CN102602111A - A kind of production method of aluminum-based copper-clad laminate and product thereof - Google Patents

Abstract

The invention relates to a production method of an aluminum-based copper-clad plate and a product thereof, wherein a glue layer and a copper film layer are attached to an aluminum substrate to be produced in a roller pressing and synchronous bonding mode.

Description

A kind of production method of aluminum-based copper-clad laminate and product thereof

technical field

The invention relates to a method for producing aluminum-based copper-clad laminates and products thereof, in particular to a production method for producing aluminum-based copper-clad laminates by rolling and pressing and products thereof.

Background technique

As we all know, aluminum-based copper-clad laminate is a kind of raw material for aluminum substrate. It is a kind of board made of electronic glass fiber cloth or other reinforcing materials impregnated with resin, covered with copper foil on one or both sides and hot-pressed. Shaped material, called copper clad laminate, referred to as aluminum-based copper-clad laminate, aluminum-based copper-clad laminate is used as the substrate material in the manufacture of printed circuit boards, and it mainly plays the role of interconnection, insulation and support for printed circuit boards. It has a great influence on the transmission speed, energy loss and characteristic impedance of the signal in the circuit, the performance, quality, processability in manufacturing, manufacturing level, manufacturing cost and long-term reliability and stability of the printed circuit board Much depends on the aluminum base copper clad laminate.

The manufacturing industry of aluminum-based copper clad laminates is a sunrise industry. It has broad development prospects along with the development of electronic information and communication industries. Its manufacturing technology is a high-tech that intersects, penetrates and promotes each other. It develops simultaneously with the electronic information industry, especially the printed circuit industry, and is inseparable. Its progress and development have been driven by the innovation and development of electronic complete machine products, semiconductor manufacturing technology, electronic mounting technology and printed circuit board manufacturing technology.

With the development of emerging industries such as LED lighting, especially the rapid increase in the scale of the LED lighting market, as an indispensable raw material in the electronics industry, the demand for aluminum-based copper-clad laminates in the electronics industry is increasing day by day, especially the development of LED technology. LED The brightness of the chip is getting higher and higher, and the technical requirements for the thermal conductivity of the aluminum-based copper-clad laminate are getting higher and higher. Now the aluminum-based copper-clad laminate produced by the traditional semi-solid film has been difficult to meet the continuously improving requirements of its technology. In addition, the traditional aluminum The production process of copper-clad laminates has many shortcomings such as low production capacity, large energy consumption, large equipment investment, and high equipment maintenance costs. It is difficult to meet the huge demand in the future market and the continuous improvement of technology. .

Contents of the invention

The invention provides a production method of aluminum-based copper-clad laminates and its products. The invention adopts the method of roller pressing and bonding to produce its production, which has low investment, simple production process, and convenient operation. The performance of the finished product can completely replace the traditional glass fiber cloth to make aluminum The quality requirement of the substrate, and this is the main purpose of the present invention.

The technical solution adopted in the present invention is: a production method of aluminum-based copper-clad laminates. The production method adopts roller pressing and synchronous bonding to attach the adhesive layer and copper film layer to the aluminum substrate for production, which specifically includes The following production steps:

The first step is to press the thermally conductive insulating layer on the surface of the aluminum substrate by rolling, and use a laminating machine to press the thermally conductive insulating layer on the surface of the aluminum substrate to obtain the first step semi-finished product. The temperature of the pressing roller of the laminating machine is between 110-130 degrees, and the pressing speed is controlled at 0.5-1.5 meters per minute. In the first step of pressing, it is necessary to ensure that the heat-conducting insulating layer is completely attached to the aluminum substrate. After the pressing process is completed, the semi-finished product of the first step is left to cool down to room temperature, and then the release transparent film layer on the thermally conductive insulating layer is peeled off.

In the second step, the semi-finished product of the first step in the first step is exhausted and shaped, and the semi-finished product of the first step in the first step is stripped off the transparent film layer into the heating device, and the inside of the heating device is controlled The temperature is between 140-150 degrees, and the placement time is 9-10 minutes, and the semi-finished product of the first step is heat-preserved and shaped.

The third step is to carry out the copper pressing process on the semi-finished product of the first step after being shaped in the second step. First, use the roller copper foil pressing method to press the copper foil on the aluminum substrate by using the roller copper foil pressing machine In the third step, the semi-finished product is obtained. The copper foil is pressed on the other side of the aluminum substrate relative to the heat-conducting insulating layer. During the third step of pressing, the roller temperature of the roller copper foil pressing machine is controlled at 130- Between 150 degrees, control the pressing force of the roller copper foil pressing machine at 5-10 kg/cm2, and then put the third-step semi-finished product into the heating device for deep hardening treatment, and control the internal temperature of the heating device at 170 Between -180 degrees, the placement time is 30-60 minutes. After that, the third-step semi-finished product is taken out from the heating device and cooled to room temperature, thereby completing the cooling and shaping of the third-step semi-finished product to obtain a finished product.

In the first step, the aluminum substrate is a cold-rolled or hot-rolled aluminum plate, and the aluminum substrate has not been subjected to hole-sealing and anodic oxidation treatment.

The heating device in the second step and the third step is an oven or a tunnel furnace.

In the process of the third step, the copper foil is pressed on the aluminum substrate by a flat pressing machine to obtain the semi-finished product of the third step. First, the copper foil is laid on the aluminum substrate relative to the heat conducting insulating layer The other side of the substrate is sent to the flat press machine for pressing. During the pressing process, the pressing part is vacuumed and pressure is applied at one time. The pressing force is controlled at 35-45 kg/cm2. Then, the semi-finished product of the third step is Put it into the heating device for deep hardening treatment, control the internal temperature of the heating device between 170-180 degrees, and put it in for 30-60 minutes. After that, take the third-step semi-finished product out of the heating device and cool it to room temperature , thereby completing the cooling and shaping of the third-step semi-finished product to obtain a finished product.

In the first step, several layers of the thermally conductive insulating layer may be laminated on the surface of the aluminum substrate by rolling.

In the case of laminating two layers of the thermally conductive insulating layer, the thickness of the two layers of the thermally conductive insulating layer is 50 microns.

And the peel strength of the aluminum-based copper-clad laminate produced by the production method of the aluminum-based copper-clad laminate is 1.90N/mm after thermal stress, the surface resistance is 7.8×10^9MΩ in the delivery state, and the volume electronegativity is 7.8×10^9MΩ in the delivery state. The thermal resistance is 7.2×10^8MΩ.m, the thermal resistance is 0.48°C/W, the dielectric constant is 3.9, the dielectric loss factor is 0.021, the thermal conductivity is 2W/m.°C, and the immersion-resistant solder is not 180S at 260°C. Delamination, non-foaming, breakdown voltage 3KV, arc resistance 280S.

The performance of the aluminum-based copper-clad laminate produced by the production method of the aluminum-based copper-clad laminate is determined by controlling the number and thickness of the heat-conducting insulating layer.

When the thermal insulation layer has two layers and its thickness is 50 microns, the breakdown voltage of the aluminum-based copper-clad laminate is DC 3KV, the thermal stress is 288°C 180s, and the thermal conductivity is 1.2-1.5w/mk. The resistance is 0.48°C/W.

When the thermal insulation layer has three layers and its thickness is 75 microns, the breakdown voltage of the aluminum-based copper-clad laminate is DC 4KV, the thermal stress is 288°C 180s, and the thermal conductivity is 1.2-1.5w/mk. The resistance is 0.5°C/W.

When the number of layers of the thermal insulating layer is four and its thickness is 100 microns, the breakdown voltage of the aluminum-based copper clad laminate is DC 5KV, the thermal stress is 288°C for 180s, and the thermal conductivity is 1.2-1.5w/mk. The resistance is 0.56°C/W.

An aluminum-based copper-clad laminate, comprising an aluminum substrate layer, a thermally conductive insulating layer, a copper foil layer, and a release-type transparent film layer, wherein the aluminum substrate layer has a first bonding surface and a second bonding surface, and the thermally conductive insulating layer The bottom surface is attached to the first pressing surface of the aluminum substrate layer, the copper foil layer is attached to the second pressing surface of the aluminum substrate layer, and the release transparent film layer is attached to the thermally conductive insulating layer on the top surface. The heat conducting insulating layer is composed of several insulating layers.

The beneficial effects of the present invention are: the product produced by the method of the present invention has a thin adhesive layer and strong voltage resistance, which can make the heat of the copper foil reach the aluminum plate quickly and play the role of high-speed heat conduction and heat dissipation. The production process is convenient and easy to use. This technology can realize high-speed production without stopping, and get rid of the problem of using semi-solid sheets and supporting large-scale laminator production equipment, which requires large investment and low efficiency. It solves the advantages of the product in the production process of aluminum-based copper-clad laminates, such as fast speed, simple process, and good stability.

Description of drawings

Fig. 1 is a structural sectional view of a product produced by the method of the present invention.

Fig. 2 is a structural cross-sectional view of an aluminum-based copper-clad laminate according to the present invention.

Detailed ways

As shown in Figure 1, a production method of an aluminum-based copper-clad laminate, the production method adopts roller pressing and synchronous bonding to attach the adhesive layer and the copper film layer to the aluminum substrate for production, which is carried out according to the method of the present invention The production has the characteristics of less investment, simple production process and convenient operation.

It specifically includes the following production steps:

In the first step, the thermally conductive insulating layer 20 is laminated on the surface of the aluminum substrate 10 by rolling.

The aluminum substrate 10 is a cold-rolled or hot-rolled aluminum plate, and the aluminum substrate 10 has not undergone hole-sealing and anodic oxidation treatment.

Use a laminating machine to press the thermally conductive insulating layer 20 on the surface of the aluminum substrate 10 to obtain the first-step semi-finished product. During the laminating process, control the temperature of the pressing roller of the laminating machine between 110-130 degrees, and control The pressing speed is 0.5-1.5 meters per minute.

In the first step of pressing, it is necessary to ensure that the thermally conductive insulating layer 20 is completely bonded to the aluminum substrate 10 without bubbles or wrinkles.

After the pressing process is completed, the semi-finished product of the first step is left to cool down to room temperature, and then the release transparent film layer 21 on the thermally conductive insulating layer 20 is peeled off.

The second step is to exhaust and shape the semi-finished product of the first step in the first step.

Put the semi-finished product of the first step that has been peeled off the release-type transparent film layer 21 in the first step into the heating device, control the internal temperature of the heating device between 140-150 degrees, and the insertion time is 9-10 minutes. In the first step, the semi-finished product is heat-preserved and shaped.

The third step is to perform copper pressing on the semi-finished product of the first step after being shaped in the second step.

Firstly, the copper foil 40 is pressed on the aluminum substrate 10 by a roller copper foil pressing machine to obtain a semi-finished product in the third step.

The copper foil 40 is pressed on the other side of the aluminum substrate 10 relative to the thermally conductive insulating layer 20 .

In the pressing process of the third step, the roller temperature of the roller copper foil pressing machine is controlled between 130-150 degrees, and the pressing force of the roller copper foil pressing machine is controlled at 5-10 kg/cm2.

Then, put the third-step semi-finished product into a heating device for deep hardening treatment, control the internal temperature of the heating device between 170-180 degrees, and put it in for 30-60 minutes.

Afterwards, the third-step semi-finished product is taken out from the heating device and cooled to room temperature, thereby completing the cooling and shaping of the third-step semi-finished product to obtain a finished product.

During specific implementation, in the third step, the copper foil 40 may also be pressed onto the aluminum substrate 10 by means of a flat pressing machine.

Firstly, the copper foil 40 is pressed onto the aluminum substrate 10 by a flat pressing machine to obtain the semi-finished product in the third step.

The copper foil 40 is laid on the other side of the aluminum substrate 10 relative to the thermally conductive insulating layer 20 and sent to a flat press machine for pressing.

During the pressing process, the pressing part is vacuumed and pressure is applied at one time, and the pressing force is controlled at 35-45 kg/cm2.

Then, put the third-step semi-finished product into a heating device for deep hardening treatment, control the internal temperature of the heating device between 170-180 degrees, and put it in for 30-60 minutes.

Afterwards, the third-step semi-finished product is taken out from the heating device and cooled to room temperature, thereby completing the cooling and shaping of the third-step semi-finished product to obtain a finished product.

The heating device in the second step and the third step is an oven or a tunnel furnace.

During specific implementation, in the first step, several layers of the thermally conductive insulating layer 20 may be laminated on the surface of the aluminum substrate 10 by rolling.

In the case of laminating two layers of the thermally conductive insulating layer 20 , the thickness of the two layers of the thermally conductive insulating layer 20 is 50 microns.

The aluminum-based copper-clad laminate produced by the production method of the aluminum-based copper-clad laminate is produced when two layers of the heat-conducting insulating layer 20 are laminated and the thickness of the two layers of the heat-conducting insulating layer 20 is 50 microns.

The peel strength is 1.90N/mm after thermal stress, the surface resistance is 7.8×10^9MΩ in the delivery state, the volume electronegativity is 7.2×10^8MΩ.m in the delivery state, and the thermal resistance is 0.48℃/W. The dielectric constant is 3.9, the dielectric loss factor is 0.021, the thermal conductivity is 2W/m.℃, the immersion-resistant solder does not delaminate or bubble at 260℃ for 180S, the breakdown voltage is 3KV, and the arc resistance is 280S .

In addition, the performance of the aluminum-based copper-clad laminate produced by the production method of the aluminum-based copper-clad laminate can be determined by controlling the number and thickness of the heat-conducting insulating layer 20 .

When the thermally conductive insulating layer 20 has two layers and its thickness is 50 microns, the breakdown voltage of the aluminum-based copper clad laminate is DC 3KV, the thermal stress is 288°C for 180s, and the thermal conductivity is 1.2-1.5w/mk. The thermal resistance is 0.48°C/W.

When the thermally conductive insulating layer 20 has three layers and its thickness is 75 microns, the breakdown voltage of the aluminum-based copper-clad laminate is DC 4KV, the thermal stress is 288°C for 180s, and the thermal conductivity is 1.2-1.5w/mk. The thermal resistance is 0.5°C/W.

When the number of layers of the thermally conductive insulating layer 20 is four and its thickness is 100 microns, the breakdown voltage of the aluminum-based copper-clad laminate is DC 5KV, the thermal stress is 288°C for 180s, and the thermal conductivity is 1.2-1.5w/mk, The thermal resistance is 0.56°C/W.

During specific implementation, a protective film 41 is also attached to the copper foil 40 .

As shown in Figure 2, an aluminum-based copper-clad laminate includes an aluminum substrate layer 1, a thermally conductive insulating layer 2, a copper foil layer 3, and a release-type transparent film layer 4, wherein the aluminum substrate layer 1 has a first bonding surface 11 and the second bonding surface 12, the bottom surface of the thermally conductive insulating layer 2 is bonded to the first bonding surface 11 of the aluminum substrate layer 1, and the copper foil layer 3 is bonded to the first bonding surface 1 of the aluminum substrate layer 1. On the two pressing surfaces 12 , the release transparent film layer 4 is bonded to the top surface of the heat conducting insulating layer 2 .

The aluminum substrate layer 1 , the thermally conductive insulating layer 2 , the copper foil layer 3 and the release transparent film layer 4 are sequentially bonded together to form the aluminum-based copper-clad laminate of the present invention.

The aluminum substrate layer 1 is a cold-rolled or hot-rolled aluminum plate, and the heat-conducting insulating layer 2 is composed of several insulating layers during actual implementation.

During specific implementation, a protective film 5 is also attached to the copper foil 3 .

Claims (9)

1. the production method of an aluminium base copper-clad plate is characterized in that: this production method adopt roller pressing and synchronously bonding mode with glue-line and copper film layer attached to producing on the aluminium base, it specifically comprises following production stage:

The first step, adopt the mode pressing heat conductive insulating layer of roll extrusion on aluminium base surface; Utilize laminating machine that this heat conductive insulating lamination is combined on this aluminium base surface, obtain first step semi-finished product, the nip roll temperature of this laminating machine of control is between the 110-130 degree in the process of pressing; The control pressing speed is at per minute 0.5-1.5 rice; Need in the process of the pressing of the first step to guarantee that this heat conductive insulating layer and this aluminium base fit fully, bubble can not occur or the Zhe that wrinkles, the process of accomplishing pressing leaves standstill cool to room temperature with these first step semi-finished product afterwards; Afterwards the release transparent film layer on this heat conductive insulating layer is peeled off

Second the step, these first step semi-finished product in the first step are carried out exhaust and typing; These first step semi-finished product that peel off release transparent film layer in the first step are inserted in the heater; Control heater internal temperature is between the 140-150 degree; The time of inserting is 9-10 minute, and these first step semi-finished product are incubated typing

The 3rd step, press copper to handle, at first, adopt the mode of roller Copper Foil pressing to utilize roller Copper Foil pressing machine that Copper Foil is pressed together on this aluminium base these first step semi-finished product in second step through after the typing; Obtain the 3rd step semi-finished product; This Copper Foil is combined in the other one side of this aluminium base with respect to this heat conductive insulating lamination, and the bowl temperature of this roller Copper Foil pressing machine of control is between the 130-150 degree in the pressing process in the 3rd step, and the pressure force of controlling this roller Copper Foil pressing machine is in the 5-10 kg/cm; Then; The 3rd step semi-finished product are inserted carry out depth-hardened in the heater and handle, control heater internal temperature is between the 170-180 degree, and the time of inserting is 30-60 minute; Afterwards; The 3rd step semi-finished product are taken out under the cool to room temperature condition from heater, thereby accomplish, obtain finished product the 3rd half-finished cooling of step and typing.

2. the production method of a kind of aluminium base copper-clad plate as claimed in claim 1 is characterized in that: this aluminium base is that cold bundle or heat are pricked aluminium sheet in the first step, and this aluminium base does not pass through the sealing of hole anodized.

3. the production method of a kind of aluminium base copper-clad plate as claimed in claim 1 is characterized in that: the heater in second step and the 3rd step is baking box or continuous tunnel furnace.

4. the production method of a kind of aluminium base copper-clad plate as claimed in claim 1 is characterized in that: in the process of carrying out for the 3rd step, adopt the mode of concora crush to utilize spreader bar that Copper Foil is pressed together on this aluminium base, obtain the 3rd step semi-finished product; At first, the other one side that this Copper Foil is laid on this aluminium base with respect to this heat conductive insulating layer is sent into spreader bar and is carried out pressing, in the pressing process, pressing is partly vacuumized disposable the exerting pressure in back; The control pressure force is in the 35-45 kg/cm, then, the 3rd step semi-finished product inserted carry out depth-hardened in the heater and handle; Control heater internal temperature is between the 170-180 degree; The time of inserting is 30-60 minute, afterwards, from heater, takes out the 3rd step semi-finished product under the cool to room temperature condition; Thereby accomplish the 3rd half-finished cooling of step and typing, obtain finished product.

5. the production method of a kind of aluminium base copper-clad plate as claimed in claim 1 is characterized in that: this heat conductive insulating layer of mode pressing several layers that in the first step, can adopt roll extrusion on the aluminium base surface.

6. the production method of a kind of aluminium base copper-clad plate as claimed in claim 5, it is characterized in that: under the situation of two-layer this heat conductive insulating layer of pressing, the thickness of two-layer this heat conductive insulating layer is 50 microns,

And the peel strength of the aluminium base copper-clad plate that the production method of utilizing this aluminium base copper-clad plate is produced is 1.90N/mm after thermal stress, and sheet resistance is 7.8 * 10^9M Ω in the acceptance attitude, and the volume resistor rate is 7.2 * 10^8M Ω .m in the acceptance attitude; Thermal resistance is 0.48 ℃/W, and dielectric constant is 3.9, and dielectric dissipation factor is 0.021; Thermal conductivity factor is 2W/m. ℃; 180S under 260 ℃ condition is not stratified, non-foaming for the tin of anti-immersed solder, and breakdown voltage is 3KV, and arc resistance is 280S.

7. the production method of a kind of aluminium base copper-clad plate as claimed in claim 5 is characterized in that: the number of plies through controlling this heat conductive insulating layer and thickness confirm to utilize the performance of the aluminium base copper-clad plate that the production method of this aluminium base copper-clad plate produces,

The number of plies at this heat conductive insulating layer is two-layer, and when its thickness was 50 microns, the breakdown voltage of aluminium base copper-clad plate was DC 3KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.48 ℃/W,

The number of plies at this heat conductive insulating layer is three layers, and when its thickness was 75 microns, the breakdown voltage of aluminium base copper-clad plate was DC 4KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.5 ℃/W,

The number of plies at this heat conductive insulating layer is four layers, and when its thickness was 100 microns, the breakdown voltage of aluminium base copper-clad plate was DC 5KV, and thermal stress is 288 ℃ of 180s, and thermal conductivity factor is 1.2-1.5w/mk, and thermal resistance is 0.56 ℃/W.

8. aluminium base copper-clad plate; It is characterized in that: comprise aluminium base flaggy, heat conductive insulating layer, copper foil layer and release transparent film layer; Wherein, this aluminium base flaggy has first stitching surface and second stitching surface, and the bottom surface of this heat conductive insulating layer is fitted on this first stitching surface of this aluminium base flaggy; This copper foil layer is fitted on this second stitching surface of this aluminium base flaggy, and this release transparent film layer is fitted on the end face of this heat conductive insulating layer.

9. a kind of aluminium base copper-clad plate as claimed in claim 8 is characterized in that: this heat conductive insulating layer is made up of the several layers insulating barrier.

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