CN102504705B - Polishing solution used for precision machining of optical communication ZrO2 ceramic stub and preparation method thereof - Google Patents
Polishing solution used for precision machining of optical communication ZrO2 ceramic stub and preparation method thereof Download PDFInfo
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- CN102504705B CN102504705B CN201110314587.XA CN201110314587A CN102504705B CN 102504705 B CN102504705 B CN 102504705B CN 201110314587 A CN201110314587 A CN 201110314587A CN 102504705 B CN102504705 B CN 102504705B
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- polishing
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- deionized water
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- polishing fluid
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- 238000005498 polishing Methods 0.000 title claims abstract description 129
- 239000000919 ceramic Substances 0.000 title claims abstract description 33
- 238000004891 communication Methods 0.000 title claims abstract description 25
- 238000002360 preparation method Methods 0.000 title claims abstract description 18
- 230000003287 optical effect Effects 0.000 title claims abstract description 14
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 title abstract 4
- 238000003754 machining Methods 0.000 title abstract 2
- 239000006185 dispersion Substances 0.000 claims abstract description 52
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000008367 deionised water Substances 0.000 claims abstract description 16
- 229910021641 deionized water Inorganic materials 0.000 claims abstract description 16
- 239000004064 cosurfactant Substances 0.000 claims abstract description 11
- 239000003381 stabilizer Substances 0.000 claims abstract description 11
- DRVWBEJJZZTIGJ-UHFFFAOYSA-N cerium(3+);oxygen(2-) Chemical class [O-2].[O-2].[O-2].[Ce+3].[Ce+3] DRVWBEJJZZTIGJ-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000012530 fluid Substances 0.000 claims description 69
- 238000003756 stirring Methods 0.000 claims description 38
- 238000003780 insertion Methods 0.000 claims description 29
- 230000037431 insertion Effects 0.000 claims description 29
- 239000003795 chemical substances by application Substances 0.000 claims description 22
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 21
- 238000004513 sizing Methods 0.000 claims description 18
- 150000001875 compounds Chemical class 0.000 claims description 15
- 229910052684 Cerium Inorganic materials 0.000 claims description 14
- ZMIGMASIKSOYAM-UHFFFAOYSA-N cerium Chemical compound [Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce][Ce] ZMIGMASIKSOYAM-UHFFFAOYSA-N 0.000 claims description 14
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 12
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 claims description 12
- 230000003750 conditioning effect Effects 0.000 claims description 12
- -1 polyoxyethylene Polymers 0.000 claims description 12
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 12
- 229960004418 trolamine Drugs 0.000 claims description 12
- 238000009736 wetting Methods 0.000 claims description 10
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 9
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims description 9
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 9
- 229910017604 nitric acid Inorganic materials 0.000 claims description 9
- 239000000725 suspension Substances 0.000 claims description 7
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- 238000012545 processing Methods 0.000 claims description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical group [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 5
- 150000001298 alcohols Chemical class 0.000 claims description 5
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical group O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 claims description 5
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 claims description 5
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 claims description 5
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 4
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 4
- 239000002002 slurry Substances 0.000 claims description 4
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 claims description 3
- KGWDUNBJIMUFAP-KVVVOXFISA-N Ethanolamine Oleate Chemical compound NCCO.CCCCCCCC\C=C/CCCCCCCC(O)=O KGWDUNBJIMUFAP-KVVVOXFISA-N 0.000 claims description 3
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 3
- ZBCBWPMODOFKDW-UHFFFAOYSA-N diethanolamine Chemical compound OCCNCCO ZBCBWPMODOFKDW-UHFFFAOYSA-N 0.000 claims description 3
- 229920001495 poly(sodium acrylate) polymer Polymers 0.000 claims description 3
- 229920001451 polypropylene glycol Polymers 0.000 claims description 3
- 229910000421 cerium(III) oxide Inorganic materials 0.000 claims description 2
- 239000000839 emulsion Substances 0.000 claims description 2
- AICOOMRHRUFYCM-ZRRPKQBOSA-N oxazine, 1 Chemical compound C([C@@H]1[C@H](C(C[C@]2(C)[C@@H]([C@H](C)N(C)C)[C@H](O)C[C@]21C)=O)CC1=CC2)C[C@H]1[C@@]1(C)[C@H]2N=C(C(C)C)OC1 AICOOMRHRUFYCM-ZRRPKQBOSA-N 0.000 claims description 2
- NNMHYFLPFNGQFZ-UHFFFAOYSA-M sodium polyacrylate Chemical compound [Na+].[O-]C(=O)C=C NNMHYFLPFNGQFZ-UHFFFAOYSA-M 0.000 claims description 2
- 239000001384 succinic acid Substances 0.000 claims description 2
- 239000003002 pH adjusting agent Substances 0.000 claims 2
- 230000000694 effects Effects 0.000 abstract description 14
- 239000000463 material Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 6
- 229910000420 cerium oxide Inorganic materials 0.000 abstract description 5
- 238000000227 grinding Methods 0.000 abstract description 5
- 238000002156 mixing Methods 0.000 abstract 3
- 206010003591 Ataxia Diseases 0.000 abstract 1
- 206010010947 Coordination abnormal Diseases 0.000 abstract 1
- 239000000654 additive Substances 0.000 abstract 1
- 239000002270 dispersing agent Substances 0.000 abstract 1
- 208000016290 incoordination Diseases 0.000 abstract 1
- 239000003643 water by type Substances 0.000 description 20
- 239000002245 particle Substances 0.000 description 15
- 239000007787 solid Substances 0.000 description 15
- 239000003595 mist Substances 0.000 description 14
- 238000005516 engineering process Methods 0.000 description 13
- 238000012360 testing method Methods 0.000 description 12
- 239000007788 liquid Substances 0.000 description 10
- 239000000243 solution Substances 0.000 description 10
- RNMDNPCBIKJCQP-UHFFFAOYSA-N 5-nonyl-7-oxabicyclo[4.1.0]hepta-1,3,5-trien-2-ol Chemical compound C(CCCCCCCC)C1=C2C(=C(C=C1)O)O2 RNMDNPCBIKJCQP-UHFFFAOYSA-N 0.000 description 9
- 239000013307 optical fiber Substances 0.000 description 9
- 238000007873 sieving Methods 0.000 description 9
- 239000003082 abrasive agent Substances 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 238000005054 agglomeration Methods 0.000 description 3
- 230000002776 aggregation Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- 230000008676 import Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000002612 dispersion medium Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003701 mechanical milling Methods 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003032 molecular docking Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000004062 sedimentation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110314587.XA CN102504705B (en) | 2011-10-17 | 2011-10-17 | Polishing solution used for precision machining of optical communication ZrO2 ceramic stub and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110314587.XA CN102504705B (en) | 2011-10-17 | 2011-10-17 | Polishing solution used for precision machining of optical communication ZrO2 ceramic stub and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102504705A CN102504705A (en) | 2012-06-20 |
| CN102504705B true CN102504705B (en) | 2014-07-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110314587.XA Expired - Fee Related CN102504705B (en) | 2011-10-17 | 2011-10-17 | Polishing solution used for precision machining of optical communication ZrO2 ceramic stub and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102504705B (en) |
Families Citing this family (16)
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|---|---|---|---|---|
| CN103484026A (en) * | 2013-09-30 | 2014-01-01 | 江苏中晶科技有限公司 | High-efficiency ceramic polishing solution and preparation method thereof |
| CN105777211B (en) * | 2014-12-26 | 2019-09-13 | 比亚迪股份有限公司 | A kind of zirconia ceramic polishing pretreatment composition and pretreatment method thereof |
| CN106479371A (en) * | 2016-08-15 | 2017-03-08 | 惠州市米特仑科技有限公司 | A kind of high precision composite polishing liquid and preparation method thereof |
| CN107014653A (en) * | 2017-04-18 | 2017-08-04 | 西华大学 | High-silicon aluminum alloy sample for detection and preparation method thereof |
| CN106978091A (en) * | 2017-04-20 | 2017-07-25 | 宁波日晟新材料有限公司 | Efficient hardening oxidation zircon ceramic polishing fluid and preparation method thereof |
| CN110358453A (en) * | 2018-04-10 | 2019-10-22 | 蓝思科技(长沙)有限公司 | A kind of glass polishing nano-cerium oxide polishing fluid and preparation method thereof |
| CN109439282A (en) * | 2018-10-23 | 2019-03-08 | 蓝思科技(长沙)有限公司 | Composite Nano abrasive material, polishing fluid and preparation method thereof, chip glass and electronic equipment |
| CN109135580B (en) * | 2018-10-25 | 2021-04-02 | 蓝思科技(长沙)有限公司 | Polishing solution for glass and preparation method thereof |
| CN110240890A (en) * | 2019-04-10 | 2019-09-17 | 广东工业大学 | Abrasive slurry for abrasive slurry jet processing and preparation method thereof |
| CN109943237A (en) * | 2019-04-16 | 2019-06-28 | 江苏艾佳达新材料有限公司 | A kind of polishing fluid |
| CN111633476B (en) * | 2020-06-09 | 2021-12-07 | 江苏师范大学 | Method for obtaining angstrom-level smooth surface of yttrium oxide transparent ceramic |
| CN111929337A (en) * | 2020-06-17 | 2020-11-13 | 宁波锦越新材料有限公司 | EBSD sample preparation method of Al-Zn-Mg-Cu alloy and EBSD sample |
| CN112608717A (en) * | 2020-12-17 | 2021-04-06 | 长沙蓝思新材料有限公司 | Coarse grinding fluid and preparation method thereof |
| CN114479676B (en) * | 2022-03-08 | 2023-04-21 | 机械科学研究总院海西(福建)分院有限公司 | Low abrasive content and weakly acidic polishing liquid for ultra-precision processing of optical glass and preparation method thereof |
| CN115558426A (en) * | 2022-09-23 | 2023-01-03 | 无锡兴华衡辉科技有限公司 | Method for grinding chip surface, suspension grinding and polishing liquid for grinding chip surface and preparation method thereof |
| CN116285699A (en) * | 2023-02-03 | 2023-06-23 | 包头海亮科技有限责任公司 | Preparation method and application of high-performance rare earth polishing powder for high-generation glass |
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| US5697992A (en) * | 1995-05-22 | 1997-12-16 | Sumitomo Chemical Company, Limited | Abrasive particle, method for producing the same, and method of use of the same |
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| CN101033374A (en) * | 2007-04-13 | 2007-09-12 | 中国地质大学(武汉) | High-purity nano diamond polishing liquid and preparing method thereof |
| CN101050339A (en) * | 2007-05-17 | 2007-10-10 | 中国地质大学(武汉) | Diamond polishing paste in high purity, and preparation method |
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| CN101696345A (en) * | 2009-10-21 | 2010-04-21 | 南昌大学 | Aluminum doped cerium rouge and preparation method thereof |
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| JPH10135163A (en) * | 1996-09-03 | 1998-05-22 | Sumitomo Chem Co Ltd | Polishing composition for metal film on semiconductor substrate and method for planarizing metal film on semiconductor substrate using the same |
| US5876490A (en) * | 1996-12-09 | 1999-03-02 | International Business Machines Corporatin | Polish process and slurry for planarization |
| US7300601B2 (en) * | 2002-12-10 | 2007-11-27 | Advanced Technology Materials, Inc. | Passivative chemical mechanical polishing composition for copper film planarization |
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| US5697992A (en) * | 1995-05-22 | 1997-12-16 | Sumitomo Chemical Company, Limited | Abrasive particle, method for producing the same, and method of use of the same |
| US5804513A (en) * | 1996-08-29 | 1998-09-08 | Sumitomo Chemical Company, Ltd. | Abrasive composition and use of the same |
| EP1211717A1 (en) * | 1999-08-17 | 2002-06-05 | Hitachi Chemical Company, Ltd. | Polishing compound for chemimechanical polishing and method for polishing substrate |
| CN1289811A (en) * | 1999-09-27 | 2001-04-04 | 不二见美国股份有限公司 | Polishing compositions |
| CN1361064A (en) * | 2000-12-25 | 2002-07-31 | 日产化学工业株式会社 | Cerium oxide sol and abrasive |
| CN1766027A (en) * | 2004-08-16 | 2006-05-03 | 三星电子株式会社 | Process for making improved cerium oxide abrasive particles and compositions comprising such particles |
| CN1865385A (en) * | 2005-05-17 | 2006-11-22 | 安集微电子(上海)有限公司 | Buffing slurry |
| KR100823457B1 (en) * | 2006-12-22 | 2008-04-21 | 테크노세미켐 주식회사 | Copper Chemical Mechanical Polishing Composition Containing Zeolite |
| CN101033374A (en) * | 2007-04-13 | 2007-09-12 | 中国地质大学(武汉) | High-purity nano diamond polishing liquid and preparing method thereof |
| CN101050339A (en) * | 2007-05-17 | 2007-10-10 | 中国地质大学(武汉) | Diamond polishing paste in high purity, and preparation method |
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| CN101696345A (en) * | 2009-10-21 | 2010-04-21 | 南昌大学 | Aluminum doped cerium rouge and preparation method thereof |
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| CN102504705A (en) | 2012-06-20 |
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