CN102575201B - Cleaning solution composition for substrate for preparation of flat panel display - Google Patents

Abstract

The present invention relates to an aqueous cleaning solution composition comprising one or more kinds of compounds selected from a boric acid derivative, an organic phosphoric acid and salts thereof, used for cleaning the surface of a substrate during a manufacturing process of a flat panel display. The aqueous cleaning solution composition of the present invention has excellent removing power of the contamination due to organic materials or particles generated on a substrate during a manufacturing process of a flat panel display, and has excellent corrosion prevention of a metal interconnect formed on a substrate. In addition, the aqueous cleaning solution composition of the present invention contains a large amount of deionized water and thus can be easily handled and is environmentally advantageous.

Description

Cleaning liquid composition for substrate of flat panel display

technical field

The present invention relates to an aqueous cleaning composition suitable for cleaning the surface of a substrate used in the manufacture of flat-panel displays, including liquid crystal displays, plasma displays, organic electroluminescent displays, flexible displays, etc., and a method for cleaning substrates using the same composition Methods.

Background technique

Flat panel displays (FPDs) generally exemplified by liquid crystal displays are fabricated by film formation, exposure, etching, and the like. Since very small particles having a size of 1 μm or less such as various organic or inorganic materials may adhere to the surface of the substrate in each manufacturing process, causing contamination unpredictably. Since such contamination by particles reduces the productivity of the plant, it should be minimized as much as possible before proceeding to subsequent processes.

Therefore, cleaning is performed between processes to remove contaminants. This cleaning solution is being thoroughly researched. For example, Japanese Unexamined Patent Publication No. 2000-232063 discloses a cleaning solution comprising phosphoric acid and ammonium phosphate, and Japanese Unexamined Patent Publication No. Ping (Hei.) 9-279189 and Japanese Unexamined Patent Publication No. No. 2001-26890 discloses an aqueous cleaning solution. However, these techniques are mainly related to cleaning agents used in semiconductor devices, and are disadvantageous because the ability to remove contaminants and anti-corrosion performance to aluminum (Al) wiring do not coexist well.

In addition, Japanese Unexamined Patent Publication No. Hei. 10-55993 discloses a stripper composition comprising quaternary ammonium salt or ammonium organic carboxylate and ammonium fluoride as a cleaning agent for preventing corrosion of metal layers. agents, aqueous organic solvents, and inorganic or organic acids. However, this composition is used to remove residual deposits after ashing resists for semiconductor devices, and the ammonium fluoride component of the composition severely corrodes Al wiring, so it is not suitable for cleaning substrates.

Contents of the invention

Accordingly, an object of the present invention is to provide an aqueous cleaning composition which can effectively remove organic pollutants or particles generated on a substrate during the manufacture of an FPD, but does not corrode the substrate used to form a gate electrode. and metal wiring for source/drain electrodes.

One aspect of the present invention provides an aqueous cleaning composition for manufacturing FPDs, comprising a boric acid component, one or more compounds selected from organic phosphoric acid and its salts, and water.

The aqueous cleaning composition may comprise, based on the total weight of the composition, 0.01 to 20 wt% of a boric acid component, 0.01 to 20 wt% of one or more compounds selected from organic phosphoric acid and its salts, and the remainder Measure water.

In addition, the aqueous cleaning composition may further include one or more selected from the group consisting of organic basic compounds, glycol ether compounds, and alkanolamine salt compounds.

Another aspect of the present invention provides a method of cleaning a substrate for manufacturing an FPD, comprising cleaning the substrate using the above-mentioned aqueous cleaning composition while maintaining the aqueous cleaning composition at 20-80°C.

Another aspect of the present invention provides a method of manufacturing an FPD, comprising cleaning a substrate for an FPD using the above-mentioned aqueous cleaning composition while maintaining the aqueous cleaning composition at 20˜80° C.

According to the present invention, the aqueous cleaning composition can highly remove organic pollutants or particles generated on the substrate during the manufacture of the FPD, and is also very effective in preventing the formation of Al, Al alloy, copper (Cu), or copper alloy on the substrate. Corrosion of metal wiring. In addition, the aqueous cleaning composition includes a large amount of deionized water and is thus easy to handle and environmentally friendly.

Detailed ways

The present invention relates to an aqueous cleaning composition for manufacturing FPD, comprising a boric acid component, one or more compounds selected from organic phosphoric acid and its salts, and water.

The aqueous cleaning composition comprises, based on the total weight of the composition, 0.01 to 20 wt% of a boric acid component, 0.01 to 20 wt% of one or more compounds selected from organic phosphoric acid and its salts, and the balance water.

In the aqueous cleaning composition according to the present invention, the boric acid component is effectively dissolved in water, thereby emulsifying organic pollutants so as to prevent the re-adhesion of these pollutants, and exhibit an excellent anti-corrosion effect on the metal of the FPD substrate .

The amount of the boric acid component may be 0.01-20 wt%, preferably 0.1-10 wt%, of the total weight of the composition. If the amount of the boric acid component is less than 0.01% by weight, the antiseptic effect and the emulsification effect of pollutants may deteriorate. In contrast, if the amount thereof exceeds 20% by weight, the composition may increase in viscosity, thereby reducing the cleaning effect.

The boric acid component is not particularly limited, and includes, for example, boric acid, its salts, its oxides, and its dehydrates, and specific examples thereof include alkyl-substituted borates such as tetraphenylammonium borate ((C ₆ H ₅ ) ₄ BNH ₄ ), phenylboronic acid (C ₆ H ₅ B(OH) ₂ ) and trimethylboroxane (C ₃ H ₉ B ₃ O ₃ ); polyborates such as ammonium pentaborate octahydrate (NH ₄ ) ₂ B ₁₀ O ₁₆ ·8H ₂ O), ammonium tetraborate tetrahydrate ((NH ₄ ) ₂ B4O ₇ ·4H ₂ O), potassium tetraborate tetrahydrate (K ₂ B ₄ O ₇ ·4H ₂ O ) and sodium octaborate tetrahydrate (Na ₂ B ₈ O ₁₃ ·4H ₂ O); fluorine-substituted borates such as fluoroboric acid (HBF ₄ ) and ammonium tetrafluoroborate (NH ₄ BF ₄ ); boric acid esters such as boric acid Trimethyl ester ((CH ₃ O) ₃ B) and triethyl borate ((C ₂ H ₅ O) ₃ B); oxides and dehydrates of boric acid, such as boron monoxide ((BO)X), boric anhydride ( B ₂ O ₃ ), potassium metaborate (KBO ₂ ) and sodium perborate (NaBO ₃ ).

A particularly useful boric acid component is boric acid; or polyborates such as ammonium pentaborate octahydrate ((NH ₄ ) ₂ B ₁₀ O ₁₆ ·8H ₂ O), ammonium tetraborate tetrahydrate ((NH ₄ ) ₂ B ₄ O ₇ ·4H ₂ O), potassium tetraborate tetrahydrate (K ₂ B ₄ O ₇ ·4H ₂ O), or sodium octaborate tetrahydrate (Na ₂ B ₈ O ₁₃ ·4H ₂ O).

In the aqueous cleaning composition according to the present invention, the one or more compounds selected from organic phosphoric acid and its salts are very effective in preventing corrosion of Al or Al alloys, and are also very effective in removing The upper surface of the substrate is freed of organic contaminants or particles. In addition, this component can function to adjust the overall pH of the cleaning composition, and thus plays an important role in the good coexistence of anti-corrosion effect of metal and cleaning effect.

In addition, the one or more compounds selected from organic phosphoric acid and salts thereof can remove pollutants more effectively when used together with an organic basic compound.

In the cleaning composition according to the present invention, the amount of one or more compounds selected from organic phosphoric acid and its salts is 0.01 to 20 wt%, preferably 0.1 to 5 wt%, of the total weight of the composition . If the amount of the one or more compounds selected from organic phosphoric acid and its salts is less than 0.01 wt%, the corrosion resistance of the cleaning composition to metals may deteriorate, and the ability to remove organic pollutants or particles may become less noticeable. In contrast, if the amount thereof exceeds 20 wt%, the pH of the cleaning composition may decrease, thereby unpredictably reducing the ability to remove organic and inorganic pollutants, and increasing costs and environmental concerns.

Examples of the organic phosphoric acid and salts thereof include aminotris(methylenephosphonic acid), ethylenediphosphonic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, 1-hydroxypropylene- 1,1-diphosphonic acid, 1-hydroxybutylene-1,1-diphosphonic acid, ethylaminobis(methylenephosphonic acid), 1,2-propanediamine tetrakis(methylenephosphonic acid), Dodecylaminobis(methylenephosphonic acid), nitrotris(methylenephosphonic acid), ethylenediaminebis(methylenephosphonic acid), ethylenediaminetetra(methylenephosphonic acid), hexane Diethylenediaminetetra(methylenephosphonic acid), diethylenetriaminepenta(methylenephosphonic acid), cyclohexanediaminetetrakis(methylenephosphonic acid), hydroxyphosphineacetic acid, 2-phosphinebutane-1, 2,4-tricarboxylic acids, and the sodium or potassium salts of these organophosphates.

Particularly useful are (1-hydroxyethylidene)-1,1-diphosphonic acid, hydroxyphosphonoacetic acid, aminotrimethylenephosphonic acid, 2-phosphinobutane-1,2,4-tricarboxylic acid, or Its sodium or potassium salt.

In the cleaning composition according to the present invention, the water is preferably deionized water, and the amount used is such that the sum of the components of the aqueous cleaning composition according to the present invention is 100 wt%.

In addition, in addition to the above components, the cleaning composition for the substrate of the FPD according to the present invention may further include an organic basic compound, a glycol ether compound, and an alkanolamine salt compound. one or more of .

The function of the organic basic compound is to sufficiently remove fine particles, organic pollutants and inorganic pollutants, and to prevent corrosion of Al or Al alloy wiring.

The amount of the organic basic compound is 0.05-10 wt%, preferably 0.1-5 wt%, of the total weight of the composition. When the amount of the organic basic compound falls within the above range, fine particles, organic pollutants, and inorganic pollutants can be sufficiently removed, and serious corrosion of Al or Al alloy wiring due to too high pH can be avoided. question.

Examples of the organic basic compound include quaternary ammonium salt compounds such as ammonium hydroxide, tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), tetrapropylammonium hydroxide (TPAH) and tetrahydroxide Butyl ammonium (TBAH); primary amines such as methylamine, ethylamine, isopropylamine, and monoisopropylamine; secondary amines such as diethylamine, diisopropylamine, and dibutylamine; tertiary amines such as trimethylamine, triethylamine amines, triisopropylamine and tributylamine; and alkanolamines such as choline, monoethanolamine, diethanolamine, 2-aminoethanol, 2-(ethylamino)ethanol, 2-(methylamino)ethanol, N- Methyldiethanolamine, dimethylaminoethanol, diethylaminoethanol, nitrogen triethanol, 2-(2-aminoethoxy)ethanol, 1-amino-2-propanol, triethanolamine, monopropyl Alcoholamine and dibutanolamine, which can be used alone or in combination of two or more.

Particularly useful organic basic compounds are ammonium hydroxide, tetramethylammonium hydroxide, or monoethanolamine.

The function of the glycol ether compound is a solvent for dissolving organic pollutants. In addition to functioning as a solvent, this component lowers the surface tension of the cleaning solution, thereby increasing the wettability of the glass substrate, thereby improving the cleaning ability of the cleaning composition.

The glycol ether compound may be used in an amount of 0.05-40 wt%, preferably 0.5-20 wt%, of the total weight of the composition.

When the amount of the glycol ether compound falls within the above range, the ability of the cleaning solution to dissolve organic pollutants can be improved, and the wettability can be increased to fully achieve the desired effect.

Examples of the glycol ether compound include ethylene glycol monobutyl ether (BG), diethylene glycol monomethyl ether (MDG), diethylene glycol monoethyl ether (carbitol), diethylene glycol Alcohol monobutyl ether (BDG), dipropylene glycol monomethyl ether (DPM), dipropylene glycol monoethyl ether (MFDG), triethylene glycol monobutyl ether (BTG), triethylene glycol monoethyl ether ( MTG), and propylene glycol monomethyl ether (MFG), which can be used alone or in combination of two or more.

The function of the alkanolamine salt compound is to prevent metal corrosion and excessive etching of the oxide layer when cleaning the substrate with the metal pattern and the oxide layer, and to inhibit the pH change of the cleaning solution. The salt production temperature for obtaining the alkanolamine salt compound can be set as low as possible, preferably maintained at 90°C or lower.

The alkanol portion of the alkanolamine salt compound is selected from lower alkanols such as C1 to C5 alkanols. Since one or more alkanol groups can be attached to the amine group, other alkanolamine salt compounds in which another substituent is attached to the amine group can be used, such as dimethylmethanolamine salt.

Specific examples of the alkanolamine salt compound include alkanolamine salts such as monoethanolamine salts, diethanolamine salts, triethanolamine salts, monoisopropanolamine salts, diisopropanolamine salts, and triisopropanolamine salts. .

The alkanolamine salt compound may include commercially available products, for example, AB RUST CM (from LABEMA Company), AB RUST A4 (from LABEMA Company), EMADOX-NA (from LABEMA Company), EMADOX-NB (from LABEMA Company) From LABEMA Company), EMADOX-NCAL (from LABEMA Company), EMADOX-102 (from LABEMA Company), EMADOX-103 (from LABEMA Company), EMADOX-D520 (from LABEMA Company), and AB RUST AT (from LABEMA Company) available from LABEMA).

The amount of the alkanolamine salt compound may be 0.001-1.0 wt%, preferably 0.01-0.5 wt%, of the total weight of the composition. When the amount of the alkanolamine salt compound falls within the above range, a better anti-corrosion effect can be obtained because the surface of the metal is protected by the coating effect.

In addition to the above components, the cleaning composition according to the present invention may further include an aqueous nonionic surfactant.

Examples of the aqueous nonionic surfactant include polyoxyethylene alkyl ether type, polyoxyethylene alkylphenyl ether type, polyoxyethylene polyoxypropylene alkyl ether type, polyoxyethylene polyoxybutylene alkyl ether type , polyoxyethylene alkylamino ether type, polyoxyethylene alkamide ether type, polyethylene glycol fatty acid ester type, sorbitan fatty acid ester type, glycerin fatty acid ester type, alcohol amide type, and glyceride type, They may be used alone or in combination of two or more.

The nonionic surfactant has a molecular structure comprising an oxyethylene group (EO group) as a hydrophilic group, and an oxypropylene group (PO group) and/or an oxybutylene group (BO group) as a hydrophobic group , and can be polyoxyethylene polyoxybutylene alkyl ether copolymer. Where -CH ₂ -CH ₂ -O- represents EO group, -CH(CH ₃ )-CH ₂ -O- or -CH ₂ -CH(CH ₃ )-O- represents PO group, and -CH ₂ -CH ₂ -CH ₂ -CH ₂ -O-, -CH(CH ₃ )-CH ₂ -CH ₂ -O-, -CH ₂ -CH(CH ₃ )-CH ₂ -O- or -CH ₂ -CH ₂ -CH (CH ₃ ) ₂ -O- represents a BO group. The copolymerized portion of EO and PO/BO can be a block copolymer, a random copolymer, or a random multi-block copolymer. Copolymer molecules may include EO-PO copolymers, EO-BO copolymers, or EO-PO/BO copolymers. In the molecule that comprises the surfactant of hydrophilic EO group and hydrophobic PO or BO group, when the total number of moles of EO group is X and the total number of moles of PO or BO group is Y, preferred X/( X+Y) falls within the range of 0.05 to 0.7. The terminal of the surfactant may be hydrogen, hydroxyl, alkyl, or alkenyl, or may be a structure to which ethylenediamine or glycerin is added.

Examples of nonionic surfactants satisfying the above requirements include polyoxyethylene/polyoxypropylene complexes, polyoxyethylene/polyoxybutylene complexes, polyoxyethylene/polyoxypropylene decyl ether complexes, polyoxyethylene/polyoxypropylene Polyoxypropylene decyl ether compound, polyoxyethylene/polyoxypropylene undecyl ether compound, polyoxyethylene/polyoxypropylene lauryl ether compound, polyoxyethylene/polyoxypropylene tetradecyl ether compound Ether compound, polyoxyethylene/polyoxybutylene decyl ether compound, polyoxyethylene/polyoxybutylene undecyl ether compound, polyoxyethylene/polyoxybutylene lauryl ether compound, Polyoxyethylene/polyoxybutylene myristyl ether complex, polyoxyethylene/polyoxypropylene 2-ethylhexyl ether, polyoxyethylene/polyoxypropylene lauryl ether, polyoxyethylene/polyoxypropylene stearin Base ether, polyoxyethylene/polyoxypropylene compound with glycerin, polyoxyethylene/polyoxypropylene compound with ethylenediamine, polyoxyethylene/polyoxybutylene 2-ethylhexyl ether, polyoxyethylene Ethylene/polyoxybutylene lauryl ether, polyoxyethylene/polyoxybutylene stearyl ether, polyoxyethylene/polyoxybutylene compound with glycerin, and polyoxyethylene/polyethylene glycol with ethylenediamine Oxybutylene compound.

Particularly useful nonionic surfactants are polyoxyethylene/polyoxypropylene complexes, polyoxyethylene/polyoxybutylene complexes, polyoxyethylene/polyoxypropylene complexes with added glycerin, or polyoxyethylene/polyoxypropylene compounds with added ethylenediamine Polyoxyethylene/polyoxypropylene composites, and more particularly useful are polyoxyethylene/polyoxypropylene composites, or polyoxyethylene/polyoxypropylene composites with ethylenediamine added.

The amount of the surfactant is 0.001-1.0 wt% of the total weight of the composition.

The cleaning composition according to the present invention can exhibit excellent cleaning effect at a temperature range of 20°C to 80°C, preferably 20°C to 50°C.

In addition, the present invention relates to a method for cleaning FPD, comprising cleaning the FPD with the above-mentioned cleaning composition, while keeping the aqueous cleaning composition at 20-80°C.

Examples of FPDs include liquid crystal displays, plasma displays, organic electroluminescent displays, and flexible displays.

The following examples are illustrative, not limiting, and may provide a better understanding of the invention.

Examples 1-17 and Comparative Examples 1-3: Preparation of cleaning composition

The organic basic compound, polar protic organic solvent, preservative, multifunctional additive (alkanolamine salt), boric acid component, and aqueous surfactant were mixed in the following Table 1 to prepare an aqueous cleaning composition.

Table 1

(Unit: wt%)

A-1: Tetramethylammonium hydroxide

A-2: Tetraethylammonium hydroxide

A-3: Monoethanolamine

B-1: Diethylene glycol monomethyl ether (MDG)

B-2: Diethylene glycol monobutyl ether (BDG)

C-1: 1-hydroxyethylidene-1,1-diphosphonic acid

C-2: 2-phosphinobutane-1,2,4-tricarboxylic acid

D-1: EMADOX-NB (from LABEMA Corporation)

D-2: EMADOX-D520 (obtained from LABEMA company)

E-1: Sodium octaborate tetrahydrate (Na ₂ B ₈ O ₁₃ 4H ₂ O)

E-2: Ammonium tetraborate tetrahydrate ((NH ₄ ) ₂ B ₄ O ₇ 4H ₂ O)

F-1: Polyoxyethylene/polyoxypropylene compound

F-2: Polyoxyethylene/polyoxypropylene ethylenediamine compound

Test Example: Evaluation of Performance of Aqueous Cleaning Compositions

<Evaluation of anti-corrosion performance>

的Cu的玻璃基板在实施例1～17及对比例1～3的各清洗组合物中浸泡30分钟。此时清洗组合物的温度为40℃。测量浸泡前后的金属层的厚度，然后由金属层厚度的此变化计算金属层的溶解速率。其结果见下表2。will have a thickness of Al and thickness of

The Cu glass substrates were immersed in the cleaning compositions of Examples 1-17 and Comparative Examples 1-3 for 30 minutes. At this time, the temperature of the cleaning composition was 40°C. The thickness of the metal layer before and after immersion was measured, and then the dissolution rate of the metal layer was calculated from this change in the thickness of the metal layer. The results are shown in Table 2 below.

<Evaluation of ability to remove organic pollutants>

A 5 cm x 5 cm glass substrate was left standing in the atmosphere for 24 hours so that it was contaminated with various organic materials, inorganic materials, and particles in the atmosphere. The substrate was cleaned with each of the cleaning compositions of Examples 1 to 17 at 40° C. for 2 minutes using a shower cleaning device. Thereafter, the cleaned substrates were rinsed with ultrapure water for 30 s, and then dried with nitrogen gas. Thereafter, 0.5 µl of ultrapure water was dropped on the glass substrate, and then the contact angle after cleaning was measured. The results are shown in Table 2 below.

<Evaluation criteria for corrosion resistance>

Variations based on metal layer thickness

)，○：良好(小于

)，△：较差(小于)，X：非常差(或更大)◎: excellent (less than

), ○: good (less than

), △: Poor (less than ), X: very poor ( or larger)

<Evaluation criteria for the ability to remove organic pollutants>

Reduction based on contact angle

◎: excellent (reduction of 40° or more), ○: good (reduction of 40° to 30°), △: poor (reduction of 30° to 20°), X: very poor (reduction of less than 20°)

Table 2

It can be clearly seen from Table 2 that the cleaning compositions comprising boric acid components and one or more compounds selected from organic phosphoric acid and its salts according to embodiments 1 to 17 of the present invention not only have an anti-corrosion effect on metal wiring Very good, and the ability to remove organic/inorganic pollutants is also very good. It can be seen that the cleaning composition of Comparative Example 1 that neither contains the boric acid component nor contains one or more compounds selected from organic phosphoric acid and its salts exhibits very good cleaning ability due to the greatly reduced contact angle . However, the actual reason for the decrease in the contact angle is considered not to remove organic/inorganic contaminants, but to corrode the metal so as to change the surface roughness of the substrate. The cleaning composition of Comparative Example 1 showed very poor anticorrosion effect on metal wiring. In addition, the cleaning composition of Comparative Example 2 containing neither the boric acid component nor one or more compounds selected from organic phosphoric acid and salts thereof showed poor cleaning ability and very poor anti-corrosion effect. In addition, the boric acid component-free cleaning composition of Comparative Example 3 showed poor cleaning ability and good anti-corrosion effect on Al, but very poor anti-corrosion effect on Cu. Therefore, confirmed by the data of table 2, the boric acid component in the cleaning composition and one or more compounds selected from organic phosphoric acid and its salt have a great impact on the anti-corrosion performance of metal wiring and the ability to remove organic/inorganic pollutants. play an important role in.

The relationship between the contact angle of water used in the test and the ability to remove organic/inorganic pollutants is as follows.

The glass substrate used for the FPD has a surface roughness and a contact angle suitable for subsequent processes including deposition of a film. However, organic contaminants are hydrophobic when present on glass substrates, such as fingerprints or oil films. Consequently, the measured contact angle of the contaminated glass substrate increases due to the surface tension of water because the wettability of the hydrophobic surface decreases. Because of this, when a cleaning process is used to remove hydrophobic contaminants from a glass substrate, the inherent properties of the glass substrate reveal themselves and thus the contact angle may be reduced to the original cleaning state. Furthermore, when surface modification is used, the surface of the substrate becomes hydrophilic, thereby further reducing the contact angle to be smaller than the original state.

<Evaluation of corrosion resistance of metal patterns>

Using a spray cleaning device, the 5cm×5cm glass substrates with Al and Cu patterns formed thereon were cleaned with the cleaning compositions of Examples 1-5 and Examples 11-15 at 40°C for 2 minutes. Rinse with water for 30 seconds, then dry with nitrogen. The results are shown in Table 3 below.

<Evaluation criteria for corrosion>

○: no corrosion, △: slight corrosion, X: extensive corrosion

table 3

Al pattern etching Cu pattern etching Example 1 ○ ○ Example 2 ○ ○ Example 3 ○ ○ Example 4 ○ ○ Example 5 ○ △ Example 11 ○ △ Example 12 ○ △ Example 13 ○ ○ Example 14 ○ ○ Example 15 ○ ○ Comparative example 1 x x

It is evident from Table 3 that the cleaning composition according to the present invention comprising a boric acid component and one or more compounds selected from organic phosphoric acid and its salts exhibits excellent anti-corrosion effects on Al and Cu.

Claims (4)

1. for the manufacture of an aqueous clean combination for flat-panel screens, comprise, based on the gross weight of described composition,

The boric acid component of 0.01～20wt%, freely eight hydration ammonium pentaborate ((NH of described boric acid component choosing ₄) ₂b ₁₀o ₁₆8H ₂o), four hydration tetraboric acid ammonium ((NH ₄) ₂b ₄o ₇4H ₂o), four hydration potassium tetraborate (K ₂b ₄o ₇4H ₂o) and four hydration eight Sodium Tetraborate (Na ₂b ₈o ₁₃4H ₂o) one or more in the group of composition;

The free HEDP of choosing of 0.01～20wt%, hydroxyl PHOSPHONACETIC, amido three (methylene radical) phosphonic acids, 2-phosphine-butane-1, one or more compounds of the group of 2,4-tricarboxylic acid and its sodium salt or its sylvite composition;

The organic basic compound of 0.05～10wt%, wherein said organic basic compound selects one or more in the group of free tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide (TEAH), hydroxide tetrapropylammonium (TPAH), tetrabutylammonium hydroxide (TBAH), monoethanolamine, diethanolamine, 1-amino-2-propyl alcohol, trolamine, single Propanolamine and two butanolamines composition;

The glycol ether compound of 0.05～40wt%, wherein said glycol ether compound selects one or more in the group of free ethylene glycol monobutyl ether (BG), diethylene glycol monomethyl ether (MDG), TC (Trivalin SF), Diethylene Glycol single-butyl ether (BDG), DPGME (DPM), dihydroxypropane single-ethyl ether (MFDG), triethylene glycol single-butyl ether (BTG), triethylene glycol list ethyl ether (MTG) and propylene glycol monomethyl ether (MFG) composition;

The alkanolamine salt compound of 0.001～1wt%, wherein said alkanolamine salt compound selects one or more in the group of free monoethanolamine salt, diethanolamine salt, triethanolamine salt, monoisopropanolamine salt, diisopropanol amine salt and tri-isopropanolamine salt composition; With

The water of surplus.

2. aqueous clean combination as claimed in claim 1, further comprises water-based nonionogenic tenside.

3. cleaning, for the manufacture of a method for the substrate of flat-panel screens, comprises with aqueous clean combination cleaning base plate claimed in claim 1, keeps described aqueous clean combination at 20～80 DEG C simultaneously.

4. manufacture a method for flat-panel screens, comprise the substrate for described flat-panel screens with aqueous clean combination cleaning claimed in claim 1, keep described aqueous clean combination at 20～80 DEG C simultaneously.