the lens 242 and the associated individually controllable element 102 . The aperture structure 248 may limit the diffractive effects of the lens 242 , the associated individually controllable element 102 and/or the diffractive effects of adjacent lenses 242 /individually controllable elements 102 .

In this embodiment, the sensor 254 may be provided with an individually addressable element 102 (or a plurality of individually addressable elements 102 in the array 200). In this embodiment a sensor 254 is arranged to detect focus. Focused detection beam 256 is redirected (eg, reflected) away from the substrate surface, passes through lens 242 , and is directed toward detector 262 through, eg, half-silvered mirror 258 . In an embodiment, the focused detection beam 256 may be the radiation used for exposure, which is redirected just from the substrate. In an embodiment, the focused detection beam 256 may be a dedicated beam directed at the substrate, which becomes the beam 256 when redirected by the substrate. An exemplary focus sensor is described above with respect to FIG. 7(O). Mirrors 258 and detectors 262 may be mounted to array 200 .

In this embodiment, the control signals may be supplied to the individually controllable elements 102 and/or one or more other devices (eg, sensors) via wired or wireless communications. Additionally, signals from the individually controllable elements 102 and/or from one or more other devices (eg, sensors) may be communicated to the controller. In FIG. 18 , line 404 may be disposed along axis of rotation 206 . In an embodiment, wire 404 may be an optical wire. In that case, the signal may be an optical signal, wherein for example different control signals are transmitted at different wavelengths. In a manner similar to the control signals, power may be supplied to the individually controllable elements 102 or to one or more other devices (eg, sensors) by wire or wirelessly. In wired embodiments, for example, power may be supplied over one or more wires 404, whether the same or different than the wires carrying the signal. In wireless embodiments, power may be delivered via RF coupling as shown at 700 .

In this embodiment, the lithographic apparatus may include a sensor 500 that measures a characteristic of radiation that is or will be transmitted through one or more individually controllable elements 102 towards the substrate. Such sensors may be spot sensors or transmissive image sensors. The sensors may be used, for example, to determine the intensity of radiation from individually controllable elements 102, the uniformity of radiation from individually controllable elements 102, the cross-sectional size or area of radiation spots from individually controllable elements 102, and/or the The position of the radiation spot of the controllable element 102 (in the X-Y plane). In this embodiment, the sensor 500 is on the frame 160 and may be adjacent to or accessible through the substrate table 106 .

In one embodiment, instead of having individually controllable elements 102 that are movable in the X-Y plane, the individually controllable elements 102 are substantially stationary in the X-Y plane during exposure of the substrate. Needless to say, the controllable element 102 may not be movable in the X-Y plane. For example, they may be movable in the X-Y plane to correct their position. A possible advantage of having a substantially stationary controllable element 102 is that it is easier to transfer power and/or data to the controllable element 102 . An additional or alternative possible advantage is the improved ability to locally adjust the focus to compensate for height differences on the substrate that are greater than the focal depth of the system and at a higher pitch than the moving controllable elements. on the spatial frequency.

In this embodiment, while the controllable elements 102 are substantially stationary, there is at least one optical element that moves relative to the individually controllable elements 102 . Various arrangements of individually controllable elements 102 that are substantially stationary in the X-Y plane and optical elements that are movable relative thereto are described below.

In the following description, the term "lens" should generally be understood to include any one or combination of various types of optical components, including refractive, reflective, magnetic, electromagnetic and electrostatic optical components, where the circumstances permit. Components, such as any refractive, reflective and/or diffractive optical elements, which provide the same function as the mentioned lenses. For example, the imaging lens may be embodied in the form of a conventional refractive lens with optical power, in the form of a Schwarzschild reflective system with optical power, and/or in the form of a field plate with optical power. Furthermore, the imaging lens may comprise non-imaging optics if the resulting effect is to produce a converging beam on the substrate.

Also, in the following description, reference is made to a plurality of independently controllable elements 102, such as mirrors or a plurality of radiation sources in a mirror array modulator. However, it should be understood that the description more generally refers to a modulator arranged to output a plurality of beams. For example, the modulator may be an acousto-optic modulator to output a plurality of beams from the beam provided by the radiation source.

19 shows a schematic top view of a portion of a lithographic apparatus having a plurality of individually controllable elements 102 (such as laser diodes) that are substantially stationary in the X-Y plane and an optical element 242 that is movable relative thereto, according to an embodiment of the invention. layout. In this embodiment, the plurality of individually controllable elements 102 may be attached to the frame and be substantially stationary in the X-Y plane, with the plurality of imaging lenses 242 moving substantially in the X-Y plane relative to the individually controllable elements 102 ( The substrate moves along direction 803 as indicated by the rotation of wheel 801 in FIG. 19 . In one embodiment, imaging lens 242 moves relative to individually controllable elements 102 by rotating about an axis. In an embodiment, imaging lenses 242 are mounted on a structure that rotates about an axis (eg, along the direction shown in FIG. 19 ) and are arranged in a circular fashion (as partially shown in FIG. 19 ).

Each individually controllable element 102 provides a collimated beam to the moving imaging lens 242 . In one embodiment, the individually controllable elements 102 are associated with one or more collimating lenses to provide a collimated beam. In one embodiment, the collimating lens is substantially stationary in the X-Y plane and is attached to the frame to which the individually controllable elements 102 are attached.

In this embodiment, the cross-sectional width of the collimated beam is smaller than the cross-sectional width of imaging lens 242 . Thus, the individually controllable elements 102 (eg, laser diodes) may be switched on as soon as the collimated beam falls completely into the optically transmissive portion of the imaging lens 242 . Then when the beam falls outside the optically transmissive portion of the imaging lens 242, the individually controllable elements 102 (eg laser diodes) are then switched off. Thus, in one embodiment, beams from individually controllable elements 102 pass through a single imaging lens 242 at any one time. The resulting traversal of the imaging lens 242 relative to the beams from the individually controllable elements 102 produces an associated imaging line 800 on the substrate by each individually controllable element 102 switched on. In FIG. 19, three imaging lines 800 are shown with respect to each of the three exemplary individually controllable elements 102 in FIG. 19, although obviously other independently controllable elements 102 in FIG. Associated imaging line 800 .

In the layout of Figure 19, the pitch of the imaging lenses 242 may be 1.5mm, and the cross-sectional width (eg diameter) of the beams from each individually controllable element 102 is slightly less than 0.5mm. For this configuration, lines of about 1 mm in length can be written with each individually controllable element 102 . Thus, in this configuration where the beam diameter is 0.5 mm and the imaging lens 242 has a diameter of 1.5 mm, the duty cycle can be as high as 67%. With proper positioning of the individually controllable elements 102 relative to the imaging lens 242, full coverage across the width of the substrate is possible. Thus, for example, several concentric rings of laser diodes as shown in Figure 19 can be used to obtain full coverage across the width of the substrate if only standard 5.6 mm diameter laser diodes are used. Thus, in this embodiment, fewer individually controllable elements 102 (such as laser diode ).

In this embodiment, each imaging lens 242 should be identical, since each individually controllable element 102 will be imaged by all moving imaging lenses 242 . In this embodiment, none of the imaging lenses 242 need to image the field, although lenses with a higher NA, such as greater than 0.3, greater than 0.18, or greater than 0.15, are required. Diffraction-limited imaging is possible with such single-element optics.

The focal point of the beam on the substrate is fixed to the optical axis of the imaging lens 242 regardless of where the collimated beam enters the lens (see, e.g., FIG. 20 , which shows a schematic three-dimensional view of part of the lithographic apparatus of FIG. 19 ) . A disadvantage of this arrangement is that the beam from the imaging lens 242 towards the substrate is not telecentric, and therefore focus errors can occur, possibly leading to overlay errors.

In this embodiment, adjusting the focus by using elements that do not move in the X-Y plane (eg at the individually controllable elements 102) will likely cause vignetting. Therefore, the desired focus adjustment should occur in the moving imaging lens 242 . This may therefore require higher frequency actuators than the moving imaging lens 242 .

Figure 21 shows a schematic side view layout of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto according to an embodiment of the present invention, and shows the relative to the independently controllable elements. Three different rotational positions of the imaging lens 242 group of the control element. In this embodiment, the lithographic apparatus of FIGS. 19 and 20 is extended by having an imaging lens 242 comprising two lenses 802 , 804 for receiving collimated beams from individually controllable elements 102 . As shown in FIG. 19 , the imaging lenses 242 move in the X-Y plane relative to the individually controllable elements 102 (eg, rotate about an axis corresponding to the at least partially circular arrangement of the imaging lenses 242 ). In this embodiment, the beams from the individually controllable elements 102 are collimated by a lens 806 before reaching the imaging lens 242, although such lenses need not be provided in an embodiment. Lens 806 is substantially stationary in the X-Y plane. The substrate moves along the X direction.

Two lenses 802, 804 are arranged in the optical path of the collimated beam from the individually controllable elements 102 to the substrate so that the beam is telecentric towards the substrate. The lens 802 between the individually controllable elements 102 and the lens 804 comprises two lenses 802A, 802B having substantially equal focal lengths. The collimated beam from the individually controllable elements 102 is focused between the two lenses 802A, 802B such that the lens 802B will collimate the beam towards the imaging lens 804 . Imaging lens 804 images the beam onto the substrate.

In this embodiment, the lens 802 moves relative to the individually controllable elements 102 in the X-Y plane at a specific speed (eg, a specific revolution per minute (RPM)). Thus, in this embodiment, if the moving imaging lens 804 moves at the same speed as the lens 802, the outgoing collimated beam from the lens 802 will have twice the speed in the X-Y plane of the moving imaging lens 804 . Thus, in this embodiment, imaging lens 804 moves at a different speed than lens 802 relative to individually controllable elements 102 . In particular, imaging lens 804 moves in the X-Y plane at twice the speed of lens 802 (eg, twice the RPM of lens 802) so that the beam will be focused telecentrically onto the substrate. Alignment of the outgoing collimated beam from lens 802 with imaging lens 804 is shown schematically in three exemplary positions in FIG. 21 . In addition, since the actual writing on the substrate will be done at twice the speed compared to the example in Fig. 19, the power of the individually controllable elements 102 should be doubled.

In this embodiment, by adjusting the focus using elements that do not move in the X-Y plane (eg at the individually controllable elements 102 ), a loss of telecentricity would likely result and cause vignetting. Therefore, the desired focus adjustment should occur in the moving imaging lens 242 .

Additionally, in this embodiment, not all of the imaging lenses 242 need to image the field. Diffraction-limited imaging is possible with such single-element optics. Duty cycles of about 65% are possible. In one embodiment, the lenses 806, 802A, 802B and 804 may include 2 aspherical lenses and 2 spherical lenses.

In one embodiment, approximately 380 individually controllable elements 102 (eg, standard laser diodes) may be used. In one embodiment, a set of approximately 1400 imaging lenses 242 may be used. In an embodiment using standard laser diodes, a set of about 4200 imaging lenses 242 can be used, which can be arranged in 6 concentric rings on the wheel. In one embodiment, the rotating wheel of the imaging lens will rotate at approximately 12000 RPM.

Figure 22 shows a schematic side view layout of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto according to an embodiment of the present invention, and shows the relative to the independently controllable elements. Three different rotational positions of the group of imaging lenses 242 of the control element. In this embodiment, in order to avoid moving the lens at a different speed than that described with respect to FIG. 21 , a so-called 4f telecentric in/telecentric out (telecentric in /telecentric out) imaging system. The moving imaging lens 242 includes two imaging lenses 808, 810 that move at approximately the same speed in the X-Y plane (e.g., around the rim along which the imaging lenses 242 are arranged at least partially in a circular fashion). axis rotation), and receives a telecentric beam as input and outputs a telecentric imaging beam to the substrate. In the 1x magnification arrangement, the image on the substrate moves twice as fast as the moving imaging lens 242 . The substrate moves along the X direction. In this arrangement the optics will likely need to image the field with a relatively large NA (eg greater than 0.3, greater than 0.18 or greater than 0.15). This arrangement may not have two single element optics. Six or more elements with very precise alignment tolerances may be required to obtain a diffraction limited image. Duty cycles of about 65% are possible. In this embodiment, local focusing is also relatively easy with elements that do not move with or in conjunction with the movable imaging lens 242 .

Figure 23 shows a schematic side view layout of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto, and showing the relative to the independently controllable elements, according to an embodiment of the invention. Five different rotational positions of the group of imaging lenses 242 of the control element. In this embodiment, in order to avoid moving the lens at a speed different from that described with respect to FIG. 21, and to have optics that do not image the field as noted with respect to FIG. The combination of lenses is combined with a moving imaging lens 242 . Referring to Figure 23, individually controllable elements 102 are provided that are substantially stationary in the X-Y plane. An optional collimating lens 806 substantially stationary in the X-Y plane is provided for collimating the beams from the individually controllable elements 102 and providing a collimated beam (having a cross-sectional width (eg diameter) of eg 0.5mm) to lens 812.

Additionally, lens 812 is a field lens 814 (having a cross-sectional width (eg, diameter), eg, 1.5 mm) that is substantially stationary in the X-Y plane and that focuses a collimated beam to moving imaging lens 242 . Lens 814 has a relatively large focal length (eg, f=20mm).

The field lens 814 of the movable imaging lens 242 moves relative to the individually controllable elements 102 (eg, rotates about an axis along which the imaging lenses 242 are arranged in an at least partially circular fashion). Field lens 814 directs the beam towards imaging lens 818 of movable imaging lens 242 . Like field lens 814 , imaging lens 818 moves relative to individually controllable elements 102 (eg, rotates about an axis along which imaging lenses 242 are arranged in an at least partially circular fashion). In this embodiment, field lens 814 moves at approximately the same speed as imaging lens 818 . A pair of field lens 814 and imaging lens 818 are aligned with each other. The substrate moves along the X direction.

Between field lens 814 and imaging lens 818 is lens 816 . Lens 816 is substantially stationary in the X-Y plane and collimates the beam from field lens 814 to imaging lens 818 . Lens 816 has a relatively large focal length (eg, f=20mm).

In this embodiment, the optical axis of the field lens 814 should coincide with the optical axis of the corresponding imaging lens 816 . Field lens 814 is designed such that the beam is folded such that the chief ray of the beam collimated by lens 816 coincides with the optical axis of imaging lens 818 . In this way, the beam towards the substrate is telecentric.

Due to the large f-number, lenses 812 and 816 may be simple spherical lenses. The field lens 814 does not affect image quality and could also be a spherical element. In this embodiment, collimating lens 806 and imaging lens 818 are lenses that do not need to image the field. Diffraction-limited imaging is possible with this single-element optic. A duty cycle of about 65% is fine.

In one embodiment, where the movable imaging lens 242 is rotatable, at least two concentric rings of individually controllable elements 102 and lenses are provided to obtain full coverage across the width of the substrate. In an embodiment the individually controllable elements 102 on the rings are arranged at a pitch of 1.5 mm. If a standard laser diode with a diameter of 5.6mm is used, then at least 6 concentric rings may be required for full coverage. Figures 24 and 25 show arrangements of concentric rings of individually controllable elements 102 according to these arrangements. In one embodiment, this would result in about 380 individually controllable elements 102 and corresponding lenses that are substantially stationary in the X-Y plane. The moving imaging lens 242 will have 700 x 6 rings = 4200 sets of lenses 814 , 818 . With this configuration, lines of about 1 mm in length can be written with each individually controllable element 102 . In one embodiment, a set of approximately 1400 imaging lenses 242 may be used. In one embodiment, lenses 812, 814, 816, and 818 may include four aspheric lenses.

In this embodiment, adjusting focus by using elements that do not move in the X-Y plane (eg at the individually controllable elements 102) would likely result in loss of telecentricity and cause vignetting. Therefore, the desired focus adjustment should occur in the moving imaging lens 242 . This may therefore require higher frequency actuators than the moving imaging lens 242 .

Figure 26 shows a schematic side view layout of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto, according to an embodiment of the invention. In this embodiment, an optical derotator is used to couple the individually controllable elements 102 , which are substantially stationary in the X-Y plane, to the moving imaging lens 242 .

In this embodiment the individually controllable elements 102 are arranged in a ring together with an optional collimating lens. Two parabolic mirrors 820 , 822 reduce the ring of collimated beams from the individually controllable elements 102 to an acceptable diameter for the derotator 824 . In FIG. 26 , a pechan prism is used as the derotator 824 . If the derotator rotates at half the speed compared to the speed of imaging lens 242 , each individually controllable element 102 appears to be substantially stationary relative to its respective imaging lens 242 . Two additional parabolic mirrors 826 , 828 expand the annulus of the derotated beam from the derotator 824 to an acceptable diameter for the moving imaging lens 242 . The substrate moves along the X direction.

In this embodiment, each individually controllable element 102 is paired with an imaging lens 242 . Therefore, it is not possible to mount the individually controllable elements 102 on concentric rings, so it is not possible to obtain full coverage across the width of the substrate. Duty cycles of about 33% are possible. In this embodiment, imaging lens 242 is a lens that does not need to image a field.

Figure 27 shows a schematic side view layout of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto, according to an embodiment of the invention. In such an arrangement, the imaging lens 242 is arranged to rotate about a direction extending in the X-Y plane (eg a rotating drum rather than a rotating wheel as eg described with respect to Figs. 19-26). Referring to FIG. 27 , a movable imaging lens 242 is arranged on a drum arranged to rotate about, for example, the Y direction. The movable imaging lens 242 receives radiation from the individually controllable elements 102 extending on a line in the Y direction between the rotational axis of the drum and the movable imaging lens 242 . In principle, a line written by the movable imaging lens 242 of such a drum will be parallel to the scanning direction 831 of the substrate. Accordingly, the derotator 830 mounted at 45° is arranged to rotate the line produced by the movable imaging lens 242 of the drum by 90° such that the imaged line is perpendicular to the scanning direction of the substrate. The substrate moves along the X direction.

For each stripe on the substrate, a circle of movable imaging lenses 242 will be required on the drum. If one such circle can write 3mm wide stripes on a substrate and the substrate is 300mm wide, then maybe 700 (optics on the circumference of the drum) x 100 = 70000 optical components are required on the drum. It may be less if cylindrical optics are used on the drum. Additionally, the imaging optics in this embodiment may need to image a specific field, which may make the optics more complex. Duty cycles of about 95% are possible. An advantage of this embodiment is that the imaged fringes can be of approximately equal length and be approximately parallel and straight. In this embodiment, local focusing is relatively easy with elements that do not move with or in conjunction with the movable imaging lens 242 .

Fig. 28 shows a schematic side view layout of a portion of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto according to an embodiment of the present invention, and shows the relative to the independently controllable elements. Five different rotational positions of the group of imaging lenses 242 of the control element.

Referring to Figure 28, individually controllable elements 102 are provided that are substantially stationary in the X-Y plane. Movable imaging lens 242 includes a plurality of lens groups, each lens group including field lens 814 and imaging lens 818 . The substrate moves along the X direction.

The field lens 814 (e.g., a spherical lens) of the movable imaging lens 242 is moved relative to the individually controllable element 102 in a direction 815 (e.g., rotated about an axis along which the imaging lens 242 is arranged at least partially in a circular manner) . Field lens 814 directs the beam toward imaging lens 818 (eg, an aspheric lens such as a double aspheric lens) of movable imaging lens 242 . Like field lens 814 , imaging lens 818 moves relative to individually controllable elements 102 (eg, rotates about an axis along which imaging lenses 242 are arranged at least partially in a circular fashion). In this embodiment, field lens 814 moves at substantially the same speed as imaging lens 818 .

The focal plane of field lens 814 coincides with the back focal plane of imaging lens 818 at position 815, which provides a telecentric in/telecentric out system. In contrast to the arrangement of FIG. 23 , the imaging lens 818 images a specific field. The focal length of field lens 814 is such that the field size for imaging lens 818 is less than a half angle of 2 to 3°. In this case, diffraction-limited imaging can also be obtained with a single-element optic, such as a double aspheric surface single-element. The field lenses 814 are arranged so that there is no space between each field lens 814 . In this case, the duty cycle of the individually controllable elements 102 may be about 95%.

The focal length of the imaging lenses 818 is such that for an NA of 0.2 at the substrate, these lenses will not be larger than the diameter of the field lens 814 . A focal length of imaging lens 818 equal to the diameter of field lens 814 will provide a diameter of imaging lens 818 that leaves sufficient space for mounting imaging lens 818 .

Due to the field angle, lines slightly larger than the pitch of the field lens 814 can be written. Also depending on the focal length of the imaging lens 818, this provides an overlap between the imaged lines of adjacent individually controllable elements 102 on the substrate. Accordingly, the individually controllable elements 102 can be mounted on the same pitch as the imaging lenses 242 on a ring.

FIG. 29 shows a schematic three-dimensional view of a portion of the lithographic apparatus of FIG. 28 . In this depiction, five individually controllable elements 102 are shown with five associated movable imaging lens groups 242 . It will be appreciated that additional independently controllable elements 102 and associated movable imaging lens groups 242 may be provided. The substrate moves in the X direction shown by arrow 829 . In an embodiment, the field lenses 814 are arranged with no space between them. The pupil plane is located at mark 817 .

In order to avoid the relatively small double aspheric imaging lens 818, reduce the amount of optics for the moving imaging lens 242, and use standard laser diodes as individually controllable elements 102, it is possible in this embodiment to use the moving imaging lens 242 A single lens group of , images multiple independently controllable elements 102 . As long as the individually controllable elements 102 are imaged telecentrically onto the field lens 814 of each movable imaging lens 242, the corresponding imaging lens 818 will re-image the beams from the individually controllable elements 102 telecentrically onto the substrate. If for example 8 lines are written simultaneously, the diameter of the field lens 814 and the focal length of the imaging lens 818 can be increased by a factor of 8 with the same throughput, while the number of movable imaging lenses 242 can be reduced by a factor of 8. Additionally, substantially stationary optics in the X-Y plane can be reduced because a portion of the optics needed to image the individually controllable elements 102 onto the field lens 814 can be common. Such an arrangement in which 8 lines are simultaneously inscribed by a single movable group of imaging lenses 242 is shown schematically in FIG. 823. Pitches from 1.5 mm to 12 mm (while writing 8 lines simultaneously by a single movable set of imaging lenses 242 ) leave enough space to mount standard laser diodes as individually controllable elements 102 . In one embodiment, 224 individually controllable elements 102 (eg, standard laser diodes) may be used. In one embodiment, a set of 120 imaging lenses 242 may be used. In one embodiment, 28 substantially stationary optics groups and 224 individually controllable elements 102 may be used.

In this embodiment, it is also relatively easy to locally focus with elements that do not move with or cooperate with the movable imaging lens 242 . As long as the telecentric image of the individually controllable elements 102 on the field lens 814 is moved along the optical axis and remains telecentric, only the focus of the image on the substrate will change and the image will remain telecentric. Figure 31 shows a schematic arrangement for controlling focus with a moving roof-like member in the arrangements of Figures 28 and 29 . Two folded mirrors 832 and a roof-like component (eg prism or mirror set) 834 are placed in the telecentric beam from the individually controllable elements 102 in front of the field lens 814 . By moving the roof-like member 834 in direction 833 away from or towards the folded mirror 832, the image is displaced along the optical axis and thus also relative to the substrate. Because of the large magnification along the optical axis due to the axial focus variation equal to the quadratic ratio of F/number, a defocus of 25 μm at the substrate with a beam at F/2.5 will provide a beam at f/37.5 A focus displacement of 5.625 mm (37.5/2.5) at the field lens 814 of . This means that the roof-like part 834 has to move half of it.

Figure 32 shows a schematic cross-sectional side view of a lithographic apparatus having independently controllable elements substantially stationary in the X-Y plane and optical elements movable relative thereto according to embodiments of the present invention. Although Fig. 32 shows an arrangement similar to that of Fig. 23, it may be modified to suit any of the embodiments of Figs. 19-22 and/or Figs. 24-31.

Referring to FIG. 32, the lithographic apparatus 100 includes a substrate table 106 that holds a substrate, and a positioning device 116 that moves the substrate table 106 in up to 6 degrees of freedom.

The lithographic apparatus 100 also includes a plurality of individually controllable elements 102 arranged on a frame 160 . In this embodiment, each individually controllable element 102 is a radiation emitting diode, for example a laser diode, such as a blue-violet laser diode. The individually controllable elements 102 are arranged on the frame 838 and extend along the Y direction. Although one frame 838 is shown, a lithographic apparatus may have multiple frames 838 similarly shown, for example, in array 200 in FIG. 5 . Further disposed on frame 838 are lenses 812 and 816 . Frame 838 and thus individually controllable elements 102 and lenses 812 and 816 are substantially stationary in the X-Y plane. Frame 838 , individually controllable elements 102 and lenses 812 and 816 can be moved in the Z direction by actuator 836 .

In this embodiment, a rotatable frame 840 is provided. Field lens 814 and imaging lens 818 are arranged on frame 840 , wherein the combination of field lens 814 and imaging lens 818 forms movable imaging lens 242 . In use, the plate rotates about its own axis 206 , for example in the direction shown by the arrow in FIG. 5 relative to the array 200 . Frame 840 is rotated about axis 206 using motor 216 . Additionally, the frame 840 can be moved in the Z direction by the motor 216 such that the movable imaging lens 242 can be displaced relative to the substrate table 106 .

In this embodiment, the aperture structure 248 having the aperture therein may be located above the lens 812 , between the lens 812 and the associated individually controllable element 102 . The aperture structure 248 may limit diffractive effects of the lens 812 , associated individually controllable elements 102 , and/or diffractive effects of adjacent lenses 812 /individually controllable elements 102 .

In an embodiment, the lithographic apparatus 100 includes one or more movable plates 890 (eg, rotatable plates, eg, rotatable disks) that include optical elements, such as lenses. In the embodiment of FIG. 32, a plate 890 with a field lens 814 and a plate 890 with an imaging lens 818 are shown. In an embodiment, the lithographic apparatus does not have any reflective optical elements that rotate when in use. In an embodiment, the lithographic apparatus is devoid of any reflective optical elements that receive radiation from any or all of the individually controllable elements 102, which rotate in use. In an embodiment, one or more (eg, all) of the plates 890 are generally planar, eg, there are no optical elements (or portions of optical elements) that protrude above or below one or more surfaces of the plate. This can be achieved, for example, by ensuring that the plate 890 is sufficiently thick (ie at least thicker than the height of the optical elements and positioning the optical elements so that they do not protrude) or by providing a flat cover plate over the plate 890 (not shown). Ensuring that one or more surfaces of the board are substantially flat can help reduce noise, for example, when the device is in use.

Figure 33 schematically shows a schematic cross-sectional side view of a portion of a lithographic apparatus having individually controllable elements substantially stationary in the X-Y plane. The lithographic apparatus 900 includes a substrate support 902 for holding a substrate and a positioning device 904 for moving the substrate support 902 in up to 6 degrees of freedom. The substrate may be a resist-coated substrate (such as a silicon wafer or glass plate).

The lithographic apparatus 900 also includes a plurality of independently controllable radiation sources 906 configured to emit a plurality of beams. As shown in Figure 33, the radiation source 906 is a self-emissive contrast device. In an embodiment, the self-emissive contrast device 906 is a radiation emitting diode, such as a light emitting diode (LED), an organic LED (OLED), a polymer LED (PLED), or a laser diode (eg, a solid state laser diode). In an embodiment, each individually controllable element 906 is a blue-violet laser diode (eg, Sanyo model no. DL-3146-151). Such diodes are available from companies such as Sanyo, Nichia, Osram and Nitride. In an embodiment, the diode emits radiation having a wavelength of about 365 nm or about 405 nm. In an embodiment, the diode may provide an output power selected from the range of 0.5-200mW. In an embodiment, the size of the laser diode (bare die) is selected from the range of 100-800 microns. In an embodiment, the laser diode has an emitting area selected from the range of 1-5 square microns. In an embodiment, the laser diode has a divergence angle selected from the range of 7-44 degrees. In an embodiment, the diode has a configuration (eg, emission area, divergence angle, output power, etc.) to provide a total brightness of greater than or equal to about 6.4×10 ⁸ W/(m ² .sr).

The individually controllable devices 906 are arranged on a frame 908 and may extend along the Y-direction and/or the X-direction. Although one frame 908 is shown, a lithographic apparatus may have multiple frames 908 . A lens 920 is also arranged on the frame 908 . The frame 908 and thus the independently controllable self-emissive contrast device 906 and lens 920 are substantially stationary in the X-Y plane. Frame 908 , independently controllable contrast device 906 and lens 920 may be moved in the Z direction by actuator 910 .

Self-emissive contrast device 906 may be configured to emit a beam, and projection systems 920, 924, and 930 may be configured to project the beam onto a target portion of the substrate. The self-emissive contrast device 906 and the projection system form an optical train. The lithographic apparatus 900 may include an actuator (eg, a motor 918 ) configured to move the column of optics, or a portion thereof, relative to the substrate. The frame 912 on which the field lens 924 and the imaging lens 930 are disposed may rotate with the actuator. The combination of field lens 924 and imaging lens 930 forms movable optics 914 . In use, the frame 912 rotates about its own axis 916, for example in the direction shown by the arrow in FIG. 34 . Frame 912 is rotated about axis 916 by use of an actuator such as motor 918 . Additionally, the frame 912 can be moved in the Z direction by the motor 910 such that the movable optics 914 can be displaced relative to the substrate support structure 902 . In Figure 33, two columns of optics are shown on opposite sides of the lithographic apparatus. In practice, the lithographic apparatus may comprise, for example, more than two columns of optics distributed over the periphery of the lithographic apparatus. Each optical column includes one or more self-emissive contrast devices 906 and a fixed portion of the projection system 920 . The rotatable portion of the optics column, including the lenses 924, 930, can be used with respect to multiple optics columns, for example when rotating the frame 912.

Aperture structure 922 has a hole therein and may be positioned above lens 920 and between lens 920 and self-emissive contrast device 906 . Aperture structure 922 may limit diffraction effects of lens 920 , associated individually controllable self-emissive contrast device 906 and/or diffraction effects of adjacent lens 920 /independent controllable self-emissive contrast device 906 .

The apparatus shown can be used by rotating the frame 912 while simultaneously moving the substrate on the substrate support structure 902 beneath the columns of optics. Self-emissive contrast device 906 may emit a beam through lenses 920, 924, and 930 when the lenses are approximately aligned with each other. By moving the lenses 924 and 930, the image of the beam on the substrate is scanned over a portion of the substrate. By simultaneously moving the substrate on the substrate support structure 902 underneath the column of optics, the part of the substrate that is subjected to the image of the self-emissive contrast device 906 is also moved. By switching the self-emissive contrast device 906 on and/or off at high speed under the control of a controller for controlling the rotation of the optical column or a portion thereof and controlling the speed of the substrate, the resist on the substrate can be The desired pattern is imaged in the agent layer.

FIG. 34 shows a schematic top view of the lithographic apparatus of FIG. 33 with a self-emissive contrast device 906 . Like the lithographic apparatus 900 shown in FIG. 33 , the lithographic apparatus 900 includes a substrate support structure 902 for holding a substrate 928, a positioning device 904 for moving the substrate support structure 902 in up to 6 degrees of freedom, A position/leveling sensor 932 for determining the position of the optical column relative to the substrate 928 and for determining whether the substrate 928 is horizontal relative to the projection of the self-emissive contrast device 906 . As shown, the substrate 928 has a rectangular shape, however, circular substrates may also be processed.

The self-emissive contrast device 906 is arranged on a frame 926 . The self-emissive contrast device 906 may be a radiation-emitting diode, such as a laser diode, such as a blue-violet laser diode. As shown in Figure 34, the contrast devices 906 may be arranged in an array extending in the X-Y plane, one or more contrast devices 906 being associated with each optical device column. The contrast device 906 is divided on more than 4 reticles as shown in FIG. 34 . Each lithography wheel includes a plurality of columns of optics mounted on a fixed frame 908 and a rotatable frame 912 . Within the lithography wheel, the optics columns may share a portion of the optics column, such as lenses 924, 930, mounted on the rotatable frame 912, i.e. the lenses 924, 930 may then be inserted into the lithography wheel when the frame is rotated. Columns of different optics are used.

The array may be an elongated wire. In an embodiment, the array may be a one-dimensional array of one or more independently controllable contrast devices 906 . In an embodiment, the array may be a two-dimensional array of one or more individually addressable contrast devices 906 .

A rotatable frame 912 may be provided, which may be rotated in the direction shown by the arrow. The rotatable frame may be provided with lenses 924, 930 (in FIG. 33) to provide an image of each movable individual contrast device 906.

The apparatus may be provided with an actuator configured to rotate the rotatable frame 912 so that the rotatable part of the optics column comprises the lenses 924,930.

During the patterning process, the substrate 928 is preferably moved along the scan direction at a constant scan speed vscan. The substrate 928 is divided along a direction generally perpendicular to the scan direction into a number of strips 936, each strip 936 being associated with its own optical column, each optical column comprising a plurality of self-emissive contrast devices 906 and projection A fixed part of the system 920. The rotatable portion of the optics column (including the lenses 924 , 930 ) can be used relative to the other strip 936 covered by the rotatable frame 912 . Each swath 936 is divided along the scan direction into a plurality of adjacent and partially overlapping target portions 938 . During the scanning movement of the substrate, target portions in a single swath are exposed by the beam which is then exposed by the contrast device 906 in the associated optical device column. A target portion 938 has an overlap with an adjacent target portion 938 in an adjacent strip 936 and an overlap with an adjacent target portion 938 in the same strip 936 . This overlap is required for obtaining a reliable pattern over the entire substrate surface.

In an embodiment, for all stripes 936 in a direction substantially perpendicular to the scan direction, columns of optics are arranged such that a pattern can be generated on the substrate with one scan.

When projecting a pattern onto a substrate, it is desirable that the patterned beam projected onto the substrate is properly aligned and in focus with the surface of the substrate on which the pattern will be generated.

In this application, the terms "for alignment" and "alignment" mean that the optical train is arranged or controlled such that the patterns generated in the target portion 938 of the optical train are connected to each other and the completed pattern does not include Any error caused by incorrect positioning of the optical column relative to the substrate.

To control the alignment of the columns of optics relative to the substrate, an alignment control system 956 is provided, a possible embodiment of which is shown in diagram 940 . The alignment control system 956 includes: a position measurement device 944 for each optical column to determine the position of the optical column relative to a reference; and an alignment adjustment device 954 to determine the position of the optical column based on the measured positions The location of one or more bundles.

The alignment control system 956 is arranged to determine the position of the columns of optics relative to each other before commencing the actual lithography process. The position of the optics column is determined relative to a reference object 940 . The reference object 940 may be the substrate 928 with a plurality of reference marks, but is preferably a separate object that is mounted on the substrate support 902 . Reference object 940 has a number of markers. The reference object 940 is manufactured with high precision and extends over the entire width of the substrate.

The marks on the reference object 940 are arranged such that the marks are arranged in each overlapping portion of the target portion 938 of two adjacent optics columns of the two or more optics columns. As a result, this marker can be used for position measurement of each of two adjacent columns of optics. For example, the position measuring device 944 of each optical column may include an image sensor 952 (see example FIG. The position in the direction in the plane. Based on this information, the relative position of the target portion 938 can be determined and, if desired, the resulting corrective action can be performed.

The alignment adjustment device 94 is configured to perform such corrective actions. Such a corrective action may be, for example, an adjustment of the projected pattern in the target portion 938 .

For example, the activation time and/or intensity of the contrast device 906 may be modified based on the relative positions of two adjacent optical device columns. In this way, the patterns to be projected in two adjacent target portions are adjusted.

Additionally, it is possible that multiple lines in one or both of the target portions 938 are skipped to avoid projecting both patterns onto the substrate 928 when there is too much overlap between the two target portions.

In another feasible solution, scaling of the data pattern in the X direction or the Y direction may be performed to compensate for the positional offset.

In an embodiment of the alignment adjustment device 954 , adjustments to the alignment are performed during the lithography process itself, rather than by any direct mechanical adjustments, such as adjustments to the position of the target portion 938 . Alternatively or additionally, corrective actions may involve mechanical adjustments within the lithographic apparatus, such as changing the relative position of the columns of optics. The alignment adjustment device 954 may be a separate processing unit or processor, but in an embodiment is part of a main processing unit or processor responsible for activating the contrast device 906 to generate the pattern on the substrate 928 .

In an alternative embodiment, a movable part of the lithographic apparatus, such as the movable lens element 920 (see FIG. 33 ), may be used to correct the alignment of the optics column. For example, movable lens element 920 may be actuated by actuator 942 (see FIG. 33 ) based on the measured position of target portion 938 to correct the relative position of target portion 938 . In this embodiment, the alignment adjustment device includes a movable lens element 920 and an actuator 942, wherein the actuator 942 or the lithographic apparatus typically also includes a processing unit or a processing unit that controls the alignment adjustment movement of the movable lens element 920. processor. The movable lens element 920 can also be used for other adjustments of the optics train.

A possible embodiment of the position measuring device will now be described in more detail.

FIG. 35 shows an embodiment of an alignment control device or controller comprising a position measurement device 944 and an alignment adjustment device 954 for determining the position of the beam of each optical column relative to a reference object 940 . The position measuring device 944 is integrated in the optical train.

In order to determine the position of the beams of the respective optics column, a reference object 940 is arranged below the respective optics column. The beam is projected by the contrast device 906 onto a reference object 940 . The projected beam passes through a lens 920 , a beam splitter or beam splitter 946 , a quarter wave plate 948 and lenses 924 , 930 on the rotatable frame 8 . The beam is reflected by the reference object 940 and the reflected beam includes an image of a marker provided on the reference object 940 . The reflected beam passes again through lenses 924 , 930 and 1/4 wave plate 948 . The reflected beam is now reflected by the beam splitter 946 due to the phase shift caused by the 1/4 wave plate 948 . The reflected beam travels via lens 950 to an image sensor 952, such as a CCD camera.

In each optical column, such a position measuring device 944 is arranged. As mentioned above, the reference object 940 includes at least one marker in each overlapping area of the two target portions. By analyzing images comprising the same marker on image sensors 952 of two adjacent optics columns, the relative positions of the optics columns can be determined.

Analysis of the image projected onto image sensor 952 may be performed by a processing unit or processor that is part of image sensor 952 or a separate processing unit. The processing unit may be a central processing unit or part of a central processing unit of the lithographic apparatus. In an embodiment, the analysis may be performed in the alignment adjuster 954 .

By repeating the alignment control for all optical columns, it is possible to determine the relative positions of all target portions of the optical columns, and thus the positions of the reticle wheels relative to each other. Based on this information, the pattern projected into all target portions can be adjusted by aligning the adjustment device 954 so that a pattern for the entire substrate 928 can be projected onto the substrate 928, whereby due to two adjacent Errors due to misalignment in overlapping regions of the target portions are avoided.

Alignment position measurements of the optics column are typically performed before starting the actual lithography process. Such a calibration process may be performed during the set-up of the lithographic apparatus and during periodic calibration of the lithographic apparatus, but may also be performed before each lithographic projection process.

Referring now to FIG. 34, at the beginning of the lithography process, the substrate 928 is moved towards the lithography wheel at a scanning speed vscan. Before the substrate reaches the lithography wheel, the sensor 932 can measure the position of the substrate relative to the optical column. If desired, the position of the substrate (eg, in the Y direction) can be changed to properly position the substrate relative to the lithography wheel. Additionally, the alignment adjustment device 954 can adjust the entire pattern. However, due to the arrangement of the alignment control system 956, errors in the pattern itself due to misalignment between columns of optics are well avoided.

Embodiments are also provided in the following numbered aspects:

1. A lithographic apparatus, comprising:

a substrate holder configured to hold a substrate;

a modulator configured to expose an exposed region of the substrate with a plurality of beams modulated according to a desired pattern; and

a projection system configured to project the modulated beam onto the substrate and comprising a lens array receiving the plurality of beams, the projection system configured to move relative to the modulator during exposure of the exposure region the lens array.

2. The lithographic apparatus of embodiment 1, wherein each lens comprises at least two lenses arranged along the beam path of at least one of the plurality of beams from the modulator to the substrate .

3. The lithographic apparatus of embodiment 2, wherein a first lens of the at least two lenses comprises a field lens and a second lens of the at least two lenses comprises an imaging lens.

4. The lithographic apparatus of embodiment 3, wherein the focal plane of the field lens coincides with the back focal plane of the imaging lens.

5. The lithographic apparatus of embodiment 3 or 4, wherein the imaging lens comprises a double aspherical lens.

6. The lithographic apparatus according to any one of embodiments 3-5, wherein the focal length of the field lens is such that the field size of the imaging lens is smaller than 2 to 3° half angle.

7. The lithographic apparatus of any one of embodiments 3-6, wherein the imaging lens has a focal length such that for an NA of 0.2 at the substrate, the imaging lens is no larger than the field lens diameter.

8. The lithographic apparatus of embodiment 7, wherein the focal length of the imaging lens is equal to the diameter of the field lens.

9. The lithographic apparatus according to any one of embodiments 3-8, wherein a plurality of said beams are imaged with a single combination of said field lens and said imaging lens.

10. The lithographic apparatus according to any one of embodiments 3-9, further comprising focus control means along at least one of said plurality of beams from said modulator to said field lens The beam path arrangement for the beam.

11. The lithographic apparatus of embodiment 10, wherein the focus control means comprises a folding mirror and a movable roof-like member.

12. The lithographic apparatus of embodiment 3, further comprising a lens in the path to collimate the beam from the first lens to the second lens.

13. The lithographic apparatus of embodiment 12, wherein a lens in the path for collimating the beam is substantially stationary relative to the modulator.

14. The lithographic apparatus according to any one of embodiments 3, 12 and 13, further comprising a lens in the path between the modulator and the first lens to focus the at least one of the plurality of bundles.

15. The lithographic apparatus of embodiment 14, wherein a lens in the path for focusing the beam is substantially stationary relative to the modulator.

16. The lithographic apparatus according to any one of embodiments 3 and 12-15, wherein the optical axis of the field lens coincides with the optical axis of the imaging lens.

17. The lithographic apparatus of embodiment 2, wherein a first lens of the at least two lenses comprises at least two sub-lenses, wherein at least one of the plurality of beams is transmitted between the two sub-lenses focus.

18. The lithographic apparatus of embodiment 17, wherein each of the at least two sub-lenses has a substantially equal focal length.

19. The lithographic apparatus according to any one of embodiments 2, 17 and 18, wherein the first lens is arranged to output a collimated beam towards a second lens of the at least two lenses.

20. The lithographic apparatus according to any one of embodiments 2 and 17-19, configured to move a first lens of said at least two lenses at a different speed than a second lens of said at least two lenses .

21. The lithographic apparatus of embodiment 20, wherein the speed of the second lens is twice the speed of the first lens.

22. The lithographic apparatus of embodiment 1, wherein each lens comprises a 4f telecentric-in/telecentric-out imaging system.

23. The lithographic apparatus of embodiment 22, wherein the 4f telecentric-in/telecentric-out imaging system comprises at least 6 lenses.

24. The lithographic apparatus of embodiment 1, further comprising a derotator between the modulator and the lens array.

25. The lithographic apparatus of embodiment 24, wherein the derotator comprises a Pechan prism.

26. The lithographic apparatus according to embodiment 24 or 25, wherein the derotator is arranged to move at half the speed of the lens array.

27. The lithographic apparatus according to any one of embodiments 24-26, further comprising a parabolic mirror to reduce the size of the beam between the modulator and the derotator.

28. The lithographic apparatus according to any one of embodiments 24-27, further comprising a parabolic mirror to increase the size of the beam between the derotator and the lens array.

29. The lithographic apparatus according to any one of embodiments 1-28, wherein the lens array rotates relative to the modulator.

30. The lithographic apparatus according to any one of embodiments 1-29, wherein the modulator comprises a plurality of independently controllable radiation sources for emitting electromagnetic radiation.

31. The lithographic apparatus according to any one of embodiments 1-29, wherein the modulator comprises a micromirror array.

32. The lithographic apparatus according to any one of embodiments 1-29, wherein the modulator comprises a radiation source and an acousto-optic modulator.

33. A device manufacturing method, comprising the steps of:

providing a plurality of beams modulated according to a desired pattern; and

projecting the plurality of beams onto a substrate using a lens array that receives the plurality of beams; and

During the projection, the lens array is moved relative to the beam.

34. The method of embodiment 33, wherein each lens comprises at least two lenses arranged along the beam path of at least one of the plurality of beams from the source of the at least one beam to the substrate. lens.

35. The method of embodiment 34, wherein a first lens of the at least two lenses comprises a field lens and a second lens of the at least two lenses comprises an imaging lens.

36. The method of embodiment 35, wherein a focal plane of the field lens coincides with a back focal plane of the imaging lens.

37. The method of embodiment 35 or 36, wherein the imaging lens comprises a double aspherical lens.

38. The method of any one of embodiments 35-37, wherein the focal length of the field lens is such that the field size of the imaging lens is less than 2 to 3° half angle.

39. The method of any one of embodiments 35-38, wherein the imaging lens has a focal length such that for an NA at the substrate of 0.2, the imaging lens is no larger than a diameter of the field lens.

40. The method of embodiment 39, wherein a focal length of the imaging lens is equal to a diameter of the field lens.

41. The method of any one of embodiments 35-40, wherein a plurality of said beams are imaged with a single combination of said field lens and said imaging lens.

42. The method of any one of embodiments 35-41, further comprising using a focus control device between a source of at least one of the plurality of beams and the field lens.

43. The method of embodiment 42, wherein the focus control device comprises a folding mirror and a movable roof-like member.

44. The method of embodiment 35, further comprising collimating at least one beam between the first lens and the second lens using a lens.

45. The method of embodiment 44, wherein a lens for collimating the at least one beam is substantially stationary relative to the at least one beam.

46. The method of any one of embodiments 35, 44 and 45, further comprising focusing towards the first lens using a lens in the path between the source of the at least one beam and the first lens At least one of the plurality of bundles.

47. The method of embodiment 46, wherein a lens for focusing the at least one beam is substantially stationary relative to the at least one beam.

48. The method of any one of embodiments 35 and 44-47, wherein an optical axis of the field lens coincides with an optical axis of the corresponding imaging lens.

49. The method of embodiment 34, wherein a first lens of the at least two lenses comprises at least two sub-lenses, wherein at least one beam of the plurality of beams is focused intermediate the two sub-lenses.

50. The method of embodiment 49, wherein each of the at least two sub-lenses has an approximately equal focal length.

51. The method of any one of embodiments 34, 49 and 50, wherein the first lens is arranged to output a collimated beam towards a second lens of the at least two lenses.

52. The method of any one of embodiments 34 and 49-51, comprising moving a first lens of the at least two lenses at a different speed than a second lens of the at least two lenses.

53. The method of embodiment 52, wherein the speed of the second lens is twice the speed of the first lens.

54. The method of embodiment 33, wherein each lens comprises a 4f telecentric-in/telecentric-out imaging system.

55. The method of embodiment 54, wherein the 4f telecentric-in/telecentric-out imaging system comprises at least 6 lenses.

56. The method of embodiment 33, further comprising derotating the beam using a derotator between a source of the beam and the lens array.

57. The method of embodiment 56, wherein the derotator comprises a Pechan prism.

58. The method of embodiment 56 or 57, comprising moving the derotator at half the speed of the lens array.

59. The method of any one of embodiments 56-58, further comprising reducing the size of the beam between the source of the beam and the derotator using a parabolic mirror.

60. The method of any one of embodiments 56-59, further comprising using a parabolic mirror to increase the size of the beam between the derotator and the lens array.

61. The method of any one of embodiments 33-60, comprising rotating the lens array relative to the beam.

62. The method according to any one of embodiments 33-61, wherein each of the plurality of independently controllable radiation sources emits each of the plurality of beams.

63. The method according to any one of embodiments 33-61, wherein the array of micromirrors emits a plurality of beams.

64. The method according to any one of embodiments 33-61, wherein a radiation source and an acousto-optic modulator generate the plurality of beams.

65. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources emitting electromagnetic radiation configured to expose an exposure region of the substrate by a plurality of beams modulated according to a desired pattern; and

a projection system configured to project the modulated beam onto the substrate and comprising an array of lenses receiving the plurality of beams, the projection system configured to be relatively independently controllable during exposure of the exposure region A radiation source moves the lens array.

66. A device manufacturing method, comprising the steps of:

using multiple independently controllable radiation sources to provide multiple beams modulated according to a desired pattern; and

projecting the plurality of beams onto a substrate using a lens array that receives the plurality of beams; and

The lens array is moved relative to the independently controllable radiation sources during the projection.

67. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator configured to expose an exposed region of the substrate with a plurality of beams modulated according to a desired pattern; and

a projection system configured to project the modulated beam onto a substrate and comprising a plurality of lens arrays for receiving the plurality of beams, each of the arrays independently following a beam path of the plurality of beams layout.

68. The lithographic apparatus according to embodiment 67, wherein the projection system is configured to move the lens array relative to the modulator during exposure of the exposure region.

69. The lithographic apparatus according to embodiment 67 or 68, wherein the lenses in each array are arranged in a single body.

70. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources emitting electromagnetic radiation, configured to expose an exposure region of the substrate with a plurality of beams modulated according to a desired pattern, and configured to, during exposure of the exposure region moving the plurality of radiation sources relative to the exposure area such that less than all of the plurality of radiation sources can expose the exposure area at any one time; and

a projection system configured to project the modulated beam onto the substrate.

71. A lithographic apparatus comprising:

a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern, at least one of the plurality of radiation sources being between a position where it emits radiation and a position where it does not emit radiation Movable;

a substrate holder configured to hold a substrate; and

a projection system configured to project the modulated beam onto the substrate.

72. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources for emitting electromagnetic radiation, configured to expose an exposure region of the substrate with a plurality of beams modulated according to a desired pattern, and configured to moving at least one of the plurality of radiation sources relative to the exposure area during exposure such that radiation from the at least one radiation source is at the same time as radiation from at least one other of the plurality of radiation sources Radiation adjoining or overlapping of sources; and

a projection system configured to project the modulated beam onto the substrate.

73. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate, at least one radiation source of the plurality of radiation sources being capable of emitting radiation to the is movable between the position of the exposed area and a position where it does not emit radiation to said exposed area, and

a projection system configured to project the modulated beam onto the substrate.

74. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate, and configured during exposure of the exposure region relative to the exposure zone shifting the plurality of radiation sources, the modulator having an output of a plurality of beams to the exposure zone, the output having an area smaller than the area of the output of the plurality of radiation sources; and

a projection system configured to project the modulated beam onto the substrate.

75. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

A modulator comprising an array of a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to a respective exposure area of the substrate, and configured to move each beam relative to its respective exposure area. an array, or moving said plurality of beams from each array, or moving said array and said plurality of beams relative to said respective exposure area, wherein in use a plurality of arrays The respective exposure regions of the arrays in the arrays adjoin or overlap the respective exposure regions of another array of the plurality of arrays; and

a projection system configured to project the modulated beam onto the substrate.

76. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region each of the plurality of radiation sources, or moving the plurality of beams relative to the exposure area, or moving each of the plurality of radiation sources and the plurality of beams relative to the exposure area, wherein during use the each of the aforementioned radiation sources operates in the steep portion of its respective power/forward current curve; and

a projection system configured to project the modulated beam onto the substrate.

77. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region each of, or moving the plurality of beams relative to the exposure area, or moving each of the plurality of radiation sources and the plurality of beams relative to the exposure area, wherein the independently controllable each of the radiation sources includes a blue-violet laser diode; and

a projection system configured to project the modulated beam onto the substrate.

78. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region each of, the plurality of radiation sources arranged in at least two concentric circular arrays; and

a projection system configured to project the modulated beam onto the substrate.

79. The lithographic apparatus according to embodiment 78, wherein at least one of said circular arrays is arranged in a staggered manner to at least one other of said circular arrays.

80. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region Each of the plurality of radiation sources is disposed about a center of a structure, and the structure has an opening within the plurality of radiation sources extending through the structure; and

a projection system configured to project the modulated beam onto the substrate.

81. The lithographic apparatus according to embodiment 80, further comprising a support holding a support structure at or outside the radiation source.

82. The lithographic apparatus of embodiment 81, wherein the support comprises a bearing that allows movement of the structure.

83. The lithographic apparatus according to embodiment 81 or 82, wherein the support comprises a motor to move the structure.

84. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region each of, the plurality of radiation sources arranged around the center of the structure;

a support for supporting the structure at or external to the radiation source, the structure configured to rotate or allow rotation of the structure; and

a projection system configured to project the modulated beam onto the substrate.

85. The lithographic apparatus according to embodiment 84, wherein the support comprises a bearing allowing rotation of the structure.

86. The lithographic apparatus according to embodiment 84 or 85, wherein the support comprises a motor that rotates the structure.

87. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region Each of the plurality of radiation sources is disposed on a movable structure that is in turn disposed on a movable plate; and

a projection system configured to project the modulated beam onto the substrate.

88. The lithographic apparatus according to embodiment 87, wherein the movable structure is rotatable.

89. The lithographic apparatus according to embodiment 87 or 88, wherein the movable plate is rotatable.

90. The lithographic apparatus according to embodiment 89, wherein the center of rotation of the movable plate does not coincide with the center of rotation of the movable structure.

91. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region Each of the plurality of radiation sources is disposed in or on a movable structure;

a fluid channel disposed in the movable structure to provide a temperature control fluid to a location at least adjacent to the plurality of radiation sources; and

a projection system configured to project the modulated beam onto the substrate.

92. The lithographic apparatus of embodiment 91, further comprising a sensor located in or on the movable structure.

93. The lithographic apparatus according to embodiment 91 or 92, further comprising a sensor located adjacent to at least one radiation source of the plurality of radiation sources but not in the movable structure or the movable structure. mobile structure.

94. The lithographic apparatus according to embodiment 92 or 93, wherein the sensor comprises a temperature sensor.

95. The lithographic apparatus according to any one of embodiments 92-94, wherein the sensor comprises a sensor configured to measure expansion and/or contraction of the structure.

96. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region Each of the plurality of radiation sources is disposed in or on a movable structure;

cooling fins disposed in or on the movable structure to provide temperature control of the structure; and

a projection system configured to project the modulated beam onto the substrate.

97. The lithographic apparatus of embodiment 96, further comprising a stationary heat sink to cooperate with a heat sink in or on the movable structure.

98. The lithographic apparatus of embodiment 97, comprising at least two heat sinks in or on the movable structure, the stationary heat sink in or movable Between at least one of the cooling fins on the structure and at least one other of the cooling fins in or on the movable structure.

99. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region Each of the plurality of radiation sources is disposed in or on a movable structure;

a fluid supply configured to supply fluid to an exterior surface of the structure to control the temperature of the structure; and

a projection system configured to project the modulated beam onto the substrate.

100. The lithographic apparatus according to embodiment 99, wherein the fluid supply is configured to supply a gas.

101. The lithographic apparatus according to embodiment 99, wherein the fluid supply is configured to supply a liquid.

102. The lithographic apparatus according to embodiment 101, further comprising a fluid confinement structure configured to maintain the liquid in contact with the structure.

103. The lithographic apparatus according to embodiment 102, wherein the fluid confinement structure is configured to maintain a seal between the structure and the fluid confinement structure.

104. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region each of

A structurally independent lens attached adjacent to or connected to each of the plurality of radiation sources and movable with the respective radiation source.

105. The lithographic apparatus according to embodiment 104, further comprising actuators configured to displace the lenses relative to their respective radiation sources.

106. The lithographic apparatus according to embodiment 104 or 105, further comprising an actuator configured to cause the lens and its respective radiation source to move relative to the structure supporting the lens and its respective radiation source. source shift.

107. The lithographic apparatus according to embodiment 105 or 106, wherein the actuator is configured to move the lens in up to 3 degrees of freedom.

108. The lithographic apparatus according to any one of embodiments 104-107, further comprising an aperture structure downstream of at least one radiation source of the plurality of radiation sources.

109. The lithographic apparatus according to any one of embodiments 104-107, wherein the lens is attached to a structure supporting the lens and its respective radiation source with a material of high thermal conductivity.

110. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region each of

a spatial coherence breaking device configured to disrupt radiation from at least one radiation source of the plurality of radiation sources; and

a projection system configured to project the modulated beam onto the substrate.

111. The lithographic apparatus according to embodiment 110, wherein said spatial coherence breaking means comprises a stationary plate, said at least one radiation source being movable relative to said plate.

112. The lithographic apparatus according to embodiment 110, wherein said spatial coherence breaking means comprises at least one selected from the group consisting of: a phase modulator, a rotating plate or a vibrating plate.

113. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region each of

a sensor configured to measure focus associated with at least one radiation source of the plurality of radiation sources, at least a portion of the sensor being in or on the at least one radiation source; and

a projection system configured to project the modulated beam onto the substrate.

114. The lithographic apparatus according to embodiment 113, wherein the sensor is configured to measure focus associated with each of the radiation sources individually.

115. The lithographic apparatus according to embodiment 113 or 114, wherein the sensor is a knife edge focus detector.

116. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region each of

a transmitter configured to wirelessly transmit signals and/or power to the plurality of radiation sources to control and/or power the plurality of radiation sources, respectively; and

a projection system configured to project the modulated beam onto the substrate.

117. The lithographic apparatus according to embodiment 116, wherein the signal comprises a plurality of signals, and further comprising a demultiplexer to route each signal of the plurality of signals towards a respective radiation source.

118. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region Each of the plurality of radiation sources is disposed in or on a movable structure;

a single wire for connecting a controller to said movable structure for sending a plurality of signals and/or power to said plurality of radiation sources for controlling and/or powering said plurality of radiation sources respectively ;and

a projection system configured to project the modulated beam onto the substrate.

119. The lithographic apparatus according to embodiment 118, wherein the signal comprises a plurality of signals, and further comprising a demultiplexer to route each signal of the plurality of signals towards a respective radiation source.

120. The lithographic apparatus according to embodiment 118 or 119, wherein the wires comprise optical wires.

121. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region each of

a sensor measuring a characteristic of radiation emitted or to be emitted towards the substrate by at least one radiation source of the plurality of radiation sources; and

a projection system configured to project the modulated beam onto the substrate.

122. The lithographic apparatus according to embodiment 121, wherein at least a portion of the sensor is located in or on the substrate holder.

123. The lithographic apparatus according to embodiment 122, wherein the at least a portion of the sensor is located in or on the substrate holder and the substrate is supported on the substrate at a location outside of the area on the bottom holder.

124. The lithographic apparatus according to any one of embodiments 121-123, wherein at least part of the sensor is located on a side of the substrate which, in use, extends substantially along the scan direction of the substrate .

125. The lithographic apparatus according to any one of embodiments 121-124, wherein at least a portion of the sensor is mounted in or on a frame supporting the movable structure.

126. The lithographic apparatus according to any one of embodiments 121-125, wherein the sensor is configured to measure radiation from the at least one radiation source outside the exposure region.

127. The lithographic apparatus according to any one of embodiments 121-126, wherein at least a part of the sensor is movable.

128. The lithographic apparatus according to any one of embodiments 121-127, further comprising a controller configured to calibrate the at least one radiation source based on results of the sensor.

129. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region Each of the plurality of radiation sources is disposed in or on a movable structure;

a sensor for measuring the position of the movable structure; and

a projection system configured to project the modulated beam onto the substrate.

130. The lithographic apparatus according to embodiment 129, wherein at least a portion of the sensor is mounted in or on a frame supporting the movable structure.

131. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region Each of the plurality of radiation sources has or provides identification;

a sensor configured to detect said signature; and

a projection system configured to project the modulated beam onto the substrate.

132. The lithographic apparatus according to embodiment 131, wherein at least a portion of the sensor is mounted in or on a frame supporting the plurality of radiation sources.

133. The lithographic apparatus according to embodiment 131 or 132, wherein the signatures comprise radiation frequencies from respective radiation sources.

134. The lithographic apparatus according to any one of embodiments 131-133, wherein the identification mark comprises at least one selected from: a barcode, a label, or a radio frequency identification mark.

135. A lithographic apparatus comprising:

a substrate holder configured to hold a substrate;

a modulator comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern to an exposure region of the substrate and configured to move the plurality of radiation sources relative to the exposure region each of

a sensor configured to detect radiation from at least one of the plurality of radiation sources redirected by the substrate; and

a projection system configured to project the modulated beam onto the substrate.

136. The lithographic apparatus according to embodiment 135, wherein the sensor is configured to determine from the redirected radiation the magnitude of the spot of radiation from the at least one radiation source incident on the substrate Location.

137. The lithographic apparatus according to any one of embodiments 70-136, wherein the modulator is configured to rotate at least one radiation source about an axis substantially parallel to a direction of propagation of the plurality of beams.

138. The lithographic apparatus according to any one of embodiments 70-137, wherein the modulator is configured to translate at least one radiation source in a direction transverse to the direction of propagation of the plurality of beams.

139. The lithographic apparatus according to any one of embodiments 70-138, wherein the modulator comprises a beam deflector configured to move the plurality of beams.

140. The lithographic apparatus according to embodiment 139, wherein the beam deflector is selected from the group consisting of: a mirror, a prism, and an acousto-optic modulator.

141. The lithographic apparatus according to embodiment 139, wherein the beam deflector comprises a polygon.

142. The lithographic apparatus according to embodiment 139, wherein the beam deflector is configured to vibrate.

143. The lithographic apparatus according to embodiment 139, wherein the beam deflector is configured to rotate.

144. The lithographic apparatus according to any one of embodiments 70-143, wherein the substrate holder is configured to move the substrate in a direction in which the plurality of beams are disposed.

145. The lithographic apparatus of embodiment 144, wherein the movement of the substrate is rotation.

146. The lithographic apparatus according to any one of embodiments 70-145, wherein the plurality of radiation sources are movable together.

147. The lithographic apparatus according to any one of embodiments 70-146, wherein the plurality of radiation sources are arranged in a circular fashion.

148. The lithographic apparatus according to any one of embodiments 70-147, wherein the plurality of radiation sources are arranged in a plate and spaced apart from each other.

149. The lithographic apparatus according to any one of embodiments 70-148, wherein the projection system comprises a lens array.

150. The lithographic apparatus according to any one of embodiments 70-149, wherein the projection system consists essentially of an array of lenses.

151. The lithographic apparatus according to embodiment 149 or 150, wherein the lenses of the lens array have a high numerical aperture, the lithographic apparatus being configured such that the substrate is exposed to radiation associated with the lenses outside of the focus position to effectively reduce the numerical aperture of the lens.

152. The lithographic apparatus according to any one of embodiments 70-151, wherein each of said radiation sources comprises a laser diode.

153. The lithographic apparatus according to embodiment 152, wherein each laser diode is configured to emit radiation having a wavelength of about 405 nm.

154. The lithographic apparatus according to any one of embodiments 70-153, further comprising a temperature controller configured to maintain the plurality of radiation sources at a substantially constant temperature during exposure.

155. The lithographic apparatus according to embodiment 154, wherein the controller is configured to heat the plurality of radiation sources to a temperature at or near the substantially constant temperature prior to exposure temperature.

156. The lithographic apparatus according to any one of embodiments 70-155, comprising at least 3 separate arrays arranged along a direction, each of said arrays comprising a plurality of radiation sources.

157. The lithographic apparatus according to any one of embodiments 70-156, wherein the plurality of radiation sources comprises at least about 1200 radiation sources.

158. The lithographic apparatus according to any one of embodiments 70-157, further comprising an alignment sensor for determining alignment between at least one radiation source of the plurality of radiation sources and the substrate.

159. The lithographic apparatus according to any one of embodiments 70-158, further comprising a level sensor for determining a position of the substrate relative to a focus position of at least one of the plurality of beams.

160. The lithographic apparatus according to embodiment 158 or 159, further comprising a controller configured to change the pattern based on results of an alignment sensor and/or results of a level sensor.

161. The lithographic apparatus according to any one of embodiments 70-160, further comprising a controller configured to measure the temperature of at least one of the plurality of radiation sources based on or in connection with the The pattern is altered by measuring a temperature associated with at least one of the plurality of radiation sources.

162. The lithographic apparatus according to any one of embodiments 70-161, further comprising a sensor for measuring radiation emitted or to be emitted towards the substrate by at least one radiation source of the plurality of radiation sources properties of radiation.

163. A lithographic apparatus comprising:

a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern;

a lens array comprising a plurality of lenslets; and

a substrate holder configured to hold a substrate,

Wherein during use, apart from the lens array, there are no other optical means between the plurality of radiation sources and the substrate.

164. A programmable patterning device comprising:

a substrate having thereon an array of radiation-emitting diodes spaced along at least one direction; and

a lens array at the radiation downstream side of the radiation emitting diodes.

165. The programmable patterning device of embodiment 164, wherein the lens array comprises a microlens array having a number of microlenses corresponding to the number of radiation emitting diodes positioned to Radiation selectively passing through respective ones of the radiation emitting diodes is focused into an array of microspots.

166. The programmable patterning device of embodiment 164 or 165, wherein the radiation emitting diodes are spaced apart along at least two orthogonal directions.

167. The programmable patterning device according to any one of embodiments 164-166, wherein the radiation emitting diodes are embedded in a material having low thermal conductivity.

168. A device manufacturing method comprising the steps of:

using a plurality of independently controllable radiation sources to provide a plurality of beams modulated according to a desired pattern towards an exposure region of the substrate;

moving at least one of the plurality of radiation sources while providing the plurality of beams such that less than all of the plurality of radiation sources can expose the exposure region at any one time; and

The plurality of beams are projected onto the substrate.

169. A device manufacturing method comprising the steps of:

using multiple independently controllable radiation sources to provide multiple beams modulated according to a desired pattern;

moving at least one of the plurality of radiation sources between a position where it emits radiation and a position where it does not emit radiation; and

The plurality of beams are projected onto the substrate.

170. A method of device fabrication comprising using a plurality of independently controllable radiation sources to provide beams modulated according to a desired pattern, and projecting the modulated beams from the plurality of independently controllable radiation sources onto a substrate using only a lens array .

171. A device manufacturing method comprising the steps of:

using multiple independently controllable radiation sources to provide multiple beams of electromagnetic radiation modulated according to a desired pattern;

At least one radiation source of the plurality of radiation sources is moved relative to the exposure region during exposure of the exposure region such that radiation from the at least one radiation source is at the same time as radiation from at least one of the plurality of radiation sources Contiguous or overlapping radiation from one other radiation source; and

The plurality of beams is projected onto a substrate.

172. The method according to any one of embodiments 168-171, wherein the step of moving comprises rotating at least one radiation source about an axis substantially parallel to the direction of propagation of the plurality of beams.

173. The method according to any one of embodiments 168-172, wherein the step of moving comprises translating at least one radiation source in a direction transverse to the direction of propagation of the plurality of beams.

174. The method according to any one of embodiments 168-173, comprising moving the plurality of beams by using a beam deflector.

175. The method of embodiment 174, wherein the beam deflector is selected from the group consisting of: a mirror, a prism, and an acousto-optic modulator.

176. The method of embodiment 174, wherein the beam deflector comprises a polygon.

177. The method of embodiment 174, wherein the beam deflector is configured to vibrate.

178. The method of embodiment 174, wherein the beam deflector is configured to rotate.

179. The method according to any one of embodiments 168-178, comprising moving the substrate in a direction in which the plurality of beams are arranged.

180. The method of embodiment 179, wherein the motion of the substrate is rotation.

181. The method according to any one of embodiments 168-180, comprising moving the plurality of radiation sources together.

182. The method according to any one of embodiments 168-181, wherein the plurality of radiation sources are arranged in a circular fashion.

183. The method according to any one of embodiments 168-182, wherein the plurality of radiation sources are arranged in a plate and spaced apart from each other.

184. The method according to any one of embodiments 168-183, wherein the step of projecting comprises forming an image of each of the beams on the substrate by using a lens array.

185. The method according to any one of embodiments 168-184, wherein said step of projecting comprises forming an image of each of said beams on said substrate using substantially only a lens array.

186. The method according to any one of embodiments 168-185, wherein each of said radiation sources comprises a laser diode.

187. The method of embodiment 186, wherein each laser diode is configured to emit radiation having a wavelength of about 405 nm.

188. A flat panel display manufactured according to the method of any one of embodiments 168-187.

189. An integrated circuit device fabricated according to the method of any one of embodiments 168-187.

190. A radiation system comprising:

a plurality of movable radiation arrays, each radiation array comprising a plurality of independently controllable radiation sources configured to provide a plurality of beams modulated according to a desired pattern; and

a motor configured to move each of the radiating arrays.

191. The radiation system of embodiment 190, wherein the motor is configured to rotate each of the radiation arrays about an axis substantially parallel to the direction of propagation of the plurality of beams.

192. The radiation system of embodiment 190 or 191, wherein the motor is configured to translate each of the radiation arrays in a direction transverse to the direction of propagation of the plurality of beams.

193. The radiation system according to any one of embodiments 190-192, further comprising a beam deflector configured to move the plurality of beams.

194. The radiation system of embodiment 193, wherein the beam deflector is selected from the group consisting of: mirrors, prisms, and acousto-optic modulators.

195. The radiation system of embodiment 193, wherein the beam deflector comprises a polygon.

196. The radiation system of embodiment 193, wherein the beam deflector is configured to vibrate.

197. The radiation system of embodiment 193, wherein the beam deflector is configured to rotate.

198. The radiation system according to any one of embodiments 190-197, wherein the plurality of radiation sources of each of the radiation arrays are movable together.

199. The radiation system according to any one of embodiments 190-198, wherein the plurality of radiation sources of each of the radiation arrays are arranged in a circular fashion.

200. The radiation system according to any one of embodiments 190-199, wherein the plurality of radiation sources of each of the radiation arrays are arranged in a plate and spaced apart from each other.

201. The radiation system according to any one of embodiments 190-200, further comprising a lens array associated with each of said radiation arrays.

202. The radiation system of embodiment 201, wherein each of the plurality of radiation sources of each of the radiation arrays is associated with a lens in the lens array associated with the radiation array .

203. The radiation system according to any one of embodiments 190-202, wherein each of the plurality of sources of each of the radiation arrays comprises a laser diode.

204. The radiation system of embodiment 203, wherein each laser diode is configured to emit radiation having a wavelength of about 405 nm.

205. A lithographic apparatus for exposing a substrate to radiation, the lithographic apparatus comprising a programmable patterning device having 100-25000 self-emissive individually addressable elements.

206. The lithographic apparatus of embodiment 205 comprising at least 400 self-emissive individually addressable elements.

207. The lithographic apparatus of embodiment 205 comprising at least 1000 self-emissive individually addressable elements.

208. The lithographic apparatus according to any one of embodiments 205-207, comprising less than 10000 self-emissive individually addressable elements.

209. The lithographic apparatus according to any one of embodiments 205-207, comprising less than 5000 self-emissive individually addressable elements.

210. The lithographic apparatus according to any one of embodiments 205-209, wherein the self-emissive individually addressable elements are laser diodes.

211. The lithographic apparatus according to any one of embodiments 205-209, wherein said self-emissive individually addressable elements are arranged to have spots on said substrate selected from the range of 0.1-3 microns size.

212. The lithographic apparatus according to any one of embodiments 205-209, wherein the self-emissive individually addressable elements are arranged to have a spot size on the substrate of about 1 micron.

213. A lithographic apparatus for exposing a substrate to radiation, the lithographic apparatus comprising a programmable patterning device such that, based on an exposure field length of 10 cm, 100- 25,000 self-emitting individually addressable elements.

214. The lithographic apparatus of embodiment 213 comprising at least 400 self-emissive individually addressable elements.

215. The lithographic apparatus of embodiment 213 comprising at least 1000 self-emissive individually addressable elements.

216. The lithographic apparatus according to any one of embodiments 213-215, comprising less than 10000 self-emissive individually addressable elements.

217. The lithographic apparatus according to any one of embodiments 213-215, comprising less than 5000 self-emissive individually addressable elements.

218. The lithographic apparatus according to any one of embodiments 213-217, wherein the self-emissive individually addressable elements are laser diodes.

219. The lithographic apparatus according to any one of embodiments 213-217, wherein said self-emissive individually addressable elements are arranged to have spots on said substrate selected from the range of 0.1-3 microns size.

220. The lithographic apparatus according to any one of embodiments 213-217, wherein the self-emissive individually addressable elements are arranged to have a spot size on the substrate of about 1 micron.

221. A programmable patterning device comprising a rotatable disk having 100-25000 self-emitting individually addressable elements.

222. The programmable patterning device of embodiment 221, wherein the disc comprises at least 400 self-emissive individually addressable elements.

223. The programmable patterning device of embodiment 221, wherein the disk comprises at least 1000 self-emissive individually addressable elements.

224. The programmable patterning device according to any one of embodiments 221-223, wherein said disc comprises less than 10000 self-emissive individually addressable elements.

225. The programmable patterning device according to any one of embodiments 221-223, wherein said disc comprises less than 5000 self-emissive individually addressable elements.

226. The programmable patterning device according to any one of embodiments 221-225, wherein the self-emissive individually addressable elements are laser diodes.

227. Use of one or more of the present inventions in the manufacture of flat panel displays.

228. Use of one or more of the inventions in an integrated circuit package.

229. A method of lithography, comprising exposing a substrate to radiation using a programmable patterning device having self-emissive elements, wherein during said exposure operating said programmable patterning device of said self-emissive elements Power consumption is less than 10kW.

230. The method of embodiment 229, wherein the power consumption is less than 5 kW.

231. The method of embodiment 229 or 230, wherein the power consumption is at least 100 mW.

232. The method according to any one of embodiments 229-231, wherein the self-emissive element is a laser diode.

233. The method of embodiment 232, wherein the laser diode is a blue-violet laser diode.

234. A method of lithography comprising exposing a substrate to radiation using a programmable patterning device having self-emissive elements, wherein in use each emissive element has a light output of at least 1 mW.

235. The method of embodiment 234, wherein the light output is at least 10 mW.

236. The method of embodiment 234, wherein the light output is at least 50 mW.

237. The method according to any one of embodiments 234-236, wherein the light output is less than 200 mW.

238. The method according to any one of embodiments 234-237, wherein the self-emissive element is a laser diode.

239. The method of embodiment 238, wherein the laser diode is a blue-violet laser diode.

240. The method of embodiment 234, wherein the light output is greater than 5 mW but less than or equal to 20 mW.

241. The method of embodiment 234, wherein the light output is greater than 5 mW but less than or equal to 30 mW.

242. The method of embodiment 234, wherein the light output is greater than 5 mW but less than or equal to 40 mW.

243. The method according to any one of embodiments 234-242, wherein the self-emissive element operates in a single mode.

244. A lithographic apparatus comprising:

Programmable patterning device having self-emissive elements; and

A rotatable frame having optics for receiving radiation from said self-emissive element, said optics being refractive optics.

245. A lithographic apparatus comprising:

Programmable patterning device having self-emissive elements; and

A rotatable frame having optical elements for receiving radiation from said self-emissive elements, said rotatable frame having no reflections for receiving radiation from any or all of said self-emissive elements type optical components.

246. A lithographic apparatus comprising:

programmable patterning device; and

A rotatable frame including a plate with optical elements, the surface of the plate with optical elements is flat.

247. Use of one or more of said inventions in the manufacture of flat panel displays.

248. Use of one or more of said inventions in the packaging of integrated circuits.

249. A flat panel display manufactured according to any of the methods.

250. An integrated circuit device fabricated according to any of the methods.

251. A lithographic apparatus comprising:

two or more columns of optics configured to project a beam onto a target portion of the substrate, each of the two or more columns of optics comprising one or more A radiation source and a projection system for projecting said beam onto a target portion;

a scanning movement actuator configured to move the substrate at a scanning speed in a scanning direction relative to the two or more columns of optics; and

Two or more position measuring devices configured to determine the position of the respective two or more optical device columns relative to the reference object.

252. The lithographic apparatus according to embodiment 251, wherein said reference object comprises at least one marker, wherein said at least one marker is arranged at two adjacent optics of said two or more columns of optics In overlapping portions of target portions of columns, wherein the at least one marker is used for position measurement of two adjacent optical device columns relative to each other.

253. The lithographic apparatus according to embodiment 251, wherein said reference object comprises a plurality of markers, each of said two or more position measuring devices comprises means for receiving one of said plurality of markers An image sensor of a reflected image of the marker, wherein the position of the optical column can be determined based on the reflected image projected onto the image sensor.

254. The lithographic apparatus according to embodiment 253, wherein said one mark is arranged in an overlapping portion of target portions of two adjacent optics columns of said two or more optics columns such that The reflected images are received by two position measuring devices.

255. The lithographic apparatus according to embodiment 253 or 254, wherein each of the two or more position measuring devices comprises a beam splitter and a 1/4 wave plate arranged to direct the reflected image to the image sensor.

256. The lithographic apparatus according to any one of embodiments 251-255, wherein said position measurement devices are integrated into respective columns of optics.

257. The lithographic apparatus according to any one of embodiments 251-256, comprising alignment adjustment means for adjusting one or more of said two or more columns of optics based on the measured positions Multiple beam positions.

258. The lithographic apparatus according to embodiment 257, wherein the alignment adjustment device is configured to adjust a pattern projected into a target portion for aligning the two or more optical device columns.

259. The lithographic apparatus according to embodiment 257 or 258, wherein said alignment adjustment means is configured to control activation of one or more radiation sources in said corresponding two or more columns of optics Timing and/or intensity to adjust the pattern.

260. The lithographic apparatus according to any one of embodiments 251-259, wherein each optics column comprises at least one movable lens element, wherein an actuator is connected to the lens element for adjusting the The location of the generated pattern in the corresponding target section.

261. The lithographic apparatus according to any one of embodiments 251-260, wherein the lithographic apparatus comprises more than two optical columns, and wherein each optical column comprises a position measurement device.

262. The lithographic apparatus according to any one of embodiments 251-261, wherein the positions of the two or more optical columns are plotted in the plane of the surface of the substrate on which the pattern is to be projected on Measured in two directions.

263. The lithographic apparatus according to any one of embodiments 251-262, wherein said reference object is a substrate.

264. The lithographic apparatus according to any one of embodiments 251-262, wherein the reference object is a reference plate mounted on a substrate support.

265. The lithographic apparatus according to any one of embodiments 251-264, wherein the radiation source is a self-emissive contrast device.

266. The lithographic apparatus according to any one of embodiments 251-265, comprising an actuator for moving one of said two or more columns of optics relative to a substrate at least part of .

267. A method for aligning an optics column of a lithographic apparatus according to any one of embodiments 251-266, the method comprising the steps of:

measuring a position of a target portion of a plurality of optical arrays relative to a reference object;

comparing the positions of the target positions of adjacent columns of optical devices relative to each other; and

Adjusting the pattern projected onto the target portion is used to align the columns of optics.

268. The method of embodiment 267, wherein the reference object comprises at least one marker, wherein the at least one marker is disposed on two adjacent optical columns of the two or more optical columns The overlapping portion of the target portion wherein the measured position of at least one marker in the two adjacent columns of optics is used to determine the position of the two adjacent columns of optics relative to each other.

Although specific reference may be made herein to the lithographic apparatus being used to fabricate a particular device or structure (such as an integrated circuit or a flat panel display), it should be understood that the lithographic apparatus and lithographic methods described herein may have other applications. Applications include but are not limited to integrated circuits, integrated optical systems, guiding and detecting patterns for magnetic domain memories, flat panel displays, liquid crystal displays (LCD), OLED displays, thin-film magnetic heads, microelectromechanical devices (MEMS), micro-opto-electromechanical systems (MOEMS) , DNA chips, packaging (e.g. flip-chip, redistribution, etc.), flexible displays or electronic devices (which are displays or electronic devices that can be rollable, bendable like paper and remain indeformable, conformal rugged, thin and/or lightweight, such as flexible plastic displays), etc. Additionally, for example in flat panel displays, the apparatus and methods of the present invention may be used to facilitate the creation of various layers, such as thin film transistor layers and/or color filter layers. It will be understood by those skilled in the art that, in the case of this alternate application, any term "wafer" or "die" used therein may be considered to be synonymous with the more general term "substrate" or "target portion", respectively. synonymous. The substrate referred to here may be processed before or after exposure, such as in a track (e.g., a tool that typically applies a layer of resist to a substrate and develops the exposed resist), dose test tool or inspection tool. Where applicable, the disclosure herein may be used in this and other substrate processing tools. In addition, the substrate may be processed more than once, for example in order to produce a multilayer IC, so that the term "substrate" as used herein may also denote a substrate that already contains a plurality of processed layers.

The terms "radiation" and "beam" as used herein include all types of electromagnetic radiation, including ultraviolet (UV) radiation (e.g., having a wavelength at or about 365, 248, 193, 157, or 126 nm) and extreme ultraviolet (EUV) radiation ( For example with wavelengths in the range of 5-20 nm) and particle beams such as ion beams or electron beams.

Flat panel display substrates may be rectangular in shape. A lithographic apparatus designed for exposing substrates of this type may provide an exposure area which covers the full width of a rectangular substrate, or a fraction of said width (eg half of the width). The substrate can be scanned under the exposure area while simultaneously scanning the patterning device or patterning device with a patterned beam to provide a changing pattern. In this way, all or part of the desired pattern is transferred to the substrate. Exposure can be done in a single scan if the exposed area covers the full width of the substrate. If the exposure area covers eg half the width of the substrate, the substrate can be moved laterally after the first scan, and usually another scan is performed to expose the remainder of the substrate.

The term "patterning device" as used herein should be broadly interpreted to mean any device that can be used to modulate the cross-section of a radiation beam, such as to create a pattern in (a portion of) a substrate. It should be noted that the pattern imparted to the radiation beam may not exactly correspond to the desired pattern in the target portion of the substrate, eg if the pattern includes phase shifting features or so called assist features. Similarly, the resulting pattern on the substrate may not correspond to the pattern formed at any one instant on the array of individually controllable elements. This may be especially true for arrangements in which the final pattern formed on each part of the substrate is built over a given period of time or during a given number of exposures, at a given time During a period or a given number of exposures, the pattern on the array of individually controllable elements and/or the relative position of the substrate varies. Typically, the pattern produced on the target portion of the substrate will correspond to a specific functional layer in the device produced in the target portion, such as an integrated circuit or a flat panel display (such as a color filter layer in a flat panel display or a layer in a flat panel display). thin film transistor layer). Examples of such patterning devices include, for example, reticles, programmable mirror arrays, laser diode arrays, light emitting diode arrays, grating light valves, and LCD arrays. A patterning device whose pattern is programmable with the aid of an electronic device such as a computer is collectively referred to herein as a "contrast device", such as a patterning device comprising a plurality of programmable elements that can be modulated per programmable element. The intensity of a portion of a radiation beam (such as all devices mentioned in the preceding sentence except reticles), including electronically programmable patterning devices with a plurality of programmable elements, passed through relative to adjacent portions of the radiation beam modulating the phase of a portion of the radiation beam to impart a pattern to the radiation beam. In one embodiment, the patterning device includes at least 10 programmable elements, such as at least 100, at least 1,000, at least 10,000, at least 100,000, at least 1,000,000, or at least 1,000,000 programmable elements. Embodiments of several of these devices are discussed in somewhat more detail below:

Programmable mirror array. A programmable mirror array may include a matrix addressable surface having a viscoelastic control layer and a reflective surface. The basic principle on which such devices are based is that addressed areas of eg a reflective surface reflect incident radiation as diffracted radiation, whereas non-addressed areas reflect incident radiation as undiffracted radiation. By using an appropriate spatial filter, it is possible to filter out the undiffracted radiation from the reflected beam, leaving only the diffracted radiation to reach the substrate. In this way, the beams are patterned according to the addressing pattern of the matrix addressable surface. It will be appreciated that, alternatively, a filter may filter out diffracted radiation, leaving undiffracted radiation to reach the substrate. Arrays of diffractive optical MEMS devices can also be used in a corresponding manner. A diffractive optical MEMS device may comprise a plurality of reflective strips deformable relative to each other to form a grating that reflects incident radiation as diffracted radiation. A further embodiment of a programmable mirror array employs a matrix arrangement of tiny mirrors, each of which can be independently tilted about an axis by applying a suitable local electric field or by employing piezoelectric actuation means. The tilt defines the state of each mirror. When the component is defect-free, the mirror can be controlled by suitable control signals from the controller. Each non-defective element is controllable to assume any one of a series of states in order to adjust the intensity of its corresponding pixel in the projected radiation pattern. Furthermore, the mirrors are matrix addressable such that addressed mirrors reflect an incident radiation beam in a different direction than non-addressed mirrors; The addressing pattern is patterned. The required matrix addressing can be performed using suitable electronic means. More information on mirror arrays as cited herein can be found in, for example, U.S. Patent Nos. US 5,296,891 and US 5,523,193 and PCT Patent Application Publication Nos. WO 98/38597 and WO 98/33096, the entire contents of which are incorporated by reference In this article.

Programmable LCD array. Examples of such constructions are provided in U.S. Patent No. US 5,229,872, the entire contents of which are incorporated herein by reference.

A lithographic apparatus may comprise one or more patterning devices, such as one or more contrast devices. For example, it may have a plurality of arrays of independently controllable elements, each controlled independently of each other. In such an arrangement, some or all of the arrays of individually controllable elements may have a common illumination system (or part of an illumination system), a common support structure for the array of individually controllable elements, and/or a common projection system ( or part of a projection system).

It should be understood that where pre-biasing features, optical proximity correction features, phase change techniques, and/or multiple exposure techniques are used, for example, the pattern "displayed" on an array of individually controllable elements may be substantially different from the pattern ultimately transferred to the substrate. A layer or pattern on a substrate. Similarly, the resulting pattern on the substrate may not correspond to the pattern formed at any one instant on the array of individually controllable elements. This may be especially true for arrangements in which the final pattern formed on each part of the substrate is built over a given time period or over a given number of exposures, at a given time period Or the pattern on the array of individually controllable elements and/or the relative position of the substrate changes during a given number of exposures.

Projection systems and/or illumination systems may include various types of optical components, such as refractive, reflective, magnetic, electromagnetic, electrostatic, or other types of optical components, or any combination thereof, to direct, shape, or control radiation beam.

The lithographic apparatus may be of the type having two (eg dual stage) or more substrate stages (and/or two or more patterning device stages). In such "multi-stage" machines, additional tables may be used in parallel, or one or more other tables may be used for exposure while preparatory steps are being performed on one or more tables.

The lithographic apparatus can also be of the type that at least a portion of the substrate can be covered with an "immersion liquid" (eg water) having a relatively high refractive index, so as to fill the space between the projection system and the substrate. The immersion liquid may also be applied to other spaces in the lithographic apparatus, such as between the patterning device and the projection system. Immersion techniques are used to increase the numerical aperture of projection systems. The term "immersion" as used herein does not mean that the structure such as the substrate is necessarily submerged in the liquid, but that the liquid is located between the projection system and the substrate during exposure.

Additionally, the device may be provided with a fluid handling unit to allow interaction between the fluid and the irradiated portion of the substrate (eg selectively attaching chemicals to the substrate or selectively modifying the surface structure of the substrate).

In an embodiment, the substrate has a generally circular shape, optionally with a notch and/or a flattened edge along a portion of its perimeter. In an embodiment, the substrate has a polygonal shape, such as a rectangular shape. Embodiments in which the substrate has a substantially circular shape include embodiments in which the diameter of the substrate is at least 25mm, such as at least 50mm, at least 75mm, at least 100mm, at least 125mm, at least 150mm, at least 175mm, at least 200mm, at least 250mm, or at least 300mm. In one embodiment, the diameter of the substrate is at most 500 mm, at most 400 mm, at most 350 mm, at most 300 mm, at most 250 mm, at most 200 mm, at most 150 mm, at most 100 mm, or at most 75 mm. Embodiments where the substrate is polygonal (e.g. rectangular) include at least 1 side of the substrate, such as at least 2 sides or at least 3 sides having at least 5 cm, such as at least 25 cm, at least 50 cm, at least 100 cm, at least 150 cm, Embodiments having a length of at least 200 cm, or at least 250 cm. In one embodiment, at least one side of the substrate has a length of at most 1000 cm, such as at most 750 cm, at most 500 cm, at most 350 cm, at most 250 cm, at most 150 cm, or at most 75 cm. In one embodiment, the substrate is a rectangular substrate having a length of about 250-350 cm and a width of about 250-300 cm. The thickness of the substrate may vary and may depend to some extent on, for example, the substrate material and/or substrate dimensions. In an embodiment, the thickness is at least 50 μm, such as at least 100 μm, at least 200 μm, at least 300 μm, at least 400 μm, at least 500 μm, or at least 600 μm. In one embodiment, the thickness of the substrate is at most 5000 μm, such as at most 3500 μm, at most 2500 μm, at most 1750 μm, at most 1250 μm, at most 1000 μm, at most 800 μm, at most 600 μm, at most 500 μm, at most 400 μm, or at most 300 μm. The substrate referred to here may be processed before or after exposure, for example in a track (a tool that typically applies a layer of resist to a substrate and develops the exposed resist). Properties of the substrate may be measured before or after exposure, for example in a metrology tool and/or inspection tool.

In one embodiment, a resist layer is disposed on the substrate. In an embodiment, the substrate is a wafer, such as a semiconductor wafer. In one embodiment, the wafer material is selected from the group consisting of Si, SiGe, SiGeC, SiC, Ge, GaAs, InP and InAs. In one embodiment, the wafer is a III/V compound semiconductor wafer. In one embodiment, the wafer is a silicon wafer. In one embodiment, the substrate is a ceramic substrate. In one embodiment, the substrate is a glass substrate. Glass substrates may be useful, for example, in the manufacture of flat panel displays and liquid crystal display panels. In one embodiment, the substrate is a plastic substrate. In one embodiment, the substrate is transparent (to the naked human eye). In one embodiment, the substrate is colored. In one embodiment, the substrate is colorless.

While patterning device 104 is described and/or shown above as above substrate 114 in one embodiment, it may alternatively or additionally be located below substrate 114 . In addition, in an embodiment, the patterning device 104 and the substrate 114 may be side by side, for example, the patterning device 104 and the substrate 114 extend vertically, and the patterns are projected horizontally. In an embodiment, patterning device 104 is provided to expose at least two opposing sides of substrate 114 . For example, there may be at least two patterning devices 104 on at least each respective opposing side of the substrate 114 to expose the sides. In an embodiment, it is possible to have a single patterning device 104 to project one side of the substrate 114 and suitable optics (such as a beam directing mirror) to project the pattern from the single patterning device 104 onto the side of the substrate 114. on the other side.

While specific embodiments of the invention have been described above, it should be understood that the invention may be embodied in forms other than those described above. For example, the invention may take the form of a computer program containing one or more sequences of machine-readable instructions for describing the methods disclosed above, or a data storage medium having such a computer program stored therein (e.g. , semiconductor memory, magnetic disk or optical disk).

Additionally, although the invention has been disclosed in the context of specific embodiments and examples, those skilled in the art will appreciate that the invention extends beyond the specific disclosed embodiments to other alternative embodiments and/or to the invention. Use and its obvious modifications and equivalents. In addition, while many variations of the invention have been shown and described in detail, other modifications within the scope of the invention will be readily apparent to those skilled in the art based on this disclosure. For example, it is contemplated that various combinations or sub-combinations of specific features and aspects of the embodiments may be made and still fall within the scope of the present invention. Accordingly, it should be understood that various features and aspects of the disclosed embodiments can be combined with or substituted for each other in forming varying modes of the disclosed invention. For example, in one embodiment, the embodiment of movable individually controllable elements of FIG. 5 may be combined with a non-movable array of individually controllable elements, eg, to provide or have a backup system.

Accordingly, while various embodiments of the present invention have been described above, it should be understood that they have been presented by way of example only, and not limitation. It will be understood by those skilled in the relevant art that various changes in form and details may be made therein without departing from the spirit and scope of the invention. Thus, the breadth and scope of the present invention should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the claims and their equivalents.

Claims (18)

1. lithographic equipment comprises:

Two or more optical devices row; Be configured to bundle is projected on the target part of substrate, each in said two or more optical devices row comprises that of being used to provide said bundle or more radiation source project to the optical projection system on the target part with being used for said bundle;

The scanning movement actuator is configured to be listed as along the direction of scanning with respect to said two or more optical devices and moves substrate with sweep velocity; With

Two or more position-measurement devices are configured to confirm that corresponding two or more optical devices are listed as the position with respect to Reference.

2. lithographic equipment according to claim 1; Wherein said Reference comprises at least one mark; In the lap of the target part of two adjacent optical devices row of wherein said at least one label placement in said two or more optical devices row, wherein said at least one mark is used for two adjacent optical devices row position measurements relative to each other.

3. lithographic equipment according to claim 1; Wherein said Reference comprises a plurality of marks; In said two or more position-measurement device each comprises the imageing sensor of the reflected image that is arranged a mark that is used for receiving said a plurality of marks, and wherein the position of optical devices row can be confirmed based on the reflected image that projects on the imageing sensor.

4. lithographic equipment according to claim 3; A wherein said label placement makes said reflected image received by two position-measurement devices in the lap of the target part of two of said two or more optical devices row adjacent optical devices row.

5. according to claim 3 or 4 described lithographic equipments, each in wherein said two or more position-measurement devices comprises beam splitter and quarter wave plate, is arranged to reflected image is guided to imageing sensor.

6. according to each described lithographic equipment among the claim 1-5, wherein said position-measurement device is integrated in the corresponding optical devices row.

7. according to each described lithographic equipment among the claim 1-6, comprise the aligning regulating device, be used for one or the position of more bundle based on the said two or more optical devices row of measured position adjustments.

8. lithographic equipment according to claim 7, wherein said aligning regulating device are configured to regulate the pattern that is projected in the target part, are used to aim at said two or more optical devices row.

9. according to claim 7 or 8 described lithographic equipments, wherein said aligning regulating device is configured to regulate said pattern through controlling in corresponding two or more optical devices row one or the actuation duration and/or the intensity of more radiation source.

10. according to each described lithographic equipment among the claim 1-9; Wherein each optical devices row comprises at least one movably lens element; Wherein actuator is connected to said lens element, is used for being adjusted in the partly position of the pattern of generation of corresponding target.

11. according to each described lithographic equipment among the claim 1-10, wherein said lithographic equipment comprises the optical devices row more than two, and wherein each optical devices row comprises position-measurement device.

12. according to each described lithographic equipment among the claim 1-11, the position of wherein said two or more optical devices row is measured on both direction in the plane on the surface of the substrate that will be belonged to by projection at pattern.

13. according to each described lithographic equipment among the claim 1-12, wherein said Reference is a substrate.

14. according to each described lithographic equipment among the claim 1-12, wherein said Reference is mounted in the reference plate on the substrate supports device.

15. according to each described lithographic equipment among the claim 1-14, wherein said radiation source is a self-emission formula contrast device.

16. according to each described lithographic equipment among the claim 1-15, comprise actuator, said actuator is used for moving with respect to substrate at least a portion of one of said two or more optical devices row.

17. one kind is used for aiming at the method according to the optical devices row of each described lithographic equipment of claim 1-16, said method comprises step:

Measure the position of the target part of a plurality of optical devices row with respect to Reference;

The position of the target location of relative to each other more adjacent optical devices row; With

The pattern that adjusting projects on the target part is used for alignment optical device row.

18. method according to claim 17; Wherein said Reference comprises at least one mark; In the lap of the target part of two adjacent optical devices row of wherein said at least one label placement in said two or more optical devices row, the measured position of at least one mark in wherein said two adjacent optical devices row is used for confirming two adjacent optical devices row positions relative to each other.

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