CN102428376A - 微机械传感器 - Google Patents
微机械传感器 Download PDFInfo
- Publication number
- CN102428376A CN102428376A CN2010800189507A CN201080018950A CN102428376A CN 102428376 A CN102428376 A CN 102428376A CN 2010800189507 A CN2010800189507 A CN 2010800189507A CN 201080018950 A CN201080018950 A CN 201080018950A CN 102428376 A CN102428376 A CN 102428376A
- Authority
- CN
- China
- Prior art keywords
- spring
- substrate
- bending
- described sensor
- above arbitrary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
- B81B3/0064—Constitution or structural means for improving or controlling the physical properties of a device
- B81B3/0067—Mechanical properties
- B81B3/007—For controlling stiffness, e.g. ribs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5705—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis
- G01C19/5712—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using masses driven in reciprocating rotary motion about an axis the devices involving a micromechanical structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2201/00—Specific applications of microelectromechanical systems
- B81B2201/02—Sensors
- B81B2201/0228—Inertial sensors
- B81B2201/0235—Accelerometers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/01—Suspended structures, i.e. structures allowing a movement
- B81B2203/0118—Cantilevers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/05—Type of movement
- B81B2203/056—Rotation in a plane parallel to the substrate
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P2015/0805—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration
- G01P2015/0808—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate
- G01P2015/0811—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass
- G01P2015/0817—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values being provided with a particular type of spring-mass-system for defining the displacement of a seismic mass due to an external acceleration for defining in-plane movement of the mass, i.e. movement of the mass in the plane of the substrate for one single degree of freedom of movement of the mass for pivoting movement of the mass, e.g. in-plane pendulum
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Pressure Sensors (AREA)
- Gyroscopes (AREA)
Abstract
Description
Claims (14)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009002701.7 | 2009-04-28 | ||
| DE102009002701.7A DE102009002701B4 (de) | 2009-04-28 | 2009-04-28 | Mikromechanischer Sensor |
| PCT/EP2010/055635 WO2010125071A1 (de) | 2009-04-28 | 2010-04-27 | Mikromechanischer sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102428376A true CN102428376A (zh) | 2012-04-25 |
| CN102428376B CN102428376B (zh) | 2014-09-10 |
Family
ID=42697290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201080018950.7A Expired - Fee Related CN102428376B (zh) | 2009-04-28 | 2010-04-27 | 微机械传感器 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US9103850B2 (zh) |
| CN (1) | CN102428376B (zh) |
| DE (1) | DE102009002701B4 (zh) |
| WO (1) | WO2010125071A1 (zh) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105043371A (zh) * | 2014-04-22 | 2015-11-11 | 精工爱普生株式会社 | 角速度传感器、电子设备以及移动体 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011145278A (ja) * | 2009-12-16 | 2011-07-28 | Seiko Epson Corp | 振動片、振動子、物理量センサー、および電子機器 |
| DE102011007168B4 (de) * | 2011-04-11 | 2019-09-19 | Hanking Electronics, Ltd. | Mikro-elektro-mechanischer Sensor sowie Verfahren zur Justierung und zum Betrieb des Sensors |
| DE102018222615B4 (de) * | 2018-12-20 | 2021-09-02 | Robert Bosch Gmbh | Bauelement mit einer optimierten mehrlagigen Torsionsfeder |
| DE102020203921A1 (de) | 2020-03-26 | 2021-09-30 | Robert Bosch Gesellschaft mit beschränkter Haftung | Mikromechanisches Bauelement, aufweisend ein Substrat, eine seismische Masse und eine Aufhängung |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030154788A1 (en) * | 2001-02-21 | 2003-08-21 | Rainer Willig | Rotation rate sensor |
| CN1816747A (zh) * | 2003-07-08 | 2006-08-09 | 飞思卡尔半导体公司 | 单测试质量块的三轴mems传感器 |
| CN101120232A (zh) * | 2004-12-31 | 2008-02-06 | Vti技术有限公司 | 振荡微机械角速度传感器 |
| DE102007035806A1 (de) * | 2007-07-31 | 2009-02-12 | Sd Sensordynamics Ag | Mikromechanischer Drehratensensor |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6390370B1 (en) * | 1990-11-15 | 2002-05-21 | Symbol Technologies, Inc. | Light beam scanning pen, scan module for the device and method of utilization |
| DE19920066B4 (de) * | 1999-05-03 | 2007-03-01 | Robert Bosch Gmbh | Sensor aus einem mehrschichtigen Substrat mit einem aus einer Halbleiterschicht herausstrukturierten Federelement |
| DE19941045A1 (de) * | 1999-08-28 | 2001-04-12 | Bosch Gmbh Robert | Mikroschwingvorrichtung |
| JP2003509670A (ja) | 1999-09-17 | 2003-03-11 | キオニックス インク | 電気分離式マイクロ機械ジャイロスコープ |
| US6393913B1 (en) * | 2000-02-08 | 2002-05-28 | Sandia Corporation | Microelectromechanical dual-mass resonator structure |
| US6401536B1 (en) * | 2000-02-11 | 2002-06-11 | Motorola, Inc. | Acceleration sensor and method of manufacture |
| FR2808264B1 (fr) * | 2000-04-28 | 2002-06-07 | Commissariat Energie Atomique | Structure mecanique micro-usinee et dispositif incorporant la structure |
| US6963679B1 (en) * | 2000-05-24 | 2005-11-08 | Active Optical Networks, Inc. | Micro-opto-electro-mechanical switching system |
| DE10108196A1 (de) * | 2001-02-21 | 2002-10-24 | Bosch Gmbh Robert | Drehratensensor |
| US6912078B2 (en) * | 2001-03-16 | 2005-06-28 | Corning Incorporated | Electrostatically actuated micro-electro-mechanical devices and method of manufacture |
| KR100439908B1 (ko) * | 2002-02-28 | 2004-07-12 | (주)엠투엔 | 정전형 미세 구동기 |
| US6954301B2 (en) | 2002-04-30 | 2005-10-11 | The Regents Of The University Of Michigan | Low-voltage electromechanical device including a tiltable microplatform, method of tilting same, array of such devices and method of setting dimple-to-substrate spacing |
| DE10238893A1 (de) * | 2002-08-24 | 2004-03-04 | Robert Bosch Gmbh | Drehratensensor |
| US6823733B2 (en) * | 2002-11-04 | 2004-11-30 | Matsushita Electric Industrial Co., Ltd. | Z-axis vibration gyroscope |
| FR2859528B1 (fr) * | 2003-09-09 | 2006-01-06 | Thales Sa | Gyrometre micro-usine a double diapason et a detection dans le plan de la plaque usinee |
| US7442918B2 (en) * | 2004-05-14 | 2008-10-28 | Microvision, Inc. | MEMS device having simplified drive |
| JP2009529697A (ja) * | 2006-03-10 | 2009-08-20 | コンティ テミック マイクロエレクトロニック ゲゼルシャフト ミット ベシュレンクテル ハフツング | 微小機械回転速度センサ |
| WO2007104742A1 (de) * | 2006-03-10 | 2007-09-20 | Continental Teves Ag & Co. Ohg | Drehratensensor mit kopplungsbalken |
| DE102007057042A1 (de) * | 2007-09-10 | 2009-03-12 | Continental Teves Ag & Co. Ohg | Mikromechanischer Drehratensensor mit Kopplungsbalken und Aufhängungs-Federelementen zur Unterdrückung der Quadratur |
| DE102007054505B4 (de) * | 2007-11-15 | 2016-12-22 | Robert Bosch Gmbh | Drehratensensor |
| DE502008002421D1 (de) * | 2008-11-11 | 2011-03-03 | Fraunhofer Ges Forschung | Mikromechanischer Coriolis-Drehratensensor |
| DE102009002702B4 (de) * | 2009-04-28 | 2018-01-18 | Hanking Electronics, Ltd. | Mikromechanischer Sensor |
| DE102009046506B4 (de) * | 2009-11-06 | 2024-01-18 | Robert Bosch Gmbh | Drehratensensor |
-
2009
- 2009-04-28 DE DE102009002701.7A patent/DE102009002701B4/de not_active Expired - Fee Related
-
2010
- 2010-04-27 US US13/266,985 patent/US9103850B2/en active Active
- 2010-04-27 WO PCT/EP2010/055635 patent/WO2010125071A1/de not_active Ceased
- 2010-04-27 CN CN201080018950.7A patent/CN102428376B/zh not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030154788A1 (en) * | 2001-02-21 | 2003-08-21 | Rainer Willig | Rotation rate sensor |
| CN1816747A (zh) * | 2003-07-08 | 2006-08-09 | 飞思卡尔半导体公司 | 单测试质量块的三轴mems传感器 |
| CN101120232A (zh) * | 2004-12-31 | 2008-02-06 | Vti技术有限公司 | 振荡微机械角速度传感器 |
| DE102007035806A1 (de) * | 2007-07-31 | 2009-02-12 | Sd Sensordynamics Ag | Mikromechanischer Drehratensensor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105043371A (zh) * | 2014-04-22 | 2015-11-11 | 精工爱普生株式会社 | 角速度传感器、电子设备以及移动体 |
Also Published As
| Publication number | Publication date |
|---|---|
| DE102009002701A1 (de) | 2010-12-02 |
| CN102428376B (zh) | 2014-09-10 |
| WO2010125071A1 (de) | 2010-11-04 |
| DE102009002701B4 (de) | 2018-01-18 |
| US9103850B2 (en) | 2015-08-11 |
| US20120042728A1 (en) | 2012-02-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: Austria - Graz A8403 Hotel Fende Aibei lebu Ling Applicant after: MAXIM INTEGRATED GmbH Address before: Austria - Graz A8403 Hotel Fende Aibei lebu Ling Applicant before: Induction Power Co.,Ltd. Address after: Austria - Graz A8403 Hotel Fende Aibei lebu Ling Applicant after: Induction Power Co.,Ltd. Address before: Austria - Graz A8403 Hotel Fende Aibei lebu Ling Applicant before: Induction Power Corp. |
|
| COR | Change of bibliographic data |
Free format text: CORRECT: APPLICANT; FROM: SENSORDYNAMICS AG TO: MAXIM INTEGRATED PRODUCTS,INC. |
|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20180803 Address after: Ohio, USA Patentee after: Hanking Microelectronics Co.,Ltd. Address before: Austria - Graz A8403 Hotel Fende Aibei lebu Ling Patentee before: Maxim Integrated GmbH |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20231031 Address after: Room A, 12th Floor, 300 Lockhart Road, Wan Chai, Hong Kong, China Patentee after: Hanwang Microelectronics Hong Kong Ltd. Address before: Ohio, USA Patentee before: Hanking Microelectronics Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20140910 |