CN102620816A - Test fixture for high-power LED device provided with sexangular baseplate - Google Patents

Abstract

The invention discloses a test fixture for high-power LED devices with a hexagonal substrate: it relates to the technical field of LED test auxiliary devices; it includes a base and a cap; the top of the base is provided with a boss for carrying LED devices, and the top edge of the boss is Two electrodes are symmetrically arranged, and a clamping mechanism for locking the cap is provided on the top surface of the base; the cap is a shell-like structure with an open lower part, and its inner wall structure is adapted to the structure of the boss, and the top plate of the cap is provided with a transparent Light hole, the inside of the top plate of the cap is located on both sides of the light hole, and two electrode plates are symmetrically fixed; its advantage is that the position of the first positioning pin corresponds to the position of the mounting hole on the edge of the hexagonal substrate, which is convenient for the installation of the hexagonal substrate and improves the test efficiency. The electrode, electrode plate and base are all made of copper material, which is convenient for heat dissipation and conduction, and the cap is made of aluminum material, which reduces the influence on the measurement results of luminous flux and improves the accuracy of photoelectric parameter measurement of LED devices with hexagonal substrates.

Description

Hexagonal Substrate High Power LED Device Test Fixture

technical field

The invention relates to the technical field of LED test auxiliary devices.

Background technique

The main packaging forms of LED devices are low-power LEDs of in-line or patch type and high-power LEDs using hexagonal substrates as heat sinks. The hexagonal substrate is a commonly used heat sink board for high-power LEDs. The packaged devices are fixed by thermal conductive glue or welding, and used as a whole. The test of low-power LED devices is relatively simple, and the testing instrument usually comes with a test fixture, while the high-power LED device has a high operating current, which requires the test fixture wire to be thick enough or connected by the Kelvin method. The base is equipped with a heat sink, and some manufacturers require that the shell temperature of the LED device be controlled during the test to make the measurement results comparable, which requires that the test fixture can be connected to a heat sink or a temperature control platform.

When testing high-power LEDs, in order to obtain accurate measurement results, the following considerations need to be made: First, the control of the shell temperature of the LED device. There is a sensitive relationship between the photoelectric parameters of the LED and its shell temperature, so the test fixture is required to be connected to a large enough radiator or temperature control platform, so as to shorten the time to reach thermal equilibrium; second, use a test fixture with a high reflectivity outer surface . For a high-power LED device with a hexagonal substrate, its non-luminous surface area is large, and the surface reflectivity is low, which will produce self-absorption effect on light. This requires the test fixture to cover the non-luminous part of the device as much as possible under the premise of not blocking the direct light, and eliminate the influence of self-absorption effect on the measurement results through the outer surface of the fixture with high reflectivity; third, use the Kelvin connection method . High-power LEDs are tested with high-current power supply, which requires the test fixture to be connected by the four-wire method, and its contacts should be connected to the root of the device.

At present, when conducting photoelectric tests on high-power LEDs with hexagonal substrates in China, it is generally used to solder the leads on the hexagonal substrates to connect them to the test instrument. This method not only destroys the hexagonal substrates, but also has low efficiency, and the leads will produce Self-absorption effects can affect test results.

Contents of the invention

The technical problem to be solved by the present invention is to provide a test fixture for high-power LED devices with hexagonal substrates, which can improve the test efficiency of high-power LED devices with hexagonal substrates, and the test results are accurate.

In order to solve the above technical problems, the technical solution adopted by the present invention is: a test fixture for high-power LED devices with a hexagonal substrate, including a base and a cap; the top of the base is provided with a boss for carrying the LED device, and the boss Two electrodes are symmetrically arranged on the edge of the top of the table, and a clamping mechanism for locking the cap is provided on the top surface of the base; the cap is a shell-like structure with a lower opening, and its inner wall structure is adapted to the structure of the boss, and the top plate of the cap is A light-transmitting hole is provided, and two electrode plates are fixed symmetrically on both sides of the light-transmitting hole on the inner side of the top plate of the cap.

The boss used to fix the LED device is a cylindrical boss, and the middle part of the top surface is fixed with a disc-shaped LED device housing heat dissipation base, and the disc-shaped LED device housing heat dissipation base is evenly distributed on the top surface of the circular direction. A first positioning pin for fixing the LED device.

The base, boss and guide groove are all made of copper, and the cap is made of aluminum.

The electrode plate is fixed on the inner side of the top plate of the cap by means of bolts and nuts, a through hole is provided at the end of the electrode plate, an insulating layer is provided on the inner wall of the through hole, insulating paper is provided between the electrode plate and the cap, and the electrode plate The lower side is provided with an insulating layer for insulation between the nut and the electrode plate.

The clamping mechanism includes a side-opened guide groove arranged on the top of the boss, and the guide grooves on both sides are oppositely arranged.

An annular support plate is provided on the opening side of the cap, and two notches having the same thickness as the opening height of the guide groove are symmetrically provided on the edge of the annular support plate.

Two second positioning pins are symmetrically provided on the top surface of the ring-shaped support plate provided on the opening side of the cap.

The beneficial effects of the present invention are as follows: by setting the first positioning pin on the top of the boss, the position and spacing of the first positioning pin are set according to the hexagonal plate structure of the high-power LED device with the hexagonal substrate, and the position of the first positioning pin is consistent with the hexagonal plate structure. The positions of the mounting holes on the edge of the substrate correspond to each other, which facilitates the installation of the hexagonal substrate and improves the test efficiency; the electrode on the top of the boss is connected to the LED device by setting the electrode plate on the inner side of the top plate of the cap, and the electrodes, the electrode plate and the base are all made of copper material , It is convenient for heat dissipation and conduction. The cap is made of aluminum material, which reduces the influence on the measurement results of luminous flux and improves the accuracy of measurement of photoelectric parameters of LED devices.

Description of drawings

The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

Fig. 1 is a schematic diagram of the structure of the base of the present invention;

Fig. 2 is a schematic diagram of the cap structure of the present invention;

Fig. 3 is a schematic diagram of the bottom structure of the cap of the present invention;

Fig. 4 is a schematic diagram of the installation sequence of the present invention;

In the drawings: 1. base; 2. guide groove; 3. first positioning pin; 4. heat dissipation base of LED device housing; 5. electrode; 6. second positioning pin; 7. light exit hole; 8. fixing hole ; 9, card slot; 10, electrode sheet; 11, insulating layer; 12, LED device.

Detailed ways

In summary, the present invention discloses a test fixture for high-power LED devices with a hexagonal substrate, which includes a base 1 and a cap; the top of the base 1 is provided with a boss for carrying LED devices, and the top edge of the boss is symmetrical There are two electrodes 5, and the top surface of the base 1 is provided with a clamping mechanism 2 for locking the cap; the cap is a shell-like structure with a lower opening, and its inner wall structure is compatible with the boss structure, and the top plate of the cap is provided with a There is a light-transmitting hole 7, and two electrode plates 10 are symmetrically fixed on both sides of the light-transmitting hole 7 on the inner side of the top plate of the cap.

The boss used to fix the LED device is a cylindrical boss, and the middle part of the top surface is fixed with a disc-shaped LED device housing cooling base 4, and the disc-shaped LED device housing cooling base 4 is evenly spaced in the circumferential direction of the top surface. Two first positioning pins 3 for fixing the LED device are arranged.

The base 1, the boss and the guide groove 2 are all made of copper, and the cap is made of aluminum.

The electrode plate 5 is fixed on the inner side of the top plate of the cap by means of bolts and nuts. The tail end of the electrode plate 10 is provided with a through hole, the inner wall of the through hole is provided with an insulating layer, and an insulating layer is provided between the electrode plate 10 and the cap. Paper 11, the lower side of the electrode plate 10 is provided with an insulating layer for insulation between the nut and the electrode 5 plate.

The clamping mechanism includes a side opening guide groove 2 arranged on the top of the boss, and the guide grooves 2 on both sides are oppositely arranged.

An annular support plate is provided on the opening side of the cap, and two notches 9 having the same thickness as the opening height of the guide groove 2 are symmetrically provided on the edge of the annular support plate.

Two second positioning pins 6 are symmetrically provided on the top surface of the annular support plate provided on the opening side of the cap.

The cap is made of aluminum material. The effect of using the aluminum material is to reduce the influence of the material on the measurement result of the luminous flux, and the aluminum material has the least influence on the measurement result of the luminous flux, so the aluminum material is used.

The heat dissipation base and guide groove of the LED device shell that dissipate heat from the high-power LED device and the circuit that supplies power to the high-power LED device are all made of copper material with good heat dissipation; during the test, in order to avoid the influence of the fixture on the measurement result, the high-power LED The device should be placed at the side opening of the integrating sphere, so except for the electrode, the cap of the fixture is made of aluminum material, because aluminum material has the least influence on the measurement result of luminous flux. Install the high-power LED device on the heat dissipation base of the LED device shell. In order to fully contact and improve the heat dissipation effect, you can apply a layer of heat-conducting silicone grease on the heat dissipation base of the LED device shell. After the LED device is placed, place the After the cap is closed, all the installation positions can be identified with the positioning pins, and the installed high-power LED device is tested to check whether the contact is good. If the contact is good, put the fixture into the side opening of the integrating sphere, and power on the LED device. After that, you can start measuring.

The manufacture of the fixture disclosed in the present invention is to measure the photoelectric parameters of high-power LED devices more accurately, and to make the test operation of high-power LED with hexagonal substrate easy to operate, so the main factors affecting LED measurement and the feasibility of operation should be considered Sex, try to eliminate the factors that cause errors in the measurement results.

According to the characteristics of the LED device test system itself, a test fixture for high-power LED devices with a hexagonal substrate is designed on the basis of the original fixture. The first is the material selection of the heat dissipation base of the shell that controls the shell temperature of the high-power LED device. The heat dissipation base of the LED device shell is made of copper material, and the diameter is the same as the maximum diameter of the hexagonal substrate. The thickness of the heat dissipation base of the LED device shell should be based on the measured The height of the high-power LED device with a hexagonal substrate is adjusted so that after it is fixed with a cap, the light emitted by the LED device is not blocked by the cap. The thickness of the common hexagonal substrate is certain, followed by the selection of the power supply electrode. , because the electrodes of the tested LED device are on the upper surface of the hexagonal substrate, it is necessary to make an electrode plate on the cap to correspond to it. The electrodes on the cap are responsible for connecting the electrodes of the high-power LED device under test and the electrodes of the heat dissipation base of the LED device shell. Conduction, because the material of the cap is aluminum, in order to avoid short circuit, it is necessary to insulate the energized electrode of the LED device and the cap. The method is to fix the electrode plate with screws. The screw and the electrode plate are not in contact and locked with nuts. To fix the electrode plate, the nut and the electrode plate are separated by polytetrafluoroethylene, and the electrode plate and the cap are separated by insulating paper, which not only plays a conductive role, but also avoids short circuit.

By setting the first positioning pin on the top of the boss, the position and spacing of the first positioning pin are set according to the hexagonal plate structure of the high-power LED device with the hexagonal substrate, and the position of the first positioning pin is consistent with the position of the mounting hole on the edge of the hexagonal substrate. Corresponding, it is convenient to install the hexagonal substrate and improve the test efficiency; the electrodes and LED devices on the top of the boss are connected by setting the electrode plate inside the top plate of the cap, and the electrodes, electrode plates and base are all made of copper material, which is convenient for heat dissipation and conduction, and the cap The aluminum material is used to reduce the influence on the measurement result of the luminous flux and improve the measurement accuracy of the photoelectric parameters of the LED device.

Claims (7)

1. A test fixture for high-power LED devices with a hexagonal substrate, characterized in that it includes a base (1) and a cap; the top of the base (1) is provided with a boss for carrying LED devices, and the top edge of the boss is Two electrodes (5) are arranged symmetrically, and a clamping mechanism (2) for locking the cap is provided on the top surface of the base (1); Correspondingly, a light-transmitting hole (7) is provided on the top plate of the cap, and two electrode plates (10) are symmetrically fixed on both sides of the light-transmitting hole (7) inside the top plate of the cap. 2. The hexagonal substrate high-power LED device test fixture according to claim 1, characterized in that: the boss used to fix the LED device is a cylindrical boss, and the middle part of the top surface is fixed with a disc-shaped LED device The housing heat dissipation base (4), two first positioning pins (3) for fixing the LED device are evenly distributed on the top surface of the circular plate-shaped LED device housing heat dissipation base (4) in the circumferential direction. 3. The test fixture for high-power LED devices with hexagonal substrate according to claim 1 or 2, characterized in that: the base (1), boss and guide groove (2) are all made of copper material, and the cap is made of Aluminum material. 4. The hexagonal substrate high-power LED device test fixture according to claim 3, characterized in that: the electrode (5) plate is fixed on the inner side of the top plate of the cap by means of bolts and nuts, and the electrode plate (10) The tail end is provided with a through hole, the inner wall of the through hole is provided with an insulating layer, the insulating paper (11) is provided between the electrode plate (10) and the cap, and the bottom side of the electrode plate (10) is provided with a nut and an electrode (5) plate insulating layer between them. 5. The hexagonal substrate high-power LED device test fixture according to claim 4, characterized in that: the clamping mechanism includes a guide groove (2) with a side opening on the top of the boss, and guide grooves (2) on both sides ) relative to the setting. 6. The test fixture for high-power LED devices with hexagonal substrate according to claim 5, characterized in that: the opening side of the cap is provided with a ring-shaped support plate, and the edge of the ring-shaped support plate is symmetrically provided with two layers of thickness and the guide groove (2) Notches (9) with the same opening height. 7. The fixture for testing high-power LED devices with hexagonal substrates according to claim 6, characterized in that two second positioning pins (6) are symmetrically provided on the top surface of the ring-shaped support plate provided on the opening side of the cap.

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