CN102412174B - Pollution control method and device in semiconductor chip manufacture - Google Patents
Pollution control method and device in semiconductor chip manufacture Download PDFInfo
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- CN102412174B CN102412174B CN201110386260.3A CN201110386260A CN102412174B CN 102412174 B CN102412174 B CN 102412174B CN 201110386260 A CN201110386260 A CN 201110386260A CN 102412174 B CN102412174 B CN 102412174B
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Abstract
The invention discloses a pollution control method in semiconductor chip manufacture. The pollution control method comprises the following steps: when a wafer batch passes a wafer guide machine, judging whether a previous process zone through which the wafer batch passes and a preset previous process which allows the wafer guide machine to perform wafer batch exchange are matched or not; judging whether previous process zone through which the wafer batch passes corresponds to the type of a wafer box in which the wafer batch is positioned or not, and judging whether a pollution identifier carried by the wafer batch conforms to a preset pollution identifier of allowing the wafer guide machine to pass or not; and if the judgment result is yes, controlling the wafer guide machine to execute the wafer batch exchange, and changing the pollution identifier of the wafer batch to be corresponding to a process zone after wafer batch exchange by the wafer guide machine. The invention also correspondingly discloses a pollution control device. The pollution control method and device provided by the invention have the advantages of realizing rigorous pollution control in the semiconductor chip manufacture, eliminating pollution and cross contamination hidden dangers in a wafer, a wafer box and a workbench and among the wafer, the wafer box and the workbench in the semiconductor chip manufacture.
Description
Technical field
The present invention relates to semiconductor wafer (wafer) manufacturing technology field, relate in particular to a kind of groundwater pollution control and system of utilizing guide card machine flow process to realize in the manufacture process of semiconductor wafer.
Background technology
In the manufacture process of semiconductor wafer, prevent that the importance of cross pollution is always obvious to all.Once exist with the wafer that pollutes sign, enter after key processing equipment, the equipment atmosphere of this critical process will be had a strong impact on, in the subsequent job not stopping, this atmosphere will have a strong impact on follow-up large batch of wafer, it can introduce some harmful elements in device, thereby directly causes device reliability variation, even do not work; What is more, and the equipment of critical process is subject to after above-mentioned pollution, may directly cause equipment not recycling.The running of all these Jiang Dui factories produces fatefulue impact.
On the other hand, along with the development of manufacturing process, copper wiring is because its low-resistance, the high superiority such as deelectric transferred start to be applied in 0.13 μ m and following semiconductor fabrication process.Yet the production capacity based on production line and the consideration of cost, need copper wiring and aluminum manufacturing procedure sharing production line, now pollute control and become particularly important, this is because the pollution of copper can have a strong impact on device performance, for example, causes short-channel effect enhancing etc.At present, between different flow process sections for similar above-mentioned this sharing production line, avoid the needs that pollute, normally using guide card machine (Sorter) flow process to carry out guide card realizes, yet, guide card machine flow process only limits to FOUP (front-opening unified pod for the control of polluting, front opening wafer case, herein referred to as wafer case) confirmation of type, and do not limit the pollution sign of wafer batch (Lot); And, when forwarding Lot to new FOUP after guide card, can not change the pollution sign of current Lot yet; May cause thus following two problems.
First, if the pollution sign not removal of Lot in this process section, but be allowed to enter other process sections, just may cause the pollution of subsequent technique section Foup used and the pollution of board.For example, when Lot forwards standard front process section (FE) to from nickel process section (NI), suppose that the Foup type of confirming is at the beginning Type NI, the pollution of Lot is designated NI; At Lot, after guide card machine, Foup material object can change the type of Type FE into, but the pollution of Lot sign be still NI, and less than by being removed such as cleaning process etc.; Like this, the Lot also polluting with NI is process guide card machine directly, thereby pollution type is the Foup of Type FE, also may pollute the board of FE process section simultaneously.
Secondly, if the contamination index of Lot in this flow process section removed, this Lot is when entering next flow process section, because the Foup of next flow process section was used, thereby this Foup may by its with pollution sign be transmitted to Lot, and this Lot also keeps original pollution sign, cause thus the actual pollution of Lot and pollution sign not to be inconsistent, and then have the hidden danger that becomes potential pollution source.For example, when Lot forwards process for copper section (CU) to from standard backend process section (BE), suppose that the Foup type of confirming is at the beginning Type BE, the pollution of Lot is designated BE; At Lot, after guide card machine, Foup material object can change the type of Type CU into, but the pollution of Lot sign is still BE; Yet in fact, Lot is polluted by the Foup with CU, thereby cause the actual pollution of Lot and pollution sign not to be inconsistent, may in subsequent technique section, pollute other Foup thus, the while is the board of possibility contaminate subsequent process section also.
Summary of the invention
Embodiments of the invention aim to provide groundwater pollution control and the device in a kind of semiconductor wafer manufacture, to solve existing the problems referred to above of pollution control device of only wafer case type being confirmed in prior art.
For achieving the above object, embodiments of the invention provide the groundwater pollution control in a kind of semiconductor wafer manufacture, be applied to comprise the wafer manufacture line of a plurality of process sections, the wafer case that each process section is corresponding dissimilar, and between adjacent process section, be provided with guide card machine, described guide card machine is for by the wafer case of wafer batch process section corresponding types from the wafer case of last process section corresponding types exchanges to, and wherein, the method comprises the following steps:
S1. when the described guide card machine of wafer batch process, judge described wafer batch the last process section of process whether conform to the last process section that the default described guide card machine of permission carries out wafer batch exchange, judge described wafer batch the last process section of process whether corresponding with the type of the residing wafer case of described wafer batch, and judge described wafer batch with pollution sign allow the pollution of process to identify with default described guide card machine whether to conform to;
S2. in above-mentioned judged result, be while being, control the exchange that described guide card machine is carried out described wafer batch;
S3. at described guide card machine, carry out after described exchange, the pollution sign of described wafer batch is changed to corresponding with a rear process section of described guide card machine execution wafer batch exchange.
Embodiments of the invention are the corresponding pollution control device providing in a kind of semiconductor wafer manufacture also, be applied to comprise the wafer manufacture line of a plurality of process sections, the wafer case that each process section is corresponding dissimilar, and between adjacent process section, be provided with guide card machine, described guide card machine is for by the wafer case of wafer batch process section corresponding types from the wafer case of last process section corresponding types exchanges to, wherein, this device comprises:
Condition detecting unit, be used for when the described guide card machine of wafer batch process, judge described wafer batch the last process section of process whether conform to the last process section that the default described guide card machine of permission carries out wafer batch exchange, judge described wafer batch the last process section of process whether corresponding with the type of the residing wafer case of described wafer batch, and judge described wafer batch with pollution sign allow the pollution of process to identify with default described guide card machine whether to conform to;
Command executing unit, is while being for the above-mentioned judged result at described condition detecting unit, controls the exchange that described guide card machine is carried out described wafer batch; And
Sign changing unit, for carrying out after described exchange at described guide card machine, changes to the pollution sign of described wafer batch corresponding with a rear process section of described guide card machine execution wafer batch exchange.
As shown from the above technical solution, groundwater pollution control and device in semiconductor wafer manufacture provided by the invention, can control guide card machine only allows to exchange to a rear process section with the wafer batch that meets the pollution sign of exchange requirement, can make simultaneously wafer batch with pollution sign conform to actual pollution condition, thereby realized the strict control of polluting, eliminated potential pollution hidden trouble in semiconductor wafer manufacture.
Accompanying drawing explanation
Fig. 1 is the embodiment flow chart of the groundwater pollution control during semiconductor wafer of the present invention is manufactured;
Fig. 2 is the example structure figure of the pollution control device during semiconductor wafer of the present invention is manufactured.
Embodiment
To describe specific embodiments of the invention in detail below.It should be noted that the embodiments described herein, only for illustrating, is not limited to the present invention.
Fig. 1 is the embodiment flow chart of the groundwater pollution control during semiconductor wafer of the present invention is manufactured, and as shown in the figure, the groundwater pollution control of the present embodiment comprises the following steps S101-S108.
S101, according to the type of wafer case, wafer manufacture line is divided into a plurality of process sections;
In one embodiment, groundwater pollution control of the present invention is applied to wafer manufacture line, for ease of polluting, controls, and first this wafer manufacture line is divided into a plurality of process sections, for example, standard front process section FE, standard backend process section BE, process for copper section CU and nickel process section NI etc.And above each process section is the dissimilar wafer case of correspondence respectively, for example, the type of wafer case also comprises FE, BE, CU, NI etc.Correspondingly, wafer batch is put at certain process section after the wafer case of a certain type, just can be with and correspondingly pollute sign, for example, puts into after the wafer case of type NI at NI process section the pollution of NI sign on phase strain meeting band.
Further, at some, have between the adjacent process section that pollutes demand for control and be also provided with guide card machine, it is for by the wafer case of wafer batch process section corresponding types from the wafer case of last process section corresponding types exchanges to.As mentioned above, guide card machine is located between two adjacent process sections, correspondingly, guide card machine just can be regarded as the transfer website of the wafer batch wafer case that a process section is corresponding from wafer case corresponding to last process section exchanges to, this website just can represent by described two adjacent process section types, for example the guide card machine between NI process section and FE can be used NI2FE (" 2 " represent English " to " here, Chinese " extremely " the meaning) represent, the rest may be inferred, and the type of site of guide card machine also comprises FE2BE, BE2CU etc.In one embodiment, when certain guide card machine of wafer batch process, method of the present invention starts to carry out the judgement of follow-up S102-S105.
In addition, as mentioned above, guide card machine is generally only located between the adjacent process section that pollutes demand for control, correspondingly, and in one embodiment, for a certain wafer batch, it during a process section, can judge whether this wafer batch will pass through guide card machine on production line from last process section enters, if through guide card machine, continues hereinafter described determining step, otherwise show that the pollution demand for control of process section is not high herein, only need to proceed to conventional pollution management and control.Also, in one embodiment, between step S101 and step S102, also comprise that judges whether the step through guide card machine, if it is continue step S102, otherwise proceed to as described above conventional pollution management and control step.
S102, judge wafer batch the last process section of process whether conform to the last process section that default permission guide card machine carries out wafer batch exchange, if it is continue step S103, otherwise go to step S108;
This step for judge wafer batch the order of process section of process whether cause confusion, if show that through judgement last process section and guide card machine allow the last process section exchanging to conform to, and show that the order of process section is correct, thereby are continued next judgement; Otherwise sequentially there is mistake in the process section that shows wafer batch, also mean that the pollution situation of wafer batch is not clear, need to be through special processing could continue to carry out the method for the present embodiment after the judgement by this step.
The guide card machine of take in FE2BE website is example, under normal circumstances, the last process section of the wafer batch institute warp of this guide card machine of process should be FE process section, if show that by judgement the last process section type of the wafer batch institute warp of importing is not FE, the process section order that shows this wafer batch is wrong, therefore can not allow by this guide card machine; In addition, in this case, the board of last process section also may be subject to the cross pollution from this wafer batch, and this need to process in addition, for example, send alarm, notify attendant to check and change wafer batch, cleaning machine etc.
S103, judge wafer batch the last process section of process and the type of the residing wafer case of wafer batch whether corresponding, if it is continue step S104, otherwise go to step S108;
This step is for judging whether this wafer batch occurs at last process section the phenomenon that wafer case mistake is put, if show that through judgement last process section conforms to the type of wafer batch wafer case of living in, shows not occur that mistake puts, thereby continued next judgement; If draw and be not inconsistent through judgement, show to occur that mistake puts, mean that thus the pollution situation of wafer batch is not clear, need to be through special processing could to continue the method for execution the present embodiment after the judgement by this step.
The guide card machine of take in BE2CU website is example, the last process section of the wafer batch institute warp of this guide card machine of process is BE process section, so under normal circumstances, wafer batch through this guide card machine also should import from the wafer case of BE type, if show that by judgement the residing wafer case type of wafer batch of importing is not BE, show that this wafer batch may be subject to the pollution of the wafer case of not clear type, therefore can not allow by this guide card machine; Meanwhile, in this case, correspondingly wafer case also may be subject to the cross pollution from this wafer batch, and this need to process in addition, such as sending alarm, notify attendant to check and changing operations such as wafer case etc.
S104, judge wafer batch with pollution sign allow the pollution of process to identify with default guide card machine whether to conform to, if it is continue step S105, otherwise go to step S108;
This step is for judging whether wafer batch had passed through pollution Transformatin before entering a rear process section of strict pollution demand for control, if show that through judgement the pollution sign of wafer batch allows the pollution sign of process to conform to this default guide card machine, show that a rear process section may not pollute demand for control or this wafer batch has carried out pollution Transformatin, thereby continued subsequent step; Otherwise after showing a process section exist to pollute demand for control and this wafer batch not through polluting Transformatin, need to correspondingly process after the judgement by this step, could continue the method for execution the present embodiment.
The guide card machine of take in NI2FE website is example, because wafer batch can be with the pollution sign of upper NI after NI process section, and FE process section is higher for polluting the demand of controlling, thereby, the guide card machine that can suppose default NI2FE allows the pollution of process to be designated F0 (NI pollutes sign through cleaned sign), if through judgement, draw the wafer batch that enters NI2FE guide card machine with pollution sign be still NI, show from NI process section wafer batch out not through polluting Transformatin, thereby need through polluting Transformatin, for example proceed to automatic clean process section, or send alarm, notify attendant to check and this wafer batch is carried out to clean etc.
S105, judge that whether the wafer case that guide card machine will carry out a rear process section corresponding types of wafer batch exchange exists, and if it is continues step S106, otherwise goes to step S108;
This step is for judging that whether wafer batch can correctly import the wafer case of a rear process section, if the wafer case of a process section corresponding types exists after judgement draws, shows that this wafer batch can normally exchange, thereby is continued next judgement; Otherwise the exchange that shows wafer batch temporarily cannot be carried out, need to be through special processing could continue to carry out the method for the present embodiment after the judgement by this step.
The guide card machine of still take in NI2FE website is example, under normal circumstances, guide card machine should import the wafer batch of process in the wafer case of the corresponding FE type of FE process section, if show that by judgement the wafer case of FE type does not exist, show that this wafer batch cannot normally import, now just need to process in addition, for example, send alarm, notify attendant to check and supplement wafer case etc.
S106, control guide card machine are carried out the exchange of wafer batch;
In the present embodiment, only have the judged result of above-mentioned steps S102-S105 to be while being, just can proceed to the exchange that this step is carried out wafer batch, by the wafer case of wafer batch process section corresponding types from correct importing of wafer case of last process section corresponding types.And in one embodiment, the order of above-mentioned each step of S102-S105 there is no particular requirement, but can be undertaken by any order.
S107, the pollution sign of pressing this wafer batch of sign change rule change of guide card machine.
Guide card machine complete by through the wafer case of wafer batch process section corresponding types from the wafer case of last process section corresponding types imports after, need to change the pollution sign of wafer batch, to reflect accurately and timely the pollution situation of wafer batch, the guide card machine of being convenient to subsequent technique section website is made the judgement that is similar to step S104.The pollution of the rear process section corresponding types exchanging with this guide card machine execution wafer batch in one embodiment, identifies to replace the original pollution sign of this wafer batch.
The guide card machine of BE2CU website of take is example, guide card machine by through wafer batch from the wafer case of BE type imports the wafer case of CU type, the method of the present embodiment is just carried out the pollution sign alter operation of wafer batch,, with the pollution of CU, identify to replace the original pollution sign of this wafer batch, just can accurately reflect thus the pollution situation of wafer batch, avoid occurring actual pollution and the situation of polluting sign and not being inconsistent, and then stop this wafer batch and in subsequent technique section, pollute other wafer case or the possibility of the board of subsequent technique section.
S108, control guide card machine suspend the exchange of carrying out wafer batch, and after carrying out alignment processing, return to correspondingly step and continue judgement.
In the judged result of step S102-S105, be not and be,, when having arbitrary step the determination result is NO, just show this wafer batch occurred pollution situation not clear or other can not allow situation by guide card machine (specifically can referring to the detailed description of above steps), now should control guide card machine and suspend the swap operation of carrying out wafer batch, need to carry out other special processing could continue to carry out subsequent step after the judgement by corresponding steps.For example, described in concrete in above step S104, for the wafer batch through NI2FE website guide card machine, at this step S104 when the determination result is NO, need to for example carry out clean to wafer batch and could continue swap operation to remove NI after polluting sign.As for other steps concrete condition that the determination result is NO, also can, with reference to the detailed description in each step, repeat no more herein.
In sum, the groundwater pollution control that the present embodiment provides, division by process section in the manufacture of semiconductor wafer and to wafer case type and wafer batch with the dual management and control carried out of pollution sign, can control guide card machine only allows to exchange to a rear process section with the wafer batch that meets the pollution sign of exchange requirement, can make simultaneously wafer batch with pollution sign conform to actual pollution condition, thereby realized the strict control of polluting, eliminated potential pollution hidden trouble in semiconductor wafer manufacture.
The corresponding pollution control device also providing in a kind of semiconductor wafer manufacture of the present invention, similar with said method, application of installation of the present invention is in the wafer manufacture line that comprises a plurality of process sections, the wafer case that each process section is corresponding dissimilar, and between adjacent process section, be provided with for by the guide card machine of wafer batch wafer case of a process section corresponding types from the wafer case of last process section corresponding types exchanges to.
Further, Fig. 2 is the example structure figure of the pollution control device during semiconductor wafer of the present invention is manufactured, as shown in the figure, the pollution control device of the present embodiment comprises: condition detecting unit 21, command executing unit 22, sign changing unit 23 and pollution removal unit 24.Wherein, condition detecting unit 21 is for carrying out the judgement that comprises following content at wafer batch during through guide card machine: judge wafer batch the last process section of process whether conform to the last process section that default permission guide card machine carries out wafer batch exchange, judge wafer batch the last process section of process and the type of the residing wafer case of wafer batch whether corresponding, judge wafer batch with pollution sign allow the pollution of process to identify with default guide card machine whether to conform to, and judge whether the wafer case that guide card machine will carry out a rear process section corresponding types of wafer batch exchange exists.Continue, command executing unit 22 is while being for the above-mentioned judged result at condition detecting unit 21, controls the exchange that guide card machine is carried out wafer batch; And be not while being in the above-mentioned judged result of condition detecting unit 21, control guide card machine and suspend the exchange of carrying out wafer batch.23 of changing units of sign complete under the control of command executing unit 22 for guide card machine after the exchange of wafer batch, according to the default sign change rule corresponding with this guide card machine, the pollution sign of wafer batch are changed; In one embodiment, sign changing unit 23 changes to the pollution sign of wafer batch corresponding with a rear process section of guide card machine execution wafer batch exchange, that is the pollution of the rear process section corresponding types, exchanging with this guide card machine execution wafer batch identifies to replace the original pollution sign of this wafer batch.Finally, pollute removal unit 24 for through 21 judgements of condition detecting unit, draw wafer batch with pollution sign when default guide card machine allows the pollution sign of process not conform to, wafer batch is carried out to pollution Transformatin.Because those of ordinary skills are by read illustrating of above embodiment of the method in conjunction with Fig. 1, should understand easily the relevant running of the present embodiment pollution control device, so further instruction just repeats no more at this.
In sum, groundwater pollution control and device in the manufacture of embodiment of the present invention semiconductor wafer, can control guide card machine only allows to exchange to a rear process section with the wafer batch that meets the pollution sign of exchange requirement, can make simultaneously wafer batch with pollution sign conform to actual pollution condition, thereby realized the strict control of polluting, eliminated potential pollution hidden trouble in semiconductor wafer manufacture.And from above-described embodiment, on the one hand, each step of groundwater pollution control of the present invention and integral body thereof, can be corresponding to being stored in computer executable instructions in computer-readable recording medium and the computer executable program of composition thereof; And on the other hand, the application's pollution control device unit and integral body thereof, can be corresponding in order to carry out the each several part computer hardware of this computer executable program or instruction and the set of hardware of composition thereof.
Although described the present invention with reference to several exemplary embodiments, should be appreciated that term used is explanation and exemplary and nonrestrictive term.The spirit or the essence that because the present invention can specifically implement in a variety of forms, do not depart from invention, so be to be understood that, above-described embodiment is not limited to any aforesaid details, and explain widely in the spirit and scope that should limit in the claim of enclosing, therefore fall into whole variations in claim or its equivalent scope and remodeling and all should be the claim of enclosing and contain.
Claims (6)
1. the semiconductor wafer groundwater pollution control in manufacturing, be applied to comprise the wafer manufacture line of a plurality of process sections, the wafer case that each process section is corresponding dissimilar, and between adjacent process section, be provided with guide card machine, described guide card machine is for by the wafer case of wafer batch process section corresponding types from the wafer case of last process section corresponding types exchanges to, wherein, the method comprises the following steps:
S1. when the described guide card machine of wafer batch process, judge described wafer batch the last process section of process whether conform to the last process section that the default described guide card machine of permission carries out wafer batch exchange, judge described wafer batch the last process section of process whether corresponding with the type of the residing wafer case of described wafer batch, and judge described wafer batch with pollution sign allow the pollution of process to identify with default described guide card machine whether to conform to;
S2. in above-mentioned judged result, be while being, control the exchange that described guide card machine is carried out described wafer batch;
S3. at described guide card machine, carry out after described exchange, the pollution sign of described wafer batch is changed to corresponding with a rear process section of described guide card machine execution wafer batch exchange;
Wherein, in described step S1, also comprise:
At described wafer batch during through described guide card machine, judge whether the wafer case that described guide card machine will carry out a rear process section corresponding types of wafer batch exchange exists.
2. semiconductor wafer as claimed in claim 1 groundwater pollution control in manufacturing, wherein, described step S2 also comprises: in above-mentioned judged result, be not while being, control described guide card machine and suspend the exchange of carrying out described wafer batch.
3. semiconductor wafer as claimed in claim 2 groundwater pollution control in manufacturing, wherein, described step S2 also comprises:
Through described step S1 judgement, draw described wafer batch with pollution sign when default described guide card machine allows the pollution sign of process not conform to, described wafer batch is carried out to pollution Transformatin, return to again afterwards described step S1.
4. the semiconductor wafer pollution control device in manufacturing, be applied to comprise the wafer manufacture line of a plurality of process sections, the wafer case that each process section is corresponding dissimilar, and between adjacent process section, be provided with guide card machine, described guide card machine is for by the wafer case of wafer batch process section corresponding types from the wafer case of last process section corresponding types exchanges to, wherein, this device comprises:
Condition detecting unit, be used for when the described guide card machine of wafer batch process, judge described wafer batch the last process section of process whether conform to the last process section that the default described guide card machine of permission carries out wafer batch exchange, judge described wafer batch the last process section of process whether corresponding with the type of the residing wafer case of described wafer batch, and judge described wafer batch with pollution sign allow the pollution of process to identify with default described guide card machine whether to conform to;
Command executing unit, is while being for the above-mentioned judged result at described condition detecting unit, controls the exchange that described guide card machine is carried out described wafer batch; And
Sign changing unit, for carrying out after described exchange at described guide card machine, changes to the pollution sign of described wafer batch corresponding with a rear process section of described guide card machine execution wafer batch exchange;
Wherein, described condition detecting unit is also at described wafer batch during through described guide card machine, judges whether the wafer case that described guide card machine will carry out a rear process section corresponding types of wafer batch exchange exists.
5. semiconductor wafer as claimed in claim 4 pollution control device in manufacturing, wherein, described command executing unit is not also while being for the above-mentioned judged result at described condition detecting unit, controls described guide card machine and suspends the exchange of carrying out described wafer batch.
6. semiconductor wafer as claimed in claim 5 pollution control device in manufacturing, wherein, also comprise: pollute removal unit, for through the judgement of described condition detecting unit, draw described wafer batch with pollution sign and default described guide card machine while allowing the pollution of process to identify not conform to, described wafer batch is carried out and polluted Transformatin, return to again afterwards described condition detecting unit and judge.
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