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CN102621736A - Method for patterning black matrix in touch panel - Google Patents

Method for patterning black matrix in touch panel Download PDF

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Publication number
CN102621736A
CN102621736A CN2012101040492A CN201210104049A CN102621736A CN 102621736 A CN102621736 A CN 102621736A CN 2012101040492 A CN2012101040492 A CN 2012101040492A CN 201210104049 A CN201210104049 A CN 201210104049A CN 102621736 A CN102621736 A CN 102621736A
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black matrix
buffer layer
touch panel
mask layer
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廖金阅
汤侑颖
林城兴
郭威宏
周诗博
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AUO Corp
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AU Optronics Corp
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Abstract

The invention provides a method for patterning a black matrix in a touch panel, which comprises the following steps: providing a glass substrate and a buffer layer, wherein the buffer layer is positioned above the glass substrate; providing a stripping mask layer above the buffer layer, wherein the stripping mask layer covers the display area of the touch panel; coating a black matrix layer of an inorganic material on respective surfaces of the buffer layer and the stripping mask layer; and stripping the stripping mask layer to form the patterned black matrix layer. According to the invention, the glue stripping mask layer is arranged above the buffer layer, the glue stripping mask layer covers the display area of the touch panel, and then the black matrix layer made of inorganic materials is coated on the surface of the buffer layer and the surface of the glue stripping mask layer, so that the patterned black matrix layer is formed after the glue stripping mask layer is stripped. The black matrix layer of the inorganic material is not peeled off compared with the black matrix layer of the organic material. In addition, another buffer layer and a metal layer may be sequentially deposited on the black matrix layer, thereby reducing an etching time of the buffer layer.

Description

一种对触控面板中的黑矩阵进行图案化的方法A method of patterning a black matrix in a touch panel

技术领域 technical field

本发明涉及触控面板,尤其涉及对该触控面板中的黑矩阵进行图案化的方法。The invention relates to a touch panel, in particular to a method for patterning a black matrix in the touch panel.

背景技术 Background technique

当前,对于广泛应用在电子产品中用以显示图像的薄膜液晶显示器(Thin Film Transistor Liquid Crystal Display,TFT-LCD)而言,其可称为继集成电路(IC)后最重要的电子产品之一。尤其地,薄膜制程为薄膜液晶显示器的发展中最重要的一环,也占有最高的资本支出。若能针对关键制程、设备及原料的研究和开发,即可节省大量的购置成本,以提升产业竞争力。At present, for Thin Film Transistor Liquid Crystal Display (TFT-LCD), which is widely used in electronic products to display images, it can be called one of the most important electronic products after integrated circuits (ICs). . In particular, the thin-film manufacturing process is the most important part in the development of thin-film liquid crystal displays, and also occupies the highest capital expenditure. If we can focus on the research and development of key processes, equipment and raw materials, we can save a lot of purchase costs and improve industrial competitiveness.

以触控面板为例,在彩色滤光片玻璃基板的底层镀有一层金属膜,也被称为黑矩阵(Black Matrix,BM)。该黑矩阵的主要功能包括提高颜色对比度、防止颜色混杂和防止漏光。一般地,为了满足黑矩阵的上述功能,应当采用多层膜干涉的原理,形成具有低反射率(高对比)、高光学密度(防止颜色混杂和漏光)且总厚度约为100~300nm的BM多层膜。例如,BM的制作主要采用溅镀方式,其普遍采用的材质为铬或氧化铬、钼或氧化钼及氮化铬,以完成BM多层膜的干涉溅镀。Taking the touch panel as an example, a layer of metal film is coated on the bottom layer of the color filter glass substrate, also known as black matrix (Black Matrix, BM). The main functions of this black matrix include improving color contrast, preventing color mixing and preventing light leakage. Generally, in order to meet the above functions of the black matrix, the principle of multilayer film interference should be adopted to form a BM with low reflectivity (high contrast), high optical density (to prevent color mixing and light leakage) and a total thickness of about 100-300nm multilayer film. For example, sputtering is mainly used in the production of BM, and the commonly used materials are chromium or chromium oxide, molybdenum or molybdenum oxide and chromium nitride to complete the interference sputtering of BM multilayer film.

然而,现有技术中,湿热测试之后在FPC粘合区域内的BM剥离的情形只会在有机材料制成的BM中发生,而不会在无机材料制成的BM中发生。此外,对于以有机材料BM为主的TFT阵列制造来说,转换成无机显影剂和回收系统也是较为繁琐的,而且转换成本十分昂贵。However, in the prior art, the BM peeling in the FPC bonding area after the damp heat test only occurs in the BM made of organic materials, but not in the BM made of inorganic materials. In addition, for TFT array fabrication based on organic material BM, the conversion to inorganic developer and recycling system is also cumbersome and expensive.

有鉴于此,如何设计一种新颖的薄膜制程,以便解决触控面板的BM剥离情形,降低制造或转换成本,是业内相关技术人员亟待解决的一项课题。In view of this, how to design a novel thin-film manufacturing process to solve the BM peeling situation of the touch panel and reduce the manufacturing or conversion cost is an urgent task to be solved by relevant technical personnel in the industry.

发明内容 Contents of the invention

针对现有技术中的BM剥离制程所存在的上述缺陷,本发明提供了一种对触控面板中的黑矩阵进行图案化的方法。Aiming at the above defects in the BM stripping process in the prior art, the present invention provides a method for patterning the black matrix in the touch panel.

依据本发明的一个方面,提供了一种对触控面板中的黑矩阵进行图案化的方法,包括以下步骤:According to one aspect of the present invention, a method for patterning a black matrix in a touch panel is provided, comprising the following steps:

提供一玻璃基板和一缓冲层,所述缓冲层位于所述玻璃基板的上方;providing a glass substrate and a buffer layer, the buffer layer being located above the glass substrate;

提供一剥胶遮罩层于所述缓冲层的上方,其中,所述剥胶遮罩层覆盖所述触控面板的显示区;providing a peeling mask layer above the buffer layer, wherein the peeling mask layer covers the display area of the touch panel;

涂敷一无机材料的黑矩阵层于所述缓冲层和所述剥胶遮罩层各自的表面;以及coating a black matrix layer of inorganic material on the respective surfaces of the buffer layer and the stripping mask layer; and

剥离所述剥胶遮罩层,以形成图案化的黑矩阵层。peeling off the stripping mask layer to form a patterned black matrix layer.

优选地,在上述涂敷黑矩阵层的步骤之后还包括:提供一第二缓冲层于所述黑矩阵层的上方;以及涂敷一金属层于所述第二缓冲层的上表面。Preferably, after the above step of coating the black matrix layer, it further includes: providing a second buffer layer above the black matrix layer; and coating a metal layer on the upper surface of the second buffer layer.

优选地,该金属层为一透明电极层。更优选地,透明电极层由氧化铟锡(ITO)或氧化铟锌(IZO)材料制成。Preferably, the metal layer is a transparent electrode layer. More preferably, the transparent electrode layer is made of indium tin oxide (ITO) or indium zinc oxide (IZO) material.

优选地,该触控面板采用单片式玻璃触控(OGS,One GlassSolution)工艺进行制作。Preferably, the touch panel is manufactured using an OGS (One Glass Solution) process.

采用本发明的对触控面板的黑矩阵进行图案化的方法,设置一剥胶遮罩层于缓冲层的上方,使该剥胶遮罩层覆盖触控面板的显示区,然后涂敷一无机材料的黑矩阵层于缓冲层的表面和剥胶遮罩层的表面,从而在剥离该剥胶遮罩层后形成图案化的黑矩阵层。无机材料的黑矩阵层相较于有机材料的黑矩阵层不会有剥离的情形。此外,在黑矩阵层上还可依次沉积另一缓冲层和一金属层,从而减少该缓冲层的蚀刻时间。Using the method for patterning the black matrix of the touch panel of the present invention, a peeling mask layer is arranged above the buffer layer, so that the peeling mask layer covers the display area of the touch panel, and then an inorganic The black matrix layer of the material is on the surface of the buffer layer and the surface of the peeling mask layer, so that a patterned black matrix layer is formed after peeling off the peeling mask layer. Compared with the black matrix layer of organic material, the black matrix layer of inorganic material will not peel off. In addition, another buffer layer and a metal layer can be sequentially deposited on the black matrix layer, thereby reducing the etching time of the buffer layer.

附图说明 Description of drawings

读者在参照附图阅读了本发明的具体实施方式以后,将会更清楚地了解本发明的各个方面。其中,Readers will have a clearer understanding of various aspects of the present invention after reading the detailed description of the present invention with reference to the accompanying drawings. in,

图1示出依据本发明的一个方面,用于对触控面板中的黑矩阵进行图案化的方法的流程框图;FIG. 1 shows a block flow diagram of a method for patterning a black matrix in a touch panel according to one aspect of the present invention;

图2示出采用图1中的方法进行薄膜制程的一具体实施例;以及Fig. 2 shows a specific embodiment of thin film manufacturing process using the method in Fig. 1; and

图3示出采用图1中的方法进行薄膜制程的另一具体实施例。FIG. 3 shows another specific embodiment of thin film fabrication using the method in FIG. 1 .

具体实施方式 Detailed ways

为了使本申请所揭示的技术内容更加详尽与完备,可参照附图以及本发明的下述各种具体实施例,附图中相同的标记代表相同或相似的组件。然而,本领域的普通技术人员应当理解,下文中所提供的实施例并非用来限制本发明所涵盖的范围。此外,附图仅仅用于示意性地加以说明,并未依照其原尺寸进行绘制。In order to make the technical content disclosed in this application more detailed and complete, reference may be made to the drawings and the following various specific embodiments of the present invention, and the same symbols in the drawings represent the same or similar components. However, those skilled in the art should understand that the examples provided below are not intended to limit the scope of the present invention. In addition, the drawings are only for schematic illustration and are not drawn according to their original scale.

下面参照附图,对本发明各个方面的具体实施方式作进一步的详细描述。The specific implementation manners of various aspects of the present invention will be further described in detail below with reference to the accompanying drawings.

如前所述,在现有的薄膜制程工艺中,于触控面板湿热测试之后,在FPC粘合区域内的BM剥离只能在有机材料制成的BM中被监测,而无法在无机材料制成的BM中进行检查。另一方面,对于TFT阵列晶圆来说,转换成无机显影剂和回收系统也较为繁琐,而且转换成本十分昂贵。为了有效地解决对于BM材质的依赖性,本发明提出了一种新颖的制程方法。As mentioned earlier, in the existing thin-film manufacturing process, after the touch panel wet heat test, the BM peeling in the FPC bonding area can only be monitored in the BM made of organic materials, but cannot be detected in the BM made of inorganic materials. Check in the completed BM. On the other hand, for TFT array wafers, switching to an inorganic developer and recycling system is cumbersome and expensive. In order to effectively solve the dependence on BM material, the present invention proposes a novel manufacturing method.

图1示出依据本发明的一个方面,用于对触控面板中的黑矩阵进行图案化的方法的流程框图。FIG. 1 shows a flow chart of a method for patterning a black matrix in a touch panel according to one aspect of the present invention.

参照图1,在本发明的方法中,首先执行步骤S1,提供一玻璃基板和一缓冲层,该缓冲层位于该玻璃基板的上方。然后,执行步骤S2,提供一剥胶遮罩层于该缓冲层的上方,其中,剥胶遮罩层覆盖触控面板的显示区,从而避免后续的制程损伤或污染触控面板的显示区,影像产品的图像显示性能。Referring to FIG. 1 , in the method of the present invention, step S1 is first performed to provide a glass substrate and a buffer layer, and the buffer layer is located above the glass substrate. Then, step S2 is performed to provide a peeling mask layer on the buffer layer, wherein the peeling mask layer covers the display area of the touch panel, so as to avoid subsequent process damage or contamination of the display area of the touch panel, Image display performance of imaging products.

接着,在步骤S3中,涂敷一无机材料的黑矩阵层于上述缓冲层和剥胶遮罩层各自的表面。例如,沿着左侧缓冲层的上表面、剥胶遮罩层的上表面以及右侧缓冲层的上表面溅镀该黑矩阵层,使其涂敷于缓冲层和剥胶遮罩层的上方。最后,将剥胶遮罩层连同其上所涂敷的一部分黑矩阵层进行剥离,从而形成图案化的黑矩阵层。Next, in step S3, a black matrix layer of inorganic material is coated on the respective surfaces of the buffer layer and the stripping mask layer. For example, the black matrix layer is sputtered on the upper surface of the left buffer layer, the upper surface of the peeling mask layer and the upper surface of the right buffer layer, so that it is coated on the buffer layer and the peeling mask layer . Finally, the stripping mask layer and a part of the black matrix layer coated thereon are peeled off to form a patterned black matrix layer.

在一具体实施例中,该触控面板采用单片式玻璃触控(OGS,One Glass Solution)工艺进行制作。In a specific embodiment, the touch panel is manufactured using an OGS (One Glass Solution) process.

图2示出采用图1中的方法进行薄膜制程的一具体实施例。其中,图2a为提供了剥胶遮罩层时的状态图,图2b为在缓冲层和剥胶遮罩层各自表面涂敷有黑矩阵层时的状态图,以及图2c为剥胶遮罩层被剥离后的状态图。FIG. 2 shows a specific embodiment of thin film fabrication using the method in FIG. 1 . Wherein, Fig. 2 a is a state diagram when a stripping mask layer is provided, Fig. 2 b is a state diagram when a black matrix layer is coated on the respective surfaces of the buffer layer and the stripping mask layer, and Fig. 2c is a stripping mask State diagram after layers have been stripped away.

请参照图2a、2b和2c。首先,依次提供一玻璃基板10和一缓冲层20,该缓冲层20位于玻璃基板10的上方。然后,提供一剥胶遮罩层30于缓冲层20之上,并且该剥胶遮罩层30至少覆盖触控面板的显示区,此时的状态如图2a所示。Please refer to Figures 2a, 2b and 2c. First, a glass substrate 10 and a buffer layer 20 are provided in sequence, and the buffer layer 20 is located above the glass substrate 10 . Then, a peeling mask layer 30 is provided on the buffer layer 20, and the peeling mask layer 30 at least covers the display area of the touch panel, and the state at this time is shown in FIG. 2a.

然后,在缓冲层20和剥胶遮罩层30各自的表面分别涂敷一无机材料的黑矩阵层,如图2b所示,黑矩阵401位于左侧缓冲层之上,黑矩阵403位于右侧缓冲层之上,并且黑矩阵402位于剥胶遮罩层30之上。最后,剥离该剥胶遮罩层30,以形成图案化的黑矩阵层,如图2c所示,在剥离该剥胶遮罩层30的同时,其上涂敷的黑矩阵402也一并被剥离。Then, a black matrix layer of an inorganic material is coated on the respective surfaces of the buffer layer 20 and the peeling mask layer 30, as shown in FIG. The buffer layer, and the black matrix 402 is located on the stripping mask layer 30 . Finally, the stripping mask layer 30 is peeled off to form a patterned black matrix layer. As shown in FIG. peel off.

图3示出采用图1中的方法进行薄膜制程的另一具体实施例。其中,图3a为提供了剥胶遮罩层时的状态图,图3b为在缓冲层和剥胶遮罩层各自表面依次涂敷有黑矩阵层、第二缓冲层和金属层时的状态图,以及图3c为剥胶遮罩层被剥离后的状态图。FIG. 3 shows another specific embodiment of thin film fabrication using the method in FIG. 1 . Wherein, Fig. 3 a is a state diagram when a peeling mask layer is provided, and Fig. 3 b is a state diagram when a black matrix layer, a second buffer layer and a metal layer are sequentially coated on the respective surfaces of the buffer layer and the peeling mask layer , and FIG. 3c is a state diagram after the stripping mask layer is peeled off.

请参照图3a、3b和3c。首先,依次提供一玻璃基板10和一缓冲层20,该缓冲层20位于玻璃基板10的上方。然后,提供一剥胶遮罩层30于缓冲层20之上,并且该剥胶遮罩层30至少覆盖触控面板的显示区,此时的状态如图3a所示。Please refer to Figures 3a, 3b and 3c. First, a glass substrate 10 and a buffer layer 20 are provided in sequence, and the buffer layer 20 is located above the glass substrate 10 . Then, a peeling mask layer 30 is provided on the buffer layer 20, and the peeling mask layer 30 at least covers the display area of the touch panel, the state at this time is shown in FIG. 3a.

然后,在缓冲层20和剥胶遮罩层30各自的表面分别涂敷一无机材料的黑矩阵层,如图3b所示,黑矩阵401位于左侧缓冲层之上,黑矩阵403位于右侧缓冲层之上,并且黑矩阵402位于剥胶遮罩层30之上。接着,在黑矩阵401、402和403的上表面分别沉积一第二缓冲层。例如,黑矩阵401上沉积第二缓冲层的一部分(标记501),黑矩阵403上沉积第二缓冲层的一部分(标记503),然后,在第二缓冲层的上表面分别沉积一金属层。例如,第二缓冲层501上沉积金属层的一部分(标记601),第二缓冲层502上沉积金属层的一部分(标记602),第二缓冲层503上沉积金属层的一部分(标记603)。最后,剥离该剥胶遮罩层30,以形成图案化的黑矩阵层,如图3c所示,在剥离该剥胶遮罩层30的同时,其上涂敷的黑矩阵、第二缓冲层和金属层也一并被剥离。由于在黑矩阵层上还沉积有第二缓冲层和金属层,因而可缩短缓冲层的蚀刻时间,提高制程效率。Then, a black matrix layer of an inorganic material is coated on the respective surfaces of the buffer layer 20 and the peeling mask layer 30, as shown in FIG. The buffer layer, and the black matrix 402 is located on the stripping mask layer 30 . Next, a second buffer layer is deposited on the upper surfaces of the black matrices 401 , 402 and 403 respectively. For example, a part of the second buffer layer (marked 501 ) is deposited on the black matrix 401 , a part of the second buffer layer (marked 503 ) is deposited on the black matrix 403 , and then a metal layer is respectively deposited on the upper surface of the second buffer layer. For example, a part of the metal layer is deposited on the second buffer layer 501 (marked 601 ), a part of the metal layer is deposited on the second buffer layer 502 (marked 602 ), and a part of the metal layer is deposited on the second buffer layer 503 (marked 603 ). Finally, the stripping mask layer 30 is peeled off to form a patterned black matrix layer. As shown in FIG. And the metal layer is also peeled off. Since the second buffer layer and the metal layer are also deposited on the black matrix layer, the etching time of the buffer layer can be shortened and the process efficiency can be improved.

在一具体实施例中,该金属层为一透明电极层。较佳地,该透明电极层由氧化铟锡(ITO)或氧化铟锌(IZO)材料制成。In a specific embodiment, the metal layer is a transparent electrode layer. Preferably, the transparent electrode layer is made of indium tin oxide (ITO) or indium zinc oxide (IZO).

采用本发明的对触控面板的黑矩阵进行图案化的方法,设置一剥胶遮罩层于缓冲层的上方,使该剥胶遮罩层覆盖触控面板的显示区,然后涂敷一无机材料的黑矩阵层于缓冲层的表面和剥胶遮罩层的表面,从而在剥离该剥胶遮罩层后形成图案化的黑矩阵层。无机材料的黑矩阵层相较于有机材料的黑矩阵层不会有剥离的情形。此外,在黑矩阵层上还可依次沉积另一缓冲层和一金属层,从而减少该缓冲层的蚀刻时间。Using the method for patterning the black matrix of the touch panel of the present invention, a peeling mask layer is arranged above the buffer layer, so that the peeling mask layer covers the display area of the touch panel, and then an inorganic The black matrix layer of the material is on the surface of the buffer layer and the surface of the peeling mask layer, so that a patterned black matrix layer is formed after peeling off the peeling mask layer. Compared with the black matrix layer of organic material, the black matrix layer of inorganic material will not peel off. In addition, another buffer layer and a metal layer can be sequentially deposited on the black matrix layer, thereby reducing the etching time of the buffer layer.

上文中,参照附图描述了本发明的具体实施方式。但是,本领域中的普通技术人员能够理解,在不偏离本发明的精神和范围的情况下,还可以对本发明的具体实施方式作各种变更和替换。这些变更和替换都落在本发明权利要求书所限定的范围内。Hereinbefore, specific embodiments of the present invention have been described with reference to the accompanying drawings. However, those skilled in the art can understand that without departing from the spirit and scope of the present invention, various changes and substitutions can be made to the specific embodiments of the present invention. These changes and substitutions all fall within the scope defined by the claims of the present invention.

Claims (5)

1.一种对触控面板中的黑矩阵进行图案化的方法,其特征在于,该方法包括以下步骤:1. A method for patterning a black matrix in a touch panel, characterized in that the method may further comprise the steps: 提供一玻璃基板和一缓冲层,所述缓冲层位于所述玻璃基板的上方;providing a glass substrate and a buffer layer, the buffer layer being located above the glass substrate; 提供一剥胶遮罩层于所述缓冲层的上方,其中,所述剥胶遮罩层覆盖所述触控面板的显示区;providing a peeling mask layer above the buffer layer, wherein the peeling mask layer covers the display area of the touch panel; 涂敷一无机材料的黑矩阵层于所述缓冲层和所述剥胶遮罩层各自的表面;以及coating a black matrix layer of inorganic material on the respective surfaces of the buffer layer and the stripping mask layer; and 剥离所述剥胶遮罩层,以形成图案化的黑矩阵层。peeling off the stripping mask layer to form a patterned black matrix layer. 2.根据权利要求1所述的方法,其特征在于,在上述涂敷黑矩阵层的步骤之后还包括:2. method according to claim 1, is characterized in that, also comprises after the step of above-mentioned coating black matrix layer: 提供一第二缓冲层于所述黑矩阵层的上方;以及providing a second buffer layer above the black matrix layer; and 涂敷一金属层于所述第二缓冲层的上表面。Coating a metal layer on the upper surface of the second buffer layer. 3.根据权利要求2所述的方法,其特征在于,所述金属层为一透明电极层。3. The method according to claim 2, wherein the metal layer is a transparent electrode layer. 4.根据权利要求3所述的方法,其特征在于,所述透明电极层由氧化铟锡(ITO)或氧化铟锌(IZO)材料制成。4. The method according to claim 3, wherein the transparent electrode layer is made of indium tin oxide (ITO) or indium zinc oxide (IZO) material. 5.根据权利要求1所述的方法,其特征在于,所述触控面板采用单片式玻璃触控(OGS,One Glass Solution)工艺进行制作。5. The method according to claim 1, characterized in that, the touch panel is manufactured using an OGS (One Glass Solution) process.
CN2012101040492A 2012-04-09 2012-04-09 Method for patterning black matrix in touch panel Pending CN102621736A (en)

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Cited By (7)

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Publication number Priority date Publication date Assignee Title
CN102830871A (en) * 2012-08-03 2012-12-19 芜湖长信科技股份有限公司 Production method of temperature-resistant pressure-resistant capacitive touch screen panel
TWI466002B (en) * 2012-12-19 2014-12-21 Chih Chung Lin Manufacturing method of touch panel
CN104422975A (en) * 2013-08-22 2015-03-18 明兴光电股份有限公司 Method for manufacturing shading pattern
CN106909251A (en) * 2017-03-02 2017-06-30 合肥鑫晟光电科技有限公司 The preparation method of touch-screen, touch-screen and display device
CN107003771A (en) * 2014-12-05 2017-08-01 三星电子株式会社 The electronic equipment touched based on mixing and the method for controlling it
CN107850965A (en) * 2015-07-31 2018-03-27 住友金属矿山股份有限公司 The manufacture method of conductive board, conductive board
CN107850966A (en) * 2015-07-31 2018-03-27 住友金属矿山股份有限公司 Conductive substrate

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102830871A (en) * 2012-08-03 2012-12-19 芜湖长信科技股份有限公司 Production method of temperature-resistant pressure-resistant capacitive touch screen panel
TWI466002B (en) * 2012-12-19 2014-12-21 Chih Chung Lin Manufacturing method of touch panel
CN104422975A (en) * 2013-08-22 2015-03-18 明兴光电股份有限公司 Method for manufacturing shading pattern
CN107003771A (en) * 2014-12-05 2017-08-01 三星电子株式会社 The electronic equipment touched based on mixing and the method for controlling it
CN107850965A (en) * 2015-07-31 2018-03-27 住友金属矿山股份有限公司 The manufacture method of conductive board, conductive board
CN107850966A (en) * 2015-07-31 2018-03-27 住友金属矿山股份有限公司 Conductive substrate
CN106909251A (en) * 2017-03-02 2017-06-30 合肥鑫晟光电科技有限公司 The preparation method of touch-screen, touch-screen and display device
WO2018157814A1 (en) * 2017-03-02 2018-09-07 京东方科技集团股份有限公司 Touch screen manufacturing method, touch screen ,and display device
CN106909251B (en) * 2017-03-02 2020-01-17 合肥鑫晟光电科技有限公司 Manufacturing method of touch screen, touch screen and display device
US10969888B2 (en) * 2017-03-02 2021-04-06 Hefei Xinsheng Optoelectronics Technology Co., Ltd. Touch panel manufacturing method, touch panel, and display device

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